A package and method of making the same

Abstract

The application discloses a packaging body and a manufacturing method thereof. The packaging body comprises a first pad assembly, a second pad assembly, at least one device, a first conductive assembly, a second conductive assembly and a first plastic sealing layer. The first pad assembly comprises a first sub-pad and a second sub-pad, the second pad assembly comprises a third sub-pad and a fourth sub-pad, and the third sub-pad is arranged side by side with the first sub-pad. The device is vertically arranged on one side of the first sub-pad facing the second sub-pad and on one side of the third sub-pad facing the fourth sub-pad, a first surface of the device is close to one side of the first sub-pad, and a second surface of the device is close to one side of the third sub-pad. The first conductive assembly is connected with the second sub-pad and a first device pad of the device respectively. The second conductive assembly is connected with the fourth sub-pad and a second device pad of the device respectively. The first plastic sealing layer is arranged on one side of the first sub-pad facing the second sub-pad, and the device is inserted into the first plastic sealing layer. The above scheme can improve the packaging utilization rate of the product.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of device packaging, in particular to a package and a manufacturing method thereof. BACKGROUND

[0002] As a kind of advanced packaging, FOPLP technology has been widely used in discrete devices and active, passive, but as for the current scheme, for smaller products such as 0603 or smaller products, the existing structure will restrict the upgrading trend of miniaturization of devices, and cannot meet the demand of smaller products. The existing product structure has the following disadvantages in the packaging of devices: 1. The product structure cannot be further miniaturized; 2. The board-level packaging will be limited by the processing flow of smaller products; 3. Cannot improve the packaging utilization of products, and cannot reduce the cost of products. A new structure is needed to improve the reliability of products. SUMMARY

[0003] The technical problem solved by the present application is to provide a package and a manufacturing method thereof to improve the packaging utilization of products.

[0004] To solve the above technical problems, one technical solution adopted by the present application is to provide a package, which comprises: a first pad assembly, the first pad assembly comprises a first sub-pad and a second sub-pad located on one side of the first sub-pad, and the first sub-pad is electrically connected with the second sub-pad; a second pad assembly, the second pad assembly comprises a third sub-pad and a fourth sub-pad located on one side of the third sub-pad, and the third sub-pad is electrically connected with the fourth sub-pad; the third sub-pad is arranged side by side with the first sub-pad; at least one device, the device is vertically arranged on the side of the first sub-pad facing the second sub-pad, the device comprises a first surface and a second surface arranged oppositely, the first surface is close to the side of the first sub-pad, the second surface is close to the side of the third sub-pad, the first surface is provided with a first device pad, and the second surface is provided with a second device pad; a first conductive assembly, one end of the first conductive assembly is connected with the second sub-pad, and the other end of the first conductive assembly is connected with the first device pad of the device; a second conductive assembly, one end of the second conductive assembly is connected with the fourth sub-pad, and the other end of the second conductive assembly is connected with the second device pad of the device; a first plastic encapsulation layer, the first plastic encapsulation layer is arranged on the side of the first sub-pad facing the second sub-pad, and the at least one device is inserted into the first plastic encapsulation layer.

[0005] Wherein, the number of devices is multiple, multiple devices are arranged side by side, and multiple devices are electrically connected in sequence through the first device pad and the second device pad on each device.

[0006] The first sub-pad and the second sub-pad are spaced apart, and the third sub-pad and the fourth sub-pad are spaced apart; the package further comprises a dielectric layer, the dielectric layer comprising opposite first and second sides, the first sub-pad and the third sub-pad being located on the first side of the dielectric layer, and the second sub-pad and the fourth sub-pad being located on the second side of the dielectric layer, the first plastic encapsulation layer being in contact with the second side of the dielectric layer; the first pad assembly further comprises a first pad connecting portion, the first pad connecting portion penetrating through the dielectric layer and having two ends connected to the first sub-pad and the second sub-pad respectively; the second pad assembly further comprises a second pad connecting portion, the second pad connecting portion penetrating through the dielectric layer and having two ends connected to the third sub-pad and the fourth sub-pad respectively.

[0007] The first conductive assembly comprises a first conductive portion and a second conductive portion connected to each other, the first conductive portion extending from the second sub-pad to a side away from the first sub-pad, and the second conductive portion connecting one end of the first conductive portion away from the second sub-pad and the first device pad; the second conductive assembly comprises a third conductive portion and a fourth conductive portion connected to each other, the third conductive portion extending from the fourth sub-pad to a side away from the third sub-pad, and the fourth conductive portion connecting one end of the third conductive portion away from the fourth sub-pad and the second device pad.

[0008] The package further comprises a second plastic encapsulation layer and a reinforcing sheet; the second plastic encapsulation layer is arranged on a side of the first plastic encapsulation layer away from the first sub-pad, and covers the first plastic encapsulation layer and the at least one device; the reinforcing sheet is arranged on a side of the second plastic encapsulation layer away from the first plastic encapsulation layer, or the reinforcing sheet is inserted into the second plastic encapsulation layer.

[0009] To solve the above technical problems, the application adopts another technical solution to provide a packaging body manufacturing method, which comprises the following steps: preparing a carrier plate; bonding a first conductive layer on at least one side of the carrier plate; manufacturing a second conductive layer on the side of the first conductive layer away from the carrier plate; etching and removing part of the second conductive layer, and retaining a first preset area and a second preset area of the second conductive layer to form a second sub-pad and a fourth sub-pad, respectively; manufacturing a first plastic sealing layer on the side of the first conductive layer facing the second sub-pad, wherein the first plastic sealing layer covers the second sub-pad and the fourth sub-pad; manufacturing a first conductive component and a second conductive component on the side of the second conductive layer away from the first conductive layer, wherein one end of the first conductive component is connected with the second sub-pad, and one end of the second conductive component is connected with the fourth sub-pad; inserting at least one device into the first plastic sealing layer, so that a first surface and a second surface of the device are oppositely arranged, the first surface is close to the side of the first sub-pad, the second surface is close to the side of the third sub-pad, a first device pad on the first surface is connected with the other end of the first conductive component, and a second device pad on the second surface is connected with the other end of the second conductive component; peeling the carrier plate from the first conductive layer; etching and removing part of the first conductive layer, and retaining a first preset area and a second preset area of the first conductive layer to form a first sub-pad and a third sub-pad, respectively; and the first sub-pad is electrically connected with the second sub-pad, and the third sub-pad is electrically connected with the fourth sub-pad.

[0010] The manufacturing of the second conductive layer on the side of the first conductive layer away from the carrier plate comprises the following steps: pressing a medium layer on the side of the first conductive layer away from the carrier plate; the medium layer comprises opposite first and second sides, and the first side of the medium layer faces the first conductive layer; first and second through holes are formed in the medium layer; a conductive seed layer is formed on the inner wall of the first through hole and the inner wall of the second through hole, respectively, and the first and second through holes are filled by electroplating to form a first pad connecting part in the first through hole, a second pad connecting part in the second through hole, and the second conductive layer on the second side of the medium layer; and the manufacturing of the first plastic sealing layer on the side of the first conductive layer facing the second sub-pad, wherein the first plastic sealing layer covers the second sub-pad and the fourth sub-pad, comprises the following steps: manufacturing the first plastic sealing layer on the side of the second side of the medium layer, wherein the first plastic sealing layer is bonded with the second side of the medium layer, and the first plastic sealing layer covers the second sub-pad and the fourth sub-pad.

[0011] The first conductive component is connected with the other end of the second conductive component, and the second conductive component is connected with the other end of the third conductive component.

[0012] The first device pad on the first surface is connected with the other end of the second conductive component, and the second device pad on the second surface is connected with the other end of the fourth conductive component.

[0013] The number of the devices is multiple; the at least one device is inserted into the accommodating groove, the first device pad is directed to the second conductive part, the second device pad is directed to the fourth conductive part, then the device is welded, the first device pad is connected with the second conductive part away from one end of the first conductive part, the second device pad is connected with the fourth conductive part away from one end of the third conductive part, which comprises: multiple devices are arranged side by side in the accommodating groove, and the first device pad of each device is directed to the second conductive part, and the second device pad of each device is directed to the fourth conductive part; each device is welded, multiple devices are sequentially connected by the first device pad and the second device pad on each device, and the first device pad of the device closest to the second conductive part is connected with the second conductive part away from one end of the first conductive part, and the second device pad of the device closest to the fourth conductive part is connected with the fourth conductive part away from one end of the second conductive part.

[0014] Before the step of peeling the carrier plate from the first conductive layer, the method further comprises: making a second plastic sealing layer on the side of the first plastic sealing layer away from the second sub-pad, the second plastic sealing layer covering the first plastic sealing layer and the at least one device; arranging a reinforcing sheet on the side of the second plastic sealing layer away from the first plastic sealing layer, or inserting the reinforcing sheet into the second plastic sealing layer.

[0015] The beneficial effects of the present application are: different from the prior art, in the package of the present application, the first pad assembly includes a first sub-pad and a second sub-pad located on one side of the first sub-pad, the first sub-pad is electrically connected with the second sub-pad, the second pad assembly includes a third sub-pad and a fourth sub-pad located on one side of the third sub-pad, the third sub-pad is electrically connected with the fourth sub-pad, the third sub-pad is arranged side by side with the first sub-pad, the first plastic sealing layer is arranged on the side of the first sub-pad facing the second sub-pad, the device includes a first surface and a second surface arranged oppositely, the first surface of the device is provided with a first device pad, and the second surface of the device is provided with a second device pad. By inserting at least one device into the first plastic sealing layer, the device is erected on the side of the first sub-pad facing the second sub-pad, and is erected on the side of the third sub-pad facing the fourth sub-pad, the first device pad is close to the side of the first sub-pad, and the second device pad is close to the side of the third sub-pad. In the packaging process, one end of the first conductive assembly is connected with the second sub-pad, the other end of the first conductive assembly is connected with the first device pad of the miniaturized device, one end of the second conductive assembly is connected with the fourth sub-pad, and the other end of the second conductive assembly is connected with the second device pad of the miniaturized device. Therefore, the packaging of various miniaturized active, passive and other devices can be expanded, the utilization rate of the device miniaturization on the FOPLP board level packaging is improved, and the limitations of the FOPLP advanced board level packaging are improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creating labor. Among them:

[0017] Figure 1 It is a structure schematic diagram of the first embodiment of the package of the present application;

[0018] Figure 2 It is a structure schematic diagram of the second embodiment of the package of the present application;

[0019] Figure 3 It is a flowchart schematic diagram of the first embodiment of the manufacturing method of the package of the present application;

[0020] Figure 4 It is a flowchart schematic diagram of the second embodiment of the manufacturing method of the package of the present application;

[0021] Figures 5a to 5j It is Figure 4 The manufacturing flow structure schematic diagram of each step of an embodiment corresponding to steps S401-S411 in the method;

[0022] Figure 6 FIG. 2 shows a flowchart of another embodiment of the manufacturing process structure corresponding to the manufacturing process structure shown in FIG. 1. Figure 5a FIG. 2 shows a flowchart of another embodiment of the manufacturing process structure corresponding to the manufacturing process structure shown in FIG. 1. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0024] Please refer to Figure 1 , Figure 1 FIG. 1 shows a structure diagram of a first embodiment of a package of the present application. In an embodiment, the package comprises: a first pad assembly 10, the first pad assembly 10 comprises a first sub-pad 101 and a second sub-pad 102 located on one side of the first sub-pad 101, the first sub-pad 101 is electrically connected with the second sub-pad 102; a second pad assembly 11, the second pad assembly 11 comprises a third sub-pad 111 and a fourth sub-pad 112 located on one side of the third sub-pad 111, the third sub-pad 111 is electrically connected with the fourth sub-pad 112; the third sub-pad 111 is arranged side by side with the first sub-pad 101; at least one device 12, the device 12 is vertically arranged on one side of the first sub-pad 101 facing the second sub-pad 102, and is vertically arranged on one side of the third sub-pad 111 facing the fourth sub-pad 112, the device 12 comprises oppositely arranged first and second surfaces, the first surface is close to one side of the first sub-pad 101, the second surface is close to one side of the third sub-pad 111, the first surface is provided with a first device pad 121, and the second surface is provided with a second device pad 122; a first conductive assembly 13, one end of the first conductive assembly 13 is connected with the second sub-pad 102, and the other end of the first conductive assembly 13 is connected with the first device pad 121 of the device 12; a second conductive assembly 14, one end of the second conductive assembly 14 is connected with the fourth sub-pad 112, and the other end of the second conductive assembly 14 is connected with the second device pad 122 of the device 12; a first plastic encapsulation layer 15, the first plastic encapsulation layer 15 is arranged on one side of the first sub-pad 101 facing the second sub-pad 102, and the at least one device 12 is inserted into the first plastic encapsulation layer 15.

[0025] The above scheme, in the package, the first pad assembly 10 includes a first sub-pad 101 and a second sub-pad 102 located on one side of the first sub-pad 101, the first sub-pad 101 is electrically connected with the second sub-pad 102, the second pad assembly 11 includes a third sub-pad 111 and a fourth sub-pad 112 located on one side of the third sub-pad 111, the third sub-pad 111 is electrically connected with the fourth sub-pad 112, the third sub-pad 111 is arranged side by side with the first sub-pad 101, the first plastic sealing layer 15 is arranged on the side of the first sub-pad 101 facing the second sub-pad 102, the device 12 includes a first surface and a second surface arranged oppositely, the first surface of the device 12 is provided with a first device pad 121, and the second surface of the device 12 is provided with a second device pad 122, by inserting at least one device 12 into the first plastic sealing layer 15, the device 12 is erected on the side of the first sub-pad 101 facing the second sub-pad 102, and is erected on the side of the third sub-pad 111 facing the fourth sub-pad 112, the first device pad 121 is close to the side of the first sub-pad 101, and the second device pad 122 is close to the side of the third sub-pad 111, so that in the packaging process, one end of the first conductive assembly 13 is connected with the second sub-pad 102, the other end of the first conductive assembly 13 is connected with the first device pad 121 of the miniaturized device 12, one end of the second conductive assembly 14 is connected with the fourth sub-pad 112, and the other end of the second conductive assembly 14 is connected with the second device pad 122 of the miniaturized device 12, so that the packaging of various miniaturized active, passive and other devices 12 can be expanded, the utilization rate of the device 12 miniaturization on the FOPLP board level packaging is improved, and the limitation of the FOPLP advanced board level packaging is improved.

[0026] Further, the number of devices 12 is multiple, the multiple devices 12 are arranged side by side, and the multiple devices 12 are sequentially electrically connected through the first device pad 121 and the second device pad 122 on each device 12. Thus, the multiple devices 12 can be erected on the same side of the first pad assembly 10 and the second pad assembly 11, and are not limited to the number of the first pad assembly 10 and the second pad assembly 11, the packaging utilization rate of the product can be improved, and the cost of the product can be reduced. The device 12 of the present application can be a chip, a resistor, a capacitor, an inductor and the like, when multiple chips are arranged, the functions of the chips can be the same or different.

[0027] Please refer to Figure 2 , Figure 2FIG. 2 is a structural schematic diagram of a second embodiment of the package of the present application. The second embodiment differs from the first embodiment described above in that, in the second embodiment, the first sub-pad 101 and the second sub-pad 102 are spaced apart, and the third sub-pad 111 and the fourth sub-pad 112 are spaced apart; the package further includes a dielectric layer 16, the dielectric layer 16 including opposite first and second sides, the first sub-pad 101 and the third sub-pad 111 being located on the first side of the dielectric layer 16, the second sub-pad 102 and the fourth sub-pad 112 being located on the second side of the dielectric layer 16, the first encapsulation layer 15 being in contact with the second side of the dielectric layer 16; the first pad assembly 10 further includes a first pad connecting portion 103, the first pad connecting portion 103 passing through the dielectric layer 16 and being connected at both ends to the first sub-pad 101 and the second sub-pad 102; the second pad assembly 11 further includes a second pad connecting portion 113, the second pad connecting portion 113 passing through the dielectric layer 16 and being connected at both ends to the third sub-pad 111 and the fourth sub-pad 112.

[0028] It can be understood that the first sub-pad 101, the second sub-pad 102, and the first pad connecting portion 103 can be integrally formed, and the third sub-pad 111, the fourth sub-pad 112, and the second pad connecting portion 113 can also be integrally formed. The dielectric layer 16 can specifically be a prepreg (Prepreg, abbreviated as PP), by providing the dielectric layer 16 between the first sub-pad 101 and the second sub-pad 102 and between the third sub-pad 111 and the fourth sub-pad 112, and by making the first pad connecting portion 103 located between the first sub-pad 101 and the second sub-pad 102 and the second pad connecting portion 113 located between the third sub-pad 111 and the fourth sub-pad 112 pass through the dielectric layer 16, the first encapsulation layer 15 made is in contact with the second side of the dielectric layer 16, so that the bonding force between the first encapsulation layer 15 and the dielectric layer 16 can be enhanced, structural damage to the package due to the shearing force of the device 12 can be avoided, and product reliability is improved.

[0029] Further, the first conductive assembly 13 includes a first conductive portion 131 and a second conductive portion 132 connected in series, the first conductive portion 131 extending from the second sub-pad 102 to a side away from the first sub-pad 101, and the second conductive portion 132 connecting one end of the first conductive portion 131 away from the second sub-pad 102 and the first device pad 121; the second conductive assembly 14 includes a third conductive portion 141 and a fourth conductive portion 142 connected in series, the third conductive portion 141 extending from the fourth sub-pad 112 to a side away from the third sub-pad 111, and the fourth conductive portion 142 connecting one end of the third conductive portion 141 away from the fourth sub-pad 112 and the second device pad 122.

[0030] It can be understood that, since the device 12 is inserted into the first plastic encapsulation layer 15, the device 12 is arranged on one side of the first sub-pad 101 facing the second sub-pad 102, and is arranged on one side of the third sub-pad 111 facing the fourth sub-pad 112, the first device pad 121 is close to one side of the first sub-pad 101, and the second device pad 122 is close to one side of the third sub-pad 111, therefore, in the process of manufacturing the first conductive assembly 13 and the first conductive part 131, the second conductive part 132 can be connected to the first device pad 121, and the fourth conductive part 142 can be connected to the second device pad 122, so that the communication with the device pad of the device 12 can be realized in the case that the device 12 is a miniaturized device 12, and the packaging of various miniaturized active, passive and other devices 12 can be expanded.

[0031] In an embodiment, the packaging body further comprises a second plastic encapsulation layer 17, which is arranged on one side of the first plastic encapsulation layer 15 away from the first sub-pad 101, and covers the first plastic encapsulation layer 15 and at least one device 12.

[0032] Further, the packaging body further comprises a reinforcing sheet 18, which is arranged on one side of the second plastic encapsulation layer 17 away from the first plastic encapsulation layer 15, or is inserted into the second plastic encapsulation layer 17. By arranging the reinforcing sheet 18 on one side of the second plastic encapsulation layer 17 or in the second plastic encapsulation layer 17, the overall rigidity of the packaging body can be ensured, and the product reliability can be improved.

[0033] The application also provides a packaging body manufacturing method, and the packaging body manufacturing method of the application can be used to manufacture any of the packaging bodies described above. Please refer to Figure 3 , Figure 3 The application also provides a packaging body manufacturing method, and the packaging body manufacturing method of the application can be used to manufacture any of the packaging bodies described above. Please refer to

[0034] S31: Prepare a carrier plate.

[0035] S32: Attach a first conductive layer on at least one side of the carrier plate.

[0036] In an embodiment, the carrier plate and the first conductive layer can also be provided together as a sheet of peelable copper foil material, the carrier plate is a peelable carrier, and the first conductive layer is a copper foil layer. The carrier plate can provide mechanical strength support for the entire processing flow.

[0037] S33: Manufacture a second conductive layer on one side of the first conductive layer away from the carrier plate.

[0038] S34: Etch and remove part of the second conductive layer, and reserve a first preset area and a second preset area of the second conductive layer to form a second sub-pad and a fourth sub-pad, respectively.

[0039] Specifically, the second conductive layer is first formed on the first conductive layer, and then a part of the second conductive layer is etched and removed, and a first preset region and a second preset region of the second conductive layer are reserved to form the second sub-pad and the fourth sub-pad, respectively.

[0040] S35: A first plastic sealing layer is formed on the first conductive layer towards the second sub-pad, and the first plastic sealing layer covers the second sub-pad and the fourth sub-pad.

[0041] S36: A first conductive component and a second conductive component are formed on the second conductive layer away from the first conductive layer, one end of the first conductive component is connected with the second sub-pad, and one end of the second conductive component is connected with the fourth sub-pad.

[0042] S37: At least one device is inserted into the first plastic sealing layer, and a first surface and a second surface of the device are oppositely arranged, the first surface is close to the first sub-pad side, the second surface is close to the third sub-pad side, a first device pad on the first surface is connected with the other end of the first conductive component, and a second device pad on the second surface is connected with the other end of the second conductive component.

[0043] It can be understood that after the first conductive component and the first conductive part are formed, the device is inserted into the first plastic sealing layer, and the device is vertically arranged on the first sub-pad side towards the second sub-pad, and vertically arranged on the third sub-pad side towards the fourth sub-pad, the first device pad is close to the first sub-pad side, and the second device pad is close to the third sub-pad side, so that the first device pad can be aligned with the second conductive part, and the second device pad can be aligned with the fourth conductive part, thereby realizing the connection of the second conductive part with the first device pad and the connection of the fourth conductive part with the second device pad, and in the case of miniaturized devices, accurate communication with the device pad can be realized, and various miniaturized active, passive and other devices can be packaged.

[0044] S38: The carrier plate is peeled off from the first conductive layer.

[0045] S39: A part of the first conductive layer is etched and removed, and a first preset region and a second preset region of the first conductive layer are reserved to form a first sub-pad and a third sub-pad, respectively. The first sub-pad is electrically connected with the second sub-pad, and the third sub-pad is electrically connected with the fourth sub-pad.

[0046] It can be understood that when the first conductive layer is attached to one side of the carrier plate in step S32, the carrier plate is peeled off from the first conductive layer to obtain a packaging structure on one side, and then a part of the first conductive layer in the packaging structure is etched and removed to retain the first preset area and the second preset area of the first conductive layer to form the first sub-pad and the third sub-pad respectively, thereby forming a packaging body; when the first conductive layer is attached to both sides of the carrier plate in step S32, the carrier plate is peeled off from the first conductive layer to obtain a packaging structure on both sides, and then a part of the first conductive layer in the packaging structure on both sides is etched and removed to retain the first preset area and the second preset area of the first conductive layer to form the first sub-pad and the third sub-pad respectively, thereby forming two packaging bodies.

[0047] Please refer to Figure 4 、 Figures 5a to 5j wherein, Figure 4 is a flowchart of a second embodiment of the packaging body manufacturing method of the present application, Figures 5a to 5j is Figure 4 is a manufacturing flowchart structure diagram of each step of an implementation corresponding to steps S401-S411 in The packaging body manufacturing method in the embodiment includes the following steps:

[0048] S401: preparing a carrier plate.

[0049] S402: attaching a first conductive layer to at least one side of the carrier plate.

[0050] S403: manufacturing a second conductive layer on a side of the first conductive layer away from the carrier plate.

[0051] S404: etching and removing a part of the second conductive layer to retain a first preset area and a second preset area of the second conductive layer to form a second sub-pad and a fourth sub-pad respectively.

[0052] Specifically, as shown in Figure 5a In an implementation, a carrier plate 20 is prepared first, then a first conductive layer 191 is attached to one side of the carrier plate 20, a second conductive layer is formed on a side of the first conductive layer 191 away from the carrier plate 20, and then a part of the second conductive layer can be etched and removed to form a second sub-pad 102 and a fourth sub-pad 112.

[0053] S405: manufacturing a first plastic encapsulation layer on a side of the first conductive layer facing the second sub-pad, the first plastic encapsulation layer covering the second sub-pad and the fourth sub-pad.

[0054] The steps S401-S405 of the embodiment are basically the same as the steps S31-S35 in the previous embodiment, and will not be described here.

[0055] Specifically, such as Figure 5b As shown, in one embodiment, a film-like molding compound is superimposed on the side of the first conductive layer 191 facing the second sub-pad 102, and then the molding compound is cured by lamination to form a first molding layer 15 covering the second sub-pad 102 and the fourth sub-pad 112, so that the first conductive layer 191 and the first molding layer 15 are firmly bonded together.

[0056] In one embodiment, step S403 may specifically include: laminating a dielectric layer on the side of the first conductive layer away from the carrier plate; the dielectric layer includes a first side and a second side opposite to each other, the first side of the dielectric layer facing the first conductive layer; forming a first through hole and a second through hole on the dielectric layer; forming a conductive seed layer on the inner wall of the first through hole and the inner wall of the second through hole respectively; electroplating to fill the first through hole and the second through hole to form a first pad connection portion in the first through hole and a second pad connection portion in the second through hole; and forming the second conductive layer on the second side of the dielectric layer.

[0057] Specifically, such as Figure 6 As shown, in one embodiment, a carrier board 20 is first prepared, and then a first conductive layer 191 is attached to both sides of the carrier board 20. For each side of the first conductive layer 191, a dielectric layer 16 is laminated on the side of the first conductive layer 191 away from the carrier board 20. The dielectric layer 16 includes a first side and a second side opposite to each other. The first side of the dielectric layer 16 faces the first conductive layer 191. Then, a first pad connection portion 103 and a second pad connection portion 113 can be formed on the dielectric layer 16 by means of opening holes, copper plating, and electroplating. A second conductive layer is formed on the second side of the dielectric layer 16. Then, a portion of the second conductive layer can be etched away to form a second sub-pad 102 and a fourth sub-pad 112. When a dielectric layer 16 is disposed between the first conductive layer 191 and the second sub-pad 102, step S405 may specifically include: fabricating the first molding compound on one side of the second side of the dielectric layer, wherein the first molding compound is adhered to the second side of the dielectric layer and covers the second sub-pad and the fourth sub-pad. Because the fabricated first molding compound is adhered to the second side of the dielectric layer, the bonding force between the first molding compound and the dielectric layer is enhanced, improving product reliability.

[0058] S406: A first conductive component and a second conductive component are fabricated on the side of the second conductive layer away from the first conductive layer, one end of the first conductive component is connected to the second sub-pad, and one end of the second conductive component is connected to the fourth sub-pad.

[0059] S407: Insert at least one device into the first molding compound, such that the devices are disposed opposite to each other on a first surface and a second surface, with the first surface near the first sub-pad and the second surface near the third sub-pad, and the first device pad on the first surface is connected to the other end of the first conductive component, and the second device pad on the second surface is connected to the other end of the second conductive component.

[0060] In one embodiment, step S406 specifically includes: forming a first blind via at a first preset position of the first molding compound layer, and forming a second blind via at a second preset position of the molding compound layer; wherein the bottom of the first blind via reaches the second sub-pad, and the bottom of the second blind via reaches the fourth sub-pad; forming a conductive seed layer on the inner wall of the first blind via and the inner wall of the second blind via respectively, electroplating to fill the first blind via and the second blind via, so as to form a first conductive portion in the first blind via and a third conductive portion in the second blind via, and forming a metal layer on the side of the first molding compound layer away from the first conductive layer; etching away a portion of the metal layer, retaining the portion of the metal layer between the first conductive portion and the third conductive portion; forming a receiving groove at the position of the metal layer between the first conductive portion and the third conductive portion, the receiving groove causing the metal layer to break and extend into the first molding compound layer, the portion of the metal layer connected to the first conductive portion being used as the second conductive portion, and the portion of the metal layer connected to the third conductive portion being used as the fourth conductive portion. At this time, step S407 specifically includes: inserting the at least one device into the receiving groove, so that the first device pad faces the second conductive part and the second device pad faces the fourth conductive part, and then soldering the device so that the first device pad is connected to the end of the second conductive part away from the first conductive part and the second device pad is connected to the end of the fourth conductive part away from the third conductive part.

[0061] Specifically, such as Figure 5c As shown, in one embodiment, laser drilling is performed directly on the surface of the first molding compound 15 at a first preset position and a second preset position to form a first blind hole 151 and a second blind hole 152. The first blind hole 151 and the second blind hole 152 penetrate the first molding compound 15, with the bottom of the first blind hole 151 reaching the second sub-pad 102 and the bottom of the second blind hole 152 reaching the fourth sub-pad 112. Then, combined with... Figure 5c and Figure 5dAfter forming the first blind via 151 and the second blind via 152, a conductive seed layer (not shown) can be formed on the inner wall of the first blind via 151 and the second blind via 152. Then, the first blind via 151 and the second blind via 152 are filled with electroplated copper to form a first conductive portion 131 in the first blind via 151, a third conductive portion 141 in the second blind via 152, and a metal layer 192 on the side of the first molding layer 15 away from the first conductive layer 191. Then, combined with... Figure 5d and Figure 5e A portion of the metal layer 192 is etched away, leaving the portion between the first conductive portion 131 and the third conductive portion 141, thus completing the fabrication of the conductive component. A receiving groove 153 is formed at the position of the metal layer 192 between the first conductive portion 131 and the third conductive portion 141. The receiving groove 153 breaks the metal layer 192 and extends it into the first molding layer 15. The portion of the metal layer 192 connected to the first conductive portion 131 serves as the second conductive portion 132, and the portion of the metal layer 192 connected to the third conductive portion 141 serves as the fourth conductive portion 142. Then, as... Figure 5f As shown, at least one device 12 is inserted into the receiving groove 153, with the first device pad 121 facing the second conductive part 132 and the second device pad 122 facing the fourth conductive part 142. Then, the device 12 can be soldered so that the first device pad 121 is connected to the end of the second conductive part 132 away from the first conductive part 131, and the second device pad 122 is connected to the end of the fourth conductive part 142 away from the third conductive part 141.

[0062] In one embodiment, when there are multiple devices, step S407 may specifically include: arranging multiple devices side-by-side in the receiving groove, with the first device pad of each device facing the second conductive portion and the second device pad of each device facing the fourth conductive portion; soldering each device so that the multiple devices are sequentially electrically connected through the first device pad and the second device pad on each device, and the first device pad of the device closest to the second conductive portion is connected to the end of the second conductive portion away from the first conductive portion, and the second device pad of the device closest to the fourth conductive portion is connected to the end of the fourth conductive portion away from the second conductive portion.

[0063] S408: A second molding layer is formed on the side of the first molding layer away from the second sub-pad, the second molding layer covering the first molding layer and the at least one device.

[0064] S409: A reinforcing sheet is provided on the side of the second molding layer away from the first molding layer, or the reinforcing sheet is inserted into the second molding layer.

[0065] Specifically, as shown in Figure 5g and Figure 5h In an embodiment, after the device 12 is connected with the first conductive component 13 and the second conductive component 14, since the device 12 is only partially encapsulated in the first encapsulation layer 15, a film-shaped encapsulation material can be further stacked on the first encapsulation layer 15, and then the encapsulation material is solidified by lamination to form a second encapsulation layer 17 covering the first encapsulation layer 15 and the device 12. Then, a reinforcing sheet 18 can be stacked on the second encapsulation layer 17. The reinforcing sheet 18 can be a semi-cured sheet, which is solidified by cooling to form the reinforcing sheet 18 to improve the rigidity of the encapsulation structure.

[0066] S410: peeling the carrier plate from the first conductive layer.

[0067] S411: etching and removing part of the first conductive layer to reserve a first preset area and a second preset area of the first conductive layer to form a first sub-pad and a third sub-pad, respectively. The first sub-pad is electrically connected with the second sub-pad, and the third sub-pad is electrically connected with the fourth sub-pad.

[0068] Specifically, as shown in Figure 5h , Figure 5i and Figure 5j In an embodiment, since the first conductive layer 191 is attached to both sides of the carrier plate 20, after the carrier plate 20 is peeled from the first conductive layer 191, two encapsulation structures can be obtained. Then, part of the first conductive layer 191 in the two encapsulation structures is etched and removed to reserve a first preset area and a second preset area of the first conductive layer 191 to form a first sub-pad 101 and a third sub-pad 111, respectively, so that two encapsulation bodies 1 can be obtained.

[0069] The package of the application, the first pad assembly includes a first sub-pad and a second sub-pad located on one side of the first sub-pad, the first sub-pad is electrically connected with the second sub-pad, the second pad assembly includes a third sub-pad and a fourth sub-pad located on one side of the third sub-pad, the third sub-pad is electrically connected with the fourth sub-pad, the third sub-pad is arranged side by side with the first sub-pad, the first plastic sealing layer is arranged on the side of the first sub-pad facing the second sub-pad, the device includes a first surface and a second surface arranged oppositely, the first surface of the device is provided with a first device pad, and the second surface of the device is provided with a second device pad, at least one device is inserted into the first plastic sealing layer, so that the device is erected on the side of the first sub-pad facing the second sub-pad and on the side of the third sub-pad facing the fourth sub-pad, the first device pad is close to the side of the first sub-pad, and the second device pad is close to the side of the third sub-pad, so that in the packaging process, one end of the first conductive assembly is connected with the second sub-pad, the other end of the first conductive assembly is connected with the first device pad of the miniaturized device, one end of the second conductive assembly is connected with the fourth sub-pad, and the other end of the second conductive assembly is connected with the second device pad of the miniaturized device, so that the packaging of various miniaturized active, passive and other devices can be expanded, the utilization rate of the device miniaturization on the FOPLP board-level packaging is improved, and the limitations of the FOPLP advanced board-level packaging are improved.

[0070] It should be noted that in this application, the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitation, the elements defined by the statement "include" do not exclude the presence of other identical elements in the process, method, article or equipment including the elements.

[0071] The above is only the embodiment of the application, and does not limit the patent scope of the application, and any equivalent structure or equivalent principle transformation using the content of the application specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the application.

Claims

1. A package, characterized by, The package comprises: a first pad assembly comprising a first sub-pad and a second sub-pad located on one side of the first sub-pad, the first sub-pad being electrically connected with the second sub-pad; a second pad assembly comprising a third sub-pad and a fourth sub-pad located on one side of the third sub-pad, the third sub-pad being electrically connected with the fourth sub-pad; the third sub-pad being arranged side by side with the first sub-pad; at least one device, the device being vertically arranged on one side of the first sub-pad towards the second sub-pad and on one side of the third sub-pad towards the fourth sub-pad, the device comprising oppositely arranged first and second surfaces, the first surface being close to one side of the first sub-pad, the second surface being close to one side of the third sub-pad, the first surface being provided with a first device pad, and the second surface being provided with a second device pad; a first conductive assembly, one end of the first conductive assembly being connected with the second sub-pad, and the other end of the first conductive assembly being connected with the first device pad of the device; a second conductive assembly, one end of the second conductive assembly being connected with the fourth sub-pad, and the other end of the second conductive assembly being connected with the second device pad of the device; a first plastic encapsulation layer, the first plastic encapsulation layer being arranged on one side of the first sub-pad towards the second sub-pad, and the at least one device being inserted into the first plastic encapsulation layer.

2. The package of claim 1, wherein, The number of the devices is multiple, the multiple devices being arranged side by side, and the multiple devices being electrically connected in sequence through the first and second device pads on each device.

3. The package of claim 1, wherein, The first sub-pad and the second sub-pad are arranged in a spaced manner, and the third sub-pad and the fourth sub-pad are arranged in a spaced manner; The package further comprises a dielectric layer, the dielectric layer comprising opposite first and second sides, the first sub-pad and the third sub-pad being located on the first side of the dielectric layer, and the second sub-pad and the fourth sub-pad being located on the second side of the dielectric layer, the first plastic encapsulation layer being in contact with the second side of the dielectric layer; The first pad assembly further comprises a first pad connecting portion, the first pad connecting portion penetrating through the dielectric layer and being connected with the first and second sub-pads at two ends thereof; The second pad assembly further comprises a second pad connecting portion, the second pad connecting portion penetrating through the dielectric layer and being connected with the third and fourth sub-pads at two ends thereof.

4. The package of claim 1, wherein, The first conductive assembly comprises a first conductive portion and a second conductive portion connected in series, the first conductive portion extending from the second sub-pad to a side away from the first sub-pad, and the second conductive portion connecting one end of the first conductive portion away from the second sub-pad and the first device pad; The second conductive assembly comprises a third conductive portion and a fourth conductive portion connected in series, the third conductive portion extending from the fourth sub-pad to a side away from the third sub-pad, and the fourth conductive portion connecting one end of the third conductive portion away from the fourth sub-pad and the second device pad.

5. The package of claim 4, wherein, The package further comprises a second plastic sealing layer and a reinforcing sheet; the second plastic sealing layer is arranged on the side of the first plastic sealing layer away from the first sub-pad, and covers the first plastic sealing layer and the at least one device; the reinforcing sheet is arranged on the side of the second plastic sealing layer away from the first plastic sealing layer, or the reinforcing sheet is inserted into the second plastic sealing layer.

6. A method for fabricating a package, the method comprising: The manufacturing method of the package comprises: preparing a carrier plate; attaching a first conductive layer on at least one side of the carrier plate; manufacturing a second conductive layer on the side of the first conductive layer away from the carrier plate; etching and removing part of the second conductive layer, and retaining a first preset area and a second preset area of the second conductive layer to form a second sub-pad and a fourth sub-pad, respectively; manufacturing a first plastic sealing layer on the side of the first conductive layer facing the second sub-pad, which covers the second sub-pad and the fourth sub-pad; manufacturing a first conductive assembly and a second conductive assembly on the side of the second conductive layer away from the first conductive layer, one end of the first conductive assembly is connected with the second sub-pad, and one end of the second conductive assembly is connected with the fourth sub-pad; inserting the at least one device into the first plastic sealing layer, and arranging the first surface and the second surface of the device oppositely, and connecting the first device pad on the first surface with the other end of the first conductive assembly, and connecting the second device pad on the second surface with the other end of the second conductive assembly; peeling the carrier plate from the first conductive layer; etching and removing part of the first conductive layer, and retaining a first preset area and a second preset area of the first conductive layer to form a first sub-pad and a third sub-pad, respectively; the first sub-pad is electrically connected with the second sub-pad, and the third sub-pad is electrically connected with the fourth sub-pad; the first surface of the device is close to the side of the first sub-pad, and the second surface of the device is close to the side of the third sub-pad.

7. The method of claim 6, wherein The manufacturing of the second conductive layer on the side of the first conductive layer away from the carrier plate comprises: pressing a medium layer on the side of the first conductive layer away from the carrier plate; the medium layer comprises opposite first and second sides, and the first side of the medium layer faces the first conductive layer; opening a first through hole and a second through hole on the medium layer; manufacturing a conductive seed layer on the inner wall of the first through hole and the inner wall of the second through hole, respectively, and electroplating to fill the first through hole and the second through hole, so as to form a first pad connecting part in the first through hole, a second pad connecting part in the second through hole, and the second conductive layer on the second side of the medium layer; The manufacturing of the first plastic sealing layer on the side of the first conductive layer facing the second sub-pad, which covers the second sub-pad and the fourth sub-pad, comprises: manufacturing the first plastic sealing layer on the side of the second side of the medium layer, which is attached to the second side of the medium layer, and covers the second sub-pad and the fourth sub-pad.

8. The method of claim 6 or 7, wherein The first conductive component is connected with the first sub-pad, and the second conductive component is connected with the fourth sub-pad. A first blind hole is formed at a first preset position of the first plastic sealing layer, and a second blind hole is formed at a second preset position of the plastic sealing layer; the bottom of the first blind hole reaches the second sub-pad, and the bottom of the second blind hole reaches the fourth sub-pad; A conductive seed layer is formed on the inner wall of the first blind hole and the inner wall of the second blind hole, respectively, and the first blind hole and the second blind hole are filled by electroplating to form a first conductive part in the first blind hole, a third conductive part in the second blind hole, and a metal layer on the side of the first plastic sealing layer away from the first conductive layer; A part of the metal layer is etched and removed, and a part of the metal layer between the first conductive part and the third conductive part is reserved; A containing groove is formed at the position of the metal layer between the first conductive part and the third conductive part, the containing groove disconnects the metal layer and extends into the first plastic sealing layer, and the part of the metal layer connected with the first conductive part is taken as a second conductive part, and the part of the metal layer connected with the third conductive part is taken as a fourth conductive part; The at least one device is inserted into the containing groove, the first device pad faces the second conductive part, and the second device pad faces the fourth conductive part, and then the device is welded, so that the first device pad is connected with one end of the second conductive part away from the first conductive part, and the second device pad is connected with one end of the fourth conductive part away from the third conductive part. The number of devices is multiple; 9. The method of claim 8, wherein The at least one device is inserted into the containing groove, the first device pad faces the second conductive part, and the second device pad faces the fourth conductive part, and then the device is welded, so that the first device pad is connected with one end of the second conductive part away from the first conductive part, and the second device pad is connected with one end of the fourth conductive part away from the third conductive part. The multiple devices are arranged side by side in the containing groove, and the first device pad of each device faces the second conductive part, and the second device pad of each device faces the fourth conductive part. ​ Soldering each of the devices, so that the devices are sequentially electrically connected through the first device pad and the second device pad on each device, and the first device pad of the device closest to the second conductive part is connected to one end of the second conductive part away from the first conductive part, and the second device pad of the device closest to the fourth conductive part is connected to one end of the fourth conductive part away from the second conductive part.

10. The method of claim 6 or 7, wherein Before the step of peeling the carrier plate from the first conductive layer, the method further comprises: A second plastic encapsulation layer is made on the side of the first plastic encapsulation layer away from the second sub-pads, and the second plastic encapsulation layer covers the first plastic encapsulation layer and the at least one device; A reinforcing sheet is arranged on the side of the second plastic encapsulation layer away from the first plastic encapsulation layer, or the reinforcing sheet is inserted into the second plastic encapsulation layer.

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