Pin coating method, device, electronic device and computer storage medium

Abstract

The embodiments of the present application provide a pin coating method, device, electronic device and computer storage medium, which relate to the field of optical communication. The method includes: determining a target film system structure according to target parameters corresponding to the target pin to be coated, the target film system structure is used to indicate the number of coating layers of the target pin, the coating material of each layer and the coating thickness of each layer; based on the target film system structure, controlling a vacuum coating machine to coat the target pin, thereby achieving coating of the pin, facilitating large-scale application, and having a high coating success rate, which can meet the requirements of industrial production.

Description

Technical Field

[0001] The present application relates to the field of optical communications, and more specifically, to a pin coating method, device, electronic device, and computer storage medium. Background Art

[0002] The pin is one of the commonly used basic devices in optical signal transmission lines. It is mainly used to connect two optical fibers and convert the divergent amount in the optical signal into a parallel amount, that is, to achieve the connection transmission of the optical signal and the collimation of the optical signal.

[0003] In practical applications, different coating systems are usually required on the end faces of the pins to suit different usage scenarios. For example, if the usage scenario of the pin requires that the end faces of the pins have a higher reflectivity for light of a certain wavelength and a lower transmittance for light of another wavelength, the end faces of the pins need to be plated with materials of different thicknesses and refractive indices to meet the requirements.

[0004] However, the existing methods of coating WDM (Wavelength Division Multiplexing) films on pins are usually complicated and difficult to implement, and cannot be applied on a large scale. In addition, the success rate of coating is not high and cannot meet the requirements of industrial production. Summary of the invention

[0005] The purpose of the present application includes, for example, providing a pin coating method, device, electronic device and computer storage medium, which can realize the coating of the pins, facilitate large-scale application, and have a high success rate of coating, which can meet the requirements of industrial production.

[0006] The embodiments of the present application can be implemented as follows:

[0007] In a first aspect, the present application provides a pin coating method, comprising:

[0008] According to the target parameters corresponding to the target pins to be coated, the target film system structure is determined, and the target film system structure is used to indicate the number of coating layers of the target pins, the coating materials of each layer, and the coating thickness of each layer;

[0009] Based on the target film system structure, the vacuum coating machine is controlled to coat the target pins.

[0010] In an optional embodiment, the target parameters corresponding to the target pin include: target reflectivity and / or target transmittance in at least one preset wavelength interval;

[0011] According to the target parameters corresponding to the target pin to be coated, determine the target film structure, including:

[0012] Obtaining an initial film system structure and a target reflectivity and / or a target transmittance in at least one preset wavelength range, wherein the initial film system structure is used to indicate the number of initial coating layers, the initial coating material of each layer, and the initial coating thickness of each layer;

[0013] The initial film system structure is optimized according to the target reflectivity and / or target transmittance of at least one preset wavelength interval to obtain the target film system structure.

[0014] In an optional embodiment, the initial film system structure is optimized according to the target reflectivity and / or target transmittance in at least one preset wavelength interval to obtain the target film system structure, including:

[0015] Using a preset optical thin film analysis algorithm, the initial film system structure is optimized with a target reflectivity and / or a target transmittance in at least one preset wavelength interval as a constraint condition to obtain a target film system structure.

[0016] In an optional embodiment, based on the target film system structure, before controlling the vacuum coating machine to coat the target pin, the method further includes:

[0017] The target pins are pre-processed, including vacuum treatment and ultrasonic cleaning.

[0018] In an optional embodiment, the pre-processing further includes: wrapping the pigtail of the target pin.

[0019] In an optional implementation, preprocessing the target pin includes:

[0020] Controlling the vacuuming equipment to perform vacuuming on the target pin;

[0021] The target pin is loaded into a fixture of an ultrasonic cleaning device, and the ultrasonic cleaning device is controlled to perform ultrasonic cleaning on the target pin.

[0022] In an optional embodiment, the coating material includes at least two of silicon monoxide, silicon dioxide, titanium monoxide, titanium dioxide, titanium trioxide, titanium pentoxide, zinc sulfide, zinc selenide, tantalum pentoxide, zirconium dioxide, and aluminum trioxide.

[0023] In a second aspect, the present application provides a pin coating device, comprising:

[0024] A structure determination module, used to determine a target film system structure according to target parameters corresponding to the target pin to be coated, the target film system structure is used to indicate the number of coating layers of the target pin, the coating material of each layer and the coating thickness of each layer;

[0025] The coating processing module is used to control the vacuum coating machine to coat the target pins based on the target film system structure.

[0026] In a third aspect, the present application provides an electronic device, comprising: a processor, a storage medium and a bus, the storage medium storing machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the storage medium communicate through the bus, and the processor executes the machine-readable instructions to perform the steps of any method in the first aspect.

[0027] In a fourth aspect, the present application provides a computer storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of any method of the first aspect are executed.

[0028] The pin coating method, device, electronic device and computer storage medium provided in the embodiments of the present application first determine the target film system structure according to the target parameters corresponding to the target pins to be coated, and the target film system structure is used to indicate the number of coating layers of the target pins, the coating materials of each layer and the coating thickness of each layer; then, based on the target film system structure, the vacuum coating machine is controlled to coat the target pins, thereby achieving the coating of the pins, which is convenient for large-scale application, and has a high success rate of coating, which can meet the requirements of industrial production. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 A flow chart of a pin coating method provided in an embodiment of the present application;

[0031] Figure 2 A flow chart of another pin coating method provided in an embodiment of the present application;

[0032] Figure 3 A schematic diagram of a pin coating device provided in an embodiment of the present application;

[0033] Figure 4 A schematic diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0036] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0037] In the description of the present application, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, it is based on the orientation or position relationship shown in the drawings, or is the orientation or position relationship in which the product of the invention is usually placed when used. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0038] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0039] It should be noted that, in the absence of conflict, the features in the embodiments of the present application may be combined with each other.

[0040] Before describing the embodiments of the present application in detail, the application scenarios of the present application are first introduced.

[0041] Pins are one of the commonly used basic components in optical signal transmission lines. They are mainly used to connect two optical fibers and convert the divergence of optical signals into parallel quantities, that is, to achieve the connection and transmission of optical signals and the collimation of optical signals. In practical applications, it is usually necessary to plate different film systems on the end faces of pins to suit different usage scenarios.

[0042] For example, if the usage scenario of the pin requires that the reflectivity of the pin end face for light in the two bands of 900-1000 nanometers and 410-600 nanometers is greater than 98.2%, and the transmittance for light in the band of 1500-1650 nanometers is less than 0.2%, then it is necessary to plate the pin end face with materials of different thicknesses and different refractive indices to meet these requirements.

[0043] However, existing pin coating methods are usually complicated and difficult to implement, and cannot be applied on a large scale. In addition, the coating success rate is not high and cannot meet the requirements of industrial production.

[0044] The embodiments of the present application provide a pin coating method, device, electronic device and computer storage medium, which simply and conveniently realize the coating of the pins, are convenient for large-scale application, and have a high success rate of coating, which can meet the requirements of industrial production.

[0045] See also Figure 1 The present application provides a pin coating method, which is applied to an electronic device, wherein the electronic device is communicatively connected with a vacuum coating machine, and the method comprises:

[0046] S101: determining a target film system structure according to target parameters corresponding to a target pin to be coated, wherein the target film system structure is used to indicate the number of coating layers of the target pin, the coating material of each layer, and the coating thickness of each layer.

[0047] In an embodiment of the present application, the pin coating design method can be executed by an electronic device, and the vacuum coating machine can be controlled. The target parameters corresponding to the target pin include: target reflectivity and / or target transmittance in at least one preset wavelength range. The specific values ​​of the target parameters can be set according to the requirements. For example, the use scenario of the pin requires that the reflectivity of the pin end face to the light in the two bands of 900-1000 nanometers and 410-600 nanometers is greater than 98.2%, and the reflectivity to the light in the band of 1500-1650 nanometers is less than 0.2%. Here, 900-1000 nanometers, 410-600 nanometers and 1500-1650 nanometers are the preset wavelength ranges, and 98.2% and 0.2% are the target reflectivities. Of course, this is just an exemplary description, and the preset wavelength range, target reflectivity and / or target transmittance can also be other values, and this application does not make specific limitations on this.

[0048] In the embodiment of the present application, the number of coating layers refers to how many layers of film are to be plated on the end face of the pin, the coating material of each layer refers to what material is used to plate each coating layer, and the coating thickness of each layer refers to the thickness of each coating layer.

[0049] In the embodiment of the present application, high refractive index materials and low refractive index materials can be used alternately as the coating materials of each layer. For example, tantalum pentoxide and silicon dioxide can be used alternately as the coating materials of each layer, that is, the first layer is coated with tantalum pentoxide, the second layer is coated with silicon dioxide, the third layer is coated with tantalum pentoxide, the fourth layer is coated with silicon dioxide, and so on, until the target number of layers is reached. In this way, the coating is more firm and stable and not easy to be damaged.

[0050] It should be noted that in the embodiments of the present application, high refractive index materials can be plated on odd-numbered layers and low refractive index materials can be plated on even-numbered layers, or high refractive index materials can be plated on even-numbered layers and low refractive index materials can be plated on odd-numbered layers. The present application does not limit this.

[0051] S102: Based on the target film system structure, control the vacuum coating machine to coat the target pins.

[0052] A vacuum coating machine is a device that uses ion-assisted technology to prepare high-purity metal films and compound films under vacuum conditions. In the embodiment of the present application, the vacuum coating machine can be controlled to use an evaporation deposition coating method or a sputtering deposition coating method to coat the target pin. The evaporation deposition coating method is to heat the coating material so that its surface components are evaporated in the form of atomic groups or ions and attached to the end face of the target pin. The sputtering deposition coating method refers to bombarding the surface of the coating material with ions to knock out the atoms of the coating material and deposit them on the end face of the target pin to form a film.

[0053] In the embodiment of the present application, the target pins may be plated using an ion-assisted thermal evaporation method, which is beneficial for improving the uniformity of the coating and the accuracy of the coating thickness.

[0054] The pin coating method provided in the embodiment of the present application first determines the target film system structure according to the target parameters corresponding to the target pins to be coated, and the target film system structure is used to indicate the number of coating layers of the target pins, the coating materials of each layer, and the coating thickness of each layer; then, based on the target film system structure, the vacuum coating machine is controlled to coat the target pins, thereby simply and conveniently realizing the coating of the pins, which is convenient for large-scale application, and has a high success rate of coating, which can meet the requirements of industrial production.

[0055] In an optional embodiment, the target parameters corresponding to the target pin include: a target reflectivity and / or a target transmittance in at least one preset wavelength range; according to the target parameters corresponding to the target pin to be coated, determining the target film system structure, including: obtaining an initial film system structure, a target reflectivity and / or a target transmittance in at least one preset wavelength range, the initial film system structure being used to indicate the initial number of coating layers, the initial coating material of each layer, and the initial coating thickness of each layer; optimizing the initial film system structure according to the target reflectivity and / or target transmittance in at least one preset wavelength range to obtain a target film system structure.

[0056] In the embodiment of the present application, the initial film system structure can be set as needed. For example, the initial film system structure can indicate that the number of film layers is 4, the first layer is plated with a first preset thickness of tantalum pentoxide, the second layer is plated with a second preset thickness of silicon dioxide, the third layer is plated with a third preset thickness of tantalum pentoxide, and the fourth layer is plated with a fourth preset thickness of silicon dioxide. Of course, this is only an exemplary description and does not mean that the present application is limited to this.

[0057] It should be noted that when the film system structure is determined, the reflectivity and transmittance of the film obtained by coating with this film system structure are also determined. Therefore, the embodiment of the present application optimizes the initial film system structure according to the target reflectivity and / or target transmittance of at least one preset wavelength range, so that the reflectivity and / or transmittance of the film obtained by coating with the optimized initial film system structure in the preset wavelength range is equal to the target reflectivity and / or target transmittance of the preset wavelength range, and the optimized initial film system structure is used as the target film system structure. The coating process is simple and convenient, easy to apply on a large scale, and the coating success rate is high, which can meet the requirements of industrial production.

[0058] In an optional embodiment, the initial film system structure is optimized according to the target reflectivity and / or target transmittance in at least one preset wavelength interval to obtain the target film system structure, including:

[0059] Using a preset optical thin film analysis algorithm, the initial film system structure is optimized with a target reflectivity and / or a target transmittance in at least one preset wavelength interval as a constraint condition to obtain a target film system structure.

[0060] In an embodiment of the present application, a preset optical thin film analysis algorithm can optimize the initial film system structure according to the target reflectivity and / or target transmittance in at least one preset wavelength range, so that the reflectivity and / or transmittance of the film plated with the optimized initial film system structure in the preset wavelength range is equal to the target reflectivity and / or target transmittance in the preset wavelength range.

[0061] In an embodiment of the present application, the preset optical thin film analysis algorithm may be an optical thin film analysis software, such as macleod, etc. By inputting the target reflectivity and / or target transmittance of at least one preset wavelength range and the initial film system structure into the optical thin film analysis software, the target film system structure can be obtained simply and quickly.

[0062] In an optional embodiment, based on the target film system structure, before controlling the vacuum coating machine to coat the target pin, the method further includes:

[0063] The target pins are pre-processed, including vacuum treatment and ultrasonic cleaning.

[0064] In the embodiment of the present application, pretreatment is performed on the target pins before coating, and impurities inside and on the surface of the pins are removed by pretreatment, which is beneficial to improving the success rate of coating and can meet the requirements of industrial production.

[0065] In an optional embodiment, the pre-processing further includes: wrapping the pigtail of the target pin.

[0066] In the embodiment of the present application, the pigtail of the target pin is wrapped before coating the target pin to prevent the pigtail of the target pin from being contaminated during the coating process, causing the target pin to be unusable after coating.

[0067] In an optional implementation, preprocessing the target pin includes:

[0068] Control the vacuuming device to perform vacuuming on the target pin; install the target pin into the fixture of the ultrasonic cleaning device, and control the ultrasonic cleaning device to perform ultrasonic cleaning on the target pin.

[0069] In the embodiment of the present application, the vacuum equipment may be a hydraulic ejector, a steam jet pump, a reciprocating pump, a centrifugal vacuum pump, a water ring vacuum pump or a rotary vane vacuum pump, which is not limited in the embodiment of the present application.

[0070] In the embodiment of the present application, the target pins are vacuumed by controlling the vacuum equipment to extract the precipitable and volatile substances in the target pins, thereby reducing the residual debris in the target pins. This avoids the failure of coating due to the extraction of debris in the target pins when controlling the vacuum coating machine to coat the target pins, thereby effectively improving the success rate of coating.

[0071] In the embodiment of the present application, the target pin after the vacuum treatment is loaded into the fixture of the ultrasonic cleaning equipment, and the ultrasonic cleaning equipment is controlled to perform ultrasonic cleaning on the target pin to prevent impurities extracted during the vacuum treatment from still adhering to the surface of the target pin and affecting the success rate of coating. In addition, the target pin is first loaded into the fixture of the ultrasonic cleaning equipment so that it is firmly fixed in the ultrasonic cleaning equipment, and then the ultrasonic cleaning equipment is controlled to clean the target pin, which is beneficial to improving the ultrasonic cleaning effect.

[0072] In the embodiments of the present application, the ultrasonic cleaning equipment may be an ultrasonic cleaning machine, a medical ultrasonic cleaner, or other equipment provided with fixed components to be cleaned. The present application does not limit the specific type and model of the ultrasonic cleaning equipment.

[0073] In an optional embodiment, the coating material includes at least two of silicon monoxide, silicon dioxide, titanium monoxide, titanium dioxide, titanium trioxide, titanium pentoxide, zinc sulfide, zinc selenide, tantalum pentoxide, zirconium dioxide, and aluminum trioxide.

[0074] In the embodiment of the present application, the coating material includes a high refractive index material and a low refractive index material. For example, one coating material can be one of titanium monoxide, titanium dioxide, titanium trioxide, titanium pentoxide, zinc sulfide, zinc selenide, tantalum pentoxide, zirconium dioxide, and aluminum trioxide, and another coating material can be one of silicon monoxide, silicon dioxide, and magnesium fluoride. Of course, this is just an exemplary description, and the coating material can also be other high refractive index materials and low refractive index materials, and this application does not make specific limitations on this.

[0075] See also Figure 2 The pin coating method provided in the embodiment of the present application first obtains the initial film system structure, the target reflectivity and / or the target transmittance in at least one preset wavelength interval; secondly, the preset optical thin film analysis algorithm is used to optimize the initial film system structure with the target reflectivity and / or the target transmittance in at least one preset wavelength interval as the constraint condition to obtain the target film system structure; then the vacuum equipment is controlled to vacuum the target pin; then the target pin is loaded into the fixture of the ultrasonic cleaning equipment, and the ultrasonic cleaning equipment is controlled to perform ultrasonic cleaning on the target pin; then the pigtail of the target pin is wrapped; finally, based on the target film system structure, the vacuum coating machine is controlled to coat the target pin. The coating of the pin is realized simply and conveniently, which is convenient for large-scale application, and the coating success rate is high, which can meet the requirements of industrial production.

[0076] See also Figure 3 The present application provides a pin coating device 20, comprising:

[0077] The structure determination module 201 is used to determine the target film system structure according to the target parameters corresponding to the target pin to be coated. The target film system structure is used to indicate the number of coating layers of the target pin, the coating material of each layer and the coating thickness of each layer.

[0078] The coating processing module 202 is used to control the vacuum coating machine to coat the target pins based on the target film system structure.

[0079] In an optional embodiment, the target parameters corresponding to the target pin include: a target reflectivity and / or a target transmittance in at least one preset wavelength range; the structure determination module 201 includes an acquisition module and an adjustment module, the acquisition module is used to acquire the initial film system structure, the target reflectivity and / or the target transmittance in at least one preset wavelength range, the initial film system structure is used to indicate the initial number of coating layers, the initial coating material of each layer, and the initial coating thickness of each layer; the optimization module is used to optimize the initial film system structure according to the target reflectivity and / or the target transmittance in at least one preset wavelength range to obtain the target film system structure.

[0080] In an optional embodiment, the optimization module is specifically used to use a preset optical thin film analysis algorithm to optimize the initial film system structure with a target reflectivity and / or a target transmittance in at least one preset wavelength range as a constraint condition to obtain a target film system structure.

[0081] In an optional embodiment, the device further includes: a pre-processing module, the pre-processing module is used to pre-process the target pin, and the pre-processing includes vacuum treatment and ultrasonic cleaning.

[0082] In an optional embodiment, the pre-processing further includes: wrapping the pigtail of the target pin.

[0083] In an optional embodiment, the pre-processing module is specifically used to control the vacuuming equipment to perform vacuuming on the target pin; load the target pin into the fixture of the ultrasonic cleaning equipment, and control the ultrasonic cleaning equipment to perform ultrasonic cleaning on the target pin.

[0084] See also Figure 4 The present application provides an electronic device 30, which includes: a processor 301, a storage medium 302 and a bus 303. The storage medium 302 stores machine-readable instructions executable by the processor 301. When the electronic device 30 is running, the processor 301 communicates with the storage medium 302 through the bus 303, and the processor 301 executes the machine-readable instructions to perform the steps of any method in the aforementioned implementation method.

[0085] The present application provides a computer storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of any method in the aforementioned implementation manner are executed.

[0086] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A pin coating method, characterized in that: include: Determine a target film system structure according to target parameters corresponding to the target pin to be coated, wherein the target film system structure is used to indicate the number of coating layers, the coating material of each layer, and the coating thickness of each layer of the target pin; Based on the target film system structure, controlling the vacuum coating machine to coat the target pins; The target parameters corresponding to the target pin include: target reflectivity and / or target transmittance in at least one preset wavelength interval; Determining the target film system structure according to the target parameters corresponding to the target pins to be coated includes: Obtaining an initial film system structure, a target reflectivity and / or a target transmittance in at least one preset wavelength range, wherein the initial film system structure is used to indicate the number of initial coating layers, the initial coating material of each layer, and the initial coating thickness of each layer; Optimizing the initial film system structure according to the target reflectivity and / or target transmittance of the at least one preset wavelength interval to obtain the target film system structure; The step of adjusting the initial film system structure according to the target reflectivity and / or the target transmittance of the at least one preset wavelength interval to obtain the target film system structure includes: Using a preset optical thin film analysis algorithm, the initial film system structure is optimized with the target reflectivity and / or target transmittance in the at least one preset wavelength interval as a constraint condition to obtain a target film system structure.

2. The pin coating method according to claim 1, characterized in that: Before controlling the vacuum coating machine to coat the target pin based on the target film system structure, the method further includes: The target pin is pre-processed, and the pre-processing includes vacuum treatment and ultrasonic cleaning.

3. The pin coating method according to claim 2, characterized in that: The pre-processing further includes: wrapping the pigtail of the target pin.

4. The pin coating method according to claim 2, characterized in that: The preprocessing of the target pin includes: Controlling a vacuuming device to perform a vacuuming process on the target pin; The target pin is loaded into a fixture of an ultrasonic cleaning device, and the ultrasonic cleaning device is controlled to perform ultrasonic cleaning on the target pin.

5. The pin coating method according to claim 1, characterized in that: The coating material includes at least two of silicon monoxide, silicon dioxide, titanium monoxide, titanium dioxide, titanium trioxide, titanium pentoxide, zinc sulfide, zinc selenide, tantalum pentoxide, zirconium dioxide, and aluminum trioxide.

6. A pin coating device, characterized in that: include: A structure determination module, used to determine a target film system structure according to target parameters corresponding to the target pin to be coated, wherein the target film system structure is used to indicate the number of coating layers, the coating material of each layer, and the coating thickness of each layer of the target pin; A coating processing module, used for controlling a vacuum coating machine to coat the target pins based on the target film system structure; The target parameters corresponding to the target pin include: target reflectivity and / or target transmittance in at least one preset wavelength interval; The structure determination module includes an acquisition module and an optimization module, wherein the acquisition module is used to acquire an initial film system structure and a target reflectivity and / or a target transmittance in at least one preset wavelength interval, wherein the initial film system structure is used to indicate the number of initial coating layers, the initial coating material of each layer, and the initial coating thickness of each layer; and the optimization module is used to optimize the initial film system structure according to the target reflectivity and / or the target transmittance in at least one preset wavelength interval to obtain a target film system structure; The optimization module is specifically used to use a preset optical thin film analysis algorithm, with a target reflectivity and / or a target transmittance in at least one preset wavelength interval as a constraint condition, to optimize the initial film system structure and obtain a target film system structure.

7. An electronic device, characterized in that: The electronic device comprises: a processor, a storage medium and a bus, wherein the storage medium stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor communicates with the storage medium via the bus, and the processor executes the machine-readable instructions to perform the steps of any method as claimed in claims 1-5.

8. A computer storage medium, characterized in that: The computer storage medium stores a computer program, and when the computer program is executed by a processor, the steps of any method according to claim 1 are executed.

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