A forming platform for a light-cured 3D printing device and a method of manufacturing the same

Abstract

The application discloses a forming platform for a light-curing 3D printing device and a preparation method thereof, and relates to the technical field of 3D printing. The quick-release locking structure on the forming platform is detachably connected with the platform mounting structure on the 3D printing device, so that the quick-release locking structure can be detachably mounted on the platform mounting structure, and the dismounting and mounting are more convenient. The surface of the forming surface of the platform body is treated, the adhesion between the forming surface of the forming platform and the printed part is improved, the occurrence of the falling plate phenomenon is significantly reduced, and the printing success rate is improved.

Description

Technical Field

[0001] This invention relates to the field of 3D printing technology, and more specifically, to a molding platform for photopolymer 3D printing equipment and its preparation method. Background Technology

[0002] Common DLP printers typically use metal forming platforms, such as stainless steel or aluminum alloy. After printing, the forming platform is removed, the printed parts are scraped off, and both the forming platform and the printer are cleaned with alcohol / isopropyl alcohol. The advantage of using a metal forming platform is that it can be reused. The disadvantages are that cleaning takes time and requires organic solvents such as alcohol / isopropyl alcohol, resulting in waste solvents that need to be disposed of properly.

[0003] To address the cleaning issues associated with metal forming platforms, injection molding platforms were developed. These platforms can be reused or are disposable and polishable; however, problems still exist during the printing process.

[0004] (1) Both metal forming platforms and injection molding platforms have the problem of complicated installation and operation. For example, most equipment uses a knob-type locking structure. This locking method requires turning the knob many times to lock the forming platform, which is complicated to operate. Moreover, due to the limitations of the material, injection molding platforms are not suitable for complex locking structures such as knobs.

[0005] (2) The adhesion between the molding surface of the injection molding platform and the printed part is poor, and the board is prone to falling off during the printing process. Many injection molding materials such as ABS, PP, PC, PVA, and PET cannot overcome the problem of board falling off well.

[0006] In view of this, the present invention is proposed. Summary of the Invention

[0007] The purpose of this invention is to provide a molding platform for photopolymer 3D printing equipment and its preparation method, which can quickly complete the positioning and locking of the molding platform, improve the working efficiency of the 3D printer; at the same time, it can also significantly improve the adhesion between the molding surface of the 3D printing molding platform and the printed part, significantly reduce the occurrence of board drop, and improve the printing success rate.

[0008] This invention is implemented as follows:

[0009] In a first aspect, the present invention provides a molding platform for a photopolymerization 3D printing device, the 3D printing device including a platform mounting structure, the molding platform comprising:

[0010] The quick-release locking structure allows for detachable connection with the platform mounting structure.

[0011] The platform body is connected to a quick-release locking structure, allowing it to be detachably mounted on a platform mounting structure via the quick-release locking structure. The platform body is made of plastic and has a surface-treated molding surface for adhering 3D printed parts that have been cured by exposure to light-curing materials.

[0012] In optional embodiments of the present invention, the surface treatment includes at least one of spraying, sandblasting, grinding, engraving, electroplating, coating, printing, texturing, polishing, painting, oiling, ion plating, and laser treatment.

[0013] In an optional embodiment of the present invention, the surface treatment is spraying, and the raw materials used for spraying include, by weight parts: 100 parts of UV-curable resin, 80-150 parts of diluent and 0.05-2 parts of initiator.

[0014] The photocurable resin is selected from at least one of acrylates, allyl ethers and vinyl ethers, and the number average molecular weight of the photocurable resin is 4000-10W.

[0015] In an optional embodiment, the product comprises, by weight, 100 parts of photocurable resin, 100-130 parts of diluent, and 0.2-0.5 parts of initiator.

[0016] In an optional embodiment of the present invention, the photocurable resin includes 50-90 parts of a first resin and 10-50 parts of a second resin, wherein the number average molecular weight of the first resin is 4000-20000 and the number average molecular weight of the second resin is 4W-10W.

[0017] The first resin is selected from at least one of RA3080, RA3081, RA3083, RA3091, 6071, 6175-3 and SD7508;

[0018] The second resin is selected from at least one of SD1000 and SWA20.

[0019] In an optional embodiment of the present invention, the diluent is selected from water and organic solvents.

[0020] In an optional embodiment of the present invention, the diluent is an organic solvent selected from at least one of ethyl acetate, butyl acetate, and propylene glycol methyl ether acetate.

[0021] In an optional embodiment, the organic solvent is a mixed solvent formed from ethyl acetate, butyl acetate, and propylene glycol methyl ether acetate.

[0022] In an optional embodiment of the present invention, the initiator is selected from at least one of TPO, 819 and TPO-L.

[0023] In an optional embodiment of the present invention, 0.05-1 part of an auxiliary agent is also included; the auxiliary agent is selected from at least one of CAB 551-0.01, CAB551-0.2, CAB 381-0.1 and CAB 381-0.5.

[0024] In an optional embodiment, the additive is 0.1-0.2 parts.

[0025] In an optional embodiment of the present invention, the surface treatment is sandblasting, and the roughness Ra of the shaped surface after sandblasting is 0.1μm-5μm.

[0026] In an optional embodiment of the present invention, the abrasive used for sandblasting is a hard abrasive with sharp edges, and the abrasive is at least one of white corundum, brown corundum, glass sand and steel sand.

[0027] In an optional embodiment of the present invention, the molding platform has a back side opposite to the molding surface, and the molding platform further includes a plurality of through holes penetrating the molding surface and the back side, wherein the diameter of the through holes gradually increases from the molding surface to the back side.

[0028] In an optional embodiment of the present invention, multiple through holes on the forming platform are arranged in an alternating manner.

[0029] In an optional embodiment of the present invention, the quick-release locking structure is any one of a sliding locking structure, a magnetic locking structure, a plug-in locking structure, or an elastic locking structure.

[0030] Secondly, the present invention also provides a method for preparing a molding platform in any of the above embodiments, comprising:

[0031] Provide a substrate for the molding platform; the substrate is made of plastic.

[0032] The substrate is surface-treated to obtain a molding platform with a surface-treated molding surface, wherein the molding surface is used to adhere a 3D printed part formed by exposure and curing of a photocurable material.

[0033] In optional embodiments of the present invention, the surface treatment includes at least one of spraying, sandblasting, grinding, engraving, electroplating, coating, printing, texturing, polishing, painting, oiling, ion plating, and laser treatment.

[0034] In an optional embodiment of the present invention, the step of surface treatment of the substrate includes: spraying the substrate, wherein the raw materials used for spraying, by mass parts, include: 100 parts of photocurable resin, 80-150 parts of diluent and 0.05-2 parts of initiator.

[0035] The photocurable resin is selected from at least one of acrylates, allyl ethers and vinyl ethers, and the number average molecular weight of the photocurable resin is 4000-10W.

[0036] In an optional embodiment of the present invention, the raw materials used for spraying, by weight, include: 100 parts of UV-curable resin, 100-130 parts of diluent, and 0.2-0.5 parts of initiator.

[0037] In an optional embodiment of the present invention, the photocurable resin includes 50-90 parts of a first resin and 10-50 parts of a second resin, wherein the number average molecular weight of the first resin is 4000-20000 and the number average molecular weight of the second resin is 4W-10W.

[0038] The first resin is selected from at least one of RA3080, RA3081, RA3083, RA3091, 6071, 6175-3 and SD7508;

[0039] The second resin is selected from at least one of SD1000 and SWA20.

[0040] In an optional embodiment of the present invention, the diluent is selected from water and organic solvents.

[0041] In an optional embodiment of the present invention, the diluent is an organic solvent selected from at least one of ethyl acetate, butyl acetate, and propylene glycol methyl ether acetate.

[0042] In an optional embodiment of the present invention, the organic solvent is a mixed solvent formed by ethyl acetate, butyl acetate and propylene glycol methyl ether acetate.

[0043] In an optional embodiment of the present invention, the initiator is selected from at least one of TPO, 819 and TPO-L.

[0044] In an optional embodiment of the present invention, 0.05-1 part of an auxiliary agent is also included; the auxiliary agent is selected from at least one of CAB 551-0.01, CAB551-0.2, CAB 381-0.1 and CAB 381-0.5.

[0045] In an optional embodiment of the present invention, the molding platform after spraying is dried, and the thickness of the dry film after drying is controlled to be 20μm-30μm.

[0046] In an optional embodiment of the present invention, the diluent is water, the drying temperature is controlled at 60℃-80℃, and the drying time is 10min-15min.

[0047] In an optional embodiment of the present invention, the diluent is an organic solvent, the drying temperature is controlled at 50°C-60°C, and the drying time is 3-5 minutes.

[0048] In an optional embodiment of the present invention, the step of surface treatment of the substrate includes: sandblasting the substrate and controlling the roughness Ra of the forming surface of the forming platform to be 0.1μm-5μm.

[0049] In an optional embodiment of the present invention, the abrasive used for sandblasting is a hard abrasive with sharp edges, and the abrasive is selected from at least one of white corundum, brown corundum, glass sand and steel sand.

[0050] In an optional embodiment of the present invention, the material of the substrate is selected from at least one of ABS, PC, PP, POM, PA, PS, PMMA, PBT, AS, PET, PVC, PEEK, PPSU, SAN, PE, TPE, PTFE, PES, and PVA.

[0051] In an optional embodiment of the present invention, the substrate is made of modified ABS material, the raw materials of which include 70-80 wt% ABS resin, 5-20 wt% PMMA resin, 5-10 wt% reinforcing fiber and 1-5 wt% coupling agent.

[0052] In an optional embodiment of the present invention, the raw materials for the modified ABS material include 73-78 wt% ABS resin, 10-15 wt% PMMA resin, 6-9 wt% reinforcing fiber, and 2-4 wt% coupling agent.

[0053] In an optional embodiment of the present invention, the reinforcing fiber is selected from at least one of glass fiber, ceramic fiber, silica fiber and boron fiber.

[0054] In an optional embodiment of the present invention, the coupling agent is selected from at least one of silane monomers, styrene monomers, and titanate monomers;

[0055] The silane monomers are selected from at least one of vinyltrimethoxysilane, vinyltriethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, and γ-(methacryloyloxy)propyltrimethoxysilane.

[0056] The present invention has the following advantages: the quick-release locking structure on the molding platform is detachably connected to the platform mounting structure on the 3D printing equipment, so that it can be detachably installed on the platform mounting structure through the quick-release locking structure, making disassembly and installation more convenient; by performing surface treatment on the molding surface of the platform body, the adhesion between the molding surface of the molding platform and the printed part is improved, significantly reducing the occurrence of board drop and improving the printing success rate. Attached Figure Description

[0057] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0058] Figure 1 A schematic diagram illustrating the application of coatings on a 3D printing platform according to an embodiment of the present invention;

[0059] Figure 2 A schematic diagram of the structure of the 3D printing molding platform is provided for embodiments of the present invention;

[0060] Figure 3 for Figure 2 A schematic diagram of the forming surface of the 3D printing molding platform;

[0061] Figure 4 for Figure 2 A schematic diagram of the structure on the back of the 3D printing molding platform;

[0062] Figure 5 for Figure 4 A cross-sectional view along HH of the 3D printing molding platform;

[0063] Figure 6 This is a schematic diagram of the structure of the 3D printer in an embodiment of the present invention;

[0064] Figure 7 This is a schematic diagram of the first platform installation structure in an embodiment of the present invention;

[0065] Figure 8 This is a schematic diagram of the second platform installation structure in an embodiment of the present invention;

[0066] Figure 9 This is a cross-sectional view of the platform installation structure in an embodiment of the present invention;

[0067] Figure 10 This is a first-view structural schematic diagram of the molding platform in an embodiment of the present invention;

[0068] Figure 11 This is a schematic diagram of the molding platform from a second perspective in an embodiment of the present invention;

[0069] Figure 12 This is a schematic diagram of the structure of the first limiting member in an embodiment of the present invention;

[0070] Figure 13 This is a schematic diagram of the structure of the second type of limiting member in an embodiment of the present invention;

[0071] Figure 14This is a schematic diagram of the structure of the third type of limiting member in an embodiment of the present invention.

[0072] Icons: 10-Paint; 110-Forming platform; 310-Optical mechanism; 001-Forming surface; 002-Back side; 003-Through hole; 004-Reinforcing rib; 200-3D printer; 210-Lifting mechanism; 220-Material tray; 230-Light source; 100-Platform mounting structure; 101-Platform body; 102-Limiting part; 120-Connecting seat; 130-Limiting component; 140-Connecting component; 111-First sliding connection part; 121-Second sliding connection part; 112-First positioning part; 122-Second positioning part; 131-Limiting block; 113-Limiting groove; 132-Elastic component; 134-First magnetic component; 135-Second magnetic component; 136-Third magnetic component. Detailed Implementation

[0073] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall apply. Reagents or instruments whose manufacturers are not specified are all conventional products that can be purchased commercially.

[0074] This invention provides a method for preparing a molding platform for a photopolymerization 3D printing device, comprising the following steps:

[0075] S1, Substrate providing the molding platform

[0076] The substrate is made of plastic and is obtained through injection molding. The appropriate molding die is selected according to the required shape of the substrate.

[0077] In some embodiments, the substrate material is selected from at least one of ABS, PC, PP, POM, PA, PS, PMMA, PBT, AS, PET, PVC, PEEK, PPSU, SAN, PE, TPE, PTFE, PES, and PVA, and can be formed from any one or more of the above materials.

[0078] In some embodiments, the substrate is made of modified ABS material, the raw materials of which include 70-80 wt% ABS resin, 5-20 wt% PMMA resin, 5-10 wt% reinforcing fiber, and 1-5 wt% coupling agent. The modified ABS material provided in the embodiments of the present invention is easy to mold, and the resulting substrate has superior overall performance.

[0079] Specifically, in the raw materials of modified ABS materials, the proportion of ABS resin can be 70wt%, 73wt%, 75wt%, 78wt%, 80wt%, etc.; the proportion of PMMA resin can be 5wt%, 10wt%, 15wt%, 20wt%; the proportion of reinforcing fiber can be 5wt%, 6wt%, 8wt%, 9wt%, 10wt%, etc.; and the proportion of coupling agent can be 1wt%, 2wt%, 3wt%, 4wt%, 5wt%, etc.

[0080] The inventors further optimized the material composition of the substrate. The modified ABS material comprises 73-78 wt% ABS resin, 10-15 wt% PMMA resin, 6-9 wt% reinforcing fiber, and 2-4 wt% coupling agent. Further optimization of the dosage of each component helps to improve the overall performance of the substrate.

[0081] In modified ABS materials, the reinforcing fibers are selected from at least one of glass fibers, ceramic fibers, silica fibers, and boron fibers, and can be any one or a mixture of the above.

[0082] In modified ABS materials, the coupling agent is selected from at least one of silane monomers, styrene monomers, and titanate monomers, and can be any one or more of the above three types of monomers. Among them, the silane monomer is selected from at least one of vinyltrimethoxysilane, vinyltriethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, and γ-(methacryloyloxy)propyltrimethoxysilane, all of which are suitable as coupling agents, and can be any one of them or a mixture of several of them.

[0083] S2, Surface Treatment

[0084] The substrate is surface-treated to obtain a molding platform with a surface-treated molding surface, which is used to adhere the 3D printed part formed by exposure and curing of a photocurable material. By surface-treating the molding surface, the adhesion between the molding surface of the molding platform and the printed part is improved, significantly reducing the occurrence of board detachment.

[0085] The surface treatment method is not limited. In some embodiments, the surface treatment includes at least one of spraying, sandblasting, grinding, engraving, electroplating, coating, printing, texturing, polishing, painting, oiling, ion plating, and laser treatment. The surface treatment method can be any one or a combination of the above methods.

[0086] In an optional embodiment of the present invention, the step of surface treatment of the substrate includes: spraying the substrate with a coating, wherein the raw materials used for spraying, by mass parts, include: 100 parts of photocurable resin, 80-150 parts of diluent and 0.05-2 parts of initiator; wherein the photocurable resin is selected from at least one of acrylates, allyl ethers and vinyl ethers, and the number average molecular weight of the photocurable resin is 4000-10W.

[0087] Specifically, the structural formulas of acrylates are as follows:

[0088]

[0089] The structural formulas of allyl ethers are as follows:

[0090]

[0091] Vinyl ethers have the following structural formulas:

[0092]

[0093] By utilizing the double bonds in acrylate, allyl ether, and vinyl ether resins to react with the photocurable resin that forms the printed part during photocuring, and by controlling the molecular weight of the photocurable resin, the coating can be made easy to surface dry, and can be used in 3D printing molding platforms.

[0094] Specifically, when the amount of photocurable resin is 100 parts, the amount of diluent can be 80 parts, 90 parts, 100 parts, 110 parts, 120 parts, 130 parts, 140 parts, 150 parts, etc.; the amount of initiator can be 0.05 parts, 0.1 parts, 0.2 parts, 0.5 parts, 0.8 parts, 1.0 parts, 1.2 parts, 1.5 parts, 1.8 parts, 2.0 parts, etc.

[0095] In a preferred embodiment, the coating for the 3D printing platform comprises, by weight, 100 parts of UV-curable resin, 100-130 parts of thinner, and 0.2-0.5 parts of initiator. By optimizing the amount of each component in the coating, the surface drying rate is further improved, thereby enhancing the adhesion of the coating to the printed parts.

[0096] In some embodiments, the photocurable resin includes 50-90 parts of a first resin and 10-50 parts of a second resin. The number average molecular weight of the first resin is 4,000-20,000, and the number average molecular weight of the second resin is 4W-10W. By combining macromolecular and small molecule resins, leveling can be effectively controlled, preventing stringing problems during spraying.

[0097] Furthermore, the first resin is selected from at least one of RA3081, RA3083, RA3091, 6071, 6175-3 and SD7508, and may be one or more of them; the second resin is selected from at least one of SD1000 and SWA20, and may be one or more of them. All of the above resins are commercially available materials, and the raw materials are readily available.

[0098] In some embodiments, the diluent is selected from water and organic solvents, and may be a mixture of one or more solvents. Using water as a solvent is more environmentally friendly, but it results in higher drying temperatures and greater energy consumption. Therefore, organic solvents are preferable, such as at least one of ethyl acetate, butyl acetate, and propylene glycol methyl ether acetate. Considering solvent toxicity, solvents with lower toxicity and easier surface drying are preferable, such as a mixture of ethyl acetate, butyl acetate, and propylene glycol methyl ether acetate.

[0099] In some embodiments, the initiator is selected from at least one of TPO, 819 and TPO-L, and the initiator can be a commonly used photocurable initiator, not limited to the above.

[0100] In some embodiments, the additive further includes 0.05-1 part of an auxiliary agent, such as 0.05 part, 0.1 part, 0.2 part, 0.3 part, 0.4 part, 0.5 part, 0.6 part, 0.7 part, 0.8 part, 0.9 part, 1.0 part, etc., preferably 0.1-0.2 parts. Adding the auxiliary agent can further improve the surface drying rate. The type of auxiliary agent may be, but is not limited to, at least one of CAB 551-0.01, CAB 551-0.2, CAB 381-0.1, and CAB 381-0.5 (all of the above auxiliary agents are cellulose acetate butyrate), and may be one or more.

[0101] Furthermore, the inventors optimized the mixing sequence by first mixing the diluent, initiator, and additives evenly, then mixing them evenly with the photocurable resin, and finally filtering. In actual operation, the process can be divided into the following steps: (1) First, add the diluent to a suitable mixing vessel, turn on the stirring, and set the speed to 500-1000 rpm. Then, add the initiator and additives in sequence and stir for 15-30 minutes until the mixture is clear and transparent; (2) Add the resin and stir at a speed of 800-1500 rpm for 15-30 minutes until the mixture is clear and transparent; (3) Stop stirring, filter with a 400-mesh filter cloth, and package the mixture.

[0102] Please refer to Figure 1 The prepared coating 10 is applied to the molding platform 110. The application method is not limited and can be spraying. The coating provided in this embodiment of the invention is suitable for injection molding materials such as ABS and can effectively improve the adhesion of the printed parts during the 3D printing process.

[0103] The printing platform substrate coated with paint is dried, and after the workpiece is cooled, it reaches a surface-dry state. The dry film thickness is controlled to be 20μm-30μm, such as 20μm, 25μm, 30μm, etc.

[0104] The drying conditions vary depending on the type of diluent:

[0105] When the diluent is water, the drying temperature should be controlled at 60℃-80℃, and the drying time at 10-15 minutes. Water-based coatings require a higher drying temperature to allow the water to evaporate quickly. As the temperature increases, the energy consumption for drying is greater, but it must not reach the softening temperature of ABS, otherwise the material will be damaged. Lower temperatures result in lower energy consumption, but require a longer drying time. Suitable drying temperatures for water-based coatings include 60℃, 70℃, and 80℃; suitable drying times include 10 minutes, 11 minutes, 12 minutes, 13 minutes, 14 minutes, and 15 minutes.

[0106] When the thinner is an organic solvent, control the drying temperature at 50℃-60℃ and the drying time at 3-5 minutes. For oil-based paints, the drying temperature can be lower and the drying time shorter; under these conditions, the organic solvent can evaporate quickly to achieve surface dryness.

[0107] It should be noted that the coating can be packaged and transported to the customer after it has reached surface dryness.

[0108] In other embodiments, the step of surface treatment of the substrate includes: sandblasting the substrate to control the roughness Ra of the forming surface of the forming platform to be 0.1μm-5μm, such as 0.1μm, 1.0μm, 2.0μm, 3.0μm, 4.0μm, 5.0μm, etc.

[0109] In some embodiments, the abrasive used for sandblasting is a hard abrasive with sharp edges, and the abrasive is selected from at least one of white corundum, brown corundum, glass sand and steel sand, and can be any one or more of the above.

[0110] This invention also provides a molding platform for a photopolymerization 3D printing device, which can be prepared by the above-described preparation method.

[0111] In some embodiments, the 3D printing molding platform prepared has a special coating on the molding surface, which can cross-link and cure with the acrylate double bonds in the printing resin during use, so that the original coating on the molding surface and the initial cured layer of the printed part are integrated, resulting in better adhesion and less likelihood of board falling off.

[0112] Please refer to Figures 1-5The molding platform 110 has a molding surface 001 and a back surface 002 opposite to the molding surface 001. The through hole 003 penetrates the molding surface 001 and the back surface 002. The opening facilitates air permeation during the molding process. At the same time, after the resin is cured and molded, the part passing through the hole can form a hanging force, thereby improving the adhesion.

[0113] In some embodiments, the inventors optimized the shape of the through-hole 003, with the diameter of the through-hole 003 gradually increasing from the forming surface 001 to the back surface 002, and multiple through-holes 003 being staggered. The 3D printing platform's aperture is designed so that the forming surface is small and the back surface is large, i.e., an inverted frustum shape, to increase the hanging force, improve the adhesion between the printed part and the 3D printing platform, thereby reducing board drop and increasing the printing success rate.

[0114] In some embodiments, the back of the molding platform 110 may also be provided with reinforcing ribs 004 to increase the support strength.

[0115] This invention provides a 3D printing device, which includes the above-described 3D printing molding platform, and may further include, for example, the following: Figure 1 The optical engine 310, material tray 220 and other structures shown in the figure are used to hold resin in the material tray 220 to form a complete 3D printing device.

[0116] It should be noted that during 3D printing using the molding platform 110, ultraviolet light is used for photocuring, thereby firmly bonding the 3D printing molding platform 110 to the resin. Figure 1 As shown.

[0117] Specifically, the acrylate can be a (meth)acrylate, with the following structural formula:

[0118]

[0119] The double bonds in the modified coating can cross-link and cure with the (meth)acrylate double bonds in the printing resin (the reaction principle is as follows), so that the original coating and the initial cured layer of the printed part are integrated, resulting in better adhesion and less likelihood of board falling off.

[0120]

[0121] In some embodiments, the molding platform provided by the present invention further includes: a quick-release locking structure and a platform body (also referred to as a substrate). The platform body is made of plastic and has a molding surface obtained through surface treatment. The molding surface is used to adhere the 3D printed part formed by exposure and curing of a photocurable material. The platform body is connected to the quick-release locking structure, and the quick-release locking structure is detachably connected to the platform mounting structure. The quick-release locking structure allows for detachable installation on the platform mounting structure, making disassembly and installation more convenient.

[0122] In some embodiments, the quick-release locking structure is any one of the following: sliding locking structure, magnetic locking structure, plug-in locking structure, and elastic locking structure. It can be any of the above structures and is not limited here.

[0123] the following Figures 6-14 This is merely an example of a quick-release locking structure on a molding platform; the specific structure of the quick-release locking structure in this invention is not limited to... Figure 6-14 The following is about Figures 6-14 The structure of the 3D printer provided in the document will be explained in detail:

[0124] Please refer to Figure 6 Figure 11 , Figure 6 The structure of the 3D printer in an embodiment of the present invention is shown in Figure 7- Figure 9 The structure of the platform installation structure in an embodiment of the present invention is shown. Figure 10 and Figure 11 The structure of the molding platform in an embodiment of the present invention is shown;

[0125] This embodiment provides a 3D printer 200, which includes a lifting mechanism 210, a material tray 220, a light source 230, and a platform mounting structure 100;

[0126] The platform mounting structure 100 includes a connecting seat 120, a limiting member 130, a connecting member 140, and a molding platform 110; the molding platform 110 includes a platform body 101, a first sliding connecting part 111, and a limiting part 102; the first sliding connecting part 111 is connected to the platform body 101, and the limiting part 102 is disposed on the first sliding connecting part 111; the first sliding connecting part 111 is used to slidably connect with the connecting seat 120 (the sliding direction of the molding platform 110 is as follows). Figure 10 (As shown by the arrow in the image), the limiting part 102 is used to cooperate with the connecting seat 120 when the platform body 101 slides relative to the connecting seat 120 to a preset position, so as to limit the sliding of the molding platform 110 relative to the connecting seat 120.

[0127] The connecting seat 120 is provided with a second sliding connecting part 121, and the first sliding connecting part 111 is used to slide and cooperate with the second sliding connecting part 121; the second sliding connecting part 121 is a slider or a groove; the limiting member 130 is connected to the connecting seat 120, and the limiting member 130 is used to cooperate with the limiting part 102 and limit the sliding of the forming platform 110 relative to the connecting seat 120 when the forming platform 110 slides to a preset position relative to the connecting seat 120; the connecting member 140 is connected to the connecting seat 120, and the connecting member 140 is used to connect to the lifting mechanism 210.

[0128] The connector 140 is connected to the lifting mechanism 210, which is used to drive the molding platform 110 connected to the connecting seat 120 to move relative to the material tray 220; the light source 230 is used to project light toward the material tray 220 so that the photocurable material located between the molding platform 110 and the material tray 220 is cured and formed.

[0129] Since the platform mounting structure 100 adopts a slidable connection between the molding platform 110 and the connecting seat 120, the position of the molding platform 110 relative to the connecting seat 120 can be easily adjusted, thereby simplifying the assembly and disassembly steps of the molding platform 110 relative to the connecting seat 120, and thus simplifying the operation of installing the molding platform 110 on the 3D printer 200.

[0130] Further, please refer to Figures 6-11 In this embodiment, when setting the molding platform 110 and the connecting seat 120, in order to make the connection between the molding platform 110 and the connecting seat 120 a sliding connection, the molding platform 110 is provided with a first sliding connection part 111, and the connecting seat 120 is provided with a second sliding connection part 121. The first sliding connection part 111 is used to slide and engage with the second sliding connection part 121. There are various structures for achieving the sliding engagement between the first sliding connection part 111 and the second sliding connection part 121, and this embodiment uses a structure in which one of the first sliding connection part 111 and the second sliding connection part 121 is a groove, and the other is a slider. It should be noted that when setting the first sliding connection part 111 and the second sliding connection part 121, in order to achieve the sliding connection between the molding platform 110 and the connecting seat 120, there are various ways to set the first sliding connection part 111 and the second sliding connection part 121, such as... Figure 7 and Figure 8 As shown.

[0131] Further, please refer to Figures 6-12 , Figure 12 The structure of the elastic member in an embodiment of the present invention is shown. In this embodiment, when the limiting member 130 is connected to the connecting seat 120, the limiting member 130 may include a limiting block 131 movably connected to the connecting seat 120; the limiting part 102 is a limiting groove 113; the limiting block 131 is used to cooperate with the limiting groove 113 when the molding platform 110 slides relative to the connecting seat 120 to a preset position. That is, by adjusting the position of the limiting block 131 relative to the connecting seat 120, the limiting block 131 can cooperate with the limiting groove 113 when the molding platform 110 slides relative to the connecting seat 120 to the preset position, and disengage from the limiting groove 113 when the molding platform 110 slides out of the preset position relative to the connecting seat 120.

[0132] In order to maintain the engagement between the limiting block 131 and the limiting groove 113 and improve the stability of the platform installation structure 100, the limiting member 130 also includes an elastic member 132 connected to the connecting seat 120. The elastic member 132 is connected to the limiting block 131 and is used to make the limiting block 131 tend to move toward the molding platform 110, so that the engagement between the limiting block 131 and the limiting groove 113 can be maintained in this way.

[0133] It should be noted that when the molding platform 110 slides to the preset position, the limiting block 131 engages with the limiting groove 113. To prevent the limiting block 131 and the limiting groove 113 from jamming at this time, a second arc-shaped transition surface is provided at both ends of the limiting block 131 and the limiting groove 113 along the sliding direction of the molding platform 110 relative to the connecting seat 120. That is, the molding platform 110 can overcome the locking force between the limiting block 131 and the limiting groove 113 and the locking force between the first positioning part 112 and the second positioning part 122 under the action of the user's external force, and slide relative to the connecting seat 120 to remove it.

[0134] Please refer to Figures 6-14 , Figure 14 The structure of the elastic element in other embodiments of the present invention is shown. In other embodiments of the present invention, when the limiting member 130 is connected to the connecting seat 120, the limiting member 130 may include a first magnetic member 134, and the limiting part 102 may include a second magnetic member 135 and a third magnetic member 136; wherein, the first magnetic member 134 is connected to the connecting seat 120; along the sliding direction of the molding platform 110 relative to the connecting seat 120, the second magnetic member 135 and the third magnetic member 136 are sequentially connected to the molding platform 110; when the molding platform 110 slides relative to the connecting seat 120 to a position spaced apart from a preset position, the first magnetic member 134 and the second magnetic member 135 repel each other; when the molding platform 110 slides relative to the connecting seat 120 to the preset position, the first magnetic member 134 and the third magnetic member 136 attract each other. The purpose of this configuration is to limit the sliding of the molding platform 110 relative to the connecting seat 120 by using the magnetic force of the first magnetic component 134 and the third magnetic component 136. When the molding platform 110 slides out of the preset position, the magnetic force between the first magnetic component 134 and the second magnetic component 135 can be used to alert the user that the molding platform 110 has not reached the preset position. It should be noted that the first magnetic component 134 can be a permanent magnet or an electromagnet. When it is an electromagnet, a sensor (or limit switch) can be further installed on the connecting seat 120 to detect the position information of the molding platform 110. Thus, when the molding platform 110 reaches the preset position, the electromagnet is energized to facilitate the automatic control of the 3D printer 200.

[0135] The features and performance of the present invention will be further described in detail below with reference to embodiments.

[0136] Example 1

[0137] This embodiment provides a method for preparing a molding platform for a photopolymerization 3D printing device, including the following steps:

[0138] (1) Coating preparation

[0139] Add 120 kg of diluent (ethyl acetate: butyl acetate: propylene glycol methyl ether acetate = 4:4:2) to a suitable stirred tank, start stirring at 800 rpm, add 0.2 kg of initiator TPO and 0.2 kg of auxiliary agent CAB 381-0.1 in sequence, and stir for 20 minutes until clear and transparent; then add 90 kg of resin SD7508 and 10 kg of resin SWA20, stir at 1000 rpm for 20 minutes until clear and transparent; stop stirring, filter with 400 mesh filter cloth, and package.

[0140] (2) Surface treatment

[0141] Taking the coating for ABS resin injection molding as an example, the coating is applied to the molding surface of the ABS printing molding platform, and the dry film thickness after drying is controlled to be 25μm to obtain the ABS 3D printing molding platform.

[0142] Example 2

[0143] The only difference from Example 1 is in step (1) coating preparation, as follows:

[0144] Add 120 kg of diluent (ethyl acetate: butyl acetate: propylene glycol methyl ether acetate = 5:3:2) to a suitable stirred tank, start stirring at 800 rpm, add 0.2 kg of initiator TPO and 0.2 kg of auxiliary agent CAB 381-0.1 in sequence, and stir for 20 minutes until clear and transparent; then add 80 kg of resin SD7508 and 20 kg of resin SD1000, stir at 1000 rpm for 20 minutes until clear and transparent; stop stirring, filter with 400 mesh filter cloth, and package.

[0145] Example 3

[0146] The only difference from Example 1 is in step (1) coating preparation, as follows:

[0147] Add 120 kg of diluent (ethyl acetate: butyl acetate: propylene glycol methyl ether acetate = 2:6:2) to a suitable stirred tank, start stirring at 800 rpm, add 0.3 kg of initiator TPO and 0.2 kg of auxiliary agent CAB551-0.01 in sequence, and stir for 20 minutes until clear and transparent; then add 70 kg of resin SD7508 and 30 kg of resin SWA20, stir at 1000 rpm for 20 minutes until clear and transparent; stop stirring, filter with 400 mesh filter cloth, and package.

[0148] Example 4

[0149] The only difference from Example 1 is in step (1) coating preparation, as follows:

[0150] Add 120 kg of diluent (ethyl acetate: butyl acetate: propylene glycol methyl ether acetate = 4:5:1) to a suitable stirred tank, start stirring at 800 rpm, add 0.4 kg of initiator TPO and 0.1 kg of auxiliary agent CAB551-0.2 in sequence, and stir for 20 minutes until clear and transparent; then add 60 kg of resin 6175-3 and 40 kg of resin SWA20, stir at 1000 rpm for 20 minutes until clear and transparent; stop stirring, filter with 400 mesh filter cloth, and package.

[0151] Example 5

[0152] The only difference from Example 1 is in step (1) coating preparation, as follows:

[0153] Add 120 kg of diluent (ethyl acetate: butyl acetate: propylene glycol methyl ether acetate = 3:5:2) to a suitable stirred tank, start stirring at 800 rpm, add 0.5 kg of initiator TPO and 0.1 kg of auxiliary agent CAB381-0.5 in sequence, and stir for 20 minutes until clear and transparent; then add 50 kg of resin RA3081 and 50 kg of resin SD1000, stir at 1000 rpm for 20 minutes until clear and transparent; stop stirring, filter with 400 mesh filter cloth, and package.

[0154] Example 6

[0155] The only difference from Example 1 is in step (1) coating preparation, as follows:

[0156] Add 120 kg of diluent (ethyl acetate: butyl acetate: propylene glycol methyl ether acetate = 3:5:2) to a suitable stirred tank, start stirring at 800 rpm, add 0.5 kg of initiator TPO and 0.1 kg of auxiliary agent CAB381-0.5 in sequence, and stir for 20 minutes until clear and transparent; then add 40 kg of resin RA3081 and 60 kg of resin SD1000, stir at 1000 rpm for 20 minutes until clear and transparent; stop stirring, filter with 400 mesh filter cloth, and package.

[0157] Example 7

[0158] The only difference from Example 1 is in step (1) coating preparation, as follows:

[0159] Add 120 kg of diluent (ethyl acetate: butyl acetate: propylene glycol methyl ether acetate = 3:5:2) to a suitable stirred tank, start stirring at 800 rpm, add 0.5 kg of initiator TPO and 0.1 kg of auxiliary agent CAB381-0.5 in sequence, and stir for 20 minutes until clear and transparent; then add 95 kg of resin RA3081 and 5 kg of resin SD1000, stir at 1000 rpm for 20 minutes until clear and transparent; stop stirring, filter with 400 mesh filter cloth, and package.

[0160] Experimental Example 1

[0161] The ABS 3D printing platforms obtained in Example 1 and the comparative example were used for 3D printing. The results of the group and performance tests of the coatings in the examples and the comparative example are shown in Table 1.

[0162] Table 1. Composition and performance test results of the coatings in Examples 1-5

[0163]

[0164] Test methods: (1) Surface drying: After coating, dry at 60℃ for 5 minutes and test by hand touch. (2) Adhesion: Similar to GB / T 9286-1998. (3) Pull-out force: Similar to GB / T5210-1985. (4) Pull-out force after 60℃×30Day: Similar to GB / T5210-1985.

[0165] As can be seen from Table 1, the coating provided in the embodiments of the present invention can significantly improve the adhesion of the 3D printing platform to the printed parts during the working process. Adding too much resin with a large molecular weight will reduce the double bond density of the coating system and affect the pull-out force.

[0166] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A molding platform for a photopolymer 3D printing device, characterized in that, The 3D printing equipment includes a platform mounting structure, wherein the molding platform includes: The quick-release locking structure is detachably connected to the platform mounting structure. The platform body is connected to the quick-release locking structure so as to be detachably mounted on the platform mounting structure via the quick-release locking structure; the platform body is made of plastic and has a molded surface obtained by surface treatment, the molded surface being used to adhere the 3D printed part formed by the exposure and curing of printing resin; The surface treatment is spraying, and the raw materials used in the spraying, by weight, include: 100 parts of UV-curable resin, 80-150 parts of diluent and 0.05-2 parts of initiator; The photocurable resin is selected from at least one of acrylates, allyl ethers and vinyl ethers, and the number average molecular weight of the photocurable resin is 4000-10W. The photocurable resin comprises 70-90 parts of a first resin and 10-30 parts of a second resin. The number average molecular weight of the first resin is 4000-20000, and the number average molecular weight of the second resin is 4W-10W. The first resin is selected from at least one of RA3080, RA3081, RA3083, RA3091, 6071, 6175-3, and SD7508. The second resin is selected from at least one of SD1000 and SWA20. The initiator is selected from at least one of TPO, 819, and TPO-L. The double bonds of the raw materials undergo cross-linking and curing reactions with the double bonds of the printing resin, so that the raw materials are integrated with the initial cured layer of the 3D printed part.

2. The molding platform according to claim 1, characterized in that, The diluent is selected from water and organic solvents.

3. The molding platform according to claim 2, characterized in that, The diluent is an organic solvent selected from at least one of ethyl acetate, butyl acetate, and propylene glycol methyl ether acetate.

4. The molding platform according to claim 1, characterized in that, It also includes 0.05-1 part of an auxiliary agent; the auxiliary agent is selected from at least one of CAB 551-0.01, CAB 551-0.2, CAB 381-0.1 and CAB 381-0.

5.

5. The molding platform according to any one of claims 1 to 4, characterized in that, The molding platform has a back side opposite to the molding surface, and the molding platform further includes a plurality of through holes penetrating the molding surface and the back side, wherein the diameter of the through holes gradually increases from the molding surface to the back side.

6. The molding platform according to claim 5, characterized in that, The plurality of through holes on the forming platform are arranged in an alternating manner.

7. The molding platform according to claim 1, characterized in that, The quick-release locking structure is any one of the following: sliding locking structure, magnetic locking structure, plug-in locking structure, and elastic locking structure.

8. A method for preparing a molding platform according to any one of claims 1-7, characterized in that, include: A substrate for providing a molding platform is provided, wherein the substrate is made of plastic. The substrate is surface treated to obtain a molding platform having a surface-treated molding surface, wherein the molding surface is used to adhere a 3D printed part formed by exposure and curing of printing resin; The surface treatment step of the substrate includes: spraying the substrate with a coating, wherein the raw materials used for spraying, by weight, include: 100 parts of a photocurable resin, 80-150 parts of a diluent, and 0.05-2 parts of an initiator; wherein the photocurable resin is selected from at least one of acrylates, allyl ethers, and vinyl ethers, and the number average molecular weight of the photocurable resin is 4000-10W; The photocurable resin comprises 70-90 parts of a first resin and 10-30 parts of a second resin. The number average molecular weight of the first resin is 4000-20000, and the number average molecular weight of the second resin is 4W-10W. The first resin is selected from at least one of RA3080, RA3081, RA3083, RA3091, 6071, 6175-3, and SD7508. The second resin is selected from at least one of SD1000 and SWA20. The initiator is selected from at least one of TPO, 819, and TPO-L. The double bonds of the raw materials undergo cross-linking and curing reactions with the double bonds of the printing resin, so that the raw materials are integrated with the initial cured layer of the 3D printed part.

9. The preparation method according to claim 8, characterized in that, The raw materials used in the spraying process, by weight, include: 100 parts of UV-curable resin, 100-130 parts of diluent, and 0.2-0.5 parts of initiator.

10. The preparation method according to claim 8, characterized in that, The diluent is selected from water and organic solvents.

11. The preparation method according to claim 10, characterized in that, The diluent is an organic solvent, which is selected from at least one of ethyl acetate, butyl acetate, and propylene glycol methyl ether acetate.

12. The preparation method according to claim 11, characterized in that, The organic solvent is a mixed solvent formed by ethyl acetate, butyl acetate and propylene glycol methyl ether acetate.

13. The preparation method according to claim 8, characterized in that, It also includes 0.05-1 part of an auxiliary agent; the auxiliary agent is selected from at least one of CAB 551-0.01, CAB 551-0.2, CAB 381-0.1 and CAB 381-0.

5.

14. The preparation method according to claim 8, characterized in that, The molding platform after spraying is dried, and the thickness of the dry film after drying is controlled to be 20μm-30μm.

15. The preparation method according to claim 14, characterized in that, The diluent is water, and the drying temperature is controlled at 60℃-80℃, with a drying time of 10min-15min.

16. The preparation method according to claim 14, characterized in that, The diluent is an organic solvent, and the drying temperature is controlled at 50℃-60℃, with a drying time of 3min-5min.

17. The preparation method according to claim 8, characterized in that, The material of the substrate is selected from at least one of ABS, PC, PP, POM, PA, PS, PMMA, PBT, AS, PET, PVC, PEEK, PPSU, SAN, PE, TPE, PTFE, PES, and PVA.

18. The preparation method according to claim 8, characterized in that, The substrate is made of modified ABS material, and the raw materials of the modified ABS material include 70-80 wt% ABS resin, 5-20 wt% PMMA resin, 5-10 wt% reinforcing fiber and 1-5 wt% coupling agent.

19. The preparation method according to claim 18, characterized in that, The reinforcing fiber is selected from at least one of glass fiber, ceramic fiber, silica fiber and boron fiber.

20. The preparation method according to claim 18, characterized in that, The coupling agent is selected from at least one of silane monomers, styrene monomers, and titanate monomers; The silane monomer is selected from at least one of vinyltrimethoxysilane, vinyltriethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, and γ-(methacryloyloxy)propyltrimethoxysilane.

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