Solder preforming device and method for laser brazing

Abstract

The present invention belongs to the technical field of solder preforming, and proposes a solder preforming device for laser brazing and a method thereof. The solder preforming device for laser brazing includes a spring plunger, a solder preforming device cover plate, a solder preforming device connecting plate, a solder preforming device bottom plate and an exhaust plug. The solder preforming device cover plate, the solder preforming device connecting plate and the solder preforming device bottom plate are installed in sequence from top to bottom. The method of using the device is as follows: after the solder preforming device tooling is assembled, the paste solder is injected into the heat conductive ring, and pressure is applied to the exhaust plug through the spring plunger to press the solder, and finally put it into a dryer for drying, so as to obtain a preformed solder of a certain structure. The present invention has a simple structure and strong adaptability, and is convenient for realizing the preforming of solders of different shapes and materials, realizing small-batch and low-cost preforming of solders, and reducing the production cost of the enterprise.

Description

Technical Field

[0001] The present invention relates to the technical field of solder preforming, and in particular to a solder preforming device and method for laser brazing. Background Art

[0002] The brazing process is simple and easy to operate. The components connected by the brazing process have good performance, high reliability, and good product consistency. Therefore, it is widely used in the connection and assembly of various products. Laser brazing technology has the advantages of high energy density, fast welding speed, and almost no welding deformation, which can greatly improve the welding quality. The brazing materials used in laser brazing are mostly powder brazing materials, paste brazing materials, and solid brazing materials, and solid brazing materials are mostly in the form of wires, strips, and sheets. As the application scope of brazing technology becomes wider and wider, more requirements are put forward for the shape and quality of the solder. Preformed solder has the advantages of diverse shapes, good weldability, and the ability to accurately control the amount of solder used. It can also be made into any size and shape to meet the needs of the welding process. It has been identified as an important means of innovation in welding technology.

[0003] Currently, most preformed solders on the market are customized prefabricated rings of shaped welding wires. Special structures require processing plants to use lathes and other processing methods. Not only is the labor intensity of workers high and the production efficiency low, but the production costs of enterprises are greatly increased. Summary of the invention

[0004] In view of the above analysis, the present invention proposes a solder preforming device and method for laser brazing, which has a simple structure, strong adaptability and low production cost.

[0005] To achieve the above purpose, the technical solution adopted by the present invention is as follows:

[0006] A solder preforming device for laser brazing is a solder preforming device tooling 9; the solder preforming device tooling 9 comprises a spring plunger 1, a solder preforming device cover plate 2, a solder preforming device connecting plate 3, a bottom plate fixing bolt 4, a solder preforming device bottom plate 5, an exhaust plug 7 and a cover plate fixing bolt 8; the solder preforming device cover plate 2, the solder preforming device connecting plate 3 and the solder preforming device bottom plate 5 are sequentially installed from top to bottom; threaded holes are evenly distributed around the solder preforming device connecting plate 3, and the solder preforming device cover plate 2 and the solder preforming device connecting plate 3 are fixedly connected by the cover plate fixing bolt 8; the solder preforming device connecting plate 3 and the solder preforming device bottom plate 5 are fixedly connected by the bottom plate fixing bolt 4; a threaded hole is arranged at the center of the solder preforming device cover plate 2 The groove hole is used to install the spring plunger 1; the center of the solder preforming device connecting plate 3 is provided with a stepped hole, including a positioning surface a10 and a positioning surface b11; one end of the exhaust plug 7 is in contact with the spring plunger 1, and the other end is installed in the center of the solder preforming device connecting plate 3; the positioning surface b11 is transitionally matched with the outer cylindrical surface of the exhaust plug 7; the positioning surface a10 is transitionally matched with the positioning surface d13 of the bottom plate 5 of the solder preforming device; the bottom plate 5 of the solder preforming device is a stepped structure, which is a hemispherical structure, a positioning surface c12, a positioning surface d13 and a bottom plate from top to bottom, and the radius increases successively; the heat conductive ring 14 of the solder structure 6 is used as a mold and is installed in the center of the solder preforming device connecting plate 3, and the depth of the positioning surface a10 is equal to the sum of the height of the positioning surface d13 and the height of the solder structure 6.

[0007] The exhaust plug 7 is a hollow cylindrical structure, and the diameter of the central through hole is used to discharge the gas generated during the forming process of the solder structure 6 to avoid the formation of pores inside the preformed solder; pressure is applied to the exhaust plug 7 by tightening the spring plunger 1.

[0008] The hemispherical structure on the top of the solder preforming device bottom plate 5 is the same shape as the bottom of the solder pin used in conjunction with the preformed solder ring 15, and serves as a mold structure of the solder preforming device.

[0009] A solder preforming method for a solder preforming device for laser brazing, specifically comprising the following steps:

[0010] Step 1, invert the heat-conducting ring 14 on the stepped structure of the bottom plate 5 of the solder preforming device, wherein the inner edge surface of the heat-conducting ring 14 and the positioning surface c12 are in transition fit;

[0011] Step 2, connecting and fixing the solder preforming device connecting plate 3 and the solder preforming device bottom plate 5 through the bottom plate fixing bolts 4, wherein the positioning surface a10 and the positioning surface d13 are transitionally matched;

[0012] Step 3, placing the solder paste into the groove of the heat conductive ring 14 through the central hole of the solder preforming device connecting plate 3, and then pressing the exhaust plug 7 into the central hole of the solder preforming device connecting plate 3;

[0013] Step 4, connect and fix the solder preforming device cover plate 2 and the solder preforming device connecting plate 3 through the cover plate fixing bolts 8, screw the spring plunger 1 into the central threaded hole of the solder preforming device cover plate 2, and tighten the spring plunger 1 to apply pressure to the exhaust plug 7;

[0014] Step 5: Place the installed solder preform device for laser brazing into a drying box for drying. After drying, disassemble the solder preform device for laser brazing to check whether the solder structure 6 meets the use requirements.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] (1) The solder preforming device for laser brazing described in the present invention has a simple structure and strong adaptability, and is convenient for preforming solders of different shapes and materials, thereby realizing small-batch, low-cost preforming of solders and reducing the production cost of enterprises.

[0017] (2) The heat-conducting ring in the solder structure of the present invention not only serves as a mold for solder preforming, but also is tightly combined with the solder surface after solder preforming, thereby greatly improving the speed, efficiency and welding quality of heat conduction during the welding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Exploded view of a solder preform device for laser brazing.

[0019] Figure 2 Schematic diagram of the structure of the solder preforming device used for laser brazing.

[0020] Figure 3 This is a schematic diagram of the structure of the connecting plate of the solder preforming device.

[0021] Figure 4 This is a schematic diagram of the base structure of the solder preforming device.

[0022] Figure 5 Schematic diagram of solder structure.

[0023] Figure 6 Schematic diagram of the heat conduction ring structure.

[0024] Figure 7 Schematic diagram of the preformed solder ring structure.

[0025] Figure 8 A schematic diagram of the structure of a solder pin used in conjunction with preformed solder.

[0026] In the figure: 1-spring plunger; 2-solder preforming device cover plate; 3-solder preforming device connecting plate; 4-bottom plate fixing bolt; 5-solder preforming device bottom plate; 6-solder structure; 7-vent plug; 8-cover plate fixing bolt; 9-solder preforming device tooling; 10-positioning surface a; 11-positioning surface b; 12-positioning surface c; 13-positioning surface d; 14-thermal conductive ring; 15-preformed solder ring; 16-positioning surface e. DETAILED DESCRIPTION

[0027] The following is a combination of technical solutions and Figure 1-Figure 7 Specific embodiments of the present invention are described in detail.

[0028] like Figure 1 A solder preforming device for laser brazing shown in the figure includes a spring plunger 1, a solder preforming device cover plate 2, a solder preforming device connecting plate 3, a base plate fixing bolt 4, a solder preforming device base plate 5, an exhaust plug 7, and a cover plate fixing bolt 8; a heat conductive ring 14 of a solder structure 6 is installed between the solder preforming device connecting plate 3 and the solder preforming device base plate 5.

[0029] like Figure 2 The solder preforming tool 9 shown includes a spring plunger 1, a solder preforming device cover plate 2, a solder preforming device connecting plate 3, a bottom plate fixing bolt 4, a solder preforming device bottom plate 5, an exhaust plug 7, and a cover plate fixing bolt 8. Among them, the central threaded hole of the solder preforming device cover plate 2 is used to install the spring plunger 1, and by tightening the spring plunger 1, a corresponding pressure can be applied to the exhaust plug 7. The exhaust plug 7 is a hollow cylindrical structure, and the diameter of the central through hole is small, which is mainly used to discharge the gas generated during the solder forming process to avoid the formation of pores inside the preformed solder.

[0030] like Figure 3 The solder preforming device connecting plate 3 shown in the figure has threaded holes evenly distributed around it, and the solder preforming device cover plate 2 and the solder preforming device bottom plate 5 are connected and fixed by the bottom plate fixing bolts 4 and the cover plate fixing bolts 8 respectively; the center of the solder preforming device connecting plate 3 is a stepped hole structure, and its positioning surface a10 and the positioning surface d13 of the solder preforming device bottom plate 5 are transitionally matched, and the positioning surface b11 and the outer cylindrical surface of the exhaust plug 7 are transitionally matched, and the depth of its positioning surface a10 is consistent with the sum of the height of the positioning surface d13 and the height of the heat conductive ring 14.

[0031] like Figure 4 The bottom plate 5 of the solder preformer shown in the figure has a stepped structure, and its top hemispherical structure is similar to that of Figure 8 The bottom shape of the solder pins used in conjunction with the preformed solder ring 15 is the same as the mold structure of the solder forming device.

[0032] by Figure 8Taking the solder pin used in conjunction with the solder structure as an example, the basic process of the present invention for performing the solder preforming operation is as follows:

[0033] (1) First, the heat-conducting ring 14 is inverted on the stepped structure of the solder preforming device bottom plate 5, wherein the inner edge surface of the heat-conducting ring 14 and the positioning surface c12 are transitionally matched, and the inner edge surface structure of the heat-conducting ring 14 and the stepped structure of the solder preforming device bottom plate 5 can be processed according to actual needs;

[0034] (2) Then, the solder preforming device connecting plate 3 and the solder preforming device bottom plate 5 are connected and fixed by the bottom plate fixing bolts 4, wherein the positioning surface a10 and the positioning surface d13 are transitionally matched;

[0035] (3) Place a certain amount of solder paste into the groove on the inner edge of the heat conducting ring 14 through the center hole of the solder preforming device connecting plate 3, and then place the exhaust plug 7 into the center hole of the solder preforming device connecting plate 3;

[0036] (4) Connect and fix the solder preforming device cover plate 2 and the solder preforming device connecting plate 3 through the cover plate fixing bolts 8, screw the spring plunger 1 into the central threaded hole of the solder preforming device cover plate 2, and tighten the spring plunger 1 so that it applies a certain pressure to the exhaust plug 7;

[0037] (5) The assembled solder preform device is placed in a drying oven for drying. After drying, the solder preform device is disassembled to check whether the solder structure 6 meets the use requirements.

[0038] like Figure 5 The solder structure 6 to be formed includes a heat conductive ring 14 and a preformed solder ring 15. The outer cylindrical surface of the preformed solder ring 15 and the inner edge surface of the heat conductive ring 14 are tightly combined during the solder preforming process, thereby improving the speed and efficiency of heat conduction during the soldering process.

[0039] The solder structure 6 formed by the present method is a truncated cone-shaped irregular polyhedron ring, which includes a heat conductive ring 14 and a preformed solder ring 15; Figure 6 The heat-conducting ring 14 shown is made of pure copper and includes an outer edge surface and an inner edge surface; the outer edge surface of the heat-conducting ring 14 is an inclined surface with an inclination angle, which is used as the irradiation surface of the laser during brazing and is used for laser irradiation; the inner edge surface is a stepped hole structure, and the preformed solder ring 15 is installed on the inner edge surface; the positioning surface e16 on the inner side of the heat-conducting ring 14 is sleeved on the positioning surface c12 of the bottom plate 5 of the solder preforming device; Figure 7 The solder preform ring 15 shown is a circular ring structure, the inner size of which matches the hemispherical structure on the top of the solder preform device bottom plate 5 , and the thickness and diameter of the outer cylindrical structure match the depth and diameter of the groove on the inner edge of the thermal conductive ring 14 .

[0040] Of course, the present invention is not limited to the above examples. Technical features not described in the present invention can be achieved by or by using existing technologies, which will not be described herein. The above embodiments are only used to illustrate the technical scheme of the present invention, and are not limitations of the present invention. The present invention is described in detail with reference to the preferred implementation modes. Ordinary technicians in this field should understand that changes, modifications, additions or substitutions made by ordinary technicians in this technical field within the essential scope of the present invention do not deviate from the purpose of the present invention, and should also fall within the scope of protection of the claims of the present invention.

Claims

1. A solder preforming device for laser brazing, characterized in that: The solder preforming device for laser brazing is a solder preforming device tool (9); The solder preforming tool (9) comprises a spring plunger (1), a solder preforming device cover plate (2), a solder preforming device connecting plate (3), a bottom plate fixing bolt (4), a solder preforming device bottom plate (5), an exhaust plug (7) and a cover plate fixing bolt (8); the solder preforming device cover plate (2), the solder preforming device connecting plate (3) and the solder preforming device bottom plate (5) are installed in sequence from top to bottom; the solder preforming device cover plate (2) and the solder preforming device connecting plate (3) are fixedly connected by the cover plate fixing bolt (8); the solder preforming device connecting plate (3) and the solder preforming device bottom plate (5) are fixedly connected by the bottom plate fixing bolt (4); a threaded hole is provided in the center of the solder preforming device cover plate (2) for installing the spring plunger (1); the solder preforming device connecting plate (3) ) is provided with a stepped hole at the center, including a positioning surface a (10) and a positioning surface b (11); one end of the exhaust plug (7) contacts the spring plunger (1), and the other end is installed in the center of the solder preforming device connecting plate (3); the positioning surface b (11) is transitionally matched with the outer cylindrical surface of the exhaust plug (7); the positioning surface a (10) is transitionally matched with the positioning surface d (13) of the solder preforming device bottom plate (5); the solder preforming device bottom plate (5) is a stepped structure, which is a hemispherical structure, a positioning surface c (12), a positioning surface d (13) and a bottom plate from top to bottom, and the radius increases in sequence; the heat conducting ring (14) of the solder structure (6) is used as a mold and is installed in the center of the solder preforming device connecting plate (3), and the depth of the positioning surface a (10) is equal to the sum of the height of the positioning surface d (13) and the height of the solder structure (6).

2. The solder preforming device for laser brazing according to claim 1, characterized in that: The exhaust plug (7) is a hollow cylindrical structure, and the diameter of its central through hole is used to discharge the gas generated during the forming process of the solder structure (6) to avoid the formation of pores inside the preformed solder; pressure is applied to the exhaust plug (7) by tightening the spring plunger (1).

3. A solder preforming method for a solder preforming device for laser brazing, characterized in that: The specific steps are as follows: Step 1, invert the heat-conducting ring (14) on the stepped structure of the bottom plate (5) of the solder preforming device, wherein the inner edge surface of the heat-conducting ring (14) and the positioning surface c (12) are in transition fit; Step 2, connecting and fixing the solder preforming device connecting plate (3) and the solder preforming device bottom plate (5) by means of bottom plate fixing bolts (4), wherein the positioning surface a (10) and the positioning surface d (13) are transitionally matched; Step 3, placing the solder paste into the groove of the heat-conducting ring (14) through the central hole of the solder preforming device connecting plate (3), and then pressing the exhaust plug (7) into the central hole of the solder preforming device connecting plate (3); Step 4: Connect and fix the solder preforming device cover plate (2) and the solder preforming device connecting plate (3) through the cover plate fixing bolts (8), screw the spring plunger (1) into the central threaded hole of the solder preforming device cover plate (2), and tighten the spring plunger (1) to apply pressure to the exhaust plug (7); Step 5: Place the installed solder preform device for laser brazing into a drying box for drying. After drying, disassemble the solder preform device for laser brazing to check whether the solder structure (6) meets the use requirements.

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