Focusing and leveling device and photolithography machine

Abstract

The application provides a focusing and leveling device and a photoetching machine, the scanning reflection assembly comprises a driving unit and a mirror unit, the mirror unit has one or at least two circumferentially distributed reflection surfaces, the driving unit drives the mirror unit to rotate to scan and image a projection spot on the surface of a substrate, without overcoming inertia generated by the mass of the mirror unit, the modulation frequency can be improved by increasing the rotation speed, thereby improving the detection signal-to-noise ratio of the focusing and leveling device, reducing the measurement error, and when the mirror unit has at least two reflection surfaces, one rotation of the mirror unit can provide multiple light intensity modulations, thereby further improving the modulation frequency.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of photolithography, and in particular to a focusing and leveling device and a photolithography machine. BACKGROUND

[0002] In the exposure process of a photolithography machine, the thickness deviation, surface fluctuation of a wafer, the inaccuracy and non-repeatability of the focal plane position of a projection objective lens (which projects a bright and clear real image of an object to be illuminated on a screen), and other factors can cause the wafer to be out of focus or tilted relative to the focal plane of the objective lens. If the wafer is out of focus or tilted, some areas in the field of view of the exposure will be outside the effective depth of focus, which will seriously affect the quality and yield of the integrated circuit. Therefore, a focusing and leveling device must be used to measure the height value and tilt amount of the wafer surface relative to the focal plane of the projection objective lens. During the entire exposure process, once the position of the wafer deviates from the optimal focal plane, the position of the wafer is adjusted by a workpiece table so that the wafer is always located on the optimal focal plane of the projection objective lens, thereby ensuring that the image formed on the wafer is clear.

[0003] In a focusing and leveling device using light intensity modulation, a single-sided scanning mirror is usually used for high-speed reciprocating simple harmonic vibration. However, the single-sided scanning mirror needs to overcome the inertia of its own mass to start and brake repeatedly during reciprocating motion, which limits the frequency of the reciprocating motion, such as only reaching 3 kHz to 4 kHz. The modulation frequency of the light intensity modulation is twice the frequency of the reciprocating vibration of the scanning mirror. The limitation of the frequency of the reciprocating motion of the scanning mirror makes it impossible to further improve the modulation frequency of the light intensity modulation. The modulation frequency of the light intensity modulation is related to the signal-to-noise ratio and measurement error of the focusing and leveling device. If the modulation frequency is low, the signal-to-noise ratio is low and the measurement error is large, which greatly affects the performance improvement of the focusing and leveling device using light intensity modulation technology. SUMMARY

[0004] The present application aims to provide a focusing and leveling device and a photolithography machine to solve the problem of the limited scanning frequency of the single-sided scanning mirror, which results in low signal-to-noise ratio and large measurement error of the focusing and leveling device.

[0005] To achieve the above-mentioned purpose, the present application provides a focusing and leveling device, comprising, in sequence along an optical path:

[0006] an illumination assembly for emitting a detection beam;

[0007] a projection slit assembly for transmitting the detection beam and forming a plurality of projection spots;

[0008] The scanning reflection assembly comprises a driving unit and a mirror unit, the mirror unit has one or at least two circumferentially distributed reflecting surfaces, the driving unit drives the mirror unit to rotate in a predetermined direction and projects the projection light spot onto the surface of the substrate, and the projection light spot is reflected by the surface of the substrate to form a detection light spot;

[0009] The detection slit assembly is used for transmitting the detection light spot and forming a mark light spot; and

[0010] The detector assembly is used for detecting the energy of the mark light spot.

[0011] Optionally, when the plurality of projection light spots are incident to the center of the reflecting surface as a whole, the energy of the mark light spot detected by the detector assembly is maximum.

[0012] Optionally, the time between when the plurality of projection light spots are incident to the reflecting surface and when the plurality of projection light spots are completely away from the reflecting surface is a scanning period, and the scanning periods corresponding to each reflecting surface are equal.

[0013] Optionally, the widths of each reflecting surface along the scanning direction are equal, and the driving unit drives the mirror unit to rotate at a uniform speed.

[0014] Optionally, the widths of each reflecting surface along the scanning direction are not equal, and the driving unit drives the mirror unit to rotate at a non-uniform speed.

[0015] Optionally, the mirror unit is a prism, a prism-ta or a prism-pyramid, and at least one side surface of the prism, the prism-ta or the prism-pyramid is the reflecting surface.

[0016] Optionally, the mirror unit has a protrusion distributed circumferentially, and at least one exposed surface of the protrusion is the reflecting surface.

[0017] Optionally, the protrusion is a prism, a prism-ta or a prism-pyramid.

[0018] Optionally, the scanning reflection assembly further comprises:

[0019] The projection imaging assembly is located between the projection slit assembly and the scanning reflection assembly, and is used for relaying and amplifying the projection light spot and then making the projection light spot incident to the substrate; and

[0020] The detection imaging assembly is located between the scanning reflection assembly and the detection slit assembly, and is used for relaying and amplifying the detection light spot and then making the detection light spot incident to the detection slit assembly; and

[0021] The relay imaging assembly is located between the detection slit assembly and the detector assembly, and is used for relaying and amplifying the mark light spot and then making the mark light spot incident to the detector assembly.

[0022] Optionally, further comprising:

[0023] a first reflecting mirror, located between the scanning reflecting assembly and the detecting imaging assembly, for reflecting the detecting light spot into the detecting imaging assembly; and

[0024] a second reflecting mirror, located between the detecting imaging assembly and the detecting slit assembly, for reflecting the detecting light spot relayed and amplified in the detecting imaging assembly into the detecting slit assembly.

[0025] Optionally, the detector assembly outputs an electrical signal representing the energy of the mark light spot, and calculates the defocus amount ΔZ of the substrate by using the following formula:

[0026]

[0027]

[0028]

[0029] wherein θ is the incident angle of the projecting light spot incident to the surface of the substrate; β is the amplification ratio of the detecting light spot from the substrate to the detecting slit assembly; f is the focal length of the reflecting mirror unit to the substrate; A is the amplitude of the electrical signal output by the detector assembly when the projecting light spot just enters one reflecting surface; and B is the amplitude of the electrical signal output by the detector assembly when the projecting light spot completely leaves the reflecting surface.

[0030] The application further provides a photoetching machine comprising the focusing and leveling device.

[0031] In the focusing and leveling device and the photoetching machine provided by the application, the scanning reflecting assembly comprises a driving unit and a reflecting mirror unit having one or at least two circumferentially distributed reflecting surfaces, the driving unit drives the reflecting mirror unit to rotate to scan and image the projecting light spot on the surface of the substrate, without overcoming the inertia generated by the mass of the reflecting mirror unit, the rotating speed is improved to improve the modulation frequency, and thus the detection signal-to-noise ratio of the focusing and leveling device is improved, and the measurement error is reduced, and when the reflecting mirror unit has at least two reflecting surfaces, the reflecting mirror unit rotates one circle to provide multiple light intensity modulations, and thus the modulation frequency is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 a structural schematic view of the focusing and leveling device provided by the first embodiment of the application;

[0033] Figure 2 a structural schematic view of the reflecting mirror unit provided by the first embodiment of the application;

[0034] Figure 3 a diagram showing the relationship between the displacement AL between the projection light spot and the detection light spot and time for the first embodiment of the present application;

[0035] Figure 4 a diagram showing the relationship between the electrical signal outputted by the detector assembly and time in the three scanning periods in the first embodiment of the present application; Figure 3

[0036] Figure 5 a diagram showing the schematic structure of the mirror unit for the second embodiment of the present application;

[0037] Figure 6 a diagram showing the schematic structure of the mirror unit for the third embodiment of the present application;

[0038] Figure 7 a diagram showing the schematic structure of the mirror unit for the fourth embodiment of the present application;

[0039] In the drawings, reference numerals are used:

[0040] 101 - illumination assembly; 102 - projection slit assembly; 103 - projection imaging assembly; 104 - mirror unit; 105 - substrate; 106 - first mirror; 107 - detection imaging assembly; 108 - second mirror; 109 - detection slit assembly; 110 - relay imaging assembly; 120 - detector assembly; 200 - projection objective. DETAILED DESCRIPTION

[0041] The specific embodiments of the present application will be described in more detail below with reference to the accompanying drawings. The advantages and features of the present application will be more apparent from the following description. It should be noted that the drawings are very simplified and are not drawn to scale, and are only used to assist in the description of the embodiments of the present application.

[0042] Embodiment One

[0043] Figure 1 a diagram showing the structure of the focusing and leveling device provided in the present embodiment. As shown in Figure 1 the focusing and leveling device provided in the present embodiment includes, along the optical path, an illumination assembly 101, a projection slit assembly 102, a projection imaging assembly 103, a scanning reflection assembly, a first mirror 106, a detection imaging assembly 107, a second mirror 108, a detection slit assembly 109, a relay imaging assembly 110, and a detector assembly 120.

[0044] Please continue to refer to Figure 1 the illumination assembly 101 can emit a detection beam, which can be an ultraviolet beam, a visible light beam, an infrared light beam, or a wide-band light beam mixed with the above three wave bands. The detection beam can be a parallel light beam through preliminary collimation. ​

[0045] The projection slit assembly 102 has a plurality of parallel first slits, or it can be understood that the projection slit assembly 102 includes an opaque first plate-like structure and the first slits formed on the first plate-like structure. After the detection beam passes through the first slits, it forms a plurality of projection spots, each of the first slits corresponding to one projection spot, and the shape and position distribution of the projection spots correspond to the shape and position distribution of the first slits.

[0046] Optionally, the first slit can be a square, rectangular or other possible shape through hole, and the first plate-like structure can be set perpendicular to the optical path or inclined relative to the optical path. The present invention does not impose any limitations.

[0047] Furthermore, the projection imaging component 103 may include one or more refractive or reflective lenses for relaying and amplifying the projected light spot. Of course, the projection imaging component 103 may also include optical lenses with special adjustment functions, such as wedges, parallel plates, aspherical mirrors, or freeform mirrors, for adjusting the imaging quality of the projection imaging component 103. Optionally, the projection imaging component 103 may also include an aperture stop for adjusting the field of view of the projected light spot.

[0048] Figure 2 This is a schematic diagram of the reflector unit 104 provided in this embodiment. Figure 1 and Figure 2 As shown, the scanning reflection assembly includes a driving unit (not shown) and a mirror unit 104. The mirror unit 104 has one or at least two circumferentially distributed reflective surfaces. The driving unit drives the mirror unit 104 to rotate in a predetermined direction and projects the projection spot, which has been amplified by the projection imaging assembly 103, onto the surface of the substrate 105. The projection spot is reflected by the surface of the substrate 105 to form a detection spot.

[0049] The substrate 105 is located below the projection lens 200. If the surface of the substrate 105 is not flat, the projected light spot projected onto a certain position on the surface of the substrate 105 will not be reflected at the optimal focal plane of the projection lens 200, resulting in distortion of the detection light spot and the substrate 105 being out of focus at this position.

[0050] Please continue reading. Figure 1 and Figure 2 In this embodiment, the reflector unit 104 is a prism, and each side of the prism is a reflective surface. Figure 2As shown in the figure, the prism is an octagonal prism, i.e. the mirror unit 104 has eight reflecting surfaces. When the driving unit drives the mirror unit 104 to rotate along the predetermined direction, the projection light spot will swing regularly, and the time from the moment when the projection light spot just enters a reflecting surface to the moment when the projection light spot completely leaves the reflecting surface is a scanning period T.

[0051] Further, the mirror unit 104 is a regular prism, and the width of each side of the regular prism along the scanning direction is equal, so that the width of each reflecting surface of the mirror unit 104 along the scanning direction is equal. The driving unit drives the mirror unit 104 to rotate at a constant speed, so that the scanning period T corresponding to each reflecting surface is equal.

[0052] Of course, the mirror unit 104 is not limited to be a regular prism, but can also be other irregular prisms. In this way, in order to ensure that the scanning period T corresponding to each reflecting surface is equal, the driving unit can drive the mirror unit 104 to rotate at a non-constant speed along the predetermined direction, for example, when the reflecting surface with a larger width along the scanning direction reflects the projection light spot, the driving unit can increase the rotating speed of the mirror unit 104; on the contrary, when the reflecting surface with a smaller width along the scanning direction reflects the projection light spot, the driving unit can decrease the rotating speed of the mirror unit 104.

[0053] It can be understood that the prism is not limited to be an octagonal prism, but can also be a triangular prism, a pentagonal prism or a hexagonal prism, and the like, which will not be illustrated one by one here.

[0054] Further, the mirror unit 104 is not limited to have eight reflecting surfaces, but can also have one, two, three or four reflecting surfaces, for example, when the mirror unit 104 is an octagonal prism, the eight sides of the octagonal prism are not all the reflecting surfaces, but only a part of the sides are the reflecting surfaces, and the other part of the sides are not the reflecting surfaces, but it should not be limited thereto.

[0055] Please continue to refer to Figure 1 The substrate 105 can be a silicon wafer, or can be other surfaces which need to be measured in a precise machining process.

[0056] Further, the first mirror 106 can be symmetrically distributed with the mirror unit 104 on both sides of the projection objective 200, and is used for reflecting the detection light spot. The first mirror 106 can turn the light path, and reduce the space occupied by the focusing and leveling device.

[0057] The detection imaging assembly 107 can include one or several refractive lenses or reflective lenses for relaying the detection light spot. Of course, the detection imaging assembly 107 can also include a wedge plate, parallel plates, aspheric lenses or free-form lenses, etc. with special adjustment functions for adjusting the imaging quality of the detection imaging assembly 107. Optionally, the detection imaging assembly 107 can also include a diaphragm for adjusting the field of view of the detection light spot.

[0058] It should be understood that, due to the turning of the optical path by the first mirror 106, the detection imaging assembly 107 and the projection imaging assembly 103 are also symmetrically distributed on both sides of the projection objective 200.

[0059] Further, the second mirror 108 is used for reflecting the detection light spot after being relayed by the detection imaging assembly 107. The second mirror 108 can also turn the optical path, reducing the space occupied by the focusing and leveling device.

[0060] It should be understood that, as an optional embodiment, the first mirror 106 and / or the second mirror 108 can be omitted; and additional optical elements can also be added to turn the optical path, which will not be illustrated one by one here.

[0061] Please continue to refer to Figure 1 The detection slit assembly 109 has a plurality of parallel second slits, or it can also be understood that the detection slit assembly 109 includes an opaque second plate structure and the second slits are formed on the second plate structure. The detection light spot forms a mark light spot after passing through the second slits.

[0062] Optionally, the second slits can be square or rectangular through holes, and the second plate structure can be arranged vertically to the optical path or can be arranged obliquely relative to the optical path, which is not limited by the present application.

[0063] Further, the shape and position distribution of the second slits and the first slits correspond to each other, and the size of the second slits and the first slits along the scanning direction has a certain proportional relationship. When the mirror unit 104 rotates, the projection light spot swings regularly, and when a plurality of projection light spots are incident to the center of the reflecting surface as a whole, the energy of the mark light spot is maximum.

[0064] The relay imaging assembly 110 can include one or several refractive or reflective lenses for relaying and magnifying the mark spot. Of course, the relay imaging assembly 110 can also include wedge plates, parallel plates, aspheric lenses or freeform lenses with special adjustment functions for adjusting the imaging quality of the relay imaging assembly 110. Optionally, the probe imaging assembly 107 can also include a diaphragm for adjusting the field of view of the mark spot.

[0065] The detector assembly 120 is used to detect the energy of the mark spot and output an electrical signal representing the energy of the mark spot. The detector assembly 120 can be a photodetector or other sensor.

[0066] Please continue to refer to Figure 1 According to the Scheimpflug Principle of the focusing and leveling system, the defocus amount ΔZ of the substrate 105 and the displacement ΔL1 of the projection spot and the probe spot in the scanning direction are related as follows:

[0067]

[0068] Where θ is the incidence angle of the projection spot incident to the surface of the substrate 105; β is the magnification of the probe spot from the substrate 105 to the probe slit assembly 109 (i.e., the magnification of the probe imaging assembly 107).

[0069] The scanning process model of each reflecting surface of the mirror unit 104 can be described as follows:

[0070]

[0071] Where, is the angular displacement of the position of the projection spot t at the reflecting surface relative to the position just entering the reflecting surface; is the maximum angular displacement of a plurality of projection spots just entering the reflecting surface to completely leaving the reflecting surface.

[0072] When the mirror unit 104 rotates, the displacement ΔY2 of the projection spot before it is incident to the surface of the substrate 105 and the displacement ΔL2 of the projection spot relative to the probe spot are respectively:

[0073]

[0074]

[0075] Where f is the focal length of the mirror unit 104 to the substrate 105.

[0076] Since the rotation of each reflecting surface of the mirror unit 104 can be considered as a small angle swing, formula (4) can be simplified as:

[0077]

[0078] In summary, when the defocus amount of the substrate 105 is ΔZ, the displacement ΔL between the projection light spot and the detection light spot is:

[0079]

[0080] wherein,

[0081] It can be seen that M, N and f are constants. According to formula (6), the displacement ΔL between the projection light spot and the detection light spot is related to .

[0082] Figure 3 FIG. 4 is a diagram of the change relationship of the displacement ΔL between the projection light spot and the detection light spot with time. As shown in FIG. 4, in the first scanning period T1, the substrate 105 is located at the correct position; in the second scanning period T2 and the third scanning period T3, the substrate 105 deviates from the correct position (defocus); wherein h is the width of the detection light spot along the scanning direction. Figure 3

[0083] FIG. 5 is a diagram of the change relationship of the electrical signal output by the detector assembly 120 in the three scanning periods with time. As shown in FIG. 5, when t = 0, the amplitude of the electrical signal output by the detector assembly 120 is A when the plurality of projection light spots just enter one reflecting surface; when t = T, the amplitude of the electrical signal output by the detector assembly 120 is B when the plurality of projection light spots completely leave the reflecting surface. A and B satisfy the following relationship: Figure 4 Figure 3 Figure 4

[0084]

[0085]

[0086] wherein, ρ is the conversion coefficient of the optical signal detected by the detector assembly 120 and the electrical signal output.

[0087] A and B satisfy the following relationship with the defocus amount of the substrate 105:

[0088]

[0089] wherein, ​​​The value of ΔZ can be derived by theoretical calculation or calibrated by experiment. According to formula (9), the defocus amount ΔZ of the substrate 105 can be calculated based on the electrical signal output by the detector assembly 120.

[0090] Based on this, the embodiment further provides a lithography machine comprising the focus and level adjusting device.

[0091] Embodiment Two

[0092] Figure 5 A schematic diagram of the mirror unit 104 provided in the embodiment is shown in FIG. 1B. As shown in FIG. 1B, the difference between the embodiment and the embodiment one is that, in the embodiment, the mirror unit 104 is a prism, each side of the prism is a reflecting surface, Figure 1 and Figure 5 In the embodiment, the mirror unit 104 is a prism, each side of the prism is a reflecting surface, Figure 5 In the embodiment, the mirror unit 104 is a prism, each side of the prism is a reflecting surface,

[0093] Further, the mirror unit 104 is a regular prism, the width of each side of the regular prism along the scanning direction is equal, so that the width of each reflecting surface of the mirror unit 104 along the scanning direction is equal. The driving unit drives the mirror unit 104 to rotate at a uniform speed, so that the scanning period T corresponding to each reflecting surface is equal.

[0094] Of course, the mirror unit 104 is not limited to be a regular prism, but can also be other irregular prisms. The prism is not limited to be an eight-prism, but can also be a three-prism, a five-prism or a six-prism, etc., which will not be illustrated one by one here.

[0095] Embodiment Three

[0096] Figure 6 A schematic diagram of the mirror unit 104 provided in the embodiment is shown in FIG. 1B. As shown in FIG. 1B, the difference between the embodiment and the embodiment one is that, in the embodiment, the mirror unit 104 is a prism, each side of the prism is a reflecting surface, Figure 1 and Figure 6 In the embodiment, the mirror unit 104 is a prism, each side of the prism is a reflecting surface, Figure 6 In the embodiment, the mirror unit 104 is a prism, each side of the prism is a reflecting surface,

[0097] Further, the mirror unit 104 is a regular prism, the width of each side of the regular prism along the scanning direction is equal, so that the width of each reflecting surface of the mirror unit 104 along the scanning direction is equal. The driving unit drives the mirror unit 104 to rotate at a uniform speed, so that the scanning period T corresponding to each reflecting surface is equal.

[0098] Of course, the reflector unit 104 is not limited to a regular pyramid, but can also be other irregular pyramids. The pyramid is not limited to an octagonal pyramid, but can be a triangular pyramid, a pentagonal pyramid, or a hexagonal pyramid, etc., which will not be listed here.

[0099] Example 4

[0100] Figure 7 This is a schematic diagram of the reflector unit 104 provided in this embodiment. Figure 1 and Figure 7 As shown, the difference from Embodiment 1 is that in this embodiment, the reflector unit 104 has protrusions distributed circumferentially, and each exposed surface of the protrusion is a reflective surface.

[0101] Please continue reading. Figure 7 In this embodiment, the protrusion is a triangular pyramid, and the exposed surface of the triangular pyramid is the two lateral faces of the pyramid. That is, each protrusion has two reflective surfaces, and the reflector unit 104 has 8 protrusions, which means it has 16 reflective surfaces.

[0102] Furthermore, the triangular pyramid is not a regular triangular pyramid, but an irregular triangular pyramid, and the widths of the two lateral faces of the pyramid along the scanning direction are not equal, so that the widths of two adjacent reflecting surfaces of the reflector unit 104 along the scanning direction are not equal. The driving unit drives the reflector unit 104 to rotate at a non-uniform speed, so that the scanning period T corresponding to each reflecting surface is equal.

[0103] Of course, the protrusion is not limited to an irregular triangular pyramid, but can also be a regular pyramid. The protrusion is also not limited to a triangular pyramid, but can be a quadrangular pyramid, a hexagonal pyramid, or a 9-sided pyramid, etc., which will not be listed here.

[0104] As an optional embodiment, the protrusion can also be a prism or a frustum, which will not be described in detail here.

[0105] It should be understood that each exposed surface of the protrusion is not necessarily the reflective surface; as long as at least one exposed surface of the protrusion is the reflective surface, the implementation of the present invention is satisfied.

[0106] The above embodiments are merely adaptive examples of several structures of the reflector unit 104. It should be understood that the reflector unit 104 in this invention is not limited to the prism, frustum, or pyramid structures described above, but can be any other possible structure. Any structure with multiple reflective surfaces and capable of rotation can serve as the reflector unit 104.

[0107] In summary, in the focusing and leveling device and the photolithography machine provided by the embodiment of the present application, the scanning reflection assembly comprises a driving unit and a mirror unit, the mirror unit has one or at least two circumferentially distributed reflecting surfaces, the driving unit drives the mirror unit to rotate to scan the projection spot to be imaged on the surface of the substrate, without overcoming the inertia generated by the mass of the mirror unit, the modulation frequency can be improved by increasing the rotation speed, thereby improving the signal-to-noise ratio of the detection of the focusing and leveling device and reducing the measurement error, and when the mirror unit has at least two reflecting surfaces, one rotation of the mirror unit can provide multiple light intensity modulations, thereby further improving the modulation frequency.

[0108] It should be noted that the embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts of each embodiment can be referred to each other.

[0109] It should also be noted that, although the present application has been disclosed with the above preferred embodiments, the above embodiments are not intended to limit the present application. For any skilled person in the art, many possible changes and modifications of the technical solutions of the present application can be made by using the disclosed technical content without departing from the scope of the technical solutions of the present application, or modified as equivalent embodiments of equivalent changes. Therefore, any simple modification, equivalent change and modification of the above embodiments made according to the technical essence of the present application without departing from the technical solutions of the present application, all still belong to the scope of protection of the technical solutions of the present application.

[0110] It should also be understood that, unless specifically described or indicated, the terms "first", "second", "third" and the like in the specification are merely used to distinguish different components, elements, steps and the like in the specification, and are not intended to represent a logical relationship or sequence relationship between the components, elements, steps and the like.

[0111] In addition, it should be recognized that the terms described herein are only used to describe specific embodiments, and are not intended to limit the scope of the present application. It should be noted that the singular forms "a" and "an" and "the" used herein and in the appended claims include plural references unless the context clearly indicates the contrary. For example, the reference to "a step" or "a device" means the reference to one or more steps or devices, and can include sub-steps and sub-devices. All conjunctions used should be interpreted in the broadest sense. In addition, the word "or" should be interpreted as having the definition of logical "or", not the definition of logical "exclusive or", unless the context clearly indicates the contrary. In addition, the implementation of the method and / or device in the embodiments of the present application can include manual, automatic or combined execution of selected tasks.

[0112] The above merely describes the preferred embodiments of the present application, and does not limit the present application in any way. Any person skilled in the art, without departing from the scope of the technical solutions of the present application, can make any form of equivalent replacement or modification of the technical solutions and technical contents disclosed by the present application, and such changes still belong to the protection scope of the present application.

Claims

1. A focusing and leveling device, characterized in that, Including those arranged sequentially along the optical path: Illumination components for emitting a detection beam; A projection slit assembly is used to transmit the detection beam and form multiple projection spots; A scanning reflection assembly includes a driving unit and a mirror unit. The mirror unit has one or at least two circumferentially distributed reflective surfaces. The driving unit drives the mirror unit to rotate in a predetermined direction and projects the projection spot onto the surface of a substrate. The projection spot is reflected by the surface of the substrate to form a detection spot. A detection slit assembly for transmitting the detection light spot and forming a marker light spot; and, A detector assembly for detecting the energy of the marked light spot.

2. The focusing and leveling device as described in claim 1, characterized in that, When multiple projected light spots are incident as a whole on the center of the reflective surface, the energy of the marked light spot detected by the detector assembly is at its maximum.

3. The focusing and leveling device as described in claim 1 or 2, characterized in that, The time between the initial incident of the multiple projected light spots on the reflective surface and their complete departure from the reflective surface constitutes one scanning cycle, and the scanning cycles corresponding to each reflective surface are equal.

4. The focusing and leveling device as described in claim 3, characterized in that, Each of the reflective surfaces has an equal width along the scanning direction, and the driving unit drives the reflective mirror unit to rotate at a constant speed.

5. The focusing and leveling device as described in claim 3, characterized in that, The width of each of the reflective surfaces is not equal along the scanning direction, and the driving unit drives the reflective mirror unit to rotate at a non-uniform speed.

6. The focusing and leveling device as described in claim 1 or 2, characterized in that, The reflector unit is a prism, frustum, or pyramid, and at least one side of the prism, frustum, or pyramid is the reflecting surface.

7. The focusing and leveling device as described in claim 1 or 2, characterized in that, The reflector unit has protrusions distributed circumferentially, and at least one exposed surface of the protrusion is the reflective surface.

8. The focusing and leveling device as described in claim 7, characterized in that, The protrusion is a prism, frustum, or pyramid.

9. The focusing and leveling device as described in claim 1, characterized in that, Also includes: A projection imaging component, located between the projection slit component and the scanning reflection component, is used to relay and amplify the projection spot before it is incident onto the substrate; A detection imaging component is located between the scanning reflection component and the detection slit component, and is used to relay and amplify the detection spot before it is incident into the detection slit component; as well as, A relay imaging component, located between the detection slit component and the detector component, is used to relay and amplify the marked light spot before it is incident into the detector component.

10. The focusing and leveling device as described in claim 9, characterized in that, Also includes: A first reflecting mirror is located between the scanning reflection component and the detection imaging component, and is used to reflect the detection light spot into the detection imaging component; as well as, The second reflector is located between the detection imaging component and the detection slit component, and is used to reflect the detection spot after being relayed and amplified by the detection imaging component into the detection slit component.

11. The focusing and leveling device as described in claim 1, characterized in that, The detector assembly outputs an electrical signal characterizing the energy of the marked light spot, and calculates the defocusing amount ΔZ of the substrate using the following formula: Wherein, θ is the incident angle of the projected light spot onto the surface of the substrate; β is the magnification of the detection light spot from the substrate to the detection slit assembly; f is the focal length of the mirror unit to the substrate; A is the amplitude of the electrical signal output by the detector assembly when the multiple projected light spots just enter one of the reflecting surfaces; B is the amplitude of the electrical signal output by the detector assembly when the multiple projected light spots completely leave the reflecting surface.

12. A lithography machine, characterized in that, Includes the focusing and leveling device as described in any one of claims 1-11.

Images