A multi-specification wafer center detection device

Abstract

The present invention provides a device for detecting the center of a chip of multiple specifications, comprising a symmetrically arranged light source and a signal acquisition unit, a rotating table for placing the chip, a surface reflecting lens and a reflective lens. The detection light beam emitted by the light source and the signal acquisition unit is reflected by the surface reflecting lens and the reflective lens in turn and then vertically projected onto the edge of the chip fixed on the rotating table. A height adjustment mechanism is provided on the reflective lens, and the position of the reflective lens projected on the chip is changed by the up and down movement of the height adjustment mechanism. The present invention can project the detection light beam emitted by the light source and the signal acquisition unit onto the edge by arranging the surface reflecting lens and the reflective lens, thereby completing the detection of the center position of the chip. Secondly, the present invention can change the position of the reflective lens projected on the chip by the up and down movement of the height adjustment mechanism, thereby realizing edge data detection and collection of chips of different sizes and specifications.

Description

Technical Field

[0001] The present invention relates to the field of wafer detection, in particular to a device for detecting the center of wafers of multiple specifications. Background Art

[0002] Wafer transfer systems are widely used in lithography and other semiconductor equipment. As devices for detecting wafer centering, they must be efficient, reliable, and accurate. Currently, existing systems can only detect the center position of a single wafer specification. However, for scientific research and experimental users, who often need to frequently switch wafers of different sizes for product research, most current lithography equipment only detects a single wafer specification, failing to meet the need for "one machine for multiple uses." Due to the high cost of lithography machines, replacing equipment requires significant investment and time, significantly increasing production and operating costs. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a multi-specification wafer center detection device to solve the problems raised in the above technical background.

[0004] The object of the present invention is achieved through the following technical solutions:

[0005] A device for detecting the center of a multi-specification wafer comprises a symmetrically arranged light source and signal acquisition unit, a rotating platform for placing the wafer, a surface reflective lens, and a reflective lens. The detection light beam emitted by the light source and signal acquisition unit is reflected by the surface reflective lens and the reflective lens in sequence and then vertically projected onto the edge of the wafer fixed to the rotating platform. The reflective lens is provided with a height adjustment mechanism, and the reflective lens changes its projected position on the wafer by the up and down movement of the height adjustment mechanism.

[0006] In the above invention content, further, the height adjustment mechanism includes an adjustment plate, a fixing frame and an adjustment screw, the reflective lens is fixed on the adjustment plate, a slider is fixed on the adjustment plate, the slider is slidably connected to a guide rail, the fixing frame is provided with screw holes, and the adjustment plate is provided with through holes, the adjustment screw passes through the through holes of the adjustment plate and the screw holes on the fixing frame from bottom to top and is rotatably connected between the fixing frame and the adjustment plate, and the screw head of the adjustment screw abuts against the lower surface of the adjustment plate.

[0007] In the above invention, further, the adjustment plate has a Z-shaped structure, the slider is fixed on one wing plate of the Z-shaped adjustment plate, a triangular block is provided on the other wing plate of the Z-shaped adjustment plate, and the reflective lens is fixed on the surface of the triangular block.

[0008] In the above invention, further, a pressing plate is provided on the adjusting plate, and the triangular block is fixed to the other wing plate of the Z-shaped adjusting plate through the pressing plate.

[0009] The above invention further includes a support and a support plate, the surface reflective lens is fixed on the support, and the support plate is used to fix the mounting support.

[0010] In the above invention, further, the triangular block is a right-angled triangular block, the reflective lenses are fixed on two right-angled surfaces of the right-angled triangular block, and the angle between the side of the support fixed with the surface reflective lens and the horizontal plane is 45°.

[0011] In the above invention, further, a receiving cavity is provided on the fixing plate, and a wing plate and a slider of the Z-shaped adjustment plate are both placed in the receiving cavity.

[0012] In the above invention, further, a vacuum suction cup is provided on the rotating table.

[0013] The beneficial effects of the present invention are:

[0014] The present invention sets a surface reflective lens and a reflective lens, which can project the detection light beam emitted by the light source and the signal acquisition unit onto the edge, thereby completing the center position detection of the chip. Secondly, the present invention can change the position of the reflective lens projected on the chip through the up and down movement of the height adjustment mechanism, thereby realizing edge data detection and collection of chips of different sizes and specifications, achieving the purpose of "one machine for multiple uses". BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0016] Figure 2 is another schematic diagram of the three-dimensional structure of the present invention;

[0017] Figure 3 This is a schematic diagram of the planar structure of the present invention;

[0018] Figure 4 This is the detection light path diagram of the present invention.

[0019] In the figure, 101-light source and signal acquisition unit, 102-fixed frame, 103-slider, 104-adjusting screw, 105-guide rail, 106-adjusting plate, 107-pressing plate, 108-triangular block, 109-surface reflective lens, 110-support, 111-support plate, 112-reflective lens, 113-wafer, 114-rotating table, 115-vacuum suction cup, 116-accommodating chamber. DETAILED DESCRIPTION

[0020] The following describes the embodiments of the present invention through specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other unless they conflict.

[0021] It should be noted that the illustrations provided in the following embodiments are merely schematic illustrations of the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0022] Example:

[0023] A multi-specification wafer center detection device, please refer to the attached Figure 1 -Attached Figure 4 As shown, it includes a symmetrically arranged light source and signal acquisition unit 101, a rotating table 114 for placing a chip 113, a surface reflective lens 109 and a reflective lens 112. The detection light beam emitted by the light source and signal acquisition unit 101 is reflected by the surface reflective lens 109 and the reflective lens 112 in sequence and then vertically projected onto the edge of the chip 113 fixed on the rotating table 114. The reflective lens 112 is provided with a height adjustment mechanism, and the reflective lens 112 changes the position of the projection on the chip 113 through the up and down movement of the height adjustment mechanism.

[0024] Specifically, the height adjustment mechanism includes an adjustment plate 106, a fixing frame 102 and an adjustment screw 104, the reflective lens is fixed on the adjustment plate 106, a slider 103 is fixed on the adjustment plate 106, the slider 103 is slidably connected to the guide rail 105, the adjustment plate 106 and the slider 103 can slide along the guide rail 105 together, the fixing frame 102 is provided with a screw hole, and the adjustment plate 106 is provided with a through hole, the adjustment screw 104 passes through the screw hole of the fixing frame 102 and the through hole on the adjustment plate 106 from bottom to top and is rotatably connected between the fixing frame 102 and the adjustment plate 106, and the screw head of the adjustment screw 104 abuts against the lower surface of the adjustment plate.

[0025] More specifically, the adjustment plate 106 has a Z-shaped structure, the slider 103 is fixed on one wing plate of the Z-shaped adjustment plate, a triangular block 108 is provided on the other wing plate of the Z-shaped adjustment plate, and the reflective lens 112 is fixed on the surface of the triangular block 108. The Z-shaped adjustment plate is also provided with a pressure plate 107, and the triangular block 108 is fixed to the other wing plate of the Z-shaped adjustment plate through the pressure plate 107. More preferably, a accommodating cavity 116 is provided on the fixed plate 102, and a wing plate and the slider of the Z-shaped adjustment plate 106 are both placed in the accommodating cavity 116.

[0026] Working principle: During the use of the invention, the light source and signal acquisition unit 101, the fixing frame 102, the guide rail 105, and the support plate 111 are all fixed on the frame of the peripheral device. When detecting the wafer 113, the wafer is placed on the rotating table 114. Preferably, a vacuum suction cup 115 can be set above the rotating table 114 to facilitate the fixing of the wafer 113. The light source and signal acquisition unit 101 is started. The detection light beam emitted by the light source and signal acquisition unit 101 is reflected onto the reflective lens 112 through the surface reflective lens 109. After re-reflection by the reflective lens 112, the vertically downward light beam is projected onto the wafer 113 to be detected below. The adjusting screw 104 is turned, and the adjusting screw 104 rotates in the screw hole of the fixing frame 102 and the through hole on the adjusting plate 106, so that the adjusting plate 106 and the slider 103 slide up or down along the guide rail 105, thereby driving the reflective lens 112 to move up or down. Through the above operation, the adjustment The position of the light beam projected onto the chip 113 by the entire reflective lens 112 is adjusted so that the light beam reflected by the reflective lens 112 is projected onto the edge of the chip 113. When the chip 113 is rotated by the rotating table 114, the detection light beams on both sides detect the edge of the chip, and the detection data is fed back to the light source and signal acquisition unit 101. After the detection data is collected, calculated and processed by the light source and signal acquisition unit 101, the coordinates of the center position of the detected chip 113 are obtained, and the center position detection of the chip 113 is completed. It can be seen from the above that in the present invention, the position of the light beam projected onto the chip 113 by the reflective lens 112 can be adjusted by rotating the adjusting screw 104 of the height adjustment mechanism, so that when detecting chips 113 of different sizes, the light beam emitted by the light source and signal acquisition unit 101 can be projected onto the edge of chips 113 of different sizes by turning the adjusting screw 104, thereby completing the detection of the center position of chips 113 of different sizes.

[0027] In the above embodiment, as a preferred embodiment, the detection device also includes a support 110 and a support plate 111, the surface reflection lens 109 is fixed on the support 110, and the support plate 111 is used to fix the mounting support 110. More preferably, the triangular block 108 is a right-angle triangular block, and the reflection lens 112 is fixed on two right-angled surfaces of the right-angle triangular block 108. The angle between the side of the support 110 on which the surface reflection lens 109 is fixed and the horizontal plane is 45°. In this embodiment, the vertical detection light beam emitted by the light source and signal acquisition unit 101 is emitted as horizontal light through the surface reflection lens 109, and then emitted as vertical light through the reflection lens 112 and projected onto the edge of the chip 113.

[0028] The above-described embodiments merely represent specific implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, and all such variations and improvements fall within the scope of protection of the present invention.

Claims

1. A multi-specification wafer center detection device, characterized in that: The invention comprises a symmetrically arranged light source and signal acquisition unit, a rotating platform for placing a wafer, a surface reflective lens and a reflective lens. The detection light beam emitted by the light source and the signal acquisition unit is reflected by the surface reflective lens and the reflective lens in sequence and then vertically projected onto the edge of the wafer fixed on the rotating platform. The reflective lens is provided with a height adjustment mechanism, and the position of the reflective lens projected on the wafer is changed by the up and down movement of the height adjustment mechanism.

2. The multi-specification wafer center detection device according to claim 1, characterized in that: The height adjustment mechanism includes an adjustment plate, a fixing frame and an adjustment screw. The reflective lens is fixed on the adjustment plate. A slider is fixed on the adjustment plate. The slider is slidably connected to a guide rail. The fixing frame is provided with a screw hole. The adjustment plate is provided with a through hole. The adjustment screw passes through the through hole of the adjustment plate and the screw hole on the fixing frame from bottom to top and is rotatably connected between the fixing frame and the adjustment plate, and the screw head of the adjustment screw abuts against the lower surface of the adjustment plate.

3. The multi-specification wafer center detection device according to claim 2, characterized in that: The adjustment plate is in a Z-shaped structure. The slider is fixed on one wing plate of the Z-shaped adjustment plate. A triangular block is provided on the other wing plate of the Z-shaped adjustment plate. The reflective lens is fixed on the surface of the triangular block.

4. The multi-specification wafer center detection device according to claim 3, characterized in that: The adjusting plate is provided with a pressing plate, and the triangular block is fixed on the other wing plate of the Z-shaped adjusting plate through the pressing plate.

5. The multi-specification wafer center detection device according to claim 4, characterized in that: It also includes a support and a support plate, the surface reflection lens is fixed on the support, and the support plate is used to fix the installation support.

6. The multi-specification wafer center detection device according to claim 5, characterized in that: The triangular block is a right-angled triangular block, and the reflective lenses are fixed on two right-angled surfaces of the right-angled triangular block. The angle between the side of the support on which the surface reflective lenses are fixed and the horizontal plane is 45°.

7. The multi-specification wafer center detection device according to claim 3, characterized in that: The fixing plate is provided with an accommodating cavity, and a wing plate and a sliding block of the Z-shaped adjusting plate are both placed in the accommodating cavity.

8. The multi-specification wafer center detection device according to claim 1, characterized in that: A vacuum suction cup is provided on the rotating platform.

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