A 5G communication motherboard with quick disassembly and assembly function

Abstract

The present invention relates to the field of communication motherboards, and specifically discloses a 5G communication motherboard with a quick disassembly and assembly function, comprising: a base; a motherboard accommodating assembly, wherein the motherboard accommodating assembly is connected to the base; a plurality of point positioning devices; a positioning cover assembly, wherein the positioning cover assembly is rotatably connected to the motherboard accommodating assembly; an auxiliary assembly; wherein the auxiliary assembly comprises: an air blast heat dissipation device, wherein the air blast heat dissipation device is connected to the motherboard accommodating assembly; a boost positioning device, wherein the boost positioning device is connected to the air blast heat dissipation device. The motherboard of this device is movably arranged, and the internal point positioning device cooperates with the positioning cover assembly to realize multi-point limiting fixation of motherboards of different specifications, which is convenient for disassembly and assembly and subsequent maintenance, and the air blast heat dissipation device can provide fixing stability of the positioning cover assembly while performing heat dissipation purge of the motherboard, and has high practicality and market prospects.

Description

Technical Field

[0001] The present invention relates to the communication motherboard industry, and in particular to a 5G communication motherboard with a quick disassembly and assembly function. Background Art

[0002] Mobile communications continue the development law of one generation of technology every ten years and have gone through the development of 1G, 2G, 3G, and 4G. With the rapid development of mobile Internet, new services and new businesses continue to emerge, and mobile data business traffic has exploded. The 4G mobile communication system is difficult to meet the demand for the surge in mobile data traffic in the future, and 5G communication technology has come into being.

[0003] 5G communication technology uses corresponding equipment as a carrier, and the carrier needs to be adapted to the communication motherboard. When existing communication motherboards are installed, most of them are integrated embedded designs with mounting components and the motherboard. During subsequent maintenance, disassembly and assembly are inconvenient and easy to damage adjacent components. Therefore, in order to solve this problem, it is urgent to develop a 5G communication motherboard with quick disassembly and assembly function. Summary of the invention

[0004] The purpose of the present invention is to provide a 5G communication motherboard with a quick disassembly and assembly function to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A 5G communication mainboard with quick disassembly and assembly function, comprising:

[0007] Base;

[0008] A mainboard accommodating component, the mainboard accommodating component is connected to the base and is used for accommodating and limiting the mainboard;

[0009] A plurality of point positioning devices, which are connected to the mainboard accommodating assembly and are used for point positioning and fixing of the mainboard;

[0010] A positioning cover assembly, the positioning cover assembly is rotatably connected to the mainboard accommodating assembly;

[0011] An auxiliary component, the auxiliary component is connected to the mainboard accommodating component;

[0012] Wherein, the auxiliary components include:

[0013] An air blast heat dissipation device, which is connected to the mainboard accommodating assembly and is used to cooperate with the positioning cover assembly to complete the heat dissipation drive of the mainboard;

[0014] The boost positioning device is connected to the air blast heat dissipation device and is used to cooperate with the air blast heat dissipation device to complete the connection and positioning of the positioning cover plate assembly.

[0015] Compared with the prior art, the beneficial effects of the present invention are: the device is reasonably designed, the main board is movably arranged, and the internal point positioning device cooperates with the positioning cover assembly to realize multi-point limit fixation of main boards of different specifications. It is easy to disassemble and assemble, and convenient for subsequent maintenance. The air blast heat dissipation device can provide the fixing stability of the positioning cover assembly while performing heat dissipation and purge of the main board, and has high practicality and market prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the side internal structure of a 5G communication mainboard with a quick disassembly and assembly function in an embodiment of the present invention.

[0017] Figure 2 This is a schematic diagram of the side external structure of a 5G communication mainboard with a quick disassembly and assembly function in an embodiment of the present invention.

[0018] Figure 3 This is a top view of a 5G communication mainboard with quick disassembly and assembly function in an embodiment of the present invention.

[0019] Figure 4 for Figure 1 Schematic diagram of the local structure at A in the middle.

[0020] Figure 5 It is a side view of a cover frame in a 5G communication mainboard with a quick disassembly and assembly function in an embodiment of the present invention.

[0021] Figure 6 This is a schematic diagram of the structure of a limit frame in a 5G communication mainboard with a quick disassembly and assembly function in an embodiment of the present invention.

[0022] In the figure: 1-base, 2-mainboard accommodating assembly, 3-point positioning device, 4-positioning cover assembly, 5-auxiliary assembly, 6-air blasting and heat dissipation device, 7-boost positioning device, 201-accommodating compartment, 202-slideway, 203-first elastic member, 204-second elastic member, 205-bottom frame, 206-conducting groove, 207-through groove, 208-mainboard, 209-side plate frame, 301-connecting shaft frame, 302-telescopic frame , 303-fixed frame warehouse, 304-third elastic member, 305-transmission frame, 306-positioning frame, 401-cover frame, 402-air inlet groove, 403-air collecting bin, 404-exhaust groove, 405-fixed shaft frame, 406-grid, 407-oblique groove, 408-positioning groove, 601-fixed frame, 602-blowing member, 603-connecting pipe, 701-boosting bin, 702-limiting frame, 703-fourth limiting frame. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] A 5G communication motherboard with a quick disassembly and assembly function, in one embodiment of the present invention, as Figures 1 to 3 As shown, it includes: a base 1; a mainboard accommodating component 2, which is connected to the base 1 and is used for accommodating and limiting the mainboard; a plurality of point positioning devices 3, which are connected to the mainboard accommodating component 2 and are used for point positioning and fixing of the mainboard; a positioning cover assembly 4, which is rotatably connected to the mainboard accommodating component 2; an auxiliary component 5, which is connected to the mainboard accommodating component 2; wherein, the auxiliary component 5 includes: an air blast heat dissipation device 6, which is connected to the mainboard accommodating component 2 and is used to cooperate with the positioning cover assembly 4 to complete the heat dissipation drive of the mainboard; a boost positioning device 7, which is connected to the air blast heat dissipation device 6 and is used to cooperate with the positioning cover assembly 4 to complete the connection and positioning of the positioning cover assembly 4.

[0025] In one embodiment of the present invention:

[0026] like Figures 1 to 3 As shown, the motherboard accommodating assembly 2 includes: a accommodating bin 201, the accommodating bin 201 is fixedly connected to the base 1; at least two slide grooves 202, the slide grooves 202 are arranged inside the accommodating bin 201; a first elastic member 203, the first elastic member 203 is connected to the inside of the accommodating bin 201; the first elastic member 203 is a spring; a plurality of second elastic members 204, the second elastic member 204 is fixedly connected to the inside of the accommodating bin 201; the second elastic member 204 is an elastic telescopic frame; a bottom frame 205, the bottom frame 205 is fixedly connected to a plurality of second elastic members 204, passes through the accommodating bin 201 and is fixedly connected to the first elastic members 203 on both sides; at least two side plate frames 209, the side plate frames 209 are fixedly connected to the base 1; at least two conducting grooves 206, the conducting grooves 206 are arranged inside the side plate frames 209, and are connected to the blast heat dissipation device 6; a through groove 207, the through groove 207 is arranged inside the outer side of the accommodating bin 201;

[0027] Before the mainboard is installed, the two positioning cover assemblies 4 are in a vertically open state, and the base 1 is installed together with other components at the set installation position of the equipment (not shown in the figure). The adapted mainboard 208 is placed on the base frame 205 through the through slot 207, and then the positioning position is determined according to the actual shape of the mainboard, and several point positioning devices 3 are rotated and adjusted to the positioning point, and then the positioning cover assemblies 4 on both sides are rotated in opposite directions to cover several point positioning devices 3 to complete the multi-point positioning of the mainboard.

[0028] In one embodiment of the present invention:

[0029] like Figure 3 and Figure 4 As shown, the point positioning device 3 includes: a plurality of connecting shaft frames 301, the connecting shaft frames 301 are connected to the inside of the accommodating bin 201; a telescopic frame 302, the telescopic frame 302 is rotatably connected to the connecting shaft frame 301; a fixed frame bin 303, the fixed frame bin 303 is fixedly connected to one end of the telescopic frame 302 away from the connecting shaft frame 301; a third elastic member 304, the third elastic member 304 is connected to the inside of the fixed frame bin 303; the third elastic member 304 is a spring; a positioning frame 306, the positioning frame 306 passes through the fixed frame bin 303 and is fixedly connected to the third elastic member 304; a transmission frame 305, the transmission frame 305 passes through the fixed frame bin 303 and the third elastic member 304 and is fixedly connected to the positioning frame 306;

[0030] According to the positioning position, with the connecting shaft frame 301 as the axis, several telescopic frames 302 are rotated, and then the telescopic frames 302 are stretched, and the positioning frame 306 and the transmission frame 305 are aligned with several positioning fixed points, and then the positioning cover plate assemblies 4 on both sides are rotated in opposite directions to close, and the fixed pressing of several point positioning devices 3 is completed. When the cover plate frames 401 on both sides are in a horizontal position, the air inlet groove 402 inside the cover plate frame 401 is connected with the conduction groove 206.

[0031] In one embodiment of the present invention:

[0032] like Figures 1 to 5 As shown, the positioning cover plate assembly 4 includes: at least two groups of fixed axis frames 405, the fixed axis frames 405 are connected to the side plate frames 209; at least two cover plate frames 401, the cover plate frames 401 are connected to the fixed axis frames 405 on both sides; a grid 406, the grid 406 is fixedly connected to the middle of the cover plate frame 401; at least two air inlet grooves 402, the air inlet grooves 402 are arranged inside the cover plate frame 401; an air collecting bin 403, the air collecting bin 403 is fixedly installed inside the cover plate frame 401, and is connected to the air inlet grooves 402 on both sides; a plurality of exhaust grooves 404, the plurality of exhaust grooves 404 penetrate the cover plate frame 401 and are connected to the air collecting bin 403; a positioning groove 408, the positioning groove 408 is arranged inside the outer side of the cover plate frame 401;

[0033] The interior of the cover frame 401 is hollow. When several point positioning devices 3 are rotated to the positioning point, the cover frames 401 on both sides are rotated with the fixed axis frame 405 as the axis. The middle grid of the cover frame 401 abuts against several transmission frames 305, and cooperates with the third elastic member 304 to drive several positioning frames 306 to move downward, thereby realizing the pressing positioning of the mainboard positioning point.

[0034] In one embodiment of the present invention:

[0035] like Figure 5 As shown, the positioning cover plate assembly 4 further includes: an inclined groove 407, and the inclined groove 407 is arranged on the inner side of the bottom of the cover plate frame 401;

[0036] When the redundant point positioning device 3 is not needed to fix the main board 208 , the telescopic frame 302 can be rotated to rotate the transmission frame 305 and the positioning frame 306 into the inclined slot 407 to store the transmission frame 305 and the positioning frame 306 .

[0037] In one embodiment of the present invention:

[0038] like Figure 3 As shown, the air-blowing heat dissipation device 6 comprises: a fixing frame 601, the fixing frame 601 is fixedly connected to the side plate frame 209; a blasting member 602, the blasting member 602 is connected to the fixing frame 601; the blasting member 602 is a blower; a connecting pipe 603, one end of the connecting pipe 603 is connected to the blasting member 602, and the other end is connected to the conducting groove 206;

[0039] When the main board 208 is fixed, the blowing parts 602 on both sides are in operation, and part of the gas enters the connecting pipes 603 on both sides, and then passes through the conducting groove 206 and the air inlet groove 402, enters the air collecting bin 403, and then is directed out through a number of exhaust grooves 404 on both sides, thereby achieving the lifting, blowing and heat dissipation of the main board 208 fixed in the middle, and the hot gas is discharged through the grid 406, further improving the operating stability of the main board 208.

[0040] In one embodiment of the present invention:

[0041] like Figure 3 and Figure 6 As shown, the boost positioning device 7 includes: a boost chamber 701, the boost chamber 701 is connected to the blowing member 602; a fourth elastic member 703, the fourth elastic member 703 is fixedly connected to the inside of the boost chamber 701; the fourth elastic member 702 is a spring; a limit frame 702, the limit frame 702 is fixedly connected to the fourth elastic member 703;

[0042] When the positioning cover plate assemblies 4 on both sides are in a horizontal state and the blowing member 602 is in operation, part of the gas can be blown into the interior of the boosting chamber 701, so that the air pressure inside the boosting chamber 701 increases, driving the limit frame 703 to move outward, and the limit frame 703 is inserted into the positioning grooves 408 on both sides to complete the limiting connection and fixation of the cover plate frames 401 on both sides.

[0043] The working principle of the present invention is as follows: before the mainboard is installed, the two positioning cover plate assemblies 4 are in a vertically open state, the base 1 is installed together with other components at the set installation position of the equipment (not shown in the figure), and the adapted mainboard 208 is placed on the bottom frame 205 through the through slot 207, and then the positioning position is determined according to the actual shape of the mainboard, and a plurality of point positioning devices 3 are rotated and adjusted to the positioning point, and then the positioning cover plate assemblies 4 on both sides are rotated in opposite directions to cover a plurality of point positioning devices 3, so as to complete the multi-point positioning of the mainboard, and according to the positioning position, a plurality of telescopic frames 302 are rotated with the connecting shaft frame 301 as the axis, and then the telescopic frames 302 are stretched, and the positioning frame 306 is aligned with the transmission frame 305 at a plurality of positioning fixed points, and then the positioning cover plate assemblies 4 on both sides are rotated in opposite directions to close, so as to complete the multi-point positioning of the mainboard, and then the positioning cover plate assemblies 4 on both sides are rotated in opposite directions to close, so as to complete the multi-point positioning of the mainboard, and then the positioning cover plate assemblies 4 on both sides are rotated in opposite directions to cover the plurality of point positioning devices 3 ... Several pairwise positioning devices 3 are fixedly pressed. When the cover plate frames 401 on both sides are in a horizontal position, the air inlet groove 402 inside the cover plate frame 401 is connected with the conducting groove 206. The cover plate frame 401 is hollow inside. When several pairwise positioning devices 3 are rotated to the positioning point, the cover plate frames 401 on both sides are rotated with the fixed axis frame 405 as the axis. The middle grid of the cover plate frame 401 abuts against several transmission frames 305, and cooperates with the third elastic member 304 to drive several positioning frames 306 to move downward, so as to realize the pressing and positioning of the mainboard positioning point. When the redundant pairwise positioning devices 3 do not need to fix the mainboard 208, the telescopic frame 302 can be rotated to rotate the transmission frame 305 and the positioning frame 306 to the inside of the inclined groove 407, so as to store the transmission frame 305 and the positioning frame 306.

[0044] When the main board 208 is fixed, the blowing members 602 on both sides are in operation, and part of the gas enters the connecting pipes 603 on both sides, and then passes through the conducting groove 206 and the air inlet groove 402, enters the gas collecting bin 403, and then is directed out through a number of exhaust grooves 404 on both sides, so as to realize the lifting, blowing and heat dissipation of the main board 208 fixed in the middle, and the hot gas is discharged through the grid 406, so as to further improve the operation stability of the main board 208. When the positioning cover plate assemblies 4 on both sides are in a horizontal state and the blowing members 602 are in operation, part of the gas can be blown into the inside of the boosting bin 701, so that the air pressure inside the boosting bin 701 increases, driving the limit frame 703 to move outward, and the limit frame 703 is inserted into the positioning grooves 408 on both sides to complete the limit connection and fixation of the cover plate frames 401 on both sides.

[0045] In summary, the mainboard 208 of the device is movable, and the internal point positioning device 3 cooperates with the positioning cover assembly 4 to realize multi-point limit fixation of mainboards of different specifications. It is easy to disassemble and assemble, and convenient for subsequent maintenance. The air-blowing heat dissipation device 6 can provide the fixing stability of the positioning cover assembly 4 while performing heat dissipation and purging of the mainboard 208.

[0046] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A 5G communication motherboard with quick disassembly and assembly function, characterized in that: include: Base; A mainboard accommodating component, the mainboard accommodating component is connected to the base and is used for accommodating and limiting the mainboard; A plurality of point positioning devices, which are connected to the mainboard accommodating assembly and are used for point positioning and fixing of the mainboard; A positioning cover assembly, the positioning cover assembly is rotatably connected to the mainboard accommodating assembly; An auxiliary component, the auxiliary component is connected to the mainboard accommodating component; Wherein, the auxiliary components include: An air blast heat dissipation device, which is connected to the mainboard accommodating assembly and is used to cooperate with the positioning cover assembly to complete the heat dissipation drive of the mainboard; A boost positioning device, which is connected to the air blast heat dissipation device and is used to cooperate with the air blast heat dissipation device to complete the connection and positioning of the positioning cover plate assembly; The mainboard accommodating component comprises: A accommodating bin, the accommodating bin is fixedly connected to the base; At least two slide grooves, wherein the slide grooves are arranged inside the storage bin; A first elastic member, wherein the first elastic member is connected to the interior of the accommodating compartment; A plurality of second elastic members, wherein the second elastic members are fixedly connected to the interior of the accommodating compartment; A bottom frame, the bottom frame is fixedly connected to the plurality of second elastic members, passes through the accommodating compartment and is fixedly connected to the first elastic members twice; At least two side frame frames, wherein the side frame frames are fixedly connected to the base; At least two conducting grooves, which are arranged inside the side plate frame and are connected to the air blast heat dissipation device; A through groove, the through groove being arranged inside the outer side of the accommodating bin; The point positioning device comprises: A plurality of connecting shaft frames, wherein the connecting shaft frames are connected to the interior of the accommodating bin; A telescopic frame, the telescopic frame is rotatably connected to the connecting shaft frame; A fixed frame bin, the fixed frame bin is fixedly connected to an end of the telescopic frame away from the connecting shaft frame; A third elastic member, the third elastic member is connected to the interior of the fixed frame compartment; A positioning frame, the positioning frame passes through the fixing frame compartment and is fixedly connected to the third elastic member; A transmission frame, wherein the transmission frame passes through the fixed frame compartment and the third elastic member and is fixedly connected to the positioning frame; The positioning cover plate assembly comprises: At least two sets of fixed shaft frames, the fixed shaft frames are connected to the side plate frames; At least two cover frames, the cover frames are connected to the fixed shaft frames on both sides; A grid frame, wherein the grid frame is fixedly connected to the middle portion of the cover frame; At least two air inlet slots, the air inlet slots being arranged inside the cover frame; An air collecting bin is fixedly installed inside the cover frame and is connected to the air inlet grooves on both sides; A plurality of exhaust slots, wherein the plurality of exhaust slots penetrate the cover frame and are connected with the gas collecting bin; A positioning groove is arranged inside the outer side of the cover frame.

2. The 5G communication motherboard with quick disassembly and assembly function according to claim 1, characterized in that: The positioning cover assembly also includes: The inclined groove is arranged on the inner side of the bottom of the cover frame.

3. The 5G communication motherboard with quick disassembly and assembly function according to claim 1, characterized in that: The air blast heat dissipation device comprises: A fixing frame, the fixing frame is fixedly connected to the side panel frame; A blasting member connected to the fixing frame; A connecting pipe, one end of which is connected to the blowing member, and the other end of which is connected to the conducting groove.

4. The 5G communication motherboard with quick disassembly and assembly function according to claim 3, characterized in that: The boost positioning device comprises: A pressurizing chamber, wherein the pressurizing chamber is connected to the blowing member; a fourth elastic member, wherein the fourth elastic member is fixedly connected to the inside of the pressurizing chamber; A limiting frame, wherein the limiting frame is fixedly connected to the fourth elastic member.

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