Heat dissipation components and electronic devices

Abstract

The present application discloses a heat dissipation component and an electronic device, wherein the heat dissipation component includes a heat spreader and a conductive circuit; the heat spreader includes a first cover plate, a second cover plate and a capillary structure, the first cover plate and the second cover plate are connected to form a receiving cavity; the capillary structure is arranged in the receiving cavity, and the capillary structure is arranged on the side of the second cover plate facing the first cover plate; the conductive circuit is arranged on the first cover plate, and a first conductive member is arranged on the side of the first cover plate facing the second cover plate, and the first conductive member is electrically connected to the conductive circuit; the first cover plate can be deformed toward the side of the second cover plate when under pressure, so that the first conductive member contacts the capillary structure, and the first conductive member is electrically connected to the second cover plate through the capillary structure.

Description

Technical Field

[0001] The present application belongs to the field of electronic technology, and specifically relates to a heat dissipation component and an electronic device. Background Art

[0002] As the performance of electronic devices improves, multiple functional devices are integrated on the electronic devices, and they face increasingly serious heating problems during use. In order to reduce the heating temperature of the electronic devices during operation, a heat spreader is usually used to dissipate the heat of the electronic devices.

[0003] However, the existing heat spreader has a simple structure and single function, and only has the function of heat dissipation. In practical applications, the heat spreader and pressure sensing module need to be arranged at different locations in the electronic device, which takes up a large space. The arrangement area of ​​the heat spreader and pressure sensing module is limited, which affects the performance of the electronic device. Summary of the invention

[0004] The present application aims to provide a heat dissipation component and an electronic device, which at least solves the problem that the existing heat spreader and pressure sensing module occupy a large space.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a heat dissipation assembly, comprising: a heat spreader and a conductive circuit; the heat spreader comprises a first cover plate, a second cover plate and a capillary structure, the first cover plate and the second cover plate are connected to form a receiving cavity; the capillary structure is arranged in the receiving cavity, and the capillary structure is arranged on a side of the second cover plate facing the first cover plate;

[0007] The conductive circuit is provided on the first cover plate, a first conductive member is provided on a side of the first cover plate facing the second cover plate, and the first conductive member is electrically connected to the conductive circuit;

[0008] The first cover plate may be deformed toward one side of the second cover plate when under pressure, so that the first conductive member contacts the capillary structure, and the first conductive member is electrically connected to the second cover plate through the capillary structure.

[0009] According to a heat dissipation assembly proposed in an embodiment of the present application, the conductive circuit includes a plurality of first conductive wires and a plurality of second conductive wires;

[0010] The plurality of first conductive wires are sequentially arranged at intervals along a first direction; the plurality of second conductive wires are sequentially arranged at intervals along a second direction; the first conductive wires and the second conductive wires intersect and are electrically connected at the intersection;

[0011] There are a plurality of the first conductive members, and at least some of the intersections of the first conductive lines and the second conductive lines are electrically connected to the plurality of the first conductive members in a one-to-one correspondence.

[0012] According to a heat dissipation assembly provided in an embodiment of the present application, along a direction perpendicular to the first cover plate, a projection of an intersection of the first wire and the second wire coincides with a projection of the first conductive member.

[0013] According to a heat dissipation component proposed in an embodiment of the present application, the conductive circuit includes a flexible circuit board; the flexible circuit board is attached to a side of the first cover plate facing away from the second cover plate; the first cover plate includes a conductive body and an insulating layer, the insulating layer is arranged on the surface of the conductive body, at least part of the insulating layer is arranged between the conductive body and the flexible circuit board, and the flexible circuit board is electrically connected to the first conductive member through the conductive body.

[0014] According to a heat dissipation assembly proposed in an embodiment of the present application, the conductive body includes a plate body and a protrusion; the protrusion is arranged on a side of the plate body facing the second cover plate; the insulating layer is coated on the surface of the conductive body, and the insulating layer is provided with a first opening and a second opening, the first opening is arranged on a side of the plate body away from the second cover plate, and the second opening is arranged at an end of the protrusion away from the plate body;

[0015] The portion of the plate body exposed at the first opening is connected to the flexible circuit board; the portion of the protrusion exposed at the second opening is used to contact the capillary structure, so that the protrusion serves as the first conductive member.

[0016] According to a heat dissipation component proposed in an embodiment of the present application, the conductive circuit also includes a second conductive member, the flexible circuit board is electrically connected to the second conductive member, the second conductive member is arranged in the first opening, and the second conductive member is electrically connected to the board body.

[0017] According to a heat dissipation assembly proposed in an embodiment of the present application, the first cover plate includes an insulating body, the conductive circuit is disposed in the insulating body, and the first conductive member is disposed on a side of the insulating body facing the second cover plate.

[0018] According to a heat dissipation assembly proposed in an embodiment of the present application, the insulating body includes a plate body and a protrusion; the protrusion is arranged on a side of the plate body facing the second cover plate, and the first conductive member is arranged at an end of the protrusion away from the plate body.

[0019] According to a heat dissipation assembly provided in an embodiment of the present application, a support portion is further provided on a side of the first cover plate facing the second cover plate, and the support portion is supported on a side of the capillary structure facing away from the second cover plate.

[0020] In a second aspect, an embodiment of the present application proposes an electronic device, comprising: a middle frame, a screen module and a heat dissipation component as described in any one of the above items; the heat dissipation component is sandwiched between the middle frame and the screen module.

[0021] In the embodiments of the present application, the heat dissipation device can be cooled by the heat spreader, and when the first cover plate of the heat spreader is under pressure, the conductive circuit, the first conductive member, the capillary structure, and the second cover plate form a current conduction path based on the contact between the first conductive member and the capillary structure. The pressure on the first cover plate can be identified based on the feedback of the current signal, thereby performing pressure sensing based on the heat spreader, thereby realizing an integrated design of heat dissipation and pressure sensing functions and reducing space occupancy.

[0022] Compared with the existing separate setting scheme of the heat spreader and the pressure sensing module, the present application does not have the problem of avoiding the design of the heat spreader and the pressure sensing module. A relatively large heat dissipation area and pressure sensing coverage area can be set to achieve a lightweight design of the electronic equipment.

[0023] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 is one of the structural schematic diagrams of the heat dissipation assembly according to an embodiment of the present application;

[0026] Figure 2 According to the embodiment of the present application Figure 1 Explosion diagram of

[0027] Figure 3 According to the embodiment of the present application Figure 1 Schematic diagram of the structure of the conductive circuit;

[0028] Figure 4 When the screen module is under heavy pressure, Figure 1 A schematic diagram of the structure of the heat dissipation assembly shown;

[0029] Figure 5 This is a second structural schematic diagram of a heat dissipation assembly according to an embodiment of the present application;

[0030] Figure 6When the screen module is under heavy pressure, Figure 5 A schematic diagram of the structure of the heat dissipation assembly shown;

[0031] Figure 7 It is a schematic diagram of the arrangement of the middle frame, screen module and heat dissipation assembly according to an embodiment of the present application.

[0032] Reference numerals:

[0033] 100, heat dissipation component; 200, screen module; 300, middle frame;

[0034] 1. Heat spreader; 2. Conductive circuit; 3. First conductive member; 11. First cover plate; 12. Second cover plate; 13. Capillary structure; 14. Welding layer; 201. Flexible circuit board; 202. Second conductive member; 21. First conductor; 22. Second conductor; 111. Conductive body; 112. Insulating layer; 121. Insulating body; 1101. Plate body; 1102. Raised portion; 1103. Support portion; 1011. Accommodating cavity; 1121. First opening; 1122. Second opening. DETAILED DESCRIPTION

[0035] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0036] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0037] In the description of the present application, it should be understood that the terms "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "inside", "outside", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0038] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0039] In the related art, a heat spreader and a pressure sensing module are provided in the electronic device, and the heat spreader and the pressure sensing module are sandwiched between the screen module and the middle frame. Since the heat spreader and the pressure sensing module are both installed below the screen module, the positions of the heat spreader and the pressure sensing module need to avoid each other, resulting in the limitation of the layout area of ​​the heat spreader and the pressure sensing module.

[0040] The above arrangement, on the one hand, limits the heat dissipation capacity of the electronic device, and on the other hand, because one pressure sensing module can only roughly identify whether there is a hard press operation on the screen module within a certain area, it is impossible to accurately confirm the specific location where the user pressed hard on the screen module. In order to expand the pressure sensing recognition area, the number of pressure sensing modules generally needs to be two or more, which is not only difficult to complete the corresponding arrangement in the electronic device, but also difficult to arrange the pressure sensing module in the area occupied by the heat sink.

[0041] To solve the above problems, the following Figure 1-Figure 7 A heat dissipation component and an electronic device according to an embodiment of the present application are described.

[0042] like Figure 1 and Figure 5 As shown, according to some embodiments of the heat dissipation assembly of the present application, the heat dissipation assembly 100 includes: a heat sink 1 and a conductive circuit 2.

[0043] The heat spreader 1 includes a first cover plate 11, a second cover plate 12 and a capillary structure 13. The first cover plate 11 and the second cover plate 12 are connected to form a receiving cavity 1011. The capillary structure 13 is arranged in the receiving cavity 1011. The capillary structure 13 is arranged on the side of the second cover plate 12 facing the first cover plate 11.

[0044] The conductive circuit 2 is arranged on the first cover plate 11, and a first conductive member 3 is provided on the side of the first cover plate 11 facing the second cover plate 12, and the first conductive member 3 is electrically connected to the conductive circuit 2; the first cover plate 11 can be deformed toward the side of the second cover plate 12 when under pressure, so that the first conductive member 3 contacts the capillary structure 13, and the first conductive member 3 is electrically connected to the second cover plate 12 through the capillary structure 13.

[0045] It is understandable that the vapor chamber 1 may be a VC (Vapor Chamber) vapor chamber 1 known in the art, also known as a vacuum chamber vapor chamber.

[0046] The periphery of the first cover plate 11 and the periphery of the second cover plate 12 are opposite and can be assembled to form a weld. The weld can be welded by hot plate welding, laser welding, ultrasonic welding or other welding methods, so that the first cover plate 11 and the second cover plate 12 are connected as a whole through the welding layer 14 formed by welding, thereby forming a closed accommodating cavity 1011 between the first cover plate 11 and the second cover plate 12.

[0047] In order to realize the heat dissipation function of the heat spreader 1, the accommodating chamber 1011 is usually evacuated, and a working medium is provided in the accommodating chamber 1011. The working medium can be converted between the liquid phase and the gas phase in the accommodating chamber 1011 when heated to realize the heat dissipation of the heating device (middle frame). Optionally, the working medium is a liquid such as pure water, methanol, ethanol, etc., which is not easy to chemically react with the first cover plate 11 and the second cover plate 12. Figure 1 and Figure 5 It is not specifically indicated.

[0048] In some examples, a support portion 1103 is provided on the side of the first cover plate 11 facing the second cover plate 12. For example, the first cover plate 11 is printed with photosensitive ink, exposed, developed, and etched with chemicals to form multiple support portions 1103 on the side of the first cover plate 11 facing the second cover plate 12. The support portion 1103 can be a cylindrical support column, and the support portion 1103 is supported on the side of the capillary structure 13 facing away from the second cover plate 12.

[0049] In some examples, a groove-shaped structure is provided on one side of the second cover plate 12 facing the first cover plate 11, and a copper wire mesh can be welded in the groove-shaped structure as the capillary structure 13. Of course, in this embodiment, grooves can also be etched or laser engraved on one side of the second cover plate 12 facing the first cover plate 11, so as to form a mesh capillary structure 13 on the surface of the second cover plate 12. The capillary structure 13 and the second cover plate 12 can both be made of conductive materials. Optionally, the capillary structure 13 is a copper wire mesh, and the second cover plate 12 is a copper plate.

[0050] In practical applications, the heat dissipation assembly 100 is usually sandwiched between the middle frame 300 and the screen module 200 of the electronic device, the side of the second cover plate 12 facing away from the first cover plate 11 is connected to the middle frame 300, and the side of the first cover plate 11 facing away from the second cover plate 12 is connected to the screen module 200. In this way, the heat dissipation assembly 100 of the embodiment of the present application can dissipate heat from the middle frame 300 to prevent heat accumulation in the electronic device.

[0051] like Figure 1 and Figure 5As shown, when the user does not press the screen module 200, or the pressing force F of the user on the screen module 200 is less than a preset value, the first cover plate 11 of the heat spreader 1 maintains its initial shape, or the deformation of the first cover plate 11 is too small, so that the first conductive member 3 is separated from the capillary structure 13, and the heat spreader 1 is only used to dissipate heat from the central frame 300.

[0052] like Figure 4 and Figure 6 As shown, when the user presses the screen module 200 hard, the pressing force F applied to the screen module 200 is greater than a preset value, and the screen module 200 may undergo a relatively large deformation, causing the pressing force F on the screen module 200 to be directly transmitted to the first cover plate 11, and the first cover plate 11 is deformed on the side toward the second cover plate 12. For example, under the action of pressing, the pressing area on the first cover plate 11 is partially recessed toward the second cover plate 12, which causes the first conductive member 3 opposite to the pressing area to approach the capillary structure 13 until the first conductive member 3 contacts the capillary structure 13.

[0053] Since the conductive circuit 2 and the second cover plate 12 can be connected to the control module through the access circuit, when the first conductive member 3 contacts the capillary structure 13, the conductive circuit 2, the first conductive member 3, the capillary structure 13 and the second cover plate 12 form a current conduction path, and the control module can determine the user's hard pressing operation on the screen module 200 according to the detected current signal. In this way, the heat spreader 1 can not only dissipate heat from the center frame 300, but also recognize the user's pressing operation.

[0054] It should be noted that the user's heavy pressing operation on the screen module 200 will not affect the normal use of the screen module 200. Although the pressed area of ​​the screen module 200 will be sunken to a certain extent under the action of the pressing force F, the local deformation on the screen module 200 is within its allowable range, and when the pressed area is no longer pressed, the pressed area will return to its original state.

[0055] At the same time, the control module can be an information processing module with certain logical operation capabilities, for example, the control module is a central processing unit (CPU). When the first conductive member 3 is separated from the capillary structure 13, the control module cannot receive the current feedback signal due to the disconnection between the conductive circuit 2 and the second cover plate 12, and it can be considered that the control module receives a low-level signal. When the first conductive member 3 is in contact with the capillary structure 13, the control module receives the current feedback signal due to the formation of a current conduction path between the conductive circuit 2 and the second cover plate 12, and it can be considered that the control module receives a high-level signal, so that the control module can identify the user's pressing operation based on the received current feedback signal.

[0056] As can be seen from the above, the heat dissipation component 100 of the embodiment of the present application can not only dissipate heat for the heating device through the heat spreader 1, but also, when the first cover plate 11 of the heat spreader 1 is under pressure, based on the contact between the first conductive member 3 and the capillary structure 13, the conductive circuit 2, the first conductive member 3, the capillary structure 13 and the second cover plate 12 form a current conduction path. The pressure on the first cover plate 11 can be identified based on the feedback of the current signal, thereby performing pressure sensing based on the heat spreader 1, thereby realizing an integrated design of heat dissipation and pressure sensing functions and reducing space occupancy.

[0057] Compared with the existing separate setting scheme of the heat spreader and the pressure sensing module, the present application does not have the problem of avoiding the design of the heat spreader and the pressure sensing module. A relatively large heat dissipation area and pressure sensing coverage area can be set to achieve a lightweight design of the electronic equipment.

[0058] In some embodiments, Figure 1 and Figure 3 As shown, in order to set a relatively large pressure-sensitive coverage area as much as possible and accurately determine the user's hard-pressing position, the conductive circuit 2 of the embodiment of the present application includes a plurality of first conductive wires 21 and a plurality of second conductive wires 22.

[0059] Specifically, the plurality of first conductive wires 21 are parallel to each other and are arranged in sequence along the first direction; the plurality of second conductive wires 22 are parallel to each other and are arranged in sequence along the second direction; the first conductive wires 21 and the second conductive wires 22 intersect and are electrically connected at the intersection.

[0060] A plurality of first conductive elements 3 are provided, and at least some of the intersections of the first conductive lines 21 and the second conductive lines 22 are electrically connected to the plurality of first conductive elements 3 in a one-to-one correspondence.

[0061] In practical applications, the first wires 21 can be connected to the control module through a first switching circuit, and the second wires 22 can be connected to the control module through a second switching circuit. Both the first switching circuit and the second switching circuit can be made of flexible printed circuit boards.

[0062] When the screen module 200 receives a hard press operation, the pressing area on the screen module 200 and the first cover plate 11 will be recessed, so that the first conductive member 3 corresponding to the pressing area contacts the capillary structure 13, thereby forming a current conduction path between the conductive circuit 2 and the second cover plate 12, and feeding back a current signal to the control module.

[0063] Since the intersection of the first wire 21 and the second wire 22 is connected to the first conductive member 3, the control module can determine the first wire 21 and the second wire 22 arranged in the current conduction path according to the feedback current signal, and thereby determine the position of the intersection of the first wire 21 and the second wire 22, thereby determining the user's re-press position according to the position of the intersection of the first wire 21 and the second wire 22.

[0064] Furthermore, since there are multiple first wires 21 and second wires 22, the intersection of any two first wires 21 and second wires 22 can be used as a pressure sensing recognition point. To this end, this embodiment can determine the layout area of ​​the heat spreader 1 according to the surface area of ​​the screen module 200, and further determine the coverage area and arrangement density of the pressure sensing recognition points according to the layout area of ​​the heat spreader 1.

[0065] In some embodiments, it may be configured that the projection of the intersection of the first conductive wire 21 and the second conductive wire 22 coincides with the projection of the first conductive member 3 along a direction perpendicular to the first cover plate 11 .

[0066] Such a design can ensure that when the pressing area corresponding to the first conductive member 3 receives a hard press operation, a current signal can be accurately fed back to the control module, and it is also convenient to ensure that the pressing coordinates calculated by the control module correspond to the pressing position of the user on the screen module 200.

[0067] In some embodiments, Figure 2 and Figure 4 As shown, the conductive circuit 2 of the embodiment of the present application includes a flexible circuit board 201 ; the flexible circuit board 201 is attached to a side of the first cover plate 11 facing away from the second cover plate 12 .

[0068] At the same time, the first cover plate 11 includes a conductive body 111 and an insulating layer 112. The insulating layer 112 is arranged on the surface of the conductive body 111. At least part of the insulating layer 112 is arranged between the conductive body 111 and the flexible circuit board 201. The flexible circuit board 201 is electrically connected to the first conductive member 3 through the conductive body 111.

[0069] The conductive body 111 may be made of copper, and the insulating layer 112 may be an insulating thermally conductive ceramic layer or a resin coating.

[0070] It is understandable that the present embodiment can utilize the good ductility and deformability of the flexible circuit board 201 to integrate it with the first cover plate 11. The flexible circuit board 201 has a flexible substrate, and a plurality of first wires 21 and a plurality of second wires 22 shown in the above embodiment are arranged in the flexible substrate. The arrangement of the first wires 21 and the second wires 22 will not be described one by one here.

[0071] At the same time, by making the first cover plate 11 include a conductive body 111 and an insulating layer 112, the structural strength and conductive performance of the first cover plate 11 can be ensured, so that the flexible circuit board 201 is arranged on the side of the first cover plate 11 away from the second cover plate 12, and the flexible circuit board 201 can be electrically connected to the first conductive member 3 through the conductive body 111 of the first cover plate 11.

[0072] In some examples, according to the pressure sensing detection requirements, multiple conductive areas opposite to the conductive body 111 can be set on the first cover plate 11, and the intersection points of at least part of the first wires 21 and the second wires 22 on the flexible circuit board 201 are connected to the multiple conductive areas one-to-one, and the multiple conductive areas are connected to the multiple first conductive members 3 one-to-one.

[0073] Furthermore, the conductive body 111 of the embodiment of the present application includes a plate body portion 1101 and a protruding portion 1102; the protruding portion 1102 is arranged on the side of the plate body portion 1101 facing the second cover plate 12; the insulating layer 112 is coated on the surface of the conductive body 111, and the insulating layer 112 is provided with a first opening 1121 and a second opening 1122, the first opening 1121 is arranged on a side of the plate body portion 1101 away from the second cover plate 12, and the second opening 1122 is arranged at an end of the protruding portion 1102 away from the plate body portion 1101.

[0074] Since the flexible circuit board 201 is attached to the side of the first cover plate 11 facing away from the second cover plate 12, based on the setting of the insulating layer 112, it can be ensured that the flexible circuit board 201 is connected to the portion of the board body 1101 exposed in the first opening 1121, while the flexible circuit board 201 is electrically isolated from the portion of the board body 1101 covered with the insulating layer 112.

[0075] At the same time, the conductive body 111 also includes a supporting portion 1103, which is arranged on the side of the plate body 1101 facing the second cover plate 12 and supported on the side of the capillary structure 13 away from the second cover plate 12. Based on the insulating layer 112 covering the surface of the supporting portion 1103, the supporting portion 1103 can be prevented from being electrically connected to the capillary structure 13.

[0076] In addition, since the second opening 1122 is arranged at one end of the protrusion 1102 away from the plate body 1101, when the user presses the screen module 200 hard, the first cover plate 11 is partially recessed toward one side of the second cover plate 12 under the action of the screen module 200, so that the portion of the protrusion 1102 exposed in the second opening 1122 contacts the capillary structure 13, so that the protrusion 1102 of this embodiment can be used as the first conductive member 3.

[0077] It should be pointed out here that the plate body 1101, the supporting portion 1103 and the protruding portion 1102 of the conductive body 111 can be an integrated structure, the supporting portion 1103 and the protruding portion 1102 are both cylindrical, the length of the protruding portion 1102 is smaller than the length of the supporting portion 1103, and multiple supporting portions 1103 and protruding portions 1102 can be provided.

[0078] like Figure 1 and Figure 2 As shown, when the user does not apply heavy pressure to the screen module 200 , the conductive body 111 maintains its initial shape, and the end of the protrusion 1102 away from the plate body 1101 is separated from the capillary structure 13 . The heat spreader 1 of this embodiment is only used to dissipate heat from the central frame 300 .

[0079] like Figure 4 As shown, when the user presses the screen module 200 hard, the pressing force F on the screen module 200 is greater than the preset value, and the screen module 200 may be deformed relatively greatly, so that the pressing force F on the screen module 200 is directly transmitted to the first cover plate 11, and the first cover plate 11 is partially recessed on the side facing the second cover plate 12, so that the protrusion 1102 opposite to the pressing area approaches the capillary structure 13 until the end of the protrusion 1102 away from the plate body 1101 contacts the capillary structure 13. At this time, the conductive circuit 2, the conductive body 111, the capillary structure 13 and the second cover plate 12 form a current conduction path, and the control module can determine the user's hard pressing operation on the screen module 200 based on the detected current signal.

[0080] In some embodiments, Figure 2 As shown, in order to realize the connection between the flexible circuit board 201 and the portion of the board body 1101 exposed in the first opening 1121, the conductive circuit 2 of this embodiment further includes a second conductive member 202, the flexible circuit board 201 is electrically connected to the second conductive member 202, the second conductive member 202 is arranged in the first opening 1121, and the second conductive member 202 is electrically connected to the board body 1101.

[0081] To ensure the reliability of the connection between the flexible circuit board 201 and the board body 1101, in this embodiment, the opening shape of the first opening 1121 can be set to adapt to the surface shape of the second conductive member 202, and the thickness of the insulating layer 112 is the same as the thickness of the second conductive member 202, so as to facilitate embedding the second conductive member 202 into the first opening 1121.

[0082] At the same time, after the second conductive member 202 is attached to the board body 1101 by means of the conductive adhesive, it can be ensured that the flexible circuit board 201 is exactly attached to the side of the first cover plate 11 facing away from the second cover plate 12 .

[0083] The second conductive member 202 may be a gold-plated sheet, and the opening shape of the first opening 1121 may be circular, rectangular, etc., which is not specifically limited.

[0084] In some embodiments, Figure 5 and Figure 6 As shown, the first cover plate 11 of the embodiment of the present application includes an insulating body 121. The insulating body 121 can be made of a heat-conducting and non-conducting material such as metal oxide, metal nitride, and plastic.

[0085] Furthermore, the conductive circuit 2 is disposed in the insulating body 121 , and the first conductive member 3 is disposed on a side of the insulating body 121 facing the second cover plate 12 .

[0086] Specifically, the conductive circuit 2 includes a plurality of first conductive wires 21 and a plurality of second conductive wires 22 as shown in the above embodiment, and the intersection of the first conductive wires 21 and the second conductive wires 22 is electrically connected to the first conductive member 3. The first conductive member 3 may be a gold-plated sheet known in the art.

[0087] like Figure 5 As shown, the insulating body 121 of the embodiment of the present application includes a plate body 1101 and a protrusion 1102; the protrusion 1102 is arranged on the side of the plate body 1101 facing the second cover plate 12, and the first conductive member 3 is arranged at one end of the protrusion 1102 away from the plate body 1101.

[0088] The insulating body 121 further includes a supporting portion 1103 . The supporting portion 1103 is disposed on a side of the body portion 1101 facing the second cover plate 12 and supported on a side of the capillary structure 13 facing away from the second cover plate 12 .

[0089] At the same time, the plate body 1101, the support part 1103 and the protrusion 1102 of the insulating body 121 can be an integrated structure, the support part 1103 and the protrusion 1102 are both cylindrical, the length of the protrusion 1102 is smaller than the length of the support part 1103, and multiple support parts 1103 and protrusions 1102 can be set.

[0090] like Figure 5 As shown, when the user does not apply heavy pressure to the screen module 200, the first cover plate 11 of the heat spreader 1 maintains its initial shape, or the deformation of the first cover plate 11 is too small. Since the gap between the end of the protrusion 1102 away from the plate body 1101 and the capillary structure 13 is too large, the first conductive member 3 is separated from the capillary structure 13. The heat spreader 1 of this embodiment is only used to dissipate heat from the central frame 300.

[0091] like Figure 6As shown, when the user presses the screen module 200 hard, the pressing force F on the screen module 200 is greater than the preset value, and the screen module 200 may be deformed relatively greatly, so that the pressing force F on the screen module 200 is directly transmitted to the first cover plate 11, and the first cover plate 11 is partially recessed on the side facing the second cover plate 12, so that the protrusion 1102 opposite to the pressing area drives the first conductive member 3 to approach the capillary structure 13 until the first conductive member 3 contacts the capillary structure 13. At this time, the conductive circuit 2, the first conductive member 3, the capillary structure 13 and the second cover plate 12 form a current conduction path, and the control module can determine the user's hard pressing operation on the screen module 200 based on the detected current signal.

[0092] like Figure 7 As shown, an embodiment of the present application proposes an electronic device, comprising: a middle frame 300 , a screen module 200 and a heat dissipation component 100 as described in any one of the above items; the heat dissipation component 100 is sandwiched between the middle frame 300 and the screen module 200 .

[0093] The first cover plate of the heat dissipation assembly 100 is disposed on a side close to the screen module 200 , and the second cover plate of the heat dissipation assembly 100 is disposed on a side close to the middle frame 300 .

[0094] Since the electronic device shown in this embodiment includes a heat dissipation component, the specific structure of the heat dissipation component refers to the above embodiment, and the electronic device shown in this embodiment includes all the technical solutions of the above embodiment, and therefore, at least has all the beneficial effects achieved by all the technical solutions of the above embodiment, which will not be repeated here one by one.

[0095] The electronic device may be a mobile terminal, such as a smart phone, a tablet computer (Tablet Personal Computer), a laptop computer (Laptop Computer), a personal digital assistant (PDA), a mobile Internet device (Mobile Internet Device, MID) or a wearable device (Wearable Device), etc. It may also be other electronic devices, such as a digital camera, an e-book, a navigator, etc., which are not specifically limited here.

[0096] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0097] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A heat dissipation component, It is characterized in that include: Vapor chamber and conductive circuit; The heat spreader includes a first cover plate, a second cover plate and a capillary structure, wherein the first cover plate and the second cover plate are connected to form a receiving cavity; the capillary structure is arranged in the receiving cavity, and the capillary structure is arranged on a side of the second cover plate facing the first cover plate; The conductive circuit is provided on the first cover plate, a first conductive member is provided on a side of the first cover plate facing the second cover plate, and the first conductive member is electrically connected to the conductive circuit; The first cover plate may be deformed toward one side of the second cover plate when under pressure, so that the first conductive member contacts the capillary structure, and the first conductive member is electrically connected to the second cover plate through the capillary structure.

2. The heat dissipation assembly according to claim 1, It is characterized in that The conductive circuit includes a plurality of first conductive wires and a plurality of second conductive wires; The plurality of first conductive wires are sequentially arranged at intervals along a first direction; the plurality of second conductive wires are sequentially arranged at intervals along a second direction; the first conductive wires and the second conductive wires intersect and are electrically connected at the intersection; There are a plurality of the first conductive members, and at least some of the intersections of the first conductive lines and the second conductive lines are electrically connected to the plurality of the first conductive members in a one-to-one correspondence.

3. The heat dissipation assembly according to claim 2, It is characterized in that Along a direction perpendicular to the first cover plate, a projection of an intersection of the first conductive wire and the second conductive wire coincides with a projection of the first conductive member.

4. The heat dissipation assembly according to claim 1, It is characterized in that The conductive circuit includes a flexible circuit board; the flexible circuit board is attached to a side of the first cover plate facing away from the second cover plate; The first cover plate includes a conductive body and an insulating layer, wherein the insulating layer is disposed on a surface of the conductive body, and at least a portion of the insulating layer is disposed between the conductive body and the flexible circuit board, and the flexible circuit board is electrically connected to the first conductive member through the conductive body.

5. The heat dissipation assembly according to claim 4, It is characterized in that The conductive body comprises a plate body and a protruding portion; the protruding portion is arranged on a side of the plate body facing the second cover plate; The insulating layer is coated on the surface of the conductive body, and the insulating layer is provided with a first opening and a second opening, the first opening is provided at a side of the plate body away from the second cover plate, and the second opening is provided at an end of the protruding portion away from the plate body; The portion of the plate body exposed at the first opening is connected to the flexible circuit board; the portion of the protrusion exposed at the second opening is used to contact the capillary structure, so that the protrusion serves as the first conductive member.

6. The heat dissipation assembly according to claim 5, It is characterized in that The conductive circuit further includes a second conductive member, the flexible circuit board is electrically connected to the second conductive member, the second conductive member is disposed in the first opening, and the second conductive member is electrically connected to the board body.

7. The heat dissipation assembly according to claim 1, It is characterized in that The first cover plate comprises an insulating body, the conductive circuit is arranged in the insulating body, and the first conductive member is arranged on a side of the insulating body facing the second cover plate.

8. The heat dissipation assembly according to claim 7, It is characterized in that The insulating body comprises a plate body and a raised portion; the raised portion is arranged on a side of the plate body facing the second cover plate, and the first conductive member is arranged on an end of the raised portion away from the plate body.

9. The heat dissipation assembly according to any one of claims 1 to 8, It is characterized in that A supporting portion is further provided on a side of the first cover plate facing the second cover plate, and the supporting portion is supported on a side of the capillary structure facing away from the second cover plate.

10. An electronic device, It is characterized in that include: A middle frame, a screen module and a heat dissipation assembly as claimed in any one of claims 1 to 9; The heat dissipation component is sandwiched between the middle frame and the screen module.

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