Wafer transmission device and semiconductor process equipment

Abstract

The application discloses a wafer conveying device and a semiconductor process equipment. The conveying device comprises a loading and unloading assembly (100), a storage assembly (200), a carrying mechanism (400) and a first mechanical arm (500). The storage assembly (200) has a plurality of storage positions (210), and at least two storage positions (210) form a group. The storage positions (210) are used for storing wafer carrying boxes. The carrying mechanism (400) is used for conveying at least two wafer carrying boxes stored on the loading and unloading assembly (100) to the first mechanical arm (500) after the at least two wafer carrying boxes are stored on the loading and unloading assembly (100). The first mechanical arm (500) is used for conveying the at least two wafer carrying boxes conveyed by the carrying mechanism (400) to a group of storage positions (210). The above scheme can solve the problem of poor conveying efficiency of the semiconductor process equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip manufacturing, and in particular to a wafer transmission device and semiconductor process equipment. Background Art

[0002] In the related technology, the semiconductor process equipment for chips includes a storage rack, a loading part, an unloading part, a first transfer robot, a second transfer robot and a cleaning equipment. In the specific work process, the first transfer robot transports the chip carrier box full of chips from the storage rack to the loading part, and the second transfer robot grabs the chips and transfers them to the process tank for cleaning, thereby realizing the chip cleaning process.

[0003] However, when the semiconductor processing equipment is reloaded, the empty wafer carrier box in the loading part needs to be transferred back to the storage rack, and the loading part needs to be emptied before reloading. Therefore, the waiting time is long, which makes the transfer efficiency of the semiconductor processing equipment poor. Summary of the Invention

[0004] The invention discloses a wafer transmission device and semiconductor process equipment, so as to solve the problem of poor transmission efficiency of semiconductor process equipment.

[0005] In order to solve the above problems, the present invention adopts the following technical solutions:

[0006] A wafer transmission device includes a loading and unloading assembly, a storage assembly, a carrying mechanism, and a first robot;

[0007] The storage assembly has a plurality of storage locations, and at least two of the storage locations form a group, and the storage locations are used to store the wafer carriers;

[0008] The transport mechanism is used to simultaneously transfer the at least two wafer carriers stored on the loading and unloading assembly to the first robot after the loading and unloading assembly stores at least two wafer carriers;

[0009] The first robot is used to transfer at least two wafer carriers transferred by the transport mechanism to a group of storage locations.

[0010] A semiconductor process equipment comprises a second robot, a process tank and the above-mentioned wafer transmission device, wherein the wafer is transmitted between the storage position and the process tank by the second robot.

[0011] The technical solution adopted by the present invention can achieve the following beneficial effects:

[0012] In the wafer transmission device disclosed in the present invention, the storage component has a plurality of storage positions, which can be used to store empty wafer carriers, and can also be used to temporarily store wafer carriers containing wafers. In this solution, the transmission device does not need to wait for the loading and unloading components to be empty during the loading process. The wafer carriers loaded into the loading and unloading components are transferred to the storage positions of the storage component through the transport mechanism and the first manipulator for temporary storage. When all the storage positions of the storage component are not full, the loading and unloading components will never be occupied and can always load. Compared with the solution in the background technology, the present application reduces the time for the transmission device to return the wafer carrier, thereby shortening the waiting time of the transmission device, thereby improving the transmission efficiency of the semiconductor process equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0014] Figure 1 A schematic structural diagram of a semiconductor process equipment disclosed in an embodiment of the present invention;

[0015] Figure 2 for Figure 1 Cross-sectional view along the AA axis;

[0016] Figure 3 A schematic structural diagram of a grouping mechanism of a semiconductor process equipment disclosed in an embodiment of the present invention;

[0017] Figure 4 This is a top view of the grouping mechanism of the semiconductor process equipment disclosed in an embodiment of the present invention.

[0018] Description of reference numerals:

[0019] 100-loading and unloading assembly, 110-first loading position, 120-second loading position, 130-first unloading position, 140-second unloading position,

[0020] 200-storage component, 210-storage position,

[0021] 300-grouping mechanism, 310-lifting part, 320-translation part, 321-support surface, 330-rotation part,

[0022] 400-carrying mechanism, 410-first carrying part, 420-second carrying part,

[0023] 500-First Robot,

[0024] 600-second manipulator,

[0025] 700-processing tank,

[0026] 800-Storage rack. DETAILED DESCRIPTION

[0027] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] The technical solutions disclosed in various embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0029] like Figures 1 to 4 As shown, an embodiment of the present invention discloses a wafer transfer device, which can realize wafer transfer. The disclosed transfer device includes a loading and unloading assembly 100, a storage assembly 200, a carrying mechanism 400 and a first robot 500.

[0030] The storage assembly 200 has multiple storage locations 210, with at least two storage locations 210 grouped together. These storage locations 210 are used to store wafer carriers. The wafer carriers can hold multiple wafers. Specifically, the wafer carriers can hold 25 wafers. Of course, the wafer carriers can also hold other numbers of wafers, and this is not a limitation herein.

[0031] The transport mechanism 400 is used to simultaneously transfer the at least two wafer carriers stored on the loading and unloading assembly 100 to the first robot 500 after the loading and unloading assembly 100 stores at least two wafer carriers. In other words, the transport mechanism 400 can transfer at least two wafer carriers at a time.

[0032] The first robot 500 is used to transfer at least two wafer carriers transferred by the transport mechanism 400 to a group of storage locations 210 .

[0033] During the specific operation, a wafer carrier containing wafers on the storage rack 800 of the transport device is loaded onto the loading and unloading assembly 100. The transport mechanism 400 transports the wafer carrier on the loading and unloading assembly 100 to the grabbing position of the first robot 500. The first robot 500 grabs the wafer carrier and places it into the storage position 210 of the storage assembly 200 for temporary storage. After the transport mechanism 400 transports and grabs the wafer carrier from the loading and unloading assembly 100, the loading operation can continue on the loading and unloading assembly 100 because the loading and unloading assembly 100 is idle. The loading of the loading and unloading assembly 100 can be carried out simultaneously with the transport operation of the transport mechanism 400 and the first robot 500.

[0034] In the embodiment disclosed in the present application, the storage component 200 has a plurality of storage positions 210, and the storage positions 210 are used to store wafer carriers. In this case, the storage positions 210 can be used to store empty wafer carriers, or can be used to temporarily store wafer carriers containing wafers. The transmission device does not need to wait for the loading and unloading component 100 to be empty during the loading process. The wafer carrier loaded to the loading and unloading component 100 is transferred to the storage position 210 of the storage component 200 through the carrying mechanism 400 and the first manipulator 500 for temporary storage. When all the storage positions 210 of the storage component 200 are not fully stored, the loading and unloading component 100 will never be occupied and can always load. Compared with the solution in the background technology, the present application reduces the time for the transmission device to return the wafer carrier, thereby shortening the waiting time of the transmission device, thereby improving the transmission efficiency of the semiconductor process equipment.

[0035] In addition, since the transport mechanism 400 and the first robot 500 can transport at least two wafer carriers at the same time, the transport efficiency of the transport device can be further improved.

[0036] The above-mentioned storage rack 800 is a component of semiconductor process equipment for storing wafers. The difference between the storage rack 800 and the storage assembly 200 is that the storage rack 800 stores wafers transported from the factory end, while the storage assembly 200 is used to temporarily store wafers during the transportation process of the semiconductor process equipment. Figure 1 shown.

[0037] To improve the process efficiency of semiconductor processing equipment, in another optional embodiment, the transfer device disclosed in the present application may further include a grouping mechanism 300, which may be disposed at a position corresponding to one group of storage locations 210. The grouping mechanism 300 may be used to group or degroup wafers stored in at least two wafer carriers in the corresponding group of storage locations 210.

[0038] During specific operation, while the wafers are being processed, the grouping mechanism 300 can combine the wafers stored in at least two wafer carriers in the corresponding group of storage locations 210. These at least two groups of wafers are combined into one group, and the combined wafers are processed together. For example, if each storage location 210 stores 25 wafers, the number of wafers combined after combining the wafers in the two storage locations 210 is 50. After the wafers have completed processing, the grouping mechanism 300 disassembles the wafers and places them into the corresponding wafer carriers.

[0039] In this solution, at least two groups of wafers are combined into one group, and the combined wafers are processed together, thereby improving the process efficiency of the semiconductor process equipment.

[0040] In this embodiment of the present application, since the storage locations 210 are arranged in groups, the grouping mechanism 300 can simultaneously assemble or disassemble at least two wafer carriers within the same group. Since the first robot 500 and the transport mechanism 400 can simultaneously transport at least two wafer carriers, the grouping mechanism 300 can perform wafer assembly and disassembly operations after a single loading operation, thereby shortening the transport time and further improving the transport efficiency of the transport device.

[0041] This article discloses a specific structure of a grouping mechanism 300, which can of course be other structures and is not limited herein. Specifically, the grouping mechanism 300 can include at least two lifting parts 310 and at least two translation parts 320, and one lifting part 310 can be mounted outside one translation part 320.

[0042] The lifting unit 310 can be used to move the wafer carrier in a vertical direction. The lifting unit 310 switches between a first position and a second position. When the lifting unit 310 is in the first position, the wafers are separated from the wafer carrier and transferred to the translation unit 320. When the lifting unit 310 is in the second position, the wafers can be loaded into the wafer carrier. In other words, when the lifting unit 310 is in the second position, the wafers are located in the wafer carrier. Therefore, when the first robot 500 transfers the wafer carrier containing the wafers to the lifting unit 310, the lifting unit 310 is in the second position.

[0043] At least two translation parts 320 can be used to move together in a horizontal direction to combine the wafers in the corresponding wafer carriers, or move away from each other in a horizontal direction to decompose the wafers in the corresponding wafer carriers.

[0044] During the specific operation, when the elevator 310 is in the second position, the first robot 500 transfers a wafer carrier filled with wafers to the elevator 310. At this point, the wafer carrier is supported on the elevator 310, and the wafers are supported on the translation unit 320. As the elevator 310 descends vertically, the wafer carrier also descends with it, gradually separating the wafers from the wafer carrier until the elevator 310 is in the first position, at which point the wafers are released from the wafer carrier. Once the wafers are released from the wafer carrier, the first robot 500 can remove the empty wafer carrier and store it in another storage location 210.

[0045] Secondly, at least two translation parts 320 are brought closer together in the horizontal direction, so that at least two groups of wafers are brought closer together, and the at least two groups of wafers are combined into one group, and the combined wafers are processed.

[0046] After the combined wafers have completed processing, the first robot 500 transfers the empty wafer carrier stored in the storage location 210 to the elevator 310, which is now in the first position. The at least two translation units 320 gradually move apart horizontally, separating the wafers into at least two groups. After the wafers are separated, the elevator 310 rises, inserting the wafers into the wafer carrier. When the elevator 310 reaches the second position, the wafers are loaded into the wafer carrier.

[0047] In this embodiment, the lifting portion 310 and the translation portion 320 are two independent components, which are provided with corresponding driving mechanisms.

[0048] In this embodiment, the movement of the lifting unit 310 allows the wafers to be separated from the wafer carrier. The separated wafers are then carried on the translation unit 320. The movement of the translation unit 320 enables the assembly and disassembly of the wafers. The movement of the lifting unit 310 and the translation unit 320 allows both the assembly and disassembly of the wafers. The grouping mechanism 300 has fewer parts, simplifying the structure of the wafer transfer device. Furthermore, the lifting unit 310 and the translation unit 320 are two independent components, preventing them from interfering with each other, thereby enhancing the reliability of the wafer transfer device.

[0049] The wafer is thin and easily slides off the translation section 320 when supported on it. In another alternative embodiment, the top of the translation section 320 may have a support surface 321 for supporting the wafer. The support surfaces 321 of at least two translation sections 320 are located in the same plane and may have a tooth-shaped structure. In this solution, when the wafer is supported on the translation section 320, it can be stuck in the gap between two adjacent teeth, effectively preventing the wafer from sliding off and further improving the support stability of the translation section 320.

[0050] In addition, the support surfaces 321 of at least two translation parts 320 can be located in the same plane. In this case, after at least two groups of wafers are assembled, they are arranged at the same height, thereby preventing wafer slippage during the clamping and transmission process.

[0051] In another optional embodiment, the top surface of the lifting portion 310 may be provided with a rotating portion 330. The rotating portion 330 can rotate about its central axis to drive the wafer carrier carried thereon to rotate, thereby achieving face-to-face, back-to-back, and back-to-face positions of the wafers. In this solution, the rotating portion 330 can rotate the wafer carrier, thereby driving the wafers inside the wafer carrier to rotate, and further achieving face-to-face, back-to-back, and back-to-face positions of the assembled wafers to meet the different process requirements of semiconductor processing equipment.

[0052] In the above solution, the lifting portion 310 can drive the rotating portion 330 to move up and down together, but the lifting portion 310 and the rotating portion 330 are driven separately.

[0053] In another optional embodiment, the loading and unloading assembly 100 may include a first loading position 110, a second loading position 120, a first unloading position 130 and a second unloading position 140. The first loading position 110 and the first unloading position 130 can both store at least one chip carrier box, and the second loading position 120 and the second unloading position 140 can both store at least two chip carrier boxes.

[0054] The transport mechanism 400 may include a first transport part 410 and a second transport part 420. The wafer carrier box can be transferred between the first loading position 110 and the second loading position 120 through the first transport part 410, and the wafer carrier box can be transferred between the second loading position 120 and the first robot 500 through the first transport part 410.

[0055] The wafer carrier can be transferred between the first unloading position 130 and the second unloading position 140 via the second carrier 420 , and the wafer carrier can be transferred between the second unloading position 140 and the first robot 500 via the second carrier 420 .

[0056] In this solution, the first loading position 110, the second loading position 120 and the first carrying part 410 are used for loading the transmission device, and the first unloading position 130, the second unloading position 140 and the second carrying part 420 are used for unloading the transmission device. Therefore, loading and unloading are carried out separately, so that the loading operation and the unloading operation will not affect each other.

[0057] In addition, loading and unloading are carried out separately, which correspondingly improves the working efficiency of the transmission device.

[0058] Optionally, the first transport part 410 and the second transport part 420 may be AGV (Automated Guided Vehicle) vehicles. Of course, the first transport part 410 and the second transport part 420 may also be other structures, which is not limited herein.

[0059] In the above embodiment, the first loading position 110 and the first unloading position 130 are both capable of storing at least one wafer carrier box. Due to the influence of the layout of the semiconductor process equipment, the first loading position 110 and the first unloading position 130 may only be able to load and unload one wafer carrier box at a time. At this time, the wafer carrier box loaded by the first loading position 110 for the first time is first transferred to the second loading position 120 for temporary storage through the first carrier part 410. After the first loading position 110 loads the wafer for the second time, the first carrier part 410 transports the wafer carrier box loaded for the second time to the second loading position 120. At this time, the first carrier part 410 can transfer the wafer carrier boxes loaded twice to the clamping position of the first robot 500 together.

[0060] The unloading operation is similar to the loading operation and will not be described in detail in this article.

[0061] Alternatively, in the above embodiment, the first loading position 110 and the first unloading position 130 can both store at least two wafer carriers. In this case, the transport mechanism 400 can simultaneously transport at least two wafer carriers.

[0062] Furthermore, the first loading position 110 can move between the second loading position 120 and the storage rack 800, that is, the first loading position 110 can move to a position close to the storage rack 800, and the first carrying part 410 can load the first loading position 110. After the first loading position 110 is loaded, it moves to a position close to the second loading position 120, and the chip carrier box on the first loading position 110 is transferred to the second loading position 120 for temporary storage through the first carrying mechanism 400. At this time, the first loading position 110 is idle, and the first loading position 110 moves to the position of the storage rack 800 again, and then the loading operation is performed.

[0063] In this solution, the first carrying portion 410 carries the wafer carrier and the first loading position 110 loads materials simultaneously, thereby shortening the loading time and further improving the transmission efficiency of the transmission device.

[0064] Optionally, the storage rack 800 and the first loading position 110 can be connected by a telescopic rod, which can be driven by a power structure such as a cylinder or a hydraulic cylinder. When the telescopic rod is extended, the first loading position 110 is pushed closer to the storage rack 800, and when the telescopic rod is shortened, the first loading position 110 is pushed closer to the second loading position 120.

[0065] In another optional embodiment, the first unloading position 130 can be moved between the second unloading position 140 and the storage rack 800. That is, the first unloading position 130 can be moved to a position close to the second unloading position 140, and the second carrying portion 420 can transfer the wafer carrier box on the second unloading position 140 to the first unloading position 130. Then, the first unloading position 130 can be moved to a position close to the storage rack 800, and the wafer carrier box on the first unloading position 130 can be unloaded to the storage rack 800.

[0066] In this solution, the second carrying portion 420 carries the wafer carrier and the first unloading position 130 unloads materials simultaneously, thereby shortening the unloading time and further improving the transmission efficiency of the transmission device.

[0067] Optionally, the storage rack 800 and the first unloading position 130 may be connected by a telescopic rod, which may be driven by a power structure such as a pneumatic cylinder or a hydraulic cylinder. When the telescopic rod is extended, the first unloading position 130 is pushed closer to the storage rack 800, and when the telescopic rod is shortened, the first unloading position 130 is pushed closer to the second unloading position 140.

[0068] In another alternative embodiment, the plurality of storage locations 210 are spaced apart along a first direction and a second direction, the first direction and the second direction being perpendicular to each other. The first direction may be the height direction of the transmission device, and the second direction may be the width direction or the length direction of the transmission device. In other words, the plurality of storage locations 210 may be arranged along a plane containing the height direction and the length direction of the transmission device, or the plurality of storage locations 210 may be arranged along a plane containing the height direction and the width direction of the transmission device.

[0069] In this solution, the storage locations 210 are mainly arranged in the height direction, and thus occupy less dimensions in the length direction and the width direction, thereby reducing the floor space of the transmission device.

[0070] The above solution can be generally understood as follows: the storage component 200 can be a shelf, and a plurality of storage positions are set along the height direction of the shelf, and this position is the storage position 210.

[0071] In another optional embodiment, the first robot 500 can move along the first direction and the second direction, and the carrying mechanism 400 can move along the third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

[0072] Optionally, the first direction may be a height direction of the transmission device, the second direction may be a width direction of the transmission device, and the third direction may be a length direction of the transmission device.

[0073] In this scheme, the movement of the first robot 500 and the carrier mechanism 400 in different directions can make the wafer carrier have a larger transmission range, so that the setting position of each component of the transmission device is not affected by the transmission direction.

[0074] In addition, the movement of the first robot 500 and the carrier mechanism 400 in different directions can also prevent the first robot 500 and the second robot 600 from interfering.

[0075] As shown in Figure 2 , the first carrier 410 and the second carrier 420 move on the lower side of the storage assembly 200, at this time, the two groups of storage sites 210 of the bottom layer of the storage assembly 200 can be set as empty sites, so as to facilitate the movement of the first carrier 410 and the second carrier 420. The first robot 500 needs to move along the height direction of the transmission device, so the top positions corresponding to the first carrier 410 are all empty sites, which reserves a moving space for the first robot 500 to move along the height direction.

[0076] As shown in Figure 2 , when the first carrier 410 moves the wafer carrier on the second feeding site 120 to the grabbing position of the first robot 500 during feeding, the first robot 500 grabs the wafer carrier on the first carrier 410, and in the case that the storage site 210 corresponding to the grouping mechanism 300 is idle, the wafer carrier can be transmitted to the 3rd storage site corresponding to the grouping mechanism 300. Figure 2 When the storage site 210 corresponding to the grouping mechanism 300 is occupied, the first robot 500 can transmit the wafer carrier to other storage sites 210 Figure 2 corresponding to the 4th to 13th storage sites, and when the storage site 210 corresponding to the grouping mechanism 300 is idle, the first robot 500 transmits the wafer carrier to the storage site 210 corresponding to the grouping mechanism 300 again, and performs grouping operation on the wafer.

[0077] As shown in Figure 2 , during discharging, the first robot 500 transmits the wafer carrier on the 3rd to 13th storage sites 210 to the second carrier 420, and the second carrier 420 transmits to the second discharging site 140.

[0078] As can be seen from Figure 2 , the 1st and 2nd storage sites of the storage assembly 200 are empty sites, the first carrier 410 can move to the 1st storage site during carrying, and the second carrier 420 can move to the 2nd storage site during moving. No storage site is set above the 1st storage site, which is to reserve a space for the first robot 500 to move along the height direction.

[0079] Figure 1The figure does not show the storage positions 4 to 13, but only shows the movement process of the first carrier 410 from the second loading position 120 to the storage position 1, and the movement process of the second carrier 420 from the storage position 2 to the second unloading position 140. Figure 1 It shows the movement process of the first carrying part 410 and the second carrying part 420.

[0080] Based on the transfer device of any of the above-mentioned embodiments of the present invention, an embodiment of the present invention further discloses a semiconductor process equipment, wherein the disclosed semiconductor process equipment has the transfer device of any of the above-mentioned embodiments. The transfer device disclosed in the present application also includes a second robot 600 and a process tank 700, and the wafer is transferred between the storage position 210 and the process tank 700 by the second robot 600. In other words, the second robot 600 clamps the wafer in the wafer carrier box into the process tank 700, and the wafer undergoes process operations in the process tank 700. The process tank 700 can perform processes such as cleaning and etching. Of course, the process tank 700 can also perform other processes, which are not limited in this article.

[0081] Specifically, the second robot 600 is used to transfer the wafers assembled by the grouping mechanism 300 to the process tank 700 . That is, the assembled wafers are transferred between the storage position 210 corresponding to the grouping mechanism 300 and the process tank 700 by the second robot 600 .

[0082] In this solution, the transfer device does not need to wait for the loading and unloading assembly 100 to be empty during the loading process. The wafer carrier loaded into the loading and unloading assembly 100 is transferred to the storage position 210 of the storage assembly 200 by the carrier mechanism 400 and the first manipulator 500 for temporary storage. When all the storage positions 210 of the storage assembly 200 are not full, the loading and unloading assembly 100 will not be occupied and can continue to load materials. Compared with the solution in the background art, this application reduces the time it takes for the transfer device to return the wafer carrier, thereby shortening the waiting time of the transfer device and thereby improving the transmission efficiency of the semiconductor process equipment.

[0083] In another optional embodiment, there may be a plurality of process tanks 700 , and the plurality of process tanks 700 are arranged at intervals along a straight line.

[0084] In this solution, different process solutions can be placed in the multiple process tanks 700, thereby achieving different process effects, thereby improving the process performance of the semiconductor process equipment. For example, different cleaning solutions can be placed in the multiple process tanks 700, thereby achieving different cleaning effects.

[0085] In addition, the plurality of process tanks 700 are arranged in a straight line, thereby making the movement of the second robot 600 simpler.

[0086] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0087] The foregoing is merely an embodiment of the present invention and is not intended to limit the present invention. It will be apparent to those skilled in the art that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention are intended to be included within the scope of the claims of the present invention.

Claims

1. A wafer transmission device, characterized in that: It includes a loading and unloading assembly (100), a storage assembly (200), a transport mechanism (400) and a first manipulator (500); The storage component (200) has a plurality of storage locations (210), and at least two of the storage locations (210) form a group, and the storage locations (210) are used to store wafer carriers; The transport mechanism (400) is used to simultaneously transfer the at least two wafer carriers stored on the loading and unloading assembly (100) to the first robot (500) after the at least two wafer carriers are stored on the loading and unloading assembly (100); The first robot (500) is used to transfer at least two wafer carriers transferred by the transport mechanism (400) to a group of storage locations (210); The transmission device further comprises a grouping mechanism (300), the grouping mechanism (300) being arranged at a corresponding position of one group of the storage positions (210); the grouping mechanism (300) being used to combine or decompose the wafers in the at least two wafer carriers stored in the corresponding group of the storage positions (210); The grouping mechanism (300) includes at least two lifting parts (310) and at least two translation parts (320), one lifting part (310) is mounted outside one translation part (320); the lifting part (310) is used to drive the chip carrier box to move in the vertical direction, and the lifting part (310) switches between a first position and a second position. When the lifting part (310) is at the first position, the chip is separated from the chip carrier box and transferred to the translation part (320); when the lifting part (310) is at the second position, the chip is loaded into the chip carrier box; at least two translation parts (320) are used to move together in the horizontal direction to combine the chips in the corresponding chip carrier box, or move away in the horizontal direction to decompose the chips in the corresponding chip carrier box.

2. The transmission device according to claim 1, characterized in that The top end of the translation part (320) has a supporting surface (321), and the supporting surface (321) is used to support the wafer. The supporting surfaces (321) of the at least two translation parts (320) are located in the same plane, and the supporting surfaces (321) are tooth-shaped structures.

3. The transmission device according to claim 1, characterized in that A rotating portion (330) is provided on the top surface of the lifting portion (310), and the rotating portion (330) rotates around its central axis to drive the wafer carrier box carried thereon to rotate, so as to achieve face-to-face, back-to-back and back-to-face state switching of the wafers.

4. The transmission device according to claim 1, characterized in that The loading and unloading assembly (100) comprises a first loading position (110), a second loading position (120), a first unloading position (130) and a second unloading position (140), wherein the first loading position (110) and the first unloading position (130) are both capable of storing at least one wafer carrier box, and the second loading position (120) and the second unloading position (140) are both capable of storing at least two wafer carrier boxes; The transport mechanism (400) comprises a first transport part (410) and a second transport part (420); the wafer carrier is transported between the first loading position (110) and the second loading position (120) via the first transport part (410); and the wafer carrier is transported between the second loading position (120) and the first manipulator (500) via the first transport part (410); The wafer carrier box is transferred between the first unloading position (130) and the second unloading position (140) via the second carrier (420), and the wafer carrier box is transferred between the second unloading position (140) and the first robot (500) via the second carrier (420).

5. The transmission device according to claim 1, characterized in that A plurality of groups of storage positions (210) are distributed at intervals along a first direction and a second direction, the first direction and the second direction are perpendicular to each other, and the first direction is the height direction of the transmission device.

6. The transmission device according to claim 5, characterized in that The first manipulator (500) moves along the first direction and the second direction, and the transport mechanism (400) moves along a third direction, wherein the first direction, the second direction and the third direction are perpendicular to each other.

7. A semiconductor process equipment, characterized in that: The invention comprises a second robot (600), a process tank (700) and a transfer device according to any one of claims 1 to 6, wherein the wafer is transferred between the storage position (210) and the process tank (700) by the second robot (600).

8. The semiconductor process equipment according to claim 7, wherein: There are a plurality of process tanks (700), and the plurality of process tanks (700) are arranged at intervals along a straight line.

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