Cooling device and cooling system

Abstract

A cooling device and a cooling system are provided. In the cooling device, a cold plate made of metal, a housing, a pump, a ground wire, and a conduction member are provided. The pump has a motor that drives an impeller and a circuit board that controls the motor. The circuit board is connected to the ground wire. The conduction member electrically connects the ground wire to the cold plate.

Description

TECHNICAL FIELD

[0001] The present application relates to a cooling device and a cooling system. BACKGROUND

[0002] A liquid-cooled cooling device is known, which has a circulation passage of a coolant, a heat receiving portion that causes the coolant to absorb heat of a temperature rising portion, a heat releasing portion that releases heat of the coolant, and a pump that circulates the coolant (Patent Literature 1).

[0003] In Patent Literature 1, it is described that the heat receiving portion is grounded, and that the grounded metal liquid contact portion is prevented from being electrified by static electricity or the like.

[0004] Patent Literature 1: Japanese Patent Application Publication No. 2012-058510

[0005] The cooling device of Patent Literature 1 does not describe how the heat receiving portion and the ground terminal are specifically connected. When mounted on an actual device, the treatment of the ground line becomes a problem. SUMMARY

[0006] The present application has been achieved in view of the above-described problems, and an object thereof is to provide a cooling device in which a heat receiving portion and a ground line are easily connected.

[0007] An exemplary cooling device of the present application has a cold plate that is made of metal and contacts a heat generating member, a housing that has a flow path through which a refrigerant passes in an internal space, a conductive member, and a connection member that connects one end of the conductive member and the cold plate. The other end of the conductive member is connected to a ground terminal.

[0008] An exemplary cooling system of the present application has the above-described cooling device, a heat sink, and a flow path tube that connects the cooling device and the heat sink, and through which a refrigerant flows. The heat sink is electrically connected to the ground terminal.

[0009] According to the exemplary present application, a cooling device and a cooling system in which a cold plate and a conductive member are easily connected are provided. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 is a schematic view of an exemplary cooling system of the present application.

[0011] Figure 2 is a perspective view of a cooling device of an exemplary first embodiment of the present application.

[0012] Figure 3 is a perspective view of a cold plate 11 of an exemplary first embodiment of the present application.

[0013] Figure 4 is a plan view of the circuit board 132 of the exemplary first embodiment of the present application.

[0014] Figure 5 is a perspective view of the cooling device 1 of the exemplary second embodiment of the present application.

[0015] Figure 6 is an enlarged perspective view of the cooling device 1 of the exemplary third embodiment of the present application, viewed from the side of the cold plate 11.

[0016] Figure 7 is an enlarged perspective view of the cooling device 1 of the exemplary fourth embodiment of the present application. DETAILED DESCRIPTION

[0017] In this specification, for easy understanding, a first direction X, a second direction Y, and a third direction Z perpendicular to each other are appropriately described. In addition, one side of the first direction X is described as a first direction X one side XI, and the other side of the first direction X is described as a first direction X other side X2. In addition, one side of the second direction Y is described as a second direction Y one side Yl, and the other side of the second direction Y is described as a second direction Y other side Y2. In addition, one side of the third direction Z is described as a third direction Z one side Zl, and the other side of the third direction Z is described as a third direction Z other side Z2. In addition, for convenience, sometimes the first direction X is described as a vertical direction. The first direction X one side XI indicates a lower direction, and the first direction X other side X2 indicates an upper direction. However, the vertical direction, the upper direction, and the lower direction are determined for convenience of explanation, and need not be consistent with the plumb direction. In addition, the vertical direction is defined only for convenience of explanation, and does not limit the orientation of the cooling device of the present application in use.

[0018] Figure 1 is a schematic view of the exemplary cooling system S of the present application. The cooling system S has the cooling device 1, the radiator 2, and the flow path tube 3. A refrigerant is filled in the cooling system S, and circulates between the cooling device 1 and the radiator 2 through the flow path tube 3. The cooling device 1 contacts a heat generating component, receives heat of the heat generating component, and exchanges heat with the refrigerant. The heat from the cooling device 1 moves to the radiator 2 through the flow path tube 3. Since the refrigerant passes through the radiator 2, the heat from the cooling device 1 is radiated to the outside. As the heat generating component, various heat generating components such as a microprocessor, a semiconductor element such as a power element, a light source of a projector, and the like, and the cooling device 1 is suitable for cooling of these heat generating components.

[0019] The cooling device 1 has a cold plate 11, a housing 12, a pump 13, and a conductive member 15. The pump 13 is connected to a ground terminal 14. In addition, the conductive member 15 connects the cold plate 11 and the ground terminal 14. The conductive member 15 is connected to the cold plate 11 by a connection member described later. The cold plate 11 is connected to the ground terminal 14 by the conductive member 15, whereby electric charges held by the cold plate 11 can flow to the ground terminal 14. The ground terminal 14 can be grounded. In addition, it can be connected to a ground terminal of a power supply circuit (not shown) mounted on an actual device such as a server.

[0020] (Embodiment 1)

[0021] Figure 2 is a perspective view of the cooling device 1 of the first exemplary embodiment of the present application. The cooling device 1 has a cold plate 11, a housing 12, a pump 13, and a conductive member 15. The cooling device 1 of the first exemplary embodiment is provided with the cold plate 11, the housing 12, and the pump 13 in this order from the first direction other side X2 toward the first direction one side XI.

[0022] The housing 12 has a space inside. A flow path for flowing of refrigerant is formed by the inside space of the housing 12 and a flow path portion 111 of the cold plate 11 described later. Heat transferred from the surface of the cold plate 11 on the first direction other side X2 is transferred to refrigerant flowing on the surface of the cold plate 11 on the first direction one side XI.

[0023] The pump 13 has a motor 131, a circuit board 132, and a ground wire 133. The motor 131 rotates an impeller (not shown) housed in the housing 12. The circuit board 132 mounts a plurality of electronic components (not shown) that control the motor 131. Refrigerant in the cooling system S circulates by rotation of the impeller. The ground wire 133 is connected to the circuit board 132 and is electrically connected to the motor 131 and the electronic components.

[0024] The cooling device 1 has the conductive member 15 that electrically connects the cold plate 11 and the ground wire 133. As an example, the conductive member 15 uses a lead wire. However, various members can be used instead of the lead wire as long as they are conductive plate-shaped members, conductive tapes, or the like.

[0025] Figure 3 is a perspective view of the cold plate 11 of the first exemplary embodiment of the present application. The cold plate 11 is a plate-shaped member made of metal. As an example of the material of the cold plate 11, a material having high thermal conductivity such as copper or aluminum is used. A heat generating member (not shown) is in contact with the surface of the cold plate 11 on the first direction other side X2. The cold plate 11 can be in direct contact with the heat generating member or can be in indirect contact via a member having high thermal conductivity.

[0026] A flow path 111 for refrigerant flow is provided on the surface of the cold plate 11 on one X1 side in the first direction. Multiple fins 112 extending toward the first X1 side are provided on the flow path 111. The multiple fins 112 are formed from the same component as the cold plate 11. More specifically, they are formed by a scraping process. By providing multiple fins 112, the contact area with the refrigerant is increased, and the heat exchange efficiency is improved.

[0027] The components constituting the cooling system S come into contact with the refrigerant through refrigerant circulation, thereby generating a transfer of charge. This transfer of charge results in the cold plate 11 becoming charged. Because the cold plate 11 is charged, impurities tend to accumulate within the cooling system S. In particular, due to the small gaps between the individual fins 112, the heat exchange efficiency decreases due to the accumulation of impurities in these gaps, resulting in reduced cooling performance of the heat-generating components.

[0028] By using the conductive component 15 to electrically connect the cold plate 11 to the grounding wire 133, the charge on the cold plate 11 flows to the grounding wire 133 via the conductive component 15. As a result, the charge on the cold plate 11 is reduced, and the accumulation of impurities in the cooling system S is reduced. Consequently, a decrease in heat exchange efficiency is prevented, thereby extending the lifespan of the cooling performance of the heat-generating components.

[0029] like Figure 2 As shown, one end of the conductive component 15 is connected to the cold plate 11. The other end of the conductive component 15 is connected to the circuit board 132. The conductive component 15 is connected to the circuit board 132 along one side of the outer peripheral surface of the housing 12.

[0030] Figure 4 This is a top view of a circuit board 132 according to an exemplary first embodiment of the present invention. The circuit board 132 has a first connection portion 1321, a second connection portion 1322, and a wiring portion 1323. A ground wire 133 is connected to the first connection portion 1321. A conductive member 15 is connected to the second connection portion 1322. The wiring portion 1323 connects the first connection portion 1321 and the second connection portion 1322. As an example, the first connection portion 1321 and the second connection portion 1322 use solder pads, and the connection between the ground wire 133 and the conductive member 15 is made, for example, by solder. Alternatively, instead of solder, a method could be considered where the first connection portion 1321 and the second connection portion 1322 are connector components connected to the ground wire 133 and the conductive member 15. Furthermore, as an example, the wiring portion 1323 uses a copper circuit pattern.

[0031] exist Figure 2In the illustrated embodiment, the circuit board 132 is shown as exposed for convenience, but is later filled with resin. As the resin, potting resin such as urethane resin, epoxy resin, or the like is used. By filling the circuit board 132 with resin, the connection portions of the electronic components, the ground wire 133, and the circuit board 132, and the connection portions of the conductive member 15 and the circuit board 132 are also filled with resin, and the water resistance is improved.

[0032] By connecting the conductive member 15 to the circuit board 132 and the ground wire 133 of the pump 13, a ground wire different from that of the motor 131 of the pump 13 can be omitted. In particular, since the conductive member 15 can be concentrated with respect to the cooling device 1, when the cooling device 1 is installed in an actual device, the problem of the conductive member 15 becoming an obstacle can be reduced.

[0033] (Embodiment 2)

[0034] Figure 5 is a perspective view of the cooling device 1 of the illustrated second embodiment of the present application. In addition, the second embodiment is the same as the first embodiment in configuration and effects, except for the connection method of the ground wire 133A and the conductive member 15A.

[0035] In the illustrated second embodiment, the conductive member 15A is connected to the middle portion of the ground wire 133A. More specifically, by connecting the connector 16 to the middle portion of the ground wire 133A, and further connecting the conductive member 15A to the connector 16, the conductive member 15A and the ground wire 133A are electrically connected to each other. As an example of the connector 16, a branch connector is used.

[0036] In the illustrated second embodiment, in the case where the circuit board 132 and the conductive member 15A cannot be connected due to a small mounting area of the circuit board 132, or the like, the ground wire 133A and the conductive member 15A can be electrically connected.

[0037] (Embodiment 3)

[0038] Figure 6 is an enlarged perspective view of the cooling device 1 of the illustrated third embodiment of the present application, viewed from the side of the cold plate 11. In addition, the third embodiment is the same as the other embodiments in configuration and effects, except for the connection method of the conductive member 15B.

[0039] The cooling device 1 of the third embodiment has the cold plate 11, the housing 12, and the fastening member 17. The cold plate 11 and the housing 12 are assembled by the fastening member 17. As an example, the fastening member 17 uses a screw. The fastening member 17 is assembled to the housing 12 by passing through the hole portion 113 of the cold plate 11 as shown. Figure 3

[0040] ​One end of the conductive member 15B is connected to the cold plate 11 and the fastening member 17. In detail, one end of the conductive member 15B is fixed by being sandwiched by the cold plate 11 and the fastening member 17. As an example, the conductive member 15B uses a member in which a circular terminal of a ring shape is attached to one end of a lead wire. Further, the circular terminal is fixed by being sandwiched with respect to the cold plate 11 by the head of the screw serving as the fastening member 17, and thus the cold plate 11 is electrically connected to the conductive member 15B.

[0041] Thus, the conductive member 15B can be connected and fixed with respect to the cold plate 11 which is a member in a plate shape. In addition, the fastening member 17 is a member that assembles the cold plate 11 and the housing 12, and the conductive member 15B can be connected to the cold plate 11 without using other members.

[0042] The other end of the conductive member 15B is preferably connected by the connection method to the ground wire 133 shown in other embodiments, but the same effect can be obtained as long as it is connected to a portion that becomes another ground terminal.

[0043] (Embodiment 4)

[0044] Figure 7 is an enlarged perspective view of the cooling device 1 of the exemplary fourth embodiment of the present application. In addition, the fourth embodiment is the same in configuration and effect as the other embodiments except for the connection method of the conductive member 15C.

[0045] As in the third embodiment, the cooling device 1 assembles the cold plate 11 and the housing 12 by the fastening member 17. One end of the conductive member 15C is disposed in a gap between the cold plate 11 and the housing 12. Further, one end of the conductive member 15C is sandwiched by the cold plate 11 and the housing 12 by assembling the cold plate 11 and the housing 12 by the fastening member 17. One end of the conductive member 15C is electrically connected by being in contact with the cold plate 11.

[0046] Thus, the conductive member 15C can be connected and fixed with respect to the cold plate 11 which is a member in a plate shape. In addition, the conductive member 15C can be connected to the cold plate 11 without using other members.

[0047] The other end of the conductive member 15B is preferably connected by the connection method to the ground wire 133 shown in other embodiments, but the same effect can be obtained as long as it is connected to a portion that becomes another ground terminal.

[0048] (Other Embodiments)

[0049] As an example, Figure 1The radiator 2 of the cooling system S shown is a radiator. The radiator 2 uses a metal such as copper or aluminum that has high thermal conductivity. The refrigerant flows inside the radiator 2, but the radiator 2 also carries an electric charge. As shown in FIG. 2, by connecting a ground terminal 21 to the radiator 2, the electric charge of the radiator 2 can be discharged. Figure 1

[0050] The above describes embodiments of the present application (including modifications) with reference to the drawings. However, the present application is not limited to the above-described embodiments, and can be implemented in various ways without departing from the gist thereof. In addition, various applications can be formed by appropriately combining the plurality of constituent elements disclosed in the above-described embodiments. For example, several constituent elements can be deleted from all of the constituent elements shown in the embodiments. For example, the constituent elements of different embodiments can be appropriately combined. For easy understanding, the drawings schematically show each constituent element as the main subject, and the thickness, length, number, interval, and the like of each constituent element shown in the drawings are sometimes different from the actual ones for the convenience of drawing. In addition, the material, shape, size, and the like of each constituent element shown in the above-described embodiments are one example, and are not particularly limited, and various changes can be made within a range that does not substantially depart from the effects of the present application.

[0051] Industrial Applicability

[0052] The present application can be used in a cooling device, for example.​

Claims

1. A cooling device comprising: Cold plate, which is made of metal, is in contact with the heat-generating components; and The outer casing has a flow path for the refrigerant to pass through the internal space. Its features are, The cooling device also has: Conducting components; as well as A connecting component that connects one end of the conductive component to the cold plate. The other end of the conductive component is connected to the ground terminal. The connecting component is a fastening component used to assemble the cold plate and the outer shell. The fastening components are arranged from the cold plate side along the direction in which the cold plate and the outer casing are opposite to each other. The fastening component includes an end that is spaced apart from the cold plate in the direction in which the cold plate and the outer casing are opposite to each other. One end of the conductive component is disposed in the gap and is clamped and fixed by the end and the cold plate. The cooling device also includes a pump. The pump has: A motor, which makes the impeller rotate; A circuit board, which houses electronic components for controlling the motor; and A grounding wire, one end of which is connected to the circuit board, and the other end of which is connected to the grounding terminal. The conductive component is connected to the circuit board and electrically connected to the grounding wire via the circuit board. Alternatively, the conductive component can be connected to the grounding wire.

2. A cooling device comprising: Cold plate, which is made of metal, is in contact with the heat-generating components; and The outer casing has a flow path for the refrigerant to pass through the internal space. Its features are, The cooling device also has: Conducting components; as well as A connecting component that connects one end of the conductive component to the cold plate. The other end of the conductive component is connected to the ground terminal. The cold plate and the outer casing are assembled using fastening components. The connecting component is the outer casing. The conductive component is fixed by clamping one end between the housing and the cold plate through the fastening components. The cooling device also includes a pump. The pump has: A motor, which makes the impeller rotate; A circuit board, which houses electronic components for controlling the motor; and A grounding wire, one end of which is connected to the circuit board, and the other end of which is connected to the grounding terminal. The conductive component is connected to the circuit board and electrically connected to the grounding wire via the circuit board. Alternatively, the conductive component can be connected to the grounding wire.

3. The cooling device according to claim 1 or 2, characterized in that, The circuit board has: The first connection part is connected to the grounding wire; The second connecting part is connected to the conductive component; and The wiring section connects the first connecting section and the second connecting section.

4. A cooling system comprising: The cooling device according to any one of claims 1 to 3; Radiators; and A flow path pipe connects the cooling device and the radiator, and this flow path pipe allows refrigerant to flow within it. Its features are, The heat sink is electrically connected to the grounding terminal.

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