Coating measurement method, coating measurement device and coating production line

Abstract

The present application discloses a coating measurement method, a coating measurement device and a coating production line, including: emitting X-rays to a material to be measured, where the material to be measured is a material formed by the combination of a coating material and a substrate; receiving the X-rays reflected by the material to be measured and forming an X-ray spectrum; determining calibrated coating material frequency points and substrate frequency points based on the X-ray spectrum, where the substrate frequency points are the frequency points f<subgt;0< / subgt; and f<subgt;1< / subgt> on both sides of the peak corresponding to the substrate on the X-ray spectrum, and the coating material frequency points are the frequency points f<subgt;2< / subgt> and f<subgt;3 on both sides of the peak corresponding to the coating material on the X-ray spectrum. Integrating (f<subgt;0< / subgt>, f<subgt;1< / subgt>) and (f<subgt;2< / subgt>, f<subgt;3) in the X-ray spectrum according to the ratio of the amount characterized by the area to obtain the thickness of the coating. Since the spectrum analysis of the reflected X-rays is performed, it is insensitive to the vibration of the material to be measured, and high-precision coating thickness measurement can be obtained. At the same time, the thickness of each coating of the multi-coating material to be measured can be measured.

Description

Technical Field

[0001] The present application relates to the technical field of coating measurement, and more particularly, to a coating measurement method, a coating measurement device, and a coating production line. Background Art

[0002] Currently, on coating production lines such as hot-dip tin production lines, an important technical index for measuring product quality is the coating thickness and its uniformity. An overly thick coating will affect the weldability and adhesion of the product, and at the same time cause waste of coating materials; an overly thin coating will affect the corrosion resistance of the product. Therefore, it is crucial to accurately and quickly measure the coating thickness of coated plates, which poses high technical requirements for coating thickness control technology. The prerequisite for obtaining a uniform and stable coating on the strip surface is to be able to accurately measure the coating thickness online, so as to provide valuable input values to the control module, and then it is possible to effectively control the coating thickness through coating thickness control devices such as air knives and squeeze rolls.

[0003] Currently, on hot-dip tin production lines, a method of measuring coating thickness using the principle of fluorescence excitation by rays is widely adopted. This method irradiates the coating material on the strip substrate with rays at a specific angle, thereby exciting the fluorescence of the corresponding coating, and the coating thickness on the strip substrate can be obtained by comparing the fluorescence spectra based on the fluorescence.

[0004] However, through the coating measurement method using fluorescence, the angle deviation between the detector and the strip substrate is required to be extremely strict (the angle deviation needs to be less than 0.5°). When this deviation requirement is met, the measurement accuracy is extremely high. However, the tension of the strip on the strip coating production line is small, resulting in a large vibration amplitude of the strip and a large torsional vibration angle of the strip, and it is simply impossible to ensure the angle deviation requirement between the detector and the strip substrate, resulting in an inability to accurately determine the measured coating thickness on the strip coating production line and an inability to timely verify whether the coating thickness of the strip meets the standard. Summary of the Invention

[0005] The main object of the present application is to provide a coating measurement method to solve the problem in the related art that the measurement method using fluorescence results in an inability to accurately determine the measured coating thickness on the strip coating production line and an inability to timely verify whether the coating thickness of the strip meets the standard.

[0006] To achieve the above object, the present application provides a coating measurement method, which includes:

[0007] Emitting X-rays to the material to be measured, where the material to be measured is a material formed by combining a coating material and a substrate;

[0008] Receiving the X-rays reflected by the material to be measured and forming an X-ray spectrum;

[0009] Based on the X-ray spectrum, calibrated coating material frequency points and substrate frequency points are determined. The substrate frequency points are the frequency points f0 and f1 on both sides of the wave peak corresponding to the substrate on the X-ray spectrum, and the coating material frequency points are the frequency points f2 and f3 on both sides of the wave peak corresponding to the coating material on the X-ray spectrum;

[0010] The coating thickness of the material to be measured is calculated according to the following formula:

[0011]

[0012] where S1 is the X-ray spectrum reflected by the material to be measured, m1 is the thickness of the material to be measured, and n1 is the coating thickness of the material to be measured.

[0013] Furthermore, the substrate frequency points and the coating material frequency points are calibrated according to the following steps:

[0014] X-rays are emitted to a standard material, and the standard material is a material with a known substrate thickness and coating thickness;

[0015] The X-rays reflected by the standard material are received and a standard X-ray spectrum is formed;

[0016] Based on the X-ray spectrum, the coating material frequency points or the substrate frequency points are calibrated. The substrate frequency points or the coating material frequency points are calibrated according to the following formula:

[0017]

[0018] where S2 is the X-ray spectrum reflected by the standard material, m2 is the thickness of the standard material, and n2 is the coating thickness of the standard material.

[0019] Furthermore, X-rays are emitted to the material to be measured, specifically:

[0020] X-rays are emitted to the material to be measured at a first preset position, and the material to be measured passes through the coating thickness control device and then passes through the first preset position.

[0021] Furthermore, X-rays are emitted to the material to be measured, and the X-rays reflected by the material to be measured are received and an X-ray spectrum is formed, specifically:

[0022] An apparatus integrated with an X-ray emitting device and a semiconductor detector emits X-rays to the material to be measured, and receives the X-rays reflected by the material to be measured and forms an X-ray spectrum.

[0023] Furthermore, it further includes controlling the operation of the coating thickness control device based on the coating thickness of the material to be measured, so that the coating thickness control device adjusts the coating thickness of the subsequent materials to be measured.

[0024] According to another aspect of the present application, there is provided a coating thickness measuring device, comprising:

[0025] an X-ray emitting unit for emitting X-rays to the material to be measured;

[0026] a detector unit for receiving the X-rays reflected by the material to be measured and forming an X-ray spectrum;

[0027] a thickness determination unit for determining a coating material frequency point and a substrate frequency point according to the X-ray spectrum, the substrate frequency points being the frequency points f0 and f1 on both sides of the peak corresponding to the substrate on the X-ray spectrum, and the coating material frequency points being the frequency points f2 and f3 on both sides of the peak corresponding to the coating material on the X-ray spectrum;

[0028] The coating thickness of the material to be measured is calculated according to the following formula:

[0029]

[0030] where S1 is the X-ray spectrum reflected by the material to be measured, m1 is the thickness of the material to be measured, and n1 is the coating thickness of the material to be measured.

[0031] Further, the detector unit is a silicon semiconductor detector, and the silicon semiconductor detector and the X-ray emitting unit are integrated into a thickness measuring device.

[0032] Further, it further comprises a sending unit for sending the coating thickness of the material to be measured to a control device, and the control device controls the operation of the coating thickness control device so that the coating thickness control device adjusts the coating thickness of the subsequent materials to be measured.

[0033] According to another aspect of the present application, there is provided a coating production line, comprising: a conveying device, a coating bath, a coating thickness control device and the above coating thickness measuring device;

[0034] The conveying device is used for conveying a substrate into the coating bath and successively driving the substrate through the working positions of the coating thickness control device and the coating thickness measuring device after coating;

[0035] The coating thickness control device is used for adjusting the coating thickness on the surface of the substrate.

[0036] Further, it further comprises a control device, and the control device is used for controlling the operation of the coating thickness control device according to the coating thickness of the material to be measured so that the coating thickness control device adjusts the coating thickness of the subsequent materials to be measured.

[0037] Further, the coating thickness control device is arranged as an air knife, and the output end of the air knife corresponds to the position of the coating on the substrate.

[0038] In an embodiment of the present application, by emitting X-rays to a material to be measured, where the material to be measured is a material formed by combining a plating material and a base material; receiving the X-rays reflected by the material to be measured and forming an X-ray spectrum; determining calibrated plating material frequency points and base material frequency points based on the X-ray spectrum, the base material frequency points being the frequency points f0 and f1 on both sides of the peak corresponding to the base material on the X-ray spectrum, and the plating material frequency points being the frequency points f2 and f3 on both sides of the peak corresponding to the plating material on the X-ray spectrum, integrating (f0, f1) and (f2, f3) in the X-ray spectrum according to the ratio of the areas representing the ratio of the amounts of components to obtain the thickness of the coating. Since the spectral analysis of the reflected X-rays is performed, it is insensitive to the vibration of the material to be measured, and high-precision coating thickness measurement can be obtained. At the same time, the thickness of each coating of the material to be measured with multiple coatings can be measured, solving the problem in the related art that the fluorescence measurement method cannot accurately determine the coating thickness on the strip coating production line and cannot verify in time whether the coating thickness of the strip meets the standard. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The drawings forming a part of this application are used to provide a further understanding of this application, making other features, objects, and advantages of this application more obvious. The schematic embodiments of the drawings of this application and their descriptions are used to explain this application and do not constitute an improper limitation of this application. In the drawings:

[0040] Figure 1 is a schematic flowchart according to an embodiment of the present application;

[0041] Figure 2 is a schematic diagram of an X-ray spectrum according to an embodiment of the present application;

[0042] Figure 3 is a schematic structural diagram of a coating thickness measurement device according to an embodiment of the present application;

[0043] Figure 4 is a schematic structural diagram of a coating production line according to an embodiment of the present application;

[0044] Among them, 1 is the material to be detected, 4 is the coating bath, 5 is the coating thickness measurement device, 51 is the X-ray emission unit, 52 is the detector unit, 53 is the thickness determination unit, 54 is the sending unit, 7 is the coating thickness control device, 8 is the conveying device, and 9 is the control device. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0045] In order to enable those skilled in the art to better understand the solution of this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this application without creative efforts shall fall within the scope of protection of this application.

[0046] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances for the embodiments of this application described herein.

[0047] In this application, the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", etc. is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe this application and its embodiments, and are not used to limit that the indicated devices, elements or components must have a specific orientation, or be constructed and operated in a specific orientation.

[0048] Moreover, in addition to being able to represent an orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0049] In addition, terms such as "arranged", "provided with", "connected", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0050] In addition, the meaning of the term "plural" should be two or more.

[0051] It should be noted that, without conflict, the embodiments in this application and the features in the embodiments can be combined with each other. The following will detail this application with reference to the drawings and in conjunction with the embodiments.

[0052] In the related art, by adopting a fluorescent coating measurement method, the angular deviation requirement between the detector and the strip substrate is extremely strict (the angular deviation needs to be less than 0.5°). When the deviation requirement is met, the measurement accuracy is extremely high. However, the tension of the strip on the strip coating production line is small, resulting in a large vibration amplitude of the strip and a large torsional vibration angle of the strip steel, which simply cannot ensure the angular deviation requirement between the detector and the strip substrate, thus leading to the inability to accurately determine the coating thickness on the strip coating production line and the inability to verify in a timely manner whether the coating thickness of the strip meets the standard.

[0053] To solve the above technical problems, as Figures 1 to 2 shown, the embodiment of the present application provides a coating measurement method, and the coating measurement method includes the following steps S10 - S40:

[0054] S10. Emitting X - rays to the material to be measured, where the material to be measured is a material formed by the combination of a plating material and a base material;

[0055] In this embodiment, X - rays are emitted to the material to be measured at the measurement position. The measurement position can be a measurement area. For example, the measurement area can be a cross - section of the material to be measured, and this cross - section can be perpendicular to the conveying direction of the material to be measured. The measurement position can also be a measurement point on the material to be measured. The material to be measured is a material in which the plating material is combined with the base material in the form of a coating after the base material passes through the plating bath 4. For example, a material formed by galvanizing the surface of a base strip.

[0056] S20. Receiving the X - rays reflected by the material to be measured and forming an X - ray spectrum;

[0057] In this embodiment, the X - rays emitted onto the material to be measured are reflected and received by a specific device to form an X - ray spectrum. The device for receiving X - rays can be a semiconductor detector, such as a silicon semiconductor detector or a germanium semiconductor detector. This type of detector can restore the X - ray spectrum it receives with relatively high resolution. In contrast, traditional ionization chamber detection cannot sense the spectrum and can only convert the X - rays it receives into a single electrical signal. As Figure 2 shown, the X - ray spectrum formed by the detector is a graph with the abscissa being the frequency and the ordinate being the energy. The plating material (assuming it is zinc) and the base material (assuming it is steel) have inherent and different characteristic reflection spectra. The image formed on the X - ray spectrum is a continuous wave, where one form of the wave represents the plating material and the other form of the wave represents the base material. As Figure 1 the first peak in represents the base material, and the second peak represents the plating material.

[0058] S30. Determining the calibrated plating material frequency point and the base material frequency point based on the X - ray spectrum, as Figure 2As shown, the substrate frequency points are the frequency points f0 and f1 on both sides of the peak corresponding to the substrate on the X-ray spectrum, and the coating material frequency points are the frequency points f2 and f3 on both sides of the peak corresponding to the coating material on the X-ray spectrum;

[0059] In this embodiment, the calibration process of the coating material frequency points and the substrate frequency points can be carried out in the laboratory, which is achieved by emitting X-rays from a standard material with a known coating thickness and substrate thickness and receiving and analyzing the reflected X-ray spectrum. In the subsequent production process, the substrate in the material to be detected 1 measured by this coating measurement method is the same material as the substrate in the standard material, and the coating material is also the same material as the coating material in the standard material.

[0060] After obtaining the X-ray spectrum, determine the 4 calibrated frequency points on the X-ray spectrum, namely the frequency points f0 and f1 for the substrate =, and the frequency points f2 and f3 for the coating material. There is no overlapping part between (f0, f1) and (f2, f3).

[0061] In this embodiment, when there is a coating formed by one coating material on the substrate, a wave corresponding to the substrate and a wave corresponding to the coating material will be formed on the X-ray spectrum. When there are coatings formed by multiple coating materials on the substrate, waves corresponding to the multiple coating materials will be formed on the X-ray spectrum respectively. At this time, frequency points need to be set for the waves corresponding to each coating material, and the setting method is the same as the frequency point setting method for one coating material described above.

[0062] S40. The coating thickness of the material to be measured is calculated according to the following formula:

[0063] Formula 1:

[0064]

[0065] Wherein, S1 is the X-ray spectrum reflected by the material to be measured, m1 is the thickness of the material to be measured, and n1 is the coating thickness of the material to be measured.

[0066] In this embodiment, after determining the frequency points corresponding to the substrate and the coating material on the X-ray spectrum, integrate (f0, f1) and (f2, f3) respectively, and calculate the coating thickness by referring to the above formula. The core idea of this calculation method is that the ratio of areas represents the ratio of the amounts of components, and then calculate the coating thickness based on the ratio of the amounts of components and the thickness of the material to be measured. The thickness of the material to be measured can be measured by a conventional thickness gauge. The above formula directly expresses the calculation method when the coating is one coating material. When the coating is two overlapping coating materials, the frequency points determined for the first coating material on the X-ray spectrum are f2 and f3, and the frequency points determined for the second coating material on the X-ray spectrum are f4 and f5. Therefore, the thickness calculation formula for the first coating material is:

[0067] Formula 2:

[0068]

[0069] The thickness calculation formula for the second plating material is as follows:

[0070] Formula Three:

[0071]

[0072] It can be seen that based on the above calculation method, on the coating layer formed by multiple plating materials on the substrate, the thicknesses of different coating layers can still be calculated separately by X-ray spectroscopy.

[0073] In this embodiment, the measurement method for the coating layer thickness is to calculate by using the X-ray spectrum formed by the reflection of X-rays. Therefore, the influence of the material to be measured on the measurement result during vibration can be reduced, high-precision measurement of the coating layer thickness can be obtained, and at the same time, the thickness of each coating layer of the material to be measured with multiple coating layers can be measured, thus solving the problem in the related technology that the fluorescence measurement method leads to the inability to accurately determine the measurement of the coating layer thickness on the strip steel coating production line and the inability to verify in time whether the coating layer thickness of the strip steel meets the standard.

[0074] Since the substrate frequency point and the plating material frequency point need to be pre-calibrated, the calibration process thereof will be described in detail in this embodiment. Specifically:

[0075] The substrate frequency point and the plating material frequency point are calibrated according to the following steps:

[0076] Emit X-rays to a standard material, where the standard material is a material with a known substrate thickness and coating layer thickness. After knowing the substrate thickness and coating layer thickness, the thickness of the standard material can be determined;

[0077] Receive the X-rays reflected by the standard material and form a standard X-ray spectrum;

[0078] In this embodiment, the process of emitting X-rays to the standard and receiving the reflected X-rays to form a standard X-ray spectrum is the same as the process of emitting X-rays to the material to be detected during the production measurement process. The difference is that during calibration, the substrate thickness and coating layer thickness of the standard material are known, and the substrate type and plating material type in the standard material are the same as the substrate type and plating material type in the material to be detected, and the thicknesses of the substrate and coating layer in the standard material are the thicknesses of the substrate and coating layer in the standard finished product of actual production.

[0079] On the formed X-ray spectrum, there are also wave peaks corresponding to the substrate and plating material in the standard material. Therefore, the plating material frequency point can be calibrated based on the X-ray spectrum. At this time, the selected plating material frequency points are the frequency points f2 and f3 located on both sides of the plating material wave peak. Then, the substrate frequency points f0 and f1 are determined based on the following formula:

[0080] Formula Four:

[0081]

[0082] Among them, S2 is the X-ray spectrum reflected by the standard material, m2 is the thickness of the standard material, and n2 is the coating thickness of the standard material.

[0083] Similarly, the substrate frequency points can also be calibrated first. At this time, the selected substrate channel points are the frequency points f0 and f1 located on both sides of the substrate peak. Then, the coating material frequency points f2 and f3 are determined based on the above formula. The frequency points for calculating the coating thickness on the X-ray spectrum obtained in the subsequent production measurement process are calibrated through the above process. During measurement, the coating thickness can be determined by calculating according to Formula One.

[0084] Emit X-rays to the material to be measured. Specifically: Emit X-rays to the material to be measured at the first preset position. The material to be measured passes through the coating thickness control device 7 and then passes through the first preset position again.

[0085] The first preset position in this embodiment is any position where the substrate is transported after the coating is completed. Devices for emitting X-rays and receiving X-rays are installed near the first preset position. In this embodiment, emit X-rays to the material to be measured, receive the X-rays reflected by the material to be measured and form an X-ray spectrum. Specifically: Emit X-rays to the material to be measured by a device integrated with an X-ray emitting device and a semiconductor detector, and receive the X-rays reflected by the material to be measured and form an X-ray spectrum.

[0086] To facilitate adjusting the coating thickness of the subsequent material according to the measured coating thickness, the measurement method in this embodiment further includes controlling the action of the coating thickness control device 7 based on the coating thickness of the material to be measured, so that the coating thickness control device adjusts the coating thickness of the subsequent material to be measured. The coating thickness control setting can be an air knife.

[0087] Based on the above coating measurement method, as Figure 3 shown, according to another aspect of the present application, a coating measurement device 5 is provided, including:

[0088] An X-ray emitting unit 51 for emitting X-rays to the material to be measured;

[0089] A detector unit 52 for receiving the X-rays reflected by the material to be measured and forming an X-ray spectrum;

[0090] A thickness determination unit 53 for determining the coating material frequency points and the substrate frequency points according to the X-ray spectrum, where the substrate frequency points are the frequency points f0 and f1 on both sides of the peak corresponding to the substrate on the X-ray spectrum, and the coating material frequency points are the frequency points f2 and f3 on both sides of the peak corresponding to the coating material on the X-ray spectrum;

[0091] The coating thickness of the material to be measured is calculated according to the following formula:

[0092]

[0093] Wherein, S1 is the X-ray spectrum reflected by the material to be measured, m1 is the thickness of the material to be measured, and n1 is the coating thickness of the material to be measured.

[0094] In this embodiment, the detector unit 52 is a silicon semiconductor detector. The silicon semiconductor detector and the X-ray emitting unit 51 are integrated into a thickness measuring device, which is convenient for adjusting the coating thickness of the subsequent material according to the measured coating thickness. The measuring device further includes a sending unit 54 for sending the coating thickness of the material to be measured to the control device 9, and the control device 9 controls the coating thickness control device 7 to act, so that the coating thickness control device 7 adjusts the coating thickness of the subsequent material to be measured. The coating thickness control device can be an air knife.

[0095] As Figure 4 shown, according to another aspect of the present application, a coating production line is provided, including: a conveying device 8, a coating bath 4, a coating thickness control device 7, and the above-mentioned coating measuring device 5;

[0096] The conveying device 8 is used to convey the substrate into the coating bath 4 and drive the substrate to pass through the working positions of the coating thickness control device 9 and the coating measuring device 5 in sequence after coating;

[0097] The coating thickness control device 9 is used to adjust the coating thickness on the surface of the substrate.

[0098] Further, it further includes a control device 9. The control device 9 is used to control the coating thickness control device 7 to act according to the coating thickness of the material to be measured, so that the coating thickness control device 7 adjusts the coating thickness of the subsequent material to be measured. The coating thickness control device 7 is set as an air knife, and the output end of the air knife corresponds to the position of the coating on the substrate.

[0099] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A plating measurement method, characterized in that, Comprising: Emitting X-rays to a material to be measured, where the material to be measured is a material formed by combining a plating material and a substrate; Receiving the X-rays reflected by the material to be measured and forming an X-ray spectrum; Determining calibrated plating material frequency points and substrate frequency points based on the X-ray spectrum, where the substrate frequency points are the frequency points f0 and f1 on both sides of the peak corresponding to the substrate on the X-ray spectrum, and the plating material frequency points are the frequency points f2 and f3 on both sides of the peak corresponding to the plating material on the X-ray spectrum; The plating thickness of the material to be measured is calculated according to the following formula: Wherein, S1 is the X-ray spectrum reflected by the material to be measured, m1 is the thickness of the material to be measured, and n1 is the plating thickness of the material to be measured.

2. The plating layer measurement method according to claim 1, wherein: The substrate frequency points and the plating material frequency points are calibrated according to the following steps: Emitting X-rays to a standard material, where the standard material is a material with a known substrate thickness and plating thickness; Receiving the X-rays reflected by the standard material and forming a standard X-ray spectrum; Calibrating the plating material frequency points or the substrate frequency points based on the X-ray spectrum, and calibrating the substrate frequency points or the plating material frequency points based on the following formula: Wherein, S2 is the X-ray spectrum reflected by the standard material, m2 is the thickness of the standard material, and n2 is the plating thickness of the standard material.

3. The plating layer measurement method according to claim 2, wherein: The emitting X-rays to the material to be measured is specifically: Emitting X-rays to the material to be measured at a first preset position, where the material to be measured passes through the plating thickness control device and then passes through the first preset position.

4. The plating layer measurement method according to claim 3, characterized in that: The emitting X-rays to the material to be measured, receiving the X-rays reflected by the material to be measured and forming an X-ray spectrum is specifically: Emitting X-rays to the material to be measured by a device integrated with an X-ray emitting device and a semiconductor detector, and receiving the X-rays reflected by the material to be measured and forming an X-ray spectrum.

5. The plating layer measuring method according to claim 4, wherein: It further includes controlling the operation of the plating thickness control device based on the plating thickness of the material to be measured, so that the plating thickness control device adjusts the plating thickness of the subsequent materials to be measured.

6. A coating measurement device, characterized in that, Comprising: An X-ray emitting unit for emitting X-rays to a material to be measured; A detector unit for receiving the X-rays reflected by the material to be measured and forming an X-ray spectrum; A thickness determining unit for determining plating material frequency points and substrate frequency points according to the X-ray spectrum, where the substrate frequency points are the frequency points f0 and f1 on both sides of the peak corresponding to the substrate on the X-ray spectrum, and the plating material frequency points are the frequency points f2 and f3 on both sides of the peak corresponding to the plating material on the X-ray spectrum; The plating thickness of the material to be measured is calculated according to the following formula: Wherein, S1 is the X-ray spectrum reflected by the material to be measured, m1 is the thickness of the material to be measured, and n1 is the plating thickness of the material to be measured.

7. The coating thickness measuring device according to claim 6, characterized in that, The detector unit is a silicon semiconductor detector, and the silicon semiconductor detector is integrated with the X-ray emitting unit on a thickness measuring device.

8. The plating layer measuring device according to claim 7, wherein It further includes a sending unit for sending the plating thickness of the material to be measured to a control device, and the control device controls the operation of the plating thickness control device, so that the plating thickness control device adjusts the plating thickness of the subsequent materials to be measured.

9. A plating production line, characterized in that, Comprising: A conveying device, a plating bath, a plating thickness control device, and a plating measurement device according to any one of claims 6 to 8; The conveying device is used to convey a substrate into the plating bath, and successively drive the substrate through the working positions of the plating thickness control device and the plating measurement device after plating; The plating thickness control device is used to adjust the plating thickness on the surface of the substrate.

10. The plating production line according to claim 9, characterized in that, It further includes a control device, which is used to control the operation of the plating thickness control device according to the plating thickness of the material to be measured, so that the plating thickness control device adjusts the plating thickness of the subsequent material to be measured.

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