Glue coating device

Abstract

The present invention provides a glue coating device, comprising: a glue coating nozzle and a cleaning nozzle; the glue coating nozzle and the cleaning nozzle are used to spray the photoresist and the cleaning agent respectively; the glue coating nozzle includes a glue coating nozzle, and the cleaning nozzle includes a cleaning nozzle; the glue coating nozzle and the cleaning nozzle are both tubular, the glue coating nozzle and the cleaning nozzle have the same direction and the side walls abut against each other, wherein the end face of the glue coating nozzle exceeds the cleaning nozzle, so that the cleaning agent of the cleaning nozzle flows through the side wall of the glue coating nozzle, which can reduce the space occupied in the equipment while removing the suspended photoresist droplets.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a glue coating device. Background Art

[0002] Photolithography is a surface processing technology that plays an important role in the manufacture of semiconductor electronic devices and integrated circuits.

[0003] Coating equipment is a common device in semiconductor manufacturing, typically used for processes such as photoresist coating and development. Photoresist coating requires placing a wafer on a rotating stage. During the wafer rotation, photoresist is applied to the wafer surface, forming a layer of specified thickness and uniformity. Therefore, very high requirements are placed on the amount of photoresist applied.

[0004] In the prior art, during the operation of the coating nozzle for coating photoresist on the wafer, some photoresist will not flow out of the nozzle but hang on the side wall of the nozzle. This part of the photoresist will agglomerate and become blocked as the solution evaporates when exposed to the air, resulting in uneven photoresist spraying.

[0005] Therefore, it is necessary to develop a novel glue coating device to improve the above-mentioned partial problems existing in the prior art. Summary of the Invention

[0006] The object of the present invention is to provide a glue coating device capable of removing the photoresist hanging on the glue coating nozzle.

[0007] To achieve the above-mentioned purpose, the present invention provides a gluing device, including a gluing nozzle and a cleaning nozzle; the gluing nozzle and the cleaning nozzle are respectively connected to a photoresist source and a cleaning agent source; the gluing nozzle includes a gluing nozzle, and the cleaning nozzle includes a cleaning nozzle; the gluing nozzle and the cleaning nozzle are both tubular, the gluing nozzle and the cleaning nozzle have the same direction and the side walls abut against each other, wherein the end face of the gluing nozzle exceeds the cleaning nozzle, so that the cleaning agent of the cleaning nozzle flows through the side wall of the gluing nozzle.

[0008] The beneficial effect of the glue coating device provided by the present invention is that: the glue coating nozzle and the cleaning nozzle, both of which are tubular, are arranged in the same direction and with their side walls abutting each other, and the end face of the glue coating nozzle extends beyond the cleaning nozzle, so that the cleaning agent sprayed by the cleaning nozzle flows through the side wall of the glue coating nozzle, thereby removing the photoresist droplets hanging on the glue coating nozzle; on the premise of removing the suspended photoresist droplets, the side walls of the glue coating nozzle and the cleaning nozzle abut against each other, thereby reducing the space occupied in the equipment.

[0009] Optionally, the diameter ratio of the gluing nozzle to the cleaning nozzle is greater than or equal to 0.3 and less than or equal to 0.7. This has the beneficial effect of: when the diameter ratio of the gluing nozzle to the cleaning nozzle is greater than or equal to 0.3 and less than or equal to 0.7, the diameter of the gluing nozzle is smaller and the diameter of the cleaning nozzle is larger, which is conducive to the cleaning agent covering the area of the gluing nozzle during the flow process, thereby improving the cleaning effect of the gluing nozzle.

[0010] Optionally, the end face distance between the gluing nozzle and the cleaning nozzle is greater than or equal to 30 mm and less than or equal to 80 mm. This has the beneficial effect of facilitating the cleaning agent to cover the area of the gluing nozzle during the flow process, thereby improving the cleaning effect of the gluing nozzle.

[0011] Optionally, the glue coating nozzle includes a tapered portion at the end of the glue coating nozzle, so that the material sprayed from the glue coating nozzle accumulates at the apex of the tapered portion under the action of gravity. This has the beneficial effect of allowing the tapered portion to cause droplets suspended from the nozzle of the glue coating nozzle to converge at the apex of the tapered portion under the action of gravity, thereby facilitating the reduction of suspended photoresist droplets. Simultaneously, the cleaning agent also flows along the sidewalls of the glue coating nozzle to the apex of the tapered portion, facilitating the cleaning nozzle to clean the photoresist droplets.

[0012] Optionally, the tapered portion is an oblique circular cone, with the projection of the apex of the oblique circular cone on its bottom surface located on the outer edge of the circle. This advantageously enables the apex of the tapered portion to be located on the sidewall of the glue coating nozzle, thereby causing suspended photoresist droplets to gather toward the sidewall of the glue coating nozzle, thereby facilitating the cleaning nozzle, which abuts against the sidewall of the glue coating nozzle, to remove the photoresist liquid.

[0013] Optionally, the cleaning nozzle includes a guide portion disposed at the end of the cleaning nozzle for directing the cleaning agent sprayed from the cleaning nozzle toward the gluing nozzle. This advantageously allows the guide portion to redirect the cleaning agent's flow, directing the cleaning agent sprayed along the extension direction of the cleaning nozzle toward the gluing nozzle, thereby increasing the contact area between the cleaning agent and the gluing nozzle and improving the cleaning effect.

[0014] Optionally, the cleaning agent is placed in a cleaning agent container, and the cleaning nozzle is connected to at least two cleaning agent containers via a fluid control device, so as to use at least two different cleaning agents for cleaning the nozzle.

[0015] Optionally, the cleaning agent includes nitrogen and a photoresist thinner. The beneficial effect is that the photoresist thinner is first used to reform the solidified photoresist on the side wall of the coating nozzle into suspended droplets, and then the nitrogen is used to remove the photoresist in the droplets, thereby improving the cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic structural diagram of a gluing device in a first embodiment of the present invention;

[0017] Figure 2 for Figure 1 The structural diagram of the gluing nozzle and the cleaning nozzle shown;

[0018] Figure 3 Schematic diagram of the structure of the gluing nozzle and the cleaning nozzle in the second embodiment of the present invention;

[0019] Figure 4 Schematic diagram of the structure of the gluing nozzle and the cleaning nozzle in the third embodiment of the present invention.

[0020] Reference numerals:

[0021] 1. Glue coating nozzle; 101. Conical portion; 1011. Opening; 2. Cleaning nozzle; 201. Flow guide portion; 3. Pipeline; 4. Nitrogen source; 5. Photoresist diluent source; 6. Photoresist source; 7. Fluid control device. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be the common meanings understood by people with ordinary skills in the field to which the invention belongs. The words "including" and similar words used in this article mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0023] In order to solve the problems existing in the prior art, an embodiment of the present invention provides a glue coating device.

[0024] Figure 1 It is a structural schematic diagram of the gluing device in the first embodiment of the present invention.

[0025] In some embodiments of the present invention, referring to Figure 1The glue coating device includes a glue coating nozzle (not shown in the figure) and a cleaning nozzle (not shown in the figure); the glue coating nozzle and the cleaning nozzle are respectively connected to a photoresist source 6 and a cleaning agent source; the glue coating nozzle includes a glue coating nozzle 1, and the cleaning nozzle includes a cleaning nozzle 2, and the glue coating nozzle 1 and the cleaning nozzle 2 are both tubular; wherein, the glue coating nozzle 1 and the cleaning nozzle 2 have the same direction and the side walls abut against each other, and the end face of the glue coating nozzle 1 exceeds the cleaning nozzle 2, so that the cleaning agent sprayed from the cleaning nozzle 2 flows through the side wall of the glue coating nozzle 1.

[0026] In some embodiments of the present invention, referring to Figure 1 The cleaning agent source has a cleaning agent container and a cleaning agent placed in the cleaning agent container. The cleaning agent source includes a nitrogen source 4 and a photoresist thinner source 5. The cleaning nozzle 2 on the cleaning nozzle (not shown in the figure) is connected to at least two cleaning agent sources through a fluid control device 7 set in the pipeline 3, and at least two different cleaning agents are used for the cleaning nozzle 2.

[0027] In some specific embodiments of the present invention, referring to Figure 1 The cleaning agent source includes a nitrogen source 4 and a photoresist thinner source 5; the glue coating nozzle 1 on the glue coating nozzle is connected to a photoresist source 6, and the cleaning nozzle 2 on the cleaning nozzle is simultaneously connected to a nitrogen source 4 and a photoresist thinner source 5 through a pipeline 3. A fluid control device 7 is provided on the pipeline 3 so that the cleaning agent sprayed by the cleaning nozzle 2 can be switched between nitrogen and photoresist thinner; during operation, the cleaning nozzle first sprays the photoresist thinner to dilute the solidified photoresist on the glue coating nozzle 1, and then sprays nitrogen.

[0028] In some specific embodiments, referring to Figure 1 The nitrogen source 4 and the photoresist diluent source 5 are respectively led out into two pipelines and connected to the pipeline of the cleaning nozzle using a three-way valve.

[0029] In some embodiments, the three-way valve is a solenoid valve and is connected to industrial control equipment to achieve automatic control.

[0030] In some specific embodiments of the present invention, referring to Figure 1 and Figure 2 The gluing nozzle and the cleaning nozzle can have different shapes according to actual application needs, but the cleaning nozzle 2 and the gluing nozzle 1 at the ends of both are tubular parts, so that when the side walls of the gluing nozzle 1 and the cleaning nozzle 2 abut against each other, the projections of the nozzles of the two on the plane perpendicular to the axis of the cleaning nozzle 2 and the gluing nozzle 1 are adjacent to each other.

[0031] Figure 2 for Figure 1The schematic diagram of the structure of the gluing nozzle and the cleaning nozzle is shown.

[0032] In some specific embodiments of the present invention, referring to Figure 2 The diameter ratio of the gluing nozzle 1 to the cleaning nozzle 2 is greater than or equal to 0.3 and less than or equal to 0.7; the side walls of the gluing nozzle 1 and the cleaning nozzle 2 abut against each other. If the diameter of the gluing nozzle 1 is small, the diameter of the cleaning nozzle 2 is relatively large, so the flow rate of the cleaning agent will be relatively increased. The cleaning agent sprayed from the cleaning nozzle 2 is easily moved to the side wall of the gluing nozzle under the influence of the surface tension of the liquid during the flow process, so that the cleaning agent covers a larger area of the gluing nozzle 1 when flowing.

[0033] Specifically, the diameter of the glue coating nozzle 1 may be 1 to 2.5 mm, and the diameter of the cleaning nozzle 2 may be 1 to 5 mm.

[0034] In some specific embodiments of the present invention, the cleaning nozzle 2 and the gluing nozzle 1 are both tubular, and the cross-sectional shapes of the two include but are not limited to circular or rectangular.

[0035] In some specific embodiments of the present invention, referring to Figure 2 The gluing nozzle 1 and the cleaning nozzle 2 are both tubular, and the axes of the gluing nozzle 1 and the cleaning nozzle 2 are parallel to each other in the same plane, so that the directions of the gluing nozzle 1 and the cleaning nozzle 2 are the same, that is, the spray flow directions of the gluing nozzle 1 and the cleaning nozzle 2 are the same.

[0036] In some specific embodiments of the present invention, referring to Figure 2 The end face of the glue coating nozzle 1 exceeds the cleaning nozzle 2, that is, the end of the glue coating nozzle 1 in the ejection direction of the ejected material exceeds the end of the cleaning nozzle 2 in the ejection direction of the ejected material, so that the cleaning agent ejected by the cleaning nozzle 2 can flow through the position where the photoresist droplets on the glue coating nozzle 1 are suspended or condensed.

[0037] In some embodiments of the present invention, the end face distance t between the glue coating nozzle 1 and the cleaning nozzle 2 is greater than or equal to 30 mm and less than or equal to 80 mm, that is, the distance t shown in the figure.

[0038] Specifically, the end face distance between the gluing nozzle 1 and the cleaning nozzle 2 can be 30, 35, 40, 45, 50, 55, 60, 65, 70, 75 or 80 mm.

[0039] Figure 3 Schematic diagram of the structure of the gluing nozzle and the cleaning nozzle in the second embodiment of the present invention; Figure 4 Schematic diagram of the structure of the gluing nozzle and the cleaning nozzle in the third embodiment of the present invention.

[0040] In some embodiments of the present invention, referring to Figure 3 The gluing nozzle includes a conical portion 101 located at the end of the gluing nozzle 1, so that the material sprayed from the gluing nozzle accumulates at the apex of the conical portion 101 under the action of gravity.

[0041] In some specific embodiments of the present invention, the tapered portion 101 may be conical.

[0042] In some specific embodiments of the present invention, referring to Figure 3 The end face of the glue coating nozzle is inclined to the cross section of the glue coating nozzle, that is, there is an inclination angle between the plane where the end face of the glue coating nozzle is located and the plane perpendicular to the axis of the glue coating nozzle.

[0043] In some specific embodiments of the present invention, referring to Figure 4 The conical portion 101 is an oblique cone, and the projection of the vertex of the oblique cone on its bottom surface is located on the outer edge of the circle. The conical portion 101 has a channel for facilitating the outflow of the photoresist. One end of the channel has an opening 1011, and the opening 1011 is located at the top of the conical portion 101. At this time, the opening 1011 is closer to the cleaning nozzle 2, which facilitates the cleaning of the photoresist at the opening 1011.

[0044] In some embodiments of the present invention, the glue coating nozzle is an edge glue coating nozzle for coating glue on the edge of a wafer. The glue coating nozzle has an oblique conical glue coating nozzle head 1 to facilitate coating glue on the edge of the wafer.

[0045] In some embodiments of the present invention, referring to Figure 3 The cleaning nozzle includes a guide portion 201 arranged at the end of the cleaning nozzle 2, which is used to guide the cleaning agent sprayed from the cleaning nozzle 2 to the glue coating nozzle 1.

[0046] In some specific embodiments, referring to Figure 3 The guide part 201 is also a tubular structure. One end of the guide part 201 is connected to the end of the cleaning nozzle 2. The axis of the guide part 201 points to the end of the glue coating nozzle 1, so that the cleaning agent sprayed from the cleaning nozzle 2 is guided to the glue coating nozzle 1.

[0047] While the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations of these embodiments are possible. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the claims. Furthermore, the invention described herein is susceptible to other embodiments and may be practiced or implemented in a variety of ways.

Claims

1. A gluing device, characterized in that: include: A gluing nozzle and a cleaning nozzle, the gluing nozzle and the cleaning nozzle are used to spray photoresist and the cleaning agent respectively; the gluing nozzle includes a gluing nozzle head, the cleaning nozzle includes a cleaning nozzle head, and the gluing nozzle head and the cleaning nozzle head are both tubular; wherein, the gluing nozzle head and the cleaning nozzle head have the same direction and the side walls abut against each other, the end face of the gluing nozzle head exceeds the cleaning nozzle head, so that the cleaning agent sprayed by the cleaning nozzle head flows through the side wall of the gluing nozzle head; the gluing nozzle includes a tapered portion located at the end of the gluing nozzle head, so that the material sprayed by the gluing head accumulates at the apex of the tapered portion under the action of gravity, and the apex of the tapered portion is located on the side close to the cleaning nozzle head, so that the cleaning agent sprayed by the cleaning nozzle head flows through the apex of the tapered portion.

2. The gluing device according to claim 1, characterized in that: The diameter ratio of the gluing nozzle to the cleaning nozzle is greater than or equal to 0.5 and less than or equal to 1.

3. The gluing device according to claim 1, characterized in that: The end face distance between the gluing nozzle and the cleaning nozzle is greater than or equal to 30 mm and less than or equal to 80 mm.

4. The gluing device according to claim 1, characterized in that: The tapered portion is in the shape of an oblique cone, and the projection of the vertex of the oblique cone on the bottom surface thereof is located on the outer edge of the circle.

5. The gluing device according to claim 1, characterized in that: The end face of the glue coating nozzle is inclined to the cross section of the glue coating nozzle.

6. The gluing device according to claim 1, characterized in that: The cleaning nozzle includes a guide portion provided at the end of the cleaning nozzle, for guiding the cleaning agent sprayed from the cleaning nozzle to the gluing nozzle.

7. The gluing device according to claim 1, characterized in that: The cleaning agent is placed in a cleaning agent container, and the cleaning nozzle is connected to at least two cleaning agent containers via a fluid control device, so as to be used for cleaning the nozzle with at least two different cleaning agents.

8. The gluing device according to claim 7, characterized in that: The cleaning agent includes any one of nitrogen gas and photoresist thinner.

Images