Loop heat pipe heat sink device

Abstract

The application provides a loop heat pipe heat dissipation device. The loop heat pipe heat dissipation device comprises an evaporator, a steam conveying pipe and a condenser. The evaporator comprises a top cover and a bottom plate, and the top cover and the bottom plate form a boiling pool. The steam conveying pipe is connected with the top cover, and comprises a first inlet and a first outlet. The first inlet of the steam conveying pipe is connected with the boiling pool. The condenser comprises a condensing return pipe and a heat dissipation component arranged outside the condensing return pipe. The condensing return pipe comprises a second inlet and a second outlet. The second inlet of the condensing return pipe is connected with the first outlet of the steam conveying pipe. The condensing return pipe is connected with the top cover, and the second outlet of the condensing return pipe is located in the boiling pool. The loop heat pipe heat dissipation device can effectively dissipate heat for related electronic devices, and is beneficial to improve the heat dissipation amount per unit time and meet the heat dissipation requirement of the electronic devices.

Description

Technical Field

[0001] This application relates to the field of heat dissipation equipment technology, specifically to a loop heat pipe heat dissipation device. Background Technology

[0002] With the widespread use of electronic devices, their functionality and computing power have also made technological progress. Currently, the power consumption of electronic components such as CPUs, GPUs, and switch chips in electronic devices is increasing. High-power electronic components require effective heat dissipation to reduce heat accumulation and prevent them from overheating and malfunctioning.

[0003] Traditional solutions involve using vapor chambers (VCs) or heat pipes to draw heat away from electronic devices, dispersing it over a larger surface area. A metal heatsink, connected to the vapor chamber or heat pipes and providing an expanded surface area, then dissipates the heat to the external environment, reducing the temperature around the electronic devices and improving their cooling capacity. To keep the temperature of high-power electronic devices within acceptable limits, large-area vapor chambers or multiple heat pipes connected in parallel are typically used. However, as the heat flux density of high-power electronic devices increases, current solutions require the simultaneous use of vapor chambers and heat pipes, resulting in complex cooling systems and higher costs. Summary of the Invention

[0004] This application provides a loop heat pipe heat dissipation device, which can effectively dissipate heat from related electronic devices, thereby increasing the heat dissipation per unit time and meeting the heat dissipation requirements of electronic devices.

[0005] This application provides a loop heat pipe heat dissipation device, which includes:

[0006] The evaporator includes a top cover and a bottom plate, which together form a boiling pool.

[0007] A steam delivery pipe is connected to the top cover. The steam delivery pipe includes a first inlet and a first outlet. The first inlet of the steam delivery pipe is connected to the boiling tank.

[0008] The condenser includes a condensation reflux tube and a heat dissipation component disposed outside the condensation reflux tube. The condensation reflux tube includes a second inlet and a second outlet. The second inlet of the condensation reflux tube is connected to the first outlet of the steam delivery tube. The condensation reflux tube is connected to the top cover, and the second outlet of the condensation reflux tube is located inside the boiling tank.

[0009] The loop heat pipe cooling device of this application embodiment includes an evaporator, a steam delivery pipe, and a condenser. The evaporator is used to absorb the heat generated by the corresponding electronic device. The heat can heat the cooling medium in the boiling pool of the evaporator, causing the cooling medium to evaporate into steam. The steam enters the steam delivery pipe, thereby carrying away the heat in a timely manner, effectively reducing the possibility of heat accumulation at the electronic device and causing the ambient temperature to be too high. The steam enters the condensation return pipe through the steam delivery pipe and condenses into liquid, releasing heat at the same time. The released heat is conducted to the condensation return pipe and the heat dissipation components. The heat dissipation components release the heat to the external atmosphere or other heat dissipation devices. The liquid formed by the condensation of steam finally flows back into the boiling pool for the next heat dissipation cycle. The evaporator, steam delivery pipe, and condenser of this application embodiment can form a self-circulating heat dissipation loop, thereby effectively cooling the electronic device, reducing the possibility that the heat generated by the electronic device cannot be dissipated in time, causing the electronic device temperature to rise and exceed the rated operating temperature, which is beneficial to improving the working stability of the electronic device, and reducing the possibility of damage to the electronic device due to high temperature.

[0010] According to one embodiment of this application, the evaporator further includes an enhanced heat exchange component disposed on the surface of the base plate facing the boiling pool.

[0011] According to one embodiment of this application, the enhanced heat exchange component has a porous structure.

[0012] According to one embodiment of this application, the evaporator further includes a float disposed in the boiling tank, the float being used to block or open the first inlet of the steam delivery pipe.

[0013] According to one embodiment of this application, the evaporator further includes a transfer pipe, which includes a first open end and a second open end. The opening size of the first open end is smaller than the opening size of the second open end. The first open end of the transfer pipe is connected to the first inlet of the steam delivery pipe, and the second open end of the transfer pipe is connected to the top cover. The transfer pipe includes a receiving portion for accommodating a float, and the receiving portion is connected to the boiling tank; or...

[0014] The evaporator also includes a limiting mesh box, which includes a side mesh section and a bottom mesh section. The limiting mesh box is set in the boiling tank. The side mesh section of the limiting mesh box is connected to the top cover, and the bottom mesh section is set corresponding to the first inlet of the steam conveying pipe. The float is set in the limiting mesh box.

[0015] According to one embodiment of this application, the condenser further includes metal fins connected to the inner surface of the condenser return tube.

[0016] According to one embodiment of this application, the heat dissipation component includes a plurality of heat dissipation fins, or the heat dissipation component includes heat dissipation fins and a housing, the housing being connected to a condensate return pipe, and a chamber for containing coolant being formed between the housing and the condensate return pipe, the heat dissipation fins being located inside the housing, and the heat dissipation fins being connected to the condensate return pipe.

[0017] According to one embodiment of this application, there are multiple condensate return pipes arranged side by side.

[0018] According to one embodiment of this application, condensers are respectively provided on both sides of the steam delivery pipe, and the loop heat pipe heat dissipation device further includes a top box, the first outlet of the steam delivery pipe is connected to the top box, and the second inlet of the condensate return pipe is connected to the top box.

[0019] According to one embodiment of this application, two or more condensers are respectively provided on both sides of the steam conveying pipe, and two or more condensers on one side of the steam conveying pipe are arranged side by side along the direction away from the steam conveying pipe. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0021] Figure 1 This is a schematic diagram of the structure of a loop heat pipe heat dissipation device provided in an embodiment of this application;

[0022] Figure 2 This is a partial cross-sectional view of a loop heat pipe cooling device provided in an embodiment of this application;

[0023] Figure 3 A partial cross-sectional view of a loop heat pipe cooling device provided in another embodiment of this application;

[0024] Figure 4 A partial cross-sectional view of a loop heat pipe cooling device provided in another embodiment of this application;

[0025] Figure 5 This is a schematic diagram of the structure of a float provided in one embodiment of this application;

[0026] Figure 6 This is a schematic diagram of the structure of a float provided in another embodiment of this application;

[0027] Figure 7 A partial cross-sectional view of a loop heat pipe cooling device provided in another embodiment of this application;

[0028] Figure 8 This is a partial cross-sectional view of a condenser provided in an embodiment of this application;

[0029] Figure 9 This is a partial cross-sectional view of a condenser provided in another embodiment of this application;

[0030] Figure 10 A partial cross-sectional view of a loop heat pipe cooling device provided in another embodiment of this application;

[0031] Figure 11 This is a schematic diagram of the structure of a loop heat pipe heat dissipation device provided in another embodiment of this application;

[0032] Figure 12 This is a schematic diagram of the structure of a loop heat pipe heat dissipation device provided in another embodiment of this application;

[0033] Figure 13 This is a partial cross-sectional view of a loop heat pipe cooling device provided in another embodiment of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 10. Loop heat pipe cooling device;

[0036] 20. Evaporator; 20a. Boiling tank;

[0037] 21. Top cover;

[0038] 22. Base plate;

[0039] 23. Enhanced heat exchange components; 231. Square column structure;

[0040] 24. Float; 241. Base; 242. Frustum; 243. Quadrangular frustum;

[0041] 25. Transfer of control; 25a. Containment area;

[0042] 26. Limiting mesh cage; 261. Side mesh section; 262. Bottom mesh section;

[0043] 30. Steam transmission pipe; 31. First inlet; 32. First outlet;

[0044] 40. Condenser;

[0045] 41. Condensate reflux pipe; 411. Second inlet; 412. Second outlet;

[0046] 42. Heat dissipation component; 421. Heat dissipation fins; 422. Housing; 4221. Liquid inlet; 4222. Liquid outlet;

[0047] 43. Metal fins;

[0048] 50. Top box;

[0049] 100. Cooling medium.

[0050] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0051] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0052] With the development of Micro-Electro-Mechanical Systems (MEMS) technology, electronic devices are becoming increasingly large-scale and integrated, while the power of many electronic devices is also increasing, leading to a sharp increase in the heat generated by high-power electronic devices. If the heat released by electronic devices cannot be dissipated in time, the temperature of the operating environment will rise, potentially exceeding the rated operating temperature of the electronic devices. This could cause the electronic devices to malfunction or even suffer structural damage.

[0053] The electronic device can be a central processing unit (CPU), a graphics processing unit (GPU), a power management chip, a wireless chip (WiFi), or a memory chip. It is understood that this application does not specifically limit the type of electronic device.

[0054] The loop heat pipe cooling device of this application embodiment has high heat dissipation efficiency. When applied to electronic devices, it can effectively dissipate heat from related electronic components, thereby increasing the heat dissipation per unit time and meeting the heat dissipation requirements of electronic components. Furthermore, the loop heat pipe cooling device of this application embodiment does not employ traditional heat dissipation structures such as heat spreaders or heat pipes, which can effectively reduce the complexity of the heat dissipation structure and control production costs.

[0055] The loop heat pipe heat dissipation device 10 of the present application embodiment will be further described below.

[0056] Figure 1 The structure of the loop heat pipe cooling device 10 according to an embodiment of this application is schematically shown. See also Figure 1As shown, the loop heat pipe cooling device 10 of this application embodiment includes an evaporator 20, a steam delivery pipe 30, and a condenser 40. The evaporator 20 is used to connect to corresponding electronic devices. Heat generated by the electronic devices can be transferred to the evaporator 20. The evaporator 20 stores a boiling heat-transferring coolant. For example, the coolant can be pure water, a fluorinated refrigerant, methanol, or ammonia, etc., a phase-change heat-transforming coolant. After absorbing heat, the coolant in the evaporator 20 boils and forms steam. The steam can flow along the steam delivery pipe 30. After flowing to the condenser 40, the steam can condense and release heat. The condensed steam forms a liquid. The liquid can flow back into the evaporator 20 for the next heat dissipation cycle. The heat at the condenser 40 can be directly released to the atmosphere or other heat dissipation devices. After the cooling working fluid in the evaporator 20 generates steam, the pressure in the evaporator 20 increases, which can drive the steam to flow in the steam delivery pipe 30 and the condenser 40, thereby realizing the self-driven circulation of steam without the need for an additional drive unit to drive the steam flow.

[0057] Figure 2 A partial cross-sectional view of the loop heat pipe cooling device 10 according to an embodiment of this application is schematically shown. See also Figure 1 and Figure 2 As shown, the evaporator 20 of this embodiment includes a top cover 21 and a bottom plate 22. The top cover 21 has a recessed receiving cavity in a direction away from the bottom plate 22. The top cover 21 and the bottom plate 22 form a boiling pool 20a for containing the cooling medium, that is, the top cover 21 and the bottom plate 22, when connected, can form a receiving space for containing the cooling medium. When the loop heat pipe heat dissipation device 10 is applied to electronic devices, the bottom plate 22 of the evaporator 20 can be connected to the corresponding electronic device. The heat generated by the electronic device can be conducted through the bottom plate 22 to the boiling pool 20a and heat the cooling medium in the boiling pool 20a.

[0058] In some possible implementations, the top cover 21 and the base plate 22 are detachably connected. For example, the top cover 21 has a flange. The flange of the top cover 21 and the base plate 22 can be connected by fasteners. Exemplarily, the fasteners can be screws. Alternatively, the fasteners include bolts and nuts.

[0059] In some examples, a sealing ring is provided between the top cover 21 and the bottom plate 22. The sealing ring surrounds the boiling pool 20a. The top cover 21 and the bottom plate 22 press against each other to ensure good sealing after the top cover 21 and the bottom plate 22 are connected, reducing the possibility of the cooling medium flowing out of the boiling pool 20a and leaking between the joint surfaces of the top cover 21 and the bottom plate 22.

[0060] In some feasible implementations, both the top cover 21 and the base plate 22 can be made of metal, such as steel, aluminum, or an aluminum alloy. The top cover 21 and the base plate 22 can be welded together to achieve a sealed connection. The welded top cover 21 and base plate 22 form an annular welded section. This annular welded section surrounds the boiling tank 20a.

[0061] In this embodiment, the steam delivery pipe 30 is connected to the top cover 21. The steam delivery pipe 30 includes a first inlet 31 and a first outlet 32. The first inlet 31 of the steam delivery pipe 30 is connected to the boiling tank 20a. Heat from the electronic device is conducted to the evaporator 20, heating the cooling medium and causing it to generate steam, thus increasing the pressure inside the evaporator 20. Under its own pressure, the steam can be discharged from the evaporator 20. The steam can enter the steam delivery pipe 30 and flow along it.

[0062] In some feasible implementations, the steam delivery pipe 30 can be detachably connected to the top cover 21. For example, both the steam delivery pipe 30 and the top cover 21 have flanges. The flanges of the steam delivery pipe 30 and the top cover 21 can be connected by fasteners. Exemplarily, the fasteners can be screws. Alternatively, the fasteners include bolts and nuts. Exemplarily, a sealing ring is provided between the flanges of the steam delivery pipe 30 and the top cover 21 to ensure good sealing after the connection of the steam delivery pipe 30 and the top cover 21.

[0063] In some feasible embodiments, both the top cover 21 and the steam delivery pipe 30 can be made of metal, such as steel, aluminum, or an aluminum alloy. The top cover 21 and the steam delivery pipe 30 can be welded together to achieve a sealed connection. The welded joint forms an annular weld.

[0064] See Figure 2 As shown, the condenser 40 of this embodiment includes a condensation reflux pipe 41 and a heat dissipation component 42 disposed outside the condensation reflux pipe 41. The condensation reflux pipe 41 includes a second inlet 411 and a second outlet 412. The second inlet 411 of the condensation reflux pipe 41 is connected to the first outlet 32 ​​of the steam delivery pipe 30. Steam in the steam delivery pipe 30 can be discharged from the first outlet 32 ​​of the steam delivery pipe 30 and then enter the condensation reflux pipe 41 from the second inlet 411. The steam can condense into liquid in the condensation reflux pipe 41, releasing heat at the same time. The condensation reflux pipe 41 absorbs the heat released when the steam condenses into liquid and conducts the heat to the external heat dissipation component 42. The heat is then directly dissipated to the external atmosphere or other heat dissipation devices through the heat dissipation component 42.

[0065] The condenser reflux pipe 41 is connected to the top cover 21 of the evaporator 20, and the second outlet 412 of the condenser reflux pipe 41 is located inside the boiling pool 20a. The liquid formed by the condensation of steam in the condenser reflux pipe 41 can flow back into the boiling pool 20a through the second outlet 412 and be reused for heat absorption and evaporation, thereby completing the unidirectional flow cycle of the cooling working fluid, so that the loop heat pipe heat dissipation device 10 forms a unidirectional airflow and liquid flow circulation loop.

[0066] In some feasible configurations, the steam delivery pipe 30 and the condensate return pipe 41 can be arranged vertically. The liquid formed by the condensation of steam in the condensate return pipe 41 can also be returned under the action of gravity, thus eliminating the need for complex capillary liquid absorption structures that rely on capillary force to achieve liquid return, such as additional heat spreaders or heat pipes. This simplifies the product structure and reduces product manufacturing costs.

[0067] In some feasible methods, after injecting liquid cooling medium into the boiling pool 20a of the evaporator 20, the second outlet 412 of the condensate return pipe 41 is located below the liquid surface of the cooling medium, thereby ensuring that the steam flow direction is unidirectional within the steam delivery pipe 30, and preventing steam from entering the condensate return pipe 41 and causing backflow.

[0068] The loop heat pipe cooling device 10 of this application embodiment includes an evaporator 20, a steam delivery pipe 30, and a condenser 40. The evaporator 20 absorbs heat generated by corresponding electronic devices. The heat heats the cooling medium in the boiling pool 20a of the evaporator 20, causing the cooling medium to evaporate into steam. The steam enters the steam delivery pipe 30, thereby promptly carrying away heat and effectively reducing the possibility of heat accumulation at the electronic devices leading to excessively high ambient temperatures. The steam enters the condensation return pipe 41 through the steam delivery pipe 30 and condenses into liquid, releasing heat in the process. The released heat is conducted to the condensation return pipe 41 and the heat dissipation component 42. The heat dissipation component 42 releases the heat to the external atmosphere or other heat dissipation devices. The liquid formed by the condensation of steam ultimately flows back into the boiling pool 20a for the next heat dissipation cycle. The evaporator 20, steam delivery pipe 30, and condenser 40 of this embodiment can form a self-circulating heat dissipation loop, thereby effectively cooling the electronic devices and reducing the possibility that the heat generated by the electronic devices cannot be dissipated in time, causing the temperature of the electronic devices to rise and exceed the rated operating temperature. This is beneficial to improving the working stability of the electronic devices and reducing the possibility of damage to the electronic devices due to high temperature.

[0069] See also some of the possible implementation methods. Figure 2As shown, the evaporator 20 also includes an enhanced heat exchange component 23. The enhanced heat exchange component 23 is disposed on the surface of the bottom plate 22 of the evaporator 20 facing the boiling tank 20a. The bottom plate 22 of the evaporator 20 can be correspondingly positioned to align with electronic devices. The heat generated by the electronic devices is conducted to the bottom plate 22. The enhanced heat exchange component 23 can dissipate the heat from the bottom plate 22 to the cooling medium in the boiling tank 20a more quickly, thereby accelerating the heat transfer efficiency from the electronic devices to the cooling medium in the boiling tank 20a and improving heat dissipation efficiency. After the cooling medium is injected into the boiling tank 20a, the enhanced heat exchange component 23 can be immersed in the cooling medium.

[0070] In some examples, the enhanced heat exchange component 23 has a porous structure. The enhanced heat exchange component 23 can generate capillary forces, which allows the cooling medium to move in and out of the enhanced heat exchange component 23 more quickly, so as to remove the heat at the enhanced heat exchange component 23 more quickly.

[0071] Exemplarily, the enhanced heat exchange component 23 may include, but is not limited to, a metal mesh, a sintered metal powder structure, or a metal foam. Exemplarily, the material of the metal mesh, the sintered metal powder structure, or the metal foam includes copper.

[0072] In some examples, the enhanced heat exchange component 23 may include a sintered metal powder structure and a columnar structure 231. The columnar structure 231 is connected to the base plate 22, and the sintered metal powder structure is disposed on the surface of the columnar structure 231. Multiple slots are formed between the columnar structures 231 to improve heat dissipation efficiency. Exemplarily, the material of the columnar structure 231 includes copper.

[0073] In some feasible ways, Figure 3 A partial cross-sectional view of the loop heat pipe heat dissipation device 10 according to an embodiment of this application is shown schematically. Figure 4 A partial cross-sectional view of the loop heat pipe cooling device 10 according to an embodiment of this application is schematically shown. See also Figure 3 and Figure 4 As shown, the evaporator 20 also includes a float 24. The float 24 is disposed in the boiling tank 20a. The float 24 is used to block or open the first inlet 31 of the steam delivery pipe 30. After the cooling medium 100 is injected into the boiling tank 20a, the float 24 can float on the surface of the cooling medium 100. When the cooling medium 100 in the evaporator 20 does not absorb heat to generate steam, the float 24 can block the first inlet 31 of the steam delivery pipe 30. When the cooling medium 100 in the evaporator 20 absorbs heat to generate steam, the surface of the cooling medium 100 drops, and the position of the float 24 also moves down, so that the float 24 can open the first inlet 31 of the steam delivery pipe 30, and steam can enter the steam delivery pipe 30. Therefore, the float 24 can automatically open periodically according to the temperature change of the cooling medium 100, realizing a self-driven cycle of steam pressure.

[0074] In some examples, the evaporator 20 also includes a transfer pipe 25. The transfer pipe 25 includes a first open end and a second open end. The opening size of the first open end is smaller than the opening size of the second open end. The first open end of the transfer pipe 25 is connected to the first inlet 31 of the steam delivery pipe 30. The second open end of the transfer pipe 25 is connected to the top cover 21 of the evaporator 20. The transfer pipe 25 includes a receiving portion for accommodating a float 24. The receiving portion is in communication with the boiling pool 20a of the evaporator 20.

[0075] For example, the float 24 may be spherical in shape, while the receiving part may be hemispherical.

[0076] Alternatively, the float 24 may include a cylindrical base and a hemispherical portion disposed on the base, and the shape of the receiving portion may be hemispherical.

[0077] or, Figure 5 The structure of the float 24 of this application is schematically shown. See also Figure 5 As shown, the float 24 includes a cylindrical base 241 and a truncated cone 242 disposed on the base 241, and the receiving part is cone-shaped.

[0078] or, Figure 6 The structure of the float 24 of this application is schematically shown. See also Figure 6 As shown, the float 24 includes a cubic base 241 and a truncated quadrangular 243 disposed on the base 241, and the receiving part is shaped like a truncated quadrangular 243.

[0079] In some examples, the adapter pipe 25 and the top cover 21 can be a single-piece structure. Alternatively, the adapter pipe 25 and the steam delivery pipe 30 can be a single-piece structure.

[0080] In some examples, Figure 7 A partial cross-sectional view of the loop heat pipe cooling device 10 according to an embodiment of this application is schematically shown. See also Figure 7As shown, the evaporator 20 also includes a limiting mesh box 26. The limiting mesh box 26 includes a side mesh portion 261 and a bottom mesh portion 262. The limiting mesh box 26 has an opening corresponding to the bottom mesh portion 262. The limiting mesh box 26 has multiple mesh openings to ensure that the cooling medium 100 or the generated steam can pass smoothly through the limiting mesh box 26. The limiting mesh box 26 is disposed within the boiling pool 20a of the evaporator 20. The side mesh portion 261 of the limiting mesh box 26 is connected to the top cover 21, and the bottom mesh portion 262 is disposed corresponding to the first inlet 31 of the steam delivery pipe 30. A float 24 is disposed within the limiting mesh box 26. When the float 24 blocks the first inlet 31 of the steam delivery pipe 30, a portion of the float 24 is located within the limiting mesh box 26, and another portion extends out from the opening of the limiting mesh box 26 and is located within the receiving portion of the transfer pipe 25. The limiting net box 26 can limit the float 24, prevent the float 24 from floating randomly, improve the positional stability of the float 24, reduce the float 24 from floating randomly and losing its function of blocking or opening the first inlet 31 of the steam conveying pipe 30, and ensure that the float 24 can successfully block or open the first inlet 31 of the steam conveying pipe 30.

[0081] For example, the material of the limiting cage 26 can be a metal material. For instance, the material of the limiting cage 26 can be, but is not limited to, stainless steel or aluminum.

[0082] In some feasible ways, Figure 8 A partial cross-sectional view of the condenser 40 of this application is schematically shown. See also Figure 8 As shown, the condenser 40 also includes metal fins 43. The metal fins 43 are for enhancing condensation. The metal fins 43 are connected to the inner surface of the condenser return pipe 41. The metal fins 43 can further increase the contact area between the steam and the condenser 40, thereby allowing the steam to condense on both the inner surface of the condenser return pipe 41 and the surface of the metal fins 43, effectively improving the condensation efficiency of the condenser 40 and ensuring that the steam is fully condensed and refluxed. In some examples, the material of the metal fins 43 may include, but is not limited to, steel, copper, or aluminum.

[0083] In some examples, the cross-section of the condenser reflux tube 41 can be circular. Multiple metal fins 43 are evenly distributed along the circumference of the condenser reflux tube 41.

[0084] In some examples, Figure 9 A partial cross-sectional view of the condenser 40 of this application is schematically shown. See also Figure 9As shown, the cross-section of the condenser reflux pipe 41 can be square. Multiple metal fins 43 are evenly distributed along the length of the cross-section of the condenser reflux pipe 41. Exemplarily, the multiple metal fins 43 can divide the condenser reflux pipe 41 into multiple individual channels. For example, six metal fins 43 can be evenly distributed along the length of the condenser reflux pipe 41, dividing the condenser reflux pipe 41 into seven individual channels.

[0085] See also some of the possible implementation methods. Figure 7 As shown, the heat dissipation component 42 includes multiple heat dissipation fins 421. A condensation return pipe 41 passes through the heat dissipation fins 421. Along the axial direction of the condensation return pipe 41, the multiple heat dissipation fins 421 are spaced apart, thereby facilitating the smooth flow of air between the multiple heat dissipation fins 421 to remove the heat emitted by the heat dissipation fins 421 and achieve air cooling to reduce the temperature of the heat dissipation fins 421.

[0086] In some feasible ways, Figure 10 A partial cross-sectional view of the loop heat pipe cooling device 10 according to an embodiment of this application is schematically shown. See also Figure 10 As shown, the heat dissipation component 42 includes heat dissipation fins 421 and a housing 422. The housing 422 is connected to a condensate return pipe 41, and a chamber for containing coolant is formed between the housing 422 and the condensate return pipe 41. The heat dissipation fins 421 are located inside the housing 422 and are connected to the condensate return pipe 41. After coolant is injected into the chamber between the housing 422 and the condensate return pipe 41, the coolant can submerge the heat dissipation fins 421. Exemplarily, the coolant may include, but is not limited to, pure water or cooling oil.

[0087] Along the axial direction of the condensation return pipe 41, multiple heat dissipation fins 421 are spaced apart, which facilitates the smooth flow of coolant between the multiple heat dissipation fins 421 to remove the heat dissipated by the heat dissipation fins 421 and achieve liquid cooling to reduce the temperature of the heat dissipation fins 421.

[0088] In some examples, Figure 11 A partial structure of the loop heat pipe cooling device 10 according to an embodiment of this application is schematically shown. See also Figure 11 As shown, the outer casing 422 has a liquid inlet 4221 and a liquid outlet 4222. Coolant at a lower temperature is injected into the chamber through the liquid inlet 4221, while coolant at a higher temperature is discharged through the liquid outlet 4222, thereby ensuring that the heat released by the heat dissipation fins 421 is carried away in a timely manner by the flowing coolant.

[0089] See also some of the possible implementation methods. Figure 1As shown, there are multiple condensation reflux pipes 41. These multiple condensation reflux pipes 41 are arranged side-by-side. The multiple condensation reflux pipes 41 are sequentially arranged to pass through each heat dissipation fin 421. For example, the cross-section of the condensation reflux pipe 41 can be circular, elliptical, or square.

[0090] In some examples, multiple condensate return pipes 41 are each connected to a steam delivery pipe 30.

[0091] In some feasible ways, Figure 12 A partial cross-sectional view of the loop heat pipe cooling device 10 according to an embodiment of this application is schematically shown. See also Figure 12 As shown, the number of condensation return pipes 41 can be one. A condensation return pipe 41 is arranged to pass through each heat sink fin 421 in sequence. Exemplarily, the cross-section of the condensation return pipe 41 can be circular or square.

[0092] See also some of the possible implementation methods. Figure 12 As shown, condensers 40 are respectively installed on both sides of the steam delivery pipe 30. The loop heat pipe heat dissipation device 10 also includes a top box 50. The first outlet 32 ​​of the steam delivery pipe 30 is connected to the top box 50. The second inlet 411 of the condensate return pipe 41 is connected to the top box 50. Steam in the steam delivery pipe 30 can quickly enter the top box 50, and then enter the condensate return pipe 41 through the top box 50. The top box 50 can form a buffer space for the steam, allowing the steam in the steam delivery pipe 30 to flow quickly, reducing the possibility that the steam delivery pipe 30 will be subjected to greater pressure or reduced heat dissipation efficiency due to a slow steam flow rate in the steam delivery pipe 30. In some examples, the first outlet 32 ​​of the steam delivery pipe 30 and the second inlet 411 of the condensate return pipe 41 can be connected to the plate of the top box 50 facing the top cover 21.

[0093] In some examples, the condensers 40 arranged on both sides of the steam delivery pipe 30 can be arranged symmetrically with the condensers 40 on the other side, which helps to ensure the heat dissipation balance and consistency of the condensers 40 on both sides of the steam delivery pipe 30.

[0094] In an embodiment where multiple condensation return pipes 41 are arranged side by side, the second inlet 411 of the multiple condensation return pipes 41 is connected to the plate of the top box 50 facing the top cover 21.

[0095] In some examples, the steam delivery pipe 30 is welded to the top box 50. The condensate return pipe 41 is welded to the top box 50.

[0096] In some feasible ways, Figure 13 A partial cross-sectional view of the loop heat pipe cooling device 10 according to an embodiment of this application is schematically shown. See also Figure 13As shown, two or more condensers 40 are respectively arranged on both sides of the steam delivery pipe 30. Along the direction away from the steam delivery pipe 30, the two or more condensers 40 on one side of the steam delivery pipe 30 are arranged side-by-side. Each of the two or more condensers 40 on each side of the steam delivery pipe 30 is connected to the steam delivery pipe 30. The steam discharged from the steam delivery pipe 30 can simultaneously enter the multiple condensers 40 on both sides for condensation, effectively improving condensation efficiency and effect, ensuring rapid and complete condensation of steam, and improving heat dissipation efficiency.

[0097] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0098] The devices or elements referred to in the embodiments of this application or implied herein must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0099] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein.

[0100] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or apparatus.

[0101] The term "multiple" in this article refers to two or more. The term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Furthermore, the character " / " in this article generally indicates an "or" relationship between the preceding and following related objects; in formulas, the character " / " indicates a "division" relationship between the preceding and following related objects.

[0102] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application.

[0103] It is understood that, in the embodiments of this application, the order of the above-mentioned process numbers does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

Claims

1. A loop heat pipe heat dissipating device, characterized by, include: An evaporator, comprising a top cover and a bottom plate, wherein the top cover and the bottom plate form a boiling tank; A steam delivery pipe is connected to the top cover. The steam delivery pipe includes a first inlet and a first outlet. The first inlet of the steam delivery pipe is connected to the boiling tank. A condenser includes a condensation reflux pipe and a heat dissipation component disposed outside the condensation reflux pipe. The condensation reflux pipe includes a second inlet and a second outlet. The second inlet of the condensation reflux pipe is connected to the first outlet of the steam delivery pipe. The condensation reflux pipe is connected to the top cover, and the second outlet of the condensation reflux pipe is located inside the boiling tank. The steam delivery pipe and the condensate return pipe are arranged vertically, and the second outlet of the condensate return pipe is located below the surface of the cooling working fluid. The evaporator also includes a float, which is disposed in the boiling tank and is used to block or open the first inlet of the steam delivery pipe; The evaporator also includes a limiting mesh box, which includes a side mesh section and a bottom mesh section. The limiting mesh box is disposed in the boiling tank. The side mesh section of the limiting mesh box is connected to the top cover, and the bottom mesh section is disposed corresponding to the first inlet of the steam conveying pipe. The float is disposed in the limiting mesh box. The evaporator also includes an enhanced heat exchange component, which is disposed on the surface of the base plate facing the boiling tank. The enhanced heat exchange component has a porous structure; The condenser also includes metal fins connected to the inner surface of the condensate return pipe; The condensers are respectively installed on both sides of the steam delivery pipe. The loop heat pipe heat dissipation device also includes a top box. The first outlet of the steam delivery pipe is connected to the top box, and the second inlet of the condensate return pipe is connected to the top box. The heat dissipation component includes multiple heat dissipation fins, or the heat dissipation component includes heat dissipation fins and a housing, the housing being connected to the condensate return pipe, and a chamber for containing coolant being formed between the housing and the condensate return pipe, the heat dissipation fins being located inside the housing, and the heat dissipation fins being connected to the condensate return pipe.

2. The loop heat pipe thermal device of claim 1, wherein, The evaporator further includes a transfer pipe, which has a first open end and a second open end. The opening size of the first open end is smaller than that of the second open end. The first open end of the transfer pipe is connected to the first inlet of the steam delivery pipe, and the second open end of the transfer pipe is connected to the top cover. The transfer pipe includes a receiving part for accommodating the float, and the receiving part is connected to the boiling tank.

3. The loop heat pipe cooling device according to claim 1 or 2, characterized in that, The number of condensation reflux pipes is multiple, and the multiple condensation reflux pipes are arranged side by side.

4. The loop heat pipe cooling device according to claim 1 or 2, wherein Two or more condensers are respectively provided on both sides of the steam conveying pipe, and two or more condensers are arranged side by side on one side of the steam conveying pipe along the direction away from the steam conveying pipe.

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