Display panel and display device

Abstract

The application discloses an array substrate, a display panel and a display device, and relates to the technical field of display, the array substrate comprises a metal wire and a glass substrate, the metal wire is laid above the glass substrate, the metal wire comprises a binding metal wire, an edge of the array substrate is provided with a binding area, the binding metal wire is arranged in the binding area and is used for being connected with an anisotropic conductive adhesive, the array substrate further comprises a protective layer, the protective layer is laid above the binding metal wire, the protective layer is provided with a through hole corresponding to the position of the binding metal wire, and the anisotropic conductive adhesive is connected with the binding metal wire through the through hole. Through the above mode, in the case that the protection performance of the binding adhesive is reduced, the display panel display function abnormality caused by the corrosion of water vapor invasion to the binding metal wire can still be effectively prevented.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] As electronic products are rapidly developing towards being lighter, thinner, shorter, and smaller, the performance of display panels is receiving increasing attention. Typically, a display panel must be connected to a driver chip on its periphery for controlling the display signal.

[0003] The upper surface of the glass substrate in the display panel is usually provided with metal traces. The metal traces extend outward from the binding area of ​​the display panel to form terminals. The terminals are connected to flexible flat cables through conductive glue, and then electrically connected to external driver chips, printed circuit boards, etc.; in order to prevent the terminals from being affected by external moisture and causing corrosion, taffeta glue is usually applied for protection after binding; however, taffeta glue will affect its protective performance in a high-humidity, high-temperature and high-salt environment for a long time, which will result in moisture and ions entering the corroded terminals from the easily corroded areas, causing abnormal display function.

[0004] Therefore, how to effectively prevent water vapor from invading and corroding the terminals, thereby causing abnormal display function of the display panel, when the protective performance of the protective glue at the binding site is reduced, has become an urgent problem to be solved in this field. Summary of the Invention

[0005] The purpose of this application is to provide an array substrate, a display panel and a display device that can effectively prevent water vapor from invading and corroding the binding metal wires, thereby causing abnormal display function of the display panel, even when the protective performance of the protective glue at the binding point is reduced.

[0006] The present application discloses an array substrate, comprising metal traces and a glass substrate, wherein the metal traces are laid above the glass substrate, the metal traces include binding metal wires, a binding area is provided at the edge of the array substrate, the binding metal wires are arranged within the binding area and are used to be connected to anisotropic conductive adhesive, the array substrate also includes a protective layer, the protective layer is laid above the binding metal wires, the protective layer is provided with through holes at positions corresponding to the binding metal wires, and the anisotropic conductive adhesive is connected to the binding metal wires through the through holes.

[0007] Optionally, a groove is provided on the glass substrate corresponding to the position of each binding metal wire, and each binding metal wire falls into the groove. There are multiple protective layers, and the multiple protective layers respectively cover each groove and the binding metal wire.

[0008] Optionally, the cross section of the through hole in a direction perpendicular to the glass substrate is an inverted trapezoid, and the width of the through hole on a side close to the glass substrate is greater than half the width of the through hole on a side close to the anisotropic conductive adhesive.

[0009] Optionally, the protective layer is provided with a plurality of through holes corresponding to the position of each of the binding metal wires, and the plurality of through holes are arranged at intervals along the extension direction of the binding metal wires to form at least a first through hole row and a second through hole row; each through hole in the first through hole row is arranged between two adjacent through holes in the second through hole row.

[0010] Optionally, a sinking groove is provided at a position on the glass substrate corresponding to the protective layer, a plurality of the binding metal wires are spaced apart in the sinking groove, the protective layer covers the plurality of the binding metal wires, and the depth of the sinking groove is equal to the total thickness of the binding metal wires and the protective layer.

[0011] Optionally, a connection groove is provided on one side of the binding metal wire close to the protective layer and at a position corresponding to the through hole, and a depth of the connection groove is less than a thickness of the binding metal wire.

[0012] Optionally, the diameter of the through hole is smaller than half the width of the binding metal wire.

[0013] Optionally, the protective layer is made of at least one of low-temperature glass, corrosion-resistant polymer resin material or inorganic coating.

[0014] The present application also discloses a display panel, including an opposing substrate. The display device further includes the array substrate described above, and the opposing substrate and the array substrate are arranged in a box.

[0015] The present application also discloses a display device, comprising Taffeta glue, anisotropic conductive glue and a printed circuit board, wherein the binding area of ​​the printed circuit board is connected to the anisotropic conductive glue; the display device also includes the above-mentioned array substrate, the anisotropic conductive glue is connected between the protective layer and the printed circuit board and covers the through hole; the Taffeta glue is coated at the connection between the printed circuit board and the protective layer.

[0016] The present application lays a protective layer above the binding metal wire and opens a through hole in the protective layer. When a binding connection is required, the anisotropic conductive adhesive can flow into the through hole and connect with the binding metal wire under the protective layer, which does not affect the electrical performance and binding effect of the binding metal wire. At the same time, the binding metal wire is buried under the protective layer, so that the binding metal wire is not exposed to the outside of the glass substrate. Even if the protective glue used to prevent water vapor corrosion at the binding part of the array substrate is degraded in terms of protective performance, even if external water vapor passes through the protective glue, it cannot pass through the protective layer to reach the binding metal wire below it. Even if the protective performance of the protective glue at the binding part is degraded, the display function of the display panel can still be effectively prevented from being corroded by water vapor intrusion. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without inventive work. In the drawings:

[0018] Figure 1 This is a schematic diagram of a first embodiment of an array substrate of the present application;

[0019] Figure 2 This is a schematic diagram of a second embodiment of the array substrate of the present application;

[0020] Figure 3 This is a schematic diagram of a channel of a second embodiment of an array substrate of the present application;

[0021] Figure 4 This is a schematic diagram of a binding area of ​​a second embodiment of an array substrate of the present application;

[0022] Figure 5 This is a schematic diagram of a third embodiment of the array substrate of the present application;

[0023] Figure 6 This is a schematic diagram of a fourth embodiment of the array substrate of the present application;

[0024] Figure 7 This is a schematic diagram of a fifth embodiment of the array substrate of the present application;

[0025] Figure 8 This is a schematic diagram of a sixth embodiment of the array substrate of the present application;

[0026] Figure 9 This is a schematic diagram of a binding region of a sixth embodiment of an array substrate of the present application;

[0027] Figure 10 A schematic diagram of an embodiment of a display panel of the present application;

[0028] Figure 11 FIG. 1 is a schematic diagram of an embodiment of a display device of the present application.

[0029] Among them, 10, display device; 100, display panel; 110, array substrate; 111, protective layer; 112, through hole; 113, first through hole row; 114, second through hole row; 120, metal trace; 121, binding metal wire; 122, connecting groove; 130, glass substrate; 131, channel; 132, sinking groove; 140, color film substrate; 150, binding area; 160, frame glue; 200, anisotropic conductive glue; 400, printed circuit board; 500, Taffeta glue; 600, opposing substrate. DETAILED DESCRIPTION

[0030] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative. However, the present application can be implemented in many alternative forms and should not be construed as being limited to the embodiments described herein.

[0031] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate relative importance or implicitly specify the quantity of the technical features indicated. Therefore, unless otherwise specified, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features; "plurality" means two or more. The term "comprising" and any variations thereof are intended to be non-exclusive inclusion, and one or more other features, integers, steps, operations, units, components, and / or combinations thereof may be present or added.

[0032] In addition, terms indicating orientation or positional relationships such as “center,” “lateral,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inside,” and “outside” are described based on the orientation or relative positional relationships shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing the present application, and do not indicate that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present application.

[0033] Furthermore, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.

[0034] The present application is described in detail below with reference to the accompanying drawings and optional embodiments.

[0035] Figure 1 This is a schematic diagram of the first embodiment of the array substrate of the present application, as shown in FIG. Figure 1 As shown, the present application discloses an array substrate 110, including a metal trace 120 and a glass substrate 130, wherein the metal trace 120 is laid on the glass substrate 130, and the metal trace 120 includes a binding metal wire 121. A binding area 150 is provided at the edge of the array substrate 110, and the binding metal wire 121 is provided in the binding area 150 for connecting with an anisotropic conductive adhesive 200. The array substrate 110 also includes a protective layer 111, which is laid on the binding metal wire 121. The protective layer 111 is provided with a through hole 112 at a position corresponding to the binding metal wire 121, and the anisotropic conductive adhesive 200 is connected to the binding metal wire 121 through the through hole 112.

[0036] The present application lays a protective layer 111 above the binding metal wire 121 and opens a through hole 112 on the protective layer 111. When a binding connection is required, the anisotropic conductive adhesive 200 can flow into the through hole 112 and connect with the binding metal wire 121 below the protective layer 111. This does not affect the electrical performance and binding effect of the binding metal wire 121. The through hole 112 reduces the area where the anisotropic conductive adhesive 200 actually contacts and binds with the binding metal wire 121, making the anisotropic conductive adhesive 200 Although a large area is coated on the protective layer 111, it only contacts and forms a bond with the binding metal wire 121 at the through hole 112. The other parts of the anisotropic conductive adhesive 200 covering the protective layer 111 form a seal for the area around the through hole 112. In this way, the through hole 112 is protected without affecting the electrical performance and binding effect of the binding metal wire 121, preventing external moisture from invading the binding metal wire 121 through the through hole 112 and causing corrosion of the binding metal wire 121, resulting in display abnormalities.

[0037] At the same time, the binding metal wire 121 is buried under the protective layer 111, so that the binding metal wire 121 is not exposed to the outside of the glass substrate 130. Even if the protective glue used to prevent water vapor corrosion at the binding point of the array substrate 110 is degraded in terms of protective performance, even if external water vapor passes through the protective glue, it cannot pass through the protective layer 111 to reach the binding metal wire 121 located thereunder. Therefore, even if the protective performance of the protective glue at the binding point is degraded, it can still effectively prevent water vapor from invading and corroding the binding metal wire 121, thereby causing abnormal display function of the display panel 100.

[0038] Specifically, the protective layer 111 is made of at least one of low-temperature glass, a corrosion-resistant polymer resin material, or an inorganic coating. The present embodiment does not impose any specific restrictions on the material of the protective layer 111, and only uses the protective layer 111 as an example for illustration. When the protective layer 111 is low-temperature glass, low-temperature glass powder can be used to make the low-temperature glass. Its components include SiO2, P2O5, B2O3, Li2O, ZnO, BaO, K2O, Na2O, etc. The low-temperature glass powder is melted into a glass body, and then washed, dried, coarsely ground, and finely ground to finally form the low-temperature glass. The low-temperature glass can effectively protect the bonding metal wires 121 and reduce the risk of failure of components such as thin-film transistors of the array substrate 110 due to high temperatures during the high-temperature glass manufacturing process.

[0039] In addition, the through hole 112 in the present application may be a circular hole or a square hole, or a through hole 112 of other shapes. The present application only uses the through hole 112 as an example to illustrate the circular hole.

[0040] In order to enable the anisotropic conductive adhesive 200 to better connect with the binding metal wire 121 through the through hole 112 and improve the binding performance, the present application also designs the size of the through hole 112: the diameter of the through hole 112 is less than half the width of the binding metal wire 121.

[0041] When the diameter of the through-hole 112 is less than half the width of the binding metal wire 121, the area of ​​the binding metal wire 121 exposed through the through-hole 112 is significantly smaller than the width of the binding metal wire 121, thereby reducing the risk of large-scale corrosion of the binding metal wire 121 by external moisture from the through-hole 112. At the same time, the partial exposure of the binding metal wire 121 through the through-hole 112 allows the anisotropic conductive adhesive 200 to contact the binding metal wire 121 through the through-hole 112, thereby achieving a binding effect. The other portion of the anisotropic conductive adhesive 200 not covered at the through-hole 112 can cover the top of the protective layer 111, making it easier to seal the area around the through-hole 112. The anisotropic conductive adhesive 200 can also easily block the through-hole 112, preventing external moisture from entering the through-hole 112 through the gap between the anisotropic conductive adhesive 200 and the protective layer 111, thereby causing corrosion to the binding metal wire 121.

[0042] Figure 2 This is a schematic diagram of a second embodiment of the array substrate of the present application. Figure 3 This is a schematic diagram of the channel of the second embodiment of the array substrate of the present application. Figure 4 Schematic diagram of the binding area of ​​the second embodiment of the array substrate of the present application; Figures 2 to 4 As shown, the glass substrate 130 is provided with a trench 131 corresponding to each bonding metal wire 121 , and each bonding metal wire 121 falls into the trench 131 . There are multiple protective layers 111 , and the multiple protective layers 111 cover each trench 131 and the bonding metal wire 121 respectively.

[0043] This embodiment and Figure 1The difference between the embodiment shown is that in this embodiment, a groove 131 is provided on the glass substrate 130 at a position corresponding to each binding metal wire 121. After the grooves 131 are formed on the glass substrate 130, each binding metal wire 121 is laid into the groove 131, so that the plurality of binding metal wires 121 are embedded in the groove 131. Then, a plurality of protective layers 111 are respectively covered on top of each binding metal wire 121, and the groove 131 is filled. The protective layer 111 is used to bury the binding metal wire 121 in the groove 131, so that the binding metal wire 121 is not exposed on the outer surface of the glass substrate 130, and the binding metal wire 121 is not easily exposed to the outer surface. Therefore, even if the protective glue at the binding portion of the array substrate 110 used to prevent water vapor erosion has reduced protection performance, even if external water vapor passes through the protective glue, it cannot pass through the protective layer 111 to reach the binding metal wires 121 located thereunder. Therefore, even if the protection performance of the protective glue at the binding portion is reduced, it can still effectively prevent water vapor from invading and corroding the binding metal wires 121, thereby causing abnormal display function of the display panel 100. Furthermore, since the binding metal wires 121 are not exposed on the surface of the glass substrate 130, the surface flatness of the glass substrate 130 can be effectively improved, which is more conducive to the uniform coating of the anisotropic conductive adhesive 200, and further improves the binding effect.

[0044] To form the channel 131 in the binding area 150 on the glass substrate 130, laser direct vaporization etching can be used, or chemical etching can be used: first, a protective layer is applied to the area where the channel 131 needs to be etched to form the channel 131. The protective layer can be formed by paraffin, a polymer film, etc.; then, a laser is used to remove the protective layer in the area where the channel 131 needs to be etched, and a glass etching solution (such as hydrofluoric acid or a strong alkali such as sodium hydroxide) is used to etch out the channel 131; then, the glass substrate 130 is cleaned and dried, so that the required channel 131 can be formed.

[0045] After the trench 131 is formed, the metal trace 120 is made. The thin film deposition-exposure-development-etching process is used to make the metal trace 120 layer. The binding metal wire 121 in the metal trace 120 is laid into the trench 131. Then, low-temperature glass powder (powder diameter 1 to 15 μm) with a melting point of 290 to 900°C is applied to fill the trench 131 and overflow. The glass powder is melted in a furnace (or heated by laser irradiation) and combined with the glass substrate 130 to form a whole. Finally, the binding area 150 is ground into a plane, forming a binding trace buried under the low-temperature glass layer and formed by low-temperature lithography. The glass layer provides protection. Even if the function of the protective glue applied on the binding area 150 of the array substrate 110 decreases and external moisture passes through the protective glue, it cannot directly contact the binding metal wire 121 through the protective layer 111, thereby effectively preventing the binding metal wire 121 from being corroded by external moisture and ultimately causing damage to the display screen. At the same time, the binding metal wire 121 is prevented from being higher than the glass substrate 130, resulting in poor flatness of the binding area 150 of the array substrate 110 and uneven binding of the anisotropic conductive glue 200, thereby further improving the binding effect of the array substrate 110.

[0046] Figure 5 This is a schematic diagram of the third embodiment of the array substrate of the present application, as shown in FIG. Figure 5 As shown, Figure 3 The embodiment shown is based on Figure 2 The improvement is that the cross section of the through hole 112 in the direction perpendicular to the glass substrate 130 is an inverted trapezoid, and the width of the through hole 112 close to the glass substrate 130 is greater than half of the width of the through hole 112 close to the anisotropic conductive adhesive 200.

[0047] This embodiment and Figure 1 The difference from the illustrated embodiment is that this embodiment improves the structure of the through hole 112 by enlarging the opening of the through hole 112 facing the anisotropic conductive adhesive 200 and reducing the opening of the through hole 112 facing the glass substrate 130, thereby forming a structure with an inverted trapezoidal cross section.

[0048] When binding the binding metal wire 121 through the anisotropic conductive adhesive 200, it is necessary to apply pressure to the anisotropic conductive adhesive 200 at the through hole 112 so that the particles in the anisotropic conductive adhesive 200 break up and down, thereby achieving electrical conduction up and down (left and right electrical shielding), and thus achieving external electrical connection of the binding metal wire 121 in the array substrate 110.

[0049] When the anisotropic conductive adhesive 200 contacts the through-hole 112 with the downwardly inclined sidewall formed due to the inverted trapezoidal structure, it will be guided by the sidewall of the through-hole 112 to more easily form contact with the binding metal wire 121 downward. At the same time, when the anisotropic conductive adhesive 200 is filled in the inverted trapezoidal through-hole 112, it forms an "anchor" effect with the sidewall of the through-hole 112 in the through-hole 112, making it difficult for the anisotropic conductive adhesive 200 to separate from the through-hole 112, thereby preventing it from falling off from the binding metal wire 121, further improving the binding effect. At the same time, the anisotropic conductive adhesive 200 can form a good adhesion with the sidewall of the through-hole 112 in the through-hole 112, forming a seal in the through-hole 112, preventing external moisture from entering the binding metal wire 121 through the gap between the anisotropic conductive adhesive 200 and the through-hole 112, causing corrosion to the binding metal wire 121, and causing abnormal function of the array substrate 110.

[0050] In order to further improve the stability of the anisotropic conductive adhesive 200 being bonded to the bonding metal wire 121 through the through-holes 112 , the present application has made improvements to the arrangement of the through-holes 112 , as follows:

[0051] Figure 6 This is a schematic diagram of a fourth embodiment of the array substrate of the present application, as shown in FIG. Figure 6 As shown, the protective layer 111 is provided with a plurality of through holes 112 corresponding to the position of each binding metal wire 121, and the plurality of through holes 112 are arranged at intervals along the extension direction of the binding metal wire 121 to form at least a first through hole row 113 and a second through hole row 114; each through hole 112 in the first through hole row 113 is arranged between two adjacent through holes 112 in the second through hole row 114.

[0052] In this embodiment, laser or chemical etching can be used to drill a plurality of through holes 112 on the low-temperature glass layer in the bonding area 150 of the array substrate 110, and at least two rows of through holes 112 are formed above the same bonding metal wire 121, namely a first through hole row 113 and a second through hole row 114. The first through hole row 113 and the second through hole row 114 expose a larger area of ​​the bonding metal wire 121 and form a plurality of contact portions with the anisotropic conductive adhesive 200. When the anisotropic conductive adhesive 200 is covered on the protective layer 111, it will contact the bonding metal wire 121 through the plurality of through holes 112. The connection area is increased. Even if the connection at a certain through-hole 112 fails, the other through-holes 112 can maintain a normal connection between the anisotropic conductive adhesive 200 and the binding metal wire 121, further enhancing the stability of the binding. At the same time, each through-hole 112 in the first through-hole row 113 corresponds to a through-hole 112 in the second through-hole row 114, forming a staggered arrangement of multiple through-holes 112. This prevents a through-hole 112 from breaking through or corroding through the binding metal wire 121 due to process errors during manufacturing, resulting in failure of the entire connection of the binding metal wire 121. Furthermore, when applying the anisotropic conductive adhesive 200, it can be applied in spots or across the entire length (since the gaps between the binding metal wires 121 are very small, a full coating is generally used). Multiple through-holes 112 are arranged at intervals above the binding metal wire 121 to minimize the possibility of metal wire corrosion and disconnection at a single through-hole 112.

[0053] Figure 7 This is a schematic diagram of a fifth embodiment of the array substrate of the present application, as shown in FIG. Figure 7 As shown, Figure 7 The embodiment shown is based on Figure 2 In the improvement, a connection groove 122 is provided on one side of the binding metal wire 121 close to the protective layer 111 and corresponding to the position of the through hole 112 , and the depth of the connection groove 122 is less than the thickness of the binding metal wire 121 .

[0054] In this embodiment, a connection groove 122 is formed at the position of the binding metal wire 121 corresponding to the through hole 112. The depth of the connection groove 122 needs to be less than the thickness of the binding metal wire 121 to prevent the binding metal wire 121 from being penetrated and damaged. When the protective layer 111 covers the binding metal wire 121, the through hole 112 of the protective layer 111 overlaps with the connection groove 122 of the binding metal wire 121.

[0055] When the anisotropic conductive adhesive 200 is coated on the protective layer 111, it first contacts the bonding metal wire 121 through the via hole 112, and then fills into the connecting groove 122 along the via hole 112. At this time, the anisotropic conductive adhesive 200 forms a connection and fixation with the via hole 112 and the connecting groove 122 at the same time. After the anisotropic conductive adhesive 200 fills in the connecting groove 122, it forms adhesion through the side wall of the connecting groove 122, so that the anisotropic conductive adhesive 200 is not easy to separate from the connecting groove 122, thereby preventing the anisotropic conductive adhesive 200 from falling off from the bonding metal wire 121.

[0056] Figure 8 FIG. 6 is a schematic view of the array substrate according to the sixth embodiment of the present application, Figure 9 FIG. 7 is a schematic view of the bonding area of the array substrate according to the sixth embodiment of the present application, as Figure 8 and Figure 9 shown, Figure 8 The embodiment shown is improved based on Figure 2 The glass substrate 130 is provided with a sunken groove 132 at the position corresponding to the protective layer 111. A plurality of bonding metal wires 121 are arranged in the sunken groove 132. The protective layer 111 covers the plurality of bonding metal wires 121. The depth of the sunken groove 132 is equal to the total thickness of the bonding metal wire 121 and the protective layer 111.

[0057] The difference between the embodiment and the embodiment shown in Figure 2 is that, in the bonding area 150 of the array substrate 110, the sunken groove 132 formed on the glass substrate 130 is not a channel 131, but a sunken groove 132. A plurality of bonding metal wires 121 are laid in the sunken groove 132. Then, the entire sunken groove 132 is covered by the protective layer 111 above the plurality of bonding metal wires 121, and the bonding metal wires 121 are buried under the protective layer 111. The via hole 112 is provided on the protective layer 111 corresponding to the position of each bonding metal wire 121 to facilitate the anisotropic conductive adhesive 200 to connect the bonding metal wire 121 through the via hole 112.

[0058] This design makes the bonding metal wire 121 not exposed outside the glass substrate 130. Even if the protective glue used to prevent water vapor erosion at the bonding area of the array substrate 110 has reduced protection performance, the water vapor from the outside can also not pass through the protective layer 111 to reach the bonding metal wire 121 located below it. In the case of reduced protection performance of the protective glue at the bonding area, water vapor can still effectively prevent corrosion of the bonding metal wire 121, thereby preventing the display panel 100 from displaying abnormally.

[0059] Among them, the depth of the sinking groove 132 is equal to the total thickness of the binding metal wire 121 and the protective layer 111, so that after the protective layer 111 is filled into the sinking groove 132 to cover the binding metal wire 121, its upper surface is on the same horizontal plane as the upper surface of the glass substrate 130, which can effectively improve the surface flatness of the glass substrate 130, is more conducive to the uniform coating of the anisotropic conductive adhesive 200, and further enhances the binding effect.

[0060] Figure 10 This is a schematic diagram of an embodiment of the display panel of the present application. Figure 10 As shown, the present application further discloses a display panel 100, including an opposing substrate 600 and a sealant 160. The display panel 100 also includes the above-mentioned array substrate 110. The opposing substrate 600 and the array substrate 110 are arranged in a box. The sealant 160 is sealed between the opposing substrate 600 and the array substrate 110. The protective layer 111 is located below the sealant 160, and the orthographic projection of the protective layer 111 on the glass substrate 130 partially overlaps with the orthographic projection of the sealant 160 on the glass substrate 130.

[0061] In the present application, when the display panel 100 is a liquid crystal display panel 100, the opposing substrate 600 is a color film substrate 140; when the display panel 100 is an OLED display panel 100, the opposing substrate 600 is a glass substrate 130; the present application does not limit the specific type of the display panel 100, and only takes the display panel 100 as a liquid crystal display panel 100 as an example.

[0062] In order to prevent the display function of the display panel 100 from being abnormal due to corrosion of the bonding metal wires 121 by external moisture intrusion when the protective glue of the outer periphery of the bonding area 150 of the display panel 100 is degraded, the present application improves the array substrate 110 in the display panel 100 as follows:

[0063] In the present application, a protective layer 111 is laid over the binding metal wires 121 of the array substrate 110, and a through hole 112 is formed in the protective layer 111. When a binding connection is required, the anisotropic conductive adhesive 200 can flow into the through hole 112 and connect with the binding metal wires 121 below the protective layer 111, thereby not affecting the electrical performance and binding effect of the binding metal wires 121. At the same time, the binding metal wires 121 are buried under the protective layer 111, so that the binding metal wires 121 are not exposed to the outside of the glass substrate 130. Even if the protective adhesive used to prevent water vapor corrosion at the binding portion of the array substrate 110 is degraded in terms of its protective performance, external water vapor cannot pass through the protective adhesive but through the protective layer 111 to reach the binding metal wires 121 below it. Therefore, even if the protective performance of the protective adhesive at the binding portion is degraded, the display panel 100 can still be effectively prevented from being corroded by water vapor intrusion and causing abnormal display function of the display panel 100.

[0064] In addition, the protective layer 111 in the present application can be located below the frame glue 160, and the orthographic projection of the protective layer 111 on the glass substrate 130 partially overlaps with the orthographic projection of the frame glue 160 on the glass substrate 130, that is, a portion of the protective layer 111 is covered by the frame glue 160. In this way, the dual protection of the frame glue 160 and the protective layer 111 can prevent external water vapor from entering the display panel 100 from the position of the frame glue 160 and causing corrosion to the metal wiring 120 inside the display panel 100, effectively preventing water vapor from invading and corroding the binding metal wire 121, thereby causing abnormal display function of the display panel 100.

[0065] Figure 11 This is a schematic diagram of an embodiment of the display device of the present application, as shown in FIG. Figure 1 As shown, the present application also discloses a display device 10, including Taffeta glue 500, anisotropic conductive adhesive 200, and a printed circuit board 400, wherein the binding side of the printed circuit board 400 is connected to the anisotropic conductive adhesive 200; the display device 10 also includes the above-mentioned display panel 100, the anisotropic conductive adhesive 200 is connected between the protective layer 111 and the printed circuit board 400, and covers the through hole 112; the Taffeta glue 500 is coated on the connection between the printed circuit board 400 and the protective layer 111.

[0066] The display device 10 is mainly displayed by the display panel 100, and the upper surface of the glass substrate 130 in the display panel 100 is usually provided with a metal trace 120, and the metal trace 120 is connected to the printed circuit board 400 through an anisotropic conductive adhesive 200; and after binding, Taffeta glue 500 is coated as an external protective adhesive for protection; However, Taffeta glue 500 will affect its protective performance in a high-humidity, high-temperature and high-salt environment for a long time, resulting in water vapor and ions still entering from the easily corroded area to corrode the binding metal wire 121, causing abnormal display function.

[0067] In order to solve the above problem, the present application improves the display panel 100 in the display device 10. By laying a protective layer 111 above the binding metal wires 121 of the array substrate 110 of the display panel 100, and opening through holes 112 on the protective layer 111, an anisotropic conductive adhesive 200 can flow into the through holes 112 and connect with the binding metal wires 121 below the protective layer 111. This does not affect the electrical performance and binding effect of the binding metal wires 121. At the same time, the binding metal wires 121 are buried under the protective layer 111. , so that the binding metal wires 121 are not exposed to the outside of the glass substrate 130. Even if the protective glue used to prevent water vapor corrosion at the binding position of the array substrate 110 has reduced protection performance, even if external water vapor passes through the protective glue, it cannot pass through the protective layer 111 to reach the binding metal wires 121 located thereunder. Even if the protection performance of the protective glue at the binding position is reduced, it can still effectively prevent water vapor from invading and corroding the binding metal wires 121, thereby causing abnormal display function of the display panel 100, thereby further improving the quality of the display device 10.

[0068] It should be noted that the inventive concept of this application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the various embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the various embodiments or technical features are combined, the original technical effects will be enhanced.

[0069] The above content is a further detailed description of the present application in conjunction with specific optional implementation methods, and the specific implementation of the present application cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, and all of them should be considered to fall within the scope of protection of the present application.

Claims

1. An array substrate, comprising a metal trace and a glass substrate, wherein the metal trace is laid on the glass substrate, the metal trace includes a binding metal wire, an edge of the array substrate is provided with a binding area, and the binding metal wire is provided in the binding area for connecting with an anisotropic conductive adhesive, characterized in that: The array substrate further includes a protective layer, the protective layer being laid above the binding metal wires, the protective layer being provided with through holes at positions corresponding to the binding metal wires, and the anisotropic conductive adhesive being connected to the binding metal wires through the through holes; The glass substrate is provided with a trench corresponding to the position of each binding metal wire, and each binding metal wire falls into the trench. There are multiple protective layers, and the multiple protective layers respectively cover each trench and the binding metal wire.

2. The array substrate according to claim 1, wherein: The cross section of the through hole in a direction perpendicular to the glass substrate is an inverted trapezoid, and the width of the through hole on a side close to the glass substrate is greater than half of the width of the through hole on a side close to the anisotropic conductive adhesive.

3. The array substrate according to claim 1, wherein: The protective layer is provided with a plurality of through holes corresponding to the position of each binding metal wire, and the plurality of through holes are arranged at intervals along the extension direction of the binding metal wire to form at least a first through hole row and a second through hole row; each through hole in the first through hole row is arranged between two adjacent through holes in the second through hole row.

4. The array substrate according to claim 1, wherein: A sinking groove is provided at a position of the glass substrate corresponding to the protective layer, a plurality of the binding metal wires are spaced apart in the sinking groove, the protective layer covers the plurality of the binding metal wires, and the depth of the sinking groove is equal to the total thickness of the binding metal wires and the protective layer.

5. The array substrate according to claim 1, wherein: A connection groove is provided on one side of the binding metal wire close to the protective layer and at a position corresponding to the through hole, and the depth of the connection groove is less than the thickness of the binding metal wire.

6. The array substrate according to claim 1, wherein: The diameter of the through hole is smaller than half of the width of the bonding metal wire.

7. The array substrate according to claim 1, wherein: The protective layer is made of at least one of low-temperature glass, corrosion-resistant polymer resin material or inorganic coating.

8. A display panel comprising an opposing substrate and a sealant, characterized in that: The display panel also includes the array substrate as described in claims 1 to 7, the opposing substrate and the array substrate are arranged in a box, the frame glue is sealed between the opposing substrate and the array substrate, the protective layer is located below the frame glue, and the orthographic projection of the protective layer on the glass substrate partially overlaps with the orthographic projection of the frame glue on the glass substrate.

9. A display device comprising Taffeta glue, anisotropic conductive adhesive, and a printed circuit board, wherein a binding area of ​​the printed circuit board is connected to the anisotropic conductive adhesive, characterized in that: The display device further includes a display panel as claimed in claim 8 , wherein the anisotropic conductive adhesive is connected between the protective layer and the printed circuit board and covers the through hole; and the Taffeta adhesive is coated at the connection between the printed circuit board and the protective layer.

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