Monitoring Method for Gas Concentration and Air Pressure Data of 12-inch Semiconductor N2STK

Abstract

The present invention discloses a method for monitoring the gas concentration and pressure data of a 12-inch N2STK semiconductor. The MCS system performs comprehensive monitoring according to the nitrogen filling time required by the wafer product, and automatically replenishes nitrogen when the S wafer is stored for more than a predetermined time. The specific steps include: the FOUP wafer enters the N2STK, and the MCS inquires the MES about the wafer nitrogen filling time and the longest nitrogen filling interval; the MES replies with the nitrogen filling time, and starts nitrogen filling after the wafer enters the warehouse; the MCS starts the nitrogen filling timing, and if there is a wafer outbound or transfer demand during this period, the MCS will refuse to execute and prohibit outbound or transfer; if the wafer is stored in the N2STK for a long time, the MCS will issue a nitrogen filling instruction again to perform a nitrogen filling operation on the wafer; after the nitrogen filling is completed, the wafer can be outbound and go to the next process. The entire process of the present invention only spans three systems, which simplifies the number of systems docked by the process processing and improves the process processing efficiency.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor process technology, and in particular to a method for monitoring nitrogen filling time and nitrogen replenishment execution time after a 12-inch wafer is stored in an N2STK. Background Art

[0002] In the existing 12-inch wafer production system, wafers transferred from the current process to the next process need to be stored in the N2STK. The gas pressure / concentration of the wafer products in the N2STK is monitored by the FDC system (big data analysis system) and the time for nitrogen filling / replenishing of the wafers is controlled. MES then combines the results of FDC system data collection to determine whether the wafer can be stored in the N2STK, because the scheduling of wafers is actually implemented by MCS. If MCS directly collects the air pressure / concentration inside the N2STK, it can more timely and accurately grasp whether the current air pressure / concentration in the N2STK meets the wafer storage standards. Compared with the mode in which MES only manages the N2STK shelf area, MCS manages the specific shelf positions in the N2STK, and can more accurately locate the shelves whose air pressure / concentration does not meet the wafer storage standards, thereby realizing MES system management; at the same time, MCS is also responsible for wafer scheduling, and can timely transfer and store the wafers in the corresponding shelf positions to avoid wafers being scrapped due to storage environment problems, thereby realizing MCS is responsible for wafer scheduling; at the same time, MCS can also synchronously issue the task of N2STK to perform inflation and pressurization, thereby promptly improving the impact of environmental problems.

[0003] The entire wafer quality monitoring and response process spans four systems: N2STK<->FDC<->MES<->MCS, as shown in the attached Figure 2 As shown, from the discovery of abnormal air pressure / concentration on a shelf in the N2STK, the wafer product is put into storage to the start of nitrogen filling in the N2STK, the card controls the release / transfer of the product, the forced release alarm during the period, and the regular nitrogen replenishment operation after long-term storage, it is necessary to perform technical judgments and execute corresponding processing logic in four systems to maintain the transfer scheduling of wafers and the improvement of the storage area environment, as well as to execute corresponding processing logic to maintain the quality of wafer products. The process is relatively cumbersome and relatively inefficient. Summary of the Invention

[0004] In order to simplify the cumbersome process across four systems, the present invention provides a method for monitoring semiconductor 12-inch N2STK gas concentration and pressure data.

[0005] The present invention is achieved through the following technical solutions:

[0006] A method for monitoring the gas concentration and pressure data of 12-inch N2STK semiconductor wafers is described. The MCS system comprehensively monitors the nitrogen filling time required by the wafer product and automatically replenishes nitrogen when the S wafer is stored for more than a predetermined time. The specific steps are as follows:

[0007] (1) When the FOUP wafer enters the N2STK, the MCS (manufacturing material handling system) inquires the MES (manufacturing information management system) about the wafer nitrogen filling time and the maximum nitrogen filling interval;

[0008] (2) MES responds to the nitrogen filling time, and nitrogen filling begins after the wafer is put into storage;

[0009] (3) MCS starts nitrogen filling timing. If there is a wafer outbound or transfer request during this period, MCS will refuse to execute it. At this time, N2STK (wafer storage system) will report an exception to remind personnel that the wafer is being filled with nitrogen and is prohibited from being outbound or transferred;

[0010] (4) If the wafer is stored in the N2STK for a long time and the longest nitrogen replenishment interval has been triggered after the nitrogen filling is completed, the MCS will issue a nitrogen filling instruction again to perform the nitrogen filling operation on the wafer;

[0011] (5) After nitrogen filling is completed, the wafer can be shipped out and sent to the next process.

[0012] Furthermore, in step (2), after MES replies to MCS with relevant parameters, MCS takes full control of the nitrogen filling / replenishing and card control of the FOUP wafer outbound / transfer. After the wafer product enters the warehouse, MCS starts to fill the wafer with nitrogen, and the nitrogen filling time has been obtained from MES through inquiry.

[0013] Furthermore, in step (3), if a person or system has a demand for the wafer to be shipped out / transferred, but the wafer is still in the nitrogen filling process, the MCS will refuse to execute the shipping / transfer task, and the N2STK will also sound an alarm to remind the person that the wafer is being filled with nitrogen and any shipping / transfer operation is prohibited.

[0014] Furthermore, the time of the long-term storage timeout in step (4) has been obtained through MES inquiry.

[0015] Furthermore, after step (5), the MCS releases the wafer control and allows it to be shipped out, thereby ensuring to the greatest extent possible that the wafer product meets the pressure / gas concentration requirements of the next process.

[0016] Beneficial effects: The MCS system is responsible for collecting data on the air pressure / concentration of the N2STK. When the air pressure / concentration of a storage shelf in a certain area of the N2STK is abnormal, the abnormality will be reported to the MES, which will determine whether the wafer can be stored in the N2STK. At the same time, the MCS can accurately locate the specific shelf position with abnormal air pressure / concentration and issue the task of inflation and pressurization to the N2STK, thereby promptly improving the environmental problems in the wafer storage area and improving product yield. From data collection -> wafer scheduling -> inflation and pressurization, the entire process only spans three systems (N2STK<->MCS<->MES), which streamlines the number of systems connected to process processing and improves process processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a flow chart of gas pressure / concentration monitoring and related nitrogen filling / supplementation card control for FOUP wafer products from storage to delivery in an embodiment of the present invention.

[0018] Figure 2 This is a description of the traditional gas concentration / pressure monitoring business process within N2STK involving four systems (N2STK<->FDC<->MES<->MCS) with FDC intervention.

[0019] Figure 3 This is a description of the gas concentration / pressure monitoring business process within the N2STK of the present invention (N2STK<->MCS<->MES, without FDC intervention).

[0020] Figure 4 Content Description: S2F23 TrackingData Collection (MCS->N2STK wafer product pressure / concentration collection).

[0021] Figure 5 Content Description: S6F1 TrackingData Collection Reply (N2STK->MCS wafer product pressure / concentration data report).

[0022] Figure 6 Content description: S5F1 AlarmReport Send (N2STK->MCS wafer product nitrogen filling / replenishing period, MCS rejects the manual outbound task and N2STK abnormal report is generated).

[0023] Figure 7 Content Description: S2F25 TrackingData Fix (MCS->N2STK performs nitrogen filling / replenishing operations on wafer products). DETAILED DESCRIPTION

[0024] The following is a detailed description of an embodiment of the present invention in conjunction with the accompanying drawings: This embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation method and specific operation process are given, but the protection scope of the present invention is not limited to the following embodiment.

[0025] like Figure 1 、 2 As shown in the figure, when wafers are put into storage, MCS will control the nitrogen filling time / nitrogen replenishment interval time assigned by MES. If there is a demand for outbound shipment during the nitrogen filling / nitrogen replenishment time, MCS will refuse to issue the outbound shipment task.

[0026] like Figure 3 、 4 As shown in the figure, if a wafer is scheduled for shipment during nitrogen filling / replenishing, and the MCS is controlling it, if someone attempts to manually force the wafer out of the N2STK, the MCS will also control it and the N2STK will alarm. The wafer will not be allowed to ship out until nitrogen filling / replenishing is complete. The MCS regularly collects parameters such as nitrogen concentration and pressure of wafer products in the N2STK and automatically performs nitrogen filling / replenishing operations based on the time assigned by the MES.

[0027] A monitoring method for N2STK gas concentration and pressure data in semiconductor 12-inch factories is used to determine whether the wafers stored in the STK have reached the nitrogen filling time or whether nitrogen replenishment is needed to ensure the yield. Because the N2STK where the wafers are stored is centrally managed by the MCS, the MCS directly monitors the nitrogen filling process inside the N2STK, which can more timely and accurately grasp whether the nitrogen filling of the wafers stored in the N2STK has been completed or whether nitrogen replenishment is needed after a period of storage. During the nitrogen filling or replenishment period, the MCS will prohibit any operation on the wafer, including outbound / transfer, to ensure the nitrogen filling time of the wafer, avoid wafer scrapping due to insufficient nitrogen filling, and maximize the product quality. Yield, compared with the current traditional FDC control wafer nitrogen filling method, N2STK also needs to be connected with FDC, and the wafer logistics scheduling and card control are all within the scope of MCS. N2STK originally needs to be connected with MCS. This invention not only improves the efficiency of wafer product nitrogen filling, but also simplifies the system docking process (no FDC intervention required), and improves the stability of the system communication level. Because each process has extremely strict standards for the gas concentration and pressure data contained in the wafer product, if the relevant data does not meet the standards and the next process is rashly carried out, the wafer product will be scrapped. Therefore, nitrogen filling or nitrogen replenishment as required plays an important role in the semiconductor 12-inch factory, maximizing the yield of the wafer product.

[0028] like Figure 5 、 6As shown in Figure 7, the N2STK reports parameters such as nitrogen concentration and pressure on wafers stored in the MCS warehouse, enabling users to monitor wafer quality on the MES system. If a worker manually forces a wafer to be removed from the warehouse during nitrogen filling / replenishment, the N2STK issues an alarm after the MCS refuses to proceed. The MCS automatically fills / replenishes the wafers according to the filling / replenishment time assigned by the MES when the wafers are received.

[0029] In order to simplify the cumbersome process across four systems (without FDC intervention), the present invention uses the MCS system to monitor the data of N2STK pressure / concentration. When the FOUP wafer enters the warehouse, the MCS asks the MES for the nitrogen filling / replenishing time of the wafer. After the MES replies to the MCS with relevant parameters, the MCS takes full control of the nitrogen filling / replenishing and the card control of the outbound / transfer of the FOUP wafer. After the wafer product enters the warehouse, the MCS starts to fill the wafer with nitrogen (the time has been obtained by querying the MES). During this period, if there is a person or system that has a demand for the wafer to be outbound / transferred, but the wafer is still in the nitrogen filling process, the MCS will start to fill the wafer with nitrogen (the time has been obtained by querying the MES). During the process, MCS will refuse to execute this outbound / transfer task, and N2STK will alarm at the same time to remind personnel that this wafer is being filled with nitrogen and any outbound / transfer operation is prohibited. After the wafer is filled with nitrogen, if it is left in N2STK for a long time exceeding the set time, the long-term storage timeout time has been obtained through MES inquiry, and MCS will automatically perform nitrogen replenishment operation on the wafer product. After the wafer is filled with nitrogen / nitrogen replenishment is completed, MES will issue the outbound task to the next process, and MCS will release the wafer card control and allow it to be shipped out, thereby ensuring to the greatest extent that the wafer product meets the pressure / gas concentration requirements of the next process and improving product yield.

[0030] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for monitoring N2STK gas concentration and pressure data in a semiconductor 12-inch wafer storage system, characterized in that: The manufacturing material handling system MCS comprehensively monitors the nitrogen filling time required by the wafer products and automatically replenishes nitrogen when the S wafer is stored for more than the set time. The specific steps are as follows: (1) When the FOUP wafer enters the wafer storage system N2STK, the manufacturing material handling system MCS inquires the manufacturing information management system MES about the wafer nitrogen filling time and the maximum nitrogen filling interval; (2) The manufacturing information management system (MES) responds to the nitrogen filling time, and nitrogen filling begins after the wafer is put into storage; (3) The manufacturing material handling system MCS starts the nitrogen filling timer. If there is a wafer outbound or transfer request during this period, the manufacturing material handling system MCS will refuse to execute it. At this time, the wafer storage system N2STK will report an abnormality to remind personnel that the wafer is being filled with nitrogen and is prohibited from being outbound or transferred; (4) If the wafer is stored in the wafer storage system N2STK for a long time, and the longest nitrogen replenishment interval has been triggered after the nitrogen filling is completed, the manufacturing material handling system MCS will issue a nitrogen filling instruction again to perform the nitrogen filling operation on the wafer; (5) After nitrogen filling is completed, the wafer can be shipped out and go to the next process.

2. The method for monitoring N2STK gas concentration and pressure data of a semiconductor 12-inch wafer storage system according to claim 1, characterized in that: In step (2), after the manufacturing information management system MES replies to the manufacturing material handling system MCS with the relevant parameters, the manufacturing material handling system MCS takes full control of the nitrogen filling / replenishing and the card control of the warehouse out / transfer of the FOUP wafer. After the wafer product enters the warehouse, the manufacturing material handling system MCS starts to fill the wafer with nitrogen. The nitrogen filling time has been obtained from the manufacturing information management system MES through inquiry.

3. The method for monitoring N2STK gas concentration and pressure data of a semiconductor 12-inch wafer storage system according to claim 1, characterized in that: During step (3), if a person or system has a need to remove / transfer the wafer, but the wafer is still in the nitrogen filling process, the manufacturing material handling system MCS will refuse to execute the removal / transfer task, and the wafer storage system N2STK will simultaneously sound an alarm to remind the person that the wafer is being filled with nitrogen and any removal / transfer operation is prohibited.

4. The method for monitoring N2STK gas concentration and pressure data of a semiconductor 12-inch wafer storage system according to claim 1, characterized in that: The long-term storage timeout period in step (4) has been obtained through querying the manufacturing information management system MES.

5. The method for monitoring N2STK gas concentration and pressure data of a semiconductor 12-inch wafer storage system according to claim 1, characterized in that: After step (5), the manufacturing material handling system MCS releases the wafer control and allows it to be shipped out, ensuring to the greatest extent that the wafer product meets the gas pressure / gas concentration requirements of the next process.

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