A semiconductor processing apparatus and a method of processing a semiconductor product

Abstract

The present disclosure provides a semiconductor processing equipment and a processing method of a semiconductor product. The semiconductor processing equipment comprises a first conveying device and a detection device. The first conveying device is used for carrying and conveying the semiconductor product to a predetermined position. The detection device is used for obtaining an offset parameter of the semiconductor product on the first conveying device. The first conveying device is further used for adjusting a starting conveying position according to the offset parameter. In the present disclosure, the detection device can obtain the offset parameter of the semiconductor product, and the first conveying device can adjust the starting conveying position according to the offset parameter. When the offset of the semiconductor product on the first conveying device can cause the semiconductor processing equipment in the related art to stop, the semiconductor processing equipment provided by the present disclosure will not stop and can automatically compensate the offset, thereby avoiding the normal operation time being occupied due to the stop for maintenance, and improving the work efficiency.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and in particular to a semiconductor processing equipment and a method for processing semiconductor products. Background Technology

[0002] When wafers are transported to the process chamber for processing, it is necessary to ensure that the semiconductor products are in a relatively centered position within the process chamber. However, misalignment can easily occur during the handling of semiconductor products.

[0003] In related technologies, the vacuum module wafer positioning device (transfer navigation module, TNS) can issue an alarm and stop the wafer transfer when the semiconductor product is misaligned. After the transfer stops, manual processing is required, which is time-consuming and may result in stacked or broken wafers. Summary of the Invention

[0004] The following is an overview of the subject matter described in detail in this disclosure. This overview is not intended to limit the scope of the claims.

[0005] This disclosure provides a semiconductor processing equipment and a method for processing semiconductor products.

[0006] According to a first aspect of this disclosure, a semiconductor processing apparatus is provided, the semiconductor processing apparatus comprising a first transfer device and a detection device;

[0007] The first transmission device is used to carry the semiconductor product and transmit the semiconductor product to a predetermined location;

[0008] The detection device is used to acquire the offset parameters of the semiconductor product on the first transmission device;

[0009] The first transmission device is also used to adjust the starting transmission position according to the offset parameter.

[0010] In some embodiments, the semiconductor processing apparatus further includes a processing chamber and a locking chamber connected to the processing chamber;

[0011] The locking chamber is used to store the semiconductor product at a fixed angle;

[0012] The first transmission device is used to remove a semiconductor product from the locking chamber at a predetermined initial position and to transfer the semiconductor product in the processing chamber along a predetermined route.

[0013] In some embodiments, the detection device is installed in the processing chamber, and the detection device includes a transmitting part and a receiving part, which are respectively fixed to the upper and lower walls of the processing chamber, and the transmitting part and the receiving part are aligned.

[0014] The emitting unit is used to emit light sensing signals perpendicular to the upper and lower walls of the processing chamber;

[0015] The receiving unit is used to receive and process the light sensing signal after it is blocked when the semiconductor product passes through the transmitting unit.

[0016] In some embodiments, the detection length of the light sensing signal in a third direction is greater than or equal to the diameter of the semiconductor product.

[0017] In some embodiments, the minimum distance between the detection device and the locking chamber is greater than or equal to the diameter of the semiconductor product.

[0018] In some embodiments, the detection device has a detection center, which is the center of the transmitting unit and the receiving unit;

[0019] The projection of the detection center is located on the predetermined route of the first transmission device.

[0020] In some embodiments, the offset parameters include: the offset angle and offset distance of the semiconductor center relative to the detection center;

[0021] The starting transmission position includes: the deflection angle and offset distance of the first transmission device relative to the predetermined initial position.

[0022] In some embodiments, the first transmission device includes a robotic arm and a robotic hand rotatably connected to the robotic arm, the robotic hand being used to carry the semiconductor product, and the robotic arm being used to control the extension and retraction distance of the robotic hand and move the semiconductor product along a predetermined route.

[0023] In some embodiments, the detection device is also used to detect the shape of the semiconductor product.

[0024] In some embodiments, the semiconductor processing equipment further includes a first positioning device disposed in the processing chamber;

[0025] The first positioning device is used to initially detect the initial offset of the semiconductor product on the first transmission device.

[0026] According to a second aspect of this disclosure, a method for processing a semiconductor product is provided, the method comprising:

[0027] Provide semiconductor products for processing;

[0028] The first transmission device transmits the semiconductor product through the detection device, and the detection device acquires the offset parameters of the semiconductor product.

[0029] The first transmission device adjusts its starting transmission position according to the offset parameter.

[0030] In some embodiments, the detection device acquires offset parameters of the semiconductor product, including:

[0031] The first transmission device transmits the semiconductor product along a predetermined route, and the first transmission device can pass through the testing center of the testing device.

[0032] Using the line connecting the testing center and the predetermined route as a reference, the offset angle and offset distance of the semiconductor product are determined based on the signal source location and signal strength received by the receiving unit of the testing device.

[0033] In some embodiments, adjusting the starting transmission position of the first transmission device according to the offset parameter includes:

[0034] Based on the offset angle of the offset parameter, the first transmission device deflects the offset angle according to the predetermined starting position of entering the locking chamber;

[0035] Based on the offset distance of the offset parameter, the first transmission device extends or retracts the offset distance according to the predetermined initial position of entering the locking chamber.

[0036] In some embodiments, when obtaining the offset parameters of the semiconductor product, the processing method of the semiconductor product further includes:

[0037] An intensity curve is generated based on the detected light intensity;

[0038] The integrity of the semiconductor product is determined based on the intensity curve and the preset curve.

[0039] In some embodiments, before the first transmission device transmits the semiconductor product through the detection device, the semiconductor product processing method further includes:

[0040] The first positioning device initially detects the initial offset of the semiconductor product on the first transmission device;

[0041] If the initial offset exceeds the adjustment range of the first positioning device, the first transmission device transmits the semiconductor product through the detection device to the locking chamber, and adjusts the starting transmission position of the first transmission device.

[0042] If the initial offset does not exceed the adjustment range of the first positioning device, the first positioning device adjusts the position of the semiconductor product.

[0043] In the semiconductor processing equipment and semiconductor product processing method provided in this disclosure, the detection device can acquire the offset parameters of the semiconductor product, and the first transmission device can adjust the starting transmission position according to the offset parameters. When the offset of the semiconductor product on the first transmission device can cause the semiconductor processing equipment in the related art to stop, the semiconductor processing equipment provided in this disclosure will not stop and can automatically perform offset compensation, avoiding downtime maintenance that would occupy normal working time and improving work efficiency.

[0044] After reading and understanding the accompanying diagrams and detailed descriptions, the other aspects can be understood. Attached Figure Description

[0045] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of these embodiments. In these drawings, similar reference numerals are used to denote similar elements. The drawings described below are some embodiments of the present disclosure, but not all embodiments. Other drawings will be readily available to those skilled in the art based on these drawings without inventive effort.

[0046] Figure 1 This is a schematic diagram of a semiconductor processing apparatus according to an exemplary embodiment.

[0047] Figure 2 yes Figure 1 A magnified view of region a in the middle.

[0048] Figure 3 This is a schematic diagram of a first positioning device according to an exemplary embodiment.

[0049] Figure 4 This is a schematic diagram illustrating the offset compensation principle according to an exemplary embodiment.

[0050] Figure 5 This is a schematic diagram illustrating the offset compensation principle according to an exemplary embodiment.

[0051] Figure 6 This is an intensity curve of a semiconductor product when it is intact, according to an exemplary embodiment.

[0052] Figure 7 This is an intensity curve of a semiconductor product when it is damaged, according to an exemplary embodiment.

[0053] Figure 8 This is a flowchart illustrating a semiconductor product processing method according to an exemplary embodiment.

[0054] Figure label:

[0055] 10. Processing chamber; 11. First transmission device; 12. First positioning device; 121. Optical sensor; 13. Detection device;

[0056] 20. Locking chamber;

[0057] 30. Process chamber;

[0058] 40. Loading chamber; 41. Second transmission device;

[0059] 50. Second positioning device;

[0060] 60. Loading port; 61. Transport box; 611. Wafer. Detailed Implementation

[0061] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions in the disclosed embodiments will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other.

[0062] When wafers are transported to the process chamber for processing, it is necessary to ensure that the semiconductor products are in a relatively centered position within the process chamber. However, misalignment can easily occur during the handling of semiconductor products.

[0063] In related technologies, the vacuum module wafer positioning device (transfer navigation module, TNS) can issue an alarm and stop the wafer transfer when the semiconductor product is misaligned. After the transfer stops, manual processing is required, which is time-consuming and may result in stacked or broken wafers.

[0064] To address the problems existing in related technologies and avoid the time-consuming manual intervention required for semiconductor processing equipment shutdown when semiconductor products deviate beyond a preset range, this disclosure provides a semiconductor processing equipment. The equipment includes a first transmission device and a detection device. The first transmission device carries and transmits the semiconductor product to a predetermined position, and the detection device acquires the deviation parameters of the semiconductor product. The first transmission device also adjusts the starting transmission position based on the deviation parameters. In this disclosure, the detection device can acquire the deviation parameters of the semiconductor product, and the first transmission device can adjust the starting transmission position based on the deviation parameters. When the deviation of the semiconductor product on the first transmission device could cause the semiconductor processing equipment in related technologies to stop, the semiconductor processing equipment provided in this disclosure will not stop and can automatically perform deviation compensation, avoiding downtime for maintenance and improving work efficiency.

[0065] According to an exemplary embodiment of this disclosure, such as Figure 1 As shown, Figure 1 A semiconductor processing apparatus is shown, which has the function of automatically conveying and processing semiconductor products, such as wafers. The semiconductor processing apparatus includes a first conveying device 11 and a detection device 13.

[0066] In this embodiment, as Figure 1 As shown, the first transfer device 11 is used to carry semiconductor products and transfer them to a predetermined position. The first transfer device 11 may include, for example, a robotic arm and a robotic hand rotatably connected to the robotic arm, the robotic hand being used to carry the semiconductor products.

[0067] It should be noted that, typically, the first transfer device 11 is located in the processing chamber 10 of the semiconductor processing equipment, which connects the locking chamber 20 and the process chamber 30. One end of the locking chamber 20 is connected to the processing chamber 10 (the interior of the processing chamber 10 is a vacuum environment), and the other end is connected to the atmospheric environment. When the semiconductor product is transferred between the atmospheric environment and the processing chamber 10, the internal pressure of the locking chamber 20 can be adjusted to prevent external gases from entering the processing chamber 10.

[0068] In one example, such as Figure 1 As shown, the first transfer device 11 can remove the semiconductor product to be processed from the locking chamber 20 and transport the semiconductor product to the process chamber 30, so that the semiconductor product can undergo a specified process in the process chamber. In this example, the predetermined position is the process chamber 30.

[0069] In another example, such as Figure 1As shown, the first transfer device 11 can remove the processed semiconductor product from the process chamber 30 and transport the semiconductor product to the locking chamber 20, thereby enabling the processed semiconductor product to be output to the atmospheric environment. In this example, the predetermined location is the locking chamber 20.

[0070] In another example, such as Figure 1 As shown, after the first transfer device 11 removes the semiconductor product to be processed from the locking chamber 20, during the process of transporting the semiconductor product to the process chamber 30, if the position of the semiconductor product on the first transfer device 11 shifts, and this shift prevents the semiconductor product from being in a more central position within the process chamber, the first transfer device 11 can transport the semiconductor product to be processed back into the locking chamber 20. The first transfer device 11 then re-loads the semiconductor product, ensuring it is in a suitable loading position. In this example, the predetermined position is the locking chamber 20.

[0071] If there are multiple locking chambers 20, one of the locking chambers 20 is fixed as the placement chamber for the offset wafer to be reloaded. The locking chamber 20 is used to adjust the wafer to a uniformly set fixed transfer position, so that the first transfer device 11 can adjust the preset initial position for taking out the wafer.

[0072] In some alternative embodiments, the first transmission device 11 may also be disposed in the loading chamber 40 of the semiconductor processing equipment. The loading chamber 40 is used to connect the locking chamber 20 and the loading port 60. The loading port 60 connects the wafer transfer box 61 and the loading chamber 40. When the first transmission device 11 is disposed in the loading chamber 40, the first transmission device 11 is used to transfer semiconductor products between the wafer transfer box 61 and the locking chamber 20.

[0073] In this embodiment, as Figure 1 As shown, the detection device 13 is used to obtain the offset parameters of the semiconductor product, and then the first transmission device 11 adjusts the starting transmission position according to the offset parameters.

[0074] When the first transmission device 11 moves the semiconductor product between the locking chamber 20 and the process chamber 30, the first transmission device 11 can pass through the detection device 13. When the first transmission device 11 passes through the detection device 13, the detection device 13 can obtain the offset parameters of the semiconductor product on the first transmission device 11. After the first transmission device 11 transports the semiconductor product back to the locking chamber 20, the first transmission device 11 separates from the semiconductor product and adjusts the starting transmission position according to the offset parameters in order to reload the semiconductor product.

[0075] It should be noted that the offset parameter acquired by the detection device 13 can be obtained during the process of the first transmission device 11 conveying the semiconductor product to the process chamber 30 after the first transmission device 11 removes the semiconductor product from the locking chamber 20. Alternatively, the offset parameter can be acquired during the process of the first transmission device 11 conveying the semiconductor product to the locking chamber 20 when the semiconductor product exceeds the deviation range of the first positioning device 12 (described in detail below).

[0076] In one example, refer to Figure 2 The offset parameters can be the offset distance and offset angle of the semiconductor product on the first transmission device 11. The first transmission device 11 has rotation and extension functions, so that the first transmission device 11 can be adjusted according to the offset distance and offset angle.

[0077] In another example, refer to Figure 2 The offset parameter can be used for semiconductor products in the second direction (reference). Figure 2 The first offset distance existing in the m direction shown, and in the third direction (refer to) Figure 2 The second offset distance exists in the n-direction shown. The second direction can be the conveying direction of the first conveying device 11, and the third direction is perpendicular to the second direction, and the third direction is perpendicular to the... Figure 2 The z-direction is shown in the diagram.

[0078] The first transmission device 11 can adjust its starting transmission position according to offset parameters. The starting transmission position includes the deflection angle and offset distance of the first transmission device relative to a predetermined initial position. It is understood that the semiconductor product can be stored in the locking chamber 20 at a fixed angle and position. However, when the first transmission device 11 enters the locking chamber along a predetermined route and retrieves the semiconductor product from the predetermined initial position, the semiconductor product will still deviate. Therefore, the first transmission device 11 adjusts its path into the locking chamber 20 according to the offset parameters and forms a new starting position in the locking chamber 20, so that the semiconductor product is in a reference position on the first transmission device 11. The predetermined initial position may include the initial deflection angle and initial extension distance of the robotic arm relative to the center of the locking chamber 20.

[0079] In this embodiment of the disclosure, the detection device can acquire the offset parameters of the semiconductor product, and the first transmission device can adjust the starting transmission position according to the offset parameters. When the offset of the semiconductor product on the first transmission device can cause the semiconductor processing equipment in the related art to stop, the semiconductor processing equipment provided in this disclosure will not stop and can automatically perform offset compensation, avoiding downtime maintenance that would occupy normal working time and improving work efficiency.

[0080] In one exemplary embodiment, such as Figure 1As shown, a semiconductor processing apparatus is provided. The semiconductor processing apparatus includes a first transmission device 11 and a detection device 13. The first transmission device 11 is used to carry semiconductor products and transmit semiconductor products to a predetermined position. The detection device 13 is used to obtain the offset parameters of the semiconductor products on the first transmission device. The first transmission device 11 is used to adjust the starting transmission position according to the offset parameters.

[0081] In this embodiment, as Figure 1 As shown, the semiconductor processing equipment also includes a processing chamber 10 and a locking chamber 20 connected to the processing chamber 10.

[0082] Reference Figure 1 The locking chamber 20 is used to store semiconductor products at a fixed angle, so that after the first transfer device 11 takes out the semiconductor product from the locking chamber 20 at a predetermined initial position and the first transfer device 11 transfers the semiconductor product to the process chamber 30 along a predetermined route, the semiconductor product can be processed in the process chamber at a desired angle.

[0083] Reference Figure 1 The detection device 13 is installed in the processing chamber 10. For example, the detection device 13 can be installed in the processing chamber 10 near the locking chamber 20.

[0084] The detection device 13 includes an emitting part and a receiving part. The emitting part can be, for example, a laser emitter, and the receiving part can be, for example, a laser receiver. The receiving part can be, for example, a charge-coupled device (CCD) image sensor. The charge-coupled device has photoelectric conversion function and can convert the detection light emitted by the emitting part into a charge signal.

[0085] The transmitter and receiver can be installed on the upper and lower walls (top and bottom walls) of the processing chamber, respectively, with the transmitter and receiver positioned vertically. Figure 2 As shown in the z-direction, the transmitter and receiver are aligned and form a detection space between them. The transmitter emits a light sensing signal perpendicular to the upper and lower walls of the processing chamber 10, and the receiver receives the light sensing signal. When the first transmission device 11 moves the semiconductor product through the detection space, the semiconductor product blocks the light sensing signal, causing a change in the detection signal received by the receiver. The receiver can receive and process the blocked light sensing signal to obtain the offset parameter of the semiconductor product on the first transmission device 11.

[0086] Among them, reference Figure 1 and Figure 2 Taking a circular semiconductor wafer 611 as an example, the first transmission device 11 can move along the second direction ( Figure 2The detection light emitted by the emitting unit in the third direction (m direction) passes through the detection space of the detection device 13. Figure 2 The length in the n-direction shown is greater than or equal to the diameter of the semiconductor product. The second direction is perpendicular to the third direction and both are perpendicular to the first direction. Figure 2 (as shown in the z-direction).

[0087] The length of the detection light in the third direction is set to be greater than or equal to the diameter of the wafer 611. When the wafer 611 shifts in the third direction, the wafer 611 is still within the detection range of the detection light. Thus, the offset parameters of the wafer 611 can be accurately obtained based on the position of the shadow area distribution on the receiving part (caused by the wafer 611 blocking the detection light).

[0088] Among them, such as Figure 1 As shown, the minimum distance between the detection device 13 and the locking chamber 20 is greater than or equal to the diameter of the wafer. Therefore, when the wafer 611 is offset too much on the first transmission device 11, the first transmission device 11 can perform the first compensation according to the offset angle (detailed in the following text) to prevent the wafer 611 from hitting the isolation door of the locking chamber 20.

[0089] In this embodiment, as Figure 2 , Figure 4 and Figure 5 As shown, the detection device 13 has a detection center A, which is the center of symmetry between the transmitting part and the receiving part. The projection of the detection center A is located on the predetermined route of the first transmission device 11 (the movement path of the robot's rotation center B), wherein the first transmission device 11 has a support center ( Figure 4 and Figure 5 The image shows a situation where the support center and the detection center A coincide. During the process of the wafer 611 being transported by the first transmission device 11 through the detection space, the support center (center of the robot arm) of the first transmission device 11 and the detection center A of the detection device 13 coincide. The receiving unit can obtain the offset parameters of the semiconductor product based on the detection signal received at that moment.

[0090] The detection device can also acquire the shape of the semiconductor product. For example, when a semiconductor product (wafer) is damaged or cracked, the blocking effect of the damaged or cracked area on the sensing light signal becomes weaker, and the receiving unit can determine the integrity of the wafer based on the intensity of the received sensing light.

[0091] In this embodiment, refer to Figure 4 and Figure 5The first transmission device 11 also has a rotation center B, which is the axis of the connecting shaft between the robotic arm and the robotic hand of the first transmission device 11. The semiconductor product has a geometric center P, which is the center of the wafer 611. When the support center coincides with the detection center A, the receiving part of the detection device 13 can obtain the position of the center of the wafer 611 based on the received detection light, and calculate the offset distance R and offset angle θ of the center relative to the rotation center B. The first transmission device 11 can adjust the semiconductor product based on the offset distance R and offset angle θ.

[0092] The following combination Figure 4 and Figure 5 The above will be explained in principle. Figure 4 The diagram shows the case where the support center of the first transmission device 11 coincides with the detection center of the detection device 13. A - support center / detection center, B - rotation center, P - geometric center of wafer 611. If wafer 611 is in its reference state, then the geometric center P of wafer 611 should coincide with point A. Therefore, Figure 4 The wafer 611 is offset from A to P, therefore, the compensation direction of the first transmission device 11 is P→A. A Cartesian coordinate system is established with point A as the origin. Assume P(x, y), where the distance between point B and point A is a known parameter (equivalent to the length between the centers of the robotic arm and the manipulator of the first transmission device 11). Assume B(0, -S). The coordinates x and y of point P can be calculated from the detection results during the movement of the first transmission device 11. As can be seen above, the offset angle is the angle θ between line segments AB and BP. The offset distance is calculated as follows: Draw an arc with B as the center and S as the radius. According to the Pythagorean theorem, the distance L between B and P can be obtained (or it can be directly measured from the graphic information). The intersection point of this arc and the line connecting B and P is C. The distance LS between C and P is the value of the offset distance R.

[0093] In one exemplary embodiment, such as Figure 1 As shown, a semiconductor processing apparatus is provided. The semiconductor processing apparatus includes a first transmission device 11 and a detection device 13. The first transmission device 11 is used to carry semiconductor products and transmit semiconductor products to a predetermined position. The detection device 13 is used to obtain the offset parameters of the semiconductor products on the first transmission device. The first transmission device 11 is used to adjust the starting transmission position according to the offset parameters.

[0094] In this embodiment, refer to Figure 1 and Figure 3 The processing chamber 10 is also equipped with a first positioning device 12.

[0095] In one example, refer to Figure 3The first positioning device 12 includes multiple optical sensors 121 (e.g., 3, 4, or 5; in this example, 3 optical sensors 121 are used). Taking the example of 3 optical sensors 121 evenly distributed around the circumference of the wafer 611, with each sensor 121 being strip-shaped and extending in the radial direction of the wafer 611, during wafer 611 positioning, when the wafer 611 is at a reference position on the first transmission device 11, each optical sensor 121 is obscured by the wafer 611 in the same shape. When the obscured shape of the optical sensor 121 is larger or smaller, it indicates that the wafer 611 is not at the reference position, and the first positioning device 12 can calculate the offset of the wafer 611 based on the feedback parameters of the optical sensors 121. It is understood that the first positioning device 12 can obtain the offset parameters of the wafer 611 and determine whether the wafer 611 should continue to be transported when the wafer 611 has not exceeded a preset offset range. The adjustment principle will not be elaborated upon further in this disclosure. In related technologies, when the first positioning device 12 detects that the wafer 611 exceeds the preset offset range, it will issue a pre-alarm error, at least causing the entire semiconductor processing equipment's transmission system to stop operating. However, in this disclosure, the first positioning device 12 can send a signal to the first transmission device 11 or a control unit (not shown). The first transmission device 11 then drives the wafer 611 back to perform an offset elimination operation, preventing downtime. It is understandable that the same semiconductor product may exceed the preset offset range even after multiple adjustments. In this case, the first positioning device 12 can issue a pre-tightening error to reduce the time spent on repeated adjustments of the semiconductor processing equipment during normal operation.

[0096] The first positioning device 12 can detect the position of the wafer 611 on the first transmission device 11 before the first support arm sends the wafer 611 into the process chamber 30, and make fine-tuning compensation for the semiconductor product within a preset offset range. However, the first positioning device 12 has a compensation upper limit. When the offset of the wafer 611 exceeds the upper limit, the first positioning device 12 in the related art will give an early warning error, which will at least cause the entire semiconductor processing equipment transmission system to stop operating. The positioning device in this disclosure can send a signal to the control unit (not shown), and the control unit controls the first transmission device 11 to transport the wafer 611 back to the locking chamber 20 for offset adjustment.

[0097] In this embodiment, refer to Figure 1 The semiconductor processing equipment also includes a loading chamber 40, which is connected to the processing chamber 10 via a locking chamber 20. A second transfer device 41 is provided in the loading chamber 40, which is used to input or output semiconductor products to the locking chamber 20. It is understood that the loading chamber 40 is in an atmospheric environment and can be connected to the transfer box 61 used to accommodate the wafer 611 and the locking chamber 20.

[0098] Among them, reference Figure 1 The semiconductor processing equipment also includes a second positioning device 50, which is connected to the loading chamber 40 and is located in an atmospheric environment. The second positioning device 50 is used when the wafer 611, after multiple adjustments, still exceeds the offset limit. In this case, the second transfer device 41 in the loading chamber 40 transfers the wafer 611 from the locking chamber 20 to the second positioning device 50, for example, by manual correction and compensation by a technician. This avoids the first transfer device 11 from cyclically operating between the locking chamber 20 and the first positioning device 12, increasing the effective working time of the semiconductor processing equipment.

[0099] According to an exemplary embodiment of this disclosure, this disclosure also provides a method for processing a semiconductor product, such as... Figure 8 As shown, Figure 8 A flowchart of a semiconductor product processing method is shown, which includes the following steps:

[0100] S100, providing semiconductor products to be processed.

[0101] In this step, such as Figure 1 As shown, the semiconductor product can be, for example, a wafer 611. Multiple wafers 611 are stacked in a transfer box 61. The transfer box 61 containing the wafers 611 can be transported to the loading port 60 by an automated overhead crane or other equipment.

[0102] S200, the first transmission device transmits the semiconductor product through the detection device, and the detection device obtains the offset parameters of the semiconductor product.

[0103] S300, The first transmission device adjusts the starting transmission position of the first transmission device according to the offset parameter.

[0104] In step S200, the detection device acquires the offset parameters of the semiconductor product, which may specifically include the following steps:

[0105] S210, The first transmission device transmits semiconductor products along a predetermined route, and the first transmission device can pass through the testing center of the testing device.

[0106] In this step, based on the fact that the detection device is in a fixed installation position in the processing chamber, the first transmission device is set to transmit the semiconductor product to the locking chamber along a predetermined route, and the first transmission device can pass through the detection center of the detection device so that the detection device can calculate the offset parameter using the same algorithm.

[0107] S220. Using the connection between the detection device and the predetermined route as a reference, determine the offset angle and offset distance of the semiconductor product based on the signal source location and signal strength received by the receiving unit of the detection device.

[0108] In this step, the transmission direction of the transmission device is perpendicular to the length direction of the detection device, so that the line connecting the detection device and the predetermined route can form a Cartesian coordinate system, and the receiving unit can determine the geometric center of the wafer based on the signal source location. The wafer's compensation direction is... Figure 4 The geometric center P is shown in the diagram, which is the detection center A.

[0109] Specifically, adjusting the starting transmission position of the first transmission device according to the offset parameter in step S300 may include the following steps:

[0110] S310. According to the offset angle of the offset parameter, the first transmission device deflects the offset angle based on the predetermined starting position of entering the locking chamber.

[0111] S320. Based on the offset distance of the offset parameter, the first transmission device extends or retracts the offset distance according to the predetermined starting position of entering the locking chamber.

[0112] First, the first transmission device compensates for the offset angle and offset distance to place the wafer back into the locking chamber at a preset angle and position. Then, the first transmission device deflects and extends relative to the predetermined starting position according to the offset angle and offset distance.

[0113] It should be noted that before the first transmission device enters the locking chamber, the first transmission device performs deflection compensation based on the offset angle (to avoid the wafer offset angle being too large, causing the wafer to collide with the edge of the locking chamber). After the first transmission device enters the locking chamber, the first transmission device performs extension compensation based on the offset distance.

[0114] In this step, based on the offset distance of the semiconductor product, the first transmission device 11 transports the semiconductor product to the locking chamber 20. The locking chamber 20 adjusts the semiconductor product to a fixed transmission position, the same as the first extraction position. However, the second extraction involves the first transmission device adjusting the angle and distance of picking up the wafer relative to the predetermined initial position. For example, when the offset distance relative to the support center is 2mm, the first transmission device will reduce its extension distance by 2mm at the predetermined initial position to make the center of the semiconductor product coincide with the support center, thereby completing the position adjustment of the semiconductor product.

[0115] In one exemplary embodiment, before the first transmission device transmits the semiconductor product past the detection device, the semiconductor product processing method further includes:

[0116] The first positioning device initially detects the initial offset of the semiconductor product on the first transmission device;

[0117] If the initial offset exceeds the offset range specified by the first positioning device, the first transmission device transmits the semiconductor product through the detection device to the locking chamber, and adjusts the starting transmission position of the first transmission device.

[0118] If the initial offset does not exceed the offset range specified by the first positioning device, the first positioning device continues to transmit the semiconductor product.

[0119] The first positioning device will be described on the semiconductor processing equipment side, and will not be repeated here.

[0120] In an exemplary embodiment, after the semiconductor product is transported back to the locking chamber 20 for adjustment, the semiconductor product processing method further includes the following steps:

[0121] If the semiconductor product still exceeds the preset offset range after multiple adjustments in the locking chamber, the second transmission device in the loading chamber will transport the semiconductor product to the atmospheric environment.

[0122] In this step, the first positioning device 12 sends a signal to the first transmission device 11 to transport the semiconductor product back to the locking chamber 20 for adjustment, which is considered one adjustment. After multiple adjustments, if the first positioning device 12 still determines that the semiconductor product exceeds a preset offset range, the first transmission device 11 places the semiconductor product in the locking chamber 20. Then, the second transmission device 41 in the loading chamber 40 transports the semiconductor product to the atmospheric environment for adjustment. For example, the maximum number of times the semiconductor product is adjusted in the locking chamber 20 is two. In one example, the second transmission device 41 can transport the semiconductor product to the second positioning device 50, which is located in the atmospheric environment. For example, a worker can manually adjust the semiconductor product in the second positioning device 50.

[0123] In this embodiment, if the semiconductor product still exceeds the preset offset range after multiple adjustments in the locking chamber 20, the semiconductor product is transported to the atmospheric environment for manual adjustment. This avoids the first transmission device 11 from cyclically operating between the locking chamber 20 and the first positioning device 12, thereby increasing the effective working time of the semiconductor processing equipment.

[0124] In one exemplary embodiment, when the detection device acquires the offset parameters of the semiconductor product, the semiconductor product processing method further includes:

[0125] An intensity curve is generated based on the detected light intensity.

[0126] In this step, the receiving unit of the detection device 13 can acquire the intensity of the detection light and generate a corresponding intensity curve. For example... Figure 6 and Figure 7 As shown, Figure 6The intensity curve of wafer 611 when it is intact is shown. Figure 7 An intensity curve is shown when wafer 611 is damaged, where the horizontal axis represents the light-shielding area relative to the support center in the second direction ( Figure 2 The distance in the m direction shown in the figure, with the vertical axis representing the distance of the shading area relative to the support center in the third direction (m direction). Figure 2 The distance in the n-direction shown.

[0127] The integrity of the semiconductor product is determined based on the intensity curve and the preset curve.

[0128] In this step, the intensity curve and a preset curve can be fitted together in the same coordinate system. The integrity of the semiconductor product is determined based on the separation of the two curves. For example, if the intensity curve and the preset curve completely overlap, it indicates that the current wafer integrity is good. The determination can be made by computer fitting or by manual observation by staff.

[0129] In an exemplary embodiment, if the position of the semiconductor product on the first transmission device 11 in the processing chamber 10 does not exceed a preset offset range, the semiconductor product processing method further includes: the first positioning device performs offset compensation on the semiconductor product, and the first transmission device transports the semiconductor product to the process chamber.

[0130] In this embodiment, the principle of the first positioning device 12 obtaining the offset parameters of the semiconductor product has been explained on the device side above, and will not be repeated here.

[0131] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0132] In the description of this specification, references to the terms "embodiment," "exemplary embodiment," "some implementation," "illustrated implementation," "example," etc., refer to specific features, structures, materials, or characteristics described in connection with an implementation or example that are included in at least one implementation or example of this disclosure.

[0133] In this specification, the illustrative expressions of the terms used do not necessarily refer to the same implementation or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more implementations or examples.

[0134] In the description of this disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0135] It is understood that the terms "first," "second," etc., as used in this disclosure may be used to describe various structures, but these structures are not limited by these terms. These terms are only used to distinguish one structure from another.

[0136] In one or more accompanying drawings, the same elements are represented by similar reference numerals. For clarity, many parts in the drawings are not drawn to scale. Furthermore, certain well-known parts may not be shown. For simplicity, a structure obtained after several steps may be depicted in a single drawing. Many specific details of this disclosure, such as the structure, materials, dimensions, processing methods, and techniques of the devices, are described below to provide a clearer understanding of the disclosure. However, as those skilled in the art will understand, this disclosure may be implemented without adhering to these specific details.

[0137] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this disclosure.

Claims

1. A semiconductor processing apparatus, characterized in that, The semiconductor processing equipment includes a processing chamber, a locking chamber connected to the processing chamber, a first transmission device, and a detection device; The locking chamber is used to store semiconductor products at a fixed angle; The first transmission device is used to remove a semiconductor product from the locking chamber at a predetermined initial position and to transfer the semiconductor product to a predetermined position in the processing chamber along a predetermined route; The detection device is installed in the processing chamber and is used to acquire the offset parameters of the semiconductor product on the first transmission device; the detection device includes a transmitting part and a receiving part, the transmitting part and the receiving part are respectively fixed to the upper and lower walls of the processing chamber, and the transmitting part and the receiving part are aligned. The emitting unit is used to emit light sensing signals perpendicular to the upper and lower walls of the processing chamber; The receiving unit is used to receive and process the light sensing signal after it is blocked when the semiconductor product passes through the transmitting unit; The detection length of the light sensing signal in the third direction is greater than or equal to the diameter of the semiconductor product; The first transmission device is also used to adjust the starting transmission position according to the offset parameter.

2. The semiconductor processing equipment according to claim 1, characterized in that, The minimum distance between the detection device and the locking chamber is greater than or equal to the diameter of the semiconductor product.

3. The semiconductor processing equipment according to claim 1, characterized in that, The detection device has a detection center, which is the center of symmetry between the transmitting part and the receiving part; The projection of the detection center is located on the predetermined route of the first transmission device.

4. The semiconductor processing equipment according to claim 3, characterized in that, The offset parameters include: the offset angle and offset distance of the semiconductor center relative to the detection center; The starting transmission position includes: the deflection angle and offset distance of the first transmission device relative to the predetermined initial position.

5. The semiconductor processing equipment according to claim 1, characterized in that, The first transmission device includes a robotic arm and a robotic hand rotatably connected to the robotic arm. The robotic hand is used to carry the semiconductor product, and the robotic arm is used to control the extension and retraction distance of the robotic hand and move the semiconductor product along a predetermined route.

6. The semiconductor processing equipment according to claim 1, characterized in that, The detection device is also used to detect the shape of the semiconductor product.

7. The semiconductor processing equipment according to claim 1, characterized in that, The semiconductor processing equipment further includes a first positioning device, which is disposed in the processing chamber; The first positioning device is used to initially detect the initial offset of the semiconductor product on the first transmission device.

8. A method for processing a semiconductor product, characterized in that, The processing method for the semiconductor product includes: Provide semiconductor products for processing; The first transmission device transmits the semiconductor product through the detection device, and the detection device acquires the offset parameters of the semiconductor product. The first transmission device adjusts its starting transmission position according to the offset parameter; The detection device acquires the offset parameters of the semiconductor product, including: The first transmission device transmits the semiconductor product along a predetermined route, and the first transmission device can pass through the testing center of the testing device. Using the connection between the testing center and the predetermined route as a reference, the offset angle and offset distance of the semiconductor product on the first transmission device are determined based on the signal source location and signal strength received by the receiving unit of the testing device.

9. The method for processing a semiconductor product according to claim 8, characterized in that, Adjusting the starting transmission position of the first transmission device according to the offset parameter includes: Based on the offset angle of the offset parameter, the first transmission device deflects the offset angle according to the predetermined initial position of entering the locking chamber; Based on the offset distance of the offset parameter, the first transmission device extends or retracts the offset distance according to the predetermined initial position of entering the locking chamber.

10. The method for processing a semiconductor product according to claim 8, characterized in that, When obtaining the offset parameters of the semiconductor product, the processing method of the semiconductor product further includes: An intensity curve is generated based on the detected light intensity; The integrity of the semiconductor product is determined based on the intensity curve and the preset curve.

11. The method for processing a semiconductor product according to claim 8, characterized in that, Before the first transmission device transmits the semiconductor product through the detection device, the semiconductor product processing method further includes: The first positioning device initially detects the initial offset of the semiconductor product on the first transmission device; If the initial offset exceeds the offset range of the first positioning device, the first transmission device transmits the semiconductor product through the detection device to the locking chamber, and adjusts the starting transmission position of the first transmission device. If the initial offset does not exceed the offset range of the first positioning device, the first transmission device continues to transmit the semiconductor product.

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