Proximity exposure device and exposure method

Through the linear layout of the proximity exposure device and the coordinated transportation of the robot, the problems of large device size and low production efficiency are solved, and efficient substrate and mask transportation and position adjustment are achieved, which reduces costs and improves production efficiency.

CN115561968BActive Publication Date: 2025-10-10AMIES TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202110744580.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-07-01
Publication Date
2025-10-10
Estimated Expiration
2041-07-01

AI Technical Summary

Technical Problem

The existing proximity exposure device is large in size, occupies space and has low production efficiency. The loading and unloading processes of the substrate and mask are not tight, resulting in long waiting time.

Method used

A linear layout of substrate transfer unit, workpiece stage transfer unit and exposure unit is adopted, including substrate storage structure, transporter and workpiece stage. A robot is used to realize efficient transportation and position adjustment of substrate and mask. The exposure unit is shared to reduce the size of the device and improve production efficiency.

Benefits of technology

The invention realizes efficient transportation and position adjustment of the substrate and the mask, reduces the size of the device, improves production efficiency and yield, and reduces costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a proximity exposure device and an exposure method, wherein a first substrate support table, a first conveyor, a substrate storage structure, a second conveyor and a second substrate support table are linearly arranged, which is beneficial to the transportation of the substrate. The substrate storage structure comprises at least two stations to realize simultaneous up and down of the substrate. The first conveyor and the second conveyor each comprise a first manipulator and a second manipulator, and the two manipulators can independently work, thereby improving the production efficiency. In addition, the first workpiece table and the second workpiece table share one exposure unit, which not only can orderly expose, but also reduces the cost and the size of the proximity exposure device. Furthermore, the substrate storage structure and the exposure unit are arranged in a same line, and the two substrate support tables, the two conveyors and the two workpiece tables are symmetrically distributed about the same line. This layout is not only beneficial to improving the transmission efficiency of the substrate, saving the time cost and improving the production efficiency, but also can reduce the size of the proximity exposure device and improve the product competitiveness.
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Description

Technical Field

[0001] The present invention relates to the technical field of photolithography machine manufacturing, and in particular to a proximity exposure device and an exposure method. Background Art

[0002] Liquid Crystal Display (LCD) technology is already one of the mainstream display technologies today, and one of the key processes in its production is the production of color filters. Color filters are primarily used to achieve color display and are currently mainly produced using proximity exposure devices. However, existing proximity exposure devices are large in size, take up a lot of space in actual applications, and are not convenient for transportation. In addition, due to the unreasonable coordination between the upper plate (for placing the substrate on the carrier), the lower plate (for removing the substrate from the carrier), and the exposure process within the proximity exposure device, the various links are not tightly connected, which easily leads to long waiting times for operations, resulting in low overall productivity.

[0003] Therefore, in order to reduce space occupancy and improve productivity, a new proximity exposure device is urgently needed. Summary of the Invention

[0004] An object of the present invention is to provide a proximity exposure device and an exposure method to solve at least one of the problems of how to improve production efficiency and how to reduce device size.

[0005] In order to solve the above technical problems, the present invention provides a proximity exposure device, comprising: a substrate transmission unit, a workpiece stage transmission unit and an exposure unit;

[0006] The substrate transfer unit includes a first substrate carrying platform, a first conveyor, a substrate storage structure, a second conveyor, and a second substrate carrying platform, which are collinearly arranged along a first direction; wherein the substrate storage structure includes at least two workstations, each of which stores a substrate; the first conveyor and the second conveyor each include a first robot and a second robot for transporting the substrate and / or mask; the first substrate carrying platform and the second substrate carrying platform are used to carry and position the substrate;

[0007] The workpiece stage transport unit includes a first workpiece stage and a second workpiece stage provided on a guide rail, and is used for adjusting the position of the substrate and / or the mask and transporting them to the exposure unit;

[0008] The exposure unit is used to expose the substrate;

[0009] In which, the substrate storage structure and the exposure unit are arranged collinearly along the second direction, and the first substrate carrying platform and the second substrate carrying platform, the first transporter and the second transporter, and the first workpiece stage and the second workpiece stage are symmetrically distributed about the collinearity of the substrate storage structure and the exposure unit.

[0010] Optionally, in the proximity exposure device, the substrate storage structure further includes a rotary drive for adjusting the position of each of the workstations.

[0011] Optionally, in the proximity exposure device, the proximity exposure device further includes a mask plate interface and a mask plate storage structure; wherein the mask plate enters the proximity exposure device through the mask plate interface and is stored in the mask plate storage structure; and / or, the mask plate leaves the proximity exposure device through the mask plate interface.

[0012] Optionally, in the proximity exposure device, the mask storage structure is stacked on the first substrate carrying platform, and the first transporter is capable of clamping or placing the mask from the mask storage structure.

[0013] Optionally, in the proximity exposure device, the mask storage structure is arranged on a side of the first workpiece stage away from the first transporter.

[0014] Optionally, in the proximity exposure device, the proximity exposure device further includes a third transporter for clamping or placing the mask from the mask storage structure; wherein the mask storage structure and the third transporter are arranged colinearly along the first direction.

[0015] Optionally, in the proximity exposure device, the first conveyor and the third conveyor are collinearly arranged along the second direction.

[0016] Optionally, in the proximity exposure device, the guide rail includes a plurality of sub-guide rails arranged along the first direction, the second direction and the third direction, for performing position adjustment of the substrate with six degrees of freedom.

[0017] Optionally, in the proximity exposure device, the first direction, the second direction and the third direction are perpendicular to each other.

[0018] Optionally, in the proximity exposure device, the first substrate carrier platform and the second substrate carrier platform both include a position detector, a temperature controller and a defect detector; wherein the position detector is used to position the substrate; the temperature controller is used to adjust the temperature of the substrate to a set temperature, and the defect detector is used to detect particle contamination on the surface of the substrate.

[0019] Optionally, in the proximity exposure device, a plurality of alignment cameras are provided on both the first workpiece stage and the second workpiece stage for aligning the positions of the substrate and / or the mask.

[0020] Optionally, in the proximity exposure device, the proximity exposure device further includes an alignment unit for aligning the substrate and the mask before exposure.

[0021] Optionally, in the proximity exposure device, the proximity exposure device further includes a mask stage for adsorbing and fixing the mask plate and performing gravity compensation on the mask plate.

[0022] Optionally, in the proximity exposure device, the proximity exposure device further includes a substrate interface, the substrate enters the proximity exposure device through the substrate interface and is stored in the substrate storage structure; and / or, the substrate leaves the proximity exposure device through the substrate interface.

[0023] Based on the same inventive concept, the present invention also provides an exposure method, comprising:

[0024] Step 1: The first transporter stores the exposed substrate on the first workpiece stage into the substrate storage structure, and places the substrate to be exposed on the first workpiece stage;

[0025] Step 2: transporting the substrate to be exposed on the second workpiece stage to the exposure unit to complete exposure;

[0026] Step 3: The second transporter stores the exposed substrate on the second workpiece stage into the substrate storage structure, and places another substrate to be exposed on the second workpiece stage;

[0027] Step 4: transporting the substrate to be exposed on the first workpiece stage to the exposure unit to complete exposure;

[0028] Step 5: Repeat steps 1 to 4 until all substrates to be exposed have completed the exposure process.

[0029] Optionally, in the exposure method, after executing step one and before executing step two, the second workpiece stage is adjusted to align with the position of the substrate to be exposed on the second workpiece stage.

[0030] Optionally, in the exposure method, after executing step three and before executing step four, the first workpiece stage is adjusted to align with the position of the substrate to be exposed on the first workpiece stage.

[0031] Optionally, in the exposure method, before executing step 1, the mask is placed on the first workpiece stage, and after being aligned with the first workpiece stage, is transported to the exposure unit.

[0032] Optionally, in the exposure method, step 1 includes:

[0033] Using a first robot in the first transporter to place the exposed substrate on a station in the substrate storage structure;

[0034] Using a first robot in the first transporter to pick up a substrate to be exposed from another station in the substrate storage structure;

[0035] Turning the first conveyor toward the first substrate carrying platform, and using a second robot in the first conveyor to clamp the substrate to be exposed on the first substrate carrying platform;

[0036] placing the substrate to be exposed, gripped by the first robot in the first transporter, on the first substrate carrying table;

[0037] The first transporter is turned toward the first workpiece stage, and a first manipulator in the first transporter is used to clamp the exposed substrate on the first workpiece stage;

[0038] The substrate to be exposed, which is gripped by the second robot in the first transporter, is placed on the first workpiece table.

[0039] Optionally, in the exposure method, step three includes:

[0040] Using the first robot in the second transporter to place the exposed substrate on a station in the substrate storage structure;

[0041] Using the first robot in the second transporter to pick up a substrate to be exposed from another station in the substrate storage structure;

[0042] The second conveyor is turned toward the second substrate carrying platform, and a second robot in the second conveyor is used to clamp the substrate to be exposed on the second substrate carrying platform;

[0043] placing the substrate to be exposed, which is gripped by the first robot in the second conveyor, on the second substrate carrying table;

[0044] The second conveyor is turned to the second workpiece stage, and the first manipulator in the second conveyor is used to clamp the exposed substrate on the second workpiece stage;

[0045] The substrate to be exposed, which is gripped by the second robot in the second transporter, is placed on the second workpiece table.

[0046] In summary, the present invention provides a proximity exposure device and an exposure method. The proximity exposure device includes: a substrate transfer unit, a workpiece stage transfer unit, and an exposure unit. The substrate transfer unit includes a first substrate carrier, a first conveyor, a substrate storage structure, a second conveyor, and a second substrate carrier, which are arranged in a collinear manner along a first direction. This linear layout facilitates the turning of the first conveyor and the second conveyor to improve the efficiency of loading or unloading the substrate. In addition, the substrate storage structure includes at least two workstations, each of which stores a substrate. Compared with the prior art, it not only increases the storage stations, but also can achieve simultaneous loading and unloading of substrates, thereby improving production efficiency. Moreover, the first conveyor and the second conveyor both include a first manipulator and a second manipulator, and the two manipulators can operate independently, respectively, and can achieve simultaneous loading and unloading of substrates, thereby avoiding long waiting times during substrate handover, greatly reducing the number of rotations of the first conveyor and the second conveyor, streamlining the process flow, and further improving production efficiency.

[0047] The workpiece stage transport unit includes a first workpiece stage and a second workpiece stage mounted on guide rails, which are used to adjust the position of the substrate and / or mask and transport them to the exposure unit; the exposure unit is used to expose the substrate. The first and second workpiece stages share a single exposure unit, which, when properly sequenced, not only enables orderly exposure but also reduces costs and the overall size of the proximity exposure apparatus.

[0048] The substrate storage structure and the exposure unit are collinearly arranged along a second direction, and the first and second substrate carrying platforms, the first and second conveyors, and the first and second workpiece stages are symmetrically distributed about the collinear line between the substrate storage structure and the exposure unit. This device layout not only improves the transfer efficiency of the first and second conveyors, thereby saving time and improving production efficiency, but also reduces the overall size of the proximity exposure apparatus, enhancing product competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 Schematic diagram of the structure of a proximity exposure device in embodiment 1 of the present invention;

[0050] Figure 2 Schematic diagram of the substrate storage structure in embodiment 1 of the present invention;

[0051] Figure 3 Schematic diagram of the structure of the first transporter and the second transporter in the first embodiment of the present invention;

[0052] Figure 4 Schematic diagram of the positional relationship between the substrate and the mask during exposure in Example 1 of the present invention;

[0053] Figure 5 Schematic diagram of the structure of a proximity exposure device in embodiment 2 of the present invention. DETAILED DESCRIPTION

[0054] In order to make the objects, advantages and features of the present invention clearer, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis required to be shown in each drawing is different, and sometimes different scales are used. It should also be understood that, unless otherwise specified or indicated, the terms "first", "second", "third" and the like in the specification are only used to distinguish between the various components, elements, steps, etc. in the specification, and are not used to represent the logical relationship or sequential relationship between the various components, elements, steps, etc.

[0055] <Example 1>

[0056] In order to solve the above technical problems, this embodiment provides a proximity exposure device, see Figure 1 , including: a substrate transfer unit, a workpiece stage transfer unit and an exposure unit. The substrate transfer unit includes a first substrate carrier 101, a first transporter 102, a substrate storage structure 103, a second transporter 104 and a second substrate carrier 105, which are arranged in a collinear manner along a first direction Y. The first transporter 102 and the second transporter can achieve 360-degree rotation, which is convenient for turning to the first substrate carrier 101, the substrate storage structure 103 and the second substrate carrier 105 to achieve loading and unloading between them. This linear layout facilitates the turning of the first transporter 102 and the second transporter 104 to improve the efficiency of loading or unloading.

[0057] Also, see Figure 2The substrate storage structure 103 includes at least two workstations, each of which stores a substrate. Figure 2 Only two workstations 1031 and 1032 are shown, and 3, 4 or 5 or more workstations are optional. The substrate storage structure 103 also includes a rotary driver 1033 for adjusting the position of each of the workstations. For example, a substrate to be exposed is placed in workstation 1031, and an exposed substrate is placed in workstation 1032. When the first conveyor 102 or the second conveyor 104 takes away the substrate to be exposed in workstation 1031, and the exposed substrate in workstation 1032 is taken away by the interface robot and a new substrate to be exposed is placed, under the action of the rotary driver 1033, the workstation 1032 located below rotates to the top, and the workstation 1031 located above rotates to the bottom, that is, the two workstations 1031 and 1032 exchange positions, and the substrate to be exposed is placed in the upper workstation, so that the first conveyor 102 or the second conveyor 104 can always take away the substrate to be exposed at the same position. Therefore, the substrate storage structure 103 not only increases the storage stations, but also facilitates simultaneous loading and unloading of substrates, thereby improving production efficiency.

[0058] For further information, see Figure 3 The first conveyor 102 and the second conveyor 104 each include a first manipulator 102a / 104a and a second manipulator 102b / 104b for transporting the substrates and / or masks. The two manipulators on each of the first conveyor 102 and the second conveyor 104 can operate independently, enabling simultaneous loading and unloading of substrates, thus avoiding long wait times during substrate transfer. During substrate transport, the coordinated use of the two manipulators significantly reduces the number of rotations required by the first conveyor 102 and the second conveyor 104, streamlining the process and improving production efficiency.

[0059] Please continue reading Figure 1 , the first substrate carrier 101 and the second substrate carrier 105 in the substrate transfer unit are used to carry and position the substrate. In addition, the first substrate carrier 101 and the second substrate carrier 105 both include a position detector, a temperature controller and a defect detector. Among them, the position detector is used to position the substrate to ensure the accuracy of the process. The temperature controller is used to adjust the temperature of the substrate to the set temperature for exposure operation. The defect detector is used to detect particle contamination on the surface of the substrate. When the contamination on the surface of the substrate exceeds the threshold range, the corresponding first conveyor 102 or the second conveyor 104 will remove the unqualified substrate to ensure that the substrate sent to the exposure unit meets the exposure requirements and improve the yield.

[0060] Furthermore, the workpiece stage transmission unit includes a first workpiece stage 201 and a second workpiece stage 202 arranged on a guide rail 203, which are used to adjust the position of the substrate and / or the mask plate and transport them to the exposure unit 30. The guide rail 203 includes a plurality of sub-guide rails arranged along a first direction Y, a second direction X and a third direction Z, which are used to adjust the position of the substrate carried on the first workpiece stage 201 or the second workpiece stage 202 with six degrees of freedom to ensure exposure accuracy. The first direction Y, the second direction X and the third direction Z are perpendicular to each other. In addition, a plurality of alignment cameras 204 are provided on both the first workpiece stage 201 and the second workpiece stage 202 for further accurately positioning and aligning the position of the substrate and / or the mask plate to ensure the yield rate.

[0061] For further information, see Figure 4 , the exposure unit 30 provides a large-size light spot for exposing the substrate S. The proximity exposure device also includes a frame 40, a base 50, an alignment unit and a mask stage 70, wherein the frame 40 and the base 50 are used to support the exposure unit 30 and the mask stage 70. The first workpiece stage 201 or the second workpiece stage 202 can be moved along the guide rail into the frame 40 and positioned on the base 50. An electrostatic chuck 205 is provided on the first workpiece stage 201 or the second workpiece stage 202 for adsorbing and carrying the substrate S. The mask stage 70 is arranged opposite to the exposure unit 30 so that the light spot provided by the exposure unit 30 directly irradiates the mask stage 70. The mask stage 70 can not only be used to adsorb and fix the mask M, but also perform gravity compensation on the mask M. The alignment unit is arranged between the exposure unit 30 and the mask stage 70 for detecting and aligning the mask M and the substrate S before exposure. Furthermore, the alignment unit includes a plurality of alignment cameras 601 and a plurality of gap measurement sensors 602 .

[0062] Among them, in the proximity exposure device provided in this embodiment, the first workpiece stage 201 and the second workpiece stage 202 share one exposure unit 30. Under a reasonable process sequence arrangement, not only can orderly exposure be achieved, but also the cost is reduced and the overall size of the proximity exposure device is reduced.

[0063] Please continue reading Figure 1The substrate storage structure 103 and the exposure unit 30 are arranged in line along a second direction X, and the first substrate support table 101 and the second substrate support table 105, the first transporter 102 and the second transporter 104, and the first workpiece table 201 and the second workpiece table 202 are symmetrically distributed about the line on which the substrate storage structure 103 and the exposure unit 30 are arranged. This device layout not only improves the transmission efficiency of the first transporter 102 and the second transporter 104, thereby saving time and improving production efficiency, but also reduces the overall size of the proximity exposure device, thereby improving product competitiveness.

[0064] In addition, the proximity exposure device further comprises a mask plate interface R0, a mask plate storage structure R10, and a third transporter R11. The mask plate enters the proximity exposure device through the mask plate interface R0 and is stored in the mask plate storage structure R10; and / or, the mask plate exits the proximity exposure device through the mask plate interface R0. Further, the mask plate storage structure R10 is arranged on a side of the first workpiece table 201 away from the first transporter 102. The third transporter R11 is used to pick up or place the mask plate from the mask plate storage structure R10, and the mask plate storage structure R10 and the third transporter R11 are arranged in line along the first direction Y; the first transporter 102 and the third transporter R11 are arranged in line along the second direction X, which facilitates the turning of the first transporter 102 and the third transporter R11 to the first workpiece table 201 to pick up or place the substrate or the mask plate, and the compact structure design facilitates further reduction of the size of the proximity exposure device.

[0065] Further, the proximity exposure device further comprises a substrate interface T0, a lamp chamber 80, and an electrical / environmental cabinet 90. The substrate is gripped by an interface robot and enters the proximity exposure device through the substrate interface T0 and is stored in the substrate storage structure 103; and / or, the substrate is gripped by the interface robot and exits the proximity exposure device through the substrate interface T0. The lamp chamber 80 is used to provide a light source, and the electrical / environmental cabinet 90 is used to realize environmental control and electrical control for exposure.

[0066] Based on the same inventive concept, the embodiment also provides an exposure method, which is used in the proximity exposure device shown in the drawings. Figure 1 The exposure method comprises the following steps:

[0067] Step S10: The first transporter 102 stores the exposed substrate on the first workpiece table 201 in the substrate storage structure 103 and places the substrate to be exposed on the first workpiece table 201.

[0068] Specifically, S101 : using the first robot 102 a in the first transporter 102 to place the exposed substrate on a workstation 1032 in the substrate storage structure 103 .

[0069] S102 : Using the first robot 102 a in the first transporter 102 to pick up a substrate to be exposed from another workstation 1031 in the substrate storage structure 103 .

[0070] S103: Rotate the first transporter 102 180 degrees toward the first substrate carrier 101, and use the second robot 102b in the first transporter 102 to clamp the substrate to be exposed on the first substrate carrier 101; the substrate to be exposed has completed positioning, temperature detection and contamination particle detection.

[0071] S104: placing the board to be exposed gripped by the first robot 102a in the first transporter 102 on the first substrate carrying platform 101, so that the first substrate carrying platform 101 can perform positioning, temperature detection and contamination particle detection on the newly placed substrate to be exposed.

[0072] S105 : rotating the first transporter 102 90 degrees to face the first workpiece stage 201 , and using the first robot 102 a in the first transporter 102 to clamp the exposed substrate on the first workpiece stage 201 .

[0073] S106: placing the substrate to be exposed, which is gripped by the second robot 102b in the first transporter 102, on the first workpiece stage 201. The first workpiece stage 201 adjusts the position of the substrate to be exposed.

[0074] Step 2 S20 : ​​transporting the substrate to be exposed on the second work stage 202 to the exposure unit to complete the exposure. The exposed substrate is transported by the second work stage 202 to a position where it is connected to the second transporter 104 .

[0075] Step three S30 : the second transporter 104 stores the exposed substrate on the second workpiece stage 202 into the substrate storage structure 103 , and places another substrate to be exposed on the second workpiece stage 202 .

[0076] Specifically, S301 : using the first robot 104 a in the second transporter 104 to place the exposed substrate on a workstation 1032 in the substrate storage structure 103 .

[0077] S302: The first robot 104a of the second transporter 104 is used to pick up a substrate to be exposed from another workstation 1031 in the substrate storage structure 103. Because the substrate storage structure is provided with a rotary actuator 1033 for adjusting the positions of the various workstations, the first robot 102a / 104a can pick up the substrate from the same workstation 1031 and place it on the same workstation 1032.

[0078] S303: Rotate the second transporter 104 180 degrees toward the second substrate carrying platform 105, and use the second robot 104b in the second transporter 104 to clamp the substrate to be exposed on the second substrate carrying platform 105; the substrate to be exposed has completed positioning, temperature detection and contamination particle detection.

[0079] S304: placing the substrate to be exposed gripped by the first robot 104a in the second transporter 104 on the second substrate carrying platform 105, so that the second substrate carrying platform 105 can perform positioning, temperature detection and contamination particle detection on the newly placed substrate to be exposed.

[0080] S305 : rotating the second transporter 104 90 degrees to face the second workpiece stage 202 , and using the first robot 104 a in the second transporter 104 to clamp the exposed substrate on the second workpiece stage 202 .

[0081] S306: placing the substrate to be exposed, which is gripped by the second robot 104b in the second transporter 104, on the second workpiece stage 202. The second workpiece stage 202 adjusts the position of the substrate to be exposed.

[0082] Step 4 S40 : transporting the substrate to be exposed on the first work stage 201 to the exposure unit 30 to complete the exposure. The exposed substrate is transported by the first work stage 201 to a position where it is connected to the first transporter 102 .

[0083] Step 5 S40: Repeat step 1 S10 to step 4 S40 until the exposure process is completed for all substrates to be exposed.

[0084] The exposed substrate and the substrate to be exposed are transported in real time by the interface robot exiting the substrate interface T0.

[0085] Further, before the step one S10 is performed, the third transporter R11 picks up the mask plate to be used from the mask plate storage structure R10, and rotates 90 degrees to a handover station, towards the first workpiece table 201, and places it on the first workpiece table 201 after alignment with the alignment camera on the first workpiece table 201. The first workpiece table 201 adjusts the position of the mask plate in 6 degrees of freedom to make the mask plate in the optimal position. The proximity exposure device provided in the embodiment transfers the adjustment of the degrees of freedom of the mask plate to the first workpiece table 201, cancels the function of the mask table in the prior art to adjust the degrees of freedom of the mask plate, and not only ensures the accuracy of the position adjustment, but also further reduces the cost, the size of the device and the design difficulty. The mask plate after position adjustment is moved to the mask table by the first workpiece table 201, and is adsorbed and positioned by the mask table. The first workpiece table 201 returns to the station for handover with the first transporter 102.

[0086] Further, the applicant has tested the time for the proximity exposure device to complete the single exposure operation from step one S10 to step four S40 through multiple tests. Specifically as follows:

[0087]

[0088] Among them, the time of step S101-step S106 and step S301-step S306 is less than or equal to 36 seconds, which is much less than the requirement of 66 seconds for substrate exchange time. And the total time of the exposure process is less than or equal to 33 seconds, which meets the set requirements. In addition, particle contamination detection is involved in steps S103-S104 and steps S303-S304. Since the time of step S101-step S106 and step S301-step S306 is less than or equal to 36 seconds, the optimal time for contamination detection is less than or equal to 36 (total exchange time)-12 (single exchange time)-4 (clamping time)=20 seconds. It can be seen that the proximity exposure device provided in the embodiment greatly shortens the exchange time, improves the exchange efficiency, and thus improves the yield.

[0089] In summary, this embodiment provides a proximity exposure device and exposure method. The first substrate carrier 101, the first conveyor 102, the substrate storage structure 103, the second conveyor 104, and the second substrate carrier 105 are arranged linearly, facilitating the transportation of substrates. The substrate storage structure 103 includes at least two workstations to enable simultaneous loading and unloading of substrates. The first conveyor 102 and the second conveyor 104 each include a first manipulator 102a / 104a and a second manipulator 102b / 104b. The two manipulators can operate independently, improving production efficiency, and sharing the substrate storage structure 103 can further reduce the size of the device. In addition, the first workpiece stage 201 and the second workpiece stage 202 share an exposure unit 30, which not only enables orderly exposure, but also reduces costs and reduces the size of the proximity exposure device. Furthermore, the substrate storage structure 103 and the exposure unit 30 are collinearly arranged, and the two substrate carriers, the two conveyors, and the two workpiece stages are symmetrically distributed about the collinearity. This layout not only helps improve the transmission efficiency of the substrate, save time costs, and improve production efficiency, but also reduces the size of the proximity exposure device and improves product competitiveness.

[0090] <Example 2>

[0091] Based on the same inventive concept, on the basis of the first embodiment, this embodiment provides a proximity exposure device, such as Figure 5 Compared with the proximity exposure device provided in the first embodiment, this embodiment removes the third transporter R11 and superimposes the mask storage structure R10 on the first substrate carrier 101. The robot arm of the first transporter 102 is used to clamp or place the mask from the mask storage structure R10. At the same time, the mask interface R0 is arranged close to one side of the first substrate carrier 101, so that the mask can enter the proximity exposure device through the mask interface R0 and be stored in the mask storage structure R10; and / or the mask can leave the proximity exposure device through the mask interface R0.

[0092] The other components and operating procedures of the proximity exposure apparatus provided in this embodiment can be referred to in the description of Example 1. Therefore, this embodiment eliminates the third transporter R11, stacks the mask storage structure R10 on the first substrate carrier 101, and utilizes the existing first transporter 102 to transport the mask. This further reduces the size of the apparatus and improves product competitiveness without compromising process performance and efficiency.

[0093] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other. In addition, the different parts between the various embodiments can also be used in combination with each other, and the present invention is not limited to this.

[0094] Furthermore, it should be recognized that although the present invention has been disclosed above with reference to preferred embodiments, the above embodiments are not intended to limit the present invention. Any person skilled in the art can utilize the above disclosed technical content to make many possible changes and modifications to the technical solution of the present invention, or modify it into equivalent embodiments with equivalent variations, without departing from the scope of the technical solution of the present invention. Therefore, any simple modifications, equivalent variations, and modifications made to the above embodiments based on the technical essence of the present invention, without departing from the content of the technical solution of the present invention, shall still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A proximity exposure device, characterized in that: include: Substrate transfer unit, workpiece stage transfer unit and exposure unit; The substrate transfer unit includes a first substrate carrying platform, a first conveyor, a substrate storage structure, a second conveyor, and a second substrate carrying platform, which are collinearly arranged along a first direction; wherein the substrate storage structure includes at least two workstations, each of which stores a substrate; the first conveyor and the second conveyor each include a first robot and a second robot for transporting the substrate and / or mask; the first substrate carrying platform and the second substrate carrying platform are used to carry and position the substrate; The workpiece stage transport unit includes a first workpiece stage and a second workpiece stage provided on a guide rail, and is used for adjusting the position of the substrate and / or the mask and transporting them to the exposure unit; The exposure unit is used to expose the substrate; wherein the substrate storage structure and the exposure unit are collinearly arranged along a second direction, and the first substrate carrying platform and the second substrate carrying platform, the first transporter and the second transporter, and the first workpiece stage and the second workpiece stage are symmetrically distributed about the collinear line where the substrate storage structure and the exposure unit are located; and The proximity exposure device further includes a mask interface and a mask storage structure; wherein the mask enters the proximity exposure device through the mask interface and is stored in the mask storage structure; and / or the mask leaves the proximity exposure device through the mask interface; The mask storage structure is stacked on the first substrate carrying platform, and the first transporter can clamp or place the mask from the mask storage structure.

2. The proximity exposure device according to claim 1, wherein The substrate storage structure further includes a rotary driver for adjusting the position of each of the workstations.

3. The proximity exposure device according to claim 1, wherein The mask storage structure is arranged on a side of the first workpiece platform away from the first transporter.

4. The proximity exposure device according to claim 3, wherein The proximity exposure device further includes a third transporter for clamping or placing the mask from the mask storage structure; wherein the mask storage structure and the third transporter are collinearly arranged along the first direction.

5. The proximity exposure device according to claim 4, wherein: The first conveyor and the third conveyor are collinearly arranged along the second direction.

6. The proximity exposure device according to claim 1, wherein The guide rail includes a plurality of sub-guide rails arranged along the first direction, the second direction and the third direction, and is used to perform position adjustment of the substrate with six degrees of freedom.

7. The proximity exposure device according to claim 6, wherein: The first direction, the second direction and the third direction are perpendicular to each other.

8. The proximity exposure device according to claim 1, wherein The first substrate carrier platform and the second substrate carrier platform both include a position detector, a temperature controller and a defect detector; wherein the position detector is used to position the substrate; the temperature controller is used to adjust the temperature of the substrate to a set temperature; and the defect detector is used to detect particle contamination on the surface of the substrate.

9. The proximity exposure device according to claim 1, wherein A plurality of alignment cameras are provided on the first workpiece stage and the second workpiece stage for aligning the positions of the substrate and / or the mask.

10. The proximity exposure device according to claim 1, wherein The proximity exposure device further includes an alignment unit for aligning the substrate and the mask before exposure.

11. The proximity exposure device according to claim 1, wherein The proximity exposure device further includes a mask stage for adsorbing and fixing the mask plate and performing gravity compensation on the mask plate.

12. The proximity exposure device according to claim 1, wherein The proximity exposure device further includes a substrate interface, through which the substrate enters the proximity exposure device and is stored in the substrate storage structure; and / or, the substrate leaves the proximity exposure device through the substrate interface.

13. An exposure method, characterized in that: Using the proximity exposure device according to any one of claims 1 to 12, the exposure method comprises: Step 1: The first transporter stores the exposed substrate on the first workpiece stage into the substrate storage structure, and places the substrate to be exposed on the first workpiece stage; Step 2: transporting the substrate to be exposed on the second workpiece stage to the exposure unit to complete exposure; Step 3: The second transporter stores the exposed substrate on the second workpiece stage into the substrate storage structure, and places another substrate to be exposed on the second workpiece stage; Step 4: transporting the substrate to be exposed on the first workpiece stage to the exposure unit to complete exposure; Step 5: Repeat steps 1 to 4 until all substrates to be exposed have completed the exposure process.

14. The exposure method according to claim 13, wherein: After executing step 1 and before executing step 2, the second workpiece stage is adjusted to align the position of the substrate to be exposed on the second workpiece stage.

15. The exposure method according to claim 13, wherein: After executing step three and before executing step four, the first workpiece stage is adjusted to align the position of the substrate to be exposed on the first workpiece stage.

16. The exposure method according to claim 13, wherein: Before executing the step 1, the mask is placed on the first workpiece stage, and after being aligned with the position by the first workpiece stage, it is transported to the exposure unit.

17. The exposure method according to claim 13, wherein: The step one comprises: Using a first robot in the first transporter to place the exposed substrate on a station in the substrate storage structure; Using a first robot in the first transporter to pick up a substrate to be exposed from another station in the substrate storage structure; Turning the first conveyor toward the first substrate carrying platform, and using a second robot in the first conveyor to clamp the substrate to be exposed on the first substrate carrying platform; placing the substrate to be exposed, gripped by the first robot in the first transporter, on the first substrate carrying table; The first transporter is turned toward the first workpiece stage, and a first manipulator in the first transporter is used to clamp the exposed substrate on the first workpiece stage; The substrate to be exposed, which is gripped by the second robot in the first transporter, is placed on the first workpiece table.

18. The exposure method according to claim 13, wherein: The step three includes: Using the first robot in the second transporter to place the exposed substrate on a station in the substrate storage structure; Using the first robot in the second transporter to pick up a substrate to be exposed from another station in the substrate storage structure; The second conveyor is turned toward the second substrate carrying platform, and a second robot in the second conveyor is used to clamp the substrate to be exposed on the second substrate carrying platform; placing the substrate to be exposed, which is gripped by the first robot in the second conveyor, on the second substrate carrying table; The second conveyor is turned to the second workpiece stage, and the first manipulator in the second conveyor is used to clamp the exposed substrate on the second workpiece stage; The substrate to be exposed, which is gripped by the second robot in the second transporter, is placed on the second workpiece table.

Citation Information

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