A headset

Abstract

The present application provides an earphone, which relates to the technical field of electronic equipment. The earphone includes an in-ear portion and a rod portion, and the in-ear portion and the rod portion are connected. Among them, an antenna is provided in the earphone, and the wireless signal radiated by the antenna can be received by an external terminal device, thereby realizing the interaction between the earphone and the external terminal device. Since metal can block the transmission of wireless signals, in the present application, a first metal layer can be provided on the side of the in-ear portion facing the human ear. The provision of the first metal layer can effectively reduce the wireless signal radiated by the antenna from entering the human body, thereby effectively improving the radiation performance of the antenna of the earphone.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a headset. Background Art

[0002] Wireless audio devices have become a rapidly developing product among wearable devices, among which the development of true wireless stereo (TWS) devices is the most prominent.

[0003] TWS can usually include an in-ear part and a rod part, wherein the in-ear part can be worn in the human ear to realize the wearing of the entire TWS on the human body, and the rod part can usually be used to set a microphone or charging contacts. At present, the antenna layout schemes of TWS can generally be divided into two categories, one is arranged on the rod part, and the other is arranged at the end of the rod part close to the in-ear part. If you want to further improve the antenna performance based on the above two antenna layout methods, you need to increase the antenna clearance area to provide better radiation conditions for the antenna. However, this will increase the size of the headset, affect the appearance of the TWS, and affect the user experience.

[0004] Based on this, how to meet the antenna radiation performance of TWS without affecting its appearance has become a difficult problem that technicians in this field need to solve urgently. Summary of the invention

[0005] The present application provides an earphone, the radiation performance of the antenna of the earphone is improved, and the appearance of the earphone is better.

[0006] The earphone provided in the present application includes an in-ear portion and a rod portion, and the in-ear portion and the rod portion are connected. The in-ear portion can be inserted into the human ear to enable the earphone to be worn on the human ear. In the present application, the earphone is provided with an antenna, and the earphone can realize wireless communication between it and an external terminal device through the wireless signal radiated by the antenna. However, when the earphone is worn on the human ear, part of the wireless signal radiated by its antenna will enter the human body, thereby causing the radiation performance of the antenna of the earphone to deteriorate. In response to this problem, the in-ear portion of the earphone provided in the present application is provided with a first metal layer on the side facing the human ear, and the first metal layer can block the radiation of the wireless signal of the antenna toward the human body, thereby reducing the wireless signal radiated by the antenna from entering the human body, so that the radiation performance of the antenna can be improved.

[0007] The specific arrangement of the first metal layer in the ear inlet is not limited. In a possible implementation of the present application, the ear inlet may also be provided with a sound outlet hole, and the first metal layer may be arranged around the sound outlet hole.

[0008] In addition, in the present application, the area of ​​the first metal layer on the side of the ear inlet facing the human ear is not limited, and it can be adjusted according to the total area of ​​the ear inlet. For example, the coverage area of ​​the first metal layer on the side of the ear inlet facing the human ear can be greater than or equal to 80% of the total area of ​​the ear inlet on that side. The first metal layer has a larger coverage area on that side of the ear inlet, which can effectively block the signal radiated by the antenna, thereby effectively reducing the wireless signal radiated by the antenna from entering the human body, so as to achieve the purpose of improving the radiation performance of the earphone antenna.

[0009] Typically, the antenna of the earphone can be arranged on the stem of the earphone, exemplarily arranged at the end of the stem close to the ear, so as to facilitate the radiation of the antenna signal. In a possible implementation of the present application, a second metal layer can be arranged on the side of the stem facing the human ear, and the second metal layer can block the radiation of the wireless signal of the antenna toward the human body, thereby reducing the wireless signal radiated by the antenna from entering the human body, which is conducive to improving the radiation performance of the antenna.

[0010] In the present application, when a first metal layer is provided on the side of the in-ear portion facing the human ear, and a second metal layer is provided on the side of the stem portion facing the human ear, the second metal layer and the first metal layer can be connected to each other so that the first metal layer and the second metal layer are formed through one process, thereby simplifying the formation process of the first metal layer and the second metal layer.

[0011] In addition, there may be a certain gap between the first metal layer and the second metal layer, and the gap may be greater than or equal to 0.01 mm, and may be 0.5 mm, 1 mm, 1.3 mm or 2 mm, etc. In this implementation of the present application, the first metal layer and the second metal layer may be formed separately to improve the flexibility of the process for forming the first metal layer and the second metal layer.

[0012] In some application scenarios, the first metal layer needs to be grounded, but the connection between the first metal layer and the ground will affect the OTA performance of the antenna in the headset. Since the inductor has high-frequency impedance electrical properties, that is, the higher the frequency, the greater the impedance it produces, the inductor can block the antenna current. In a possible implementation of the present application, a first inductor is arranged between the first metal layer and the grounding point, the first metal layer is connected in series with the first inductor, and the first metal layer is electrically connected to the grounding point through the first inductor. Among them, the inductance value of the first inductor may be greater than or equal to 10nH, and exemplarily, it may be 15nH, 18nH or 22nH. In this way, the first metal layer can be made into a suspended metal, thereby minimizing the impact of the grounding of the first metal layer on the OTA performance of the antenna of the headset, and even allowing the wireless signal radiated by the antenna of the headset to be radiated out through the first metal layer for a second time, so as to solve the shielding problem caused by the grounding of the first metal layer shielding the antenna radiation.

[0013] Similarly, in some possible embodiments of the present application, a second inductor is provided between the second metal layer and the grounding point, the second metal layer is connected in series with the second inductor, and the second metal layer is electrically connected to the grounding point through the second inductor. The inductance value of the second inductor may be greater than or equal to 10nH, and may be 15nH, 18nH or 22nH, for example. In this way, the second metal layer can be made into a suspended metal, thereby minimizing the influence of the grounding of the second metal layer on the OTA performance of the antenna of the headset, and even allowing the wireless signal radiated by the antenna of the headset to be radiated out through the second metal layer for a second time, so as to solve the shielding problem caused by the grounding of the second metal layer shielding the antenna radiation.

[0014] It is understandable that after the formation process of the first metal layer of the in-ear part and the second metal layer of the stem part is completed, in order to avoid the first metal layer and the second metal layer being exposed to the outside and affecting the appearance of the earphone, in a possible implementation of the present application, an appearance surface layer structure can also be provided on the first metal layer and the second metal layer. In specific implementation, a spray painting process can be used to spray paint the surfaces of the first metal layer and the second metal layer to cover the first metal layer and the second metal layer. Thereby, the earphone has a relatively complete and integrated appearance surface to meet the appearance aesthetic requirements of the earphone and enhance the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A structural schematic diagram of an existing headset is provided for an embodiment of the present application;

[0016] Figure 2a and Figure 2b A schematic diagram of the structure of an earphone provided at different angles according to an embodiment of the present application;

[0017] Figure 2c A schematic diagram of the structure of an earphone provided in another embodiment of the present application;

[0018] Figure 3a and Figure 3b A schematic diagram of the structure of an earphone at different angles provided by another embodiment of the present application;

[0019] Figure 3c A schematic diagram of the structure of an earphone provided in another embodiment of the present application;

[0020] Figure 4 A schematic diagram of the structure of an earphone provided in another embodiment of the present application;

[0021] Figure 5 A schematic diagram of an OTA performance test of an earphone without a metal layer provided in an embodiment of the present application when worn on an ear head mold;

[0022] Figure 6A schematic diagram of an OTA performance test of an earphone provided with a metal layer when worn on an ear head mold provided in an embodiment of the present application.

[0023] Reference numerals:

[0024] 1-earphone; 101-ear inlet; 1011-first metal layer; 102-stem; 1021-second metal layer; 103-sound outlet;

[0025] 104-gap; 2-head mold with ears. DETAILED DESCRIPTION

[0026] In order to facilitate the understanding of the headphones provided in the embodiments of the present application, the application scenarios thereof are first described below. At present, wireless audio devices are gradually developing and maturing, among which the development of true wireless stereo devices (true wireless stereo, TWS) is the most prominent. Wireless audio devices may be headphones, for example, which integrate key components such as antennas, processor chips, batteries, microphones, speakers, wearing sensors, and control sensors, so that audio data can be transmitted with external terminal devices such as mobile phones through their own wireless communication functions. Since wireless audio devices have the advantages of being portable and capable of wireless communication, coupled with the continuous maturity of wireless Bluetooth transmission technology, the user experience is gradually improved, and in the future they will become an indispensable portable device in the lives of users.

[0027] Reference Figure 1 , Figure 1 The schematic diagram of the structure of an existing headset provided by a possible embodiment of the present application is shown. The headset 1 may include an in-ear portion 101 and a stem portion 102 connected to each other, wherein the headset 1 can be inserted into a human ear through the in-ear portion 101 to achieve wearing. Components such as a speaker and a wearing sensor may be arranged in the in-ear portion 101, so that it is convenient for the human ear to listen to the audio data received by the headset 1, and the wearing state of the headset 1 in the human ear may be detected. Components such as a battery, a microphone or a control sensor may be arranged in the stem portion 102. In addition, a charging contact may be arranged in the stem portion 102, and the battery may be charged through the charging contact. The amount of audio output by the user may be input into the headset 1 through the microphone, and transmitted to an external terminal device connected thereto through the headset 1. The setting of the control sensor may realize the control of the working state of the headset 1 by applying a control action such as a gesture to the stem portion 102.

[0028] At present, the antenna of the earphone 1 is usually arranged at the end of the rod 102 close to the ear inlet 101, and some are arranged at the ear inlet 101. Since the wireless signal radiated by the antenna is an electromagnetic wave, when the earphone 1 is worn on the human ear, part of the wireless signal radiated by the antenna will enter the human body, thereby deteriorating the radiation performance of the antenna of the earphone 1.

[0029] The earphone 1 provided in the present application is intended to solve the above-mentioned problem by providing a metal layer on the side of the earphone 1 facing the human body to reduce the radiation of the antenna's wireless signal toward the human body, thereby improving the radiation performance of the antenna.

[0030] In order to make the objectives, technical solutions and advantages of the present application more clear, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0031] The terms used in the following embodiments are only for the purpose of describing specific embodiments, and are not intended to be used as limitations on the present application. As used in the specification and the appended claims of the present application, the singular expressions "one", "a kind of", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context. It should also be understood that in the following embodiments of the present application, "at least one", "one or more" refer to one, two or more. The term "and / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist; for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship.

[0032] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0033] Reference Figure 2a , Figure 2a A schematic diagram of the structure of an earphone 1 provided for a possible embodiment of the present application. In the present application, for the convenience of description, when the earphone 1 is worn on a human ear, the side of the earphone 1 facing the human body is referred to as the inner side of the earphone 1, and the side of the earphone 1 facing away from the human body is referred to as the outer side of the earphone 1. Based on this, the side of a local structure of the earphone 1 (such as the ear inlet 101 or the stem 102) facing the human body is referred to as the inner side of the local structure, and the side facing away from the human body is referred to as the outer side of the local structure.

[0034] Reference Figure 2b , Figure 2b for Figure 2a A schematic diagram of the structure of the earphone 1 at another angle is shown in FIG. Figure 2a and Figure 2b In the illustrated embodiment, a first metal layer 1011 is provided in the ear inlet 101 of the earphone 1, and the first metal layer 1011 can be provided on the inner side of the ear inlet 101. The material of the first metal layer 1011 can be, but is not limited to, pure metals such as copper and aluminum, or alloys such as copper alloys and aluminum alloys. In addition, in the present application, the specific location of the first metal layer 1011 on the inner side of the ear inlet 101 is not limited, and it can be adjusted according to the structure of the inner side of the ear inlet 101. Exemplarily, a sound outlet 103 is provided in the ear inlet 101, and the first metal layer 1011 can be provided around the sound outlet 103. In the present application, the specific shape of the first metal layer 1011 is not limited, and for example, it can be a regular shape such as a rectangle, an ellipse or a circle, or it can be some possible irregular shapes. In addition, the first metal layer 1011 of the ear inlet 101 can be provided as Figure 2a and Figure 2b The continuous graph shown can also be Figure 2c The discontinuous pattern shown can be used as long as it can block the wireless signal radiated by the antenna toward the human body to the greatest extent.

[0035] In addition, in the present application, the coverage area of ​​the first metal layer 1011 on the inner side of the ear inlet 101 is not limited, and it can be set according to the total area of ​​the inner side of the ear inlet 101. For example, the coverage area of ​​the first metal layer 1011 on the inner side of the ear inlet 101 can be greater than or equal to 80% of the total area of ​​the inner side of the ear inlet 101.

[0036] In the present application, the first metal layer 1011 can be formed by, but is not limited to, a laser engraving and chemical plating process. In a specific implementation, a laser engraving trace can be first formed on the main surface of the in-ear part 101, and then the trace is chemically plated to form a metal layer. It is understandable that after the formation process of the first metal layer 1011 of the in-ear part 101 is completed, in order to avoid the first metal layer 1011 being exposed to the outside, affecting the appearance of the earphone 1. In a possible embodiment of the present application, an appearance surface layer structure can also be set on the first metal layer 1011. In a specific implementation, a painting process can be used to spray paint the surface of the first metal layer 1011 to cover the first metal layer 1011. Thereby, the earphone 1 has a relatively complete and integrated appearance surface to meet the appearance aesthetic requirements of the earphone 1 and enhance the user experience.

[0037] In the present application, since the setting of the first metal layer 1011 has a certain blocking effect on the radiation of the wireless signal of the antenna, in the present application Figure 2a to Figure 2cIn the illustrated embodiment, by providing a first metal layer 1011 with a relatively large area on the inner side of the ear inlet 101 of the earphone 1, the wireless signal radiated by the antenna can be effectively reduced from entering the human body, thereby effectively improving the radiation performance of the antenna of the earphone 1.

[0038] Generally, the connection of the first metal layer 1011 to the ground will affect the over the air (OTA) performance of the antenna in the headset 1. Therefore, in some embodiments of the present application, the first metal layer 1011 may not be grounded. However, in some application scenarios, the first metal layer 1011 needs to be connected to the ground. In this case, the influence on the OTA performance of the antenna in the headset 1 can be reduced by selecting an appropriate grounding point. The following will specifically describe how to ground the first metal layer 1011.

[0039] In addition, since the inductor has high-frequency impedance, that is, the higher the frequency, the greater the impedance it generates, the inductor can block the antenna current. In a possible embodiment of the present application, when the first metal layer 1011 is connected to the ground point, a first inductor ( Figure 2a to Figure 2c (not shown), the first metal layer 1011 is connected in series with the first inductor, and the first metal layer 1011 is electrically connected to the ground point through the first inductor. Among them, the inductance value of the first inductor may be greater than or equal to 10nH, and illustratively, may be 15nH, 18nH or 22nH. In addition, the first metal layer 1011 and the first inductor, and the first inductor and the ground point may be connected by, but not limited to, a spring or a pogo pin. In this embodiment of the present application, by connecting the first metal layer 1011 to the ground point through the first inductor, the first metal layer 1011 can be made into a suspended metal, thereby minimizing the impact of the grounding of the first metal layer 1011 on the OTA performance of the antenna of the headset 1, and even allowing the wireless signal radiated by the antenna of the headset 1 to be radiated out through the first metal layer 1011 for a second time, so as to solve the shielding problem caused by the grounding of the first metal layer 1011 shielding the antenna radiation.

[0040] Reference Figure 3a , Figure 3a A schematic diagram of the structure of an earphone 1 provided in another possible embodiment of the present invention. In this embodiment, in addition to the first metal layer 1011 being provided on the earphone inlet 101, a second metal layer 1021 may be provided on the stem 102 of the earphone 1. The specific arrangement of the first metal layer 1011 of the earphone inlet 101 of this embodiment may be the same as that of the above-mentioned Figure 2a , Figure 2b and Figure 2cSimilar to the embodiment in, in specific implementation, the first metal layer 1011 can be arranged on the inner side of the ear inlet 101, and the material of the first metal layer 1011 can be, but not limited to, pure metals such as copper and aluminum, or alloys such as copper alloy and aluminum alloy. In addition, in the present application, the specific setting position of the first metal layer 1011 on the inner side of the ear inlet 101 is not limited, and it can be adjusted according to the structure of the inner side of the ear inlet 101. Exemplarily, if a sound outlet hole 103 is provided in the ear inlet 101, the first metal layer 1011 can be arranged around the sound outlet hole 103. In the present application, the coverage area of ​​the first metal layer 1011 on the inner side of the ear inlet 101 is not limited, and it can be arranged according to the total area of ​​the inner side of the ear inlet 101. For example, the coverage area of ​​the first metal layer 1011 on the inner side of the ear inlet 101 can be greater than or equal to 80% of the total area of ​​the inner side of the ear inlet 101.

[0041] Please refer to Figure 3b , Figure 3b for Figure 3a A schematic diagram of the structure from another angle. The second metal layer 1021 of the stem 102 of the earphone 1 can be arranged on the inner side of the stem 102, and the material of the second metal layer 1021 can be, but is not limited to, pure metals such as copper and aluminum, or alloys such as copper alloys and aluminum alloys. It can be understood that in the present application, the materials of the first metal layer 1011 arranged on the in-ear portion 101 and the second metal layer 1021 arranged on the stem 102 can be the same or different, and are not specifically limited in the present application. In addition, the specific setting position of the second metal layer 1021 on the stem 102 is not limited, and it can be arranged according to the area of ​​the inner side of the stem 102 to effectively block the wireless signal radiated by the antenna. In the present application, the specific shape of the second metal layer 1021 of the stem 102 is not limited. For example, it can be a regular shape such as a rectangle, an ellipse, a trapezoid or a parallelogram, or it can be some possible irregular shapes.

[0042] In the present application, the first metal layer 1011 of the ear inlet 101 and the second metal layer 1021 of the stem 102 may be Figure 3a and Figure 3b The continuous graph shown can also be Figure 3c The discontinuous pattern shown is sufficient as long as it can minimize the amount of wireless signals radiated by the antenna entering the human body.

[0043] exist Figure 3a to Figure 3cIn the illustrated embodiment, a first metal layer 1011 disposed on the ear inlet portion 101 of the earphone 1 is connected to a second metal layer 1021 disposed on the stem portion 102. When the first metal layer 1011 of the ear inlet portion 101 and the second metal layer 1021 of the stem portion 102 are made of the same material, the first metal layer 1011 of the ear inlet portion 101 and the second metal layer 1021 of the stem portion 102 can be obtained by the same process, which can effectively simplify the molding process of the two metal layers.

[0044] exist Figure 3a to Figure 3c In the illustrated embodiment, the first metal layer 1011 of the in-ear portion 101 and the second metal layer 1021 of the stem portion 102 can be formed by, but not limited to, laser engraving and chemical plating processes. In a specific implementation, laser engraving traces can be formed on the body surfaces of the in-ear portion 101 and the stem portion 102, respectively, and then the traces are chemically plated to form corresponding metal layers. It can be understood that after the formation process of the first metal layer 1011 of the in-ear portion 101 and the second metal layer 1021 of the stem portion 102 is completed, in order to avoid the first metal layer 1011 and the second metal layer 1021 being exposed to the outside, affecting the appearance of the earphone 1. In a possible embodiment of the present application, an appearance surface layer structure can also be provided on the first metal layer 1011 and the second metal layer 1021. In a specific implementation, a spray painting process can be used to spray paint the surfaces of the first metal layer 1011 and the second metal layer 1021 to cover the first metal layer 1011 and the second metal layer 1021. Thereby, the earphone 1 has a relatively complete and integrated appearance, so as to meet the aesthetic requirements of the earphone 1 and enhance the user experience.

[0045] In the present application, since the arrangement of the first metal layer 1011 and the second metal layer 1021 has a certain blocking effect on the radiation of the wireless signal of the antenna, in the present application Figure 3a to Figure 3c In the illustrated embodiment, by providing a first metal layer 1011 with a relatively large area on the inner side of the ear inlet portion 101 of the earphone 1, and providing a second metal layer 1021 with a relatively large area on the inner side of the stem portion 102 of the earphone 1, the wireless signal radiated by the antenna can be effectively reduced from entering the human body, thereby effectively improving the radiation performance of the antenna of the earphone 1.

[0046] Generally, the connection of the first metal layer 1011 and the second metal layer 1021 to the ground may affect the over the air (OTA) performance of the antenna in the earphone 1. Therefore, in some embodiments of the present application, the first metal layer 1011 and the second metal layer 1021 may not be grounded. However, in some scenarios where the first metal layer 1011 needs to be connected to the ground, the influence on the OTA performance of the antenna in the earphone 1 can be reduced by selecting an appropriate grounding point. The following will specifically describe how to ground the first metal layer 1011 and the second metal layer 1021.

[0047] In addition, since the inductor has high-frequency impedance, that is, the higher the frequency, the greater the impedance it generates, the inductor can block the antenna current. Therefore, in a possible embodiment of the present application, when the first metal layer 1011 is connected to the ground point, a first inductor ( Figure 3a to Figure 3c (not shown), the first metal layer 1011 is connected in series with the first inductor, and the first metal layer 1011 is electrically connected to the ground point through the first inductor. The inductance value of the first inductor may be greater than or equal to 10nH, and may be 15nH, 18nH or 22nH, for example. In addition, the first metal layer 1011 and the first inductor, and the first inductor and the ground point may be connected, but not limited to, via a spring or a pogo pin. In addition, a second inductor ( Figure 3a to Figure 3c The second metal layer 1021 is connected in series with the second inductor, and the second metal layer 1021 is electrically connected to the ground point through the second inductor. The inductance value of the second inductor may be greater than or equal to 10nH, and may be 15nH, 18nH or 22nH, for example. In addition, the second metal layer 1021 and the second inductor, and the second inductor and the ground point may be connected, but not limited to, through a spring or a pogo pin. In this embodiment of the present application, by connecting the first metal layer 1011 to the ground point through the first inductor and connecting the second metal layer 1021 to the ground point through the second inductor, the first metal layer 1011 and the second metal layer 1021 can be made into suspended metals, thereby minimizing the impact of the grounding of the first metal layer 1011 and the second metal layer 1021 on the OTA performance of the antenna of the earphone 1, and even allowing the wireless signal radiated by the antenna of the earphone 1 to be radiated out for a second time through the first metal layer 1011 and the second metal layer 1021, so as to solve the shielding problem caused by the grounding of the first metal layer 1011 and the second metal layer 1021 shielding the antenna radiation.

[0048] Reference Figure 4 , Figure 4The schematic diagram of the structure of the earphone 1 provided by another possible embodiment of the present application is shown. In this embodiment, the ear inlet 101 of the earphone 1 is provided with a first metal layer 1011, and in addition, the stem 102 of the earphone 1 may be provided with a second metal layer 1021. Among them, the specific arrangement of the first metal layer 1011 of the ear inlet 101 of the earphone 1 of this embodiment may be similar to the above-mentioned embodiment. In specific implementation, the first metal layer 1011 may be provided on the inner side of the ear inlet 101, and the material of the first metal layer 1011 may be, but not limited to, pure metals such as copper and aluminum, or alloys such as copper alloys and aluminum alloys. In addition, in the present application, the specific arrangement position of the first metal layer 1011 on the inner side of the ear inlet 101 is not limited, and it can be adjusted according to the structure of the inner side of the ear inlet 101. Exemplarily, a sound outlet 103 is provided in the ear inlet 101, and the first metal layer 1011 may be provided around the sound outlet 103. In the present application, the coverage area of ​​the first metal layer 1011 on the inner side of the ear inlet 101 is not limited, and it can be set according to the total area of ​​the inner side of the ear inlet 101. For example, the coverage area of ​​the first metal layer 1011 on the inner side of the ear inlet 101 can be greater than or equal to 80% of the total area of ​​the inner side of the ear inlet 101.

[0049] You can continue to refer to Figure 4 , the second metal layer 1021 of the stem 102 of the earphone 1 can be arranged on the inner side of the stem 102, and the material of the second metal layer 1021 can be, but is not limited to, pure metals such as copper and aluminum, or alloys such as copper alloys and aluminum alloys. It can be understood that in the present application, the materials of the first metal layer 1011 arranged on the in-ear portion 101 and the second metal layer 1021 arranged on the stem 102 can be the same or different, and are not specifically limited in the present application. In addition, the specific setting position of the second metal layer 1021 on the stem 102 is not limited, and it can be set according to the area of ​​the inner side of the stem 102 to effectively block the wireless signal radiated by the antenna. In the present application, the specific shape of the second metal layer 1021 of the stem 102 is not limited. For example, it can be a regular shape such as a rectangle, an ellipse, a trapezoid or a parallelogram, or it can be some possible irregular shapes.

[0050] In the present application, the first metal layer 1011 of the ear inlet 101 and the second metal layer 1021 of the stem 102 may be Figure 4 The continuous graph shown can also be referred to Figure 3c Set it to a discontinuous pattern as long as it can cover the antenna at the corresponding position to the greatest extent.

[0051] Figure 4 The earphone 1 of the embodiment shown is Figure 3a to Figure 3c The earphone 1 of the embodiment shown is different in that: Figure 4In the illustrated embodiment, the first metal layer 1011 disposed on the ear inlet 101 of the earphone 1 and the second metal layer 1021 disposed on the stem 102 are arranged at intervals, and there is a certain gap 104 between the first metal layer 1011 of the ear inlet 101 and the second metal layer 1021 of the stem 102, and the size of the gap 104 can be set according to the specific application scenario. In a possible embodiment of the present application, the gap 104 may be greater than or equal to 0.01 mm, and may be 0.5 mm, 1 mm, 1.3 mm or 2 mm, etc. In addition, the gap 104 may be set on the ear inlet 101, or may be set on the stem 102.

[0052] In a possible embodiment of the present application, when the first metal layer 1011 of the ear inlet 101 and the second metal layer 1021 of the rod 102 are made of the same material, the first metal layer 1011 of the ear inlet 101 and the second metal layer 1021 of the rod 102 can be obtained by the same processing, which can effectively simplify the forming process of the two metal layers.

[0053] exist Figure 4 In the illustrated embodiment, the first metal layer 1011 of the in-ear portion 101 and the second metal layer 1021 of the stem portion 102 can be formed by, but not limited to, laser engraving and chemical plating processes. In a specific implementation, laser engraving traces can be formed on the body surfaces of the in-ear portion 101 and the stem portion 102, respectively, and then the traces are chemically plated to form corresponding metal layers. It can be understood that after the formation process of the first metal layer 1011 of the in-ear portion 101 and the second metal layer 1021 of the stem portion 102 is completed, in order to avoid the first metal layer 1011 and the second metal layer 1021 being exposed to the outside, affecting the appearance of the earphone 1. In a possible embodiment of the present application, an appearance surface layer structure can also be provided on the first metal layer 1011 and the second metal layer 1021. In a specific implementation, a spray painting process can be used to spray paint the surfaces of the first metal layer 1011 and the second metal layer 1021 to cover the first metal layer 1011 and the second metal layer 1021. Thereby, the earphone 1 has a relatively complete and integrated appearance, so as to meet the aesthetic requirements of the earphone 1 and enhance the user experience.

[0054] In the present application, since the arrangement of the first metal layer 1011 and the second metal layer 1021 has a certain blocking effect on the radiation of the wireless signal of the antenna, in the present application Figure 4 In the illustrated embodiment, by providing a first metal layer 1011 with a relatively large area on the inner side of the ear inlet portion 101 of the earphone 1, and providing a second metal layer 1021 with a relatively large area on the inner side of the stem portion 102 of the earphone 1, the wireless signal radiated by the antenna can be effectively reduced from entering the human body, thereby effectively improving the radiation performance of the antenna of the earphone 1.

[0055] Generally, the connection of the first metal layer 1011 and the second metal layer 1021 to the ground will affect the over the air (OTA) performance of the antenna in the earphone 1. Therefore, in some embodiments of the present application, the first metal layer 1011 and the second metal layer 1021 may not be grounded. However, in some scenarios where the first metal layer 1011 needs to be connected to the ground, the influence on the OTA performance of the antenna in the earphone 1 can be reduced by selecting an appropriate grounding point.

[0056] In addition, since the inductor has high-frequency impedance, that is, the higher the frequency, the greater the impedance it generates, the inductor can block the antenna current. In a possible embodiment of the present application, when the first metal layer 1011 is connected to the ground point, a first inductor (not shown in the figure) can be set between the first metal layer 1011 and the ground point, the first metal layer 1011 is connected in series with the first inductor, and the first metal layer 1011 is electrically connected to the ground point through the first inductor. In addition, a second inductor ( Figure 4 (not shown), the second metal layer 1021 is connected in series with the second inductor, and the second metal layer 1021 is electrically connected to the ground point through the second inductor. Figure 4 In the embodiment shown, the first inductor and the second inductor can refer to the above Figure 3a to Figure 3c The configuration of the first inductor and the second inductor in the illustrated embodiment is described above and will not be described in detail here.

[0057] In this embodiment of the present application, by connecting the first metal layer 1011 to the ground point through the first inductor and connecting the second metal layer 1021 to the ground point through the second inductor, the first metal layer 1011 and the second metal layer 1021 can be made into suspended metals, thereby minimizing the impact of the grounding of the first metal layer 1011 and the second metal layer 1021 on the OTA performance of the antenna of the earphone 1, and even allowing the wireless signal radiated by the antenna of the earphone 1 to be radiated out for a second time through the first metal layer 1011 and the second metal layer 1021, so as to solve the shielding problem caused by the grounding of the first metal layer 1011 and the second metal layer 1021 shielding the antenna radiation.

[0058] After understanding the structure of the earphone 1 provided by the present application, the OTA performance of the earphone 1 provided by each embodiment of the present application in different application scenarios is described below. Referring to Table 1, Table 1 shows the results obtained after testing the OTA performance of four earphone 1 samples in different application scenarios on the 0th channel of Bluetooth (corresponding to the frequency point of 2.402GHz), the 39th channel (corresponding to the frequency point of 2.441GHz) and the 78th channel (corresponding to the frequency point of 2.48GHz). In Table 1, the total radiated power (TRP) and the total isotropic sensitivity (TIS) of each sample are shown. Generally, TRP can be obtained by performing surface integration and averaging of the radiation power of the entire radiation sphere. It reflects the radiation power of the entire earphone 1, which is related to the radiation power and antenna radiation performance of the earphone 1 in the conduction state. TIS can reflect the reception sensitivity index of the entire radiation sphere earphone 1. It reflects the reception sensitivity of the entire earphone 1, which is related to the conduction sensitivity and antenna radiation performance of the earphone 1. In the present application, the units of TRP and TIS are both dB (decibel). In order to make Table 1 concise, only the corresponding data are shown in Table 1, and the units are omitted.

[0059] In Table 1, the first set of data is the result of OTA performance test of sample 1 in different application scenarios, and the sample 1 includes earphone 1 without metal layer in the in-ear part 101 and the stem part 102. Sample 1A is the OTA performance of earphone 1 of sample 1 when placed in free space; Sample 1B is the OTA performance of earphone 1 when earphone 1 of sample 1 is worn on a head mold without ear (CTIA head); Sample 1C is the OTA performance of earphone 1 when earphone 1 of sample 1 is worn on a head mold with ear 2 (ear head); Sample 1D is the drop of ear mold without ear when earphone 1 of sample 1 is worn on the head mold without ear; Sample 1E is the drop of ear mold with ear when earphone 1 of sample 1 is worn on the head mold with ear 2.

[0060] In addition, please refer to Figure 5 , Figure 5 The schematic diagram of the structure of the earphone 1 of sample 1 being worn on the ear-mounted head mold 2 is shown. Figure 5 The wavy lines in the head mold 2 with ears indicate that the wireless signals radiated by the antenna enter the head mold 2 with ears. The more wavy lines there are, the more electromagnetic waves enter the head mold 2 with ears.

[0061] The second set of data is the results of OTA performance testing of sample 2 in different application scenarios, where sample 2 includes Figure 2a and Figure 2bFor the earphone 1 in the illustrated embodiment, Sample 2A is the OTA performance of the earphone 1 of Sample 2 when placed in free space; Sample 2B is the OTA performance of the earphone 1 of Sample 2 when worn on a head mold without ears; Sample 2C is the OTA performance of the earphone 1 of Sample 2 when worn on a head mold with ears; Sample 2D is the amplitude reduction of the head mold without ears when the earphone 1 of Sample 2 is worn on the head mold without ears; Sample 2E is the amplitude reduction of the head mold with ears when the earphone 1 of Sample 2 is worn on the head mold with ears.

[0062] The third set of data is the results of OTA performance testing of sample 3 in different application scenarios, where sample 3 includes Figure 3a and Figure 3b For the earphone 1 in the illustrated embodiment, Sample 3A is the OTA performance of the earphone 1 of Sample 3 when placed in a free space; Sample 3B is the OTA performance of the earphone 1 of Sample 3 when worn on a head mold without ears; Sample 3C is the OTA performance of the earphone 1 of Sample 3 when worn on a head mold with ears 2; Sample 3D is the amplitude reduction of the head mold without ears when the earphone 1 of Sample 3 is worn on the head mold without ears; Sample 3E is the amplitude reduction of the head mold with ears when the earphone 1 of Sample 3 is worn on the head mold with ears 2.

[0063] The fourth set of data is the result of OTA performance testing of sample 4 in different application scenarios, where sample 4 includes Figure 4 For the earphone 1 in the illustrated embodiment, sample 4A is the OTA performance of the earphone 1 of sample 4 when placed in free space; sample 4B is the OTA performance of the earphone 1 of sample 4 when worn on a head mold without ears; sample 4C is the OTA performance of the earphone 1 of sample 4 when worn on a head mold with ears 2; sample 4D is the amplitude reduction of the head mold without ears when the earphone 1 of sample 4 is worn on the head mold without ears; sample 4E is the amplitude reduction of the head mold with ears when the earphone 1 of sample 4 is worn on the head mold with ears 2.

[0064] In addition, please refer to Figure 6 , Figure 6 A structural schematic diagram of the earphone 1 of sample 4 being worn on the ear-mounted head mold 2 is shown. Figure 6 The wavy lines in the head mold 2 with ears indicate that the wireless signals radiated by the antenna enter the head mold 2 with ears. The more wavy lines there are, the more electromagnetic waves enter the head mold 2 with ears.

[0065] Table 1

[0066]

[0067]

[0068] Because the human body usually has the greatest impact on the radiation performance of the antenna of the earphone 1 when the earphone 1 is worn on the human ear, in this application, only the OTA performance of the four samples when worn on the ear head mold 2 can be discussed. By comparing the OTA performance of the four samples in Table 1 when worn on the ear head mold 2, it can be found that the average TIS value of sample two (-80.6dB) is 0.7dB higher than the average TIS value of sample one (-79.9dB); the average TIS value of sample three (-81.1dB) is 1.2dB higher than the average TIS value of sample one (-79.9dB); the average TIS value of sample four (-81.4dB) is 1.5dB higher than the average TIS value of sample one (-79.9dB). In addition, by comparing the OTA performance of the four samples in Table 1 when worn on the ear head mold 2, it can be found that the average TIS value of sample two (-80.6dB) is 0.7dB higher than the average TIS value of sample one (-79.9dB); the average TIS value of sample four (-81.4dB) is 1.5dB higher than the average TIS value of sample one (-79.9dB). Figure 5 and Figure 6 It can be understood from the comparison that the earphone 1 provided in the present application can reduce the amount of wireless signals radiated by the antenna entering the ear-mounted head mold 2.

[0069] Therefore, by using the earphone 1 provided by the present application, by setting the first metal layer 1011 on the inner side of the ear inlet 101 of the earphone 1, or by setting the first metal layer 1011 on the inner side of the ear inlet 101 and setting the second metal layer 1021 on the inner side of the rod 102, it is possible to reduce the amount of wireless signals radiated by the antenna from entering the human body, thereby effectively improving the OTA performance of the earphone 1. In addition, by using the solution of the present application, there is no need to change the design of the original antenna, and there is no need to increase the clearance area of ​​the antenna, and the implementation method is relatively simple.

[0070] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An earphone worn on a human ear, characterized in that: It comprises an ear inlet portion and a rod portion, wherein the ear inlet portion and the rod portion are connected, wherein: a first metal layer is provided on a side of the ear inlet portion facing the human ear; The first metal layer is a pure metal layer; The ear inlet is provided with a sound outlet hole, and the first metal layer is arranged around the sound outlet hole; The earphone has a grounding point, a first inductor is arranged between the first metal layer and the grounding point, the first metal layer is connected in series with the first inductor, and the first metal layer is connected to the grounding point through the first inductor; The earphone also includes an antenna, which is arranged at the end of the rod portion close to the ear inlet portion.

2. The earphone according to claim 1, characterized in that The coverage area of ​​the first metal layer on the side of the ear inlet facing the human ear is greater than or equal to 80% of the total area of ​​the side of the ear inlet facing the human ear.

3. The earphone according to claim 1 or 2, characterized in that: A second metal layer is provided on a side of the rod portion facing the human ear.

4. The earphone according to claim 3, characterized in that: The first metal layer and the second metal layer are connected to each other; or, there is a gap between the first metal layer and the second metal layer.

5. The earphone according to claim 1, characterized in that The inductance value of the first inductor is greater than or equal to 10 nH.

6. The earphone according to claim 3, characterized in that: The earphone has a grounding point, a second inductor is arranged between the second metal layer and the grounding point, the second metal layer and the second inductor are connected in series, and the second metal layer is connected to the grounding point through the second inductor.

7. The earphone according to claim 6, characterized in that The inductance value of the second inductor is greater than or equal to 10 nH.

8. The earphone according to claim 3, characterized in that: The surfaces of the first metal layer and the second metal layer are further provided with an appearance layer structure, and the appearance layer structure is used to cover the first metal layer and the second metal layer.

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