Substrate processing method and substrate processing apparatus
By moving the nozzle in the substrate processing apparatus and using a camera to monitor the nozzle position changes, the problem of misjudgment in nozzle dripping and outflow detection is solved, thus achieving reliability and accuracy in substrate processing.
Patent Information
- Application Number
- CN202180040992.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-06-08
- Filing Date
- 2021-05-28
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2041-05-28
AI Technical Summary
In substrate processing devices, existing technologies cannot effectively detect whether the nozzle is still dripping or flowing out after the valve is closed, especially when the nozzle position changes or multiple nozzles are switched, which can easily lead to misjudgment of leakage.
By holding the substrate and moving the nozzle after the valve is closed, using a camera to capture image data, tracking changes in nozzle position, setting a judgment zone, and monitoring the dripping or outflow of the treatment liquid.
Proper detection of nozzle dripping and outflow ensures the reliability and accuracy of substrate processing.
Smart Images

Figure CN115668461B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a substrate processing method and a substrate processing apparatus. Background Technology
[0002] In the manufacturing processes of semiconductor equipment, various processing solutions such as pure water, photoresist, and etching solution are supplied to substrates for cleaning, photoresist coating, and etching. As an apparatus for processing substrates using these processing solutions, a substrate processing apparatus is widely used that rotates the substrate in a horizontal position while dispensing the processing solution from a nozzle onto the surface of the substrate.
[0003] In this substrate processing apparatus, a nozzle is connected to a processing liquid supply source via piping, and a valve is installed on the piping. The valve is controlled by a control unit; an open signal from the control unit opens the valve, and a closed signal from the control unit closes the valve. By opening the valve, processing liquid is dispensed from the nozzle; by closing the valve, the dispensing of processing liquid from the nozzle stops.
[0004] In such a substrate processing apparatus, an imaging unit such as a camera is proposed to monitor the discharge of processing liquid from the nozzle (Patent Documents 1, 2). The imaging unit sequentially captures images of the imaging area including the nozzle tip to obtain image data. The image processing unit receives the image data and determines whether processing liquid is being discharged from the nozzle based on the pixel values in the image data set in a determination area lower than the nozzle.
[0005] Existing technical documents
[0006] Patent documents
[0007] Patent Document 1: Japanese Patent No. 2008-135679
[0008] Patent Document 2: Japanese Patent No. 2015-173148 Summary of the Invention
[0009] The problem that the invention aims to solve
[0010] By closing the valve, the discharge of the treatment fluid from the nozzle stops. Sometimes, droplets of treatment fluid may fall from the nozzle when this discharge stops. This droplet-like falling is also called dripping. Additionally, due to valve malfunctions, a continuous flow of fine treatment fluid may occur from the nozzle. This flow of treatment fluid is also called outflow.
[0011] To detect leaks (including dripping and outflow) of such treatment fluid, it is advisable to continue monitoring the nozzle even after the valve is closed.
[0012] Additionally, sometimes the nozzle is moved after a valve is closed. When the nozzle moves, its position changes within the image data acquired by the imaging unit. When the nozzle's position changes within the image data, the processed liquid from the nozzle may shift from the detection area within the image data. In this case, based on the pixel values within the detection area, it is impossible to monitor for dispensing anomalies such as dripping or overflow, and leakage cannot be detected.
[0013] Furthermore, substrate processing apparatuses sometimes have multiple nozzles. For example, sometimes after the first nozzle finishes dispensing processing liquid, the second nozzle begins dispensing processing liquid while the first nozzle is moved. In this case, when processing liquid from the second nozzle enters the determination area within the image data, it is possible to mistakenly detect the processing liquid as leakage.
[0014] Therefore, this application was made in view of the above-mentioned problems, and its purpose is to provide a technology that can still properly monitor leakage from the nozzle even after a valve is closed.
[0015] Solution for solving the problem
[0016] A first embodiment of the substrate processing method includes: a holding step, holding a substrate; a first dispensing step, outputting an open signal to a valve provided in a supply pipe, dispensing processing liquid from the tip of a first nozzle connected to the supply pipe toward the main surface of the substrate; a moving step, moving the first nozzle after a time point when a closed signal is output to the valve; an image capturing step, at least after the time point when a closed signal is output to the valve, sequentially capturing images of a predetermined area including the tip of the first nozzle using a camera, acquiring multiple image data; a setting step, detecting the position of the first nozzle in each of the multiple image data, tracking the positional change of the first nozzle among the multiple image data, and setting a determination area lower than the tip of the first nozzle; and a leakage monitoring step, monitoring the presence or absence of processing liquid falling from the tip of the first nozzle based on pixels in the determination area in each of the multiple image data.
[0017] A second embodiment of the substrate processing method is based on the first embodiment of the substrate processing method, wherein the first nozzle is raised during the aforementioned moving step.
[0018] A third embodiment of the substrate processing method, based on the second embodiment, further includes a second ejection step. In this second ejection step, processing liquid is ejected from the second nozzle onto the main surface of the substrate while the first nozzle is raised. In the leakage monitoring step, the rise of the first nozzle is tracked in the image data acquired by the camera during the second ejection step to set the determination area, thereby avoiding processing liquid reaching the main surface of the substrate from the tip of the second nozzle.
[0019] A substrate processing apparatus includes: a substrate holding section for holding a substrate; a nozzle connected to a supply pipe provided at a valve for discharging processing liquid supplied through the supply pipe to the main surface of the substrate held by the substrate holding section; a moving mechanism for moving the nozzle; a camera for capturing images of a predetermined area including the tip of the nozzle; and a control unit that outputs an open signal to the valve to discharge processing liquid from the tip of the nozzle to the main surface of the substrate, and after a time point when a closed signal is output to the valve, moves the nozzle using the moving mechanism, detects the position of the nozzle in each of a plurality of image data sequentially acquired by the camera at least after the time point when the closed signal is output to the valve, tracks the position change of the nozzle between the plurality of image data, sets a determination area lower than the tip of the nozzle, and monitors the presence or absence of processing liquid falling from the tip of the nozzle based on pixels in the determination area in each of the plurality of image data.
[0020] Invention Effects
[0021] Based on the substrate processing method and substrate processing apparatus, leakage can be appropriately detected. Attached Figure Description
[0022] Figure 1 This is a diagram that schematically illustrates an example of the overall structure of a substrate processing apparatus.
[0023] Figure 2 This is a top view that roughly represents an example of the structure of a processing unit.
[0024] Figure 3 This is a side view that roughly represents an example of the structure of a processing unit.
[0025] Figure 4 This is a top view that roughly represents an example of the movement path of the nozzle.
[0026] Figure 5 This is a function block diagram illustrating an example of the internal structure of the control unit.
[0027] Figure 6 This is a flowchart illustrating an example of the actions of a processing unit.
[0028] Figure 7 This is a flowchart illustrating an example of a specific step in the liquid treatment process.
[0029] Figure 8 This is a flowchart representing a specific example of monitoring and processing.
[0030] Figure 9 This is a diagram that roughly represents an example of captured image data.
[0031] Figure 10 This is a diagram that roughly represents an example of captured image data.
[0032] Figure 11 This is a diagram that roughly represents an example of captured image data.
[0033] Figure 12 This is a diagram that roughly represents an example of captured image data.
[0034] Figure 13 This is a diagram that roughly illustrates an example of how droplets of the treatment liquid fall.
[0035] Figure 14 This is a diagram that roughly represents an example of captured image data. Detailed Implementation
[0036] The embodiments will now be described with reference to the accompanying drawings. Furthermore, the drawings are schematic representations, and for ease of explanation, structures have been appropriately omitted or simplified. Additionally, the sizes and relative positions of the structures shown in the drawings are not necessarily accurately depicted, but rather appropriately altered.
[0037] Furthermore, in the following descriptions, the same symbols are used to illustrate the same components, as are their names and functions. Therefore, detailed descriptions are sometimes omitted to avoid repetition.
[0038] Furthermore, in the following description, even when sequence numbers such as "first" or "second" are used, these terms are used for convenience in order to facilitate understanding of the implementation method, and are not limited to the order that can be generated by these sequence numbers.
[0039] Expressions indicating relative or absolute positional relationships (e.g., "towards a direction," "along a direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) unless otherwise specified, not only strictly indicate the positional relationship but also indicate a state of relative displacement in angle or distance within the tolerance or to which equivalent functionality can be obtained. Expressions indicating equality (e.g., "same," "equal," "homogeneous," etc.) unless otherwise specified, not only indicate a state of quantitative and strict equality but also indicate a state of difference with tolerance or to which equivalent functionality can be obtained. Expressions indicating shape (e.g., "quadrilateral" or "cylindrical," etc.) unless otherwise specified, not only strictly indicate the shape geometrically but also indicate a shape with features such as concavity, convexity, chamfering, etc., within the range where equivalent effects can be obtained. Expressions such as "possess," "have," "have," "include," or "contain" a constituent element are not exclusive expressions that exclude the existence of other constituent elements. The expression “at least one of A, B, and C” includes: only A; only B; only C; any two of A, B, and C; and all of A, B, and C.
[0040] <Overall Structure of the Substrate Processing Device>
[0041] Figure 1 This is a top view illustrating an example of the internal configuration of the substrate processing apparatus 100 in this embodiment. Figure 1 As exemplified, the substrate processing apparatus 100 is a monolithic processing apparatus that processes substrates W, which are the objects of processing, one by one.
[0042] In this embodiment, the substrate processing apparatus 100 cleans the circular thin-plate silicon substrate, i.e., the substrate W, using a rinsing solution such as a chemical solution and pure water, and then dries it.
[0043] For example, a mixture of ammonia and hydrogen peroxide water (SC1), a mixed aqueous solution of hydrochloric acid and hydrogen peroxide water (SC2), or DHF solution (dilute hydrofluoric acid) can be used as the above-mentioned solution.
[0044] In the following description, chemical solutions, rinsing solutions, and organic solvents are collectively referred to as "processing solutions". In addition, chemical solutions used to remove unwanted films or used for etching are also included in "processing solutions".
[0045] The substrate processing apparatus 100 includes multiple processing units 1, a loading port LP, an indexing robot 102, a main transport robot 103, and a control unit 9.
[0046] As a carrier, a FOUP (Front Opening Unified Pod), an SMIF (Standard Mechanical Interface) wafer cassette that houses the substrate W in a sealed space, or an OC (Open Cassette) that exposes the substrate W to external gas can be used. In addition, a transfer robot transfers the substrate W between the carrier and the main transfer robot 103.
[0047] Processing unit 1 performs liquid processing and drying processing on a substrate W. The substrate processing apparatus 100 of this embodiment is equipped with 12 processing units 1 of the same structure.
[0048] Specifically, four towers, each containing three processing units 1 stacked in the vertical direction, are configured to surround the main transport robot 103.
[0049] exist Figure 1 The diagram shows, in a schematic representation, one of the three overlapping processing units 1. Furthermore, the number of processing units 1 in the substrate processing apparatus 100 is not limited to 12 and can be adapted accordingly.
[0050] The main transfer robot 103 is positioned at the center of the four towers on which the processing units 1 are stacked. The main transfer robot 103 moves the substrate W, which is the object of processing, received from the indexing robot 102, into each processing unit. In addition, the main transfer robot 103 removes the processed substrate W from each processing unit 1 and hands it over to the indexing robot 102. The control unit 9 controls the operation of each structural component of the substrate processing apparatus 100.
[0051] The following description will focus on one of the 12 processing units 1 mounted on the substrate processing apparatus 100, but the other processing units 1 have the same configuration except for the different arrangement of the nozzles.
[0052] <Processing Unit>
[0053] Next, processing unit 1 will be described. Hereinafter, one of the 12 processing units 1 mounted on the substrate processing apparatus 100 will be described. Figure 2 This is a top view that schematically represents an example of the structure of processing unit 1. Additionally, Figure 3 This is a longitudinal sectional view that schematically represents an example of the structure of processing unit 1.
[0054] The processing unit 1 includes, as an example, a rotating chuck 20, a nozzle 30, a nozzle 60, a nozzle 65, a fixed nozzle 80, a processing cup 40, and a camera 70 within the chamber 10.
[0055] The chamber 10 includes a side wall 11 along the vertical direction, a top wall 12 that closes the upper side of the space enclosed by the side wall 11, and a bottom wall 13 that closes the lower side. The space enclosed by the side wall 11, top wall 12, and bottom wall 13 is a processing space. In addition, a portion of the side wall 11 of the chamber 10 is provided with an inlet / outlet for the main transport robot 103 to move the substrate W in / out, and a gate for opening and closing the inlet / outlet (both omitted from the figure).
[0056] A fan filter unit (FFU) 14 is installed on the top wall 12 of the chamber 10. The fan filter unit 14 is used to further purify the air in the cleanroom where the substrate processing apparatus 100 is located and supply it to the processing space within the chamber 10. The fan filter unit 14 includes a fan and a filter (e.g., a HEPA (High Efficiency Particulate Air) filter) for introducing air from the cleanroom and delivering it to the chamber 10, and forms a downward flow of clean air in the processing space within the chamber 10. In order to evenly distribute the clean air supplied from the fan filter unit 14, a perforated plate with multiple blowout holes can also be provided directly below the top wall 12.
[0057] The rotary chuck 20 holds the substrate W in a horizontal position. A horizontal position means that the normal to the substrate W is along the vertical direction. The rotary chuck 20 includes a circular plate-shaped rotating base 21 fixed horizontally to the upper end of a rotating shaft 24 extending in the vertical direction. A rotary motor 22 is provided below the rotating base 21 to rotate the rotating shaft 24. The rotary motor 22 rotates the rotating base 21 in the horizontal plane via the rotating shaft 24. Additionally, a cylindrical outer casing is provided to surround the rotary motor 22 and the rotating shaft 24.
[0058] The outer diameter of the circular rotating base 21 is slightly larger than the diameter of the circular substrate W held in the rotating chuck 20. Therefore, the rotating base 21 has an upper surface 21a that faces the entire lower surface of the substrate W to be held.
[0059] A plurality of chuck pins 26 (four in this embodiment) are erected on the periphery of the upper surface 21a of the rotating base 21. The plurality of chuck pins 26 are arranged at equal intervals (90° intervals if there are four chuck pins 26 in this embodiment) along a circumference corresponding to the periphery of the circular substrate W. Each chuck pin 26 is configured to be driven between a holding position abutting against the periphery of the substrate W and an open position away from the periphery of the substrate W. The plurality of chuck pins 26 are driven in conjunction with a linkage mechanism (not shown) housed within the rotating base 21. By stopping the plurality of chuck pins 26 in their respective abutting positions, the rotating chuck 20 can hold the substrate W above the rotating base 21 in a horizontal position close to the upper surface 21a (see reference 2000). Figure 3 Furthermore, by stopping the multiple chuck pins 26 in their respective open positions, the holding of the substrate W can be released.
[0060] The lower end of the outer cover component 23 covering the rotary motor 22 is fixed to the bottom wall 13 of the chamber 10, and the upper end reaches directly below the rotating base 21. A flange-shaped component 25 is provided at the upper end of the outer cover component 23. This flange-shaped component 25 protrudes approximately horizontally outward from the outer cover component 23 and extends downward. With the rotary chuck 20 holding the substrate W by a plurality of chuck pins 26, the rotary motor 22 rotates the rotation shaft 24, thereby enabling the substrate W to rotate about a rotation axis CX passing through the center of the substrate W and in the vertical direction. Furthermore, the drive of the rotary motor 22 is controlled by the control unit 9.
[0061] The nozzle 30 is configured such that a discharge head 31 is mounted on the front end of the nozzle arm 32. The base end of the nozzle arm 32 is fixedly connected to the nozzle base 33. The nozzle base 33 can rotate about an axis along the vertical direction via a motor (not shown). Rotation of the nozzle base 33, as... Figure 2 As indicated by arrow AR34, the nozzle 30 moves in an arc within the space above the rotating chuck 20. These nozzle arms 32, nozzle base 33, and motor are examples of the moving mechanism 37 that moves the nozzle 30.
[0062] Figure 4 This is a top view that roughly represents an example of the movement path of nozzle 30. (Example) Figure 4 As an example, the discharge head 31 of the nozzle 30 moves circumferentially around the nozzle base 33 by rotation of the nozzle base 33. The nozzle 30 can stop at the appropriate position. Figure 4 In the example, nozzle 30 can stop at each of the central position P31, the peripheral position P32, and the standby position P33.
[0063] The central position P31 is the position where the nozzle 31 is vertically opposed to the center of the substrate W held in the rotating chuck 20. When the nozzle 30 located at the central position P31 ejects processing liquid onto the main surface (upper surface) of the rotating substrate W, the processing liquid falls onto the center of the upper surface of the substrate W and is spread across the entire upper surface of the substrate W by centrifugal force, and then disperses outward from the periphery of the substrate W. Thus, processing liquid can be supplied to the entire upper surface of the substrate W, and processing can be applied to the entire upper surface of the substrate W.
[0064] Peripheral position P32 is the position where the ejector head 31 and the peripheral portion of the substrate W held in the rotating chuck 20 are vertically opposed. When the nozzle 30 located at peripheral position P32 ejects processing liquid onto the upper surface of the rotating substrate W, the processing liquid falls onto the peripheral portion of the upper surface of the substrate W and is moved to the peripheral side of the substrate W by centrifugal force, and then disperses to the outside from the periphery of the substrate W. Thus, processing liquid can be supplied only to the peripheral portion of the upper surface of the substrate W, and only the peripheral portion of the substrate W can be processed (so-called edge processing).
[0065] Alternatively, the nozzle 30 can also spray processing liquid onto the upper surface of the rotating substrate W while moving back and forth between the central position P31 and the peripheral position P32. In this case, the entire upper surface of the substrate W can be processed.
[0066] Furthermore, the nozzle 30 may not discharge treatment fluid at the peripheral position P32. For example, the peripheral position P32 may also be a relay position where the nozzle 30 temporarily goes into standby mode when it moves from the central position P31 to the standby position P33.
[0067] The standby position P33 is a position in which the ejector head 31 and the base plate W held in the rotating chuck 20 are not vertically opposed. In the standby position P33, a standby box for accommodating the ejector head 31 of the nozzle 30 may also be provided.
[0068] Additionally, the nozzle 30 is height-adjustable. The nozzle 30 is height-adjustable via a nozzle lifting mechanism (not shown), for example, built into the nozzle base 63. The nozzle lifting mechanism includes, for example, a ball screw configuration. The nozzle 30 can also stop, for example, at a central upper position P36, which is vertically above the central position P31.
[0069] like Figure 3 As an example, nozzle 30 is connected to a processing fluid supply source 36 via a supply pipe 34. A valve 35 is provided in the supply pipe 34. The valve 35 opens and closes the flow path of the supply pipe 34. When the valve 35 is open, processing fluid from the processing fluid supply source 36 is supplied to nozzle 30 through the supply pipe 34 and is ejected from the front end of nozzle 30.
[0070] In addition, such as Figure 2 As exemplified, in addition to the nozzle 30 described above, the processing unit 1 of this embodiment is also provided with a nozzle 60 and a nozzle 65. The nozzles 60 and 65 of this embodiment have the same structure as the nozzle 30 described above. That is, the nozzle 60 is configured such that a discharge head 61 is mounted on the front end of the nozzle arm 62. The nozzle 60 can move in an arc shape in the space above the rotating chuck 20 between a central position opposite to the center of the substrate W and a standby position further outward than the substrate W, as shown by arrow AR64, via a nozzle base 63 connected to the base end side of the nozzle arm 62.
[0071] Similarly, the nozzle 65 is configured to have a discharge head 66 mounted on the front end of the nozzle arm 67. The nozzle 65 can move in an arc shape in the space above the rotating chuck 20 between a central position opposite to the center of the substrate W and a standby position further outward than the substrate W, as shown by arrow AR69, via a nozzle base 68 connected to the base end side of the nozzle arm 67.
[0072] In addition, nozzles 60 and 65 can also be configured to be height-adjustable.
[0073] Nozzle 60 and nozzle 65 are connected to a treatment fluid supply source (not shown) via supply pipes (not shown), similar to nozzle 30. Each supply pipe is equipped with a valve (not shown), which switches the supply / stop of the treatment fluid by opening and closing the valves. Furthermore, nozzle 60 and nozzle 65 can also be configured to supply multiple treatment fluids, including at least pure water.
[0074] Alternatively, at least one of nozzles 30, 60, and 65 can be a dual-fluid nozzle that mixes a cleaning solution such as pure water with pressurized gas to generate droplets, and then sprays the mixture of droplets and gas onto the substrate W. Furthermore, the number of nozzles provided in the processing unit 1 is not limited to three; one or more is sufficient.
[0075] exist Figure 2 and Figure 3 In this example, the processing unit 1 is also provided with a fixed nozzle 80. The fixed nozzle 80 is located above the rotary chuck 20 and radially outward from the periphery of the rotary chuck 20. As a more specific example, the fixed nozzle 80 is positioned facing the processing cup 40 described later in the vertical direction. The outlet of the fixed nozzle 80 faces the substrate W, and its opening axis is, for example, along the horizontal direction. The fixed nozzle 80 also dispenses a processing liquid (e.g., pure water) onto the upper surface of the substrate W held in the rotary chuck 20. The processing liquid dispensed from the fixed nozzle 80 falls, for example, onto the central portion of the upper surface of the substrate W.
[0076] like Figure 3 As illustrated, the fixed nozzle 80 is connected to the processing fluid supply source 83 via a supply pipe 81. A valve 82 is provided in the supply pipe 81. The valve 82 opens and closes the flow path of the supply pipe 81. When the valve 82 is open, the processing fluid from the processing fluid supply source 83 is supplied to the fixed nozzle 80 through the supply pipe 81 and is ejected from the front end of the fixed nozzle 80.
[0077] The processing cup 40 surrounding the rotary chuck 20 includes an inner cup 41, a middle cup 42, and an outer cup 43 that can be raised and lowered independently. The inner cup 41 surrounds the rotary chuck 20 and has a shape that is approximately rotationally symmetrical with respect to a rotation axis CX held at the center of the base plate W of the rotary chuck 20. The inner cup 41 integrally includes: a bottom 44 in a circular shape when viewed from above; a cylindrical inner wall portion 45 that rises upward from the inner periphery of the bottom 44; a cylindrical outer wall portion 46 that rises upward from the outer periphery of the bottom 44; a first guide portion 47 that rises upward from between the inner wall portion 45 and the outer wall portion 46 and whose upper end extends obliquely upward towards the center (near the rotation axis CX held at the base plate W of the rotary chuck 20) along a smooth arc; and a cylindrical middle wall portion 48 that rises upward from between the first guide portion 47 and the outer wall portion 46.
[0078] The inner wall portion 45 is formed to a length such that, when the inner cup 41 is raised to its highest position, it is accommodated between the outer cover member 23 and the flange member 25 with an appropriate gap. The middle wall portion 48 is formed to a length such that, when the inner cup 41 and the middle cup 42 are closest, it is accommodated between the second guide portion 52 of the middle cup 42 (described later) and the processing liquid separation wall 53 with an appropriate gap.
[0079] The first guide portion 47 has an upper end portion 47b that extends obliquely upward toward the center (in the direction close to the rotation axis CX of the substrate W) along a smooth arc. Furthermore, a waste tank 49 for collecting and discarding used processing fluid is located between the inner wall portion 45 and the first guide portion 47. An annular inner recovery tank 50 for collecting and recycling used processing fluid is located between the first guide portion 47 and the middle wall portion 48. Further, an annular outer recovery tank 51 for collecting and recycling processing fluid of a different type than that in the inner recovery tank 50 is located between the middle wall portion 48 and the outer wall portion 46.
[0080] A venting and drainage mechanism (not shown) is connected to the waste tank 49 for discharging the treated liquid collected in the waste tank 49 and forcibly venting the waste tank 49. For example, four venting and drainage mechanisms are arranged at equal intervals along the circumference of the waste tank 49. Additionally, recovery mechanisms (not shown) are connected to the inner recovery tank 50 and the outer recovery tank 51, respectively, for recovering the treated liquid collected in the inner and outer recovery tanks 50 to a recovery tank located outside the processing unit 1. Furthermore, the bottoms of the inner and outer recovery tanks 50 and 51 are slightly inclined relative to the horizontal direction, and the recovery mechanism is connected at the lowest position. Thus, the treated liquid flowing into the inner and outer recovery tanks 50 and 51 is smoothly recovered.
[0081] The middle cup 42 surrounds the rotary chuck 20 and has a shape that is approximately rotationally symmetrical with respect to the axis of rotation CX held at the center of the base plate W of the rotary chuck 20. The middle cup 42 integrally includes a second guide portion 52 and a cylindrical processing liquid separation wall 53 connected to the second guide portion 52.
[0082] The second guide portion 52 has the following features on the outer side of the first guide portion 47 of the inner cup 41: a lower end portion 52a that forms a coaxial cylindrical shape with the lower end portion of the first guide portion 47; an upper end portion 52b that extends obliquely upward from the upper end portion 52a along a smooth arc towards the center (in the direction close to the rotation axis CX of the substrate W); and a folded-back portion 52c formed by folding the front end portion of the upper end portion 52b downward. When the inner cup 41 and the middle cup 42 are in their closest position, the lower end portion 52a is received within the inner recovery groove 50 with an appropriate gap between the first guide portion 47 and the middle wall portion 48. Furthermore, the upper end portion 52b is configured to overlap the upper end portion 47b of the first guide portion 47 of the inner cup 41 in the vertical direction, and when the inner cup 41 and the middle cup 42 are in their closest position, it approaches the upper end portion 47b of the first guide portion 47 with a very small gap. Furthermore, the folded portion 52c formed by folding the front end of the upper end 52b downward has the following length: when the inner cup 41 and the middle cup 42 are closest, the folded portion 52c overlaps with the front end of the upper end 47b of the first guide portion 47 in the horizontal direction.
[0083] Furthermore, the upper end portion 52b of the second guide portion 52 is formed with a wall thickness that increases towards the bottom, and the processing liquid separation wall 53 has a cylindrical shape that extends downward from the lower outer periphery of the upper end portion 52b. The processing liquid separation wall 53 is accommodated in the outer recovery tank 51 with an appropriate gap between the middle wall portion 48 and the outer cup 43 when the inner cup 41 and the middle cup 42 are in the closest possible position.
[0084] The outer cup 43 surrounds the rotating chuck 20 outside the second guide portion 52 of the middle cup 42, and has a shape that is approximately rotationally symmetrical with respect to the rotation axis CX held at the center of the base plate W of the rotating chuck 20. The outer cup 43 functions as a third guide portion. The outer cup 43 has: a lower end portion 43a that is coaxially cylindrical with the lower end portion 52a of the second guide portion 52; an upper end portion 43b that extends obliquely upward from the upper end portion 43a along a smooth arc towards the center (in the direction close to the rotation axis CX of the base plate W); and a folded-back portion 43c formed by folding the front end portion of the upper end portion 43b downward.
[0085] When the inner cup 41 and outer cup 43 are in the closest position, the lower end portion 43a is accommodated in the outer recovery tank 51 with an appropriate gap between the processing liquid separation wall 53 of the middle cup 42 and the outer wall portion 46 of the inner cup 41. Furthermore, the upper end portion 43b is configured to overlap with the second guide portion 52 of the middle cup 42 in the vertical direction, and when the middle cup 42 and outer cup 43 are in the closest position, it approaches the upper end portion 52b of the second guide portion 52 with a very small gap. Further, the folded-back portion 43c formed by folding the front end portion of the upper end portion 43b downwards is configured such that when the middle cup 42 and outer cup 43 are in the closest position, the folded-back portion 43c overlaps with the folded-back portion 52c of the second guide portion 52 in the horizontal direction.
[0086] Furthermore, the inner cup 41, the middle cup 42, and the outer cup 43 can be raised and lowered independently of each other. That is, the inner cup 41, the middle cup 42, and the outer cup 43 are each provided with an independent cup lifting mechanism (illustration omitted), thereby raising and lowering them individually and independently. Such a cup lifting mechanism can be, for example, various known mechanisms such as ball screw mechanisms and cylinders.
[0087] The partition plate 15 is configured to vertically divide the inner space of the chamber 10 around the processing cup 40. The partition plate 15 can be a single plate-shaped component surrounding the processing cup 40, or it can be a plate formed by joining multiple plate-shaped components. In addition, the partition plate 15 can be formed with through holes or cuts in the thickness direction. In this embodiment, a through hole is formed for a support shaft to pass through, which supports the nozzle base 33 of the nozzle 30, the nozzle base 63 of the nozzle 60, and the nozzle base 68 of the nozzle 65.
[0088] The outer peripheral end of the partition plate 15 is connected to the side wall 11 of the chamber 10. Furthermore, the edge of the partition plate 15 surrounding the processing cup 40 is formed into a circular shape with a diameter larger than the outer diameter of the outer cup 43. Therefore, the partition plate 15 does not obstruct the raising and lowering of the outer cup 43.
[0089] Additionally, an exhaust pipe 18 is provided on a portion of the side wall 11 of the chamber 10 and near the bottom wall 13. The exhaust pipe 18 is connected to an exhaust mechanism (not shown). Air from the clean air supplied from the fan filter unit 14 and flowing downward within the chamber 10, passing between the treatment cup 40 and the partition plate 15, is discharged outside the device through the exhaust pipe 18.
[0090] Camera 70 is disposed within chamber 10 and above partition plate 15. Camera 70 includes, for example, an optical system such as a CCD (Charge Coupled Device) as a solid-state imaging element and a lens. Camera 70 is provided, for example, to monitor the discharge state of the processing liquid from nozzle 30. The imaging area of camera 70 includes substrate W and space above substrate W. This imaging area includes, for example, the tip of nozzle 30 when stopped at the central position P31, and also the tip of nozzle 30 when stopped at the upper central position P36. Camera 70 captures images of the imaging area, obtains image data, and sequentially outputs the acquired image data to control unit 9.
[0091] like Figure 3 As shown, an illumination unit 71 is provided inside the chamber 10 and above the partition plate 15. When the chamber 10 is a dark room, the control unit 9 can also control the illumination unit 71 to illuminate the chamber 71 when the camera 70 is taking pictures.
[0092] The hardware structure of the control unit 9 in the board processing apparatus 100 is the same as that of a conventional computer. That is, the control unit 9 is configured to include: a processing unit such as a CPU that performs various arithmetic operations; a temporary storage medium such as a read-only memory (ROM) that stores the basic program; a read-write memory (RAM) that stores various information; and a non-temporary storage medium such as a disk that stores control software or data. The CPU of the control unit 9 executes a predetermined processing program, thereby controlling the various operating mechanisms of the board processing apparatus 100 to perform processing. Furthermore, the functions of the control unit 9 can also be implemented using dedicated hardware circuitry that does not require software.
[0093] Figure 5 This is a functional block diagram that schematically represents an example of the internal structure of the control unit 9. The control unit 9 includes a monitoring and processing unit 91, a determination area setting unit 92, and a processing control unit 93.
[0094] The processing control unit 93 controls the various structures within the control chamber 10. Specifically, the processing control unit 93 controls the rotary motor 22, various valves such as valves 35 and 82, the motors of nozzle bases 33, 63, and 68, the nozzle lifting mechanism, the cup lifting mechanism, and the fan filter unit 14. The processing control unit 93 controls these structures in a predetermined sequence, thereby enabling the processing unit 1 to process the substrate W.
[0095] The monitoring and processing unit 91 monitors and processes the image data obtained by the camera 70 from capturing images inside the chamber 10. Specifically, for example, the camera 70 captures images of a predetermined area including the front end of the nozzle 30 to obtain image data, and the monitoring and processing unit 91 monitors the discharge status of the treatment liquid from the nozzle 30 based on the captured image data.
[0096] The determination area setting unit 92 sets a determination area in the captured image data for determining the discharge state of the processing liquid from the nozzle 30. The determination area will be described in detail later.
[0097] <An example of a substrate processing procedure>
[0098] <Overall Process>
[0099] Figure 6 This is a flowchart illustrating an example of a substrate processing procedure. First, the main transport robot 103 transports the unprocessed substrate W into the processing unit 1 (step S1: transport process). Then, the rotating chuck 20 holds the substrate W in a horizontal position (step S2: holding process). Specifically, multiple chuck pins 26 move to their respective abutment positions, thereby holding the substrate W with the multiple chuck pins 26.
[0100] Then, the rotary motor 22 begins to rotate the substrate W (step S3: rotation process). Specifically, the rotary motor 22 rotates the rotary chuck 20, thereby rotating the substrate W held on the rotary chuck 20. Then, the cup lifting mechanism raises the processing cup 40 (step S4: cup lifting process). As a result, the processing cup 40 stops at the upper position.
[0101] Then, a processing liquid is sequentially supplied to the substrate W (step S5: processing liquid process). Furthermore, in this processing liquid process (step S5), the cup lifting mechanism appropriately switches the rising cup according to the type of processing liquid supplied to the substrate W, but this is essentially different from the present embodiment, so its description is omitted below.
[0102] In the processing liquid step (step S5), nozzles 30, 60, 65, and fixed nozzle 80 sequentially eject processing liquid onto the upper surface of substrate W as needed. Here, as an example, after nozzle 30 ejects processing liquid, fixed nozzle 80 ejects processing liquid. Figure 7This is a flowchart illustrating a specific example of a part of the processing fluid procedure. As a specific example, firstly, the nozzle base 33 moves the nozzle 30 from the standby position P33 to the central position P31 (step S51: first nozzle movement step). Then, the processing control unit 93 outputs an open signal to the valve 35, thereby opening the valve 35 (step S52: first ejection step). As a result, the processing fluid from the processing fluid supply source 36 flows through the supply pipe 34 and is supplied to the nozzle 30, and ejected from the tip of the nozzle 30 onto the upper surface of the substrate W. The processing fluid falling onto the upper surface of the substrate W is expanded by centrifugal force, scattering outwards from the periphery of the substrate W. Thus, the upper surface of the substrate W can be processed according to the processing fluid.
[0103] For example, when a predetermined time has elapsed since the start of the discharge of the processing liquid from nozzle 30, the processing control unit 93 outputs a closing signal to valve 35, closing valve 35. This stops the discharge of the processing liquid from nozzle 30.
[0104] Then, the nozzle base 33 raises the nozzle 30 from the central position P31 to the upper central position P36 (step S53: second moving process).
[0105] Then, the processing control unit 93 outputs an open signal to the valve 82, thereby opening the valve 82 (step S54: second ejection process). As a result, the processing liquid from the processing liquid supply source 83 flows through the supply pipe 81 and is supplied to the fixed nozzle 80, from which it is ejected onto the upper surface of the substrate W. The processing liquid ejected from the fixed nozzle 80 is, for example, a rinsing liquid such as pure water. In this case, the rinsing liquid rinses the processing liquid on the upper surface of the substrate W, and the processing liquid on the upper surface of the substrate W is replaced by the rinsing liquid.
[0106] exist Figure 7 In this example, the movement of the nozzle 30 begins (step S53) before the discharge of the treatment liquid from the fixed nozzle 80 (step S54). This reduces the likelihood of the treatment liquid discharged from the fixed nozzle 80 colliding with the nozzle 30.
[0107] Then, when a predetermined time has elapsed since, for example, the discharge of the processing liquid from the fixed nozzle 80, the processing control unit 93 outputs a closing signal to the valve 82, closing the valve 82. Thus, the discharge of the processing liquid from the fixed nozzle 80 stops.
[0108] After step S54, nozzles 30, 60, and 65 can be moved sequentially to predetermined positions as needed to discharge the treatment liquid. Additionally, the fixed nozzle 80 can also discharge the treatment liquid as needed. The treatment liquid process (step S5) ends when the discharge of treatment liquid from nozzles 30, 60, 65, and the fixed nozzle 80 is completed.
[0109] Refer again Figure 6After the liquid treatment process (step S5) is completed, the processing unit 1 dries the substrate W (step S6: drying process). For example, the rotary motor 22 increases the rotational speed of the substrate W to dry the substrate W (so-called rotary drying).
[0110] Then, the cup lifting mechanism lowers the processing cup 40 (step S7: cup lowering process).
[0111] Then, the rotary motor 22 stops the rotation of the rotary chuck 20 and the substrate W, and the rotary chuck 20 releases the substrate W from its holding position (step S8: holding release process). Specifically, the plurality of chuck pins 26 move to their respective open positions, thereby releasing the holding position.
[0112] Then, the main transport robot 103 removes the processed substrate W from the processing unit 1 (step S9: removal process).
[0113] The substrate W is processed as described above.
[0114] <Surveillance>
[0115] The monitoring and processing unit 91 uses camera 70 to monitor the discharge status of the processing liquid in the processing liquid process (step S5). Figure 8 This is a flowchart illustrating a specific example of monitoring processing. Camera 70 sequentially captures images in the processing step (step S5), acquiring captured image data sequentially (step S11: capturing step). For example, camera 70 acquires motion image data at a predetermined frame rate. In this case, the captured image data corresponds to one frame of the motion image data. Figures 9 to 11 This is a diagram that roughly represents an example of captured image data.
[0116] Figure 9 An example of image data captured by camera 70 when nozzle 30 stops at the central position P31 is shown. In this image data, nozzle 30 has not yet discharged the treatment fluid.
[0117] Figure 10 An example of image data captured by camera 70 is shown when nozzle 30, stopped at the central position P31, is discharging treatment liquid. The image data includes a column of treatment liquid flowing down from the tip of nozzle 30.
[0118] According to Figure 10 Understandably, the processing liquid ejected from nozzle 30 is included in the image data in a region lower than the tip of nozzle 30. Therefore, if a determination region R1 including this region is set, the monitoring processing unit 91 can monitor the ejection state of the processing liquid from nozzle 30 based on the pixel values within determination region R1. For example, according to... Figure 9 and Figure 10Understandably, the pixel values in the determination region R1 differ when the nozzle 30 is dispensing processing liquid and when the nozzle 30 is not dispensing processing liquid. For example, the sum of the pixel values in the determination region R1 when the nozzle 30 is dispensing processing liquid is greater than the sum of the pixel values in the determination region R1 when the nozzle 30 is not dispensing processing liquid.
[0119] Here, firstly, the determination area setting unit 92 sets the aforementioned determination area R1 (step S12: setting process). Specifically, the determination area setting unit 92 first performs image processing on the captured image data to detect the coordinate position of the nozzle 30. For example, the determination area setting unit 92 detects the coordinate position of the nozzle 30 within the captured image data by matching the reference image data RI1 containing the nozzle 30 (specifically, the ejector head 31) pre-stored in the storage medium with a template of the captured image data. Furthermore, in Figure 9 In the example, the image data RI1 will be schematically displayed with an imaginary line coinciding with the captured image data.
[0120] Then, the determination region setting unit 92 sets the determination region R1 according to the coordinate position of the nozzle 30. Specifically, the determination region setting unit 92 sets the determination region R1 so that the determination region R1 includes a region extending downward from the front end of the nozzle 30. Figure 9 and Figure 10 In the example, the decision region R1 has the shape of a rectangle extending longitudinally.
[0121] The relative position of the determination region R1 with respect to the coordinate position of the nozzle 30 is preset, for example, and stored as setting information in the storage medium. Additionally, the shape and size of the determination region R1 are also preset, for example, and stored as setting information in the storage medium. The determination region setting unit 92 sets the determination region R1 based on the coordinate position of the nozzle 30 detected by template matching and the setting information stored in the storage medium.
[0122] The monitoring processing unit 91 determines the discharge status of the processed liquid from the nozzle 30 based on the pixel values within the determination area R1 (step S13: monitoring process). Specifically, the monitoring processing unit 91 determines whether the sum of the pixel values within the determination area R1 is greater than or equal to a predetermined discharge reference value. If the sum is greater than or equal to the discharge reference value, it determines that the nozzle 30 is discharging processed liquid. Conversely, if the sum is less than the discharge reference value, the monitoring processing unit 91 determines that the nozzle 30 is not discharging processed liquid.
[0123] Furthermore, the determination of whether or not the processing liquid is dispensed based on the pixel values within the determination region R1 is not limited to this, and various methods can be employed. For example, the dispersion of pixel values within the determination region R1 when the nozzle 30 dispenses processing liquid is greater than the dispersion when the nozzle 30 does not dispense processing liquid. Therefore, the monitoring and processing unit 91 can also calculate this dispersion and determine whether or not the processing liquid is dispensed based on the magnitude of this dispersion. Alternatively, the standard deviation can be used instead of the dispersion.
[0124] The monitoring and processing unit 91 performs the aforementioned processing on the image data sequentially acquired by the camera 70, thereby detecting the start time of the nozzle 30's discharge of the treated liquid and the end time of the nozzle 30's discharge of the treated liquid. Furthermore, the monitoring and processing unit 91 can calculate the discharge period of the treated liquid based on the start and end times, and monitor whether this discharge period is within a predetermined time.
[0125] Furthermore, in the example described above, the nozzle 30 stops at the central position P31 while discharging the processing liquid. In this case, the position of the nozzle 30 remains unchanged, so the position of the determination area R1 does not need to be changed. Therefore, the determination area setting unit 92 can also set the determination area R1 in a common manner for multiple captured image data obtained when the nozzle 30 is stopped at the central position P31.
[0126] Specifically, the determination region setting unit 92 detects the coordinate position of the nozzle 30 based on an initial captured image data where the nozzle 30 stops at the central position P31, as described above. Then, the determination region setting unit 92 sets a determination region R1 based on this coordinate position. The determination region setting unit 92 does not perform the operation of detecting the coordinate position of the nozzle 30 in subsequent captured image data, but directly uses the pre-set determination region R1. By setting the determination region R1 in a common manner across multiple captured image data, the detection operation of the nozzle 30's coordinate position can be avoided, reducing the processing load of the determination region setting unit 92.
[0127] <Dripping>
[0128] When the processing liquid is discharged from nozzle 30 for a predetermined period, the processing control unit 93 outputs a closing signal to valve 35 to stop the discharge of processing liquid from nozzle 30. When the discharge of processing liquid stops, droplets of processing liquid may sometimes fall from the tip of nozzle 30 (so-called dripping). When such droplets fall onto the upper surface of substrate W, it may cause adverse conditions. Figure 11 An example of image data captured by camera 70 when nozzle 30 stops discharging treatment fluid is shown. This image data includes droplets of treatment fluid falling from the tip of nozzle 30.
[0129] According to Figures 9 to 11The comparison is understandable when the nozzle 30 does not discharge the treatment liquid ( Figure 9 When nozzle 30 discharges the treatment liquid ( Figure 10 ), and when dripping occurs ( Figure 11 The pixel values in the determination area R1 are different. For example, the sum of the pixel values in the determination area R1 when dripping occurs is less than the sum of the pixel values in the determination area R1 when the nozzle 30 discharges the treatment liquid, but greater than the sum of the pixel values in the determination area R1 when the nozzle 30 does not discharge the treatment liquid.
[0130] Therefore, the monitoring and processing unit 91 can determine whether dripping has occurred based on the pixel values within the determination area R1. As a specific example, when the sum of the pixel values within the determination area R1 is greater than or equal to a predetermined first reference value, the monitoring and processing unit 91 determines that the nozzle 30 is dispensing treatment liquid; when the sum of the pixel values within the determination area R1 is less than the first reference value but greater than or equal to a predetermined second reference value, it determines that dripping has occurred; when the sum of the pixel values within the determination area R1 is less than the second reference value, it determines that the nozzle 30 is not dispensing treatment liquid.
[0131] Furthermore, the determination of the presence or absence of a droplet based on the pixel values within the determination region R1 is not limited to this; various methods can be employed. For example, the presence or absence of a droplet can also be determined based on the discreteness or standard deviation within the determination region R1.
[0132] In addition, in the above-mentioned liquid treatment step (step S5), when the valve 35 is closed and the nozzle 30 stops discharging the liquid treatment, the nozzle base 33 raises the nozzle 30 from the central position P31 to the upper central position P36 (second moving step: step S53). Figure 12 The image data captured by the camera 70 is shown when the nozzle 30 stops at the central upper position P36.
[0133] The aforementioned dripping may also occur during the ascent of nozzle 30 from the central position P31 to the upper central position P36. Furthermore, dripping may also occur after nozzle 30 stops at the upper central position P36. Therefore, it is desirable for the monitoring processing unit 91 to monitor the presence or absence of processing liquid (dripping) falling from the tip of nozzle 30 both during the movement of nozzle 30 towards the upper central position P36 and when it stops at the upper central position P36.
[0134] Hereinafter, the determination area R1, defined based on the coordinate position of the nozzle 30 stopped at the central position P31, will be referred to as the determination area R10. Figure 12 In the example, the decision region R10 is shown by a two-dot dashed line.
[0135] The droplets of the treatment fluid fall from the tip of the nozzle 30. Therefore, even when the nozzle 30 rises to the upper central position P36, the droplets still pass through the determination region R10, which is located lower than the tip of the nozzle 30. Therefore, the determination region R10 can also be considered as the determination region R1 (hereinafter referred to as determination region R11) during the movement of the nozzle 30 to the upper central position P36 and its stop at the upper central position P36.
[0136] However, sometimes the liquid droplets fall at an angle from the front end of the nozzle 30. Figure 13 This diagram is a simplified representation of an example of how a droplet falls. If a droplet moves vertically downwards along the inner wall of the nozzle 30's ejection head 31 and falls from the tip of the nozzle 30, the droplet may be ejected at an angle downwards. If the distance between the tip of the nozzle 30 and the detection area R10 is large, the droplet may fall without passing through the detection area R10. In this case, even if the monitoring and processing unit 91 monitors the detection area R10, it cannot detect the droplet. That is, a failure to detect the droplet occurs.
[0137] In another example of the above-mentioned treatment liquid process (step S5), after the treatment liquid is ejected from the nozzle 30 (first ejection process: step S52), the nozzle 80 is fixed to eject the treatment liquid (second ejection process: step S54). Figure 14 An example of image data captured when the treatment liquid is ejected from the fixed nozzle 80 is shown. Figure 14 The decision region R10 is also indicated by a two-dot dashed line. Figure 14 In this example, a portion of the treatment liquid ejected from the front end of the fixed nozzle 80 is included within the determination area R10. In this case, there is a possibility that the monitoring and processing unit 91 may mistakenly detect the treatment liquid as a droplet (dripping) falling from the nozzle 30.
[0138] Therefore, in this embodiment, the determination region setting unit 92 tracks the position change of the nozzle 30 among multiple captured image data at least after the time point when the valve 35 outputs a closing signal, and sets a determination region R11 in each captured image data. That is, the determination region setting unit 92 sets a determination region R11 for each captured image data acquired sequentially from the moment the second moving step (step S53) is about to begin.
[0139] As a specific example, the determination area setting unit 92 performs nozzle 30 detection operations on image data acquired after a predetermined period has elapsed since the start of the discharge of the processed liquid from the nozzle 30. The predetermined time is set to be shorter than the discharge period of the processed liquid from the nozzle 30 and is stored in a storage medium or the like. As a result, the determination area setting unit 92 can detect the position of the nozzle 30 just as it is about to output a closing signal to the valve 35.
[0140] The determination region setting unit 92 performs tracking processing, for example, between multiple temporally consecutive image data as a detection action. Based on the tracking processing, the coordinate positions of the nozzle 30 can be obtained from each of the multiple temporally consecutive captured image data. Furthermore, as a method for tracking processing, for example, median streams can be used.
[0141] In the median stream, multiple tracking object points are first generated at a specified density within a designated area of the initial captured image data. This initial captured image data can be, for example, the initial captured image data used for the detection operation. Furthermore, the designated area in this captured image data can be, for example, a region consistent with the reference image data RI1 (i.e., the region representing nozzle 30). Then, for each tracking object point, its position in the next captured image data is tracked using the Lucas-Kanade Tracker. Further, by using Forward-Backward Error, tracking object points with large tracking errors are removed during the above tracking process, and the median (center value) of the positional changes of the tracking object points in the preceding and following captured image data is calculated using the remaining tracking object points. Then, based on this center value, the region representing nozzle 30 (i.e., the coordinate position) is estimated (detected) in the next captured image data.
[0142] The determination region setting unit 92 sets a determination region R1 (i.e., determination region R11) in each captured image data based on the coordinate position of the nozzle 30 detected in each captured image data. The relative positional relationship, size, and shape of the nozzle 30 and the determination region R11 are, for example, preset as described above, and stored in the storage medium. Thus, the determination region R11 is set to track the movement of the nozzle 30 in each captured image data.
[0143] exist Figure 14 In this example, the determination region R11 is set according to the coordinate position of the nozzle 30, which stops at the central upper position P36, and avoids the area containing the processing liquid ejected by the fixed nozzle 80. That is, the determination region setting unit 92 sets the determination region R11 as the nozzle 30 rises in the second moving step (step S53), thereby avoiding the area containing the processing liquid that reaches the upper surface of the substrate W from the tip of the fixed nozzle 80 in the second ejection step (step S54). Conversely, the central upper position P36 of the nozzle 30 is set so that the determination region R11 can avoid the area containing the processing liquid that reaches the upper surface of the substrate W from the tip of the fixed nozzle 80.
[0144] As described above, the determination region setting unit 92 detects the coordinate position of the nozzle 30 for each captured image data at least after outputting a closing signal to the valve 35, and sets the determination region R1 based on the coordinate position of the nozzle 30.
[0145] Then, the monitoring processing unit 91 monitors the presence or absence of processing liquid falling from the tip of the nozzle 30 based on the pixel values within the determination area R1 of each captured image data set by the determination area setting unit 92. The determination area R1 is set to track the movement of the nozzle 30, so the monitoring processing unit 91 can properly detect the dripping. That is, the possibility of missed detection and false detection can be reduced.
[0146] Furthermore, in the example described above, during the stop period from when the nozzle 30 stops at the central upper position P36 until the discharge of the processing liquid from the fixed nozzle 80 ends, the nozzle 30 remains continuously stopped at the central upper position P36. In this case, there is no need to change the determination region R11 during this stop period. Therefore, the determination region setting unit 92 can set the determination region R11 commonly for multiple captured image data acquired during the stop period. That is, when the determination region R11 is set based on the captured image data when the nozzle 30 stops at the central upper position P36, the determination region R11 is also applied to other captured image data acquired after the stop period. As a result, there is no need to perform tracking processing and set the determination region R11 during the stop period. Therefore, the processing load of the determination region setting unit 92 can be reduced.
[0147] The substrate processing method and substrate processing apparatus 100 have been described in detail above. However, all the embodiments described above are merely illustrative, and the substrate processing apparatus is not limited thereto. It is understood that numerous variations not illustrated can be conceived without departing from the scope of this disclosure. The structures described in the above embodiments and variations can be appropriately combined or omitted as long as they do not contradict each other.
[0148] In the example above, after the discharge of the treated liquid stops, the nozzle 30 rises from the central position P31 to the upper central position P36 (second movement step: step S53). However, in this second movement step, the nozzle 30 may also be moved from the central position P31 to the peripheral position P32. In this case, the determination area setting unit 92 also detects the coordinate position of the nozzle 30 in each captured image data at least after outputting a closing signal to the valve 35, and sets the determination area R11 in each captured image data in a manner that tracks the movement of the nozzle 30. As a result, dripping from the nozzle 30 can be detected with high detection accuracy.
[0149] Furthermore, in the example above, although the focus is on dripping, the aforementioned monitoring process can also be used to detect outflow. Outflow refers to the following abnormality: due to an abnormality of valve 35, a thin stream of liquid processing fluid still flows from nozzle 30 despite a closed signal being output to valve 35.
[0150] In addition, in the example above, although the discharge of the treatment liquid from nozzle 30 is monitored, the discharge of the treatment liquid from each of nozzles 60 and 65 can also be monitored.
[0151] Symbol Explanation
[0152] 1—Processing unit, 20—Rotating chuck, 30, 60, 65—First nozzle (nozzle), 37—Moving mechanism, 80—Second nozzle (fixed nozzle), 9—Control unit, 70—Camera, 100—Substrate processing device, S11—Picture process (step), S12—Setting process (step), S13—Leakage monitoring process (step), S2—Holding process (step), S52—First ejection process (step), S53—Moving process (step), S54—Second ejection process (step), W—Substrate.
Claims
1. A substrate processing method characterized by, Possessing: a holding step of holding a substrate; a first discharge step of outputting an open signal to a valve provided to a supply pipe, and discharging a processing liquid from a front end of a first nozzle connected to the supply pipe to a main surface of the substrate; a moving step of moving the first nozzle after a point in time when the first discharge step ends in response to the valve outputting the close signal; a photographing step of causing a camera to sequentially photograph a predetermined area including the front end of the first nozzle in the movement of the first nozzle after the point in time when the valve outputs the close signal, and acquire a plurality of image data; a setting step of detecting a position of the first nozzle in each of the plurality of image data acquired in the movement of the first nozzle in a state after the valve outputs the close signal, causing a determination area to track a change in the position of the first nozzle between the plurality of image data, and setting the determination area on a lower side than the front end of the first nozzle; and a liquid leakage monitoring step of monitoring the presence or absence of the processing liquid falling from the front end of the first nozzle based on pixels within the determination area in each of the plurality of image data acquired in the movement of the first nozzle in the state after the valve outputs the close signal.
2. The substrate processing method according to claim 1, wherein the first nozzle is raised in the moving step.
3. The substrate processing method according to claim 2, further comprising a second discharge step of discharging a processing liquid from a second nozzle to the main surface of the substrate in a state where the first nozzle is raised, in the liquid leakage monitoring step, the determination area is set by tracking the raising of the first nozzle in the image data acquired by the camera in the second discharge step, thereby avoiding the processing liquid reaching the main surface of the substrate from the front end of the second nozzle. Possessing: a substrate holding section that holds a substrate; 4. A substrate processing apparatus characterized by comprising: a nozzle that is connected to a supply pipe provided to a valve, and discharges a processing liquid supplied through the supply pipe to a main surface of the substrate held by the substrate holding section; a moving mechanism that moves the nozzle; a camera that photographs a predetermined area including a front end of the nozzle; and a control section that outputs an open signal to the valve, causes the processing liquid to be discharged from the front end of the nozzle to the main surface of the substrate, moves the nozzle by the moving mechanism after a point in time when the processing liquid is discharged ends in response to the valve outputting a close signal, detects a position of the nozzle in each of a plurality of image data sequentially acquired by the camera after the point in time when the valve outputs the close signal, causes a determination area to track a change in the position of the nozzle between the plurality of image data, sets the determination area on a lower side than the front end of the nozzle, and monitors the presence or absence of the processing liquid falling from the front end of the nozzle based on pixels within the determination area in each of the plurality of image data.
Citation Information
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