A small hole sleeve site folding die cutting method and its product

Abstract

The present application relates to the technical field of die cutting, and discloses a small-hole sleeve position folding die cutting method and a product thereof.The small-hole sleeve position folding die cutting method cuts a virtual line at a folding position to assist folding, and then folds the product along the virtual line and then die cuts, so that the die cutting times can be effectively reduced, the machine adjustment loss of multiple machine adjustments can be reduced, the positioning hole damage caused by multiple hole sleeving can be avoided, the product processing efficiency and product processing precision can be effectively improved, and a large amount of labor cost can be saved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of die cutting, in particular to a small hole sleeve position folding die cutting method and product thereof. BACKGROUND

[0002] Referring to Figure 1 , it is a schematic diagram of a die cutting product, which is a structural die cutting piece in a computer, comprising a three-layer structure, from top to bottom in turn comprising: a first layer of second double-sided adhesive 1 and first double-sided adhesive 2, a second layer of single-sided adhesive 3, and a third layer of second release film 4.

[0003] The existing processing process is to punch each layer of the product structure into shape, and then rely on an assembly jig to assemble each part together by means of manual or mechanical arm grabbing, referring to Figure 2 . The following problems exist: multiple punching times, low production efficiency, and the processing precision of the product cannot be guaranteed. SUMMARY

[0004] The technical problem to be solved by the present application provides a small hole sleeve position folding die cutting method which reduces the number of punching times, improves production efficiency, and improves the processing precision of the product.

[0005] To solve the above technical problems, the present application provides a small hole sleeve position folding die cutting method, comprising the following steps:

[0006] S1, providing a first protective film, a second protective film, a first release film, a second release film, a first double-sided adhesive, and a first cover film, adhering the adhesive-free surface of the second protective film to the first protective film, adhering the first release film and the second release film side by side to the release surface of the second protective film, adhering the double-sided adhesive to the first release film, and adhering the first cover film to the double-sided adhesive;

[0007] S2, performing first die cutting on the first cover film, the first double-sided adhesive, and the second release film;

[0008] S3, removing the first cover film waste, the first double-sided adhesive waste, and the second release film waste generated by the first die cutting, and providing a second double-sided adhesive, a second cover film, a single-sided adhesive, and a third cover film, adhering the second double-sided adhesive to the remaining first cover film and the first release film, adhering the second cover film to the second double-sided adhesive, adhering the single-sided adhesive to the remaining second release film and the second protective film, and adhering the third cover film to the single-sided adhesive;

[0009] S4, performing second die cutting on the second cover film, the second double-sided adhesive, the single-sided adhesive, and the third cover film, and cutting a dashed line on the first protective film between the first release film and the second release film;

[0010] S5, removing the first protective film, removing the second cover film, the third cover film, removing the second double-sided adhesive waste material, single-sided adhesive waste material generated by the second time die cutting, tearing off the second protective film at the bottom of the second double-sided adhesive along the dotted line, folding the remaining second double-sided adhesive, the remaining first double-sided adhesive along the dotted line and the second protective film along the dotted line to the remaining single-sided adhesive, and providing a fourth cover film, and the fourth cover film is attached to the remaining second double-sided adhesive and the remaining first double-sided adhesive;

[0011] S6, the fourth cover film, the remaining first double-sided adhesive, the remaining second double-sided adhesive, and the remaining single-sided adhesive are subjected to a third time die cutting to cut out a product frame.

[0012] In an embodiment of the present application, the following steps are further included:

[0013] S7, removing the frame waste material and the remaining fourth cover film, and covering the tape for winding.

[0014] In an embodiment of the present application, the following steps are further included:

[0015] S8, the tape is subjected to a fourth time die cutting to remove the tape waste material and the remaining second protective film, and winding.

[0016] In an embodiment of the present application, the first release film and the second release film are attached side by side on both sides of the center line of the release surface of the second protective film, and a dotted line is cut on the center line of the first protective film during the second time die cutting.

[0017] In an embodiment of the present application, the first cover film, the second cover film, the third cover film, and the fourth cover film are PE materials.

[0018] In an embodiment of the present application, the materials of the first double-sided adhesive and the second double-sided adhesive are different.

[0019] In an embodiment of the present application, the single-sided adhesive is FTBFAP-15.

[0020] In an embodiment of the present application, the first protective film is an SPE material.

[0021] The present application also provides a small hole set position die cutting machine which adopts any of the above-mentioned small hole set position folding die cutting methods to process the product.

[0022] The present application also provides a die cutting product which is processed by any of the above-mentioned small hole set position folding die cutting methods.

[0023] The above technical solutions of the present application have the following advantages compared with the prior art:

[0024] The small hole sleeve position folding die cutting method can effectively reduce the die cutting times, reduce the machine adjusting loss of multiple machine adjustments, avoid the positioning hole damage caused by multiple hole sleeving, effectively improve the product processing efficiency and product processing precision, and save a large amount of labor cost.

[0025] The above description is only a summary of the technical solutions of the present application, in order to more clearly understand the technical means of the present application, and can be implemented according to the content of the specification, and in order to make the above and other purposes, characteristics and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are as follows. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to make the content of the present application more easily understood, the following is a further detailed description of the present application according to specific embodiments of the present application and in conjunction with the accompanying drawings, wherein

[0027] Figure 1 is a structure diagram of the existing die cutting product;

[0028] Figure 2 is a schematic diagram of the existing processing process;

[0029] Figure 3 is a flow chart of the small hole sleeve position folding die cutting method in embodiment one of the present application;

[0030] Figure 4 is a schematic diagram of the first die cutting in embodiment one of the present application;

[0031] Figure 5 is a back view of the first die cutting in embodiment one of the present application;

[0032] Figure 6 is a schematic diagram of the second die cutting in embodiment one of the present application;

[0033] Figure 7 is a back view of the second die cutting in embodiment one of the present application;

[0034] Figure 8 is a schematic diagram of the third die cutting in embodiment one of the present application;

[0035] Figure 9 is a back view of the third die cutting in embodiment one of the present application;

[0036] Figure 10 is a schematic diagram of the fourth die cutting in embodiment one of the present application;

[0037] Figure 11 is a back view of the fourth die cutting in embodiment one of the present application.

[0038] Explanation of the reference numerals in the specification: 1. Second double-sided tape; 2. First double-sided tape; 3. Single-sided tape; 4. Second release film; 5. First protective film; 6. Second protective film; 7. First release film; 8. First covering film; 9. Second covering film; 10. Third covering film; 11. Fourth covering film; 12. Material tape. DETAILED DESCRIPTION

[0039] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0040] Example 1

[0041] like Figure 3 As shown in FIG. 1 , the small hole nesting folding die-cutting method in this embodiment includes the following steps:

[0042] Step S1: providing a first protective film 5, a second protective film 6, a first release film 7, a second release film 4, a first double-sided tape 2, and a first cover film 8; laminating the non-adhesive surface of the second protective film 6 on the first protective film 5; laminating the first release film 7 and the second release film 4 side by side on the release surface of the second protective film 6; laminating the double-sided tape on the first release film 7; and laminating the first cover film 8 on the double-sided tape;

[0043] Step S2, performing a first die-cutting on the first cover film 8, the first double-sided adhesive tape 2 and the second release film 4; Figure 4 and 5 .

[0044] Step S3: removing the first cover film 8 waste, the first double-sided tape 2 waste, and the second release film 4 waste generated by the first die-cutting, and providing a second double-sided tape 1, a second cover film 9, a single-sided tape 3, and a third cover film 10; laminating the second double-sided tape 1 on the remaining first cover film 8 and the first release film 7, laminating the second cover film 9 on the second double-sided tape 1, laminating the single-sided tape 3 on the remaining second release film 4 and the second protective film 6, and laminating the third cover film 10 on the single-sided tape 3;

[0045] Step S4, perform a second die-cut on the second cover film 9, the second double-sided tape 1, the single-sided tape 3, and the third cover film 10, and cut a dotted line on the first protective film 5 through the first release film 7 and the second release film 4; Figure 6 and 7 .

[0046] Step S5, remove the first protective film 5, remove the second cover film 9, the third cover film 10, remove the second double-sided adhesive tape 1 waste, single-sided adhesive tape 3 waste, tear off the second protective film 6 at the bottom of the second double-sided adhesive tape 1 along the dotted line, fold the remaining second double-sided adhesive tape 1, the remaining first double-sided adhesive tape 2 along the dotted line and the second protective film 6 along the dotted line to the remaining single-sided adhesive tape 3, and provide a fourth cover film 11, and the fourth cover film 11 is attached to the remaining second double-sided adhesive tape 1 and the remaining first double-sided adhesive tape 2;

[0047] Step S6, the fourth cover film 11, the remaining first double-sided adhesive tape 2, the remaining second double-sided adhesive tape 1, and the remaining single-sided adhesive tape 3 are subjected to a third die cutting to cut out a product frame. Refer to Figure 8 And 9 .

[0048] Further, the following steps are also included:

[0049] Step S7, remove the frame waste and the remaining fourth cover film 11, and cover the tape 12 for winding.

[0050] Step S8, the tape 12 is subjected to a fourth die cutting to remove the tape 12 waste and the remaining second protective film 6, and is wound. Refer to Figure 10 And 11 .

[0051] The small hole sleeve folding die cutting method can effectively reduce the die cutting times, reduce the machine adjustment loss of multiple machine adjustments, avoid the damage of the positioning hole caused by multiple hole sleeving, effectively improve the product processing efficiency and product processing precision, and save a large amount of labor cost.

[0052] Optionally, the first release film 7 and the second release film 4 are attached side by side on the center line of the release surface of the second protective film 6, and a virtual line is cut on the center line of the first protective film 5 during the second die cutting.

[0053] Optionally, the first cover film 8, the second cover film 9, the third cover film 10, and the fourth cover film 11 are PE materials. In one embodiment, the first cover film 8, the second cover film 9, the third cover film 10, and the fourth cover film 11 are all PE-30B.

[0054] In this embodiment, the materials of the first double-sided adhesive tape 2 and the second double-sided adhesive tape 1 are different. In one embodiment, the first double-sided adhesive tape 2 is TESA4982, and the thickness is 0.1mm; the second double-sided adhesive tape 1 is TESA60384, and the thickness is 0.1mm.

[0055] In one embodiment, the single-sided adhesive tape 3 is FTBFAP-15, and the thickness is 0.015mm.

[0056] In one embodiment, the first release film 7 and the second release film 4 are both DK100B07S.

[0057] In one embodiment, the material tape 12 is DK50T00D.

[0058] Optionally, the first protective film 5 is an SPE material. In one embodiment, the first protective film 5 is SPE4211, and the second protective film 6 is JKDARS104-P3.

[0059] Embodiment Two

[0060] This embodiment discloses a small-hole sleeve position die-cutting machine which adopts the small-hole sleeve position folding die-cutting method in Embodiment One to die-cut products.

[0061] Embodiment Three

[0062] This embodiment discloses a die-cut product which is processed by the small-hole sleeve position folding die-cutting method in Embodiment One.

[0063] Obviously, the above embodiments are merely examples for clear illustration, and are not intended to limit the embodiments. Based on the above description, those skilled in the art can make other different forms of changes or variations. Here, it is not necessary and impossible to enumerate all the embodiments. The obvious changes or variations derived therefrom are still within the protection scope of the present application.

Claims

1. A small hole nesting folding die cutting method, characterized in that: The following steps are involved: S1. Provide a first protective film, a second protective film, a first release film, a second release film, a first double-sided tape, and a first cover film. Lay the non-adhesive surface of the second protective film on the first protective film, lay the first release film and the second release film side by side on the release surface of the second protective film, lay the first double-sided tape on the first release film, and lay the first cover film on the first double-sided tape. S2, performing a first die-cutting on the first cover film, the first double-sided adhesive tape and the second release film; S3. Remove the first cover film waste, the first double-sided tape waste, and the second release film waste generated by the first die-cutting, and provide a second double-sided tape, a second cover film, a single-sided tape, and a third cover film. Lay the second double-sided tape on the remaining first cover film and the first release film, laminarize the second cover film on the second double-sided tape, laminarize the single-sided tape on the remaining second release film and the second protective film, and laminarize the third cover film on the single-sided tape. S4, performing a second die-cut on the second cover film, the second double-sided tape, the single-sided tape, and the third cover film, and cutting a dotted line on the first protective film between the first release film and the second release film; S5. Remove the first protective film, the second cover film, and the third cover film, remove the second double-sided tape waste and the single-sided tape waste generated by the second die-cutting, tear off the second protective film at the bottom of the second double-sided tape along the dotted line, fold the remaining second double-sided tape, the remaining first double-sided tape, and the second protective film along the dotted line onto the remaining single-sided tape, provide a fourth cover film, and attach the fourth cover film to the remaining second double-sided tape and the remaining first double-sided tape; S6. Perform a third die-cutting operation on the fourth cover film, the remaining first double-sided adhesive tape, the remaining second double-sided adhesive tape, and the remaining single-sided adhesive tape to cut out a product outer frame.

2. The small hole nesting folding die cutting method according to claim 1, characterized in that: The following steps are also included: S7, removing the outer frame waste and the remaining fourth cover film, and covering with the material tape for rewinding.

3. The small hole nesting folding die cutting method according to claim 2, characterized in that: The following steps are also included: S8. Perform a fourth die-cut on the material strip, remove the material strip waste and the remaining second protective film, and rewind.

4. The small hole nesting folding die cutting method according to claim 1, characterized in that: The first release film and the second release film are laminated side by side on both sides of the center line of the release surface of the second protective film. During the second die-cutting, a dotted line is cut on the center line of the first protective film.

5. The small hole nesting folding die cutting method according to claim 1, characterized in that: The first cover film, the second cover film, the third cover film and the fourth cover film are made of PE material.

6. The small hole nesting folding die cutting method according to claim 1, characterized in that: The first double-sided tape and the second double-sided tape are made of different materials.

7. The small hole nesting folding die cutting method according to claim 1, characterized in that: The single-sided adhesive is FTBFAP-15.

8. The small hole nesting folding die cutting method according to claim 1, characterized in that: The first protective film is made of SPE material.

9. A small hole die cutting machine, characterized in that: The product is die-cut using the small hole nesting folding die-cutting method as described in any one of claims 1 to 8.

10. A die-cut product, characterized in that: The product is obtained by using the small hole nesting folding die cutting method as described in any one of claims 1-8.

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