A method for packaging a laser light source based on silicon nitride ceramics

Abstract

The application discloses a laser light source packaging method based on silicon nitride ceramics and relates to the technical field of laser light source packaging.The laser light source packaging method is composed of silicon nitride ceramics, a laser chip, silver powder resin glue, aluminum oxide, epoxy resin and N-methyl pyrrolidone raw materials.The light source packaging steps are as follows: firstly, the position of the center point of the laser in the laser cavity of the silicon nitride ceramics is measured by using a screw micrometer; the laser light source packaging method based on silicon nitride ceramics measures the position of the center point of the silicon nitride ceramic circuit plate by using a screw micrometer, marks the position by using silver powder resin glue, and stabilizes the light spot line by using laser light source projection technology, so that the laser pad plate of the silicon nitride ceramics is aligned and packaged with the envelope frame, the laser light cannot be offset, the quality of the laser light source packaging based on silicon nitride ceramics is high, the packaging effect is good, cost is saved, and the market use is widened.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser light source packaging, in particular to a laser light source packaging method based on silicon nitride ceramic. BACKGROUND

[0002] With the development of lighting technology, from the early kerosene lamp, gradually developed to the electric age of tungsten incandescent lamp, LED energy-saving lamp and laser lamp, from energy saving, use power stability and lighting effect of new research and development of lighting lamp, widely used in optical communication, household lighting, optical storage field, and inorganic material ceramic laser lighting is more energy saving than LED energy-saving lamp lighting, brightness is brighter and smaller, therefore, the technical personnel in-depth study of the various aspects of laser technology.

[0003] For light source packaging, it is well known that it is to maintain the airtightness of the laser lamp itself, eliminate the influence of temperature and humidity of the external environment on the laser lamp, and the surface layer of the packaging is to physically protect the laser chip, avoid long-term exposure of the chip to air, reduce physical damage and chemical damage of the chip wire, and failure, which can improve the reliability and durability of the chip. Moreover, the packaging needs to have good light transmission efficiency and excellent heat dissipation, improve the light efficiency and heat dissipation performance of the light source; therefore, any lighting lamp needs to be packaged, such as LED energy-saving lamp using resin packaging, soldering and thermal ultrasonic die bonding method for light source packaging; Inorganic material ceramic laser lamp is packaged by laser module, including eutectic soldering, glue bonding laser chip and ceramic frame covering plastic sheet packaging of conversion light source.

[0004] The existing laser light source packaging method based on silicon nitride ceramic has the problems that the laser chip is fixedly pasted in the laser cylinder made of silicon nitride ceramic, the packaging deviates during debugging of the laser line and the frame of the packaging tube, resulting in deviation of the laser light; and the quality of the laser light source packaging based on silicon nitride ceramic is not good, which wastes cost and consumes time. SUMMARY

[0005] (I) Technical problems solved

[0006] In view of the deficiencies of the prior art, the present application provides a laser light source packaging method based on silicon nitride ceramic, which solves the problems of the conventional laser light source packaging method based on silicon nitride ceramic that the raw materials are not safe enough, the material ratio is not scientific enough, and the edible standard cannot be reached, and the skin disease treatment effect is not very ideal.

[0007] (II) Technical solutions

[0008] To achieve the above object, the application provides the following technical scheme: a laser light source packaging method based on silicon nitride ceramic, characterized by comprising silicon nitride ceramic, laser chip, silver powder resin glue, aluminum oxide, epoxy resin and N-methyl pyrrolidone raw materials; the light source packaging steps are as follows:

[0009] S1, first, the laser of the silicon nitride ceramic is used to measure the position of the center point on the surface of the silicon nitride ceramic in the laser cavity, mark and draw a circle with this point, and use silver powder resin glue to surround the circle;

[0010] In this embodiment, it is specifically explained that in the laser of the silicon nitride ceramic, the ceramic circuit is pasted on the laser cavity of the laser of the silicon nitride ceramic by the ceramic circuit board, the light-emitting module of the crystal chip is connected on the ceramic circuit board, the laser line is emitted, the light spot line is formed by passing through the laser tube cavity of the silicon nitride ceramic, and the crystal chip is offset during the preparation process of the conventional production of the silicon nitride ceramic. When the fluorescent substance sprayed on the crystal chip emits light, the light is offset, the heating power is large, and the problem of resource waste is caused. Therefore, the position and size of the crystal chip are measured by using the precise measuring screw micrometer on the surface of the silicon nitride ceramic circuit board, the corresponding position is marked, and the pasting position of the crystal chip is controlled.

[0011] S2, the laser chip is aligned from the circle opening, pressed in, the switch of the laser light source is turned on, the laser is in the illumination state, the vertical light shadow on the surface of the silicon nitride ceramic is observed, when the back light circle and the circle opening position and size are consistent, the silver powder resin glue is heated and the laser chip is pasted horizontally;

[0012] In this embodiment, it is specifically explained that the laser from the tube cavity of the silicon nitride ceramic adopts the light source projection technology, the light source projection of the light-emitting light on the crystal chip is defined as a spherical harmonic function by using the Monte Carlo integral function, the center point and the light source overlap point in the tube cavity of the silicon nitride ceramic are defined as a spherical coordinate system and the spherical harmonic function is integrated and calculated The spherical coordinate of the spherical harmonic light source of the laser light source is coincident, the light spot line of the laser emission is stable and centered, the silver powder resin glue can maintain the conductivity of the back of the laser chip, and the light source emission and signal transmission are performed.

[0013] S3, then, the principle of conductive glue pasting is adopted, after curing at 150 DEG C for 1 h, the heat ultrasonic wire bonding technology is adopted to combine the lead and I / O interface of the laser chip, and the aluminum oxide is uniformly sprayed in the hot molten state on the bonding surface to form a metal barrier layer by the vacuum spraying method;

[0014] In this embodiment, the conductive glue is specifically a silver powder resin glue, the lead of the laser chip is a line on the integrated circuit board of the crystal chip for leading out the internal circuit and connecting with the peripheral circuit, the lead is an interface for constituting the communication transmission light source of the chip, one end of the lead at the end is called a tail line, which is used for welding a small metal to make the crystal chip and the solder pad on the printed board of the external control circuit to be bonded by heat ultrasonic wave, thereby forming a welding node, and the I / O interface is used for inputting and outputting data signals between the internal storage and the external connecting device, and is a hardware device for transmitting control signals.

[0015] S4, polishing a concave point at the center point of the cover glass frame substrate, forming a stable light spot line by focusing the laser light source, avoiding the light path from being deviated by the principle of confirming a straight line by two points, and filling and bonding the glass frame substrate with epoxy resin, drying and curing;

[0016] In this embodiment, the light spot is a focus point where the laser beam converges through the focusing mirror, and the laser power density is most concentrated at the bright spot; the concave point polished at the center point of the cover glass frame substrate is a concave lens with a thin middle edge and a thick edge, which is used to reduce the erect virtual image, converge the light source emitted by the laser into an image, and improve the utilization of laser power.

[0017] S5, finally, using physical tools and chemical reagent N-methyl pyrrolidone to deburr and clean the encapsulated silicon nitride ceramic laser light source frame, laser code marking and test packaging effect.

[0018] In this embodiment, the deburring and cleaning is to remove the burrs caused by the epoxy resin poured on the laser of the silicon nitride ceramic by using a chemical reagent; the laser code marking is to use a laser code marking machine to produce etching effect by gasification and oxidation on the surface of the silicon nitride ceramic through high temperature generated by laser aggregation, so as to remove the marks that cannot be removed, and the laser code marking has the characteristics of fast speed, high precision, good quality and small deformation; the test packaging effect is to use a semiconductor sealing test instrument to test the encapsulated silicon nitride ceramic laser produced by production and manufacturing, and the test sealing degree is to use vacuum air pressure technology, test the use efficiency of laser power, and test whether the light spot line of the laser is deviated and the angle of the deviation.

[0019] In a preferred embodiment, the silicon nitride ceramic is an inorganic material ceramic which does not shrink when sintered, has high strength, low density, high temperature resistance and strong heat conduction, and is used for manufacturing materials of housings of lasers and automobile engines; wherein the silicon nitride has a molecular formula of Si3N4, a molecular weight of 3119, and a hexagonal crystal form, and a decomposition temperature in air of 1800 DEG C; the Si3N4 ceramic is a covalent compound, and is prepared by reacting silicon powder with nitrogen at a high temperature of 1200 DEG C to generate preliminary silicon nitride, and then performing secondary nitration at a temperature of 200 DEG C to 1400 DEG C to generate an α-type Si3N4 powder with a purity of ≥90%, and then performing a high-pressure sintering (HPS) process to prepare the Si3N4 ceramic with high strength; and the HPS process is specifically to add the Si3N4 powder to a certain amount of magnesium oxide, and then sinter the mixture into the Si3N4 ceramic under a pressure of ≥1916 MPa and a temperature of ≥1600 DEG C.

[0020] In a preferred embodiment, the silver powder resin adhesive is a conductive adhesive used for fixing laser chips and conducting electricity, and is prepared by adding 100-120 parts of silver powder, 20-25 parts of epoxy resin, 2-5 parts of acetone diluent, 2-5 parts of ethylene diamine (DETA) curing agent, and 0.5-2 parts of DH-1 enhancer into a beaker under a temperature of 25 DEG C, and then uniformly stirring the mixture with a glass rod to obtain the silver powder resin adhesive.

[0021] In a preferred embodiment, the screw micrometer gauge is a gauge made of a screw micrometer principle, has the characteristics of flexible measurement and high accuracy, and is used for detecting the outer diameter, inner diameter, depth, thickness and gear common normal length of spare parts of a silicon nitride ceramic laser, and has an accuracy of 0.001 mm; the screw micrometer gauge is composed of a ruler frame, a micrometer head, a force measuring device, a brake and a fixed anvil structure, wherein the micrometer head is provided with a fixed scale sleeve with scales, and the size of a part is measured by rotating a thread, and the value of the part is read.

[0022] In a preferred embodiment, the hot ultrasonic wire bonding technology is a technology combining a hot pressure bonding technology and an ultrasonic bonding technology, and is a process of bonding and connecting a pad on a laser chip and a lead substrate by using a fine metal wire through heating, pressurizing and ultrasonic methods; specifically, a spherical bonding method using pure gold is used to disconnect the metal lead on the laser chip, a high-voltage electricity is generated by an electronic ignition system of a hot ultrasonic wire bonding machine, air around an electrode and the metal lead is ionized, air between the lead section and the electrode is broken down to form an electric arc, the metal lead section is melted under high temperature, and a ball is formed under the action of gravity and surface tension of the metal lead section, and then a fine wire made of pure gold is used to connect the lead of the laser chip and the bonding of the lead on the silicon nitride ceramic plate under the action of ultrasonic energy and heat energy, and a welding node is formed by the ball.

[0023] In a preferred embodiment, the vacuum spraying is by using vacuum magnetron sputtering technology, which uses the magnetic field on the surface of the cathode to form electron traps, and the plasma generated by abnormal glow discharge in the vacuum thin gas is bombarded on the surface of the cathode target under the action of the electric field, so that the molecules, atoms, ions and electrons on the surface of the target are sputtered, the sputtered particles have kinetic energy, and the particles are shot in the direction of the substrate surface to form a metal plating layer on the substrate surface. The specific spraying process is to generate a large number of sputtered particles for high-speed deposition, and the metal particles are sputtered on the bonding node to form a film.

[0024] In a preferred embodiment, the epoxy resin is a non-toxic, colorless polymer produced by the condensation reaction of epichlorohydrin and bisphenol A, and its molecular formula is (C 11 H 12 O3) n , and the density is 1.2 g / cm 3 . The epoxy resin contains secondary hydroxyl and epoxy groups, and the carboxyl of the acidic resin is used to open the ring of the epoxy and react with the isocyanate in the polyurethane adhesive. The addition product of the epoxy resin dissolved in ethyl acetate and added with phosphoric acid and heated for reaction can improve the initial adhesion, heat resistance and hydrolytic stability of the adhesive, and has good bonding strength, chemical resistance, water resistance, high electrical insulation and sealing performance. The epoxy resin is prepared by the method of atmospheric pressure casting, and the laser of silicon nitride ceramic is sealed and insulated for encapsulation.

[0025] In a preferred embodiment, the aluminum oxide is a high-hardness inorganic compound with a molecular formula of Al2O3 and a molecular weight of 101.96. The true density is 3.97 g / cm 3 , the loose bulk density is 0.85-0.9 g / cm 3 , the melting point is 2054℃, the boiling point is 2980℃, and it is an ion crystal that can be ionized at high temperature. It has the characteristics of being difficult to dissolve in water, white solid, odorless and tasteless, extremely hard texture, easy to absorb moisture but not deliquescent. In the molten state, it is sputtered on the surface of the bonding site by a vacuum spraying machine, and it is the target of vacuum spraying.

[0026] In a preferred embodiment, the N-methyl pyrrolidone is a colorless transparent oily liquid organic substance with a molecular formula of C5H9NO and a molecular weight of 99.131. The density is 1.028 g / cm 3 , the melting point is -24℃, the boiling point is 202℃, and the viscosity is 1.65 mPa.s. It is used as a cleaning agent for processing excess flash of epoxy resin, and its preparation method is to obtain 1,4-butanediol by dehydrogenation and amination reaction process.

[0027] In a preferred embodiment, the silicon nitride ceramic, laser chip, silver powder resin adhesive, alumina, epoxy resin, and N-methylpyrrolidone were all purchased from Jiangsu Qiangsheng Functional Chemical Co., Ltd.; the spiral micrometer, glass frame substrate, and thermo-ultrasonic wire bonding machine were all purchased from Shenzhen Xuchen Semiconductor Technology Co., Ltd.

[0028] (III) Beneficial Effects

[0029] This invention provides a laser source packaging method based on silicon nitride ceramic, which has the following beneficial effects:

[0030] This laser source packaging method based on silicon nitride ceramics uses a micrometer to measure the center point of the silicon nitride ceramic circuit plate, marks it with silver powder resin adhesive, and uses laser source projection technology to stabilize the laser spot line. This achieves the function of fixing and bonding the laser chip inside the laser tube made of silicon nitride ceramics, and ensuring that the laser line and the encapsulation frame converge and align during the packaging process without causing laser beam deviation. It achieves high quality, good packaging effect, cost savings, and expanded market application of the laser source packaging based on silicon nitride ceramics. (iv) Description of the attached drawings

[0031] Figure 1 This is a flowchart of the laser source packaging method based on silicon nitride ceramic of the present invention. Detailed Implementation

[0032] Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0033] This invention provides, for example Figure 1 A technical solution: A laser light source packaging method based on silicon nitride ceramic, comprising silicon nitride ceramic, laser chip, silver powder resin adhesive, alumina, epoxy resin, and N-methylpyrrolidone raw material; the light source packaging steps are as follows:

[0034] S1. First, the laser of silicon nitride ceramic is placed on the surface of silicon nitride ceramic in its laser cavity. The position of its center point is measured using a micrometer screw gauge, marked, and a circle is drawn with this point. Silver powder resin glue is used to draw around the circle.

[0035] In this embodiment, it is specifically explained that in the laser of silicon nitride ceramic, the ceramic circuit is pasted by the ceramic circuit board in the laser cavity of the laser of silicon nitride ceramic, the light-emitting module of the crystal chip is connected on the ceramic circuit board, the laser line is emitted, the light spot line is formed through the laser tube cavity of the silicon nitride ceramic, and the laser of the traditional production of silicon nitride ceramic is prepared. In the preparation process, the installed crystal chip is offset, the fluorescent substance sprayed on the crystal chip is offset when the light is emitted, the heat power is large, and the problem of resource waste is caused. Therefore, the position and the size of the crystal chip are measured by using the precise measurement spiral micrometer on the surface of the silicon nitride ceramic circuit board, the corresponding position is marked, and the pasting position of the crystal chip is controlled.

[0036] S2, align the laser chip from the circle opening, press it in, turn on the switch of the laser light source, let the laser be in the illumination state, observe the vertical light shadow of the silicon nitride ceramic surface, when the back light circle and the circle opening position and size are consistent, paste the laser chip by heating the silver powder resin glue horizontally;

[0037] In this embodiment, it is specifically explained that the laser from the tube cavity of the silicon nitride ceramic adopts the light source projection technology, the light source projection of the light-emitting of the crystal chip is defined as a spherical harmonic function by using a Monte Carlo integral function, the center point and the light source overlapping point in the tube cavity of the silicon nitride ceramic are defined as a spherical coordinate system and the spherical harmonic function is integrated and calculated The spherical harmonic illumination of the spherical coordinate to the laser light source is coincident, and the light spot line of the laser emission is stable and centered; the silver powder resin glue can maintain the conductivity of the back of the laser chip, and the light source emission and signal transmission are performed.

[0038] S3, then adopt the principle of conductive glue pasting, after curing at 150 DEG C for 1 h, adopt the hot ultrasonic wire bonding technology, combine the lead and the I / O interface of the laser chip, and then adopt the vacuum spraying method to uniformly spray the aluminum oxide in a hot molten state on the bonding surface to form a metal barrier layer;

[0039] In this embodiment, it is specifically explained that the conductive glue is silver powder resin glue, the lead of the laser chip is the line for connecting the internal circuit of the integrated circuit board of the crystal chip and the peripheral circuit, the lead is an interface for constituting the communication transmission light source of the chip, one end of the lead end is called a tail line, which is used for welding a small metal to form a soldering node by hot ultrasonic bonding between the crystal chip and the solder pad of the external control circuit printed board; the I / O interface is used for inputting and outputting data signals between the internal storage and the external connection equipment, and is used for connecting the controller of the silicon nitride ceramic laser, controlling the use of the laser light emission, and transmitting the control signal of the hardware equipment.

[0040] S4, grinding a concave point at the center point of the cover glass frame substrate, forming a stable light spot line by focusing the laser light source, confirming a straight line by two points, avoiding the light path from deviating, filling and bonding the glass frame substrate with epoxy resin, drying and curing;

[0041] In this embodiment, it is specifically explained that the light spot is the focus point where the laser beam converges through the focusing mirror, and the laser power density is most concentrated at the bright spot; grinding a concave point at the center point of the cover glass frame substrate is a concave lens with a thin middle edge and a thick edge, which is used to reduce the upright virtual image, converge the light source emitted by the laser into an image, and improve the utilization of laser power.

[0042] S5, finally, using physical tools and chemical reagent N-methyl pyrrolidone to deburr and clean the encapsulated silicon nitride ceramic laser light source frame, laser code marking and test packaging effect.

[0043] In this embodiment, it is specifically explained that the deburring and cleaning is to remove the burrs caused by the epoxy resin poured on the laser of the silicon nitride ceramic by using chemical reagents; the laser code marking is to use a laser code marking machine to produce etching effect by gasification and oxidation on the surface of the silicon nitride ceramic through high temperature generated by laser aggregation, so as to remove the marks that cannot be removed, and the laser code marking has the characteristics of fast speed, high precision, good quality and small deformation; the test packaging effect is to test the encapsulated silicon nitride ceramic laser produced by using semiconductor sealing test instrument, and the test sealing degree is to use vacuum air pressure technology, test the use efficiency of laser power, and test whether the laser spot line is deviated and the angle of deviation.

[0044] In this embodiment, it is specifically explained that the silicon nitride ceramic is an inorganic material ceramic that does not shrink during sintering, has the characteristics of high strength, low density, high temperature resistance and strong heat conduction, and is used for manufacturing shell raw materials of laser and materials of automobile engine; wherein, the molecular formula of silicon nitride is Si3N4, the molecular weight is 3119, and it presents hexagonal crystal form, the decomposition temperature in air is 1800℃, Si3N4 ceramic is a covalent compound, its preparation method is to generate preliminary silicon nitride by reacting silicon powder with nitrogen at high temperature 1200℃, to generate α-type Si3N4 powder with purity ≥90% by secondary nitriding at 200℃ to 1400℃, and to prepare high-strength Si3N4 ceramic by hot-pressing sintering process HPS; the specific HPS process is to add a certain amount of magnesium oxide to Si3N4 powder, and to sinter Si3N4 ceramic under the conditions of pressure ≥1916MPa and temperature ≥1600℃.

[0045] In this embodiment, the silver powder resin glue is a conductive glue, which is used for fixing the laser chip and conducting electricity. The preparation method is as follows: 100-120 parts of silver powder, 20-25 parts of epoxy resin are taken out and placed in a beaker, 2-5 parts of acetone diluent, 2-5 parts of vinyl triamine DETA curing agent and 0.5-2 parts of DH-1 enhancer are added in sequence under the condition of 25℃, and the mixture is uniformly stirred with a glass rod to prepare the silver powder resin glue.

[0046] In this embodiment, the spiral micrometer gauge is a gauge made of spiral micrometer principle, which has the characteristics of flexible measurement and high accuracy, and is used for detecting the outer diameter, inner diameter, depth, thickness and gear public normal length of the spare parts of the silicon nitride ceramic laser, and the accuracy is 0.001mm. The spiral micrometer gauge is composed of a ruler frame, a micrometer head, a force measuring device, a brake and a fixed anvil structure. The micrometer head has a fixed scale sleeve with scales, and the size of the part is measured by rotating the thread, and the part value is read out.

[0047] In this embodiment, the hot ultrasonic wire bonding technology is a process of bonding and connecting the pads on the laser chip and the lead substrate by heating, pressing and ultrasonic method by using fine metal wires. Specifically, the spherical bonding method of pure gold material is used to disconnect the metal lead on the laser chip, the high-voltage electricity is generated by the electronic ignition system of the hot ultrasonic wire bonding machine, the air around the electrode and the metal lead is ionized, the air between the lead fracture and the electrode is broken down to form an electric arc, the metal lead fracture is melted under high temperature, and the ball is formed under the action of its own gravity and surface tension. Then, the fine wire of pure gold material is used to connect the pins of the laser chip and the bonding of the lead on the silicon nitride ceramic plate under the action of ultrasonic energy and heat energy, and the ball forms a welding node.

[0048] In this embodiment, the vacuum spraying is a vacuum magnetron sputtering technology. The magnetic field on the cathode surface forms an electron trap. The thin gas in vacuum is bombarded on the surface of the cathode target material under the action of the electric field in the plasma generated by abnormal glow discharge, so that the molecules, atoms, ions and electrons on the surface of the target material are sputtered out. The sputtered particles have kinetic energy and are shot towards the substrate surface along the direction, forming a metal plating layer on the substrate surface. The specific spraying process is to generate a large number of sputtering particles for high-speed deposition, and the metal particles are sputtered on the bonding node to form a film.

[0049] In this embodiment, the epoxy resin is a non-toxic, colorless polymer produced by the condensation reaction of epoxy chloropropane and bisphenol A, and its molecular formula is (C 11 H 12 O3) n, density 1.2 g / cm 3 , the epoxy resin contains secondary hydroxyl and epoxy group, the carboxyl of the acid resin is used to open ring of the epoxy, to react with isocyanate in the polyurethane adhesive, and to dissolve the epoxy resin in ethyl acetate, to add phosphoric acid and to heat, the adduct is added to the polyurethane adhesive, the initial adhesion, heat resistance and hydrolysis stability of the adhesive are improved, the adhesive has good bonding strength, chemical resistance, water resistance, high electrical insulation and sealing performance; the epoxy resin is prepared by the method of normal pressure casting, and the laser of silicon nitride ceramic is sealed and insulated to form a gel during the encapsulation process.

[0050] In this embodiment, it is specifically explained that the alumina is a high-hardness inorganic compound, the molecular formula is Al2O3, the molecular weight is 101.96, the true density is 3.97 g / cm 3 , the loose bulk density is 0.85-0.9 g / cm 3 , the melting point is 2054℃, the boiling point is 2980℃, it is an ion crystal that can be ionized at high temperature, has the characteristics of being difficult to dissolve in water, white solid, odorless and tasteless, extremely hard texture, easy to absorb moisture but not deliquescent, used in a molten state, sputtered on the surface of the bonding by a vacuum spraying machine, and is a target for vacuum spraying.

[0051] In this embodiment, it is specifically explained that the N-methyl pyrrolidone is a colorless transparent oily liquid organic matter, the molecular formula is C5H9NO, the molecular weight is 99.131, the density is 1.028 g / cm 3 , the melting point is -24℃, the boiling point is 202℃, the viscosity is 1.65 mPa.s, used as a cleaning agent for processing excess flash of epoxy resin, and the preparation method is to obtain 1,4-butanediol by dehydrogenation and amination reaction process.

[0052] In this embodiment, it is specifically explained that the silicon nitride ceramic, laser chip, silver powder resin adhesive, alumina, epoxy resin and N-methyl pyrrolidone are all purchased from Jiangsu Qiangsheng Functional Chemical Co., Ltd.; the screw micrometer gauge, glass frame substrate and thermal ultrasonic wire bonding machine are all purchased from Shenzhen Xucheng Semiconductor Technology Co., Ltd.

[0053] In summary, the laser source packaging method based on silicon nitride ceramic solves the problems of fixing and pasting the laser chip in the laser cylinder made of silicon nitride ceramic, packaging offset during the adjustment of the laser line and the sealing cylinder frame, and the deviation of the light line, which leads to the poor quality of the laser source packaging based on silicon nitride ceramic, waste of cost and time.

[0054] While embodiments of the application have been shown and described, it is to be understood that the application is not limited to the details of the embodiments described, since numerous changes, modifications, substitutions and variations can be made thereto without departing from the spirit and scope of the application as defined by the appended claims and their equivalents.

Claims

1. A laser source packaging method based on silicon nitride ceramic, characterized in that, The components include silicon nitride ceramics, laser chips, silver powder resin adhesive, alumina, epoxy resin, and N-methylpyrrolidone raw materials; the light source packaging steps are as follows: S1. First, connect the light-emitting module of the crystal chip inside the laser cavity of the silicon nitride ceramic laser to emit the laser line. The laser line passes through the laser cavity of the silicon nitride ceramic to form a light spot line. On the surface of the silicon nitride ceramic circuit board, use a micrometer screw gauge to measure the position of its center point, mark it, and draw a circle with this point. Use silver powder resin glue to come out around the circle. S2. Align the laser chip with the circular opening, press it in, turn on the laser emission light source switch to make the laser in the illumination state, and observe the vertical light and shadow on the silicon nitride ceramic surface. When you see that the backlight aperture is consistent with the position and size of the circular opening, heat the silver powder resin glue to horizontally paste the laser chip. S3. Then, using the principle of conductive adhesive bonding, after curing at 150°C for 1 hour, thermo-ultrasonic wire bonding technology is used to combine the leads and I / O interfaces of the laser chip. Then, through vacuum spraying, the hot-molten aluminum oxide is evenly sprayed onto the bonding surface to form a metal barrier layer. S4. At the center point of the glass frame substrate, a concave point is ground inside. A stable light spot line is formed by focusing the laser light source. The principle of confirming a straight line by two points is used to avoid the optical path from deviating. Then, the glass frame substrate is filled with epoxy resin, bonded, dried and cured. S5. Finally, the laser light source frame of the encapsulated silicon nitride ceramic is deburred and cleaned using the chemical reagent N-methylpyrrolidone. The encapsulated silicon nitride ceramic is then marked with laser marking using a laser marking machine. Finally, the encapsulation effect of the encapsulated silicon nitride ceramic is tested.

2. The laser source packaging method based on silicon nitride ceramic according to claim 1, characterized in that: The silicon nitride ceramic is an inorganic ceramic material that does not shrink during sintering; wherein, the molecular formula of silicon nitride is... It exhibits a hexagonal crystal shape and decomposes in air at a temperature of 1800℃. Ceramics are covalent compounds, and their preparation method involves reacting silicon powder with nitrogen at a high temperature of 1200℃ to generate preliminary silicon nitride, followed by a secondary nitriding process at a temperature of 200℃ to 1400℃ to produce silicon nitride with a purity ≥90%. type Powder, prepared using the HPS (Hot Press Sintering) process, yields high-strength powder. ceramics.

3. The laser source packaging method based on silicon nitride ceramic according to claim 1, characterized in that: The silver powder resin adhesive is a conductive adhesive. Its preparation method is to calculate according to the weight ratio, take 100-120 parts of silver powder and 20-25 parts of epoxy resin and put them in a beaker. Under the condition of 25°C, add 2-5 parts of acetone diluent, 2-5 parts of vinyltriamine DETA curing agent and 0.5-2 parts of DH-1 reinforcing agent in sequence, and stir with a glass rod at a uniform speed until fully mixed to obtain the adhesive.

4. The laser source packaging method based on silicon nitride ceramic according to claim 1, characterized in that: The aforementioned micrometer is a measuring instrument made using the principle of micrometer screw measurement. It consists of a ruler frame, a micrometer head, a force measuring device, a brake, and a fixed measuring anvil structure. The micrometer head has a fixed graduated sleeve with scales. The part size is measured by rotating the screw thread, and the part value is read.

5. The laser source packaging method based on silicon nitride ceramic according to claim 1, characterized in that: The thermo-ultrasonic wire bonding technology is a process that combines thermo-press bonding technology with ultrasonic bonding technology. By heating, pressurizing, and ultrasonicating, fine metal wires are used to bond and connect the pads on the laser chip to the lead substrate.

6. The laser source packaging method based on silicon nitride ceramic according to claim 1, characterized in that: The vacuum spraying uses vacuum magnetron sputtering technology, which utilizes the magnetic field on the cathode surface to form an electron trap. The rarefied gas in the vacuum, under the action of the plasma generated by the abnormal glow discharge, bombards the surface of the cathode target material, sputtering out molecules, atoms, ions and electrons from the target material surface. The sputtered particles carry kinetic energy and are directed towards the substrate surface, forming a metal coating on the substrate surface.

7. The laser source packaging method based on silicon nitride ceramic according to claim 1, characterized in that: The epoxy resin is a non-toxic, colorless polymer produced by the condensation reaction of epichlorohydrin and bisphenol A, with the molecular formula: Its density is 1.

2. .

8. The laser source packaging method based on silicon nitride ceramic according to claim 1, characterized in that: The alumina is a high-hardness inorganic compound with the molecular formula: It has a molecular weight of 101.96 and a true density of 3.

97. The loose bulk density is 0.85-0.

9. It has a melting point of 2054℃ and a boiling point of 2980℃, and is an ionic crystal that can be ionized at high temperatures.

9. A laser source packaging method based on silicon nitride ceramic according to claim 1, characterized in that: The N-methylpyrrolidone is a colorless, transparent, oily liquid organic compound with the molecular formula: It has a molecular weight of 99.131 and a density of 1.

028. It has a melting point of -24℃, a boiling point of 202℃, and a viscosity of 1.65 mPa·s.

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