Display panel and display device

Abstract

The present application discloses a display panel and a display device. The display panel includes a display area and a non-display area. The non-display area is located on one side of the display area. The non-display area includes a binding area and a peripheral area. The binding area connects the display area and the peripheral area. The display panel includes an array substrate, a color filter substrate, and a flexible circuit board. The array substrate is located in the display area and the non-display area. The array substrate has a first surface and a second surface relative to each other. The array substrate has a recessed portion, the recessed portion is located in the peripheral area, and the opening of the recessed portion is located on the second surface. The color filter substrate is arranged on the second surface. The flexible circuit board is bound and connected to the array substrate located in the binding area. The flexible circuit board is bent toward the side of the color filter substrate away from the array substrate, and a portion of the flexible circuit board is bent and arranged in the recessed portion.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] Liquid Crystal Display (LCD) has the advantages of high image quality, small size, light weight, low voltage drive, low power consumption and wide range of applications. Therefore, it has been widely used in consumer electronics or computer products such as portable TVs, mobile phones, camcorders, notebook computers, and desktop monitors, becoming the mainstream display. Currently, in order to achieve a four-sided borderless display panel design, the most commonly used technical means is to flip it. Please refer to Figure 1 Unlike a conventional display panel structure, in a four-sided borderless display panel, the glass substrate of the array substrate 10 is located on the side close to the display surface of the display panel, while the color filter substrate 20 is located on the side of the array substrate 10 away from the display surface. The flexible circuit board 40 bends toward the side of the color filter substrate 20 away from the array substrate 10. Therefore, the bending of the flexible circuit board 40 deviates from the binding direction, causing the flexible circuit board 40 to peel off from the array substrate 10, thereby causing the display panel to fail. Summary of the Invention

[0003] Embodiments of the present application provide a display panel and a display device, which are used to solve the technical problem that a flexible circuit board falls off from an array substrate, thereby causing failure of the display panel.

[0004] An embodiment of the present application provides a display panel, including a display area and a non-display area, wherein the non-display area is located on at least one side of the display area, the non-display area includes a binding area and a peripheral area, and the binding area connects the display area and the peripheral area. The display panel includes:

[0005] an array substrate, the array substrate being located in the display area and the non-display area, the array substrate having a first surface and a second surface opposite to each other, the array substrate having a recessed portion, the recessed portion being located in the peripheral area, and an opening of the recessed portion being located on the second surface;

[0006] a color filter substrate, disposed on the second surface;

[0007] A flexible circuit board, wherein a portion of the flexible circuit board is disposed on the second surface, the flexible circuit board is bound and connected to the array substrate located in the binding area, the flexible circuit board is bent toward a side of the color filter substrate away from the array substrate, and a portion of the flexible circuit board is bent and arranged in the recessed portion.

[0008] Optionally, in some embodiments provided in the present application, the display panel further includes a bonding member, the bonding member is disposed in the recessed portion, and the flexible circuit board is connected to the bonding member.

[0009] Optionally, in some embodiments provided in the present application, the recessed portion includes a first sub-area and a second sub-area, the first sub-area is located on a side close to the binding area, the second sub-area is located on a side away from the binding area, the bonding member is located in the first sub-area, and a portion of the flexible circuit board is arranged in the second sub-area.

[0010] Optionally, in some embodiments provided in the present application, the width of the second sub-region is between 0.5 mm and 1.5 mm.

[0011] Optionally, in some embodiments provided in the present application, the array substrate further includes a substrate, a thin film transistor and a plurality of insulating layers arranged on the substrate, the plurality of insulating layers cover the thin film transistor, and the recess penetrates at least one insulating layer.

[0012] Optionally, in some embodiments provided in the present application, the multiple insulating layers include a first insulating layer, a second insulating layer, and a third insulating layer sequentially arranged on the substrate, the recess passes through the third insulating layer, and the bottom of the recess is located on the second insulating layer.

[0013] Optionally, in some embodiments provided in the present application, the multiple insulating layers include a first insulating layer, a second insulating layer, and a third insulating layer sequentially arranged on the substrate, the recess passes through the third insulating layer, the second insulating layer, and the first insulating layer, and the bottom of the recess is located on the substrate.

[0014] Optionally, in some embodiments provided in the present application, the flexible circuit board includes a first part, a bent part and a second part, the first part and the second part are connected through the bent part, the first part is connected to the array substrate and the bonding member, the second part is arranged on the side of the color film substrate away from the array substrate, the bent part is arranged between the first part and the second part, and a part of the bent part is bent and arranged in the recessed portion.

[0015] Optionally, in some embodiments provided in the present application, the display panel further includes a blocking layer, a first polarizer and a sealant, the first polarizer is located on the side of the array substrate away from the color film substrate, the blocking layer is arranged between the array substrate and the first polarizer, and the blocking layer is located in the non-display area, and the sealant is arranged on the first side surface of the array substrate and covers the side surface of the first polarizer on the same side as the first side surface.

[0016] Correspondingly, an embodiment of the present application further provides a display device, which includes the above-mentioned display panel and a backlight module. The backlight module is located on a side of the color filter substrate away from the array substrate.

[0017] Embodiments of the present application provide a display panel and a display device. The display panel includes a display area and a non-display area, the non-display area being located to one side of the display area. The non-display area includes a binding area and a peripheral area, the binding area connecting the display area and the peripheral area. The display panel includes an array substrate, a color filter substrate, and a flexible circuit board. The array substrate is located in both the display area and the non-display area, and has a first surface and a second surface facing each other. The array substrate has a recessed portion located in the peripheral area, with an opening located on the second surface. An adhesive member is disposed within the recessed portion. The color filter substrate is disposed on the second surface. The flexible circuit board is bonded to the array substrate located in the binding area, and the flexible circuit board bends toward the side of the color filter substrate away from the array substrate, with a portion of the bent flexible circuit board disposed within the recessed portion. When the flexible circuit board bends toward the side of the color filter substrate away from the array substrate, the bending direction of the flexible circuit board deviates from the binding direction of the flexible circuit board. Therefore, the flexible circuit board is at risk of falling off the array substrate, thereby causing display failure of the display panel. In the embodiment of the present application, a recessed portion is provided on the array substrate corresponding to the peripheral area. When the flexible circuit board is bent toward the side of the color filter substrate away from the array substrate, part of the flexible circuit board is bent and arranged in the recessed portion, thereby reducing the stress generated by the flexible circuit board during the bending process, thereby preventing the flexible circuit board from falling off the array substrate. Therefore, the display panel provided in the embodiment of the present application can be used to solve the technical problem of the display panel caused by the flexible circuit board falling off the array substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 A schematic structural diagram of a display panel provided in a comparative embodiment of the present application;

[0020] Figure 2 A schematic structural diagram of a display panel provided in an embodiment of the present application;

[0021] Figure 3 A schematic diagram of the structure of the flexible circuit board of the display panel provided in an embodiment of the present application before being bent;

[0022] Figure 4 A schematic diagram of the first structure of the array substrate provided in an embodiment of the present application;

[0023] Figure 5 A schematic diagram of a second structure of the array substrate provided in an embodiment of the present application;

[0024] Figure 6 A schematic structural diagram of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of this application more clear, this application will be further described in detail below with reference to the accompanying drawings. Please refer to the drawings in the accompanying drawings, in which the same component symbols represent the same components. The following description is based on the specific embodiments of this application shown, and it should not be construed as limiting other specific embodiments of this application that are not described in detail herein. The word "embodiment" used in this specification means an example, instance or illustration.

[0026] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0027] The embodiments of the present application provide a display panel and a display device. Detailed descriptions are provided below. It should be noted that the order in which the following embodiments are described does not limit the preferred order of the embodiments.

[0028] Please refer to Figure 1 , Figure 1A schematic diagram of the structure of a display panel provided for a comparative embodiment of the present application. In order to achieve a narrow bezel or even a bezel-less design, a common technical means is to achieve this through flipping. Unlike the conventional display panel structure, in a four-sided bezel-less display panel, the glass substrate of the array substrate 10 is located on the side close to the display surface of the display panel, while the color filter substrate 20 is located on the side of the array substrate 10 away from the display surface. The flexible circuit board 40 bends toward the side of the color filter substrate 20 away from the array substrate 10. Therefore, the bending of the flexible circuit board 40 deviates from the binding direction, causing the flexible circuit board 40 to easily peel off from the array substrate 10, thereby causing the display panel to fail. In addition, due to the material properties of the flexible circuit board 40, when the flexible circuit board is bent, the bent portion of the flexible circuit board will extend beyond the side of the sealant. Therefore, when a protective cover is set on the display panel to protect the flexible circuit board, there is a gap between the side of the sealant and the protective cover, affecting the aesthetics of the product.

[0029] In response to the above technical problems, an embodiment of the present application provides a display panel for solving the technical problem that a flexible circuit board falls off from an array substrate, thereby causing failure of the display panel.

[0030] An embodiment of the present application provides a display panel, comprising a display area and a non-display area, wherein the non-display area is located to one side of the display area, the non-display area comprising a binding area and a peripheral area, and the binding area connecting the display area and the peripheral area. The display panel comprises an array substrate, a color filter substrate, and a flexible circuit board. The array substrate is located in the display area and the non-display area, and has a first surface and a second surface relative to each other. The array substrate has a recessed portion, the recessed portion is located in the peripheral area, and the opening of the recessed portion is located on the second surface. The color filter substrate is disposed on the second surface. The flexible circuit board is bound and connected to the array substrate located in the binding area. The flexible circuit board is bent toward the side of the color filter substrate away from the array substrate, and a portion of the flexible circuit board is bent and arranged within the recessed portion.

[0031] When the flexible circuit board is bent toward the side of the color filter substrate away from the array substrate, the bending direction of the flexible circuit board deviates from the binding direction of the flexible circuit board. Therefore, the flexible circuit board is prone to the risk of falling off the array substrate, thereby causing display failure of the display panel. In the embodiment of the present application, by providing a recessed portion on the array substrate corresponding to the peripheral area, when the flexible circuit board is bent toward the side of the color filter substrate away from the array substrate, a portion of the flexible circuit board is bent and arranged within the recessed portion, reducing the stress generated by the flexible circuit board during the bending process, thereby preventing the flexible circuit board from falling off the array substrate. Therefore, the display panel provided by the embodiment of the present application can be used to solve the technical problem of the flexible circuit board falling off the array substrate, thereby causing the display panel.

[0032] The display panel provided by the present application is described in detail below through specific embodiments.

[0033] Please combine Figure 2 and Figure 3 , Figure 2 A schematic structural diagram of a display panel provided in an embodiment of the present application. Figure 3 A schematic diagram of the structure of the flexible circuit board of the display panel provided in an embodiment of the present application before being bent. This embodiment of the present application provides a display panel, wherein the display panel 1000 includes a display area AA and a non-display area NA. The non-display area NA is located to one side of the display area AA. The non-display area NA includes a binding area BA and a peripheral area PA. The binding area BA connects the display area AA and the peripheral area PA. The display panel 1000 includes an array substrate 10, a color filter substrate 20, a liquid crystal layer 50, a bonding member 30, a flexible circuit board 40, a driver chip 90, a printed circuit board 100, a first polarizer 60, a second polarizer 110, a shielding layer 70, and a sealant 80.

[0034] The array substrate 10 is located in the display area AA and the non-display area NA. The array substrate 10 has a first surface 1a and a second surface 1b facing each other. The array substrate 10 has a recessed portion 10a located in the peripheral area PA, with an opening of the recessed portion 10a located on the second surface 1b. An adhesive member 30 is disposed within the recessed portion 10a.

[0035] In the embodiment of the present application, the recessed portion 10a includes a first sub-region 10a1 and a second sub-region 10a2. The first sub-region 10a1 is located on the side closest to the binding area BA, while the second sub-region 10a2 is located away from the binding area BA. The adhesive member 30 is located in the first sub-region 10a1, and a portion of the flexible circuit board 40 is disposed within the second sub-region 10a2. In the present application, the recessed portion 10a is divided into the first sub-region 10a1 and the second sub-region 10a2. The adhesive member 30 is located within the first sub-region 10a1, while the second sub-region 10a2 serves as a stress relief area for the flexible circuit board 40. When the flexible circuit board 40 bends toward the side of the color filter substrate 20 away from the array substrate 10, the second sub-region 10a2 relieves stress generated during the bending process, thereby preventing cracks in the flexible circuit board 40.

[0036] The width D1 of the second sub-region 10a2 is between 0.5 mm and 1.5 mm. For example, the width of the second sub-region 10a2 can be 0.5 mm, 0.8 mm, 1 mm, 1.2 mm, 1.4 mm, and 1.5 mm. In the embodiment of the present application, the width of the second sub-region 10a2 is set between 0.5 mm and 1.5 mm to ensure sufficient space to release stress generated during the bending process of the flexible circuit board 40.

[0037] In some embodiments, the adhesive member 30 may be Tuffy glue, a resin-based colloid specifically used in the electronics industry. After curing on the adhesive, it thins to form a light blue layer that is easy to tear off. Tuffy can be used as the adhesive member 30 in this application. Tuffy glue has strong viscosity, preventing the flexible circuit board 40 from detaching from the array substrate 10. Tuffy also has good corrosion resistance, protecting the metal traces on the array substrate 10.

[0038] Please refer to Figure 4 , Figure 4 This is a schematic diagram of the first structure of an array substrate provided in an embodiment of the present application. In some embodiments, the array substrate 10 further includes a substrate 101, a light shielding layer 103, a thin film transistor 102 disposed on the substrate 101, multiple insulating layers, and bonding pads. The multiple insulating layers cover the thin film transistor 102, wherein the recessed portion 10a extends through at least one insulating layer.

[0039] The thin film transistor 102 includes a gate 1022, an active layer 1021, a source 1023, and a drain 1024. The plurality of insulating layers include a first insulating layer 104, a second insulating layer 106, a third insulating layer 108, and a fourth insulating layer 105 sequentially disposed on the substrate 101.

[0040] In some embodiments, the light shielding layer 103 is disposed on the substrate 101. The material of the light shielding layer 103 may be at least one of molybdenum, titanium, copper, and manganese.

[0041] The first insulating layer 104 is disposed on the substrate 101 and covers the light shielding layer 103. The material of the first insulating layer 104 can be at least one of silicon oxide, silicon nitride, and silicon oxynitride.

[0042] The active layer 1021 is disposed on the side of the buffer layer away from the substrate 101. The material of the active layer 1021 can be one of indium gallium zinc oxide, indium gallium tin oxide, and indium gallium zinc tin oxide, or the active layer 1021 can also be a low-temperature polysilicon active layer 1021 or an a-Si active layer 1021.

[0043] Oxide Thin Film Transistors (OTFTs) have become a hot topic in thin film transistor development due to their advantages, such as high carrier mobility, low power consumption, and applicability to low-frequency drives. Oxide thin film transistors (OTFTs) are thin film transistors in which the active layer 1021 is formed using a metal oxide semiconductor. This application uses metal oxide as the material for the active layer 1021 to improve the driving capability of the driver substrate.

[0044] The fourth insulating layer 105 is disposed on a side of the active layer 1021 away from the first insulating layer 104. The material of the fourth insulating layer 105 may be at least one of silicon oxide, silicon nitride, and silicon oxynitride.

[0045] The gate 1022 is disposed on a side of the fourth insulating layer 105 away from the active layer 1021. The gate 1022 may be made of molybdenum, titanium, copper, or an alloy thereof.

[0046] The second insulating layer 106 is disposed on a side of the gate 1022 away from the fourth insulating layer 105. The material of the second insulating layer 106 can be at least one of silicon oxide, silicon nitride, and silicon oxynitride.

[0047] The source electrode 1023 and the drain electrode 1024 are spaced apart and disposed on the second insulating layer 106. The source electrode 1023 and the drain electrode 1024 may be made of one of molybdenum, titanium, copper, manganese, or an alloy thereof.

[0048] The drain electrode 1024 is connected to the light shielding layer 103 via a connecting electrode 107. In the embodiment of the present application, the light shielding layer 103 not only shields the active layer 1021 from light, preventing it from affecting its stability, but also electrically connects to the drain electrode 1024 via the connecting electrode 107. Because the orthographic projections of the light shielding layer 103, the active layer 1021, and the gate electrode 1022 on the substrate 101 overlap, parasitic capacitances form between the light shielding layer 103, the active layer 1021, and the gate electrode 1022, respectively. When the display panel is operating, the voltage applied to the data signal line varies, causing the voltage on the drain electrode 1024 to change accordingly. This, in turn, causes the voltage on the light shielding layer 103 to change, thereby affecting the electrical performance of the active layer 1021. By connecting the light shielding layer 103 and the source electrode 1023 to form an equal potential, the voltage changes on the light shielding layer 103 can be prevented from affecting the electrical performance of the active layer 1021.

[0049] The third insulating layer 108 is disposed on a side of the second insulating layer 106 away from the fourth insulating layer 105. The material of the third insulating layer 108 may be at least one of silicon oxide, silicon nitride, and silicon oxynitride.

[0050] The bonding pad Pad is provided on the third insulating layer 108 .

[0051] Please continue to refer to Figure 4 In some embodiments, the recessed portion 10a passes through the third insulating layer 108, and the bottom of the recessed portion 10a is located on the second insulating layer 106. In the present application, the recessed portion 10a passes through the third insulating layer 108. Therefore, only the third insulating layer 108 of the array substrate 10 needs to be edge-grinded to form the recessed portion 10a.

[0052] Please refer to Figure 5 , Figure 5 This is a schematic diagram of a second structural embodiment of an array substrate provided in an embodiment of the present application. In some embodiments, the recessed portion 10a extends through the third insulating layer 108, the second insulating layer 106, and the first insulating layer 104, with the bottom of the recessed portion 10a located on the substrate 101. In the present application, the recessed portion 10a extends through the third insulating layer 108, the second insulating layer 106, and the first insulating layer 104, with the bottom of the recessed portion 10a located on the substrate 101. This allows the recessed portion 10a to have a greater depth, thereby providing more space to accommodate the flexible circuit board 40 when the flexible circuit board 40 is bent, further improving stress release.

[0053] The color filter substrate 20 is disposed on the second surface 1b. In some embodiments, the color filter substrate 20 is smaller than the array substrate 10 in width and is disposed on the array substrate 10 to expose the array substrate 10 and the recessed portion 10a in the binding area BA.

[0054] The liquid crystal layer 50 is disposed between the array substrate 10 and the color filter substrate 20 , and the liquid crystal layer 50 is located in the display area AA.

[0055] The flexible circuit board 40 is bonded to the bonding pads Pad located in the bonding area BA and is connected to the adhesive member 30. The flexible circuit board 40 is bent toward the side of the color filter substrate 20 away from the array substrate 10. In this application, because the bending direction of the flexible circuit board 40 deviates from the bonding direction of the flexible circuit board 40, the flexible circuit board 40 is susceptible to falling off the array substrate 10, thereby causing display failure of the display panel 1000. In this embodiment of the present application, a recessed portion 10a is provided on the array substrate 10 corresponding to the peripheral area PA, and an adhesive member 30 is disposed within the recessed portion 10a. This allows the adhesive member 30 to connect to the flexible circuit board 40, thereby preventing the flexible circuit board 40 from falling off the array substrate 10. Therefore, the display panel 1000 provided in this embodiment of the present application can be used to address the technical problem of the flexible circuit board 40 falling off the array substrate 10, thereby causing display failure of the display panel 1000.

[0056] In some embodiments, the flexible circuit board 40 includes a first portion 40a, a curved portion 40b, and a second portion 40c. The first portion 40a and the second portion 40c are connected by the curved portion 40b. The first portion 40a is connected to the array substrate 10 and the adhesive member 30. The second portion 40c is disposed on a side of the color filter substrate 20 away from the array substrate 10. The curved portion 40b is disposed between the first portion 40a and the second portion 40c. A portion of the curved portion 40b is bent and disposed within the second sub-region 10a2 of the recessed portion 10a.

[0057] The driver chip 90 is disposed on a side of the second portion 40c away from the color filter substrate 20. The printed circuit board 100 is disposed on a side of the second portion 40c away from the color filter substrate 20. In this embodiment of the present application, the flexible circuit board 40 and the driver chip 90 can be considered to be packaged using COF (Chip On Film) technology. Specifically, the driver chip 90 is fixed to the flexible circuit board 40, and the driver chip 90 is loaded with a raw electrical signal. Furthermore, the driver chip 90 processes the raw signal to form a drive signal that passes through the flexible circuit board 40, thereby controlling the display image of the display panel. Furthermore, in this embodiment of the present application, the driver chip 90 is bonded to the side of the color filter substrate 20 away from the array substrate 10 via the flexible circuit board 40, thereby visually achieving a borderless display on all four sides.

[0058] The first polarizer 60 is located on the side of the array substrate 10 away from the color filter substrate 20. It interprets polarized light modulated by the liquid crystal, creating a contrast between light and dark, and thus producing a display image. The first polarizer 60 extends over the array substrate 10, color filter substrate 20, and flexible circuit board 40, achieving a borderless full-screen display.

[0059] The blocking layer 70 is arranged between the array substrate 10 and the first polarizer 60, and the blocking layer 70 is located in the non-display area NA. The blocking layer 70 is used to block the metal circuit on the array substrate 10. In the present application, the blocking layer 70 is hidden under the first polarizer 60, which simplifies the technical difficulties of the four-sided borderless display panel, keeps the front edge color of the display panel 1000 consistent, reduces the color difference and appearance difference of the four edges of the display panel 1000, and is conducive to improving the picture quality of the whole machine.

[0060] The sealant 80 is disposed on the first side 1c of the array substrate 10 and covers the side of the first polarizer 60 on the same side as the first side 1c. The sealant 80 in this application covers the first side 1c and the side of the first polarizer 60 on the same side as the first side 1c, thereby preventing light leakage from that side of the display panel, which could degrade display quality.

[0061] In some embodiments, the side of the sealant 80 facing away from the first side 1c is flush with the curved portion 40b. In this embodiment, since the side of the sealant 80 facing away from the first side 1c is flush with the curved portion 40b, when an external protective cover is installed to protect the flexible circuit board 40, no gap is created between the protective cover and the sealant 80, thereby improving the viewing quality of the display panel. Therefore, in this embodiment, the side of the sealant 80 facing away from the first side 1c is flush with the curved portion 40b, further improving the display quality of the display panel.

[0062] The second polarizer 110 is disposed on a side of the color filter substrate 20 away from the array substrate 10. The second polarizer 110 is used to convert the light beam generated by the backlight module into polarized light.

[0063] Please refer to Figure 6 , Figure 6 A structural schematic diagram of a display device provided in an embodiment of the present application. The embodiment of the present application also provides a display device, which includes a display panel and a backlight module 210. The backlight module 210 is located on the side of the color filter substrate 20 away from the array substrate 10. Among them, the display line board is the display panel described above, and the display panel includes a display area AA and a non-display area NA. The non-display area NA is located on one side of the display area AA. The non-display area NA includes a binding area BA and a peripheral area PA. The binding area BA connects the display area AA and the peripheral area PA. The display panel 1000 includes an array substrate 10, a color filter substrate 20, a liquid crystal layer 50, a bonding member 30, a flexible circuit board 40, a driver chip 90, a printed circuit board 100, a first polarizer 60, a second polarizer 110, a shielding layer 70 and a sealant 80.

[0064] In some embodiments, the display device 2000 further includes a protective cover 220 disposed outside the second portion 40c and the curved portion 40b of the flexible circuit board 40. In this embodiment, the side of the sealant 80 facing away from the first side 1c is flush with the curved portion 40b. Because the side of the sealant 80 facing away from the first side 1c is flush with the curved portion 40b, no gap is created between the protective cover and the sealant 80 when the protective cover 220 is installed to protect the flexible circuit board 40. Therefore, by aligning the side of the sealant 80 facing away from the first side 1c with the curved portion 40b, the display quality of the display device 2000 is further enhanced.

[0065] It should be noted that the display device 2000 in the embodiment of the present application can be a mobile phone or any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop monitors, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, medical equipment, industrial control equipment, touch interactive terminals, etc. The embodiment of the present application does not specifically limit this.

[0066] In summary, although the present application has been disclosed as above with preferred embodiments, the above preferred embodiments are not intended to limit the present application. Ordinary technicians in this field can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined by the claims.

Claims

1. A display panel, characterized in that: The display panel includes a display area and a non-display area, wherein the non-display area is located on at least one side of the display area, the non-display area includes a binding area and a peripheral area, and the binding area connects the display area and the peripheral area. The display panel includes: an array substrate, the array substrate being located in the display area and the non-display area, the array substrate having a first surface and a second surface opposite to each other, the array substrate having a recessed portion, the recessed portion being located in the peripheral area, and an opening of the recessed portion being located on the second surface; a color filter substrate, disposed on the second surface; a flexible circuit board, wherein a portion of the flexible circuit board is disposed on the second surface, the flexible circuit board is bound and connected to the array substrate located in the binding area, the flexible circuit board is bent toward a side of the color filter substrate away from the array substrate, and a portion of the flexible circuit board is bent and arranged in the recessed portion; The display panel further includes a bonding member, the bonding member being disposed in the recessed portion, and the flexible circuit board being connected to the bonding member; The recessed portion includes a first sub-area and a second sub-area, the first sub-area is located on a side close to the binding area, the second sub-area is located on a side away from the binding area, the adhesive member is located in the first sub-area, and a portion of the flexible circuit board is disposed in the second sub-area; The width of the second sub-region is between 0.5 mm and 1.5 mm.

2. The display panel according to claim 1, wherein: The array substrate further includes a substrate, a thin film transistor and a plurality of insulating layers arranged on the substrate, the plurality of insulating layers cover the thin film transistor, and the recessed portion penetrates at least one insulating layer.

3. The display panel according to claim 2, wherein: The plurality of insulating layers include a first insulating layer, a second insulating layer, and a third insulating layer sequentially arranged on the substrate. The recess penetrates the third insulating layer, and the bottom of the recess is located on the second insulating layer.

4. The display panel according to claim 2, wherein: The multiple insulating layers include a first insulating layer, a second insulating layer, and a third insulating layer sequentially arranged on the substrate. The recess penetrates the third insulating layer, the second insulating layer, and the first insulating layer. The bottom of the recess is located on the substrate.

5. The display panel according to claim 1, wherein: The flexible circuit board includes a first part, a bent part, and a second part. The first part and the second part are connected by the bent part. The first part is connected to the array substrate and the bonding member. The second part is arranged on a side of the color film substrate away from the array substrate. The bent part is arranged between the first part and the second part. A part of the bent part is bent and arranged in the recessed portion.

6. The display panel according to claim 5, wherein: The display panel also includes a blocking layer, a first polarizer and a sealant. The first polarizer is located on the side of the array substrate away from the color film substrate. The blocking layer is arranged between the array substrate and the first polarizer, and the blocking layer is located in the non-display area. The sealant is arranged on the first side surface of the array substrate and covers the side surface of the first polarizer on the same side as the first side surface.

7. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 6 and a backlight module, wherein the backlight module is located on a side of the color filter substrate away from the array substrate.

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