Transfer carrier and chip screening and transfer method based on optical waveguide

Abstract

The present invention discloses a transfer carrier for selectively transferring chips. A photosensitive adhesive layer is provided on the first surface of the transfer carrier and includes an optical waveguide. The light-emitting surface of the optical waveguide has a plurality of independently controllable light-emitting positions that can output preset light. A photosensitive adhesive layer is provided on the first surface of the transfer carrier that is sensitive to the preset light. The preset light outputted from the light-emitting position is irradiated from the first surface of the transfer carrier to the photosensitive adhesive layer, thereby changing the adhesive force of the photosensitive adhesive layer. The present invention also discloses a chip screening method, wherein the first surface of the transfer carrier is first bonded to the surface of the chip away from the carrier substrate through the photosensitive adhesive layer. Then, the selected light-emitting positions on the optical waveguide are controlled to output preset light to change the adhesive force of the photosensitive adhesive layer at the corresponding chip, thereby reversing the adhesive force between the first adhesive layer and the photosensitive adhesive layer. After separating the first surface of the transfer carrier from the carrier substrate, the transferred chips can be screened. The method can be used for high-precision, small-sized chip screening and transfer, and has high transfer efficiency.

Description

[0001] Summary of the instruction manual

[0002] The present invention discloses a transfer carrier for selectively transferring chips. A photosensitive adhesive layer is provided on the first surface of the transfer carrier and includes an optical waveguide. The light-emitting surface of the optical waveguide has a plurality of independently controllable light-emitting positions that can output preset light. A photosensitive adhesive layer is provided on the first surface of the transfer carrier that is sensitive to the preset light. The preset light outputted from the light-emitting position is irradiated from the first surface of the transfer carrier to the photosensitive adhesive layer, thereby changing the adhesive force of the photosensitive adhesive layer. The present invention also discloses a chip screening method, wherein the first surface of the transfer carrier is first bonded to the surface of the chip away from the carrier substrate through the photosensitive adhesive layer. Then, the selected light-emitting positions on the optical waveguide are controlled to output preset light to change the adhesive force of the photosensitive adhesive layer at the corresponding chip, thereby reversing the adhesive force between the first adhesive layer and the photosensitive adhesive layer. After separating the first surface of the transfer carrier from the carrier substrate, the transferred chips can be screened. The method can be used for high-precision, small-sized chip screening and transfer, and has high transfer efficiency. Technical Field

[0003] The present invention relates to the field of semiconductor technology, and in particular to a transfer carrier for chip screening and a chip screening transfer method. Background Art

[0004] In the Mini LED manufacturing process, chip transfer technologies such as Pick & Place or sting crystal are commonly used. Micro LED chips are smaller than Mini LED chips and are the application trend for next-generation display LED chips. The number of Micro LED chips manufactured on an epitaxial wafer of the same size is several times, or even dozens of times, that of Mini LED chips. Using Pick & Place or sting crystal to transfer Micro LED chips would be extremely time-consuming and inefficient. The Micro LED manufacturing process requires the integration of mass transfer technology, that is, the rapid and accurate transfer of Micro LED chips in large quantities. When transferring a large number of Micro LED chips, it is necessary to first remove some defective chips caused by process problems. If Pick & Place or sting crystal removal is used, a more precise and smaller transfer head is required, and the efficiency is lower. Therefore, an effective solution for selective chip transfer is needed. Summary of the Invention

[0005] The purpose of the present invention is to provide a transfer carrier and a chip screening and transfer method, which uses an optical waveguide to generate small-area, high-precision light to change the viscosity of the adhesive layer on the carrier substrate to which the chip is attached, and can be used for high-precision, small-size chip screening and transfer.

[0006] In order to achieve the above-mentioned objectives, the present invention discloses a transfer carrier for selectively transferring chips, wherein the transfer carrier includes an optical waveguide plate, one surface of the optical waveguide plate is a light-emitting surface, and the light-emitting surface has a plurality of light-emitting positions that can output preset light and are independently controllable. The first surface of the transfer carrier is provided with a photosensitive adhesive layer that is sensitive to the preset light, and the preset light output from the light-emitting position is irradiated from the first surface of the transfer carrier to the photosensitive adhesive layer, and changes the adhesion force of the photosensitive adhesive layer.

[0007] Preferably, the optical waveguide sheet includes a light guide plate, an optical waveguide coupler and a matrix light source, the light guide plate has an optical waveguide structure for light conduction, the light output surface of the light guide plate has a coupling-in area and a light output area, the optical waveguide coupler is arranged in the coupling-in area, and several light output positions are located in the light output area. The matrix light source has several light source output points and outputs the preset light to the coupling-in area, and the preset light is output to the corresponding light output position through the optical waveguide coupler and the optical waveguide structure.

[0008] Preferably, the transfer carrier also includes a transparent substrate, the transparent substrate having a first surface and a second surface opposite to each other, the first surface of the transparent substrate is provided with the photosensitive adhesive layer, the optical waveguide plate is separated from the transparent substrate or the optical waveguide plate is fixed to the transparent substrate, and the light emitting surface of the optical waveguide plate is adjacent to the second surface of the transparent substrate.

[0009] Preferably, the carrying body of the transfer carrier is composed of the optical waveguide sheet, and the light-emitting surface of the optical waveguide sheet is the first surface of the transfer carrier.

[0010] Preferably, the photosensitive adhesive layer is provided on the first surface of the transfer carrier in the form of an adhesive dot matrix; or the photosensitive adhesive layer completely covers the first surface of the transfer carrier.

[0011] Preferably, the preset light is UV light, the photosensitive adhesive layer is UV debonding adhesive or UV curing adhesive, and the preset light can reduce or increase the adhesive force of the photosensitive adhesive layer.

[0012] The present invention also discloses a chip screening and transfer method based on optical waveguide, comprising: providing a carrier substrate carrying a plurality of chips, the chips having a first surface and a second surface relative to each other, the first surfaces of the plurality of chips being bonded to the carrier substrate through a first adhesive layer, the light emitting position on the optical waveguide sheet corresponding to the chip position on the carrier substrate; providing the transfer carrier as described above; bonding the first surface of the transfer carrier to the second surface of the chip through the photosensitive adhesive layer, the light emitting position of the optical waveguide sheet being aligned with the chip on the carrier substrate; obtaining the position of the pre-selected chip on the carrier substrate, controlling the light emitting position on the optical waveguide sheet corresponding to the position of the pre-selected chip to output the preset light to change the bonding force of the photosensitive adhesive layer at the second surface of the pre-selected chip, the bonding force of the first adhesive layer being between the bonding force before and after the bonding force of the photosensitive adhesive layer is changed, so that the bonding force between the first adhesive layer and the photosensitive adhesive layer is reversed; and moving the first surface of the transfer carrier away from the carrier substrate relatively.

[0013] Preferably, the adhesion force of the first adhesive layer is greater than the adhesion force of the photosensitive adhesive layer whose adhesion force has not changed; "controlling the light output position on the optical waveguide corresponding to the position of the pre-selected chip to output the preset light to change the adhesion force of the photosensitive adhesive layer at the second surface of the pre-selected chip" specifically means: controlling the light output position on the optical waveguide corresponding to the position of the pre-selected chip to output the preset light to increase the adhesion force of the photosensitive adhesive layer, so that the adhesion force of the first adhesive layer is less than the adhesion force of the photosensitive adhesive layer after the adhesion force is changed.

[0014] Preferably, the adhesion force of the first adhesive layer is smaller than the adhesion force of the photosensitive adhesive layer whose adhesion force has not been changed; "controlling the light output position on the optical waveguide corresponding to the position of the pre-selected chip to output the preset light to change the adhesion force of the photosensitive adhesive layer at the second surface of the pre-selected chip" specifically means: controlling the light output position on the optical waveguide corresponding to the position of the pre-selected chip to output the preset light to reduce the adhesion force of the photosensitive adhesive layer, so that the adhesion force of the first adhesive layer is greater than the adhesion force of the photosensitive adhesive layer after the adhesion force is changed.

[0015] Preferably, the transfer carrier also includes a transparent substrate, the transparent substrate having a first surface and a second surface relative to each other, the first surface of the transparent substrate is provided with the photosensitive adhesive layer, the optical waveguide plate is separately arranged from the transparent substrate or the optical waveguide plate is fixed to the transparent substrate, and the light emitting surface of the optical waveguide plate faces the second surface of the transparent substrate, and the preset light output by the optical waveguide plate passes through the transparent substrate and irradiates the photosensitive adhesive layer at the pre-selected chip to change the adhesion force of the photosensitive adhesive layer at the pre-selected chip.

[0016] Preferably, the carrying body of the transfer carrier is composed of the optical waveguide plate, the light-emitting surface of the optical waveguide plate is the first surface of the transfer carrier, and the preset light output by the optical waveguide plate is directly irradiated on the photosensitive adhesive layer at the pre-selected chip to change the adhesion force of the photosensitive adhesive layer at the pre-selected chip.

[0017] The present invention also discloses another chip screening and transfer method based on optical waveguide, comprising: providing a transfer carrier as described above, wherein the transfer carrier is provided with a first surface of a photosensitive layer and a plurality of chips are bonded thereto, the chips having a first surface and a second surface relative to each other, the first surface of the chip is bonded to the first surface of the transfer carrier through a photosensitive adhesive layer, and the light output positions on the transfer carrier correspond to the chip positions respectively; providing a transfer substrate, wherein a second adhesive layer is provided on the first surface of the transfer substrate; bonding the first surface of the transfer substrate to the second surface of the chip through the second adhesive layer; obtaining the position of the pre-selected chip on the transfer carrier, controlling the light output position corresponding to the position of the pre-selected chip on the optical waveguide to output a preset light, the preset light being irradiated on the photosensitive adhesive layer at the first surface of the pre-selected chip to change the bonding force of the photosensitive adhesive layer at the first surface of the pre-selected chip, the bonding force of the second adhesive layer being between the bonding force before and after the bonding force of the photosensitive adhesive layer is changed, so that the bonding force between the second adhesive layer and the photosensitive adhesive layer is reversed.

[0018] Compared to existing technologies, the present invention utilizes a carrier with an optical waveguide as a transfer carrier. The optical waveguide selectively generates a small, highly precise light output position, altering the adhesion of the photosensitive adhesive layer on the first surface of the transfer carrier. This allows the photosensitive adhesive layer of the transfer carrier to specifically capture the chips for screening and transfer. This makes it suitable for screening and transferring small chips such as Micro LED and Mini LED chips. Furthermore, the transfer carrier of the present invention can transfer multiple chips simultaneously, even enabling the simultaneous screening and transfer of all chips on the carrier substrate, resulting in high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 FIG. 1 is a flow chart of a chip screening and transfer method based on an optical waveguide in a first embodiment of the present invention.

[0020] Figure 2 FIG. 1 is a flow chart of a chip screening and transfer method based on an optical waveguide in a second embodiment of the present invention.

[0021] Figure 3 FIG. 4 is a flow chart of a chip screening and transfer method based on an optical waveguide in a third embodiment of the present invention.

[0022] Figure 4 FIG. 4 is a flow chart of a chip screening and transfer method based on an optical waveguide in a fourth embodiment of the present invention.

[0023] Figure 5FIG. 4 is a flow chart of a chip screening and transfer method based on an optical waveguide in a fifth embodiment of the present invention.

[0024] Figure 6 1 is a structural diagram of a transfer carrier in the first embodiment of the present invention.

[0025] Figure 7 2 is a structural diagram of a transfer carrier in a fourth embodiment of the present invention.

[0026] Figure 8 This is a structural diagram of a transfer carrier according to the present invention that is different from that of the fourth embodiment.

[0027] Figure 9 It is a planar structural diagram of the optical waveguide plate of the present invention.

[0028] Figure 10 This is another structural diagram of the optical waveguide plate of the present invention. DETAILED DESCRIPTION

[0029] In order to explain the technical content, structural features, achieved objectives and effects of the present invention in detail, the following is a detailed description in conjunction with the embodiments and the accompanying drawings.

[0030] refer to Figure 1 In a first embodiment of the present invention, a chip screening and transfer method based on an optical waveguide is disclosed, comprising:

[0031] (a) A carrier substrate 10 is provided, which carries a plurality of chips 20. The chips 20 have opposing first and second surfaces. The first surfaces of the chips 20 are bonded to the carrier substrate 10 via a first adhesive layer 21. The carrier substrate 10 may be a sapphire substrate, a blue film, or other structures.

[0032] (b) providing a transfer carrier 30, said transfer carrier 30 including an optical waveguide sheet 31, with reference to Figure 9 The optical waveguide plate 31 has a light output area 302, and the light output area 302 has a plurality of light output positions 311 corresponding to the positions of the chip 20 on the carrier substrate 10, which can output preset light. The plurality of light output positions 311 are independently controllable. The first surface of the transfer carrier 30 is provided with a photosensitive adhesive layer 32. After the preset light is output from the first surface of the transfer carrier 30, the adhesive force (viscosity) of the photosensitive adhesive layer 32 corresponding to the light output position 311 can be changed.

[0033] (c) The first surface of the transfer carrier 30 is bonded to the second surface of the chip 20 via the photosensitive adhesive layer 32 , and the light emitting position 311 of the optical waveguide plate 31 is aligned with the chip 20 on the carrier substrate 10 .

[0034] (d) Obtaining the position of the preselected chip 20' on the carrier substrate 10, controlling the light output position 311 on the optical waveguide plate 31 corresponding to the position of the preselected chip 20' to output a predetermined light, the predetermined light irradiating the photosensitive adhesive layer 32 on the second surface of the preselected chip 20' to change the adhesive force of the photosensitive adhesive layer 32 on the second surface of the preselected chip 20', wherein the adhesive force of the first adhesive layer 21 is between the adhesive forces before and after the adhesive force of the photosensitive adhesive layer 32 is changed, thereby reversing the adhesive force between the first adhesive layer 21 and the photosensitive adhesive layer 32. In this embodiment, the predetermined light is UV light, and the photosensitive adhesive layer 32 is UV curable adhesive. Before the predetermined light is output, the adhesive force of the first adhesive layer 21 on the first surface of the preselected chip 20' is greater than the adhesive force of the photosensitive adhesive layer 32. After the predetermined light is output to the photosensitive adhesive layer 32 and cured, the adhesive force of the photosensitive adhesive layer 32 increases, causing the adhesive force of the photosensitive adhesive layer 32 on the second surface of the preselected chip 20' to be greater than the adhesive force of the first adhesive layer 21.

[0035] (e) The transfer carrier 30 is moved away from the carrier substrate 10. At this point, the first surfaces of the preselected chips 20' are relatively separated from the carrier substrate 10. The preselected chips 20' are bonded to the first surface of the transfer carrier 30 via the photosensitive adhesive layer 32. The second surfaces of the chips 20 other than the preselected chips 20' are separated from the first surface of the transfer carrier 30 and continue to be bonded to the carrier substrate 10. Alternatively, the entire transfer carrier 30 and carrier substrate 10 can be lifted, and then the carrier substrate 10 removed, to separate the transfer carrier 30 and carrier substrate 10.

[0036] In this embodiment, the pre-selected chips 20 ′ are the chips that are screened out and need to be transferred.

[0037] In step (d) of this embodiment, after obtaining the positions of all pre-selected chips 20' on the carrier substrate 10, the optical waveguide 31 can be controlled to simultaneously output a preset light at the light output positions 311 corresponding to the positions of all pre-selected chips 20', thereby simultaneously changing the adhesive force of the photosensitive adhesive layer 32 at all pre-selected chips 20', thereby facilitating the simultaneous screening and transfer of all pre-selected chips 20 in step (e). The position information of the pre-selected chips 20' can be provided by an automated optical inspection device, other inspection equipment, or a host computer. Of course, the positions of the pre-selected chips 20' can also be obtained in batches, and the corresponding light output positions 311 can be controlled to output the preset light in a time-dependent manner.

[0038] In this embodiment, some chips 20 are selected as pre-selected chips 20 ′. Of course, all chips 20 may also be selected as pre-selected chips 20 ′ to achieve full transfer of the chips 20 on the carrier substrate 10 .

[0039] refer to Figure 1In this embodiment, the first adhesive layer 21 is an array of adhesive dots corresponding to each of the chips 20. In other embodiments, the first adhesive layer 21 may also be coated or pasted on the entire surface of the carrier substrate 10 for bonding the chip 20.

[0040] refer to Figure 1 and Figure 6 In this embodiment, the carrying body of the transfer carrier 30 is composed of the body of the optical waveguide plate 31, the photosensitive adhesive layer 32 is formed on the light emitting position 311 of the optical waveguide plate 31, and the light emitting surface of the optical waveguide plate 31 is the first surface of the transfer carrier 30.

[0041] refer to Figure 9 and Figure 10 In this embodiment, the optical waveguide sheet 31 includes a light guide plate 303, an optical waveguide coupler, and a matrix light source 314. The light guide plate 303 contains an optical waveguide structure for light transmission. The light-emitting surface of the light guide plate 303 includes an input coupling region 301 and a light-emitting region 302. The optical waveguide coupler is located in the input coupling region 301, and a plurality of light-emitting positions 311 are located in the light-emitting region. The matrix light source 314 has light source output points corresponding to the positions of the chips 30 on the carrier substrate 10, for outputting predetermined light. The optical waveguide coupler transmits the predetermined light output by the matrix light source 314 in the input coupling region 301 to the corresponding optical waveguide structure of the light guide plate 303. The optical waveguide structure contains non-interfering optical waveguide paths 312. The optical waveguide paths 312 transmit the predetermined light input from the input coupling region 301 to the corresponding light-emitting positions 311 in the light-emitting region 302, forming light-emitting points at the light-emitting positions 311, thereby directing the light output. The structures of the optical waveguide structure and the optical waveguide coupler are well known to those skilled in the art and will not be described in detail here. In this embodiment, the output light of the light source output point corresponding to the matrix light source 314 can be controlled according to the position of the preselected chip 20 to control which light output positions 311 output the preset light.

[0042] In this embodiment, the matrix light source 314 is an ultraviolet matrix light source, and the ultraviolet matrix light source corresponds one to one chip. Among them, one light emitting position 311 corresponds to one chip 20 or multiple chips 20, and one light emitting position 311 can form one light emitting point or multiple light emitting points. One chip 20 corresponds to one light emitting point or multiple light emitting points. When one chip 20 corresponds to one light emitting point, the adhesion of the photosensitive adhesive layer 32 at the second side of the chip 20 can be changed through one light emitting point. In some other embodiments, one chip 20 can correspond to multiple light emitting points, and the adhesion of the photosensitive adhesive layer 32 at the second side of the chip 20 can be changed through multiple light emitting points.

[0043] In this embodiment, each optical waveguide line 312 corresponds to a light output position 311 , and the present invention independently controls the light output positions 311 by mutually non-interfering optical waveguide lines.

[0044] Of course, the optical waveguide plate 31 used in the present invention is an optical waveguide plate 31 having an independently controllable light emitting position 311 corresponding to the chip 20 on the carrier substrate 10 , and is not limited to the above structure.

[0045] In this embodiment, the preset light is UV light (ultraviolet light), and the photosensitive adhesive layer 32 is a UV curing adhesive. Of course, the preset light can also be other light. In this case, the photosensitive adhesive layer 32 is cured by other glue that is sensitive to the preset light and can change its adhesive strength (viscosity).

[0046] In this embodiment, the chip 20 is an LED chip 20, such as a Micro LED or a Mini LED. Of course, the chip 20 can also be other chips.

[0047] In this embodiment, the photosensitive adhesive layer 32 fully covers the first surface of the transfer carrier 30. Of course, the photosensitive adhesive layer 32 can also only cover all the light-emitting positions 311 of the transfer carrier 30 to form a glue point array, or fully cover the light-emitting area 302 of the transfer carrier 30.

[0048] refer to Figure 2 , which is a second embodiment of the present invention, different from the first embodiment. In the second embodiment of the present invention, the preset light is UV light, and the photosensitive adhesive layer 32 is UV debonding adhesive. Before the preset light is output, the bonding force of the first adhesive layer 21 at the first surface of the preselected chip 20' is less than the bonding force of the photosensitive adhesive layer 32. After the preset light is output, the bonding force of the photosensitive adhesive layer 32 can be reduced, so that the bonding force of the first adhesive layer 21 at the first surface of the preselected chip 20' is greater than the bonding force of the photosensitive adhesive layer 32.

[0049] Therefore, unlike the first embodiment, after the transfer carrier 30 is relatively separated from the carrier substrate 10 in step (e), the first surfaces of the chips 20 other than the pre-selected chip 20' are separated from the carrier substrate 10 and bonded to the transfer carrier 30, and the second surfaces of the pre-selected chip 20' are separated from the first surface of the transfer carrier 30 and remain bonded to the first surface of the carrier substrate 10.

[0050] In this embodiment, the pre-selected chips 20 ′ are chips that need to be retained, and the chips other than the pre-selected chips 20 ′ are screened chips that need to be transferred.

[0051] refer to Figure 3 , which is the third embodiment of the present invention. Unlike the above embodiments, in this embodiment, the photosensitive adhesive layer 32 is provided on the first surface of the transfer carrier 30 in the form of a matrix of adhesive dots. This configuration of the photosensitive adhesive layer 32 can also be used in the following other embodiments, not limited to the first and second embodiments.

[0052] refer to Figure 4 and Figure 7 This is a fourth embodiment of the present invention. Unlike the first embodiment, in this embodiment, the transfer carrier 30a further comprises a transparent substrate 33 having a first surface and a second surface opposite to each other. The photosensitive adhesive layer 32 is provided on the first surface of the transparent substrate 33, and the optical waveguide sheet 31 is provided separately from the second surface of the transparent substrate 33. The first surface of the transparent substrate 33 serves as the first surface of the transfer carrier 30a.

[0053] In this embodiment, the transparent substrate 33 is a glass substrate. Of course, the transparent substrate 33 may also be other transparent substrates.

[0054] refer to Figure 4 In step (c), during operation, the second surface of the transparent substrate 33 can be aligned and assembled with the light-emitting side of the optical waveguide plate 31, and then the first surface of the transparent substrate 33 can be adhered to the second surface of the chip 20. Alternatively, the first surface of the transparent substrate 33 can be adhered to the second surface of the chip 20, and then the second surface of the transparent substrate 33 can be aligned and assembled with the light-emitting side of the optical waveguide plate 31.

[0055] In this embodiment, the predetermined light is light that increases the adhesion of the photosensitive adhesive layer 32. In step (d), the predetermined light is output from the light output position 311 on the optical waveguide 31 corresponding to the position of the preselected chip 20' to increase the adhesion of the photosensitive adhesive layer 32, thereby ensuring that the adhesion of the first adhesive layer 21 on the first surface of the preselected chip 20' is less than the adhesion of the photosensitive adhesive layer 32.

[0056] In step (e), the first surface of the transfer carrier 30 is separated from the carrier substrate 10 , and the optical waveguide sheet 31 and the transparent substrate 33 can be moved simultaneously or sequentially.

[0057] Of course, reference Figure 8 In the transfer carrier 30 c , the optical waveguide plate 31 and the transparent substrate 33 may also be fixed together, and the light emitting surface of the optical waveguide plate 31 faces the second surface of the transparent substrate 33 .

[0058] refer to Figure 5 , which is the fifth embodiment of the present invention, discloses a chip screening and transfer method based on an optical waveguide, comprising:

[0059] (a) A transfer carrier 30 is provided with a plurality of chips 20 bonded thereto. The chips 20 have first and second opposing surfaces. The first surfaces of the plurality of chips 20 are bonded to the first surface of the transfer carrier 30 via a photosensitive adhesive layer 32. The structure of the transfer carrier 30 is as described above, and light-emitting positions 311 on the transfer carrier 30 correspond to positions of the chips 20, respectively.

[0060] (b) Providing a transfer substrate 40 , wherein a second adhesive layer 34 is disposed on a first surface of the transfer substrate 40 .

[0061] (c) Bonding the first surface of the transfer substrate 40 to the second surface of the chip 20 via the second adhesive layer 34 .

[0062] (d) The position of the preselected chip 20' on the transfer carrier 30 is obtained, and a light output position 311 on the optical waveguide plate 31 corresponding to the position of the preselected chip 20' is controlled to output a predetermined light. The predetermined light is irradiated onto the photosensitive adhesive layer 32 on the first surface of the preselected chip 20' to change the adhesive force of the photosensitive adhesive layer 32 on the first surface of the preselected chip 20', thereby changing the adhesive force of the second adhesive layer 34 between the adhesive forces before and after the adhesive force of the photosensitive adhesive layer 32 is changed, thereby reversing the adhesive force between the second adhesive layer 34 and the photosensitive adhesive layer 32. In this embodiment, the predetermined light is UV light, and the photosensitive adhesive layer 32 is a UV debonding adhesive. Before the predetermined light is output, the adhesive force of the second adhesive layer 34 on the second surface of the preselected chip 20' is less than the adhesive force of the photosensitive adhesive layer 32. After the predetermined light is output and cured, the predetermined light reduces the adhesive force of the photosensitive adhesive layer 32 and causes the adhesive force of the photosensitive adhesive layer 32 on the first surface of the preselected chip 20' to be less than the adhesive force of the second adhesive layer 34.

[0063] (e) The transfer substrate 40 is moved in a direction away from the transfer carrier 30 (or vice versa). At this time, the first surface of the pre-selected chip 20' is separated from the transfer carrier 30 and bonded to the transfer substrate 40. The second surfaces of the chips 20 other than the pre-selected chip 20' are separated from the first surface of the transfer substrate 40 and continue to be bonded to the carrier substrate 10.

[0064] In this embodiment, the pre-selected chips 20 ′ are the chips that are screened out and need to be transferred.

[0065] Of course, in another embodiment, the photosensitive adhesive layer 32 may also be a UV-curing adhesive. Before the preset light is output, the bonding force of the second adhesive layer 34 on the second surface of the preselected chip 20' is greater than the bonding force of the photosensitive adhesive layer 32. After the preset light is output, the preset light increases the bonding force of the photosensitive adhesive layer 32 and causes the bonding force of the photosensitive adhesive layer 32 on the first surface of the preselected chip 20' to be greater than the bonding force of the second adhesive layer 34. At this time, the transfer substrate 40 is moved away from the transfer carrier 30 (or conversely, the transfer carrier 30 is moved away from the transfer substrate 40). The first surfaces of the chips 20 other than the preselected chip 20' are separated from the first surface of the transfer carrier 30 and bonded to the transfer substrate 40. The second surfaces of the preselected chips 20' are separated from the first surface of the transfer substrate 40 and continue to be bonded to the transfer carrier 30. In the embodiment where the photosensitive adhesive layer 32 is a UV-curing adhesive, the preselected chips 20' are the chips that have been screened out and do not need to be transferred.

[0066] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention are still within the scope of the present invention.

Claims

1. A transfer carrier for selectively transferring chips, characterized in that: The transfer carrier includes an optical waveguide sheet, one surface of which is a light-emitting surface, and the light-emitting surface has a plurality of independently controllable light-emitting positions capable of outputting preset light, the light-emitting positions corresponding to positions of the chip on the carrier substrate, a photosensitive adhesive layer sensitive to the preset light is provided on the first surface of the transfer carrier, the transfer carrier is bonded to the chip via the photosensitive adhesive layer, the preset light outputted from the light-emitting positions is irradiated from the first surface of the transfer carrier to the photosensitive adhesive layer, and changes the adhesive force of the photosensitive adhesive layer; The optical waveguide sheet includes a light guide plate, an optical waveguide coupler and a matrix light source. The light guide plate has an optical waveguide structure for light conduction. The light output surface of the light guide plate has a coupling-in area and a light output area. The optical waveguide coupler is arranged in the coupling-in area. Several light output positions are located in the light output area. The optical waveguide structure has non-interfering optical waveguide lines, each optical waveguide line corresponds to a light output position, so that the light output positions can be independently controlled through the non-interfering optical waveguide lines. The matrix light source has several light source output points and outputs the preset light to the coupling-in area. The preset light is output to the corresponding light output position through the optical waveguide coupler and the optical waveguide structure.

2. The transfer carrier according to claim 1, wherein: The transfer carrier also includes a transparent substrate having a first surface and a second surface opposite to each other, the first surface of the transparent substrate being provided with the photosensitive adhesive layer, the optical waveguide plate being separated from the transparent substrate or being fixed to the transparent substrate, and the light emitting surface of the optical waveguide plate being adjacent to the second surface of the transparent substrate.

3. The transfer carrier according to claim 1, wherein: The carrying body of the transfer carrier is composed of the optical waveguide sheet, and the light-emitting surface of the optical waveguide sheet is the first surface of the transfer carrier.

4. The transfer carrier according to claim 1, wherein: The photosensitive adhesive layer is provided on the first surface of the transfer carrier in the form of an adhesive dot matrix; or the photosensitive adhesive layer completely covers the first surface of the transfer carrier.

5. The transfer carrier according to claim 1, wherein: The preset light is UV light, the photosensitive adhesive layer is UV debonding adhesive or UV curing adhesive, and the preset light can reduce or increase the adhesive force of the photosensitive adhesive layer.

6. A chip screening and transfer method based on optical waveguide, characterized by: include: Providing a carrier substrate carrying a plurality of chips, wherein the chips have a first surface and a second surface opposite to each other, and the first surfaces of the plurality of chips are adhered to the carrier substrate via a first adhesive layer; Providing a transfer carrier according to any one of claims 1 to 5, wherein the light exit position on the optical waveguide sheet corresponds to the chip position on the carrier substrate; Bonding the first surface of the transfer carrier to the second surface of the chip via the photosensitive adhesive layer, and aligning the light-emitting position of the optical waveguide with the chip on the carrier substrate; Obtaining the position of a preselected chip on the carrier substrate, controlling a light output position on the optical waveguide sheet corresponding to the position of the preselected chip to output the preset light so as to change the adhesive force of the photosensitive adhesive layer on the second surface of the preselected chip, wherein the adhesive force of the first adhesive layer is between the adhesive forces before and after the adhesive force of the photosensitive adhesive layer is changed, so that the adhesive force between the first adhesive layer and the photosensitive adhesive layer is reversed; The first surface of the transfer carrier is relatively away from the carrier substrate.

7. The chip screening and transfer method according to claim 6, wherein: The bonding force of the first adhesive layer is greater than the bonding force of the photosensitive adhesive layer whose bonding force has not changed; "controlling the light output position on the optical waveguide corresponding to the position of the pre-selected chip to output the preset light to change the bonding force of the photosensitive adhesive layer at the second surface of the pre-selected chip" specifically means: controlling the light output position on the optical waveguide corresponding to the position of the pre-selected chip to output the preset light to increase the bonding force of the photosensitive adhesive layer, so that the bonding force of the first adhesive layer is less than the bonding force of the photosensitive adhesive layer after the bonding force is changed.

8. The chip screening and transfer method according to claim 6, wherein: The bonding force of the first adhesive layer is smaller than the bonding force of the photosensitive adhesive layer whose bonding force has not been changed; "controlling the light output position on the optical waveguide corresponding to the position of the pre-selected chip to output the preset light to change the bonding force of the photosensitive adhesive layer at the second surface of the pre-selected chip" specifically means: controlling the light output position on the optical waveguide corresponding to the position of the pre-selected chip to output the preset light to reduce the bonding force of the photosensitive adhesive layer, so that the bonding force of the first adhesive layer is greater than the bonding force of the photosensitive adhesive layer after the bonding force is changed.

9. A chip screening and transfer method based on optical waveguide, characterized by: include: A transfer carrier according to any one of claims 1 to 5 is provided, wherein a plurality of chips are bonded to a first surface of the transfer carrier having a photosensitive layer, the chips having a first surface and a second surface opposite to each other, the first surfaces of the chips being bonded to the first surface of the transfer carrier via a photosensitive adhesive layer, and light-emitting positions on the transfer carrier corresponding to positions of the chips; Providing a transfer substrate, wherein a second adhesive layer is disposed on a first surface of the transfer substrate; bonding the first surface of the transfer substrate to the second surface of the chip via the second adhesive layer; The position of the preselected chip on the transfer carrier is obtained, and the light output position corresponding to the position of the preselected chip on the optical waveguide plate is controlled to output a preset light. The preset light is irradiated on the photosensitive adhesive layer at the first surface of the preselected chip to change the adhesion force of the photosensitive adhesive layer at the first surface of the preselected chip. The adhesion force of the second adhesive layer is between the adhesion force before and after the adhesion force of the photosensitive adhesive layer is changed, so that the adhesion force between the second adhesive layer and the photosensitive adhesive layer is reversed.

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