High-speed mini-led die bonder and die bonding method

Abstract

The application relates to the technical field of semiconductor packaging equipment, and discloses a high-speed Mini-LED die bonding machine and a die bonding method. The high-speed Mini-LED die bonding machine comprises a rack, a crystal ring module, a detachable lens module arranged on the rack, a needle module and a die bonding module. First and second workstations are formed in the rack. The modules can be placed on the first or second workstation. The die bonding module comprises a swing arm. The swing arm comprises a first swing arm and a second swing arm. Different materials correspond to different swing arms and different workstations, so that the adaptability of the die bonding machine is improved. The die bonding method is as follows: a wafer is placed on the crystal ring module, the needle module lifts the wafer, and the swing arm transfers the wafer for die bonding. A first material is processed. The lens module, the needle module and the die bonding module are located in the first workstation. The swing arm is the first swing arm. When a second material is processed, the lens module, the needle module and the die bonding module are located in the second workstation. The swing arm is replaced by the second swing arm. The application has the effect of improving the adaptability of the die bonding machine.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging equipment technology, and in particular to a high-speed Mini-LED die bonder and die bonding method. Background Technology

[0002] Die bonding machines are mainly used for lead frame plates of various gold wire ultrasonic welding equipment, as well as various nozzles, ejector pins, dispensing heads, and various spare parts of automated equipment in various chip mounting equipment. Traditional die bonding machines use a single swing arm and a single nozzle to pick up the wafer for die bonding, and the dispensing method uses a syringe dispensing valve, which is inefficient for single dispensing.

[0003] One type of high-speed Mini-LED die bonder in related technologies includes a platform, a feeding mechanism and a receiving mechanism respectively mounted on the left and right mounting plates of the platform; it also includes a track mechanism, a lens assembly, a wafer frame moving platform, a ejector pin assembly, and a multi-head die bonder mounted on the platform surface. The feeding mechanism feeds the LED bracket into the inlet of the adjacent track mechanism. The track mechanism receives and transfers the LED bracket, and moves it to a set position with the assistance of the lens assembly. After the ejector pin assembly ejects the wafer from the wafer frame moving platform, the multi-head die bonder fixes the wafer onto the LED bracket. The receiving mechanism receives the die-bonded LED bracket. Compared with traditional die bonding methods that bond one wafer at a time, this die bonder improves die bonding efficiency and accuracy by using multiple die bonding nozzles to bond multiple wafers at once, ensuring consistency. However, in the high-speed, high-precision die bonder of related technologies, when the length of the LED bracket changes during the die bonding process, the fixed structure of the multi-head die bonder results in low die bonding efficiency and increased die bonding error.

[0004] Therefore, the high-speed, high-precision die bonder in the above technical solution has the defects of low efficiency and low precision when die bonding different types of LED brackets. Summary of the Invention

[0005] In order to improve the adaptability of the die bonder while enhancing its working efficiency and die bonding accuracy, this application provides a high-speed Mini-LED die bonder and a die bonding method.

[0006] Firstly, the high-speed Mini-LED die bonder provided in this application adopts the following technical solution:

[0007] A high-speed Mini-LED die bonder, comprising:

[0008] The machine frame has a first workstation and a second workstation.

[0009] A crystal ring module, mounted on the rack, is used to place wafers;

[0010] The lens module is detachably mounted on the frame and is used to photograph and locate chip information and transmit chip information position deviation.

[0011] The ejector pin module is detachably mounted on the frame and is used to lift the wafer;

[0012] The die bonding module is detachably mounted on the frame and includes a drive unit and a swing arm. The drive unit is connected to the swing arm and is used to drive the swing arm to reciprocate between the die supply position and the die bonding position. The swing arm is used to pick up the wafer.

[0013] When the lens module, the ejector pin module, and the die bonding module are all located at the first station, the swing arm uses the first swing arm to bond the first material; when the lens module, the ejector pin module, and the die bonding module are all located at the second station, the swing arm uses the second swing arm to bond the second material.

[0014] Based on the above technical solution, when processing the first material, the lens module, ejector module, and die-bonding module are all located at the first station. The first swing arm used in the die-bonding module is a first swing arm, which is compatible with the type of the first material. The wafer is placed on the crystal ring module, the lens module positions and photographs the wafer, calculates the wafer's positional deviation, adjusts the wafer's position, the ejector module lifts the wafer, and the first swing arm picks up the wafer for die bonding. When processing the second material, the lens module, ejector module, and die-bonding module are all located at the second station. The second swing arm used in the die-bonding module is a second swing arm, which is compatible with the type of the second material to facilitate subsequent die bonding operations. When processing different types of materials, the lens module, ejector module, and die-bonding module are placed at compatible stations, and different types of swing arms are replaced according to the type of material, improving the adaptability of the die bonder, increasing work efficiency, and improving the accuracy during die bonding.

[0015] Preferably, the ejector module includes a lifting device and an ejector device. The lifting device is fixedly connected to the frame and connected to the ejector device. The lifting device is used to drive the ejector device to lift and lower so that the ejector device lifts the wafer.

[0016] Based on the above technical solution, the lifting device is connected to the ejector pin device. The lifting device drives the ejector pin device to rise, the ejector pin device lifts the wafer, the die bonding device picks up the wafer from the ejector pin device, and after the wafer is transferred, the lifting device drives the ejector pin device to fall, so that the ejector pin device returns to its original position.

[0017] Preferably, the lifting device includes a mounting base, a first motor, and an eccentric cam. The mounting base is detachably connected to the frame, the first motor is fixedly connected to the mounting base, and the eccentric cam is connected to the first motor. The first motor is used to drive the eccentric cam to rotate.

[0018] A limiting plate is slidably mounted on the mounting base, and a limiting groove is provided on the limiting plate. An eccentric cam is disposed in the limiting groove and abuts against the limiting groove so that the eccentric cam drives the limiting plate to rise and fall.

[0019] Based on the above technical solution, the mounting base is set between the first motor and the frame, and the mounting base and the frame are detachably connected to facilitate the replacement of the ejector pin module between different workstations; the eccentric cam is fixedly connected to the output shaft of the first motor, and the eccentric cam also rotates when the output shaft of the first motor rotates; a limit plate is slidably set on the mounting base, and the eccentric cam is set in the limit plate, so that the limit plate can be raised and lowered when the eccentric cam rotates.

[0020] Preferably, the ejector pin device includes an ejector rod and an ejector pin. The ejector rod is connected to the limiting plate, and the ejector pin is connected to the ejector rod. An ejector pin cap is fitted on the ejector pin to protect it.

[0021] Based on the above technical solution, the push rod is connected to the push pin, and the push rod abuts against the limiting plate. When the first motor drives the eccentric cam to rotate, the eccentric cam drives the limiting plate, push rod and push pin to rise and fall. The push pin cap is sleeved on the outside of the push pin and push rod to protect the push pin.

[0022] Preferably, the driving device includes a second motor and a mounting rod. The second motor is fixedly connected to the frame, the mounting rod is fixedly connected to the second motor, and the swing arm is detachably connected to the mounting rod. The second motor is used to drive the mounting rod and the swing arm to rotate.

[0023] Based on the above technical solution, a mounting rod is provided between the second motor and the swing arm to facilitate the connection between the second motor and the swing arm. The swing arm and the mounting rod are detachably connected to facilitate the replacement of different swing arms according to different materials.

[0024] Preferably, the crystal ring module includes an X-axis moving component, a Y-axis moving component, and a wafer stage. The X-axis moving component includes an X-axis linear guide, an X-axis moving base, and an X-axis linear motor. The Y-axis moving component includes a Y-axis linear guide, a Y-axis moving base, and a Y-axis linear motor. The Y-axis linear guide is fixedly connected to the frame. The Y-axis moving base is slidably connected to the Y-axis linear guide. The Y-axis linear motor is fixedly connected to the Y-axis moving base and the X-axis linear guide. The Y-axis linear motor drives the X-axis moving component to move along the Y-axis direction. The X-axis moving base is slidably connected to the X-axis linear guide. The X-axis linear motor is fixedly connected to the X-axis moving base. The wafer stage is connected to the X-axis linear motor, and the X-axis linear motor drives the wafer stage to move along the X-axis direction.

[0025] Based on the above technical solution, the Y-axis linear motor is fixedly connected to the Y-axis moving base, and the Y-axis linear motor drives the Y-axis moving base to move on the Y-axis linear guide rail; the X-axis linear motor is fixed on the X-axis moving base, and the X-axis linear motor drives the X-axis moving base to move on the X-axis linear guide rail. Since the X-axis linear guide rail is fixedly connected to the Y-axis linear motor, and the wafer stage is fixedly connected to the X-axis linear motor, the wafer stage can move along the X-axis and Y-axis directions, thereby adjusting the position of the wafer stage and the wafer.

[0026] Preferably, the frame is provided with a track module, which includes an X-axis track assembly and a Y-axis track assembly. The X-axis track assembly includes an X-axis track, an X-axis mounting base, and an X-axis motor. The Y-axis track assembly includes a Y-axis track, a Y-axis mounting base, and a Y-axis motor. The Y-axis track is fixedly connected to the frame, the Y-axis mounting base is slidably connected to the Y-axis track, and the Y-axis motor is fixedly connected to the Y-axis mounting base. The Y-axis motor is used to drive the Y-axis mounting base to move along the Y-axis direction. The X-axis track is connected to the Y-axis motor, the X-axis mounting base is slidably connected to the X-axis track, and the X-axis motor is fixedly connected to the X-axis mounting base. The X-axis motor is used to drive the X-axis mounting base to move along the X-axis direction. A mounting platform is provided on the X-axis motor, and a die bonding station is provided on the mounting platform. A lens barrel module is provided on the frame, and the lens barrel module is correspondingly provided with the die bonding station.

[0027] Based on the above technical solution, the Y-axis motor and Y-axis mounting base are fixedly connected, the Y-axis mounting base is slidably connected to the Y-axis track, and the Y-axis track is fixedly connected to the frame, so that the Y-axis motor can drive the Y-axis moving base to slide along the Y-axis track; the X-axis track is fixedly connected to the Y-axis motor, the X-axis mounting base and X-axis motor are both slidably connected to the X-axis track, and the X-axis mounting base and X-axis motor are fixedly connected, so that the X-axis motor can drive the X-axis mounting base to slide along the X-axis direction; the X-axis motor is fixedly connected to the mounting stage, so that the mounting stage can move along the X-axis and Y-axis directions; the lens module takes pictures of the wafer and transmits the wafer's position deviation information, and then drives the mounting stage and die bonding stage to move through the X-axis motor and Y-axis motor to adjust and correct the wafer's position for subsequent die bonding operations.

[0028] Preferably, the rack is provided with a lighting device for illuminating the wafer.

[0029] Based on the above technical solution, the lighting device is used for lighting wafers.

[0030] Secondly, the die bonding method provided in this application adopts the following technical solution:

[0031] A die bonding method using a high-speed Mini-LED die bonder includes the following steps:

[0032] When processing the first material, the lens module, ejector pin module and die bonding module are all located at the first station, and the swing arm on the die bonding module is the first swing arm.

[0033] The wafer is adjusted and placed on the crystal ring module. The lens module takes pictures of the wafer to determine its position information and position deviation information. The crystal ring module then adjusts the position of the wafer.

[0034] The ejector module pushes the chip out of the ejector pin assembly.

[0035] Die bonding: The drive device drives the swing arm to pick up and transfer the wafer for die bonding.

[0036] When processing the second material, the lens module, ejector module and die bonding module are disassembled from the first station and installed at the second station. The swing arm on the die bonding module is replaced with the second swing arm to perform the operations of adjusting the wafer, ejecting the wafer and bonding the die.

[0037] Based on the above technical solution, when processing the first material, the lens module, ejector module, and die bonding module are all located at the first station. The swing arm on the die bonding module is the first swing arm. The wafer is placed on the crystal ring module. The lens module takes pictures to locate the position information of the wafer and calculates the position deviation information of the wafer. The crystal ring module adjusts the position of the wafer so that the wafer is in the accurate position. The ejector module lifts the wafer, and the first swing arm picks up the wafer for die bonding. When processing the second material, the lens module, ejector module, and die bonding module are all located at the second station. The swing arm on the die bonding module is the second swing arm. Die bonding is then performed through the above operation steps. Since different materials correspond to different stations and swing arms that are compatible with the materials, the adaptability of the die bonding machine is improved, and the working efficiency and accuracy of the die bonding machine are also improved.

[0038] In summary, this application includes at least one of the following beneficial technical effects:

[0039] 1. When processing the first material, the lens module, ejector pin module, and die bonding module are all located at the first station, and the swing arm is the first swing arm. The model of the first swing arm is compatible with the first material. When processing the second material, the lens module, ejector pin module, and die bonding module are all located at the second station, and the swing arm is the second swing arm. The model of the second swing arm is compatible with the second material. When processing different types of materials, the appropriate station and the appropriate swing arm are selected, which improves the compatibility of the die bonding machine, improves the working efficiency and the accuracy during die bonding.

[0040] 2. The track module adjusts the position of the die bonder on the X and Y axes to facilitate accurate die bonding;

[0041] 3. Both the lens module and the lens barrel module take pictures of the chip to determine the chip's positional error and make adjustments to the chip. Attached Figure Description

[0042] Figure 1 A schematic diagram of the overall structure of the high-speed Mini-LED die bonder according to an embodiment of this application is shown;

[0043] Figure 2 The diagram illustrates a partial structural schematic of a high-speed Mini-LED die bonder according to an embodiment of this application, mainly used to illustrate the different workstations of the die bonder;

[0044] Figure 3 A schematic diagram of the ejector pin module in a high-speed Mini-LED die bonder according to an embodiment of this application is shown;

[0045] Figure 4 A schematic diagram of the crystal ring module in the high-speed Mini-LED die bonder according to an embodiment of this application is shown;

[0046] Figure 5A schematic diagram of the die bonding module in the high-speed Mini-LED die bonding machine according to an embodiment of this application is shown.

[0047] Explanation of reference numerals in the attached drawings: 10. Frame; 11. First station; 111. Lens module first station; 112. Ejector pin module first station; 113. Die-bonding module first station; 12. Second station; 121. Lens module second station; 122. Ejector pin module second station; 123. Die-bonding module second station; 20. Lens module; 30. Ejector pin module; 31. Lifting device; 311. Mounting base; 312. First motor; 313. Eccentric cam; 32. Ejector pin device; 321. Limiting plate; 322. Ejector rod; 323. Ejector pin; 324. Base; 325. Connecting seat; 326. Ejector pin cap; 40. Die-bonding module; 41. Drive device; 411. Second motor ; 412, Mounting rod; 42, Swing arm; 43, Mounting box; 50, Crystal ring module; 51, Y-axis moving assembly; 511, Y-axis linear guide; 512, Y-axis moving seat; 513, Y-axis linear motor; 52, X-axis moving assembly; 521, X-axis linear guide; 522, X-axis moving seat; 523, X-axis linear motor; 53, Wafer stage; 60, Track module; 61, Y-axis track assembly; 611, Y-axis track; 612, Y-axis mounting seat; 613, Y-axis motor; 62, X-axis track assembly; 621, X-axis track; 622, X-axis mounting seat; 623, X-axis motor; 63, Mounting platform; 64, Die bonding platform; 70, Lens barrel module; 80, Lighting device. Detailed Implementation

[0048] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.

[0049] In a first aspect, embodiments of this application disclose a high-speed Mini-LED die bonder.

[0050] Reference Figure 1 and Figure 2 The high-speed Mini-LED die bonder includes a frame 10 and two sets of lens modules 20, two sets of ejector pin modules 30, and two sets of die bonder modules 40 detachably mounted on the frame 10. The frame 10 has a first station 11 and a second station 12, which are arranged parallel to each other. The first station 11 is located away from the ejector pin modules 30, and the second station 12 is located closer to the ejector pin modules 30. The first station 11 is suitable for smaller material sizes, and the second station 12 is suitable for larger material sizes. The lens modules 20, ejector pin modules 30, and die bonder modules 40 can be interchanged between the first station 11 and the second station 12 according to the material type, thereby improving the adaptability of the die bonder. The position of the station can be designed according to the type of die bonder material.

[0051] Reference Figure 2 The first station 11 includes a lens module first station 111, an ejector pin module first station 112, and a die bonding module first station 113. The second station 12 includes a lens module second station 121, an ejector pin module second station 122, and a die bonding module second station 123. Different modules can be set in corresponding stations. The width of the material processed by the die bonding machine is usually 60-200mm. When processing materials with a width of 60-160mm, the module is located at the first station 11; when processing materials with a width of 160-200mm, the module is located at the second station 12.

[0052] Reference Figure 3 The die bonding module 40 includes a drive unit 41 and a swing arm 42. The drive unit 41 is arranged vertically, and a mounting box 43 is provided on the frame 10. The drive unit 41 includes a second motor 411 and a mounting rod 412. The second motor 411 is fixedly mounted on the mounting box 43 for easy disassembly of the drive unit 41. The output shaft of the second motor 411 passes through the mounting box 43, and the mounting rod 412 is fixedly mounted on the output shaft of the second motor 411. The swing arm 42 is detachably connected to the mounting rod 412 for easy replacement of the swing arm 42. The swing arm 42 reciprocates between the die supply position and the die bonding position. The swing arm 42 includes a first swing arm and a second swing arm. The first swing arm is shorter and suitable for processing materials of 60-160mm, while the second swing arm is longer and suitable for processing materials of 160-200mm, thereby improving the working efficiency during processing and the accuracy during die bonding.

[0053] Reference Figure 4 The ejector module 30 includes a lifting device 31 and an ejector device 32. The lifting device 31 is mounted on the frame 10, and the ejector device 32 is connected to the lifting device 31. The lifting device 31 includes a mounting base 311, a first motor 312, and an eccentric cam 313. The mounting base 311 is detachably connected to the frame 10. The first motor 312 is fixedly connected to the mounting base 311. The eccentric cam 313 is fixedly connected to the output shaft of the first motor 312. When the output shaft of the first motor 312 rotates, the eccentric cam 313 also rotates.

[0054] Reference Figure 4The ejector device 32 includes a limiting plate 321, an ejector rod 322, and an ejector pin 323. The limiting plate 321 is slidably connected to the mounting base 311. A limiting groove is provided on the limiting plate 321, and an eccentric cam 313 is disposed in the limiting groove. The eccentric cam 313 abuts against the limiting plate 321. When the eccentric cam 313 rotates, the limiting plate 321 moves accordingly to achieve lifting and lowering. A base 324 is provided on the limiting plate 321, and a through hole is provided on the base 324. The ejector rod 322 passes through the through hole and is fixedly connected to the limiting plate 321. The ejector rod 322 is fixedly connected to the ejector pin 323. The ejector pin 323 is used to lift the wafer. When the first motor 312 is working, the first motor 312 drives the eccentric cam 313 to rotate, so that the ejector rod 322 and the ejector pin 323 move accordingly to achieve lifting and lowering.

[0055] Reference Figure 4 A connecting seat 325 is fitted onto the outer side of the push rod 322. The height of the connecting seat 325 is less than the height of the push rod 322. One end of the connecting seat 325 is fixedly connected to the base 324. A pin cap 326 is provided on the connecting seat 325. The pin cap 326 is fitted onto the outer side of the push rod 322. The sum of the heights of the pin cap 326 and the connecting seat 325 is less than the sum of the heights of the push rod 322 and the pin 323, so that the pin 323 can pass through the pin cap 326 to lift the wafer. A groove is provided on the connecting seat 325, and a flange is provided on the pin cap 326. The flange is adapted to the groove to facilitate the connection between the pin cap 326 and the connecting seat 325. A pin hole is provided on the pin cap 326, and the size of the pin hole is adapted to the pin 323.

[0056] Reference Figure 5 A crystal ring module 50 is provided between the lens module 20 and the ejector pin module 30. The crystal ring module 50 includes a Y-axis moving component 51, which includes a Y-axis linear guide rail 511, a Y-axis moving seat 512, and a Y-axis linear motor 513. The Y-axis linear guide rail 511 is fixedly connected to the frame 10, the Y-axis moving seat 512 is slidably connected to the Y-axis linear guide rail 511, and the Y-axis linear motor 513 is fixedly connected to the Y-axis moving seat 512. A magnet is provided on the Y-axis linear guide rail 511, and the magnet cooperates with the Y-axis linear motor 513 to make the Y-axis moving seat 512 move along the Y-axis direction.

[0057] Reference Figure 5An X-axis moving component 52 is provided on the Y-axis moving component 51. The X-axis moving component 52 includes an X-axis linear guide 521, an X-axis moving base 522, and an X-axis linear motor 523. The X-axis linear guide 521 is fixedly connected to the Y-axis linear motor 513, the X-axis moving base 522 is slidably connected to the X-axis linear guide 521, and the X-axis linear motor 523 is fixedly connected to the X-axis moving base 522. A magnet is provided on the X-axis linear guide 521, and the magnet cooperates with the X-axis linear motor 523 to cause the X-axis linear motor 523 and the X-axis moving base 522 to move along the X-axis direction. A wafer stage 53 is provided on the X-axis linear motor 523 for placing wafers.

[0058] Reference Figure 2 A track module 60 is provided between the two sets of die bonding modules 40. The track module 60 is located in the middle position on the frame 10. The track module 60 includes a Y-axis track assembly 61, which includes a Y-axis track 611, a Y-axis mounting base 612, and a Y-axis motor 613. The Y-axis track 611 is fixedly connected to the frame 10, the Y-axis mounting base 612 is slidably connected to the Y-axis track 611, and the Y-axis motor 613 is fixedly connected to the Y-axis mounting base 612. A magnet is provided on the Y-axis track 611, and the magnet cooperates with the Y-axis motor 613 to realize the sliding of the Y-axis mounting base 612 along the Y-axis direction.

[0059] Reference Figure 2 An X-axis track assembly 62 is provided on the Y-axis track assembly 61. The X-axis track assembly 62 includes an X-axis track 621, an X-axis mounting base 622, and an X-axis motor 623. The X-axis track 621 is fixedly connected to the Y-axis motor 613. The X-axis mounting base 622 is slidably mounted on the X-axis track 621. The X-axis motor 623 is fixedly connected to the X-axis mounting base 622. A magnet is provided on the X-axis track 621. The magnet cooperates with the X-axis motor 623 to realize the sliding of the X-axis mounting base 622 along the X-axis direction.

[0060] Reference Figure 2 An X-axis motor 623 is equipped with a mounting platform 63, and a die bonding station 64 is mounted on the mounting platform 63. A lens barrel module 70 is mounted directly above the die bonding station 64. The lens barrel module 70 is fixedly connected to the frame 10. The die bonding station 64 and the lens barrel module 70 are both located in the middle of the two sets of die bonding modules 40. The lens barrel module 70 is used to take pictures to determine the position of the wafer, calculate the position deviation information, and adjust the position of the wafer so that the wafer can be bonded on the die bonding station 64.

[0061] Reference Figure 1 The rack 10 is also equipped with two sets of lighting devices 80, which are fixedly connected to the rack 10. The lighting devices 80 are symmetrically arranged about the track module 60 and are used to illuminate the wafers.

[0062] The implementation principle of a high-speed Mini-LED die bonder according to an embodiment of this application is as follows: The wafer is placed on the wafer stage. The lens module 70 takes pictures to locate the wafer's position information to determine the wafer's positional deviation information. The position of the wafer on the X-axis and Y-axis is changed by the X-axis moving component 52 and the Y-axis moving component 51. The first motor 312 drives the eccentric cam 313 to rotate, and the ejector pin 323 moves upward to lift the wafer. The swing arm 42 transfers the wafer to the top of the die bonder 64. The lens module 20 takes pictures to determine the wafer's position information to determine the wafer's positional deviation information. The position of the wafer on the X-axis and Y-axis is changed by the X-axis track component 62 and the Y-axis track component 61. The swing arm 42 places the wafer on the wafer... Die bonding is performed on the die bonding stage 64. The frame 10 has a first station 11 and a second station 12. Both the first station 11 and the second station 12 are used to place modules. When the lens module 20, the ejector pin module 30 and the die bonding module 40 are all located at the first station 11, the swing arm 42 adopts the first swing arm. The position of the first station 11 and the first swing arm are both adapted to the type of the first material. When the lens module 20, the ejector pin module 30 and the die bonding module 40 are all located at the second station 12, the swing arm 42 adopts the second swing arm. The position of the second station 12 and the second swing arm are both adapted to the type of the second material. Different materials are adapted to different stations and different swing arms, thereby improving the working efficiency and accuracy of die bonding.

[0063] Secondly, this application provides a die bonding method using a high-speed Mini-LED die bonder, which includes the following steps:

[0064] The wafer is placed on the wafer stage 53, and the lens module 20 takes pictures of the wafer to determine its position. The positional deviation information of the wafer is calculated, and the position of the wafer is adjusted by the X-axis linear motor and the Y-axis linear motor.

[0065] The first motor 312 drives the eccentric cam 313 to rotate. The rotation of the eccentric cam 313 drives the push rod 322 and the push pin 323 to rise. The push pin 323 will lift the wafer.

[0066] The second motor 411 drives the swing arm 42 to move to the die supply position, which is directly above the ejector pin 323. The swing arm 42 picks up the die, and the second motor 411 drives the swing arm 42 to move the die to the die bonding stage 64.

[0067] The position of the wafer is adjusted by taking pictures of the wafer on the swing arm 42 by the lens barrel module 70 to determine the position of the wafer, calculating the position deviation information of the wafer, and adjusting the position of the wafer by the X-axis motor 623 and the Y-axis motor 613.

[0068] Die bonding: The swing arm 42 places the wafer on the die bonding stage 64 to perform the die bonding operation.

[0069] When processing materials with a length of 160mm, the lens module 20, the ejector pin module 30, and the die bonding module 40 are all located on the first station 11, and the swing arm 42 used is a shorter swing arm 42; when processing materials with a length of 200mm, the lens module 20, the ejector pin module 30, and the die bonding module 40 are all located on the second station 12, and the swing arm 42 used is a longer swing arm 42.

[0070] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A high-speed Mini-LED die bonder, characterized in that, include: The frame (10) has a first station (11) and a second station (12); a track module (60) is provided on the frame (10) between two sets of die bonding modules (40), and a mounting platform (63) is provided on the X-axis motor (623) of the track module (60), and a die bonding station (64) for wafer die bonding is provided on the mounting platform (63); a lens barrel module (70) is provided on the frame (10), and the lens barrel module (70) is correspondingly provided with the die bonding station (64) of the track module (60); A crystal ring module (50) is disposed on the rack (10) for placing wafers; the crystal ring module (50) includes an X-axis moving component (52), a Y-axis moving component (51) and a wafer stage (53) on which the wafers are placed, and the position of the wafers on the X-axis and Y-axis is changed by the X-axis moving component (52) and the Y-axis moving component (51); The lens module (20) is detachably mounted on the frame (10) and is used to photograph and position the chip information and transmit the chip information position deviation. The ejector pin module (30) is detachably mounted on the frame (10) for lifting the wafer; The die bonding module (40) is detachably mounted on the frame (10) and includes a drive device (41) and a swing arm (42). The drive device (41) is connected to the swing arm (42). The drive device (41) is used to drive the swing arm (42) to reciprocate between the die supply position and the die bonding position. The swing arm (42) is used to pick up the wafer. The second station (12) is more suitable for materials with larger sizes than the first station (11). The lens module (20), the ejector pin module (30) and the die bonding module (40) can be replaced between the first station (11) and the second station (12). When the lens module (20), the ejector pin module (30), and the die bonding module (40) are all located at the first station (11), the swing arm (42) uses the first swing arm to bond the first material; when the lens module (20), the ejector pin module (30), and the die bonding module (40) are all located at the second station (12), the swing arm (42) uses the second swing arm to bond the second material, and the second swing arm is a longer swing arm than the first swing arm; The lens module (70) takes pictures of the wafer and transmits the wafer's position deviation information. The X-axis motor (623) and the Y-axis motor (613) drive the mounting stage (63) and the die bonding stage (64) of the track module (60) to move, so as to adjust and correct the position of the wafer on the die bonding stage (64) for subsequent die bonding operations.

2. The high-speed Mini-LED die bonder according to claim 1, characterized in that, The ejector module (30) includes a lifting device (31) and an ejector device (32). The lifting device (31) is fixedly connected to the frame (10). The lifting device (31) is connected to the ejector device (32). The lifting device (31) is used to drive the ejector device (32) to lift up and down so that the ejector device (32) lifts the wafer.

3. The high-speed Mini-LED die bonder according to claim 2, characterized in that, The lifting device (31) includes a mounting base (311), a first motor (312), and an eccentric cam (313). The mounting base (311) is detachably connected to the frame (10). The first motor (312) is fixedly connected to the mounting base (311). The eccentric cam (313) is connected to the first motor (312). The first motor (312) is used to drive the eccentric cam (313) to rotate. A limiting plate (321) is slidably disposed on the mounting base (311). A limiting groove is provided on the limiting plate (321). An eccentric cam (313) is disposed in the limiting groove. The eccentric cam (313) abuts against the limiting groove so that the eccentric cam (313) drives the limiting plate (321) to rise and fall.

4. The high-speed Mini-LED die bonder according to claim 3, characterized in that, The ejector pin device (32) includes an ejector rod (322) and an ejector pin (323). The ejector rod (322) is connected to the limiting plate (321), and the ejector pin (323) is connected to the ejector rod (322). An ejector pin cap (326) is fitted on the ejector pin (323) to protect the ejector pin (323).

5. The high-speed Mini-LED die bonder according to claim 1, characterized in that, The drive device (41) includes a second motor (411) and a mounting rod (412). The second motor (411) is fixedly connected to the frame (10), the mounting rod (412) is fixedly connected to the second motor (411), and the swing arm (42) is detachably connected to the mounting rod (412). The second motor (411) is used to drive the mounting rod (412) and the swing arm (42) to rotate.

6. The high-speed Mini-LED die bonder according to claim 1, characterized in that, The X-axis moving assembly (52) includes an X-axis linear guide (521), an X-axis moving base (522), and an X-axis linear motor (523). The Y-axis moving assembly (51) includes a Y-axis linear guide (511), a Y-axis moving base (512), and a Y-axis linear motor (513). The Y-axis linear guide (511) is fixedly connected to the frame (10). The Y-axis moving base (512) is slidably connected to the Y-axis linear guide (511). The Y-axis linear motor (513) is fixedly connected to the Y-axis moving base (512). The Y-axis linear motor (513) is fixedly connected to the X-axis linear guide (521). The Y-axis linear motor (513) is used to drive the X-axis moving component (52) to move along the Y-axis direction. The X-axis moving seat (522) is slidably connected to the X-axis linear guide (521). The X-axis linear motor (523) is fixedly connected to the X-axis moving seat (522). The wafer stage (53) is connected to the X-axis linear motor (523). The X-axis linear motor (523) is used to drive the wafer stage (53) to move along the X-axis direction.

7. The high-speed Mini-LED die bonder according to claim 1, characterized in that, The track module (60) includes an X-axis track assembly (62) and a Y-axis track assembly (61). The X-axis track assembly (62) includes an X-axis track (621), an X-axis mounting base (622), and an X-axis motor (623). The Y-axis track assembly (61) includes a Y-axis track (611), a Y-axis mounting base (612), and a Y-axis motor (613). The Y-axis track (611) is fixedly connected to the frame (10), and the Y-axis mounting base (612) is slidably connected to the Y-axis track (611). The Y-axis motor (613) is fixedly connected to the Y-axis mounting base (612). The Y-axis motor (613) is used to drive the Y-axis mounting base (612) to move along the Y-axis direction. The X-axis track (621) is connected to the Y-axis motor (613). The X-axis mounting base (622) is slidably connected to the X-axis track (621). The X-axis motor (623) is fixedly connected to the X-axis mounting base (622). The X-axis motor (623) is used to drive the X-axis mounting base (622) to move along the X-axis direction.

8. The high-speed Mini-LED die bonder according to claim 1, characterized in that, The frame (10) is provided with an illumination device (80) for illuminating the wafer.

9. A method for solidification, characterized in that, Using a high-speed Mini-LED die bonder as described in any one of claims 1-8, the die bonding method includes the following steps: When processing the first material, the lens module (20), the ejector pin module (30) and the die bonding module (40) are all located at the first station (11), and the swing arm (42) on the die bonding module (40) is the first swing arm; Adjust the wafer, place the wafer on the crystal ring module (50), take a picture of the wafer with the lens module (20), determine the wafer position information and the wafer position deviation information, and adjust the position of the wafer with the crystal ring module (50). The chip is ejected by the ejector pin module (30); For die bonding, the driving device (41) drives the swing arm (42) to pick up the transferred wafer for die bonding; When processing the second material, the lens module (20), the ejector module (30) and the die bonding module (40) are removed from the first station (11) and installed at the second station (12). The swing arm (42) on the die bonding module (40) is replaced with the second swing arm to perform the operations of adjusting the wafer, ejecting the wafer and bonding the die.

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