PCB power board and power supply

Abstract

This application provides a power PCB and a power supply. The power PCB includes a moving point layer and a static point layer, with a shielding layer disposed between the moving point layer and the static point layer. When the PCB is powered on and operating, the voltage variation amplitude of the static point layer is less than a first set threshold, while the voltage variation amplitude of the moving point layer is greater than a second set threshold, and the second set threshold is no less than the first set threshold. This application can improve the operating performance of the PCB power board.

Description

Technical Field

[0001] The present application relates to the field of power supply technology, and in particular to a PCB power board and a power supply. Background Art

[0002] With the continuous advancement of technology, the requirements for power supplies are becoming increasingly stringent. Electromagnetic compatibility (EMC), as a key power supply indicator, is gaining increasing attention. When designing printed circuit board (PCB) power supplies, a layered layout is often used to improve EMC performance.

[0003] Most existing methods simply separate the signal layer and the power supply layer, and lay out the power traces on the same layer without considering the impact of the power traces on EMC, which is likely to degrade the performance of the power supply. Summary of the Invention

[0004] The embodiments of the present application provide a PCB power board and a power supply to solve the problem that the existing power supply only arranges the power lines on the same layer without considering the impact of the power lines on EMC.

[0005] In a first aspect, the present application provides a PCB power board, comprising a dynamic point layer and a static point layer, wherein a shielding layer is provided between the dynamic point layer and the static point layer;

[0006] When the PCB power board is powered on, the voltage change amplitude of the static point layer is less than the first set threshold, the voltage change amplitude of the dynamic point layer is greater than the second set threshold, and the second set threshold is not less than the first set threshold.

[0007] In a possible implementation, the shielding layer is at least one of a positive busbar layer, a negative busbar layer, and a grounding layer, and the positive busbar layer and / or the negative busbar layer each include at least one busbar absorption capacitor.

[0008] In a possible implementation, the number of moving point layers is a first number, and the number of static point layers is a second number;

[0009] The shielding layer has a first number of moving point layers on the first side and a second number of static point layers on the second side; wherein the first number of moving point layers are adjacent to each other and the second number of static point layers are adjacent to each other.

[0010] In a possible implementation, the first number of moving-point layers are arranged on the first side of the shielding layer in order from small to large voltage variation amplitudes and from near to far;

[0011] The first number of static point layers are arranged on the second side of the shielding layer in order from small to large voltage variation amplitudes and from near to far.

[0012] In a possible implementation, the number of moving point layers is a third number, and the number of static point layers is a fourth number;

[0013] The third number of moving point layers and the fourth number of static point layers are arranged alternately, and at least one shielding layer is provided between each static point layer and each moving point layer.

[0014] In a possible implementation, the PCB power board further includes a signal layer, and the shielding layer includes a first shielding layer and a second shielding layer;

[0015] The signal layer, the first shielding layer, the dynamic point layer, the second shielding layer and the static point layer are sequentially arranged on the PCB power board.

[0016] In a second aspect, the present application provides a PCB power board, comprising one or two power layers, the power layer comprising a static point area and a dynamic point area;

[0017] When the PCB power board is powered on, the voltage change amplitude in the static point area is less than the third set threshold, the voltage change amplitude in the dynamic point area is greater than the fourth set threshold, and the fourth set threshold is not less than the third set threshold.

[0018] In a possible implementation, the static point area includes a first static point area and a second static point area, and the moving point area includes a first moving point area, a second moving point area, and a third moving point area;

[0019] The first static point area, the first moving point area, the second moving point area, the second static point area and the third moving point area are sequentially arranged on the power layer from left to right.

[0020] In a possible implementation, the static point area includes at least one of a positive bus area, a negative bus area, and a ground area.

[0021] In a third aspect, the present application provides a power supply, comprising a PCB power board as described in any one of the first aspects and / or a PCB power board as described in any one of the second aspects.

[0022] Embodiments of the present application provide a PCB power board and power supply, the power board comprising a dynamic point layer and a static point layer, with a shielding layer disposed between the dynamic point layer and the static point layer. By designing the PCB power board in layers, the dynamic point layer (where voltage amplitude varies significantly) and the static point layer (where voltage amplitude varies less significantly) are separated by the shielding layer. This effectively reduces the mutual influence between the dynamic point layer and the static point layer, thereby improving the EMC performance of the PCB power board and avoiding the influence of power wiring. When the PCB power board is generally used as a power supply board, it can effectively improve the EMC performance of the power supply and enhance its operational reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] Figure 1 This is a schematic structural diagram of a PCB power board provided in an embodiment of the present application;

[0025] Figure 2 This is a structural diagram of another PCB power board provided in an embodiment of the present application;

[0026] Figure 3 This is a schematic structural diagram of a third PCB power board provided in an embodiment of the present application;

[0027] Figure 4 This is a schematic structural diagram of a fourth PCB power board provided in an embodiment of the present application;

[0028] Figure 5 This is a structural diagram of the fifth PCB power board provided in an embodiment of the present application;

[0029] Figure 6 This is a top view schematic diagram of a PCB power board provided in an embodiment of the present application;

[0030] Figure 7 This is a top view schematic diagram of another PCB power board provided in an embodiment of the present application. DETAILED DESCRIPTION

[0031] To help those skilled in the art better understand this solution, the following will clearly describe the technical solutions in the embodiments of this solution in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of this solution, not all of it. Based on the embodiments of this solution, all other embodiments obtained by those skilled in the art without creative work should fall within the scope of protection of this solution.

[0032] Throughout the specification, claims, and accompanying figures of this solution, the term "including" and any variations thereof mean "including, but not limited to," and are intended to cover non-exclusive inclusions and are not limited to the examples listed herein. Furthermore, the terms "first" and "second," etc., are used to distinguish between different objects, not to describe a specific order.

[0033] For some switching power supplies that include switching transistors, the static point represents the signal directly connected to the switching transistor without passing through the energy storage inductor. The voltage amplitude changes slightly after power-on. The dynamic point represents the signal input or output to the main power inductor. The voltage amplitude changes significantly after power-on. In actual applications, it has been found that when the dynamic and static points are arranged in layers and overlap, the dynamic point can couple to the static point through the interlayer capacitance, interfering with the static point and causing radiation to be transmitted from the static point, resulting in poor EMC performance of the power supply.

[0034] To solve the above problems, an embodiment of the present application provides a PCB power board, which improves the EMC performance of the power supply side from the perspective of layered layout of the power supply layer.

[0035] The following is a detailed description of the implementation of this application with reference to the accompanying drawings:

[0036] Figure 1 This is a schematic diagram of the structure of a power supply PCB power board provided in an embodiment of the present application. Figure 1 The power PCB power board includes a dynamic point layer D and a static point layer J, and a shielding layer P is provided between the dynamic point layer and the static point layer.

[0037] When the PCB power board is powered on, the voltage change amplitude of the static point layer J is less than the first set threshold, the voltage change amplitude of the dynamic point layer D is greater than the second set threshold, and the second set threshold is not less than the first set threshold.

[0038] The PCB power board in the embodiment of the present application can be a PCB board that carries strong electrical signals, i.e., a power supply layer. The dynamic point layer represents a power routing layer with large voltage fluctuations, while the static point layer represents a power routing layer with small voltage fluctuations. The first and second set thresholds can be determined based on actual conditions.

[0039] The dynamic point layer D, the shielding layer P and the static point layer J can be arranged on the PCB power board from top to bottom or from bottom to top, and the specific selection can be made according to actual conditions.

[0040] Optionally, the shielding layer P may be a grounding layer. For some power supplies that include positive / negative busbars, since the busbars generally include multiple absorption capacitors, the positive / negative busbars may also serve as shielding layers, that is, the positive busbar layer and / or the negative busbar layer may serve as shielding layers.

[0041] The embodiments of the present application isolate the dynamic point layer from the static point layer through a shielding layer, preventing the dynamic point layer and the static point layer from overlapping each other, eliminating interlayer coupling capacitance, and preventing static point radiation, thereby significantly improving the EMC performance of the PCB power board. In addition, for power boards that use the positive busbar layer and / or negative busbar layer as a shielding layer, there is no need to provide a separate grounding layer, effectively utilizing the internal circuit lines, reducing the number of layout layers without generating external interference to the PCB board, greatly improving the layout convenience of the PCB power board, and at the same time reducing the production cost of the PCB power board.

[0042] See also Figure 2 , which shows a structural diagram of another PCB power board provided by an embodiment of the present application. Figure 2 As shown, in some embodiments of the present application, the number of dynamic point layers is a first number M, and the number of static point layers is a second number N;

[0043] The shielding layer P has a first number M of moving point layers on the first side and a second number N of static point layers on the second side; wherein the first number M of moving point layers are adjacent to each other, and the second number N of static point layers are adjacent to each other.

[0044] For example, Figure 2 As shown, the dynamic point layers D1, D2, ..., DM are arranged on the upper side of the shielding layer P from bottom to top, and the static point layers J1, J2, ..., JN are arranged on the lower side of the shielding layer P from top to bottom, and M and N are both positive integers.

[0045] In the embodiment of the present application, multiple dynamic point layers and multiple static point layers are separately arranged on both sides of the shielding layer. On the basis of improving the EMC performance of the PCB power board, the number of layers of the PCB power board can be reduced, and the production cost can be reduced to a certain extent.

[0046] In some embodiments of the present application, the first number of moving-point layers are arranged on the first side of the shielding layer in order from small to large voltage variation amplitudes and from near to far;

[0047] The first number of static point layers are arranged on the second side of the shielding layer in order from small to large voltage variation amplitudes and from near to far.

[0048] The voltage amplitude changes of different static point layers may be different, and the voltage amplitude changes of different dynamic point layers may also be different. According to the magnitude of the voltage amplitude change, multiple static point layers and multiple dynamic point layers can be set on both sides of the shielding layer P.

[0049] For example, Figure 2As shown, for the dynamic point layers D1, D2, ..., DM, the voltage amplitude changes are all greater than the second set threshold value. According to the voltage amplitude change from small to large, the dynamic point layers D1, D2, ..., DM can be sequentially arranged from bottom to top on the upper side of the shielding layer P. Similarly, for the static point layers J1, J2, ..., JN, the voltage amplitude changes are all less than the first set threshold value. According to the voltage amplitude change from small to large, the static point layers J1, J2, ..., JN can be sequentially arranged from top to bottom on the lower side of the shielding layer P.

[0050] In the embodiment of the present application, the static point layer and the dynamic point layer with large voltage amplitude transformation are arranged at a position away from the shielding layer, which can improve the EMC performance of the PCB power board from a design perspective, thereby improving the working reliability of the product.

[0051] See also Figure 3 , which shows a schematic structural diagram of a third PCB power board provided in an embodiment of the present application. In some embodiments of the present application, the number of dynamic point layers is a third number X, and the number of static point layers is a fourth number Y;

[0052] The third number X of moving point layers and the fourth number Y of static point layers are alternately arranged, and at least one shielding layer P is provided between each static point layer and each moving point layer.

[0053] The moving point layer and the static point layer can be staggered. X and Y are both positive integers. The third number X and the fourth number Y can be the same or different. When X≠Y, the extra static point layers can be set adjacent to each other and used as a static point layer, or the extra moving point layers can be set adjacent to each other and used as a moving point layer. When X=Y, the moving point layer and the static point layer can be staggered directly. Among them, it is necessary to ensure that there is at least one shielding layer between the moving point layer and the static point layer. The first number M, the second number N, the third number X and the fourth number Y can be the same or different, and are selected according to the actual wiring situation.

[0054] For example, Figure 3 As shown, when X=Y, the PCB power board can be set to the form of D1-P-J1-.....-DX-P-JY.

[0055] The embodiment of the present application can achieve multi-layer shielding by staggering multiple dynamic point layers and multiple static point layers, and setting at least one shielding layer between the dynamic point layer and the static point layer, thereby further improving the EMC performance of the power board.

[0056] See also Figure 4 , which shows a schematic structural diagram of the fourth PCB power board provided in the embodiment of the present application. Figure 4As shown, in some embodiments of the present application, the dynamic point layer includes a first dynamic point layer D1 and a second dynamic point layer D2, and the static point layer includes a first static point layer J1;

[0057] The first moving point layer D1 and the second moving point layer D2 are adjacent to each other, and the shielding layer P is provided between the second moving point layer D2 and the first static point layer J1.

[0058] See also Figure 5 , which shows a schematic structural diagram of the fifth PCB power board provided in the embodiment of the present application. Figure 5 As shown, in some embodiments of the present application, the PCB power board further includes a signal layer Z, and the shielding layer includes a first shielding layer P1 and a second shielding layer P2;

[0059] The signal layer Z, the first shielding layer P1, the dynamic point layer D, the second shielding layer P2 and the static point layer J are sequentially arranged on the PCB power board.

[0060] The embodiment of the present application separates the signal layer Z, the dynamic point layer D and the static point layer J through a shielding layer, which can effectively reduce the mutual interference between the layers and further improve the EMC performance of the PCB power board.

[0061] Most of the above embodiments are layouts of three-layer or more-layer PCB power boards. For one-layer or two-layer PCB power boards, the embodiments of the present application provide the following solutions.

[0062] See also Figure 6 , which shows a schematic top view of a PCB power board provided in an embodiment of the present application. Figure 6 As shown, in some embodiments of the present application, the PCB power board includes one or two power layers, and the power layer includes a static point area J0 and a dynamic point area D0;

[0063] When the PCB power board is powered on, the voltage variation amplitude of the static point area J0 is less than the third set threshold, the voltage variation amplitude of the dynamic point area D0 is greater than the fourth set threshold, and the fourth set threshold is not less than the third set threshold.

[0064] The third set threshold and the fourth set threshold can be determined according to actual conditions.

[0065] Optionally, the static point area may include at least one of a positive bus area, a negative bus area, and a grounding area.

[0066] See also Figure 7 , which shows a top view of another PCB power board provided in an embodiment of the present application. As shown in Figure 7, in some embodiments of the present application, the static point area includes a first static point area J01 and a second static point area J02, and the dynamic point area includes a first dynamic point area D01, a second dynamic point area D02, and a third dynamic point area D03;

[0067] The first static point area J01 , the first moving point area D01 , the second moving point area D02 , the second static point area J02 and the third moving point area D03 are sequentially arranged on the power layer from left to right.

[0068] The embodiment of the present application divides a single-layer power board or a double-layer power board into a dynamic point area and a static point area, and groups areas with similar voltage change amplitudes together, thereby effectively avoiding interference between different areas and ensuring the EMC performance of the PCB power board.

[0069] An embodiment of the present application also provides a power supply, including a PCB power board as described in any of the above embodiments.

[0070] The embodiment of the present application effectively ensures the EMC performance of the power supply by isolating and dividing the power supply layer. At the same time, when the positive / negative busbars are used as the shielding layer, the number of board layers can be saved without generating external interference to the PCB power board. After distinguishing the dynamic point layer, the static point layer and the shielding layer, the number of dynamic point layers and the number of static point layers can be determined according to the routing requirements, and finally the shielding layer can be set between the dynamic point layer and the static point layer. This can not only improve EMC performance but also reduce production costs, and has wide practicality.

[0071] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A PCB power board, characterized in that: It comprises a dynamic point layer and a static point layer, wherein a shielding layer is provided between the dynamic point layer and the static point layer; When the PCB power board is powered on, the voltage change amplitude of the static point layer is less than a first set threshold, the voltage change amplitude of the dynamic point layer is greater than a second set threshold, and the second set threshold is not less than the first set threshold; The number of the moving point layers is a first number, and the number of the static point layers is a second number; The shielding layer has a first number of moving point layers on the first side and a second number of static point layers on the second side; wherein the first number of moving point layers are adjacent to each other, and the second number of static point layers are adjacent to each other; The first number of moving-point layers are arranged on the first side of the shielding layer in order from near to far according to the voltage variation amplitude from small to large; The first number of static point layers are arranged on the second side of the shielding layer in order from near to far according to the voltage change amplitude from small to large.

2. The PCB power board according to claim 1, wherein: The shielding layer is at least one of a positive busbar layer, a negative busbar layer and a grounding layer, and the positive busbar layer and / or the negative busbar layer each include at least one busbar absorption capacitor.

3. The PCB power board according to claim 1, wherein: The PCB power board further includes a signal layer, and the shielding layer includes a first shielding layer and a second shielding layer; The signal layer, the first shielding layer, the dynamic point layer, the second shielding layer and the static point layer are sequentially arranged on the PCB power board.

4. A power supply, characterized in that: Comprising the PCB power board as described in any one of claims 1 to 3.

Images