Method of working and system for working a processing device

Abstract

The present application provides a machining operation method and a machining system. The machining operation method includes steps 1, 2, 3 and 4. Step 1 provides an object having a machining surface, the machining surface is divided into a plurality of machining areas, each machining area has at least one workpiece. Step 2 performs path calculation according to at least one workpiece of each machining area to generate machining path of each machining area, wherein the machining paths of the machining areas are different from each other. Step 3 uses a machining device to perform machining operation according to the machining path of one of the machining areas obtained in step 2. Step 4 moves the machining device to the next machining area after completing the machining operation of all workpieces in one of the machining areas.

Description

Technical Field

[0001] This invention relates to a processing method and a processing system for a processing apparatus. Background Technology

[0002] During the fabrication of chips (such as miniature light-emitting diode chips), when an inspection device detects a defective chip on the substrate, it removes the chip from the substrate, for example, using a laser lift-off process. In this process, the laser device scans all areas of the chip relative to the chip, only emitting a laser beam to perform laser lift-off at the location of the defect. However, this full-surface scanning path is long and time-consuming.

[0003] Another approach is to calculate the optimal path for the laser to scan the defect location for each chip processed. However, a new optimal path needs to be calculated every time a chip is replaced, resulting in long processing times. Summary of the Invention

[0004] This invention relates to a processing method for a processing device, which effectively shortens processing time and calculation time.

[0005] This invention relates to a processing system that effectively shortens processing time and computation time.

[0006] An embodiment of the present invention provides a processing method for a processing device, comprising steps 1, 2, 3, and 4. Step 1 involves providing an object having a processing surface, dividing the processing surface into multiple processing regions, wherein each processing region has at least one workpiece, and the intersection of these processing regions is an empty set. Step 2 involves performing path calculations based on at least one workpiece in each processing region to generate a processing path for each processing region, wherein the processing paths of these processing regions are distinct from each other. Step 3 involves using the processing device to perform processing operations according to the processing path of one of the processing regions obtained in Step 2. Step 4 involves completing the processing operations for all workpieces within one of these processing regions, and then moving the processing device to the next processing region.

[0007] One embodiment of the present invention provides a machining system for machining an object, wherein the object has a machining surface. The machining system includes a computing unit, a machining device, and a control unit. The computing unit is used to divide the machining surface into multiple machining regions, wherein each machining region has at least one workpiece, and the intersection of these machining regions is an empty set. The computing unit is further used to perform path calculation based on at least one workpiece in each machining region to generate a machining path for each machining region, wherein the machining paths of these machining regions are distinct from each other. The control unit is used to control the machining device to perform machining operations according to the machining path of one of the machining regions obtained by the computing unit, wherein after the machining device completes the machining of all workpieces in one of the machining regions, the control unit controls the machining device to move to the machining path of the next machining region for machining operations.

[0008] In the processing method and system of the processing apparatus according to embodiments of the present invention, a processing path for each processing area is generated based on path calculation performed on at least one workpiece in each processing area. After completing the processing of all workpieces in a processing area, the processing apparatus is moved to the next processing area. Therefore, the processing method and system of the processing apparatus according to embodiments of the present invention can effectively shorten the processing time while effectively shortening the calculation time. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the architecture of a processing system according to an embodiment of the present invention;

[0010] Figure 2 This is a flowchart of a processing operation method of a processing apparatus according to an embodiment of the present invention;

[0011] Figure 3 and Figure 4 for Figure 2 A schematic diagram of the processing path for the processing operation method of the processing device;

[0012] Figure 5 It shows Figure 3 or Figure 4 Sub-regions of the processing area;

[0013] Figure 6 This illustrates another way to set up the processing area. Detailed Implementation

[0014] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0015] Figure 1 This is a schematic diagram of the architecture of a processing system according to an embodiment of the present invention. Figure 2This is a flowchart of a processing method of a processing apparatus according to an embodiment of the present invention. Figure 3 and Figure 4 for Figure 2 A schematic diagram of the processing path for the processing device. Please refer to... Figures 1 to 4 The processing system 100 in this embodiment can be used to perform... Figure 2 The processing apparatus is described as follows: A processing system 100 is used to process an object 200, wherein the object 200 has a processing surface 202. In this embodiment, the object 200 is, for example, a substrate on which a plurality of electronic components or conductive lines are provided on the processing surface 202. The electronic components are, for example, miniature light-emitting diodes or other types of electronic components, and the substrate is, for example, a temporary substrate or a display backplate.

[0016] The machining system 100 includes a computing unit 110, a machining device 120, and a control unit 130. The computing unit 110 is used to divide the machining surface 202 into multiple machining areas 210, such as... Figure 3 Medium-sized squares, such as Figure 3 The system is divided into 4×4 (i.e., 16) processing areas 210. Each processing area 210 has at least one workpiece 220. In this embodiment, the workpiece 220 is a defective electronic component or conductive circuit, such as a defective miniature light-emitting diode, sensor, or conductive circuit. The intersection of these processing areas 210 is an empty set, meaning that these processing areas do not partially overlap or completely overlap.

[0017] The arithmetic unit 110 is further configured to perform path calculations based on at least one workpiece 220 on each processing area 210, generating a processing path 230 for each processing area 210, wherein the processing paths 230 of these processing areas 210 are different from each other, such as Figure 3 As shown.

[0018] The control unit 130 is electrically connected to the arithmetic unit 110 and the processing apparatus 120, and is used to control the processing apparatus 120 to perform processing operations according to the processing path 230 of one of the processing areas 210 calculated by the arithmetic unit 110. After the processing apparatus 120 completes the processing of all workpieces 220 in one of the processing areas 210, the control unit 130 controls the processing apparatus 120 to move to the processing path 230 of the next processing area 210 to perform processing operations. In this embodiment, the processing apparatus 120 is a laser device, and the processing operation is a component removal operation. For example, the processing apparatus 120 emits a laser beam 122 to perform a laser peeling process, thereby causing the workpiece 220 (e.g., a defective micro light-emitting diode) to detach from the substrate 200.

[0019] The processing method of the processing apparatus in this embodiment includes steps S110, S120, S130, and S140. Step S110 involves providing an object 200 with a processing surface 202, dividing the processing surface 202 into multiple processing regions 210, each processing region 210 having at least one workpiece 220, and the intersection of these processing regions 210 being an empty set. Step S120 involves performing path calculations based on at least one workpiece 220 in each processing region 210 to generate a processing path 230 for each processing region 210, wherein the processing paths 230 for these processing regions 210 are distinct from each other. Step S130 involves using the processing apparatus 120 to perform processing operations according to the processing path 230 of one of the processing regions 210 obtained in step S120. Step S140 involves, after completing the processing operations on all workpieces 220 within one of these processing regions 210, moving the processing apparatus 120 to the next processing region 210. In this embodiment, the processing device 120 moves to the next processing area 210, and the processing sequence of these processing areas 210 is shown in the movement path 237 (path arrow), as follows: Figure 3 and Figure 4 As shown. In one embodiment, this processing sequence does not involve processing the same processing area 210 repeatedly. Figure 3 and Figure 4 In this embodiment, numbers 1 to 16 represent the processing order of the processing device 120 on these processing areas 210. That is, processing area 210 numbered 1 is processed first, then processing area 210 numbered 2 is processed along the movement path 237, then processing area 210 numbered 3 is processed, and then processing areas 210 numbered 4 to 16 are processed sequentially. In this embodiment, the movement of the processing device 120 relative to the processing area 210 can be such that the processing device 120 remains stationary while the processing area 210 is moved by the movement of the stage supporting the substrate 200, or it can be such that the substrate 200 remains stationary while the processing device 120 moves. Therefore, the aforementioned "moving the processing device 120 to the next processing area 210" can mean that the processing device 120 remains stationary while the stage moves the substrate 200, or it can be such that the substrate 200 remains stationary while the processing device 120 moves. Furthermore, in one embodiment, each processing area 210 has an equal area.

[0020] In the processing method and system 100 of the processing apparatus in this embodiment, path calculation is performed based on at least one workpiece 220 on each processing area 210 to generate a processing path 230 for each processing area 210. After completing the processing of all workpieces 220 within a processing area 210, the processing apparatus 120 is moved to the next processing area 210. Therefore, the processing method and system 100 of the processing apparatus in this embodiment can effectively shorten the processing time while effectively shortening the calculation time. In other words, the processing method and system 100 of the processing apparatus in this embodiment can be used with software (e.g., executed by the calculation unit 110) to pre-optimize the processing path 230 to reduce the idle time of the processing apparatus 120. Furthermore, since the processing path 230 is optimized by partitioning (i.e., dividing into multiple processing areas 210) and the processing order of these processing areas 210 is in a fixed order (such as the order indicated by the movement path 237), the calculation can be simplified, thus saving calculation time. Compared with the prior art, which calculates the entire processing surface, at least about 40% of the time can be saved.

[0021] In one embodiment, such as Figure 3 As shown, each processing area 210 is uniformly connected from the bottom left corner of the movement path 237 relative to the bottom left corner of the area. The workpiece 220 is used as the starting point of the processing path 230. After entering the area according to the direction of the movement path 237, the workpieces are processed first and then connected sequentially from left to right. When planning the path, it is only necessary to consider which workpiece 220 is at the bottom left corner and use it as the starting point. It is not necessary to consider the coordinates of the last point of the previous processing area 210, thus reducing the computational burden.

[0022] In one embodiment, such as Figure 4 As shown, after step S130 and before step S140, the processing apparatus 120 moves between adjacent processing areas 210 via a connecting path 235. The connecting path 235 connects the processing paths 230, and the paths formed by the connecting path 235 and the processing paths 230 do not overlap. The end point of the previous processing area 210 is connected to the start point of the next processing area 210. At this time, the processing apparatus 120 moves, and the stage carrying the substrate 200 also moves, allowing the processing apparatus to move and perform processing.

[0023] In this embodiment, the processing surface 202 has M×N processing areas 210, where M+N>2, M and N are both positive integers, and the processing device 120 moves sequentially within these processing areas 210. In one embodiment, 2≦M≦5 and 2≦N≦5, and the processing areas 210 are arranged in an array. Figure 3 and Figure 4In this example, 16 processing areas 210 are used. However, in other embodiments, the processing surface 202 can also be divided into 25 processing areas 210 or other numbers of processing areas 210, such as... Figure 6 There are 25 processing areas 210. Dividing the processing area into 25 processing areas 210 results in the greatest time savings. More than 25 processing areas 210 offer little benefit, while fewer than 4 processing areas 210 result in minimal time savings. The processing areas 210 can be polygonal, rectangular, square, equilateral triangle, hexagonal, or other suitable geometric shapes. Furthermore, in this embodiment, the area ratio of each processing area 210 to the processing surface 202 (or to the object 200) falls within the range of 0.04 to 0.25.

[0024] In this embodiment, the processed surface 202 further includes at least one normal region 250 within the adjacent processed regions 210, wherein the number of workpieces 220 in this at least one normal region 250 is 0, such as Figure 3 and Figure 4 As shown. In this embodiment, when the processing device 120 is moved to the next processing area 210, the processing device 120 sweeps across this at least one normal area 250 without performing processing, wherein one of these processing areas 210 in step S130 and the next processing area 210 in step S140 are adjacent to both sides of this at least one normal area 250, as shown. Figure 3 and Figure 4 As shown. In this embodiment, the normal region 250 and these processing regions 210 are connected to form a processing surface 202. In one embodiment, the area of ​​each normal region 250 is equal to that of each processing region 210.

[0025] In this embodiment, at least one workpiece 220 in a processing area 210 may be multiple workpieces 220, and the processing path 230 is the connection path of these workpieces 220 that minimizes the processing time of the processing device 120 in the processing area 210. In one embodiment, the processing path 230 is the shortest path connecting these workpieces 220, and the processing paths 230 do not intersect. Furthermore, in one embodiment, at least one workpiece 220 in a processing area 210 may be a single workpiece 220, in which case the processing path 230 is the location of this single workpiece.

[0026] In one embodiment, the arithmetic unit 110 and the control unit 130 may be, for example, a central processing unit (CPU), a microprocessor, a digital signal processor (DSP), a programmable controller, a programmable logic device (PLD), or other similar devices or combinations thereof, and the present invention is not limited thereto. Furthermore, in one embodiment, the functions of the arithmetic unit 110 and the control unit 130 may be implemented as multiple program codes. These program codes are stored in a memory and executed by the arithmetic unit 110 and the control unit 130. Alternatively, in one embodiment, the functions of the arithmetic unit 110 and the control unit 130 may be implemented as one or more circuits. The present invention does not limit the implementation of the functions of the arithmetic unit 110 and the control unit 130 in software or hardware. In one embodiment, the arithmetic unit 110 and the control unit 130 may also be integrated into the same controller.

[0027] In this embodiment, the processing method of the processing apparatus further includes, before step S110, performing detection on the processing surface 202 to obtain the position of at least one workpiece 220 on the processing surface 202, for example, obtaining the positions of all workpieces 220 on the processing surface 202. In this embodiment, the processing system 100 further includes a detection unit 140 for performing detection on the processing surface 202 to obtain the positions of the workpieces 220 on the processing surface 202. The detection unit 140 is, for example, an automated optical inspection device or other device capable of detecting images of the processing surface 202. The detection unit 140 may be electrically connected to the processing unit 110 to transmit the captured image signal to the processing unit 110 for analysis.

[0028] In one embodiment, the processing method of the processing apparatus further includes dividing the processing surface 202 into multiple detection areas and detecting each of these detection areas to obtain the position of at least one workpiece 220 on the processing surface 202 (e.g., obtaining the positions of all workpieces 220 on the processing surface 202). In one embodiment, each detection area overlaps with the area of ​​each processing area 210 on the processing surface 202. Specifically, for example, the distinction of multiple detection areas on the processing surface corresponds to multiple subsequent processing areas 210, and each detection area and each processing area 210 have the same area and completely overlap, thereby saving time for further distinguishing processing areas later.

[0029] In this embodiment, each processing area 210 has m×n sub-areas 212, where m+n>2, and m and n are positive integers. The processing operation method of the processing device further includes performing path calculations on the m×n sub-areas 212 sequentially. Figure 5 The diagram illustrates a small number of 4×4 sub-regions 212. Each sub-region is configured with workpieces to be processed (such as defective miniature LEDs) and components that do not require processing (such as normal miniature LEDs). The first workpiece 220a in each of the 4×4 sub-regions 212 is designated as the first workpiece to be processed on the processing path 230. Path calculation is then performed to generate a processing path 230 for the processing device 120 to process these workpieces 220 in the processing area 210. However, the number of sub-regions is not limited to... Figure 5 For the limited time, it can be like Figure 3 The illustration shows 11×11 sub-regions 212, which can also be represented as... Figure 6 The diagram illustrates 6×6 sub-regions, with the number of electronic components or conductive lines on object 200 serving as the primary basis for dividing the sub-regions.

[0030] In this embodiment, the boundary of the substrate 200 is the incircle of the overall boundary of these processing areas 210. This allows for full utilization of all area on the substrate 200. This approach offers the greatest flexibility and can accommodate substrates 200 of different shapes. However, in another embodiment, the boundary of the substrate 200 can also be the circumcircle of the overall boundary of these processing areas 210, such as... Figure 6 As shown. In this case, the peripheral area of ​​the substrate 200 has no workpiece 220 or few workpieces 220 that are rarely used, so it does not need to be included in the inspection or processing area, reducing processing time. Figure 6 In the diagram, numbers 1 to 25 represent the processing sequence of processing device 120 for these processing areas 210. For example... Figure 6 Dividing the process into 25 processing zones 210 can save the most working time. More than 25 processing zones 210 are not very effective, and fewer than 4 processing zones 210 can save less time, but this is not the limit.

[0031] In summary, in the processing method and system of the processing apparatus of the embodiments of the present invention, a processing path for each processing area is generated based on path calculation performed on at least one workpiece in each processing area, and the processing apparatus is moved to the next processing area after the processing of all workpieces in a processing area is completed. Therefore, the processing method and system of the processing apparatus of the embodiments of the present invention can effectively shorten the processing time while effectively shortening the calculation time.

[0032] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A processing operation method of a processing device, characterized in that, include: Step 1: Provide an object with a processing surface, divide the processing surface into multiple processing areas, each processing area has m×n sub-regions, where m+n>2, and m and n are positive integers, each processing area has at least one workpiece, and the intersection of the multiple processing areas is an empty set; Step 2: Perform path calculation based on at least one workpiece in each processing area to generate a processing path for each processing area, wherein the processing paths of the multiple processing areas are different from each other; Step 3: Using the processing device, perform processing operations according to the processing path of one of the plurality of processing areas obtained in Step 2. The processing device sequentially performs path calculations on the m×n sub-regions of each processing area, setting the first workpiece in each m×n sub-region as the first workpiece to be processed on the processing path, generating the processing path for the processing device to process the plurality of workpieces in the processing area. At least one sub-region among the m×n sub-regions is correspondingly configured with workpieces to be processed and components not to be processed. Step 4: After completing the processing of all workpieces in one of the multiple processing areas, move the processing device to the next processing area.

2. The processing method of the processing apparatus according to claim 1, characterized in that, After step 3 and before step 4, the processing device moves between adjacent processing areas via a connecting path, which connects the processing paths of the multiple processing areas, and the paths formed by the connecting path and the processing paths of the multiple processing areas do not overlap.

3. The processing method of the processing apparatus according to claim 1, characterized in that, The processing surface has M×N processing areas, where M+N>2, M and N are both positive integers, and the processing device moves sequentially within the plurality of processing areas.

4. The processing method of the processing apparatus according to claim 1, characterized in that, The area ratio of each processing area to the processing surface falls within the range of 0.04 to 0.

25.

5. The processing operation method of the processing apparatus according to claim 1, characterized in that, The processing surface also includes at least one normal area in the adjacent plurality of processing areas, wherein the number of workpieces in the at least one normal area is 0.

6. The processing operation method of the processing apparatus according to claim 5, characterized in that, When the processing device is moved to the next processing area, the processing device sweeps over the at least one normal area without processing, wherein one of the plurality of processing areas in step 3 and the next processing area in step 4 are adjacent to the two sides of the at least one normal area.

7. The processing operation method of the processing apparatus according to claim 1, characterized in that, The at least one workpiece can be multiple workpieces, and the processing path is the connection path of the multiple workpieces that minimizes the processing time of the processing device in the processing area.

8. The processing operation method of the processing apparatus according to claim 7, characterized in that, The processing path is the shortest path connecting the multiple workpieces, and the processing paths do not intersect.

9. The processing operation method of the processing apparatus according to claim 1, characterized in that, Also includes: Before step 1, the machining surface is inspected to obtain the position of at least one workpiece on the machining surface.

10. The processing operation method of the processing apparatus according to claim 9, characterized in that, Also includes: The processing surface is divided into multiple detection areas, and the multiple detection areas are detected respectively to obtain the position of at least one workpiece on the processing surface.

11. The processing operation method of the processing apparatus according to claim 10, characterized in that, Each detection area overlaps with the area of ​​each processing area on the processing surface.

12. The processing operation method of the processing apparatus according to claim 1, characterized in that, The processing device is a laser device, and the processing operation is a component removal operation.

13. A processing system, characterized in that, The processing system is used to process an object, the object having a processing surface, and includes: The calculation unit is used to divide the processing surface into multiple processing regions, wherein each processing region has m×n sub-regions, where m+n>2, and m and n are positive integers. Each processing region has at least one workpiece, and the intersection of the multiple processing regions is an empty set. The calculation unit is further used to perform path calculation based on at least one workpiece in each processing region to generate a processing path for each processing region, wherein the processing paths of the multiple processing regions are different from each other. Processing equipment; and The control unit controls the processing device to perform processing operations according to the processing path of one of the plurality of processing areas calculated by the calculation unit. The processing device sequentially performs path calculations on the m×n sub-regions of each processing area, sets the first workpiece in the m×n sub-regions as the first workpiece to be processed on the processing path, and generates the processing path for the processing device to process the plurality of workpieces in the processing area. At least one sub-region in the m×n sub-regions is correspondingly configured with workpieces to be processed and components not to be processed. After the processing device completes the processing of all workpieces in one of the plurality of processing areas, the control unit controls the processing device to move to the processing path of the next processing area to perform processing operations.

14. The processing system according to claim 13, characterized in that, It also includes a detection unit for performing detection on the machined surface to obtain the position of the at least one workpiece on the machined surface.

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