Chip liquid cooling system and working method thereof

Abstract

The application discloses a chip liquid cooling system and a working method thereof, and belongs to the technical field of chip cooling. A first radiator, a liquid pressurizing device and a second radiator are connected into a circulation loop through pipelines, and the circulation loop is filled with a nanofluid cooling medium; a cooling medium parameter monitoring device is arranged in the circulation loop; one side of the first radiator is connected with a chip through a heat conduction pad, and a first radiator fan is arranged on the other side of the first radiator; a second radiator fan is arranged on one side of the second radiator; the liquid pressurizing device comprises a high-speed motor and a Tesla pump connected with the high-speed motor; and the cooling medium parameter monitoring device is connected with the first radiator fan, the high-speed motor and the second radiator fan respectively. The application has the advantages of simple structure, low cost, noiseless operation, adaptability to load change, and low energy consumption on the premise of good heat dissipation performance.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip cooling, and in particular relates to a chip liquid cooling system and a working method thereof. Background Art

[0002] With the rapid development of information technology, chips are becoming increasingly integrated. This increased integration leads to a sharp increase in power consumption and heat generation per unit area, with the heat flux density of chips currently increasing exponentially. Research has shown that chips will not operate stably if their maximum temperature exceeds 85°C, and every 1°C increase in temperature affects their performance and reliability. For example, when the temperature of an electronic chip rises from 70°C to 80°C, its reliability decreases by 50%.

[0003] Currently, chip cooling systems are mainly divided into passive cooling systems and active cooling systems. Passive cooling systems mainly use heat pipes and phase change heat storage cooling, while active cooling systems are mainly divided into air cooling systems, liquid cooling systems and two-phase cooling systems.

[0004] Currently, high-performance laptops, personal computers, workstations, and servers primarily use forced heat exchange systems with drive devices to cool graphics cards or central processing unit chips, known as active cooling systems. Active cooling systems are primarily powered by piezoelectric pumps, gear pumps, and compressors. Piezoelectric pumps operate at high frequencies, creating noise that is difficult to control and require an independent power supply to meet their specific operating voltage and frequency. Gear pumps have a fixed flow rate, making it difficult to adapt to changes in chip thermal loads, resulting in high flow pulsation and noise. Compressors are complex, costly, and prone to leakage. Furthermore, single cooling methods, such as heat pipes or liquid cooling alone, fail to effectively cool the chip. Summary of the Invention

[0005] In order to solve the above problems, the purpose of the present invention is to provide a chip liquid cooling system and its working method, which has a simple structure, low cost, silent operation, can adapt to changes in load, and reduce energy consumption while having good heat dissipation performance.

[0006] The present invention is achieved through the following technical solutions:

[0007] The present invention discloses a chip liquid cooling system, comprising a thermal pad, a first radiator, a first cooling fan, a liquid pressurizing device, a second radiator, a second cooling fan, and a cooling medium parameter monitoring device;

[0008] The first radiator, the liquid pressurizing device and the second radiator are connected to form a circulation loop through pipelines, and the circulation loop is filled with nanofluid cooling medium; the cooling medium parameter monitoring device is arranged in the circulation loop; one side of the first radiator is connected to the chip through a thermal pad, and the first cooling fan is arranged on the other side of the first radiator; the second cooling fan is arranged on one side of the second radiator; the liquid pressurizing device includes a high-speed motor and a Tesla pump connected to the high-speed motor; the cooling medium parameter monitoring device is respectively connected to the first cooling fan, the high-speed motor and the second cooling fan.

[0009] Preferably, the first radiator includes a heat spreader, a first radiator intermediate body and a first radiator top cover; a plurality of air channels are opened on one side of the heat spreader; a first radiator upper cover is provided on the first radiator top cover; a first radiator lower shell is provided at the bottom of the first radiator intermediate body, and is surrounded by a first radiator side shell on the side, and a cooling medium inlet and a cooling medium outlet are respectively provided at both ends of the first radiator side shell; the upper and lower ends of the first radiator side shell are respectively connected to the first radiator upper cover and the first radiator lower shell; a plurality of column holes are provided on the first radiator lower shell and the first radiator upper cover, and a first radiator heat dissipation column is connected between the column holes on the first radiator lower shell and the column holes on the first radiator upper cover; a plurality of first radiator heat-conducting columns are also connected to the first radiator lower shell and the first radiator upper cover; a plurality of first radiator heat-dissipating fins are arranged on the first radiator upper cover.

[0010] Further preferably, first capillary mesh partitions are evenly arranged inside the heat dissipation columns of the first radiator.

[0011] Further preferably, the first radiator heat conducting column is a heat pipe, the evaporation end of the first radiator heat conducting column is connected to the first radiator lower shell, and the condensation end of the first radiator heat conducting column is connected to the first radiator upper cover.

[0012] Further preferably, the first radiator heat dissipation columns and the first radiator heat conduction columns are arranged in a staggered array; the positions of the column holes on the lower shell of the first radiator correspond to the air channels, and no first radiator fins are provided at the column holes on the upper cover of the first radiator.

[0013] Preferably, the liquid pressurizing device also includes a high-speed motor shaft, a Tesla pump disc and a housing; the high-speed motor shaft is connected to the high-speed motor, and a plurality of Tesla pump discs are arranged on the high-speed motor shaft and encapsulated in the housing; the end of the high-speed motor shaft is a hollow structure and is provided with a cooling medium inlet, and the radial direction of the high-speed motor shaft is provided with a shaft radial hole, and a gasket is provided between adjacent Tesla pump discs, and a gasket radial hole is provided on the gasket, and the shaft radial hole and the gasket radial hole are connected to form a cooling medium channel, and a cooling medium outlet is provided on the housing.

[0014] Further preferably, the number of the shaft radial holes and the gasket radial holes in the circumferential direction is the same.

[0015] Preferably, the second heat sink comprises a second heat sink lower shell, a second heat sink side shell and a second heat sink upper shell; the upper and lower ends of the second heat sink side shell are connected with the second heat sink lower shell and the second heat sink upper shell respectively; a plurality of ventilation holes are formed in the second heat sink lower shell and the second heat sink upper shell, and a second heat sink cooling column is connected between the ventilation holes, and a second capillary mesh partition is arranged in the second heat sink cooling column; a plurality of layers of second heat sink cooling fins are arranged on the second heat sink side shell.

[0016] Preferably, the cooling medium parameter monitoring device comprises a temperature sensor and a pressure sensor, the temperature sensor is connected with the first cooling fan, the high-speed motor and the second cooling fan respectively, and the pressure sensor is connected with the high-speed motor.

[0017] The working method of the chip liquid cooling system disclosed in the application comprises:

[0018] The heat generated by the chip during operation is transmitted to the first heat sink through the heat conduction pad, and then is dissipated under the action of the nanofluid cooling medium and the first cooling fan; the nanofluid cooling medium enters the liquid pressurizing device, and the Tesla pump converts mechanical energy into pressure energy of the fluid under the driving of the high-speed motor to provide energy for the nanofluid cooling medium circulation; the heat absorbed by the nanofluid cooling medium enters the second heat sink, and is dissipated into the air under the action of the second cooling fan; the cooling medium parameter monitoring device monitors the parameters of the cooling medium in real time, and adjusts the rotating speeds of the first cooling fan, the high-speed motor and the second cooling fan in real time.

[0019] Compared with the prior art, the application has the following beneficial technical effects:

[0020] In the current chip cooling power equipment, there are mainly piezoelectric pumps, gear pumps, compressors and the like. The piezoelectric pump belongs to a reciprocating mechanical device, and noise is an inherent problem when it works in a high-frequency working state. At present, there is no good solution, and the piezoelectric vibrator needs a certain frequency of alternating current and voltage, so it needs an independent power supply, which leads to the increase of the complexity of the cooling system. The gear pump belongs to a constant displacement pump, which is difficult to adapt to the change of the heat load of the chip, and has large flow pulsation and noise. The compressor has a complex structure, high cost and is prone to leakage. Based on the above problems, the liquid cooling or vapor system of the chip has not been popularized in large quantities at present.

[0021] The chip liquid cooling system disclosed in the application adopts a Tesla pump as a power equipment, which belongs to a rotary machine, reduces the noise problem of a reciprocating equipment, adopts a conventional high-speed motor for driving, does not need an independent power supply, simplifies the structure of the system, and the Tesla pump has no blade, only needs to arrange a plurality of circular discs on a rotating shaft, relies on the viscosity of liquid to promote pressure when the disc rotates, is simple in processing and manufacturing, and low in cost. Unlike a conventional blade pump, the Tesla pump based on fluid viscosity works, the smaller the size, the higher the efficiency, and the Tesla pump used in the chip cooling system belongs to a micro-sized equipment, the disc diameter is small, and the working efficiency is higher than that of a conventional power machine, thereby reducing energy loss. The current research results show that the mechanical equipment that transmits power by friction has a self-cleaning effect, and nano particles in the liquid cannot deposit on the surface of the disc, and there is no flow passage blockage problem. When the heat load of the chip increases, the rotating speed of the motor is increased to adapt to the load change, and the energy consumption is low. The system adopts a nanofluid cooling medium as a circulating cooling medium, is uniform and stable, has high heat conduction performance, and combines the forced air cooling effect of the first and second heat sinks to improve the overall heat dissipation performance of the system.

[0022] Further, the heat conduction column in the first heat sink adopts a heat pipe principle to quickly conduct the heat generated by the chip to the first heat sink upper cover plate and the first heat sink fin, reduce the temperature of the chip, and ensure the working performance of the chip.

[0023] Further, the first heat sink fin is uniformly arranged with a first capillary mesh partition plate, and the heat is taken away by air in the gap of the first capillary mesh partition plate.

[0024] Further, the first heat sink heat conduction column is not a heat pipe used in conventional chip cooling to transfer the heat generated by the chip to the condenser end of the heat sink, but the evaporation end and the condenser end are both in the first heat sink, thereby reducing the volume of the heat pipe and the volume of the entire heat dissipation system.

[0025] Further, the first heat sink heat conduction column and the first heat sink heat conduction column are arranged alternately, the gap formed is filled with nanofluid, the nanofluid is driven by the Tesla pump to form a circulation, and a part of the heat is carried to the second heat sink, and the heat is discharged into the air by the second heat sink.

[0026] Further, the second heat sink simultaneously adopts three technical schemes of forced air cooling convection, forced liquid cooling, and nanofluid enhanced heat transfer, and effectively dissipates the heat of the chip into the air.

[0027] The working method of the chip liquid cooling system has good heat dissipation effect, good adaptability to load, low energy consumption, no noise during operation and wide application range. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 It is a schematic diagram of the system of the present application;

[0029] Figure 2 It is an exploded view of the first heat sink;

[0030] Figure 3 It is an enlarged view of A in Figure 2

[0031] Figure 4 It is a structural schematic diagram of the liquid pressurizing device;

[0032] Figure 5 It is a structural schematic diagram of the second heat sink.

[0033] In the figure: 1-chip, 2-heat-conducting pad, 3-first heat sink, 31-vapor chamber, 32-first heat sink intermediate body, 33-first heat sink top cover, 311-air channel, 321-first heat sink lower shell, 322-column hole, 323-first heat sink side shell, 324-heat-conducting column, 331-first heat sink heat dissipation column, 332-first heat sink upper cover plate, 333-first heat sink fin, 334-first capillary mesh partition, 4-first heat dissipation fan, 5-liquid pressurizing device, 51-high-speed motor, 521-high-speed motor rotating shaft, 522-Tesla pump disc, 523-housing, 524-rotating shaft radial hole, 525-gasket, 526-gasket radial hole, 6-second heat sink, 61-second heat sink lower shell, 62-second heat sink heat dissipation column, 621-second capillary mesh partition, 63-second heat sink side shell, 64-second heat sink upper shell, 65-second heat sink fin, 7-second heat dissipation fan, 8-temperature sensor, 9-pressure sensor. DETAILED DESCRIPTION

[0034] The present application will be further described in detail below in conjunction with the accompanying drawings, which are explanatory rather than limiting of the present application:

[0035] As Figure 1 , the chip liquid cooling system of the present application comprises a heat-conducting pad 2, a first heat sink 3, a first heat dissipation fan 4, a liquid pressurizing device 5, a second heat sink 6, a second heat dissipation fan 7, and a cooling medium parameter monitoring device;

[0036] ​The first radiator 3, the liquid pressurizing device 5 and the second radiator 6 are connected to form a circulation loop through pipelines, and the circulation loop is filled with nanofluid cooling medium; the cooling medium parameter monitoring device is arranged in the circulation loop; one side of the first radiator 3 is connected to the chip 1 through the thermal pad 2, and the first cooling fan 4 is arranged on the other side of the first radiator 3; the second cooling fan 7 is arranged on one side of the second radiator 6; the liquid pressurizing device 5 includes a high-speed motor 51 and a Tesla pump connected to the high-speed motor 51; the cooling medium parameter monitoring device is respectively connected to the first cooling fan 4, the high-speed motor 51 and the second cooling fan 7.

[0037] like Figure 2 In a preferred embodiment of the present invention, the first radiator 3 includes a heat spreader 31, a first radiator intermediate body 32 and a first radiator top cover 33; a plurality of air channels 311 are opened on one side of the heat spreader 31; a first radiator upper cover 332 is provided on the first radiator top cover 33; a first radiator lower shell 321 is provided at the bottom of the first radiator intermediate body 32, and a first radiator side shell 323 is surrounded on the side; a cooling medium inlet and a cooling medium outlet are provided at both ends of the first radiator side shell 323; the upper and lower ends of the first radiator side shell 323 are respectively provided with cooling medium outlets. The first radiator lower shell 321 and the first radiator upper cover 332 are respectively connected to the first radiator upper cover 332 and the first radiator lower shell 321; a plurality of column holes 322 are provided on the first radiator lower shell 321 and the first radiator upper cover 332, and the first radiator heat dissipation columns 331 are connected between the column holes 322 on the first radiator lower shell 321 and the column holes 322 on the first radiator upper cover 332; the first radiator lower shell 321 and the first radiator upper cover 332 are also connected to a plurality of first radiator heat-conducting columns 324; a plurality of first radiator heat dissipation fins 333 are arranged on the first radiator upper cover 332.

[0038] like Figure 3 Preferably, first capillary mesh partitions 334 are evenly arranged inside the first radiator heat dissipation column 331.

[0039] Preferably, the first radiator heat conducting column 324 is a heat pipe, the evaporation end of the first radiator heat conducting column 324 is connected to the first radiator lower shell 321 , and the condensation end of the first radiator heat conducting column 324 is connected to the first radiator upper cover 332 .

[0040] Preferably, the first radiator heat dissipation columns 331 and the first radiator heat conduction columns 324 are arranged in an alternating array; the position of the column hole 322 on the first radiator lower shell 321 corresponds to the air channel 311, and the first radiator heat dissipation fin 333 is not set at the column hole 322 on the first radiator upper cover 332.

[0041] like Figure 4In a preferred embodiment of the present invention, the liquid pressurizing device 5 further includes a high-speed motor shaft 521, Tesla pump discs 522, and a housing 523. The high-speed motor shaft 521 is connected to the high-speed motor 51, and a plurality of Tesla pump discs 522 are arranged on the high-speed motor shaft 521 and encapsulated within the housing 523. The end of the high-speed motor shaft 521 is hollow and has a cooling medium inlet. Shaft radial holes 524 are arranged radially along the high-speed motor shaft 521. Spacers 525 are provided between adjacent Tesla pump discs 522, each having a gasket radial hole 526 formed therein. The shaft radial holes 524 and the gasket radial holes 526 communicate with each other to form a cooling medium channel. A cooling medium outlet is provided on the housing 523. Preferably, the number of shaft radial holes 524 and gasket radial holes 526 in the circumferential direction is equal.

[0042] like Figure 5 In a preferred embodiment of the present invention, the second radiator 6 includes a second radiator lower shell 61, a second radiator side shell 63 and a second radiator upper shell 64; the upper and lower ends of the second radiator side shell 63 are respectively connected to the second radiator lower shell 61 and the second radiator upper shell 64; the second radiator lower shell 61 and the second radiator upper shell 64 are both provided with a plurality of ventilation holes, and the second radiator heat dissipation columns 62 are connected between the ventilation holes, and the second radiator heat dissipation columns 62 are provided with a second capillary mesh partition 621; the second radiator side shell 63 is provided with a plurality of layers of second radiator heat dissipation fins 65.

[0043] In a preferred embodiment of the present invention, the cooling medium parameter monitoring device includes a temperature sensor 8 and a pressure sensor 9. The temperature sensor 8 is connected to the first cooling fan 4, the high-speed motor 51 and the second cooling fan 7 respectively, and the pressure sensor 9 is connected to the high-speed motor 51.

[0044] In a preferred embodiment of the present invention, the first heat sink heat conducting column 324, the first heat sink heat dissipating column 331 and the second heat sink heat dissipating column 62 can be shaped in a hexagonal prism, a quadrangular prism, a cylinder or other shapes that are easy to process.

[0045] In a preferred embodiment of the present invention, the nanofluid cooling medium is preferably graphene nanofluid, which can significantly enhance the heat exchange effect between the liquid and the wall.

[0046] In a preferred embodiment of the present invention, the thermal pad 2 can be made of a material with good thermal conductivity and low cost, such as thermal grease, thermal silica gel, thermal gel, etc.

[0047] The working method of the above chip liquid cooling system includes:

[0048] The heat generated by the chip 1 when working is transferred to the heat spreader 31 through the thermal pad 2; the first part of the heat of the heat spreader 31 is transferred to the first radiator cover 332 and the first radiator fins 333 by the thermal conductive columns 324; the second part of the heat of the heat spreader 31 is transferred to the first radiator heat dissipation columns 331 and the heat dissipation fins 334 arranged inside; part of the heat transferred by the heat spreader 31 is extracted from the air channel 311 on the heat spreader 31 by the first cooling fan 4, and then dispersed into the air through the first capillary mesh partition 334 and the first radiator fins 333 inside the heat dissipation column 331, and the other part is composed of the nanofluid entering from the side of the first radiator intermediate body 32, flowing through the array gap formed by the first radiator heat conductive columns 324 and the first radiator heat dissipation columns 331, and taking away the heat.

[0049] The nanofluid enters the channel formed by several Tesla pump discs 522 through the inside of the high-speed motor shaft 521, the shaft radial hole 524, and the gasket radial hole 526 in sequence, absorbs mechanical energy and converts it into fluid pressure energy, providing energy for liquid circulation.

[0050] The heat absorbed by the nanofluid in the first radiator 3 is transferred to the second radiator heat dissipation column 62 and the second radiator heat dissipation fin 65 of the second radiator 6, and is dissipated into the air through forced convection of the second capillary mesh partition 621 in the second radiator heat dissipation column 62 and natural convection of the second radiator heat dissipation fin 65.

[0051] The temperature sensor 8 monitors the temperature parameters of the nanofluid and is used to control the rotation speeds of the first cooling fan 4 , the high-speed motor 51 and the second cooling fan 7 . The pressure sensor 9 detects the pressure parameters of the nanofluid and is used to control the rotation speed of the high-speed motor 51 .

[0052] The above description is only part of the embodiments of the present invention. Although some terms are used in the present invention, the possibility of using other terms is not excluded. The use of these terms is merely for the convenience of describing and explaining the essence of the present invention. Interpreting them as any additional limitations is contrary to the spirit of the present invention. The above description is only to further illustrate the content of the present invention with examples to facilitate easier understanding, but it does not mean that the embodiments of the present invention are limited to these. Any technical extension or re-creation made according to the present invention is protected by the present invention.

Claims

1. A chip liquid cooling system, characterized in that: It comprises a thermal pad (2), a first radiator (3), a first cooling fan (4), a liquid pressurizing device (5), a second radiator (6), a second cooling fan (7), and a cooling medium parameter monitoring device; The first radiator (3), the liquid pressurizing device (5) and the second radiator (6) are connected to form a circulation loop through a pipeline, and the circulation loop is filled with a nanofluid cooling medium; the cooling medium parameter monitoring device is arranged in the circulation loop; one side of the first radiator (3) is connected to the chip (1) through a thermal pad (2), and the first cooling fan (4) is arranged on the other side of the first radiator (3); the second cooling fan (7) is arranged on one side of the second radiator (6); the liquid pressurizing device (5) includes a high-speed motor (51) and a Tesla pump connected to the high-speed motor (51); The cooling medium parameter monitoring device is respectively connected to the first cooling fan (4), the high-speed motor (51) and the second cooling fan (7); The first radiator (3) comprises a heat spreader (31), a first radiator intermediate body (32) and a first radiator top cover (33); a plurality of air channels (311) are provided on one side of the heat spreader (31); a first radiator upper cover (332) is provided on the first radiator top cover (33); a first radiator lower shell (321) is provided at the bottom of the first radiator intermediate body (32), and a first radiator side shell (323) is surrounded on the side; a cooling medium inlet and a cooling medium outlet are provided at both ends of the first radiator side shell (323); the upper and lower ends of the first radiator side shell (323) are respectively connected to the first radiator upper cover (332) is connected to the first radiator lower shell (321); a plurality of column holes (322) are provided on the first radiator lower shell (321) and the first radiator upper cover (332), and a first radiator heat dissipation column (331) is connected between the column hole (322) on the first radiator lower shell (321) and the column hole (322) on the first radiator upper cover (332); a plurality of first radiator heat conduction columns (324) are further connected to the first radiator lower shell (321) and the first radiator upper cover (332); a plurality of first radiator heat dissipation fins (333) are arranged on the first radiator upper cover (332); The first radiator heat dissipation columns (331) and the first radiator heat conduction columns (324) are arranged in a staggered array; the position of the column hole (322) on the first radiator lower shell (321) corresponds to the air channel (311), and the first radiator heat dissipation fin (333) is not provided at the column hole (322) on the first radiator upper cover (332).

2. The chip liquid cooling system according to claim 1, characterized in that: First capillary mesh partitions (334) are evenly arranged inside the first radiator heat dissipation column (331).

3. The chip liquid cooling system according to claim 1, characterized in that: The first radiator heat-conducting column (324) is a heat pipe, the evaporation end of the first radiator heat-conducting column (324) is connected to the first radiator lower shell (321), and the condensation end of the first radiator heat-conducting column (324) is connected to the first radiator upper cover (332).

4. The chip liquid cooling system according to claim 1, characterized in that: The liquid pressurizing device (5) further comprises a high-speed motor shaft (521), a Tesla pump disc (522) and a housing (523); the high-speed motor shaft (521) is connected to the high-speed motor (51), and a plurality of Tesla pump discs (522) are arranged on the high-speed motor shaft (521) and encapsulated in the housing (523); the end of the high-speed motor shaft (521) is a hollow structure and is provided with a cooling medium inlet, a shaft radial hole (524) is arranged radially on the high-speed motor shaft (521), a gasket (525) is provided between adjacent Tesla pump discs (522), a gasket radial hole (526) is provided on the gasket (525), the shaft radial hole (524) and the gasket radial hole (526) are connected to form a cooling medium channel, and a cooling medium outlet is provided on the housing (523).

5. The chip liquid cooling system according to claim 4, characterized in that: The number of the rotating shaft radial holes (524) and the gasket radial holes (526) in the circumferential direction is the same.

6. The chip liquid cooling system according to claim 1, characterized in that: The second radiator (6) comprises a second radiator lower shell (61), a second radiator side shell (63) and a second radiator upper shell (64); the upper and lower ends of the second radiator side shell (63) are respectively connected to the second radiator lower shell (61) and the second radiator upper shell (64); a plurality of ventilation holes are provided on the second radiator lower shell (61) and the second radiator upper shell (64), and a second radiator heat dissipation column (62) is connected between the ventilation holes. A second capillary mesh partition (621) is provided in the second radiator heat dissipation column (62); and a plurality of layers of second radiator heat dissipation fins (65) are provided on the second radiator side shell (63).

7. The chip liquid cooling system according to claim 1, characterized in that: The cooling medium parameter monitoring device comprises a temperature sensor (8) and a pressure sensor (9), wherein the temperature sensor (8) is respectively connected to the first cooling fan (4), the high-speed motor (51) and the second cooling fan (7), and the pressure sensor (9) is connected to the high-speed motor (51).

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