Apparatus for manufacturing semiconductor device and method for manufacturing semiconductor device

Abstract

Disclosed is a manufacturing apparatus for semiconductor devices and a manufacturing method for semiconductor devices, which can further improve the quality of semiconductor devices. The manufacturing apparatus for semiconductor devices includes: a plurality of processing heads arranged apart from each other for performing prescribed processing on different positions of a common lead frame, and each having a camera; and a controller that controls the driving of the plurality of processing heads, and positions the plurality of processing heads at positions that at least offset optical shifts. The controller acquires optical inspection images corresponding to the plurality of processing heads by capturing a paste of one island portion with the cameras before the positioning, and calculates the amount of difference in the relative positional relationship between the island portion and the paste in the optical inspection images between the processing heads as the optical shifts.

Description

Technical Field

[0001] This specification discloses a semiconductor device manufacturing apparatus and a method for manufacturing a semiconductor device, comprising multiple processing heads that perform prescribed processing on different locations of a common substrate. Background Technology

[0002] Generally, semiconductor manufacturing apparatus includes a processing head that performs prescribed processes on a substrate, such as applying paste or bonding chips. When performing these prescribed processes, it is required to accurately position the processing head relative to the substrate. To achieve this positioning, techniques are known in the past that involve equipping the processing head with a camera that captures images of the substrate, and determining the position of the processing head relative to the substrate based on the images obtained by the camera (e.g., Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent No. 4029855 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] Furthermore, in recent years, to shorten lead time, manufacturing apparatuses have been proposed that allow multiple processing heads to perform specified processes in parallel on a single substrate. According to this manufacturing apparatus, the processing time for a single substrate can be significantly reduced compared to a single-head configuration. In this multi-head structure, each processing head has a positioning camera, and positioning is performed based on images obtained from the cameras.

[0008] Here, in a camera, the image obtained is distorted due to individual differences in lenses or imaging elements, or the tilt of the camera's optical axis. Therefore, even when shooting the same area from the same position, the resulting images will differ depending on the camera. Furthermore, this image distortion, which varies for each camera, causes positioning deviations between processing heads. Consequently, the arrangement of processed objects (paste or chips, etc.) mounted on a substrate becomes uneven, leading to a deterioration in the quality of the semiconductor device.

[0009] Therefore, this specification discloses a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method that can further improve the quality of semiconductor devices.

[0010] Technical means to solve the problem

[0011] The semiconductor device manufacturing apparatus disclosed in this specification is characterized by comprising: a plurality of processing heads, spaced apart from each other for performing prescribed processing on different locations of a common substrate, and each of the plurality of processing heads having a camera for photographing the substrate; and a controller for controlling the driving of the plurality of processing heads and the transport of the substrate, wherein the controller positions the plurality of processing heads relative to the substrate at positions that at least offset optical offset, and prior to the positioning, the controller first uses the camera of each of the plurality of processing heads to photograph an optical inspection portion including a reference object and an object disposed separately from the reference object to obtain optical inspection images corresponding to the plurality of processing heads respectively, and calculates the difference in the relative positional relationship between the reference object and the object in the optical inspection image between the processing heads as the optical offset.

[0012] Alternatively, the prescribed process may include placing the object on the substrate, the reference being the shape features of the substrate surface, and the controller, before acquiring the optical inspection image, first causing one of the plurality of processing heads to perform the prescribed process on a portion of the substrate, using the portion of the substrate on which the object has been placed through the prescribed process as the optical inspection portion, and then using the cameras of each of the plurality of processing heads to take pictures.

[0013] Furthermore, the controller may position the plurality of processing heads at positions that counteract the optical and mechanical offsets during the positioning process. Before positioning, the controller may first cause the plurality of processing heads to perform the prescribed processing on the corresponding areas of the substrate, and use the cameras of each of the plurality of processing heads to capture the corresponding areas of the substrate to obtain mechanical inspection images corresponding to the plurality of processing heads. Based on the relative positional relationship between the reference object and the object mapped in the mechanical inspection image, the mechanical offset is calculated for each of the plurality of processing heads.

[0014] Furthermore, the specified process may be a process of applying paste to the substrate as the object.

[0015] The method for manufacturing a semiconductor device disclosed in this specification is characterized by including the following steps: acquiring optical offsets corresponding to a plurality of processing heads spaced apart from each other for performing predetermined processing on different locations of a common substrate; positioning the plurality of processing heads relative to the substrate at positions that at least offset the optical offsets, and performing the predetermined processing on corresponding locations of the substrate by the plurality of processing heads, wherein the acquisition step includes the following steps: using a camera provided in each of the plurality of processing heads to capture an optical inspection area including a reference object and an object spaced apart from the reference object to acquire optical inspection images corresponding to the plurality of processing heads; and calculating the difference in the relative positional relationship between the reference object and the object in the optical inspection image between the processing heads as the optical offset.

[0016] The effects of the invention

[0017] According to the technique disclosed in this specification, optical offset is obtained, and the processing head is positioned to counteract the optical offset, thereby reducing the positional deviation of the object being processed within the substrate. As a result, the quality of the semiconductor device can be further improved. Attached Figure Description

[0018] Figure 1 It is a diagram showing the structure of the manufacturing apparatus.

[0019] Figure 2 This is a schematic side view of the manufacturing equipment.

[0020] Figure 3 It is an image showing the appearance of the lead frame after the paste coating process is completed.

[0021] Figure 4 This is a diagram showing an example of an image captured by a camera.

[0022] Figure 5A This is an example of a photo showing a checkered pattern.

[0023] Figure 5B This is another example of photographing a checkered pattern.

[0024] Figure 6 This is a diagram illustrating an example of the coating result obtained when applying paste without correcting for optical offset.

[0025] Figure 7 It is a diagram representing the calculation process of optical offset.

[0026] Figure 8 It is a diagram representing the calculation process of optical offset.

[0027] Figure 9A It is a mapping of the first optical examination image.

[0028] Figure 9B It is a mapping of the first optical examination image.

[0029] Figure 10 This is a flowchart illustrating the calculation process for the position correction value.

[0030] [Explanation of Symbols]

[0031] 10: Manufacturing equipment

[0032] 12: Platform

[0033] 14f: First processing head

[0034] 14s: Second processing head

[0035] 16f: first dispenser

[0036] 16s: Second dispenser

[0037] 18f: First Camera

[0038] 18s: Second camera

[0039] 24: Transport Track

[0040] 26: X Bootloader

[0041] 28: Y-boot component

[0042] 30: Controller

[0043] 32: Processor

[0044] 34: Memory

[0045] 40f: First optical inspection image

[0046] 40s: Second optical inspection image

[0047] 100: Lead Frame

[0048] Af: First Region

[0049] As: Second Region

[0050] Ci: Center point of the island

[0051] Cp: ​​Center point of the paste

[0052] If, Is: Island

[0053] OSm: Mechanical offset

[0054] OSo: Optical offset

[0055] Og: origin

[0056] Pf, Ps: Paste Detailed Implementation

[0057] Hereinafter, the semiconductor device manufacturing apparatus 10 will be described with reference to the accompanying drawings. Figure 1 This is a diagram showing the structure of the manufacturing apparatus 10. Furthermore, Figure 2 This is a schematic side view of the manufacturing apparatus 10. The manufacturing apparatus 10 is used to mount semiconductor chips on a lead frame 100, which serves as a substrate, to manufacture a semiconductor device. More specifically, the manufacturing apparatus 10 is a paste coating apparatus for applying a paste for fixing semiconductor chips onto the lead frame 100.

[0058] The manufacturing apparatus 10 includes: a stage 12 for adsorbing and fixing the lead frame 100, a first processing head 14f and a second processing head 14s, a transport track 24 for transporting the lead frame 100 along the X direction, and a controller 30 for controlling their drive. Here, the first processing head 14f and the second processing head 14s have substantially the same structure. Therefore, in the following description, without distinguishing between the first processing head 14f and the second processing head 14s, the suffixes f and s will be omitted, and they will be simply referred to as "processing head 14". The same applies to the distributor 16 and the camera 18 described later.

[0059] like Figure 1 As shown, the first processing head 14f and the second processing head 14s are spaced apart along the X direction (i.e., the conveying direction of the lead frame 100). Each processing head 14 can move freely along the X and Y directions via the X guide 26 and the Y guide 28. In addition, the first processing head 14f and the second processing head 14s can move independently of each other.

[0060] The processing head 14 includes a dispensing unit 16 and a camera 18. The dispensing unit 16 dispenses a paste P, such as non-conductive paste (NCP), for chip mounting onto the lead frame 100. The dispensing unit 16 can move up and down in the Z direction via a lifting mechanism (not shown). The structure of the dispensing unit 16 is not particularly limited as long as it can dispense a specified amount of paste P as needed. Therefore, the dispensing unit 16 may, for example, include: a syringe for storing paste P, a piston that can move in and out of the syringe, and a motor that moves the piston linearly.

[0061] The camera 18 is arranged spaced apart from the distributor 16 in the X and Y directions, and its relative position in the horizontal direction with respect to the distributor 16 is fixed. Furthermore, the design value (xs, ys) of the offset of the camera 18 relative to the distributor 16 will be referred to below as the "basic offset OSs".

[0062] Camera 18 has a vertically downward optical axis and captures images of the lead frame 100. Specifically, multiple islands, designated in a two-dimensional matrix, are formed on the lead frame 100 for applying paste. Camera 18 captures images of these islands. Camera 18 then sends the captured images of the islands (i.e., the lead frame 100) to controller 30. Controller 30 calculates the relative position of processing head 14 to the lead frame 100 based on the captured images and positions processing head 14 based on the calculation results.

[0063] The controller 30 controls the drive of the platform 12 or the conveyor rail 24 and the processing head 14. Furthermore, the controller 30 calculates a position correction value for adjusting the target position of the processing head 14, which will be described later. Additionally, the controller 30 is a computer physically equipped with a processor 32 and a memory 34.

[0064] Next, refer to Figure 3 This will be used to explain the paste coating process performed using this manufacturing apparatus 10. Figure 3 This is an image showing the appearance of the lead frame 100 after the paste coating process is completed. For example... Figure 3 As shown, the manufacturing apparatus 10 in this example manages a lead frame 100 by dividing it into two parts along the conveying direction. That is, the controller 30 manages the lead frame 100 by dividing it into a first region Af located upstream in the conveying direction and a second region As located downstream in the conveying direction from the first region Af.

[0065] Hereinafter, the island portion located in the first region Af will be referred to as "island portion If", and the island portion located in the second region As will be referred to as "island portion Is". Similarly, the paste applied to island portion If will be referred to as "paste Pf", and the paste applied to island portion Is will be referred to as "paste Ps". Moreover, without distinguishing between regions, the suffixes f and s will be omitted and the terms "region A", "island portion I", and "paste P" will be used interchangeably.

[0066] The first processing head 14f applies paste Pf to the island portion Is of the first region Af in the lead frame 100. Similarly, the second processing head 14s applies paste Ps to the island portion Is of the second region As in the lead frame 100. In this way, processing is performed in parallel using two processing heads 14f and 14s for one lead frame 100, thereby significantly reducing lead time.

[0067] When applying the paste P, the controller 30 uses the camera 18 to capture images of island I and calculates the relative position of the dispensing device 16 to island I based on the acquired images. Furthermore, the controller 30 positions the processing head 14 so that the dispensing device 16 is in the target position. Once positioning is complete, the controller 30 drives the dispensing device 16 to spray a predetermined amount of paste P onto island I. The controller 30 performs this process on all islands I.

[0068] As described above, the processing head 14 must be positioned when applying the paste P. The positioning process of the processing head 14 will be explained. As described above, when positioning the processing head 14, the controller 30 uses the camera 18 to capture images of the lead frame 100 (specifically, the island section I). Figure 4 This diagram shows an example of an image captured using camera 18.

[0069] like Figure 4 As shown, an island I, roughly rectangular in shape, is reflected in the captured image. This island I is used as a reference point to indicate the positioning datum. In this example, the center point of the island I (hereinafter referred to as "island center point Ci") is set as the target location for applying the paste P.

[0070] To position the dispensing unit 16, the controller 30 determines the relative position of the dispensing unit 16 and the island center point Ci based on the captured image. Specifically, the controller 30 calculates the offset (x1, y1) of the island center point Ci relative to the origin Og of the captured image. This offset (x1, y1) represents the offset of the optical axis of the camera 18 relative to the island center point Ci. Furthermore, by adding the offset (x1, y1) to the offset of the dispensing unit 16 relative to the camera 18, i.e., the basic offset OSs = (xs, ys), the theoretical value of the offset of the dispensing unit 16 relative to the island center point Ci can be determined.

[0071] The basic offset OSs is the designed offset of the camera 18 relative to the distributor 16. Therefore, the actual offset of the camera 18 relative to the distributor 16 often differs from the basic offset OSs due to assembly errors or changes over time. Hereinafter, the error between the actual offset and the basic offset OSs will be referred to as the mechanical offset OSm = (xm, ym). Furthermore, due to differences in the optical characteristics of each camera 18, there exists an optical offset OSo (described later) between the first processing head 14f and the second processing head 14s. Therefore, the controller 30 calculates the mechanical offset OSm and the optical offset OSo before positioning the processing head 14. And, when positioning the processing head 14, the position that cancels out these offsets OSm and OSo is set as the target position of the processing head 14.

[0072] Here, the mechanical offset OSm can be determined using previously known methods. For example, after positioning the processing head 14 based on the basic offset OSs and applying the paste P, an image can be taken of the island portion I coated with the paste P, and the offset of the paste P from the center point Ci of the island portion can be calculated based on the image, and the mechanical offset OSm can be calculated based on the offset.

[0073] Next, refer to Figure 5A and Figure 5B Let's explain the optical offset OSo. Even with identical products, the optical characteristics of camera 18 can vary. These differences arise from individual variations in lenses or imaging elements, or variations in the tilt of the optical axis caused during the assembly of camera 18. Because of this optical characteristic deviation, even when photographing the same object from the same position, the content of the image obtained can sometimes differ depending on the camera. For example, consider the case where multiple cameras are used to photograph a specific grid pattern from a specific position. In this case, the following situation exists: in one camera, such as... Figure 5A As shown, the image obtained is a spool-like contraction in the center, whereas in other cameras, such as... Figure 5B As shown, an image with a barrel-shaped bulge in the center is obtained. If this difference in image quality is ignored and positioning is performed based on the captured image, positioning errors will occur between cameras. For example, the coordinates of the intersection point C1 of the grid within the captured image are... Figure 5A In the middle is (x, y), while Figure 5B Let (x+xo, y+yo) be the position deviation (xo, yo) caused by the deviation in the optical characteristics of this type of camera. If this optical deviation OSo is not considered, even if the positions are the same in reality, they will be calculated as different positions, resulting in positioning errors.

[0074] Here, this optical offset OSo is the positional deviation between the cameras 18. Therefore, when there is only one processing head 14, that is, when there is only one positioning camera 18, it will not cause a major problem. On the other hand, when there are multiple processing heads 14 and the multiple processing heads 14 are used to process a lead frame 100, the optical offset OSo will cause positioning deviation, thus causing a major problem.

[0075] Figure 6 This is a diagram showing an example of the coating results obtained without correcting the optical offset OSo in the first camera 18f and the second camera 18s. Figure 6In this process, when applying paste Pf to the first region Af, the first applicator 16f is positioned based on an image captured by the first camera 18f. Therefore, since it is limited to the first region Af, there is no deviation in optical characteristics, and the relative positional relationship of the multiple pastes Pf applied to the first region Af becomes nearly ideal. Similarly, the relative positional relationship of the multiple pastes Ps applied to the second region As also becomes nearly ideal. On the other hand, due to the deviation in optical characteristics between the first camera 18f and the second camera 18s, the relative positional relationship of pastes Pf and pastes Ps produces an error corresponding to the optical offset OSo. For example, although it is required that the multiple pastes be arranged in a straight line along the X direction, Figure 6 In the example, paste Ps deviates from yo relative to paste Pf. Similarly, when multiple pastes are required to be coated along the X direction at a fixed interval L, the X-direction interval between the first region Af and the second region As also deviates from the ideal distance xo, becoming L+xo. As a result, when viewed as a whole in the lead frame 100, the coating position of paste P deviates, leading to a decrease in the quality of the finally manufactured semiconductor device.

[0076] Therefore, in this example, the optical offset OSo is calculated before the actual manufacture of the article begins. The acquisition of the optical offset OSo will be explained below. Figure 7 , Figure 8 This is a diagram illustrating the calculation process for the optical offset OSo. After determining the optical offset OSo, the controller 30... Figure 7 As shown, the first processing head 14f is instructed to apply paste to an island portion If. This island portion If is an optical inspection area captured by both the first camera 18f and the second camera 18s. After the first processing head 14f applies paste Pf to the island portion If, the controller 30 causes the first camera 18f to capture the applied paste Pf. The controller 30 acquires the image obtained through this capture as a first optical inspection image 40f. Figure 9A It is a mapping of the first optical inspection image 40f. Figure 9A In the diagram, the black circle represents the center point Ci of the island, and the × symbol represents the center point Pf of the paste (hereinafter referred to as "paste center point Cp"). For example... Figure 9A As shown in the example, in the first optical inspection image 40f, the first camera 18f obtains an image of the paste center point Cp that is offset from (a, b) relative to the island center point Ci.

[0077] Next, controller 30, as Figure 8As shown, the lead frame 100 is moved along the X direction so that the island portion If, which serves as the optical inspection area, is within the field of view of the second camera 18s. The second camera 18s then captures an image of the optical inspection area, obtaining the resulting image as the second optical inspection image 40s. The second optical inspection image 40s captures the same paste Pf as the first optical inspection image 40f. Figure 9B This is an example diagram showing the second optical inspection image at 40 seconds. Additionally, Figure 9B In the diagram, the dashed × indicates a position (a, b) from the center point Ci of the island, which is the position of the center point Cp of the paste calculated based on the first optical inspection image 40f.

[0078] like Figure 9B As shown, in the second optical inspection image 40s, the paste Pf deviates from the island center point Ci by (c, d). That is, although the same paste Pf is captured, the deviation of the paste center point Cp from the island center point Ci in the image, and even the relative position of the paste Pf with respect to the reference object (the island If in this example), are different. This is caused by the difference in optical characteristics between the first camera 18f and the second camera 18s. Figure 9B In the example, due to differences in optical properties, the second camera 18s deviates from (e, f) compared to the first camera 18f. Furthermore, e = ca and f = bd.

[0079] The controller 30 acquires the difference (e, f) between the paste position obtained by the first camera 18f and the paste position obtained by the second camera 18s as the optical offset OSo = (xo, yo). That is, it sets xo = e and yo = f and stores it in the memory 34. Furthermore, it stores the value (-xo, -yo) that cancels the optical offset OSo as the position correction value of the second processing head 14s in the memory 34. When positioning the second processing head 14s, the target position of the second processing head 14s is added to the value (-xo, -yo) that cancels the optical offset OSo. Thus, in the first processing head 14f and the second processing head 14s, the positioning reference is consistent, and the relative positional relationship of the paste P applied to a lead frame 100 is close to the ideal value.

[0080] Next, refer to Figure 10 This section explains the process of calculating the position correction values ​​CVf and CVs of the first processing head 14f and the second processing head 14s, respectively. Figure 10This is a flowchart illustrating the calculation process of position correction values ​​CVf and CVs. When calculating the position correction values ​​CVf and CVs, firstly, paste Pf is applied to the first region Af using the first processing head 14f, and paste Ps is applied to the second region As using the second processing head 14s (S10). Furthermore, pastes Pf and Ps can be applied to all islands If and Is of the corresponding regions Af and As, or only to a portion of the islands If and Is.

[0081] Next, the first and second mechanical inspection images are acquired (S12). The first mechanical inspection image is obtained by using the first camera 18f to capture the paste Pf of the island section If. Similarly, the second mechanical inspection image is obtained by using the second camera 18s to capture the paste Ps of the island section Is.

[0082] The controller 30 calculates the mechanical offset of the first processing head 14f, i.e., the first mechanical offset OSm_f, based on the obtained first mechanical inspection image. Moreover, the controller 30 calculates the mechanical offset of the second processing head 14s, i.e., the second mechanical offset OSm_s, based on the obtained second mechanical inspection image (S14).

[0083] Next, the controller 30 acquires a first optical inspection image 40f obtained by capturing the paste Pf of the island If using the first camera 18f (S16). The first optical inspection image 40f can be acquired by re-capturing or by acquiring one of the first mechanical inspection images as the first optical inspection image 40f.

[0084] Subsequently, the controller 30 moves the lead frame 100 so that the paste Pf reflected in the first optical inspection image 40f is within the field of view of the second camera 18s (S18). Then, the second camera 18s is used to photograph the paste Pf to obtain the second optical inspection image 40s (S20).

[0085] The controller 30 can acquire the optical offset OSo (S22) as long as it can acquire the first optical inspection image 40f and the second optical inspection image 40s. That is, the difference between the relative positional relationship between the reference object and the paste Pf obtained based on the first optical inspection image 40f and the relative positional relationship between the reference object and the paste Pf obtained based on the second optical inspection image 40s is used as the optical offset OSo.

[0086] Next, the controller 30 calculates the value of the offset obtained by canceling it as the position correction value (S24). That is, the controller 30 calculates the value of canceling the first mechanical offset OSm_f as the first position correction value CVf = -(OSm_f). Moreover, the controller 30 calculates the value of canceling the second mechanical offset OSm_s and the optical offset OSo as the second position correction value CVs = -(OSm_s + OSo). When manufacturing the article, each processing head 14 is positioned to the position obtained by adding the position correction value to the target position.

[0087] As explained above, in this example, multiple cameras 18f and 18s are used to capture images of a common object (paste Pf), and the optical offset OSo is calculated based on the visual differences between the objects in the acquired images. Furthermore, during product manufacturing, the processing head 14s is positioned to compensate for the optical offset OSo, thereby reducing the positional deviation between the processing heads 14 and improving the quality of the final product.

[0088] Furthermore, while the description uses an apparatus for applying paste P as an example of a specified process, the techniques disclosed in this specification are applicable to other apparatuses that utilize multiple heads to process a substrate. For instance, the techniques in this specification are also applicable to bonding apparatuses for bonding chips to substrates. That is, bonding apparatuses that have multiple bonding heads and utilize these multiple bonding heads to bond chips to a common substrate. The techniques in this specification are also applicable to such bonding apparatuses.

[0089] Furthermore, in the description, the island portion I of the lead frame 100 is used as a reference, and the paste Pf applied to the island portion I is used as the object to obtain the relative positional relationship between the two, and even the optical offset OSo. However, as long as two cameras 18f and 18s are used to photograph the same object, the object to be photographed can be anything other than the paste Pf. For example, an inspection station can be pre-set near the stage 12, and a reference object and certain objects can be pre-set at the inspection station as a reference. In this case, the controller 30 uses the inspection station as the optical inspection area and causes the two cameras 18f and 18s to take pictures. Moreover, in the description, two processing heads 14 are provided, but as long as a common substrate is being processed, the number of processing heads 14 can be two or more.

[0090] Furthermore, in the described description, the first camera 18f and the second camera 18s are fixed relative to the conveying direction. After the first camera is used to photograph the island section Is, the lead frame 100 is conveyed and the second camera is used to photograph the same island section. However, it is also possible to move the first camera 18f and the second camera 18s relative to the lead frame 100 while maintaining the offset between them.

Claims

1. A manufacturing apparatus of a semiconductor device, characterized by comprising: including: a plurality of processing heads arranged apart from each other for performing a prescribed process on mutually different positions of a common substrate, and each having a camera for imaging the substrate; and a controller that controls driving of the plurality of processing heads and conveyance of the substrate, and positions the plurality of processing heads at positions that at least cancel optical deviation caused by optical characteristics of cameras between the plurality of processing heads, with respect to the substrate, the controller acquires optical inspection images corresponding to the plurality of processing heads, by imaging an optical inspection site including a reference object and an object arranged apart from the reference object, using the camera of each of the plurality of processing heads, before the positioning, and calculates an amount of difference in relative positional relationship between the reference object and the object in the optical inspection images as the optical deviation.

2. The apparatus according to claim 1, wherein the prescribed process includes a process of placing the object on the substrate, the reference object is a shape feature of a surface of the substrate, the controller causes one of the plurality of processing heads to perform the prescribed process on a portion of the substrate, before the acquisition of the optical inspection images, and the portion of the substrate on which the object is placed by the prescribed process is imaged as the optical inspection site, using the camera of each of the plurality of processing heads.

3. The apparatus according to claim 1 or 2, wherein the controller positions the plurality of processing heads at positions that cancel the optical deviation and mechanical deviation, with respect to the substrate, at the positioning, the controller causes the plurality of processing heads to perform the prescribed process on corresponding regions of the substrate, respectively, before the positioning, acquires mechanical inspection images corresponding to the plurality of processing heads, by imaging the corresponding regions of the substrate, using the camera of each of the plurality of processing heads, and the plurality of processing heads calculate the mechanical deviation based on relative positional relationship between the reference object and the object in the mechanical inspection images, respectively.

4. The apparatus according to claim 1 or 2, wherein the prescribed process is a process of applying paste as the object to a substrate.

5. A method of manufacturing a semiconductor device, characterized by including: acquiring an optical deviation caused by optical characteristics of cameras between each of a plurality of processing heads corresponding to a prescribed process performed on mutually different positions of a common substrate arranged apart from each other; and positioning the plurality of processing heads at positions that at least cancel the optical deviation, with respect to the substrate, and performing the prescribed process on corresponding positions of the substrate by the plurality of processing heads, respectively, the acquiring includes: imaging an optical inspection site including a reference object and an object arranged apart from the reference object, using the camera provided in each of the plurality of processing heads, to acquire optical inspection images corresponding to the plurality of processing heads, respectively; and ​ ​ The difference in the relative positional relationship between the reference object and the target object, which is reflected in the optical inspection image, is calculated as the optical shift.

Images