Smart wearable devices

Abstract

The present invention discloses an intelligent wearable device, which includes a housing, a circuit assembly, and a temperature adjustment assembly. The housing is provided with a mounting cavity, the circuit assembly is provided in the mounting cavity, and the temperature adjustment assembly includes an adjustment member and a reversing switch provided in the mounting cavity. The adjustment member is provided on at least one side of the circuit assembly, the adjustment member has a first surface facing the circuit assembly, and the adjustment member and the reversing switch are electrically connected to the circuit assembly in sequence; wherein the circuit assembly controls the reversing switch to switch the direction of current in the adjustment member so as to cool or release heat on the first surface. The technical solution of the present application changes the direction of current in the adjustment member by adjusting the reversing switch, so as to cool or heat the first surface of the adjustment member, thereby adjusting the temperature in the mounting cavity, ensuring that the various components in the intelligent wearable device operate in an appropriate temperature environment, ensuring efficient operation, and enabling the intelligent wearable device to meet a wider range of usage environments.

Description

Technical Field

[0001] The present invention relates to the technical field of smart wearable devices, and in particular to a smart wearable device. Background Art

[0002] The smart wearable industry is experiencing rapid growth, with smartwatches, smart bracelets, and other smart wearable devices gaining widespread market acclaim for their diverse health and fitness features. These devices typically feature a main body for displaying information and enabling interactive functions such as presses or touch controls.

[0003] Smart wearable devices generate a lot of heat under high loads and are prone to heat accumulation. In lower temperatures, such as when diving or outdoors in winter, the devices can easily become cold and malfunction. Existing smart wearable devices often incorporate heat-conducting layers to dissipate heat, or employ insulation layers to achieve thermal insulation. These methods are limited in functionality, inefficiency, and inflexibility, making them inflexible in complex working environments. Summary of the Invention

[0004] The main purpose of the present invention is to provide a smart wearable device, which aims to achieve temperature regulation within the smart wearable device, make the product work more efficiently, and have more diverse usage scenarios.

[0005] To achieve the above objectives, the smart wearable device proposed by the present invention includes:

[0006] A housing, wherein the housing is provided with a mounting cavity;

[0007] a circuit assembly, the circuit assembly being disposed in the mounting cavity; and

[0008] a temperature adjustment assembly, the temperature adjustment assembly comprising an adjustment member and a reversing switch disposed in the mounting cavity, the adjustment member being disposed on at least one side of the circuit assembly, the adjustment member having a first surface facing the circuit assembly, the adjustment member and the reversing switch being electrically connected to the circuit assembly in sequence;

[0009] The circuit assembly controls the reversing switch to switch the direction of the current in the regulating member so as to cool or release heat on the first surface.

[0010] In one embodiment, the adjusting member is provided with an adjusting layer, and the adjusting layer is provided with the first surface and a second surface facing away from the circuit component;

[0011] The regulating layer has a first state in which the first surface releases heat and the second surface cools, and a second state in which the first surface cools and the second surface releases heat. The regulating layer is electrically connected to the circuit component through the reversing switch, and the circuit component controls the reversing switch to switch between the first state and the second state.

[0012] In one embodiment, the adjusting member further includes a first heat-conducting layer, and the first heat-conducting layer is attached to the first surface;

[0013] And / or, the adjusting member further includes a second heat-conducting layer, and the second heat-conducting layer is attached to the second surface.

[0014] In one embodiment, a limiting plate is provided in the installation cavity, and the limiting plate and the side wall of the installation cavity are combined to form a limiting groove, and the adjusting member is provided in the limiting groove.

[0015] In one embodiment, the limiting groove is arranged around the circuit component.

[0016] In one embodiment, the limiting plate is a heat conducting member, and the first surface is in contact with the limiting plate.

[0017] In one embodiment, a plurality of heat conducting grooves are provided at intervals on the outer side wall of the limiting groove;

[0018] And / or, a plurality of heat-conducting grooves are provided at intervals on the outer side surface of the shell.

[0019] In one embodiment, the circuit assembly is provided with a circuit board, the circuit board is provided in the mounting cavity, the circuit board is provided with a switch circuit, and the switch circuit is electrically connected to the reversing switch;

[0020] The smart wearable device further includes a button, which partially extends into the mounting cavity and is used to trigger the switch circuit.

[0021] In one embodiment, a first avoidance hole is provided on a side surface of the housing, and the adjusting member is provided with a second avoidance hole facing the first avoidance hole. A connecting passage communicating with the mounting cavity is formed between the first avoidance hole and the second hole, and part of the buttons are movably disposed in the connecting passage.

[0022] The circuit board is provided with a shrapnel switch, which is electrically connected to the switch circuit. The shrapnel switch is on the movement path of the key, so that the key can trigger the shrapnel switch.

[0023] In one embodiment, the reversing switch is a double-pole double-throw switch, and the reversing switch is electrically connected to the circuit board.

[0024] The technical solution of the present application sets a circuit component and a temperature adjustment component in the installation cavity. The temperature adjustment component includes an adjustment part and a reversing switch. The adjustment part and the reversing switch are electrically connected to the circuit component in sequence. The circuit component changes the direction of the current in the adjustment part by adjusting the reversing switch, so that the first surface of the adjustment part is cooled or heated, thereby adjusting the temperature in the installation cavity, ensuring that each component in the smart wearable device operates in a suitable temperature environment, ensuring work efficiency and enabling the smart wearable device to meet more diverse usage environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0026] Figure 1 This is a schematic structural diagram of an embodiment of a smart wearable device of the present invention;

[0027] Figure 2 for Figure 1 Schematic diagram of the explosion structure of the smart wearable device;

[0028] Figure 3 for Figure 2 Schematic diagram of the enlarged structure at A in the middle;

[0029] Figure 4 Schematic diagram of the structure of a temperature adjustment component according to an embodiment of the present invention.

[0030] Description of Figure Numbers:

[0031]

[0032]

[0033] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0035] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0036] In addition, the descriptions of "first", "second", etc. in the present invention are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0037] In order to achieve temperature regulation in a smart wearable device, make the product work more efficiently, and have more diverse usage scenarios, the present invention proposes a smart wearable device 100.

[0038] Optionally, the smart wearable device 100 may be a watch, a bracelet, a necklace, etc.

[0039] Reference Figures 1 to 4 In some embodiments of the present invention, the smart wearable device 100 includes a shell 10, a circuit component 30 and a temperature adjustment component 50. The shell 10 is provided with an installation cavity 10a, and the circuit component 30 is provided in the installation cavity 10a. The temperature adjustment component 50 includes an adjustment member 51 and a reversing switch 53 provided in the installation cavity 10a. The adjustment member 51 is provided on at least one side of the circuit component 30. The adjustment member 51 has a first surface facing the circuit component 30. The adjustment member 51 and the reversing switch 53 are electrically connected to the circuit component 30 in sequence; wherein, the circuit component 30 controls the reversing switch 53 to switch the direction of the current in the adjustment member 51 so that the first surface cools or releases heat.

[0040] The housing 10 is used to mount and accommodate functional modules such as the circuit assembly 30 and the temperature control assembly 50 of the smart wearable device 100. To facilitate the processing and molding of the housing 10, in one embodiment, the housing 10 comprises an outer shell and a bottom shell, each of which can be independently designed and processed. The outer shell is frame-shaped or annular, and the bottom shell is located on one side of the outer shell and can be sealed to the outer shell by gluing or other means to form an integrated structure of the housing 10 and the aforementioned accommodating cavity.

[0041] Typically, the smart wearable device 100 also includes a display portion connected to the housing 10. The display portion is used to display information on the smart wearable device 100, such as clock information, image information, etc. The display portion and the housing 10 are sealed to provide waterproof and dustproof protection for the functional modules within the mounting cavity 10a.

[0042] In one embodiment, the circuit assembly 30 occupies the center of the mounting cavity 10a, and the adjustment member 51 is located to the side of the circuit assembly 30, between the circuit assembly 30 and the sidewall of the mounting cavity 10a. Alternatively, the adjustment member 51 can be located to the side of a specific portion of the circuit assembly 30 to provide targeted temperature regulation. The adjustment member 51 can include multiple sections spaced apart along the circumference of the circuit assembly 30 to provide comprehensive temperature regulation within the mounting cavity 10a. Alternatively, the adjustment member 51 can be located around the circuit assembly 30 to achieve comprehensive and uniform temperature regulation.

[0043] The specific shape of the adjustment member 51 is adapted to the shape of the housing 10. For example, when the housing 10 is generally circular, the adjustment member 51 may be an arcuate plate segment or an annular member extending along the circumference of the circuit assembly 30; when the housing 10 is generally polygonal, the adjustment member 51 may be a straight plate segment or a plate structure similar in shape to the housing 10.

[0044] In this embodiment, the regulating element 51 utilizes solid-state cooling technology. Specifically, the regulating element 51 includes a PN layer, a thermocouple formed by connecting an N-type semiconductor material and a P-type semiconductor material. Due to the Peltier effect, when current flows through the PN layer, heat migrates between the two ends, creating a temperature difference. When the current in the thermocouple reverses, the heat flow direction also reverses. Therefore, by changing the direction of the current in the regulating element 51, the first surface can be cooled or released.

[0045] Optionally, the reversing switch 53 can be adjusted according to temperature information feedback via input instructions or the circuit component 30 to change the direction of the current in the regulating member 51. The reversing switch 53 can be a relay.

[0046] In this way, the technical solution of the present application sets a circuit component 30 and a temperature adjustment component 50 in the installation cavity 10a. The temperature adjustment component 50 includes an adjustment part 51 and a reversing switch 53. The adjustment part 51 and the reversing switch 53 are electrically connected to the circuit component 30 in sequence. The circuit component 30 changes the direction of the current in the adjustment part 51 by adjusting the reversing switch 53, so that the first surface of the adjustment part 51 is cooled or heated, thereby adjusting the temperature in the smart wearable device 100, ensuring that each component in the smart wearable device 100 operates in a suitable temperature environment, ensuring work efficiency and enabling the smart wearable device 100 to meet more diverse usage environments.

[0047] Reference Figure 1 and Figure 4 In one embodiment, the adjusting member 51 is provided with an adjusting layer 511, the adjusting layer 511 is provided with a first surface and a second surface facing away from the circuit assembly 30, and the first heat-conducting layer 513 is attached to the first surface; wherein, the adjusting layer 511 has a first state in which the first surface releases heat and the second surface cools, and a second state in which the first surface cools and the second surface releases heat. The adjusting layer 511 is electrically connected to the circuit assembly 30 through the reversing switch 53, and the circuit assembly 30 controls the reversing switch 53 to switch between the first state and the second state.

[0048] Specifically, the adjustment layer 511 includes a PN layer. To facilitate heat transfer, the adjustment layer 511 is configured as a plate with a certain side area. The two surfaces of the adjustment layer 511 are respectively a first surface and a second surface. When the adjustment layer 511 is energized, heat can rapidly migrate between the first and second surfaces. Therefore, in the first state, heat migrates from the first surface to the second surface, causing the temperature of the first surface to be higher than that of the second surface. The heat from the first surface is dissipated into the mounting cavity 10a through the first thermal conductive layer 513, thereby achieving the purpose of heating. In the second state, heat migrates from the second surface to the first surface, causing the temperature of the first surface to be lower than that of the second surface. The air or components in the mounting cavity 10a exchange heat with the first surface through the first thermal conductive layer 513, thereby achieving the purpose of heat dissipation.

[0049] In one embodiment, to ensure more uniform heat transfer, the regulating member 51 further includes a first heat-conducting layer 513, which is attached to the first surface of the regulating layer 511. The first heat-conducting layer 513 is a thermally conductive insulating sheet whose shape is adapted to the regulating layer 511 to ensure good adhesion to the regulating layer 511 and improve thermal conductivity.

[0050] In one embodiment, the adjustment layer 511 and the first heat-conducting layer 513 are bonded together by a thermal conductive agent, which can be thermal conductive silicone grease. While tightly bonding the adjustment layer 511 and the first heat-conducting layer 513, the gap between them is fully filled to reduce thermal resistance and improve thermal conductivity efficiency.

[0051] Furthermore, in one embodiment, the adjustment member 51 further includes a second heat-conducting layer, which is attached to the second surface. Its structure and function are similar to those of the first heat-conducting layer 513 described above, and details thereof will not be repeated here. The second heat-conducting layer can be bonded to the adjustment layer 511 using a thermally conductive agent such as thermal grease, or the second heat-conducting layer can be a thermally conductive coating such as thermal paste.

[0052] Reference Figure 1 and Figure 3 In one embodiment, a limiting plate 11 is provided in the installation cavity 10a. The limiting plate 11 and the side wall of the installation cavity 10a are combined to form a limiting groove 11a. The adjusting member 51 is provided in the limiting groove 11a.

[0053] In this embodiment, the limiting plate 11 protrudes from the bottom wall of the mounting cavity 10a and is disposed opposite the sidewall of the mounting cavity 10a to form the aforementioned limiting groove 11a. The curvature, length, and height of the limiting groove 11a are adapted to the adjustment member 51 so that the limiting groove 11a can effectively limit the adjustment member 51 and improve stability.

[0054] Optionally, when the adjusting member 51 is a plate disposed on one side of the circuit assembly 30 , both ends of the limiting plate 11 may be bent toward the side walls of the mounting cavity 10 a so that the adjusting member 51 cannot escape from both sides of the limiting groove 11 a .

[0055] Reference Figure 3 In one embodiment, the limiting groove 11a surrounds the circuit assembly 30. In this embodiment, the outer contour of the housing 10 is generally circular. The limiting plate 11 surrounds the circuit assembly 30 and, together with the sidewalls of the mounting cavity 10a, forms an annular limiting groove 11a. The regulating member 51 is also annular and is positioned within the limiting groove 11a to achieve comprehensive and uniform temperature regulation within the mounting cavity 10a.

[0056] A pin 5111 extends from one side of the adjustment member 51 and connects to the circuit assembly 30. The retaining plate 11 is provided with a structure for avoiding the pin 5111. In this embodiment, one side of the retaining groove 11a is open to facilitate the entry of the annular adjustment member 51 into the retaining groove 11a. The retaining plate 11 also has a relief groove 11c or a through hole to allow the pin 5111 to pass through the retaining plate 11 and connect to the circuit assembly 30.

[0057] Optionally, the end surface of the limiting plate 11 close to the opening is sunken to form two avoidance grooves 11 c.

[0058] In one embodiment, the limiting plate 11 is a heat conductor, and the first surface of the limiting plate 11 is in contact with the limiting plate 11, which is used to conduct heat. The distance between the two opposing side walls of the limiting groove 11a is roughly equivalent to the thickness of the adjusting member 51, so that the adjusting member 51 can be firmly restrained and fixed by the limiting groove 11a. The first and second surfaces of the adjusting member 51 are well contacted with the side walls of the limiting groove 11a, improving the efficiency of heat conduction and thus the efficiency of temperature regulation.

[0059] Optionally, the limiting plate 11 and the shell 10 can be made of metal, such as aluminum alloy, or thermal conductive materials such as thermal conductive ceramics, so that heat can be transferred in the limiting plate 11 and the shell 10 with higher efficiency, further improving the efficiency of temperature regulation.

[0060] In one embodiment, a plurality of heat-conducting grooves are provided at intervals along the sidewalls of the limiting groove 11a. In this embodiment, the heat-conducting grooves can be provided along the extension direction or the groove depth direction of the limiting groove 11a, and the cross-section of the heat-conducting grooves can be serrated or concave-convex to increase the contact area with the air and improve the heat conduction efficiency.

[0061] It can be understood that if heat is transferred between the first surface and the limiting plate 11 through contact, the heat conduction groove is arranged on the outer wall of the limiting groove 11a; if heat is transferred between the first surface and the limiting plate 11 through air, the heat conduction groove is arranged on the inner and outer walls of the limiting groove 11a.

[0062] Furthermore, a plurality of heat-conducting grooves are provided at intervals on the outer side surface of the housing 10 to increase the contact surface between the housing 10 and the outside air, thereby increasing the heat dissipation efficiency of the housing 10 .

[0063] Reference Figure 1 and Figure 2 In one embodiment, the circuit assembly 30 is provided with a circuit board 33, which is arranged in the installation cavity 10a. The circuit board 33 is provided with a switching circuit, which is electrically connected to the reversing switch 53; the smart wearable device 100 also includes a button 13, which partially extends into the installation cavity 10a and is used to trigger the switching circuit 33.

[0064] In this embodiment, the circuit board 33 is fixed to the bottom wall of the mounting cavity 10a and is used to collect signals, process data, and issue commands. The button 13 can be located on the side or front of the housing 10. The user can use the button 13 to send different signals to the circuit board 33 according to the actual application environment. The control module of the circuit board 33 controls the adjustment member 51 to operate in different states based on these signals, providing convenient and clear feedback.

[0065] Optionally, the circuit board 33 is provided with a switch element corresponding to the button 13, and the button 13 touches the switch element to trigger the switch circuit.

[0066] Optionally, the switch element is a spring switch 331 .

[0067] Optionally, in one embodiment, the circuit assembly 30 further includes a power supply 31 , which is electrically connected to the circuit board 33 and is used to provide electrical energy to components such as the circuit board 33 .

[0068] Specifically, in one embodiment, a first avoidance hole is provided on the side of the shell 10, and the adjusting member 51 is provided with a second avoidance hole 51a opposite to the first avoidance hole. A connecting channel connected to the installation cavity 10a is formed between the first avoidance hole and the second hole, and part of the button 13 can be movably arranged in the connecting channel; the circuit board 33 is provided with a spring switch 331, the spring switch 331 is electrically connected to the switching circuit, and the spring switch 331 is on the movement path of the button 13, so that the button 13 can trigger the spring switch 331.

[0069] In this embodiment, the button 13 is located on the side of the housing 10. The button 13 is a multi-section cylindrical entity. The first and second escape holes 51a are circular. A retaining structure is provided within the first escape hole to prevent the button 13 from being removed from the housing 10. A bracket is provided on the surface of the circuit board 33, and a spring switch 331 is mounted on the bracket, facing the button 13. Pressing the button 13 causes the end of the button 13 located within the mounting cavity 10a to press against the spring switch 331. Releasing the button 13 resets the button 13 via the elastic structure within the connecting channel.

[0070] Optionally, when the adjustment member 51 is disposed in the limiting groove 11a, the first avoidance hole communicates with the limiting groove 11a, and a third avoidance hole 11b is further provided on the limiting plate 11 to allow the button 13 to pass through. The limiting plate 11 is also formed with a frame structure for supporting the bracket, thereby improving the stability of the spring switch 331.

[0071] It is understandable that, in addition to the first state and the second state mentioned in the above embodiment, the circuit assembly 30 can also cut off the power supply from the power supply 31 to the adjustment member 51, so that the adjustment member 51 is in the third state, ie, the non-operating state.

[0072] In combination with the above embodiment, a reference situation of key 13 control is given below:

[0073] The adjusting member 51 is in the third state;

[0074] The user long presses the button 13, the spring switch 331 generates a continuous signal, and the circuit board 33 controls the adjustment member 51 to be energized, entering the first state or the second state;

[0075] When the user presses the button 13 for the first time, the dome switch 331 generates a touch signal, and the circuit board 33 controls the reversing switch 53 to change the current in the regulating member 51;

[0076] The user presses the button 13 again, the dome switch 331 generates a touch signal, and the circuit board 33 controls the reversing switch 53, changing the current in the regulating member 51 again;

[0077] The user long presses the button 13 again, the spring switch 331 generates a continuous signal, and the circuit board 33 controls the regulating member 51 to cut off the power supply, so that the regulating member 51 enters the third state.

[0078] In another embodiment, the smart wearable device 100 is provided with a display component electrically connected to the circuit board 33. The user can also input corresponding instructions through the display component to control the state of the adjustment member 51 to cope with different usage environments.

[0079] In another embodiment, the regulating member 51 can also realize automatic start and stop through self-feedback of the control module of the circuit board 33, which is more intelligent and convenient.

[0080] In this embodiment, a temperature sensor for sensing temperature is provided within the housing 10 and is electrically connected to the circuit assembly 30. When the temperature sensor senses that the temperature of a component or within the mounting cavity 10a is below a predetermined value, it sends a signal to the circuit assembly 30, which in turn powers the adjustment member 51 and controls heat release from the first surface. When the temperature sensor senses that the temperature of a component or within the mounting cavity 10a is above a predetermined value, it sends a signal to the circuit assembly 30, which powers the adjustment member 51 and adjusts the direction of current flow within the adjustment member 51 via the reversing switch 53, thereby cooling the first surface. When the temperature is within a predetermined range, the circuit assembly 30 de-energizes the adjustment member 51, entering a third state.

[0081] In one embodiment, the change-over switch 53 is a double-pole double-throw switch, and the change-over switch 53 is electrically connected to the circuit board 33 .

[0082] Reference Figure 4 In this embodiment, the adjustment member 51 extends two pins 5111, and the reversing switch 53 is connected to the two pins 5111. The reversing switch 53 can simultaneously connect or disconnect the two pins 5111 and switch the connection direction of the two pins 5111. It can be understood that when the reversing switch 53 is disconnected, it corresponds to the third state of the aforementioned embodiment; when the reversing switch 53 connects the two pins 5111 in the forward direction, it corresponds to the first state of the aforementioned embodiment; and when the reversing switch 53 connects the two pins 5111 in the reverse direction, it corresponds to the second state of the aforementioned embodiment.

[0083] The switching between the three states can be realized more conveniently by controlling the reversing switch 53 through the circuit board 33 .

[0084] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention description and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A smart wearable device, characterized in that: include: A housing, wherein the housing is provided with a mounting cavity; a circuit assembly, the circuit assembly being disposed in the mounting cavity; and a temperature adjustment assembly, the temperature adjustment assembly comprising an adjustment member and a reversing switch disposed in the mounting cavity, the adjustment member being disposed on at least one side of the circuit assembly and surrounding the circuit assembly, the adjustment member having a first surface facing the circuit assembly, the adjustment member and the reversing switch being electrically connected to the circuit assembly in sequence; The regulating member is provided with a PN layer, which is a thermocouple formed by connecting an N-type semiconductor material and a P-type semiconductor material; The circuit assembly controls the reversing switch to switch the direction of the current in the regulating member so as to cool or release heat on the first surface.

2. The smart wearable device according to claim 1, wherein: The adjusting member is provided with an adjusting layer, the adjusting layer includes the PN layer, and the adjusting layer is provided with the first surface and a second surface facing away from the circuit component; The regulating layer has a first state in which the first surface releases heat and the second surface cools, and a second state in which the first surface cools and the second surface releases heat. The regulating layer is electrically connected to the circuit component through the reversing switch, and the circuit component controls the reversing switch to switch between the first state and the second state.

3. The smart wearable device according to claim 2, wherein: The regulating member further includes a first heat-conducting layer, and the first heat-conducting layer is attached to the first surface; And / or, the adjusting member further includes a second heat-conducting layer, and the second heat-conducting layer is attached to the second surface.

4. The smart wearable device according to claim 1, wherein: A limiting plate is provided in the installation cavity. The limiting plate and the side wall of the installation cavity are combined to form a limiting groove. The adjusting member is provided in the limiting groove.

5. The smart wearable device according to claim 4, wherein: The limiting groove is arranged around the circuit component.

6. The smart wearable device according to claim 4, wherein: The limiting plate is a heat conducting member, and the first surface is attached to the limiting plate.

7. The smart wearable device according to claim 4, wherein: The side walls of the limiting groove are provided with a plurality of heat conducting grooves at intervals; And / or, a plurality of heat-conducting grooves are provided at intervals on the outer side surface of the shell.

8. The smart wearable device according to any one of claims 1 to 7, wherein: The circuit assembly is provided with a circuit board, the circuit board is arranged in the installation cavity, the circuit board is provided with a switch circuit, and the switch circuit is electrically connected to the reversing switch; The smart wearable device further includes a button, which partially extends into the mounting cavity and is used to trigger the switch circuit.

9. The smart wearable device according to claim 8, wherein: A first avoidance hole is provided on a side surface of the housing, and a second avoidance hole is provided on the adjusting member opposite to the first avoidance hole. A connecting passage communicating with the mounting cavity is formed between the first avoidance hole and the second avoidance hole, and at least part of the button is movably disposed in the connecting passage. The circuit board is provided with a shrapnel switch, which is electrically connected to the switch circuit. The shrapnel switch is on the movement path of the key, so that the key can trigger the shrapnel switch.

10. The smart wearable device according to claim 8, wherein: The reversing switch is a double-pole double-throw switch, and the reversing switch is electrically connected to the circuit board.

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