Automatic tinning device and tinning method for PCB

Abstract

The application discloses a kind of automatic tinning device and tinning method of PCB circuit board, it is related to circuit board automatic tinning technical field, including: tinning table;Placement mechanism, the placement mechanism is installed on the bottom shell wall of tinning table, the placement mechanism is used to fix PCB circuit board, while it is convenient to take and place;Tinning mechanism, the tinning mechanism is installed on the top shell wall of tinning table, the placement mechanism is below tinning mechanism, the tinning mechanism has smearing flux, tinning and cleaning integrated function.The structure in placement mechanism is convenient to fix, clamping circuit board body, it is convenient to take in the process of fixing, clamping, improve tinning efficiency;The structure in tinning mechanism is convenient to tinning circuit board body automatically, and in the process of tinning, the surface of circuit board body can be cleaned, prevent splashing to the circuit board body of tinned paste outside line dirty, guarantee the neatness of circuit board body.

Description

Technical Field

[0001] This invention relates to the field of automatic tin plating technology for circuit boards, specifically to an automatic tin plating device and method for PCB circuit boards. Background Technology

[0002] Circuit boards are named as follows: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed circuit board (copper etching technology), etc. Circuit boards miniaturize and visualize circuits, playing an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Circuit boards can also be called printed circuit boards or printed circuit boards. The emergence and development of FPC circuit boards (also known as flexible circuit boards, which are highly reliable and highly flexible printed circuit boards made with polyimide or polyester film as the substrate, characterized by high wiring density, light weight, thinness, and good bending properties) and rigid-flex boards. Therefore, a rigid-flex board is a circuit board that combines flexible and rigid circuit boards through processes such as lamination, according to relevant technological requirements, to form a circuit board with both FPC and PCB characteristics.

[0003] In the prior art, such as the Chinese patent CN206389628U entitled "A Tin Plating Device for Printed Circuit Boards," a base, a cover plate, a fixing seat, and a brush are included. The cover plate is hinged to the base, and the fixing seat is fixedly mounted on the base. The cover plate has several through holes of the same size as the areas on the surface of the printed circuit board to be tinned. A cover film is laid on the surface of the cover plate. The width of the cover film is smaller than the width of the cover plate but larger than the width of the fixing seat. The cover film has through holes corresponding to the positions on the surface of the printed circuit board to be tinned. Its advantages are that the fixing seat is used to fix the printed circuit board, and the through holes on the cover plate and cover film are used to locate the positions to be tinned. Manual tinning results in good tinning quality. For different types of circuit boards, only the corresponding cover film needs to be made to complete the tinning. The production time is short, the cost is low, and it is suitable for tinning operations of various types and small batches of printed circuit boards.

[0004] However, in the existing technology, manual soldering is not only very inefficient, but it also makes the surface of the PCB circuit board dirty. If it is not cleaned in time, the solder paste will be difficult to clean after it dries, affecting the cleanliness of the PCB circuit board. Summary of the Invention

[0005] The purpose of this invention is to overcome the technical problems of existing technologies, such as the low efficiency of manual tin plating and the soiling of the PCB circuit board surface. This invention provides an automatic tin plating device and method for PCB circuit boards. The vertical tin plating machine has the advantages of good stability, simple structure, and suitability for long-term operation.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] An automatic tin plating device for PCB circuit boards includes:

[0008] Tin plating station;

[0009] A placement mechanism is installed on the bottom shell wall of the tin plating table. The placement mechanism is used to fix the PCB circuit board and facilitate its placement and removal.

[0010] A tin plating mechanism is installed on the top shell wall of the tin plating table, and the placement mechanism is located below the tin plating mechanism. The tin plating mechanism has integrated functions of applying flux, tin plating, and cleaning.

[0011] Preferred:

[0012] The placement mechanism includes:

[0013] A tripod is provided, with a placement rack installed on the top of the tripod. A circuit board body is placed inside the placement rack, and a spring is fixedly connected to the inner wall of the placement rack. A rubber extrusion plate is fixedly connected to one end of the spring. The two rubber extrusion plates are located on both sides of the circuit board body, and circuit board fixing components and positioning components are installed on both sides of the placement rack.

[0014] Preferred:

[0015] The circuit board fixing assembly includes:

[0016] The rotating shaft has a groove on the top of the placement rack. The rotating shaft is rotatably connected to the groove, and an L-shaped fastener is fixedly fitted on the outer ring of the rotating shaft. A positioning groove is provided on one side of the L-shaped fastener.

[0017] Preferred:

[0018] The positioning component includes:

[0019] The connecting block has grooves on both outer walls of the placement rack. The connecting block is slidably connected to the grooves. A spring is fixedly connected to one side of the connecting block, and one end of the spring is fixedly connected to the groove.

[0020] Preferred:

[0021] The inner ring of the connecting block is fixedly fitted with a pull rod and a connecting plate. The pull rod passes through the second groove. A positioning shaft is fixedly connected to one side of the connecting plate. One end of the positioning shaft passes through the second groove and is inserted into the positioning groove.

[0022] Preferred:

[0023] The inner wall of the placement rack is provided with a sliding groove, and a slider is fixedly connected to one side of the rubber extrusion plate. The slider is slidably connected to the sliding groove.

[0024] Preferred:

[0025] The tin plating mechanism includes:

[0026] A servo motor is fixedly connected to the top of the tin plating station by bolts, and the output shaft of the servo motor is fixedly connected to a drive shaft. One end of the drive shaft passes through the top of the tin plating station and is fixedly connected to a cam.

[0027] Preferred:

[0028] The outer ring of the cam is fitted with a hollow frame, and a fixing frame is welded to one side of the hollow frame. The fixing frame is rotatably connected to a flux brush roller and a tin plating brush roller, and a guide block is fixedly connected to the top of the fixing frame. A guide groove is opened on the top of the tin plating table, and the guide block is slidably connected to the guide groove.

[0029] Preferred:

[0030] The bottom of the fixed frame is fixedly connected to a connecting rod 2 via a connecting rod 1. The connecting rod 2 is fixedly connected to two cleaning brushes, and the flux brush roller and the tin plating brush roller are located between the two cleaning brushes.

[0031] This invention also discloses a tin plating method for an automatic tin plating device for PCB circuit boards, which includes the following steps:

[0032] S1: Pull the lever to make the connecting block slide in the second groove. While the connecting block is sliding, it will drive the positioning shaft to slide through the connecting plate. When the positioning shaft is disengaged from the positioning groove, the L-shaped fastener can rotate. When the long axis of the L-shaped fastener moves away from the placement frame body, the circuit board body is placed in it.

[0033] S2: After the circuit board body is flipped into the placement rack, the pull rod is released. The connecting block will drive the positioning shaft to re-insert into the positioning groove through the force of the second spring. When the positioning shaft is inside the positioning groove, the L-shaped fastener will be unable to rotate, thus fixing the circuit board body.

[0034] S3: After fixing the circuit board body, start the servo motor. The servo motor drives the cam to rotate in the inner circle of the cutout frame through the transmission shaft. The rotation of the cam will drive the fixed frame to make linear reciprocating motion on the top shell wall of the tin plating table through the cutout frame and guide block.

[0035] S4: During the linear reciprocating motion of the fixing frame, the fixing frame will drive all the structures connected to it to move together. Among them, the cleaning brush away from the cutout frame will come into contact with the circuit board body first, and the cleaning brush will clean the dirt on the surface of the circuit board body.

[0036] S5: After cleaning the dirt on the surface of the circuit board, the flux brush roller will apply a layer of flux to the surface of the circuit board. Then, when the tin plating brush roller passes over the surface of the circuit board, it will plate a layer of tin. After that, the cleaning brush near the cutout frame will clean the dirt on the surface of the circuit board again. This process is repeated until the tin plating is completed.

[0037] S6: Finally, pull the lever to make the connecting block slide in the second groove. While the connecting block is sliding, it will drive the positioning shaft to slide through the connecting plate. When the positioning shaft is disengaged from the positioning groove, the L-shaped fastener can rotate. When the long axis of the L-shaped fastener moves away from the placement frame body, the circuit board body can be taken out from it.

[0038] Compared with the prior art, the beneficial effects of the present invention are:

[0039] 1. In this invention, the combination of the placement mechanism and the tin plating mechanism facilitates automatic tin plating of the circuit board body, greatly improving tin plating efficiency and reducing manual labor intensity.

[0040] 2. In this invention, the structure in the placement mechanism facilitates the fixing and clamping of the circuit board body, making it easy to pick up during the fixing and clamping process and improving the tin plating efficiency.

[0041] 3. In this invention, the structure in the tin plating mechanism facilitates automatic tin plating of the circuit board body, and during the tin plating process, the surface of the circuit board body can be cleaned to prevent solder paste from splashing outside the circuit and soiling the circuit board body, thus ensuring the cleanliness of the circuit board body. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the overall structure of an automatic tin plating device and tin plating method for a PCB circuit board according to one embodiment of the present invention.

[0043] Figure 2 This is a schematic diagram of the overall structure of the placement mechanism in an automatic tin plating device and tin plating method for a PCB circuit board according to one embodiment of the present invention.

[0044] Figure 3 This is an enlarged structural diagram of point A in an automatic tin plating device and tin plating method for a PCB circuit board according to one embodiment of the present invention.

[0045] Figure 4 This is a schematic diagram of the overall structure of the circuit board fixing component and positioning component in an automatic tin plating device and tin plating method for a PCB circuit board according to one embodiment of the present invention.

[0046] Figure 5 This is a schematic diagram of the overall structure of the tin plating mechanism in an automatic tin plating device and tin plating method for a PCB circuit board according to one embodiment of the present invention.

[0047] Figure 6 This is a schematic diagram of the overall structure of the servo motor in an automatic tin plating device and tin plating method for a PCB circuit board according to one embodiment of the present invention.

[0048] In the picture:

[0049] 1. Tin plating table; 2. Placement mechanism; 21. Tripod; 22. Placement rack; 23. Spring 1; 24. Rubber extrusion plate; 25. Circuit board body; 26. Circuit board fixing assembly; 261. Rotating shaft; 262. L-shaped fastener; 263. Positioning groove; 27. Positioning assembly; 271. Connecting block; 272. Pull rod; 273. Connecting plate; 274. Positioning shaft; 275. Spring 2; 3. Tin plating mechanism; 31. Servo motor; 32. Drive shaft; 33. Cam; 34. Fixing frame; 35. Hollow frame; 36. Flux brush roller; 37. Tin plating brush roller; 38. Connecting rod 1; 39. Connecting rod 2; 310. Cleaning brush. Detailed Implementation

[0050] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] Combined with appendix Figure 1-6 In this embodiment, an automatic tin plating device and tin plating method for PCB circuit boards includes: a tin plating table 1; a placement mechanism 2, which is installed on the bottom shell wall of the tin plating table 1 and is used to fix the PCB circuit board and facilitate its placement and removal; and a tin plating mechanism 3, which is installed on the top shell wall of the tin plating table 1 and the placement mechanism 2 is located below the tin plating mechanism 3. The tin plating mechanism 3 has integrated functions of applying flux, tin plating and cleaning.

[0052] Specifically, the tin plating mechanism 3 can move above the placement mechanism 2. The cooperation between the placement mechanism 2 and the tin plating mechanism 3 facilitates automatic tin plating of the circuit board body 25, greatly improving tin plating efficiency and reducing manual labor intensity.

[0053] To facilitate a thorough understanding of the specific structure and principle of the placement mechanism 2 by those skilled in the art, further explanation of the placement mechanism 2 is provided. In this embodiment, the placement mechanism 2 includes: a tripod 21, a placement frame 22 mounted on the top of the tripod 21, a circuit board body 25 placed inside the placement frame 22, and a spring 23 fixedly connected to the inner wall of the placement frame 22. One end of the spring 23 is fixedly connected to a rubber extrusion plate 24, and the two rubber extrusion plates 24 are respectively located on both sides of the circuit board body 25. Circuit board fixing components 26 and positioning components 27 are mounted on both sides of the placement frame 22. The circuit board fixing component 26 includes: a rotating shaft 261, a groove 1 formed on the top of the placement frame 22, the rotating shaft 261 rotatably connected to the groove 1, and an L-shaped fixing member 262 fixedly fitted around the outer ring of the rotating shaft 261. A positioning groove 263 is provided on one side; the positioning component 27 includes: a connecting block 271, and grooves 22 are provided on both outer walls of the placement frame 22. The connecting block 271 is slidably connected to the grooves 22. A spring 275 is fixedly connected to one side of the connecting block 271, and one end of the spring 275 is fixedly connected to the groove 22. A pull rod 272 and a connecting plate 273 are fixedly sleeved on the inner ring of the connecting block 271. The pull rod 272 passes through the groove 22. A positioning shaft 274 is fixedly connected to one side of the connecting plate 273. One end of the positioning shaft 274 passes through the groove 22, and the positioning shaft 274 is inserted into the positioning groove 263. A sliding groove is provided on the inner wall of the placement frame 22. A slider is fixedly connected to one side of the rubber extrusion plate 24, and the slider is slidably connected to the sliding groove.

[0054] Specifically, the rubber extrusion plate 24 can move stably on the placement frame 22 through the cooperation of the slider and the groove. When the circuit board body 25 is located between the two rubber extrusion plates 24, the rubber extrusion plate 24 will firmly clamp the circuit board body 25 through the force of the spring 23, so that it is stably installed on the placement frame 22.

[0055] To facilitate a thorough understanding of the specific structure and principle of the tin plating mechanism 3 by those skilled in the art, further explanation of the tin plating mechanism 3 is provided. In this embodiment, the tin plating mechanism 3 includes: a servo motor 31, which is fixedly connected to the top of the tin plating table 1 by bolts, and the output shaft of the servo motor 31 is fixedly connected to a transmission shaft 32. One end of the transmission shaft 32 passes through the top of the tin plating table 1 and is fixedly connected to a cam 33; a hollow frame 35 is fitted around the outer ring of the cam 33, and a fixing frame 34 is welded to one side of the hollow frame 35. The fixing frame 34 is rotatably connected to a flux brush roller 36 and a tin plating brush roller 37, and a guide block is fixedly connected to the top of the fixing frame 34. A guide groove is opened on the top of the tin plating table 1, and the guide block is slidably connected to the guide groove; a connecting rod 39 is fixedly connected to the bottom of the fixing frame 34 by a connecting rod 38, and two cleaning brushes 310 are fixedly connected to the connecting rod 39. The flux brush roller 36 and the tin plating brush roller 37 are located between the two cleaning brushes 310.

[0056] Working principle: First, pulling the lever 272 causes the connecting block 271 to slide within the second groove. As the connecting block 271 slides, it drives the positioning shaft 274 to slide via the connecting plate 273. Once the positioning shaft 274 disengages from the positioning groove 263, the L-shaped fixing member 262 can rotate. When the long axis of the L-shaped fixing member 262 moves away from the main body of the placement rack 22, the circuit board body 25 is placed inside. After the circuit board body 25 is inside the placement rack 22, releasing the lever 272 causes the connecting block 271 to move via the second spring 275. The force drives the positioning shaft 274 to re-insert into the positioning groove 263. When the positioning shaft 274 is inside the positioning groove 263, the L-shaped fixing piece 262 cannot rotate, thus fixing the circuit board body 25. After fixing the circuit board body 25, the servo motor 31 is started. The servo motor 31 drives the cam 33 to rotate in the inner ring of the hollow frame 35 through the transmission shaft 32. The rotation of the cam 33 will drive the fixing frame 34 to perform linear reciprocating motion on the top shell wall of the tin plating station 1 through the hollow frame 35 and the guide block. 4. During the linear reciprocating motion, the fixed frame 34 will drive all the structures connected to it to move together. Among them, the cleaning brush 310, which is away from the cutout frame 35, will first come into contact with the circuit board body 25, and clean the dirt on the surface of the circuit board body 25 through the cleaning brush 310. After cleaning the dirt on the surface of the circuit board body 25, the flux brush roller 36 will apply a layer of flux to the surface of the circuit board body 25, and then the tin plating brush roller 37 will plate a layer of tin on the surface of the circuit board body 25 as it passes over it. The cleaning brush 310, located near the cutout frame 35, will clean the dirt on the surface of the circuit board body 25 again. This process is repeated until the tin plating is completed. Finally, the pull rod 272 is pulled to make the connecting block 271 slide in the groove. While the connecting block 271 is sliding, it will drive the positioning shaft 274 to slide through the connecting plate 273. When the positioning shaft 274 is disengaged from the positioning groove 263, the L-shaped fixing piece 262 can be rotated. When the long axis of the L-shaped fixing piece 262 is away from the body of the placement frame 22, the circuit board body 25 can be removed from it.

[0057] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An automatic tin plating device for PCB circuit boards, characterized in that, include: Tin plating station (1); A placement mechanism (2) is installed on the bottom shell wall of the tin plating table (1). The placement mechanism (2) is used to fix the PCB circuit board and facilitate its placement and removal. The placement mechanism (2) includes: A tripod (21) is provided with a placement rack (22) on its top. The placement rack (22) contains a circuit board body (25), and a spring (23) is fixedly connected to the inner wall of the placement rack (22). A rubber extrusion plate (24) is fixedly connected to one end of the spring (23). The two rubber extrusion plates (24) are located on both sides of the circuit board body (25), and a circuit board fixing assembly (26) and a positioning assembly (27) are installed on both sides of the placement rack (22). The circuit board fixing assembly (26) includes: A rotating shaft (261) is provided on the top of the placement rack (22), the rotating shaft (261) is rotatably connected to the groove, and the outer ring of the rotating shaft (261) is fixedly fitted with an L-shaped fastener (262), and a positioning groove (263) is provided on one side of the L-shaped fastener (262). The positioning component (27) includes: The connecting block (271) has grooves on both outer walls of the placement rack (22). The connecting block (271) is slidably connected to the grooves. A spring (275) is fixedly connected to one side of the connecting block (271). One end of the spring (275) is fixedly connected to the groove. A pull rod (272) and a connecting plate (273) are fixedly sleeved on the inner ring of the connecting block (271). The pull rod (272) passes through the groove. A positioning shaft (274) is fixedly connected to one side of the connecting plate (273). One end of the positioning shaft (274) passes through the groove and is inserted into the positioning groove (263). The tin plating mechanism (3) is installed on the top shell wall of the tin plating table (1), and the placement mechanism (2) is located below the tin plating mechanism (3). The tin plating mechanism (3) has an integrated function of applying flux, tin plating and cleaning.

2. The automatic tin plating device for a PCB circuit board according to claim 1, characterized in that... The inner wall of the placement rack (22) is provided with a sliding groove, and a slider is fixedly connected to one side of the rubber extrusion plate (24), and the slider is slidably connected to the sliding groove.

3. The automatic tin plating device for a PCB circuit board according to claim 2, characterized in that: The tin plating mechanism (3) includes: A servo motor (31) is fixedly connected to the top of the tin plating station (1) by bolts, and the output shaft of the servo motor (31) is fixedly connected to a transmission shaft (32). One end of the transmission shaft (32) passes through the top of the tin plating station (1) and is fixedly connected to a cam (33).

4. The automatic tin plating device for a PCB circuit board according to claim 3, characterized in that: The outer ring of the cam (33) is fitted with a hollow frame (35). A fixing frame (34) is welded to one side of the hollow frame (35). The fixing frame (34) is rotatably connected to a flux brush roller (36) and a tin plating brush roller (37). A guide block is fixedly connected to the top of the fixing frame (34). A guide groove is opened on the top of the tin plating table (1). The guide block is slidably connected to the guide groove.

5. The automatic tin plating device for a PCB circuit board according to claim 4, characterized in that: The bottom of the fixed frame (34) is fixedly connected to the connecting rod (39) via the connecting rod (38). The connecting rod (39) is fixedly connected to two cleaning brushes (310). The flux brush roller (36) and the tin plating brush roller (37) are located in the middle of the two cleaning brushes (310).

6. A tin plating method for an automatic tin plating device for a PCB circuit board, employing the automatic tin plating device for a PCB circuit board as described in claim 5, characterized in that... Includes the following steps: S1: Pull the lever (272) to drive the connecting block (271) to slide in the groove. While the connecting block (271) is sliding, it will drive the positioning shaft (274) to slide through the connecting plate (273). When the positioning shaft (274) is disengaged from the positioning groove (263), the L-shaped fixing piece (262) can rotate. When the long axis of the L-shaped fixing piece (262) is away from the main body of the placement frame (22), the circuit board body (25) is placed in it. S2: After the circuit board body (25) is flipped into the placement rack (22), the pull rod (272) is released. The connecting block (271) will drive the positioning shaft (274) to re-insert into the positioning groove (263) through the force of the second spring (275). When the positioning shaft (274) is inside the positioning groove (263), the L-shaped fastener (262) will not be able to rotate, thus fixing the circuit board body (25). S3: After fixing the circuit board body (25), start the servo motor (31). The servo motor (31) drives the cam (33) to rotate in the inner ring of the cutout frame (35) through the transmission shaft (32). The rotation of the cam (33) will drive the fixing frame (34) to make linear reciprocating motion on the top shell wall of the tin plating table (1) through the cutout frame (35) and the guide block. S4: During the linear reciprocating motion of the fixing frame (34), the fixing frame (34) will drive all the structures connected to it to move together. Among them, the cleaning brush (310) away from the cutout frame (35) will first come into contact with the circuit board body (25) and clean the dirt on the surface of the circuit board body (25) through the cleaning brush (310). S5: After cleaning the dirt on the surface of the circuit board body (25), the flux brush roller (36) will apply a layer of flux to the surface of the circuit board body (25), and then the tin plating brush roller (37) will plate a layer of tin on the surface of the circuit board body (25) when it passes over it. Then the cleaning brush (310) near the cutout frame (35) will clean the dirt on the surface of the circuit board body (25) again. This process is repeated until the tin plating is completed. S6: Finally, pull the lever (272) to drive the connecting block (271) to slide in the groove. While the connecting block (271) is sliding, it will drive the positioning shaft (274) to slide through the connecting plate (273). When the positioning shaft (274) is disengaged from the positioning groove (263), the L-shaped fixing piece (262) can rotate. When the long axis of the L-shaped fixing piece (262) is far away from the main body of the placement frame (22), the circuit board body (25) can be taken out from it.

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