A flat panel detector with temperature control function and a temperature control method thereof

Abstract

This invention discloses a flat panel detector with temperature control function and its temperature control method. The flat panel detector includes an image sensor panel, a thermally conductive structural frame, a working circuit, a heat generation or exchange unit, and a PID temperature control module, which is responsible for array imaging. The thermally conductive structural frame supports the image sensor panel and also serves as a heat-conducting medium for heat exchange. The working circuit includes a temperature detection circuit, a power supply circuit, a main control circuit, and an image acquisition timing control circuit. The heat generation or exchange unit is used for heating or cooling and directly acts on the thermally conductive structural frame. The PID temperature control module calculates and adjusts the operating parameters of the heat generation or exchange unit and drives the heat generation or exchange unit to heat or dissipate heat, so that the panel reaches and stabilizes at the target temperature. The flat panel detector with temperature control function and its temperature control method provided by this invention can quickly complete the temperature control of the detector, reducing the waiting time for product startup.

Description

Technical Field

[0001] This invention relates to the field of medical imaging equipment, and more particularly to a flat panel detector with temperature control function and its temperature control method. Background Technology

[0002] Because pixel grayscale and noise levels are significantly affected by ambient temperature and often cannot be ignored, flat panel detectors in actual clinical use generally require a waiting period of about one hour after power-on, until the internal temperature of the detector stabilizes, before use. This is to ensure sufficient image performance to always meet diagnostic requirements. Furthermore, for flat panel detectors without internal temperature control, in addition to the longer stabilization time, the excessively high internal temperature caused by the full-power circuitry can also lead to increased image noise and performance degradation. Moreover, due to the influence of external ambient temperature, the large temperature fluctuations within the system pose challenges to equipment calibration and image processing algorithms, making it difficult to guarantee image performance.

[0003] For example, in patent application CN1752881A, the flat panel detector directly uses temperature feedback control to adjust the temperature of the detector through a heat conduction device. The heating method is relatively simple, and the heating process takes a long time. Another example is patent application CN203970408U, which uses an external temperature control module to regulate the temperature of its internal components. While this saves internal space, it results in poor overall integration, cumbersome installation, and limited placement. Furthermore, its heat exchange circuit is simple and does not differentiate between the heating conditions of different areas of the circuit board inside the detector, easily leading to uneven heating and affecting imaging performance.

[0004] Stabilizing the flat panel detector under one or more temperature conditions can bring significant benefits to system design. Operating the system at maximum power for extended periods poses a risk of overheating in certain environments, leading to the generation of bad pixels in the image and increased random noise. Conversely, continuous operation in low-power mode results in significant temperature fluctuations during sustained use, degrading system calibration effectiveness and increasing dark noise. Summary of the Invention

[0005] To address the problems of existing technologies, this invention provides a flat panel detector with temperature control function and its temperature control method, the technical solution of which is as follows:

[0006] On one hand, the present invention provides a flat panel detector with temperature control function, including...

[0007] An image sensor panel, wherein the image sensor panel is a photosensitive component used for array imaging responsible for photoelectric conversion;

[0008] A thermally conductive structural frame is provided to support the image sensor panel and also serves as a thermally conductive medium for heat exchange of the image sensor panel.

[0009] A heat generation or exchange unit, which is used for heating or cooling of the system, and the heat generation or exchange unit directly acts on the heat-conducting structural frame;

[0010] The working circuit includes a temperature detection circuit, a power supply circuit, a main control circuit, and an image acquisition timing control circuit. The temperature detection circuit includes multiple temperature sensors distributed at multiple locations on the flat panel detector to detect the temperature at multiple points, including the current ambient temperature, the temperature of the image sensor panel, the temperature of the thermally conductive frame, and the temperature of the working circuit.

[0011] The PID temperature control module calculates and adjusts the operating parameters of the heat generation or exchange unit based on the preset target temperature and the actual temperature detected by the temperature detection circuit, and drives the heat generation or exchange unit to heat or dissipate heat, so that the image sensor panel reaches and stabilizes at the target temperature.

[0012] Furthermore, the heat generation or exchange unit is heated by electric auxiliary heating and / or a semiconductor heat pump; the heat generation or exchange unit is cooled by one or more of the following methods: natural cooling, air cooling, water cooling, and electric cooling.

[0013] Furthermore, the flat panel detector also includes a temperature control strategy execution module, which can use one or more temperature control strategies to heat or dissipate heat from the image sensor panel. The PID temperature control module calculates and adjusts the parameters of the temperature control strategy execution module based on the target temperature and the actual temperature detected by the temperature detection circuit, and drives the temperature control strategy execution module to heat or dissipate heat from the image sensor panel.

[0014] Furthermore, the temperature control strategy execution module includes a power adjustment unit, which is used to adjust the heating power / heat dissipation power of the heat generation or exchange unit under the drive of the PID temperature control module.

[0015] If the actual temperature is higher than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the power adjustment unit to increase the heat dissipation power and / or decrease the heating power; if the actual temperature is lower than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the power adjustment unit to decrease the heat dissipation power and / or increase the heating power.

[0016] Furthermore, the temperature control strategy execution module includes a first power unit, a second power unit, and a duty cycle adjustment unit. The power consumption of the first power unit is higher than that of the second power unit. The duty cycle adjustment unit is used to adjust the duty cycle of the first power unit and the second power unit under the drive of the PID temperature control module.

[0017] If the actual temperature is higher than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the duty cycle adjustment unit to lower the duty cycle of the first power unit; if the actual temperature is lower than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the duty cycle adjustment unit to increase the duty cycle of the first power unit.

[0018] Furthermore, the temperature control strategy execution module includes a power consumption switching control unit and multiple circuit modules disposed on the circuit board inside the flat panel detector. Each circuit module has different thermal capacities and supports power consumption switching. The power consumption switching control unit is used to control some or all of the circuit modules to switch power consumption under the drive of the PID temperature control module to enumerate all thermal capacity combinations.

[0019] If the actual temperature is higher than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the power consumption switching control unit to switch the heat capacity combination to reduce the heat capacity value; if the actual temperature is lower than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the power consumption switching control unit to switch the heat capacity combination to increase the heat capacity value.

[0020] Furthermore, the temperature control strategy execution module includes a free combination of the following three temperature control strategy execution modules:

[0021] The first temperature control strategy execution module includes a power adjustment unit, which is used to adjust the heating power / heat dissipation power of the heat generation or exchange unit under the drive of the PID temperature control module.

[0022] The second temperature control strategy execution module includes a first power unit, a second power unit, and a duty cycle adjustment unit. The power consumption of the first power unit is higher than that of the second power unit. The duty cycle adjustment unit is used to adjust the duty cycle of the first power unit and the second power unit under the drive of the PID temperature control module.

[0023] The third temperature control strategy execution module includes a power consumption switching control unit and multiple circuit modules disposed on the circuit board inside the flat panel detector. Each circuit module has a different thermal capacity and supports power consumption switching. The power consumption switching control unit is used to control some or all of the circuit modules to switch power consumption under the drive of the PID temperature control module to enumerate all thermal capacity combinations.

[0024] On the other hand, the present invention provides a temperature control method for a flat panel detector, comprising the following steps:

[0025] S1. Collect the ambient temperature and determine the setting method for the target temperature of the flat panel detector, so as to obtain the target temperature according to the ambient temperature and the setting method;

[0026] S2. Input the obtained target temperature into the PID temperature control module. The PID temperature control module uses the PID algorithm to drive the temperature control strategy execution module to heat or dissipate heat from the flat panel detector.

[0027] S3. Detect the current actual temperature of the flat panel detector and feed the actual temperature information back to the PID temperature control module;

[0028] S4. Determine whether the difference between the target temperature and the actual temperature is within the preset range. If so, the temperature control strategy execution module maintains the current heating or cooling power consumption parameters to heat or cool the flat panel detector and repeats S3-S4. Otherwise, execute S5.

[0029] S5. Based on the difference between the target temperature and the actual temperature, the PID temperature control module uses the PID algorithm to adjust the power consumption parameters of the temperature control strategy execution module so that the flat panel detector reaches and stabilizes at the target temperature, and repeats S3-S4.

[0030] Furthermore, in step S1, the target temperature is equal to the ambient temperature, or the target temperature is equal to the ambient temperature plus a positive offset, or the target temperature is equal to a certain fixed value, or the target temperature and the ambient temperature have a pre-established basic functional relationship.

[0031] Furthermore, the PID temperature control module can drive the temperature control strategy execution module to use one or more of the following temperature control strategies to heat or dissipate heat from the flat panel detector:

[0032] In the first temperature control strategy, the temperature control strategy execution module includes a power adjustment unit. The power adjustment unit is used to adjust the heating power / heat dissipation power of the heat generation or exchange unit under the drive of the PID temperature control module. If the actual temperature is higher than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the power adjustment unit to increase the heat dissipation power and / or decrease the heating power. If the actual temperature is lower than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the power adjustment unit to decrease the heat dissipation power and / or increase the heating power.

[0033] In the second temperature control strategy, the temperature control strategy execution module includes a first power unit, a second power unit, and a duty cycle adjustment unit. The power consumption of the first power unit is higher than that of the second power unit. The duty cycle adjustment unit is used to adjust the duty cycle of the first power unit and the second power unit under the drive of the PID temperature control module. If the actual temperature is higher than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the duty cycle adjustment unit to lower the duty cycle of the first power unit. If the actual temperature is lower than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the duty cycle adjustment unit to increase the duty cycle of the first power unit.

[0034] In the third temperature control strategy, the temperature control strategy execution module includes a power consumption switching control unit and multiple circuit modules disposed on the circuit board inside the flat panel detector. Each circuit module has a different thermal capacity and supports power consumption switching. The power consumption switching control unit is used to control some or all of the circuit modules to switch power consumption under the drive of the PID temperature control module to enumerate all thermal capacity combinations. If the actual temperature is higher than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the power consumption switching control unit to switch the thermal capacity combination to reduce the thermal capacity value. If the actual temperature is lower than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the power consumption switching control unit to switch the thermal capacity combination to increase the thermal capacity value.

[0035] The beneficial effects of the technical solution provided by this invention are as follows:

[0036] a. It can accurately and quickly bring the flat panel detector to the target temperature and maintain stability;

[0037] b. It can reduce the waiting time for product startup and improve product usability;

[0038] c. Facilitates obtaining optimal image performance at room temperature;

[0039] d. Rationally allocate the internal heat exchange of the flat panel detector. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is a schematic diagram of a flat panel detector with temperature control function provided in an embodiment of the present invention;

[0042] Figure 2 This is a schematic diagram of the control framework for a flat panel detector with temperature control function provided in an embodiment of the present invention;

[0043] Figure 3 This is a schematic diagram of the thermal capacity combination of a flat panel detector circuit module with temperature control function provided in an embodiment of the present invention.

[0044] The reference numerals in the attached figures are as follows: 1-Image sensor panel, 2-Heat-conducting structural frame, 3-Heat generation or exchange unit, 4-Working circuit, 5-Temperature detection point. Detailed Implementation

[0045] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0046] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, apparatus, product, or device that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0047] In one embodiment of the present invention, a flat panel detector with temperature control function is provided, see [link to relevant documentation]. Figure 1 The system includes an image sensor panel 1, a thermally conductive structural frame 2, a working circuit 4, a heat generation or exchange unit 3, and a PID temperature control module. The image sensor panel 1 is a photosensitive component used for array imaging involving photoelectric conversion. The thermally conductive structural frame 2 supports the image sensor panel 1; it is a metal frame and also serves as a heat-conducting medium for heat exchange. The working circuit includes a temperature detection circuit, a power supply circuit, a main control circuit, and an image acquisition timing control circuit. The working circuit is also a heat generation unit and is mounted on a circuit board within one or more of the flat panel detectors. The temperature detection circuit contains multiple temperature sensors distributed according to a certain rule within the detector. The temperature detection circuit at various locations of the device can detect the temperature at one or more of the following points: ambient temperature, image sensor panel 1 temperature, thermally conductive frame 2 temperature, and working circuit temperature. The heat generation or exchange unit 3 is used for heating or cooling. The heat generation or exchange unit 3 can act directly on the thermally conductive frame 2, or the thermally conductive frame 2 can be used directly as a heat exchange medium. The PID temperature control module calculates and adjusts the operating parameters of the heat generation or exchange unit 3 according to the preset target temperature and the actual temperature detected by the temperature detection circuit, and drives the heat generation or exchange unit 3 to heat or dissipate heat, so that the image sensor panel 1 reaches and stabilizes at the target temperature.

[0048] Specifically, see Figure 1The image sensor panel 1 is in contact with the upper surface of the thermally conductive frame 2. The circuit board is located below the thermally conductive frame 2 and inside the housing of the flat panel detector. The flat panel detector contains multiple circuit modules with different heat capacities. These circuit modules can be mounted on a single circuit board or distributed across multiple circuit boards. The temperature detection circuit distributes multiple temperature measurement units at different temperature detection points 5 to detect the ambient temperature, image sensor panel temperature, thermally conductive frame temperature, and internal circuit temperature at one or more points, and outputs the temperature data to the PID temperature control module. The PID temperature control module calculates and adjusts the operating parameters of the heat generation or exchange unit 3 based on a preset target temperature and the actual temperature detected by the temperature detection circuit, and drives the heat generation or exchange unit 3 to heat or dissipate heat. The heat generation or exchange unit may operate using methods including, but not limited to, air cooling, water cooling, electric auxiliary heating, and semiconductor heat pumps. Besides using a heat generation or exchange unit, the PID temperature control module can also utilize the significant high-low power consumption difference within its internal working circuitry to replace the heat generation or exchange unit and complete the temperature control of the image sensor panel 1. This approach leverages the difference in heating and heat dissipation efficiency under different power consumption levels, thus lacking a complete concept of heat exchange. Temperature control is performed when the system is idle. It should be noted that the actual temperature can be equal to the detected temperature of the image sensor panel 1, or it can be equal to the arithmetic value of multiple temperature values ​​detected by the temperature detection circuit within the flat panel detector, to accurately reflect the internal temperature of the flat panel detector.

[0049] In one embodiment of the present invention, the flat panel detector further includes a temperature control strategy execution module, see [link to relevant documentation]. Figure 2 The temperature control strategy execution module employs various temperature control strategies to heat or dissipate heat from the image sensor panel 1. The PID temperature control module calculates and adjusts the parameters of the temperature control strategy execution module based on the target temperature and the actual temperature detected by the temperature detection circuit, selects a suitable temperature control strategy, and drives the temperature control strategy execution module to heat or dissipate heat from the image sensor panel 1. The PID temperature control module may also include a comparator for comparing the difference between the ambient temperature and the actual temperature, performing PID algorithm calculations on the difference results to output power consumption parameters for controlling the temperature control strategy execution module.

[0050] The temperature control strategy execution module includes a free combination of the following three temperature control strategy execution modules:

[0051] The first temperature control strategy execution module includes a power adjustment unit, which is used to adjust the heating power / heat dissipation power of the heat generation or exchange unit 3 under the drive of the PID temperature control module.

[0052] The second temperature control strategy execution module includes a first power unit, a second power unit, and a duty cycle adjustment unit. The power consumption of the first power unit is higher than that of the second power unit. The duty cycle adjustment unit is used to adjust the duty cycle of the first power unit and the second power unit under the drive of the PID temperature control module.

[0053] The third temperature control strategy execution module includes a power consumption switching control unit and multiple circuit modules disposed on the circuit board inside the flat panel detector. Each circuit module has a different thermal capacity and supports power consumption switching. The power consumption switching control unit is used to control some or all of the circuit modules to switch power consumption under the drive of the PID temperature control module to enumerate all thermal capacity combinations.

[0054] In one embodiment of the present invention, a temperature control method for a flat panel detector is provided, comprising the following steps:

[0055] S1. Collect the ambient temperature and determine the setting method for the target temperature of the flat panel detector, so as to obtain the target temperature according to the ambient temperature and the setting method;

[0056] S2. Input the obtained target temperature into the PID temperature control module. The PID temperature control module uses the PID algorithm to drive the temperature control strategy execution module to heat or dissipate heat from the flat panel detector.

[0057] S3. Detect the current actual temperature of the flat panel detector and feed the actual temperature information back to the PID temperature control module;

[0058] S4. Determine whether the difference between the target temperature and the actual temperature is within the preset range. If so, the temperature control strategy execution module maintains the current heating or cooling power consumption parameters to heat or cool the flat panel detector and repeats S3-S4. Otherwise, execute S5.

[0059] S5. Based on the difference between the target temperature and the actual temperature, the PID temperature control module uses the PID algorithm to adjust the power consumption parameters of the temperature control strategy execution module so that the flat panel detector reaches and stabilizes at the target temperature, and repeats S3-S4.

[0060] In step S1, the target temperature is determined using the target temperature selection strategy module. The target temperature can be set using at least two of the following selection strategies:

[0061] The first setting method is suitable for environments with minimal temperature changes. If the change in ambient temperature within a unit of time is within a reference range, the target temperature is equal to the ambient temperature. Alternatively, the target temperature is equal to the ambient temperature plus a positive offset, which covers the change in ambient temperature within a unit of time. This positive offset can be defined as a fixed value or a value that varies relative to the ambient temperature. Furthermore, a pre-established basic functional relationship can be established between the target temperature and the ambient temperature, so that the offset between the target temperature and the ambient temperature gradually decreases as the ambient temperature rises. This design ensures that the overall equipment temperature is always relatively low and stable.

[0062] The second setting method involves setting the target temperature to a fixed value. This method only considers the stability of the device itself and ignores the influence of external temperature. Since the stabilized temperature is always a fixed value, it is beneficial for image correction processing. However, if the set target temperature differs significantly from the ambient temperature, it will take longer to reach the target temperature. When the ambient temperature is higher than the preset target temperature, this control will fail.

[0063] Users can choose between the two setting methods mentioned above based on the actual ambient temperature. It should be noted that the target temperature can be referenced solely by the temperature of the image sensor panel, or by other temperature-controlled components of the flat panel detector.

[0064] In step S2, the PID temperature control module can use a PID algorithm to obtain the initial power consumption parameters for driving the temperature control strategy execution module based on the target temperature or the difference between the target temperature and the ambient temperature, in order to heat or dissipate heat from the flat panel detector. It should be noted that the power consumption parameters include, but are not limited to, the power output, operating frequency, and duration.

[0065] In one embodiment of the present invention, the temperature control strategy execution module includes a free combination of the following three temperature control strategy execution modules:

[0066] The first temperature control strategy execution module includes a power adjustment unit, which is used to adjust the heating power / heat dissipation power of the heat generation or exchange unit under the drive of the PID temperature control module. If the actual temperature is higher than the target temperature and the difference between the two exceeds a preset threshold range, the PID temperature control module drives the power adjustment unit to increase the heat dissipation power and / or decrease the heating power. If the actual temperature is lower than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the power adjustment unit to decrease the heat dissipation power and / or increase the heating power.

[0067] Specifically, by using a general PID algorithm, the output temperature after PID temperature control is used as the feedback input. The difference between the target point and the feedback input is calculated, and the heating / heat dissipation power of the heat generation or exchange unit is determined based on the difference. This process is repeated until the target temperature is finally reached and stabilized. Its advantage is that the control algorithm is simple. As long as the corresponding PID parameters are selected well, the target temperature can be reached quickly and is not affected by the working status of the equipment.

[0068] The second temperature control strategy execution module includes a first power unit, a second power unit, and a duty cycle adjustment unit. The power consumption of the first power unit is higher than that of the second power unit. The duty cycle adjustment unit is used to adjust the duty cycle of the first power unit and the second power unit under the drive of the PID temperature control module. If the actual temperature is higher than the target temperature and the difference between the two exceeds a preset threshold range, the PID temperature control module drives the duty cycle adjustment unit to lower the duty cycle of the first power unit. If the actual temperature is lower than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the duty cycle adjustment unit to increase the duty cycle of the first power unit.

[0069] Specifically, the first power unit and the second power unit correspond to the highest and lowest power consumption states of the internal circuit board of the flat panel detector, respectively. Then, using a PID algorithm, a duty cycle for the highest and lowest power consumption is defined within a period T. If multiple circuit boards exist internally, they can be controlled simultaneously to operate at the highest and lowest power consumption according to the duty cycle. The advantage of this strategy is that the control algorithm is simple, and as long as the corresponding PID parameters are selected well, the target temperature can be reached quickly. However, due to the certain lag in switching from high to low power consumption to temperature stability, deviations and oscillations are prone to occur in the actual temperature control process. During the system's image acquisition operation, this control strategy will temporarily fail.

[0070] The third temperature control strategy execution module includes a power consumption switching control unit and multiple circuit modules mounted on a circuit board within the flat panel detector. Each circuit module has a different thermal capacity and supports power consumption switching. The power consumption switching control unit, driven by the PID temperature control module, controls some or all of the circuit modules to switch power consumption to enumerate all thermal capacity combinations. If the actual temperature is higher than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the power consumption switching control unit to switch the thermal capacity combination, thereby reducing the thermal capacity value of the circuit module combination. If the actual temperature is lower than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the power consumption switching control unit to switch the thermal capacity combination, thereby increasing the thermal capacity value of the circuit module combination.

[0071] Specifically, the system enumerates all power consumption types of the circuit modules, utilizes the different heat capacities of each circuit module that supports power consumption switching to form different heating combinations, and then, based on the difference between the target temperature and the actual temperature, periodically controls the system to operate under different power consumption type combinations so that the system eventually stabilizes at the target temperature.

[0072] The above three temperature control strategies can operate independently or in combination, including situations where two or more temperature control strategies exist simultaneously, facilitating the selection of the appropriate strategy based on actual conditions. It should be noted that the various schemes for setting the target temperature and the various schemes for temperature control can be freely combined to form new temperature control technical solutions, and such combinations are still within the protection scope of this embodiment.

[0073] In one embodiment of the present invention, the flat panel detector internally includes an image sensor panel, an aluminum structural frame, and a working circuit supporting high- and low-power switching. Here, the high and low power consumption of the working circuit is used instead of a dedicated heat generation or exchange unit to describe the temperature control process. See [link to relevant documentation]. Figure 3 .

[0074] The operating circuit comprises a temperature detection circuit, a power supply circuit, a main control circuit, an image acquisition timing control circuit, and various external electronic modules. These circuits can be distributed on the circuit board in the form of circuit modules. The temperature detection circuit includes multiple temperature measurement units to perform real-time multi-point monitoring of ambient temperature, image sensor panel temperature, thermally conductive frame temperature, and internal circuit temperature. The circuit generates heat during operation. Without power management, the system will continuously operate at high power consumption until thermal equilibrium is reached. At this point, the rate of heat generation by the circuit should be equal to or similar to the rate of heat dissipation by the system.

[0075] The program in the main control circuit can control the switching between high and low power consumption of different internal circuits and external electronic modules. The contribution of a circuit module to the system's heat generation within the same time period is defined as the heat capacity of that circuit. Assuming the heat capacities of the internal circuits at high power consumption are denoted as K1, K2, K3…, different combinations of heat capacities can be formed, such as K1, K1+K3, K2+K3, K1+K2+K3… The heat capacity of each internal circuit can be calculated under certain temperature, time, and combination conditions. Generally, the heat capacity of a circuit module can be approximately calculated by reading the ambient temperature and the temperature of the heat-conducting structural frame near the circuit when it is operating. By utilizing the different heat capacities generated by each circuit module at high and low power consumption, and by real-time detection of the temperature difference between the current and target temperatures, a PID temperature control algorithm can be used to stabilize the flat panel detector at the preset target temperature.

[0076] The preset target temperature here is the temperature that the image sensor panel needs to reach, defined as the current ambient temperature plus an offset value. After the device is powered on, the initial temperature of each part inside should be consistent with the ambient temperature. The target temperature and the current ambient temperature are read intermittently, and the PID control parameters are obtained using the PID temperature control algorithm. A correspondence table between the PID control parameters and the thermal capacity combination is established. When the PID control parameters are calculated, the corresponding thermal capacity combination circuit is started, so that the corresponding circuit module runs in a high power consumption state.

[0077] Using the different thermal capacities of system circuits for temperature control has some limitations. For example, when a flat panel detector is acquiring images, it needs to operate in a high-power state, at which point temperature control will fail. Furthermore, a sufficient difference should be maintained between the total high and low power consumption so that the system does not require a long waiting time to reach the target temperature stabilization state.

[0078] The temperature-controlled flat panel detector and its temperature control method provided by this invention utilize the internal structural design model and temperature feedback of the flat panel to accurately and quickly complete the temperature control of the detector, making it almost unaffected by the external ambient temperature. On the one hand, this can reduce the waiting time for product startup and improve product availability; on the other hand, it is also conducive to obtaining optimal image performance at room temperature.

[0079] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A flat panel detector with temperature control function, characterized in that, include Image sensor panel (1), the image sensor panel (1) is a photosensitive component, used for array imaging responsible for photoelectric conversion; A thermally conductive structural frame (2) is used to support the image sensor panel (1) and also serves as a thermally conductive medium for heat exchange of the image sensor panel (1). A heat generation or exchange unit (3) is used for system heating or cooling, and the heat generation or exchange unit (3) directly acts on the heat-conducting structural frame (2); The working circuit (4) includes a temperature detection circuit, a power supply circuit, a main control circuit and an image acquisition timing control circuit. The temperature detection circuit includes multiple temperature sensors, which are distributed at multiple positions on the flat panel detector to detect the current ambient temperature. The PID temperature control module calculates and adjusts the working parameters of the heat generation or exchange unit (3) based on the preset target temperature and the actual temperature detected by the temperature detection circuit, and drives the heat generation or exchange unit (3) to heat or dissipate heat, so that the image sensor panel (1) reaches and stabilizes at the target temperature. The preset method of the target temperature is to have a pre-established functional relationship between the target temperature and the ambient temperature, so that the offset between the target temperature and the ambient temperature gradually decreases as the ambient temperature rises. The temperature control strategy execution module is configured with a first submodule, which includes a power consumption switching control unit and multiple circuit modules disposed on the circuit board inside the flat panel detector. Each circuit module has a different thermal capacity and supports power consumption switching. The power consumption switching control unit is used to control some or all of the circuit modules to switch power consumption under the drive of the PID temperature control module to enumerate all thermal capacity combinations. If the actual temperature is higher than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the power consumption switching control unit to switch the thermal capacity combination so as to reduce the thermal capacity value. If the actual temperature is lower than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the power consumption switching control unit to switch the heat capacity combination so that the heat capacity value increases.

2. The flat panel detector with temperature control function according to claim 1, characterized in that, The heat generation or exchange unit (3) is heated by electric auxiliary heating and / or a semiconductor heat pump; the heat generation or exchange unit (3) is cooled by one or more of the following methods: natural cooling, air cooling, water cooling, and electric cooling.

3. The flat panel detector with temperature control function according to claim 1, characterized in that, The temperature control strategy execution module can use a variety of temperature control strategies to heat or dissipate heat from the image sensor panel (1). The PID temperature control module calculates and adjusts the parameters of the temperature control strategy execution module based on the target temperature and the actual temperature detected by the temperature detection circuit, and drives the temperature control strategy execution module to heat or dissipate heat from the image sensor panel (1).

4. The flat panel detector with temperature control function according to claim 3, characterized in that, The temperature control strategy execution module is also configured with a second sub-module, which includes a power adjustment unit. The power adjustment unit is used to adjust the heating power / heat dissipation power of the heat generation or exchange unit (3) under the drive of the PID temperature control algorithm module. If the actual temperature is higher than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the power adjustment unit to increase the heat dissipation power and / or decrease the heating power; if the actual temperature is lower than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the power adjustment unit to decrease the heat dissipation power and / or increase the heating power.

5. The flat panel detector with temperature control function according to claim 3, characterized in that, The temperature control strategy execution module is also configured with a third sub-module, which includes a first power unit, a second power unit and a duty cycle adjustment unit. The power consumption of the first power unit is higher than that of the second power unit. The duty cycle adjustment unit is used to adjust the duty cycle of the first power unit and the second power unit under the drive of the PID temperature control module. If the actual temperature is higher than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the duty cycle adjustment unit to reduce the duty cycle of the first power unit. If the actual temperature is lower than the target temperature and the difference exceeds a preset threshold range, the PID temperature control module drives the duty cycle adjustment unit to increase the duty cycle of the first power unit.

6. The flat panel detector with temperature control function according to claim 3, characterized in that, The temperature control strategy execution module includes the following three temperature control strategy execution modules in a free combination: The first temperature control strategy execution module includes a power adjustment unit, which is used to adjust the heating power / heat dissipation power of the heat generation or exchange unit (3) under the drive of the PID temperature control module. The second temperature control strategy execution module includes a first power unit, a second power unit, and a duty cycle adjustment unit. The power consumption of the first power unit is higher than that of the second power unit. The duty cycle adjustment unit is used to adjust the duty cycle of the first power unit and the second power unit under the drive of the PID temperature control module. The third temperature control strategy execution module includes a power consumption switching control unit and multiple circuit modules disposed on the circuit board inside the flat panel detector. Each circuit module has a different thermal capacity and supports power consumption switching. The power consumption switching control unit is used to control some or all of the circuit modules to switch power consumption under the drive of the PID temperature control module to enumerate all thermal capacity combinations.

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