Flexible circuit board and display device

Abstract

The present disclosure provides a flexible circuit board and a display device, wherein the flexible circuit board includes: a substrate, a plurality of binding pins and a protective layer, wherein the plurality of binding pins are located on the substrate, the plurality of binding pins extend along a first direction and are arranged along a second direction; the protective layer is located on a side of the binding pins away from the substrate; the protective layer includes a plurality of first openings and a second opening for exposing the plurality of binding pins, the size of the first opening is larger than the size of the second opening; one binding pin corresponds to one first opening and at least one second opening, and the second opening is located on at least one side of the two sides of the first opening in the first direction. By providing a protective layer on a side of the binding pin away from the substrate, the protective layer includes a first opening and a second opening for exposing the binding pin, and the exposed area of ​​the binding pin can be reduced on the basis of ensuring the contact area of ​​the binding pin, thereby reducing the risk of corrosion of the binding pin and improving the binding reliability.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a flexible circuit board and a display device. Background Art

[0002] With the development of display technology, the application of display technology is becoming more and more extensive, and users' requirements for the user experience of display products are also getting higher and higher. In the era of pursuing visual effects, full-screen display and large-screen display effects of display products such as mobile phones and computers are becoming more and more popular among users.

[0003] Full screens have attracted widespread attention due to their large screen-to-body ratio and ultra-narrow borders, which can greatly improve the visual effect of viewers compared to ordinary display screens. In order to increase the screen-to-body ratio of the screen, a flexible printed circuit (FPC) is usually bound to the edge of the display screen, and then the control device is bound to the flexible printed circuit and bent on the back side of the display surface to save the edge area of ​​the screen for setting up more display area.

[0004] Usually, in order to ensure the effective contact area of ​​the flexible circuit board binding, the gold finger is often set to be longer. After the binding is completed, a part of the gold finger will be exposed to the air and corroded, thereby affecting the binding reliability. Summary of the invention

[0005] The flexible circuit board provided in the embodiment of the present disclosure includes:

[0006] Base material;

[0007] A plurality of binding pins are located on the substrate, the plurality of binding pins extend along a first direction and are arranged along a second direction; the first direction intersects the second direction;

[0008] A protective layer, located on a side of the binding pin facing away from the substrate;

[0009] The protective layer includes a plurality of first openings and a second opening for exposing the plurality of binding pins, wherein the size of the first opening is larger than the size of the second opening; one binding pin corresponds to one first opening and at least one second opening, and the second opening is located on at least one side of the first opening on both sides in the first direction.

[0010] Optionally, in the embodiment of the present disclosure, one binding pin corresponds to one first opening and a plurality of second openings, and the plurality of second openings are arrayed and distributed on both sides of the first opening in the first direction.

[0011] Optionally, in the embodiment of the present disclosure, the width of the first opening in the second direction is less than or equal to the width of the binding pin in the second direction; the width of the first opening in the first direction is less than or equal to half of the width of the binding pin in the first direction.

[0012] Optionally, in the embodiment of the present disclosure, the width of the binding pin in the first direction is 0.8 mm-1.5 mm; the width of the binding pin in the second direction is 0.1 mm-0.2 mm; the spacing between two adjacent binding pins in the second direction is 0.05 mm-0.1 mm;

[0013] The width of the first opening in the first direction is 0.3 mm-0.75 mm; the width of the first opening in the second direction is 0.06 mm-0.2 mm;

[0014] The width of the second opening in the first direction is 0.03 mm-0.05 mm; the width of the second opening in the second direction is 0.03 mm-0.05 mm; and the interval between two adjacent second openings is 0.01 mm-0.03 mm.

[0015] Optionally, in the embodiment of the present disclosure, it also includes:

[0016] a conductive layer, located on the binding pins in the first opening and the second opening;

[0017] A surface of the conductive layer facing away from the binding pin is flush with a surface of the protective layer facing away from the binding pin.

[0018] Optionally, in the embodiment of the present disclosure, the conductive layer is made of nickel and / or gold.

[0019] Optionally, in the embodiment of the present disclosure, the plurality of binding pins include: a plurality of first binding pins and a plurality of second binding pins;

[0020] The first binding pin and the second binding pin are respectively located at two ends of the flexible circuit board, and the first binding pin and the second binding pin are located on the same side of the substrate.

[0021] Optionally, in the embodiment of the present disclosure, the plurality of binding pins include: a plurality of first binding pins and a plurality of second binding pins; the protection layer includes a first protection layer and a second protection layer;

[0022] The first binding pin and the second binding pin are respectively located at two ends of the flexible circuit board; the first binding pin is located on one side of the substrate, and the second binding pin is located on the side of the substrate away from the first binding pin; the first protective layer is located on the side of the first binding pin away from the substrate, and the second protective layer is located on the side of the second binding pin away from the substrate.

[0023] Accordingly, an embodiment of the present disclosure further provides a display device, comprising: a display panel and any of the above-mentioned flexible circuit boards; wherein:

[0024] The display panel comprises: a display area and a non-display area surrounding the display area; a connecting pin is arranged in the non-display area on one side of the display area;

[0025] One of the binding pins on the flexible circuit board corresponds to one of the connecting pins on the display panel;

[0026] The binding pins and the connecting pins corresponding to each other are bound by anisotropic conductive adhesive films.

[0027] Optionally, in an embodiment of the present disclosure, the display panel includes:

[0028] substrate substrate;

[0029] A driving circuit layer is located on the base substrate; the driving circuit layer includes a plurality of display signal leads;

[0030] An organic light emitting diode device layer, located on a side of the driving circuit layer away from the base substrate;

[0031] An encapsulation layer, located on a side of the organic light emitting diode device layer away from the substrate;

[0032] A touch function layer, located on a side of the encapsulation layer away from the organic light emitting diode device layer; the touch function layer comprises a plurality of touch signal leads;

[0033] The connection pins include: display connection pins and touch connection pins; one display signal lead is correspondingly connected to one display connection pin, and one touch signal lead is correspondingly connected to one touch connection pin;

[0034] The display device includes two flexible circuit boards, namely a display flexible circuit board and a touch flexible circuit board. The touch flexible circuit board is used to bind the touch connection pins, and the display flexible circuit board is used to bind the display connection pins.

[0035] Optionally, in an embodiment of the present disclosure, the plurality of binding pins in the touch flexible circuit board include: a plurality of first touch binding pins and a plurality of second touch binding pins; the first touch binding pins and the second touch binding pins are located at two ends of the touch flexible circuit board, and the first touch binding pins and the second touch binding pins are located on the same side of the substrate in the touch flexible circuit board;

[0036] The first touch binding pin and the touch connecting pin are bound to each other;

[0037] The plurality of binding pins in the display flexible circuit board include: a plurality of first display binding pins and a plurality of second display binding pins; the first display binding pins and the second display binding pins are located at two ends of the display flexible circuit board, and the first display binding pins and the second display binding pins are located at two sides of the substrate in the display flexible circuit board;

[0038] The second display binding pin and the display connection pin are bound to each other;

[0039] The second touch binding pin and the second display binding pin are bound to each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 A schematic diagram of a top view of a flexible circuit board provided in an embodiment of the present disclosure;

[0041] Figure 2 for Figure 1 A schematic cross-sectional view at the middle dashed line CC';

[0042] Figure 3 Another schematic diagram of a top view of the flexible circuit board provided in an embodiment of the present disclosure;

[0043] Figure 4 Another schematic diagram of a top view of the flexible circuit board provided in an embodiment of the present disclosure;

[0044] Figure 5 A schematic diagram of a top view of the structure of a display device provided in an embodiment of the present disclosure;

[0045] Figure 6 is a schematic diagram of the film layer structure of the display panel in the display area in the embodiment of the present disclosure;

[0046] Figure 7 for Figure 5 A schematic cross-sectional view of the dashed line frame Q1 along the second direction F2;

[0047] Figure 8 for Figure 5 A schematic cross-sectional view of the dashed line frame Q2 along the second direction F2;

[0048] Fig. 9 for Figure 5 A schematic cross-sectional view along the second direction F2 within the middle dotted frame Q3. DETAILED DESCRIPTION

[0049] In order to solve the problem that the gold fingers of a flexible circuit board are easily corroded, thereby affecting the binding reliability, the embodiments of the present disclosure provide a flexible circuit board and a display device.

[0050] The following is a detailed description of the specific implementation of the flexible circuit board and the display device provided by the embodiment of the present disclosure in conjunction with the accompanying drawings. The size and shape of each part in the accompanying drawings do not reflect the actual proportion, and the purpose is only to illustrate the content of the present disclosure.

[0051] Figure 1 A schematic diagram of a top view of a flexible circuit board provided in an embodiment of the present disclosure. Figure 2 for Figure 1 The cross-sectional diagram at the dotted line CC' is shown in Figure 1 and Figure 2 As shown, the flexible circuit board provided in the embodiment of the present disclosure may include:

[0052] A substrate 10;

[0053] A plurality of binding pins 11 are located on the substrate 10. The plurality of binding pins 10 extend along a first direction F1 and are arranged along a second direction F2. The first direction F1 and the second direction F2 intersect. For example, the first direction F1 and the second direction F2 may be perpendicular to each other. Of course, the angle between the first direction F1 and the second direction F2 may also be other values, which are not limited here.

[0054] The protective layer 12 is located on the side of the binding pin 11 facing away from the substrate 10;

[0055] The protective layer 12 includes a plurality of first openings 121 and second openings 122 for exposing the binding pins 11, wherein the size of the first opening 121 is larger than the size of the second opening 122; one binding pin 11 corresponds to one first opening 121 and at least one second opening 122, and the second opening 122 is located on at least one side of the first opening 121 on the first direction F1.

[0056] In the flexible circuit board provided by the embodiment of the present disclosure, a protective layer is provided on the side of the binding pin facing away from the substrate, the protective layer includes a first opening and a second opening for exposing the binding pin, and the size of the first opening is larger than the size of the second opening, and the binding pin corresponds to one first opening and at least one second opening. In this way, the exposed area of ​​the binding pin can be reduced while ensuring the contact area of ​​the binding pin, thereby reducing the risk of corrosion of the binding pin and improving the binding reliability.

[0057] In the embodiments of the present disclosure, the flexible circuit board can be bound and connected with a display panel or other device, and a plurality of connecting pins are provided in the display panel or other device, and the plurality of binding pins in the flexible circuit board are respectively bound and connected with a plurality of connecting pins in the display panel or other device. In specific implementation, the number, arrangement, shape and size of each binding pin in the flexible circuit board can be set according to the number, arrangement, shape and size of the connecting pins in the display panel or other device.

[0058] In addition, if Figure 1 As shown, the flexible circuit board may further include: a plurality of signal lines 14 respectively connected to the binding pins 11. Since the binding pins in the flexible circuit board are bound and connected to the connection pins in the display panel or other devices, the signal lines 14 in the flexible circuit board can realize signal transmission with the display panel or other devices. In a specific implementation, the signal lines 14 in the flexible circuit board may be located in the same film layer as the binding pins 11, and the signal lines 14 and the binding pins 11 may be manufactured by the same patterning process to reduce the process cost, and the ends of the signal lines 14 may be used as the binding pins 11 to ensure that the connection performance between the binding pins 11 and the corresponding signal lines 14 is better.

[0059] Continue to refer to Figure 1 , one binding pin 11 corresponds to one first opening 121 and at least one second opening 122. Since the size of the first opening 121 is larger than that of the second opening 122, the area of ​​the binding pin 11 exposed by the first opening 121 is larger. When the binding pin 11 is bound and connected to the corresponding connection pin, it can be ensured that there is sufficient contact area between the binding pin 11 and the corresponding connection pin. In addition, the second opening 122 is located on at least one side of the two sides of the first opening 121 in the first direction F1. On the one hand, the length of the exposed binding pin 11 in the first direction F1 can be increased. Even if there is an error between the binding pin 11 and the corresponding connection pin during the binding process, it can be ensured that the binding pin 11 and the corresponding connection pin are well bound. On the other hand, since the size of the second opening 122 is smaller, the exposed area of ​​the binding pin 11 can be reduced, reducing the risk of corrosion of the binding pin 11.

[0060] Optionally, the protective layer 12 may be made of a polyimide (PI) material, or other materials, which are not limited here.

[0061] In a specific implementation, in the above-mentioned flexible circuit board provided in the embodiment of the present disclosure, as Figure 1 and Figure 2As shown, one binding pin 11 corresponds to one first opening 121 and multiple second openings 122, and multiple second openings 122 are distributed in an array on both sides of the first opening 121 in the first direction F1. By setting the second openings 122 on both sides of the first opening 121 in the first direction F1, the length of the exposed binding pin 11 in the first direction F1 can be increased, so that there is a sufficient contact area between the binding pin 11 and the corresponding connecting pin, and even if there is an error between the binding pin 11 and the corresponding connecting pin during the binding process, it can be ensured that the binding pin 11 and the corresponding connecting pin are well bound. In addition, the exposed area at both ends of the binding pin 11 can be reduced, reducing the risk of corrosion of the binding pin 11. In the actual process, the binding pin 11 and the corresponding connecting pin are bound and connected through anisotropic conductive film, and the multiple second openings 122 are arranged in an array distribution, which can make the distribution of the anisotropic conductive film more uniform, so that the binding reliability of the binding pin 11 and the corresponding connecting pin is higher.

[0062] It should be noted that Figure 1 In the example, six second openings 122 are provided on both sides of the first opening 121 in the first direction F1. In specific implementation, the number and distribution of the second openings 122 can be set according to the actual space size, which is not limited here. Figure 1 In the figure, the first opening 121 is rectangular and the second opening 122 is square for illustration. In a specific implementation, the first opening 121 and the second opening 122 may also be other shapes, which are not limited here.

[0063] Optionally, in the above-mentioned flexible circuit board provided in the embodiment of the present disclosure, Figure 1 As shown, the width of the first opening 121 in the second direction F2 is less than or equal to the width of the binding pin 11 in the second direction F2, so that the protective layer 12 can cover the gap between two adjacent binding pins 11 in the second direction F2, thereby preventing short circuits between the two adjacent binding pins 11. In addition, the width of the first opening 121 in the first direction F1 is less than or equal to half the width of the binding pin 11 in the first direction F1, so that sufficient space can be reserved to set the second opening 122 on at least one side of the first opening 121 in the first direction F1, thereby reducing the exposed area of ​​the binding pin 11 and reducing the risk of corrosion of the binding pin 11.

[0064] In practical applications, in the above-mentioned flexible circuit board provided by the embodiment of the present disclosure, Figure 1As shown, the width of the second opening 122 in the first direction F1 is smaller than the width of the first opening 121 in the first direction F1; the width of the second opening 122 in the second direction F2 is smaller than the width of the first opening 121 in the second direction. In this way, the size of the second opening 122 can be smaller than the size of the first opening 121, so that the area of ​​the binding pin 11 exposed by the second opening 122 is smaller, thereby reducing the risk of corrosion of the binding pin 11.

[0065] Optionally, in the above-mentioned flexible circuit board provided in the embodiment of the present disclosure, Figure 1 As shown, the width of the binding pin 11 in the first direction F1 is 0.8mm-1.5mm; the width of the binding pin 11 in the second direction F2 is 0.1mm-0.2mm; the spacing between two adjacent binding pins 11 in the second direction F2 is 0.05mm-0.1mm. For example, the width of the binding pin 11 in the first direction F1 can be 0.91mm, the width of the binding pin 11 in the second direction F2 can be 0.155mm, and the spacing between two adjacent binding pins 11 in the second direction F2 can be 0.09mm. Of course, the size and spacing of the binding pins 11 can also be other values, which can be set according to the space of the flexible circuit board, and are not limited here.

[0066] Optionally, in the above-mentioned flexible circuit board provided in the embodiment of the present disclosure, referring to Figure 1 The width of the first opening 121 in the first direction F1 is 0.3mm-0.75mm; the width of the first opening 121 in the second direction F2 is 0.06mm-0.2mm. For example, the width of the first opening 121 in the first direction F1 can be 0.395mm, and the width of the first opening 121 in the second direction F2 can be 0.115mm. Of course, the size of the first opening 121 can also be other values, which can be set in combination with the size of the binding pin 11, and is not limited here.

[0067] Optionally, in the above-mentioned flexible circuit board provided in the embodiment of the present disclosure, Figure 1 As shown, the width of the second opening 122 in the first direction F1 is 0.03mm-0.05mm; the width of the second opening 122 in the second direction F2 is 0.03mm-0.05mm; the spacing between two adjacent second openings 122 is 0.01mm-0.03mm. For example, the second opening 122 can be a square opening of 0.045mm×0.045mm, and the spacing between two adjacent second openings 122 can be 0.025mm. Of course, the second opening 122 can also be other shapes, and the size and spacing of the second openings 122 can also be other values, which can be set in combination with the size of the binding pin 11 and the first opening 121, and are not limited here.

[0068] Furthermore, in the above-mentioned flexible circuit board provided in the embodiment of the present disclosure, Figure 1 and Figure 2 , and may also include:

[0069] The conductive layer 13 is located on the binding pins 11 in the first opening 121 and the second opening 122;

[0070] The surface of the conductive layer 13 facing away from the binding pin 11 is flush with the surface of the protective layer 12 facing away from the binding pin 11 .

[0071] In the embodiment of the present disclosure, the conductive layer 13 is used to fill the first opening 121 and the second opening 122 in the protective layer 12, and the surface of the conductive layer 13 away from the binding pin 11 is made flush with the surface of the protective layer 12 away from the binding pin 11, so as to ensure the binding flatness and further improve the binding reliability of the binding pin 11 and the corresponding connecting pin. Optionally, the total thickness of the conductive layer 13 and the binding pin 11 is about 20 μm.

[0072] In a specific implementation, the binding pin 11 can be made of copper metal. Copper metal has good electrical conductivity and low cost, but copper metal is easily oxidized. The conductive layer 13 can protect the binding pin 11 and prevent the binding pin 11 from being corroded. The conductive layer 13 can be made of a metal material that is not easily oxidized. Optionally, the conductive layer 13 can be made of nickel and / or gold. Of course, the binding pin 11 and the conductive layer 13 can also be made of other materials, which are not limited here.

[0073] In practical applications, the flexible circuit board provided by the embodiment of the present disclosure has at least the following two implementation methods, which are described in detail below with reference to the accompanying drawings.

[0074] Method 1:

[0075] Figure 3 Another schematic diagram of a top view of the flexible circuit board provided in the embodiment of the present disclosure is shown in FIG. Figure 3 As shown, the plurality of binding pins in the above-mentioned flexible circuit board include: a plurality of first binding pins 11A and a plurality of second binding pins 11B;

[0076] The first binding pin 11A and the second binding pin 11B are respectively located at two ends of the flexible circuit board, and the first binding pin 11A and the second binding pin 11B are located at the same side of the substrate 10 .

[0077] In this way, the flexible circuit board in the first mode can be bound and connected with two devices located on the same side of the substrate 10. In addition, the flexible circuit board in the first mode can also include a protective layer 12 and a conductive layer 13.

[0078] Method 2:

[0079] Figure 4 Another schematic diagram of a top view of a flexible circuit board provided in an embodiment of the present disclosure, wherein: Figure 4 (1) is a schematic diagram of one side of the above-mentioned flexible circuit board, Figure 4 (2) is a schematic diagram of the other side of the above-mentioned flexible circuit board. Figure 4 As shown, the plurality of binding pins in the above-mentioned flexible circuit board include: a plurality of first binding pins 11A and a plurality of second binding pins 11B; the protective layer includes a first protective layer 12a and a second protective layer 12b;

[0080] The first binding pin 11A and the second binding pin 11B are respectively located at two ends of the flexible circuit board; Figure 4 In (1), the first binding pin 11A is located on one side of the substrate 10, and the first protective layer 12a is located on the side of the first binding pin 11a away from the substrate 10; Figure 4 In (2), the second binding pin 11B is located on a side of the substrate 10 away from the first binding pin 11A, and the second protective layer 12 b is located on a side of the second binding pin 11B away from the substrate 10 .

[0081] In this way, the flexible circuit board in the second mode can be bound and connected to the two devices located on both sides of the substrate 10. In addition, the conductive layer in the above-mentioned flexible circuit board is divided into a first conductive layer and a second conductive layer. Figure 4 In (1), the first conductive layer 13a is located on the side of the first binding pin 11A away from the substrate 10, such as Figure 4 In (2), the second conductive layer 13 b is located on a side of the second binding pin 11B facing away from the substrate 10 .

[0082] In addition, in addition to the above-mentioned method 1 and method 2, the structure of the flexible circuit board can be set according to actual needs. For example, a plurality of binding pins can be set only at one end of the flexible circuit board.

[0083] Based on the same inventive concept, the embodiment of the present disclosure also provides a display device, which can be applied to any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a laptop computer, a digital photo frame, a navigator, etc. Since the principle of solving the problem by the display device is similar to that of the above-mentioned flexible circuit board, the implementation of the display device can refer to the implementation of the above-mentioned flexible circuit board, and the repeated parts will not be repeated.

[0084] Figure 5 A schematic diagram of a top view of a display device provided in an embodiment of the present disclosure is shown in FIG. Figure 5 As shown, the display device provided by the embodiment of the present disclosure may include: a display panel 2 and any of the above-mentioned flexible circuit boards (for example Figure 5 31 or 32); wherein,

[0085] The display panel 2 includes: a display area A and a non-display area B surrounding the display area A; a connection pin ( Figure 5 not shown);

[0086] One binding pin on the flexible circuit board corresponds to one connecting pin on the display panel;

[0087] The binding pins and the connecting pins corresponding to each other are bonded by anisotropic conductive adhesive films.

[0088] In the display device provided by the embodiment of the present disclosure, the connecting pins in the display panel are bound and connected to the binding pins in the flexible circuit board. Since a protective layer is provided in the flexible circuit board, and the protective layer includes a first opening and a second opening for exposing the binding pins, the size of the first opening is larger than the size of the second opening, and the binding pins correspond to one first opening and at least one second opening. Therefore, when the binding pins are bound and connected to the corresponding connecting pins, there is a sufficient contact area between the binding pins and the corresponding connecting pins, and the exposed area of ​​the binding pins is small, the risk of corrosion of the binding pins is low, and the binding reliability is high.

[0089] Figure 6 FIG. 1 is a schematic diagram of the film structure of the display panel in the display area in the embodiment of the present disclosure, such as Figure 6 As shown, the above-mentioned display panel may include:

[0090] Base substrate 20;

[0091] The driving circuit layer 21 is located on the base substrate 20; the driving circuit layer 21 includes a plurality of display signal leads ( Figure 6 The driving circuit layer 21 may include components such as a thin film transistor T and a capacitor structure, and the thin film transistor T may include: an active layer Ac, a source electrode S, a drain electrode D, and a gate electrode Ga; the display signal lead in the driving circuit layer 21 may be electrically connected to the thin film transistor T;

[0092] The organic light-emitting diode device layer 22 is located on the side of the driving circuit layer 21 away from the base substrate 20; wherein the organic light-emitting diode device layer 22 may include: a first electrode 221, a second electrode 222, an organic light-emitting layer 223, and a pixel defining layer 224; the first electrode 221 may be connected to the drain electrode D of the thin film transistor T through a conductive connection portion LB, and the pixel defining layer 224 is used to define the area of ​​each pixel in the display panel;

[0093] The encapsulation layer 23 is located on the side of the organic light-emitting diode device layer 22 away from the base substrate 10; wherein the encapsulation layer 23 may include: an inorganic film layer 231 and an organic film layer 232 stacked, and the organic film layer 232 may be located between two adjacent inorganic film layers 231;

[0094] The touch function layer 24 is located on the side of the encapsulation layer 23 away from the organic light emitting diode device layer 22; the touch function layer 24 includes a plurality of touch signal leads ( Figure 6 A touch barrier layer 25 is also provided between the touch function layer 24 and the encapsulation layer 23, and the touch barrier layer 25 can prevent metal atoms in the touch function layer 24 from entering the encapsulation layer 23;

[0095] In addition, the display panel may also include: a gate insulating layer 211 located between the active layer Ac and the gate Ga, an interlayer insulating layer 212 located between the gate Ga and the source S, a first flat layer 213 located between the source S and the conductive connection part LB, and a second flat layer 214 located between the conductive connection part LB and the first electrode 221.

[0096] The connection pins include: display connection pins and touch connection pins; one display signal lead wire is connected to one display connection pin, and one touch signal lead wire is connected to one touch connection pin;

[0097] like Figure 5 As shown, the display device may include two flexible circuit boards, namely a display flexible circuit board 31 and a touch flexible circuit board 32. The touch flexible circuit board 32 is used to bind touch connection pins, and the display flexible circuit board 31 is used to bind display connection pins. For example, the touch connection pins may be located in a dotted box Q1, and the touch flexible circuit board 32 is bound and connected to the touch connection pins at the dotted box Q1. The display connection pins may be located in a dotted box Q2, and the display flexible circuit board 31 is bound and connected to the display connection pins at the dotted box Q2. In addition, the touch flexible circuit board 32 may also be bound and connected to the display flexible circuit board 31 at the dotted box Q3.

[0098] Figure 7 for Figure 5 A schematic cross-sectional view of the dashed line frame Q1 along the second direction F2, Figure 8 for Figure 5 A schematic cross-sectional view of the dashed line frame Q2 along the second direction F2, Fig. 9 for Figure 5 The cross-sectional view along the second direction F2 in the dashed line frame Q3 is combined with Figure 5 , Figure 7 and Fig. 9In the embodiment of the present disclosure, the plurality of binding pins in the above-mentioned touch flexible circuit board 32 include: a plurality of first touch binding pins 11a and a plurality of second touch binding pins 11b; the first touch binding pins 11a and the second touch binding pins 11b are located at both ends of the touch flexible circuit board, and the first touch binding pins 11a and the second touch binding pins 11b are located on the same side of the substrate 10 in the touch flexible circuit board, that is, the touch flexible circuit board 32 has the structure of the above-mentioned method 1. In the dotted frame Q1, the first touch binding pin 11a is bound to the touch connection pin 201a.

[0099] Combination Figure 5 , Figure 8 and Fig. 9 , the multiple binding pins in the display flexible circuit board 31 include: multiple first display binding pins 11c and multiple second display binding pins 11d; the first display binding pin 11c and the second display binding pin 11d are located at both ends of the display flexible circuit board 31, and the first display binding pin 11c and the second display binding pin 11d are located on both sides of the substrate 10 in the display flexible circuit board 31, that is, the display flexible circuit board 31 has the structure of the above-mentioned method 2; the first display binding pin 11c is bound to the display connection pin 201b, and the second touch binding pin 11b is bound to the second display binding pin 11d.

[0100] Combination Figure 5 and Figure 7 In the dotted frame Q1, the touch flexible circuit board 32 is bound and connected to the touch connecting pin 201a in the display panel 2 through the anisotropic conductive adhesive film 30. Since the touch flexible circuit board 32 is provided with a protective layer 12, when the first touch binding pin 11a is bound to the touch connecting pin 201a, the first touch binding pin 11a and the touch connecting pin 201a have a sufficient contact area, and the exposed area of ​​the first touch binding pin 11a is small, so the risk of the first touch binding pin 11a being corroded is low. In addition, the display panel 2 may further include: a third protective layer 202a and a third conductive layer 203a located on the side of the touch connection pin 201a away from the base substrate 20, wherein, similar to the structure of the protective layer 12 in the touch flexible circuit board 32, the third protective layer 202a may also include a first opening and a second opening, the touch connection pin 201a corresponds to a first opening and at least one second opening, and the third conductive layer 203a is located in the first opening and the second opening, and the surface of the third conductive layer 203a is flush with the surface of the third protective layer 202a. In this way, the risk of corrosion of the touch connection pin 201a is also reduced, further improving the binding reliability.

[0101] Combination Figure 5 and Figure 8, within the dotted frame Q2, within the dotted frame Q2, the display flexible circuit board 31 is bound and connected to the display connecting pin 201b in the display panel 2 through the anisotropic conductive adhesive film 30. Since the display flexible circuit board 31 is provided with a protective layer 12, when the first display binding pin 11c is bound and connected to the display connecting pin 201b, the first display binding pin 11c and the display connecting pin 201b have a sufficient contact area, and the exposed area of ​​the first display binding pin 11c is small, and the risk of the first display binding pin 11c being corroded is low. In addition, the display panel 2 may further include: a fourth protective layer 202b and a fourth conductive layer 203b located on the side of the display connection pin 201b away from the base substrate 20, wherein, similar to the protective layer 12 in the display flexible circuit board 31, the fourth protective layer 202b may also include a first opening and a second opening, the display connection pin 201b corresponds to a first opening and at least one second opening, and the fourth conductive layer 203b is located in the first opening and the second opening, and the surface of the fourth conductive layer 203b is flush with the surface of the fourth protective layer 202b. In this way, the risk of corrosion of the display connection pin 201b is also reduced, further improving the binding reliability.

[0102] Combination Figure 5 and Fig. 9 In the dotted frame Q3, the display flexible circuit board 31 is bound and connected to the touch flexible circuit board 32 through the anisotropic conductive adhesive film 30. Since the display flexible circuit board 31 and the touch flexible circuit board 32 are both provided with a protective layer 12, when the second touch binding pin 11b is bound and connected to the second display binding pin 11d, the second touch binding pin 11b and the second display binding pin 11d have sufficient contact area, and the exposed areas of the second touch binding pin 11b and the second display binding pin 11d are both small, so the risk of the second touch binding pin 11b and the second display binding pin 11d being corroded is low.

[0103] In addition, if Figure 5 As shown, in the embodiment of the present disclosure, the above-mentioned display device may also include: a control device 33, a connector 34 and a main board (not shown in the figure), wherein the control device 33 may be a chip or other components, the touch flexible circuit board 32 is electrically connected to the control device 33, and the display flexible circuit board 31 is electrically connected to the main board through the connector 34.

[0104] In the flexible circuit board and display device provided by the embodiments of the present disclosure, a protective layer is provided on the side of the binding pins in the flexible circuit board away from the substrate, the protective layer includes a first opening and a second opening for exposing the binding pins, and the size of the first opening is larger than the size of the second opening, and the binding pins correspond to one first opening and at least one second opening. In this way, the exposed area of ​​the binding pins can be reduced while ensuring the contact area of ​​the binding pins, thereby reducing the risk of corrosion of the binding pins and improving the binding reliability.

[0105] Although the preferred embodiments of the present disclosure have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present disclosure.

[0106] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present disclosure without departing from the spirit and scope of the embodiments of the present disclosure. Thus, if these modifications and variations of the embodiments of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is also intended to include these modifications and variations.

Claims

1. A flexible circuit board, comprising: Base material; A plurality of binding pins are located on the substrate, the plurality of binding pins extend along a first direction and are arranged along a second direction; The first direction intersects with the second direction; A protective layer, located on a side of the binding pin facing away from the substrate; The protective layer comprises a plurality of first openings and a second opening for exposing the plurality of binding pins, wherein the size of the first opening is larger than the size of the second opening; One of the binding pins corresponds to one of the first openings and at least one of the second openings, and the second opening is located on at least one of the two sides of the first opening in the first direction.

2. The flexible circuit board according to claim 1, wherein: One binding pin corresponds to one first opening and a plurality of second openings, and the plurality of second openings are distributed in an array on both sides of the first opening in the first direction.

3. The flexible circuit board according to claim 1 or 2, wherein: The width of the first opening in the second direction is less than or equal to the width of the binding pin in the second direction; the width of the first opening in the first direction is less than or equal to half of the width of the binding pin in the first direction.

4. The flexible circuit board according to claim 1 or 2, wherein: The width of the binding pin in the first direction is 0.8mm-1.5mm; the width of the binding pin in the second direction is 0.1mm-0.2mm; the spacing between two adjacent binding pins in the second direction is 0.05mm-0.1mm; The width of the first opening in the first direction is 0.3 mm-0.75 mm; the width of the first opening in the second direction is 0.06 mm-0.2 mm; The width of the second opening in the first direction is 0.03 mm-0.05 mm; the width of the second opening in the second direction is 0.03 mm-0.05 mm; and the interval between two adjacent second openings is 0.01 mm-0.03 mm.

5. The flexible circuit board according to claim 1 or 2, wherein: Also includes: a conductive layer, located on the binding pins in the first opening and the second opening; A surface of the conductive layer facing away from the binding pin is flush with a surface of the protective layer facing away from the binding pin.

6. The flexible circuit board according to claim 5, wherein: The conductive layer is made of nickel and / or gold.

7. The flexible circuit board according to claim 1 or 2, wherein: The plurality of binding pins include: a plurality of first binding pins and a plurality of second binding pins; The first binding pin and the second binding pin are respectively located at two ends of the flexible circuit board, and the first binding pin and the second binding pin are located on the same side of the substrate.

8. The flexible circuit board according to claim 1 or 2, wherein: The plurality of binding pins include: a plurality of first binding pins and a plurality of second binding pins; the protection layer includes a first protection layer and a second protection layer; The first binding pin and the second binding pin are respectively located at two ends of the flexible circuit board; the first binding pin is located on one side of the substrate, and the second binding pin is located on the side of the substrate away from the first binding pin; the first protective layer is located on the side of the first binding pin away from the substrate, and the second protective layer is located on the side of the second binding pin away from the substrate.

9. A display device, comprising: A display panel and a flexible circuit board as claimed in any one of claims 1 to 8; wherein: The display panel comprises: a display area and a non-display area surrounding the display area; a connecting pin is arranged in the non-display area on one side of the display area; One of the binding pins on the flexible circuit board corresponds to one of the connecting pins on the display panel; The binding pins and the connecting pins corresponding to each other are bound by anisotropic conductive adhesive films.

10. The display device according to claim 9, wherein: The display panel comprises: substrate substrate; A driving circuit layer is located on the base substrate; the driving circuit layer includes a plurality of display signal leads; An organic light emitting diode device layer, located on a side of the driving circuit layer away from the base substrate; An encapsulation layer, located on a side of the organic light emitting diode device layer away from the substrate; A touch function layer, located on a side of the encapsulation layer away from the organic light emitting diode device layer; the touch function layer comprises a plurality of touch signal leads; The connection pins include: display connection pins and touch connection pins; one display signal lead is correspondingly connected to one display connection pin, and one touch signal lead is correspondingly connected to one touch connection pin; The display device includes two flexible circuit boards, namely a display flexible circuit board and a touch flexible circuit board. The touch flexible circuit board is used to bind the touch connection pins, and the display flexible circuit board is used to bind the display connection pins.

11. The display device according to claim 10, wherein: The plurality of binding pins in the touch flexible circuit board include: a plurality of first touch binding pins and a plurality of second touch binding pins; the first touch binding pins and the second touch binding pins are located at two ends of the touch flexible circuit board, and the first touch binding pins and the second touch binding pins are located on the same side of the substrate in the touch flexible circuit board; The first touch binding pin and the touch connecting pin are bound to each other; The plurality of binding pins in the display flexible circuit board include: a plurality of first display binding pins and a plurality of second display binding pins, the first display binding pins and the second display binding pins are located at two ends of the display flexible circuit board, and the first display binding pins and the second display binding pins are located at two sides of the substrate in the display flexible circuit board; The second display binding pin and the display connection pin are bound to each other; The second touch binding pin and the second display binding pin are bound to each other.

Images