Display device

Abstract

The present disclosure provides a display device, belonging to the field of display equipment. The display device includes a display panel and a circuit connector bound and connected to the display panel; the circuit connector includes a flexible substrate and a binding structure, and the edge of the flexible substrate has a first binding area; the binding structure is located in the first binding area, and the binding structure includes a first row of pads and a second row of pads, the first row of pads includes a plurality of first pads, the second row of pads is located on the side of the first row of pads close to the middle of the flexible substrate, and the second row of pads includes a plurality of second pads. When the first binding area is bound to the second binding area, the length of the first pad is less than the length of the second pad, which is conducive to preventing the first pad from extending to the wiring area of ​​the display panel, ensuring that the orthographic projections of the plurality of first pads on the display panel are located in the second binding area, and preventing the wiring area of ​​the display panel from being short-circuited by the first pad.

Description

Technical Field

[0001] The present disclosure relates to the field of display devices, and in particular to a display apparatus. Background Art

[0002] Mobile phones, monitors, etc. are common display devices in life, and display devices can display rich picture information.

[0003] The display device includes a display panel and a circuit connector, where the circuit connector may be a COF (English: Chipon film, Chinese: Covered Chip Film) or an FPC (English: Flexible Printed Circuit, Chinese: Flexible Circuit Board). The display panel usually has a bonding area, which is located at the edge of the display panel, and the COF or FPC is bonded to the display panel in the bonding area. Summary of the invention

[0004] The embodiment of the present disclosure provides a display device, comprising a display panel and a circuit connection member bound and connected to the display panel;

[0005] The circuit connector comprises a flexible substrate and a binding structure, and the edge of the flexible substrate has a first binding area;

[0006] The binding structure is located in the first binding area, and the binding structure includes a first row of pads and a second row of pads, the first row of pads includes a plurality of first pads arranged along the edge of the flexible substrate, the second row of pads is located on a side of the first row of pads close to the middle of the flexible substrate, and the second row of pads includes a plurality of second pads arranged along the arrangement direction of the plurality of first pads;

[0007] In a first direction, the length of the first pad is smaller than the length of the second pad, and the first direction is the arrangement direction of the first row of pads and the second row of pads;

[0008] The edge of the display panel has a second binding area, the first binding area is bound to the second binding area, the orthographic projection of the multiple first solder pads on the display panel is located in the second binding area, and the second binding area is distributed with a third row of solder pads and a fourth row of solder pads, the third row of solder pads includes a plurality of third solder pads connected to the multiple first solder pads in a one-to-one correspondence, the fourth row of solder pads includes a plurality of fourth solder pads connected to the multiple second solder pads in a one-to-one correspondence, and in the first direction, the length of the third solder pad is the same as the length of the fourth solder pad.

[0009] Optionally, in the first direction, a ratio of a length of the first pad to a length of the second pad is 8:10 to 9:10.

[0010] Optionally, in the first direction, a ratio of a length of the first pad to a length of the second pad is 8:9.

[0011] Optionally, in the first direction, the length of the first pad is 800 μm, and the length of the second pad is 900 μm.

[0012] Optionally, in the first direction, a ratio of a spacing between the first row of pads and the second row of pads to a length of the first pad is 1:10 to 1.5:10.

[0013] Optionally, in the arrangement direction of the plurality of first pads, a spacing between adjacent first pads located in the middle is greater than a spacing between adjacent first pads located on both sides;

[0014] In the arrangement direction of the plurality of second pads, a spacing between adjacent second pads located in the middle is greater than a spacing between adjacent second pads located at both sides.

[0015] Optionally, in the first direction, a ratio of a spacing between the first row of pads and the second row of pads to a spacing between the third row of pads and the fourth row of pads is 2:5 to 3:5.

[0016] Optionally, in the first direction, a ratio of a length of the third pad to a length of the first pad is 7:20 to 8:20, and a ratio of a length of the fourth pad to a length of the second pad is 3:10 to 4:10.

[0017] Optionally, in the arrangement direction of the plurality of third pads, the spacings between adjacent third pads are the same;

[0018] In the arrangement direction of the plurality of fourth pads, the intervals between adjacent fourth pads are the same.

[0019] Optionally, in the second direction, the width of the third pad is greater than that of the first pad, the width of the fourth pad is greater than that of the second pad, and the second direction is parallel to the surface of the flexible substrate and perpendicular to the first direction.

[0020] Optionally, in the second direction, the width of the first pad is 13 μm, and the width of the second pad is 13 μm.

[0021] Optionally, the angle between the length direction of the first pad and the first direction is 0° to 10°, and the plurality of first pads are symmetrically distributed about a center line of the first binding area, and the center line extends along the first direction;

[0022] The included angle between the length direction of the second pad and the first direction is 0° to 10°, and the plurality of second pads are symmetrically distributed about a center line of the first binding area.

[0023] Optionally, the extension lines of the plurality of first pads in the length direction intersect at one point;

[0024] Extension lines of the plurality of second pads in the length direction intersect at one point.

[0025] Optionally, the flexible substrate is covered with a solder resist, the solder resist is located outside the first binding area, and an orthographic projection of the solder resist on the plane where the display panel is located is located outside the display panel.

[0026] Optionally, the circuit connector is a chip-on-film or a flexible printed circuit board.

[0027] Optionally, a driver integrated circuit is provided on the display panel, or a driver integrated circuit is provided on the chip-on-film;

[0028] The driving integrated circuit is a quadruple high definition integrated circuit QHD-IC.

[0029] The beneficial effects brought by the technical solution provided by the embodiments of the present disclosure include at least:

[0030] When the first binding area is bound to the second binding area, the length of the first pad is smaller than the length of the second pad, which helps to prevent the first pad from extending into the wiring area of ​​the display panel, ensuring that the orthographic projections of the plurality of first pads on the display panel are located within the second binding area, and preventing the wiring area of ​​the display panel from being short-circuited by the first pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 is a top view of a display device in the related art;

[0033] Figure 2 yes Figure 1 A local enlarged schematic diagram within the middle dotted line range;

[0034] Figure 3 is a cross-sectional view of the flip chip film;

[0035] Figure 4 It is a schematic diagram of the local structure of the display panel;

[0036] Figure 5 is a structural schematic diagram of a display device provided by an embodiment of the present disclosure;

[0037] Figure 6 is a schematic diagram of a partial structure of a chip-on-film provided by an embodiment of the present disclosure;

[0038] Figure 7 is a schematic diagram of binding between a first binding area and a second binding area provided by an embodiment of the present disclosure;

[0039] Figure 8 It is a schematic diagram of the structure of another display device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0040] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0041] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by persons with ordinary skills in the field to which the present disclosure belongs. The words "first", "second", "third" and similar words used in the patent application specification and claims of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not indicate a quantity limitation, but indicate the existence of at least one. Words such as "include" or "comprise" and similar words mean that the elements or objects appearing before "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. Words such as "connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0042] Figure 1 is a top view of a display device in the related art. Figure 1 As shown, the display device includes a display panel 20 and a circuit connection member bound and connected to the display panel 20. The circuit connection member here can be a chip-on-film COF or a flexible circuit board FPC; for example Figure 1 As shown in FIG. 1 , the COF 10 is bonded to the display panel 20 .

[0043] Display devices generally include display devices using COF (Chip On Film) packaging technology and display devices using COP (Chip On Panel) packaging technology. The display driver integrated circuit (IC) 14 of the display device using COF packaging technology is located on COF 10; one end of COF 10 is bound and connected to the display panel 20, and the other end is bound and connected to a circuit board, which can be a PCB (Printed Circuit Board) or an FPC. The driver IC 14 of the display device using COP packaging technology is located on the display panel 20; the display panel 20 is directly bound and connected to the flexible circuit board FPC.

[0044] Figure 2 yes Figure 1 A partial enlarged schematic diagram within the dotted line range. Figure 2 As shown, the embodiment of the present disclosure is described by taking a display device of a COF packaging process as an example.

[0045] Figure 3 is a cross-sectional view of the flip chip film. Figure 3 Shown Figure 2 Section I-I in the figure. Figure 2 and Figure 3 As shown, the COF 10 includes a flexible substrate 11 and a binding structure 12. On one side of the flexible substrate 11, a first binding area 101 is provided at the edge of one side of the flexible substrate 11, and the binding structure 12 is located in the first binding area 101. The binding structure 12 includes a plurality of first pads 121 and a plurality of second pads 122; the first pads 121 and the second pads 122 are located in the metal routing layer of the COF, and are exposed through the openings on the protective layer, and can be electrically connected to the display panel 20.

[0046] Figure 4 It is a schematic diagram of the local structure of the display panel. Figure 4 As shown, a second binding area 201 is provided at the edge of one side of the display panel 20, and a routing area 202 is provided on the inner side of the second binding area 201 (i.e., the side close to the middle of the display panel 20). A plurality of third pads 210 and a plurality of fourth pads 220 are distributed in the second binding area 201. A plurality of signal lines 230 are also distributed on the display panel 20, and the third pads 210 and the fourth pads 220 are respectively connected to the signal lines 230, and the signal lines 230 extend from the second binding area 201 to the routing area 202. The same signal line 230 may include two sections, one of which is located on the surface of the display panel 20, and the other is located in the display panel 20, and the two sections are connected through a via 240. Figure 4The distribution of the signal lines 230 and the via holes 240 shown in FIG. 2 is only for illustration, and the distribution of the signal lines 230 and the via holes 240 may be different for different display panels.

[0047] The first binding area 101 is bound to the second binding area 201 , the plurality of first pads 121 are connected to the plurality of third pads 210 in a one-to-one correspondence, and the plurality of second pads 122 are connected to the plurality of fourth pads 220 in a one-to-one correspondence.

[0048] In the related art, in order to further reduce the border of the display device and increase the cutting rate of the display panel, the width D of the second binding area 201 has to be set smaller, so that during binding, a part of the first pad 121 may enter the routing area 202. Figure 4 FIG. 2 schematically shows a first pad 121 partially entering the routing area 202 . The portion of the first pad 121 entering the routing area 202 may contact the via 240 , causing a short circuit in the signal line 230 .

[0049] Figure 5 Schematic diagram of a display device provided by an embodiment of the present disclosure. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc. Figure 5 As shown, the display device includes a display panel 20 and a circuit connector bound and connected to the display panel 20. The circuit connector in the embodiment of the present disclosure may be a flip chip film or a flexible circuit board. In subsequent embodiments, the circuit connector is a flip chip film 10 as an example to illustrate the scheme in the present disclosure.

[0050] Figure 6 FIG. 1 is a schematic diagram of a partial structure of a flip chip film provided by an embodiment of the present disclosure. Figure 6 As shown, the COF 10 includes a flexible substrate 11 and a binding structure 12 , and the edge of the flexible substrate 11 has a first binding area 101 .

[0051] The binding structure 12 is located in the first binding area 101, and includes a first row of pads 12a and a second row of pads 12b. The first row of pads 12a includes a plurality of first pads 121 arranged along the edge of the flexible substrate 11, the second row of pads 12b is located on one side of the first row of pads 12a close to the middle of the flexible substrate 11, and the second row of pads 12b includes a plurality of second pads 122 arranged along the arrangement direction of the plurality of first pads 121.

[0052] In the first direction A, the length m of the first pad 121 is smaller than the length n of the second pad 122. The first direction A is the arrangement direction of the first row of pads 12a and the second row of pads 12b.

[0053] The edge of the display panel 20 has a second binding area 201 . Figure 5 The dotted line b in FIG. 2 is the boundary between the second binding area 201 and the routing area 202 .

[0054] The first binding area 101 is bound to the second binding area 201, and the orthographic projections of the plurality of first pads 121 on the display panel 20 are located in the second binding area 201. The second binding area 201 is distributed with a third row of pads 21a and a fourth row of pads 22a. Figure 7 Schematic diagram of binding between the first binding area and the second binding area provided by the embodiment of the present disclosure. Figure 7 As shown, the third row of pads 21a includes a plurality of third pads 210 connected to the plurality of first pads 121 in one-to-one correspondence, and the fourth row of pads 22a includes a plurality of fourth pads 220 connected to the plurality of second pads 122 in one-to-one correspondence. In one embodiment of the present application, in the first direction A, the length d of the third pad 210 is the same as the length e of the fourth pad 220.

[0055] The COF 10 and the display panel 20 are usually connected in an OLB (Outer Lead Bonding) process. In the process, an anisotropic conductive film (ACF) is disposed between the surfaces of the COF 10 and the display panel 20 to be in contact. The first bonding area 101 refers to the area on the COF 10 that contacts the ACF, and the second bonding area 201 refers to the area on the display panel 20 that contacts the ACF.

[0056] When the first binding area is bound to the second binding area, in the first direction, the length of the first pad is smaller than the length of the second pad, which helps to prevent the first pad from extending into the wiring area of ​​the display panel, ensuring that the orthographic projections of the plurality of first pads on the display panel are within the second binding area, and preventing the wiring area of ​​the display panel from being short-circuited by the first pad.

[0057] like Figure 6 As shown, the flexible substrate 11 may be covered with a solder resist 13 (eg Figure 6 The solder resist 13 is located outside the first binding area 101 , and the orthographic projection of the solder resist 13 on the plane where the display panel 20 is located is located outside the display panel 20 . Figure 5 In the figure, the dotted line a is the boundary of the distribution of the solder resist 13. By making the orthographic projection of the solder resist on the plane where the display panel is located outside the display panel 20, the solder resist will not contact the display panel 20 and affect the binding. The orthographic projection of the solder resist 13 on the plane where the display panel 20 is located here refers to the orthographic projection when the flexible substrate 11 is flattened to be parallel to the plane where the display panel 20 is located.

[0058] For example, there may be a gap between the plurality of first pads 121 and the edge of the flexible substrate 11. Figure 5 In the embodiment, a portion of the flexible substrate 11 extends above the boundary line b between the second binding area 201 and the routing area 202, and the plurality of first pads 121 are located below the boundary line b between the second binding area 201 and the routing area 202. Since the areas of the flexible substrate 11 outside the first binding area 101 are insulated, this portion of the flexible substrate 11 will not cause a short circuit in the routing area 202.

[0059] Optionally, the display device further includes a display driver IC 14; the driver IC 14 may be Figure 5 As shown, it is located on the chip-on-chip film 10, and can also be set on the display panel 20. The driver IC 14 is a QHD (English: Quad High Definition, Chinese: Quad High Definition)-IC. QHD is a screen resolution with a resolution of 2560×1440, which is more suitable for handheld mobile terminals, such as mobile phones. Usually, a display device with a QHD-IC, the binding structure 12 of the chip-on-chip film 10 includes two rows of pads. In other examples of the present application, the display device can also be a display device with other driver ICs 14, and the binding structure 12 includes two rows of pads.

[0060] like Figure 6 As shown, the plurality of first pads 121 and the plurality of second pads 122 are respectively connected to the driving IC 14 through the signal lines 15 . Figure 6 Three signal lines 15 are schematically shown in FIG.

[0061] Exemplarily, the cross-sectional area of ​​the signal line 15 is positively correlated with the length of the signal line 15. The longer the length of the signal line 15, the greater the resistance of the signal line 15, and when the length is the same, the larger the cross-sectional area, the smaller the resistance of the signal line 15, for a longer signal line 15, the cross-sectional area of ​​the signal line 15 is set to be larger, and for a shorter signal line 15, the cross-sectional area of ​​the signal line 15 is set to be smaller, which can reduce the resistance difference between different signal lines 15, and even make the resistance of each signal line 15 the same.

[0062] Optionally, the flexible substrate 11 may be a multi-layer substrate, that is, the flexible substrate 11 includes insulating dielectric layers and conductive layers that are alternately stacked. Different signal lines 15 may be located in the same conductive layer or in different conductive layers. When the number of first pads 121 and second pads 122 is large, more signal lines 15 need to be arranged. By using a multi-layer substrate and arranging the signal lines 15 in multiple conductive layers, the arrangement of the signal lines 15 can be facilitated. Signal lines 15 of different layers may also be connected through vias.

[0063] The conductive layer can be made of copper foil, or can also be made of other conductive materials, such as gold, silver, etc.

[0064] A plurality of fifth pads 16 may also be distributed on the flexible substrate 11, and the plurality of fifth pads 16 are arranged along one side of the flexible substrate 11. The plurality of fifth pads 16 may be connected to other structures, such as a PCB (Printed Circuit Board) in an ILB (Inner Lead Bonding) process.

[0065] like Figure 6 As shown, the length directions of the first pads 121 and the second pads 122 are both at an acute angle to the first direction A, and the first direction A is the arrangement direction of the first row of pads 12a and the second row of pads 12b.

[0066] The orthographic projections of the first solder pad 121 and the second solder pad 122 in the second binding area 201 are both rectangles. The length direction of the first solder pad 121 refers to the extension direction of the longer side of the first solder pad 121 in the orthographic projection of the second binding area 201, and the length direction of the second solder pad 122 refers to the extension direction of the longer side of the second solder pad 122 in the orthographic projection of the second binding area 201.

[0067] When the width of the first binding area 101 is the same, the first pad 121 is tilted at a certain angle, so that the length of the first pad 121 can be appropriately increased, thereby increasing the contact area between the first pad 121 and the display panel 20, so that the COF 10 and the display panel 20 are more firmly bound. The width of the first binding area 101 refers to the width of the first binding area 101 in the first direction A.

[0068] Exemplarily, the angle between the length direction of the first pad 121 and the first direction A is 0° to 10°, and the plurality of first pads 121 are symmetrically distributed about the center line o of the first binding area 101, the center line o extends along the first direction A, and the center line o is a symmetry axis of the first binding area 101. The angle between the length direction of the second pad 122 and the first direction A is 0° to 10°, and the plurality of second pads 122 are also symmetrically distributed about the center line o of the first binding area 101.

[0069] Optionally, the angle between the length direction of the first pad 121 and the first direction A may be gradual, and the angle between the length direction of the second pad 122 and the first direction A may also be gradual. Taking a plurality of first pads 121 as an example, in the arrangement direction of the plurality of first pads 121, the angle between the length direction of the first pad 121 located in the middle and the first direction A may be smaller than the angle between the length direction of the first pads 121 located on both sides and the first direction A.

[0070] In one example, the extension lines of the plurality of first pads 121 in the length direction intersect at one point. The extension lines of the plurality of second pads 122 in the length direction intersect at one point, which can improve the binding yield and reliability of the display device. The intersection point of the extension lines of the plurality of first pads 121 in the length direction and the intersection point of the extension lines of the plurality of second pads 122 in the length direction can be the same point or two different points.

[0071] In the first row of pads 12a, the spacing Δ between adjacent first pads 121 may be gradual, where the spacing Δ is the length of the line connecting the geometric centers of adjacent first pads 121. For example, in the arrangement direction of the plurality of first pads 121, the spacing Δ between adjacent first pads 121 located in the middle may be greater than the spacing Δ between adjacent first pads 121 located on both sides; in the arrangement direction of the plurality of second pads 122, the spacing between adjacent second pads 122 located in the middle is greater than the spacing between adjacent second pads 122 located on both sides.

[0072] like Figure 7 As shown, in the first direction A, the ratio of the length m of the first pad 121 to the length n of the second pad 122 may be 8:10 to 9:10, that is, the ratio of the length m to the length n may be 0.8 to 0.9. When binding, a straight line (e.g. Figure 7 Line c in the middle, line c to line L 2 and the straight line L 3 The first pad 121 is aligned with a straight line on the display panel 20 (equal to the distance between the first pad 121 and the second pad 122) to position the COF 10. When the lengths of the second pads 122 are the same, if the ratio of the length of the first pad 121 to the length of the second pad 122 in the first direction A is too small, the first pad 121 will be too short, which may cause the problem of loose binding. If the ratio of the length of the first pad 121 to the length of the second pad 122 in the first direction A is too large, the first pad 121 will enter the wiring area 202 of the display panel 20, which will increase the risk of short circuit.

[0073] The two ends of the plurality of first pads 121 are usually aligned, and the two ends of the plurality of second pads 122 are also aligned. Figure 7 In the embodiment, one end of each of the plurality of first pads 121 is aligned with a straight line L 1 The other ends of the plurality of first pads 121 are aligned with a straight line L 2 One end of each of the second pads 122 is aligned with a straight line L 3 The other ends of the plurality of second pads 122 are aligned with a straight line L 4 . Straight line L1 , straight line L 2 , straight line L 3 and the straight line L 4 They are parallel to each other and perpendicular to the first direction A. In the first direction A, the length m of the first pad 121 is the straight line L 1 and the straight line L 2 The length n of the second pad 122 is the straight line L 3 and the straight line L 4 The spacing between.

[0074] For example, in the embodiment of the present disclosure, in the first direction A, the ratio of the length m of the first pad 121 to the length n of the second pad 122 is 8:9. With this ratio, both the firmness of the binding and the risk of short circuit can be taken into consideration.

[0075] Exemplarily, in the first direction A, the length m of the first pad 121 is 800 μm, and the length n of the second pad 122 is 900 μm.

[0076] For example, in the second direction B, the width of the first pad 121 may be 13 μm, and the width of the second pad 122 may be 13 μm, and the second direction B is parallel to the surface of the flexible substrate 11 and perpendicular to the first direction A. The widths of the plurality of first pads 121 and the widths of the plurality of second pads 122 may be the same.

[0077] Taking the first soldering pad 121 as an example, when the length of the first soldering pad 121 in the first direction A is determined, the larger the width of the first soldering pad 121 in the second direction B, the larger the contact area between the first soldering pad 121 and the display panel 20 during binding, and the more secure the binding. However, when the first binding area 101 is determined, the larger the width of the first soldering pad 121, the smaller the gap that can be reserved between adjacent first soldering pads 121, and the smaller the gap, the easier it is for the first soldering pad 121 to short-circuit during binding.

[0078] like Figure 7 As shown, in the first direction A, the ratio of the spacing t between the first row of pads 12a and the second row of pads 12b to the length m of the first pad 121 can be 1:10 to 1.5:10, that is, the ratio of the spacing t to the length m can be 0.1 to 0.15. The spacing t between the first row of pads 12a and the second row of pads 12b is equivalent to the straight line L 2 and the straight line L 3 The spacing between.

[0079] When the area size of the first binding area 101 is determined, the larger the spacing t between the first row of pads 12a and the second row of pads 12b, the smaller the length of the first pads 121 and the second pads 122 that can be arranged in the first direction A, which may easily lead to the problem of loose binding. If the spacing t between the first row of pads 12a and the second row of pads 12b is too small, the risk of short circuit between the first pads 121 and the second pads 122 will increase during binding.

[0080] For example, in the embodiment of the present disclosure, the ratio of the spacing t between the first row of pads 12a and the second row of pads 12b to the length m of the first pad 121 is 1: 8. This ratio can take into account both the firmness of the binding and the risk of short circuit.

[0081] Exemplarily, the spacing t between the first row of pads 12a and the second row of pads 12b is 100 μm.

[0082] like Figure 7 As shown, on the display panel 20 , a third row of pads 21 a connected to the first row of pads 12 a and a fourth row of pads 22 a connected to the second row of pads 12 b are distributed in the second binding area 201 .

[0083] The third row of pads 21 a includes a plurality of third pads 210 connected to the plurality of first pads 121 in one-to-one correspondence, and the fourth row of pads 22 a includes a plurality of fourth pads 220 connected to the plurality of second pads 122 in one-to-one correspondence.

[0084] Through the bonding process, the first pad 121 and the second pad 122 on the COF 10 are connected to the third pad 210 and the fourth pad 220 on the display panel 20 in a one-to-one correspondence.

[0085] The spacing T between the third row of pads 21 a and the fourth row of pads 22 a may be greater than the spacing t between the first row of pads 12 a and the second row of pads 12 b .

[0086] The two ends of the plurality of third pads 210 are usually aligned, and the two ends of the plurality of fourth pads 220 are also aligned. Figure 7 In the embodiment, one end of each of the plurality of third pads 210 is aligned with a straight line L 5 The other ends of the plurality of third pads 210 are aligned with a straight line L 6 One end of each of the fourth pads 220 is aligned with a straight line L 7 The other ends of the plurality of fourth pads 220 are aligned with a straight line L 8 . Straight line L 5 , straight line L 6 , straight line L 7 and the straight line L 8They are parallel to each other and perpendicular to the first direction A. In the first direction A, the length d of the third pad 210 is the straight line L 5 and the straight line L 6 The length e of the fourth pad 220 is the straight line L 7 and the straight line L 8 The spacing between.

[0087] Exemplarily, the ratio of the spacing t between the first row of pads 12a and the second row of pads 12b and the spacing T between the third row of pads 21a and the fourth row of pads 22a may be 2:5-3:5, that is, the ratio of spacing t to spacing T may be 0.4-0.6.

[0088] In the embodiment of the present disclosure, the ratio of the spacing t between the first row of pads 12a and the second row of pads 12b to the spacing T between the third row of pads 21a and the fourth row of pads 22a is 1: 2. The spacing between the first row of pads 12a and the second row of pads 12b is 100 μm, and the spacing between the third row of pads 21a and the fourth row of pads 22a is 200 μm.

[0089] like Figure 7 As shown, in the first direction A, the length d of the third pad 210 may be smaller than the length m of the first pad 121 , and the length e of the fourth pad 220 may be smaller than the length n of the second pad 122 .

[0090] Optionally, in the first direction A, the ratio of the length d of the third pad 210 to the length m of the first pad 121 may be 7:20 to 8:20, that is, the ratio of the length d to the length m may be 0.35 to 0.4, and the ratio of the length e of the fourth pad 220 to the length n of the second pad 122 may be 3:10 to 4:10, that is, the ratio of the length e to the length n may be 0.3 to 0.4.

[0091] Exemplarily, in the first direction A, the ratio of the length m of the first pad 121 , the length n of the second pad 122 , the length d of the third pad 210 , and the length e of the fourth pad 220 is 8:9:6:6.

[0092] In the embodiment of the present disclosure, the length d of the third pad 210 is the same as the length e of the fourth pad 220 , which is 600 μm.

[0093] like Figure 7 As shown, in the second direction B, the width of the third pad 210 may be greater than the width of the first pad 121 , and the width of the fourth pad 220 may be greater than the width of the second pad 122 .

[0094] The widths of the plurality of third pads 210 may be different, and the widths of the plurality of fourth pads 220 may also be different. For example, among the plurality of third pads 210, in the first direction A, the width of the third pad 210 located in the middle of the third row of pads 21a is greater than the width of the third pads 210 located on both sides; the width of the fourth pad 220 located in the middle of the fourth row of pads 22a is greater than the width of the fourth pads 220 located on both sides. Alternatively, the width of the third pad 210 located in the middle of the third row of pads 21a is less than the width of the third pads 210 located on both sides; the width of the fourth pad 220 located in the middle of the fourth row of pads 22a is less than the width of the fourth pads 220 located on both sides.

[0095] For example, in the second direction B, the average width of the third pad 210 may be 20.5 μm, and the average width of the fourth pad 220 may be 20.5 μm. The average width of the third pad 210 refers to the ratio of the sum of the widths of all the third pads 210 to the number of the third pads 210, and the average width of the fourth pad 220 refers to the ratio of the sum of the widths of all the fourth pads 220 to the number of the fourth pads 220.

[0096] In the arrangement direction of the plurality of third row pads 21a, the spacing between adjacent third pads 210 may be the same; in the arrangement direction of the plurality of fourth row pads 22a, the spacing between adjacent fourth pads 220 may be the same. The spacing between adjacent third pads 210 is the length of the line connecting the geometric centers of the adjacent third pads 210, and the spacing between adjacent fourth pads 220 is the length of the line connecting the geometric centers of the adjacent fourth pads 220.

[0097] Figure 8 is a schematic diagram of the structure of another display device provided by an embodiment of the present disclosure. Figure 6 The display devices shown differ in that Figure 8 In the embodiment, the length direction of the first pad 121 and the length direction of the second pad 122 are both parallel to the first direction A.

[0098] According to different display devices, the first pad 121 and the second pad 122 can be Figure 6 The arrangement shown can also be Figure 8 Arrangement shown.

[0099] The above description is only an optional embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A display device, characterized in that: It comprises a display panel (20) and a circuit connector bound and connected to the display panel (20); The circuit connector comprises a flexible substrate (11) and a binding structure (12), wherein the edge of the flexible substrate (11) has a first binding area (101); The binding structure (12) is located in the first binding area (101), and the binding structure (12) comprises a first row of pads (12a) and a second row of pads (12b), the first row of pads (12a) comprising a plurality of first pads (121) arranged along an edge of the flexible substrate (11), the second row of pads (12b) is located on a side of the first row of pads (12a) close to the middle of the flexible substrate (11), and the second row of pads (12b) comprises a plurality of second pads (122) arranged along an arrangement direction of the plurality of first pads (121); In a first direction (A), the length of the first pad (121) is smaller than the length of the second pad (122), and the first direction (A) is the arrangement direction of the first row of pads (12a) and the second row of pads (12b); The edge of the display panel (20) has a second binding area (201), the first binding area (101) is bound to the second binding area (201), the orthographic projections of the plurality of first solder pads (121) on the display panel (20) are located in the second binding area (201), the second binding area (201) is distributed with a third row of solder pads (21a) and a fourth row of solder pads (22a), the third row of solder pads (21a) includes a plurality of third solder pads (210) connected to the plurality of first solder pads (121) in a one-to-one correspondence, the fourth row of solder pads (22a) includes a plurality of fourth solder pads (220) connected to the plurality of second solder pads (122) in a one-to-one correspondence, and in the first direction (A), the length of the third solder pads (210) is the same as the length of the fourth solder pads (220).

2. The display device according to claim 1, characterized in that In the first direction (A), the ratio of the length of the first pad (121) to the length of the second pad (122) is 8:10 to 9:

10.

3. The display device according to claim 2, characterized in that In the first direction (A), the ratio of the length of the first pad (121) to the length of the second pad (122) is 8:

9.

4. The display device according to claim 3, characterized in that In the first direction (A), the length of the first pad (121) is 800 μm, and the length of the second pad (122) is 900 μm.

5. The display device according to claim 3, characterized in that: In the first direction (A), the ratio of the spacing between the first row of pads (12a) and the second row of pads (12b) to the length of the first pad (121) is 1:10 to 1.5:

10.

6. The display device according to any one of claims 1 to 5, characterized in that: In the arrangement direction of the plurality of first solder pads (121), the spacing between adjacent first solder pads (121) located in the middle is greater than the spacing between adjacent first solder pads (121) located on both sides; In the arrangement direction of the plurality of second solder pads (122), the spacing between adjacent second solder pads (122) located in the middle is greater than the spacing between adjacent second solder pads (122) located at both sides.

7. The display device according to any one of claims 1 to 5, characterized in that: In the first direction (A), the ratio of the spacing between the first row of pads (12a) and the second row of pads (12b) to the spacing between the third row of pads (21a) and the fourth row of pads (22a) is 2:5 to 3:

5.

8. The display device according to any one of claims 1 to 5, characterized in that: In the first direction (A), the ratio of the length of the third pad (210) to the length of the first pad (121) is 7:20 to 8:20, and the ratio of the length of the fourth pad (220) to the length of the second pad (122) is 3:10 to 4:

10.

9. The display device according to claim 8, characterized in that: In the arrangement direction of the plurality of third solder pads (210), the spacings between adjacent third solder pads (210) are the same; In the arrangement direction of the plurality of fourth solder pads (220), the spacings between adjacent fourth solder pads (220) are the same.

10. The display device according to claim 8, characterized in that: In a second direction (B), the width of the third pad (210) is greater than the width of the first pad (121), the width of the fourth pad (220) is greater than the width of the second pad (122), and the second direction (B) is parallel to the surface of the flexible substrate (11) and perpendicular to the first direction (A).

11. The display device according to claim 10, characterized in that: In the second direction (B), the width of the first pad (121) is 13 μm, and the width of the second pad (122) is 13 μm.

12. The display device according to any one of claims 1 to 5 or any one of claims 9 to 11, characterized in that: The angle between the length direction of the first pad (121) and the first direction is 0° to 10°, and the plurality of first pads (121) are symmetrically distributed about a center line (o) of the first binding area (101), and the center line (o) extends along the first direction (A); The angle between the length direction of the second solder pad (122) and the first direction is 0° to 10°, and the plurality of second solder pads (122) are symmetrically distributed about a center line (o) of the first binding area (101).

13. The display device according to claim 12, characterized in that: The extension lines of the plurality of first pads (121) in the length direction intersect at one point; Extension lines of the plurality of second pads (122) in the length direction intersect at one point.

14. The display device according to any one of claims 1 to 5 or any one of claims 9 to 11 and 13, characterized in that: The flexible substrate (11) is covered with a solder resist (13), the solder resist (13) is located outside the first binding area (101), and the orthographic projection of the solder resist (13) on the plane where the display panel (20) is located is located outside the display panel (20).

15. The display device according to any one of claims 1 to 5 or any one of claims 9 to 11 and 13, characterized in that: The circuit connection component is a chip-on-film (10) or a flexible circuit board.

16. The display device according to claim 15, characterized in that: A driving integrated circuit (14) is provided on the display panel (20), or a driving integrated circuit (14) is provided on the chip-on-film; The driving integrated circuit (14) is a quadruple high definition integrated circuit (QHD-IC).

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