Circuit board, manufacturing method thereof and lens module

Abstract

A circuit board, a manufacturing method thereof and a lens module are provided. The manufacturing method comprises the following steps: providing a circuit substrate, the circuit substrate comprising a base layer, a metal layer and a first circuit layer, the first circuit layer comprising a first circuit opening and a first circuit, the base layer comprising a hollow region and a non-hollow region; removing the metal layer exposed by the first circuit opening to form a second circuit layer, the second circuit layer comprising a second circuit opening and a second circuit; removing the second circuit corresponding to the hollow region to form a hollow cavity; removing the base layer corresponding to the hollow region to form a base layer opening, the hollow cavity and the base layer opening being in communication, thereby obtaining the circuit board, wherein the first circuit corresponding to the hollow region can be deformed. The manufacturing method of the circuit board provided by the present application can realize the position adjustment of the chip through the deformation of the first circuit of the hollow region.

Description

Technical Field

[0001] This application relates to a printed circuit board technology, and more particularly to a circuit board and its manufacturing method, and a lens module. Background Technology

[0002] To meet the high pixel and high resolution requirements of the lens module, optical image stabilization is necessary. Since the image sensor's image stabilization response is fast and its adjustment frequency is high, image stabilization of the image sensor significantly improves the image quality of the lens module.

[0003] However, the current image stabilization function of lens modules fails to meet actual needs. Summary of the Invention

[0004] In view of this, in order to overcome at least one of the above-mentioned defects, it is necessary to propose a method for manufacturing a circuit board for lens module image stabilization.

[0005] In addition, it is necessary to provide a circuit board manufactured using the above-described manufacturing method and a lens module using the circuit board.

[0006] This application provides a method for manufacturing a circuit board, the method comprising the steps of: providing a circuit substrate, the circuit substrate comprising a base layer, a metal layer disposed on a surface of the base layer, and a first circuit layer disposed on the surface of the metal layer, the first circuit layer comprising a first circuit opening and a first circuit, the metal layer being exposed through the first circuit opening, the base layer comprising a cutout area and a non-cutout area connected to the cutout area; removing the metal layer exposed through the first circuit opening to form a second circuit layer, the second circuit layer comprising a second circuit opening and a second circuit communicating with the first circuit opening; removing the second circuit corresponding to the cutout area to form a cutout cavity, the cutout cavity communicating with the first circuit opening; and removing the base layer corresponding to the cutout area to form a base layer opening, the cutout cavity communicating with the base layer opening, the surface of the first circuit layer near the base layer being exposed through the base layer opening, thereby obtaining the circuit board, wherein the first circuit corresponding to the cutout area can be deformed.

[0007] In some possible implementations, the method for fabricating the hollow cavity includes: forming a first insulating layer on the surfaces of the first circuit layer and the base layer corresponding to the non-hollow area away from the first circuit layer, the first insulating layer covering the first circuit layer, the base layer and the second circuit layer corresponding to the non-hollow area, to obtain an intermediate circuit board; and immersing the intermediate circuit board in an etching solution, the etching solution being used to etch away the second circuit corresponding to the hollow area to form the hollow cavity, wherein the etching rate ratio of the first circuit and the second circuit in the etching solution is 1:1 to 1:10.

[0008] In some possible implementations, the metal layer is made of at least one of nickel, silver, titanium, and nickel-chromium alloys.

[0009] In some possible implementations, the thickness of the metal layer is 1-50 μm.

[0010] In some possible implementations, after removing the base layer corresponding to the cutout area, the manufacturing method further includes forming a second insulating layer on the surface of the first line corresponding to the cutout area.

[0011] In some possible implementations, the size of the base layer opening is smaller than the size of the hollow cavity along the direction in which the circuit board extends.

[0012] In some possible implementations, the first line layer includes multiple first lines, and the multiple first lines corresponding to the cutout area are not connected to each other.

[0013] This application also provides a circuit board, the circuit board including a base layer, a first circuit layer disposed on one side of the base layer, and a second circuit layer disposed between the first circuit layer and the base layer. The first circuit layer includes a first circuit opening and a first circuit, and the second circuit layer includes a second circuit opening and a second circuit. The first circuit opening and the second circuit opening are connected. The base layer includes a hollow area and a non-hollow area connected to the hollow area. A hollow cavity is provided through the second circuit layer corresponding to the hollow area, and the hollow cavity is connected to the first circuit opening. A base layer opening is provided through the base layer corresponding to the hollow area, and the base layer opening is connected to the hollow cavity. The surface of the first circuit layer near the base layer is exposed by the base layer opening, and the first circuit corresponding to the hollow area can be deformed.

[0014] In some possible implementations, the material of the second circuit layer includes at least one of nickel, silver, titanium, and nickel-chromium alloy, and the thickness of the second circuit layer is 1-50 μm.

[0015] In some possible implementations, the first circuit layer corresponding to the non-cutout area and the surface of the base layer facing away from the first circuit layer are provided with a first insulating layer, and the surface of the first circuit corresponding to the cutout area is provided with a second insulating layer.

[0016] In some possible implementations, the size of the base layer opening is smaller than the size of the hollow cavity along the direction in which the circuit board extends.

[0017] In some possible implementations, the first line layer includes multiple first lines, and the multiple first lines corresponding to the cutout area are not connected to each other.

[0018] This application also provides a lens module, which includes a circuit board, a bracket, a lens, and a chip as described above. The bracket is disposed on the circuit board; the lens is disposed on the bracket; the chip is disposed on the first line of the circuit board corresponding to the cutout area and housed within the bracket, the plane of the chip is perpendicular to the optical axis of the lens, and the first line is deformed to generate movement of the chip in multiple directions perpendicular to the optical axis.

[0019] Compared to existing technologies, the circuit board manufacturing method provided by this invention utilizes hollow and non-hollow areas. The hollow area allows for connection and signal transmission between the chip placed thereon and different non-hollow areas. Furthermore, the deformation of the first line corresponding to the hollow area enables dynamic traction of the chip, allowing for fine-tuning of its translation and rotation, thereby achieving optical image stabilization. The circuit board manufacturing method is simple, compatible with high-density wiring in small spaces, and supports both subtractive and additive processes, facilitating mass production and reducing costs. Moreover, the low matching degree between the hollow area and the chip facilitates lens module assembly. Additionally, the material of the first line can be selected based on the adjustment range of the chip within the plane perpendicular to the optical axis, and the line width and spacing of the first line can be controlled using the aforementioned circuit board manufacturing method. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a copper-clad laminate provided in an embodiment of the present invention.

[0021] Figure 2 In order to be in Figure 1 The diagram shows the formation of through-holes and copper plating on the copper-clad laminate.

[0022] Figure 3 For graphical representation Figure 2 The diagram shown illustrates how the first copper layer and the second copper layer form the first circuit layer and the third circuit layer.

[0023] Figure 4 With graphics Figure 3 The diagram shows a schematic of the second circuit layer forming a pattern of metal layers.

[0024] Figure 5 In order to be in Figure 4 The diagram shows a first insulating layer formed on the surfaces of the first and third circuit layers corresponding to the non-cutout areas.

[0025] Figure 6 In order to be in Figure 5 The diagram shows a hollow cavity formed on the second circuit layer.

[0026] Figure 7 To remove Figure 6A schematic diagram of the base layer corresponding to the hollowed-out area shown.

[0027] Figure 8 This is a schematic diagram of the circuit board provided in one embodiment of the present invention.

[0028] Figure 9 A top view of a circuit board provided according to an embodiment of the present invention.

[0029] Figure 10 This is a schematic diagram of the structure of a lens module provided in one embodiment of the present invention.

[0030] Explanation of main component symbols

[0031] Circuit board 100

[0032] Copper Clad Laminate 1

[0033] 11 grassroots

[0034] First surface 111

[0035] Second surface 112

[0036] 113 grassroots openings

[0037] Metal layer 12

[0038] First copper layer 13

[0039] Second copper layer 14

[0040] Through hole 15

[0041] Coating 16

[0042] First line layer 17

[0043] Route 171

[0044] The first line opening is 172.

[0045] Third line layer 18

[0046] The third line opening 181

[0047] Circuit board 10

[0048] Second line layer 20

[0049] Second line opening 21

[0050] Second Line 22

[0051] Hollow cavity 23

[0052] First insulating layer 30

[0053] Intermediate circuit board 40

[0054] Second insulating layer 50

[0055] Hollowed-out area A

[0056] Non-hollowed-out area B

[0057] Lens Module 200

[0058] Bracket 201

[0059] Lens 202

[0060] Chip 203

[0061] Optical axis a

[0062] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0063] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0064] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0065] This invention provides a method for manufacturing a circuit board 100, which specifically includes the following steps:

[0066] Step S1, please refer to Figure 1 A copper-clad laminate 1 is provided, the copper-clad laminate 1 including a base layer 11, a metal layer 12, a first copper layer 13, and a second copper layer 14. The base layer 11 includes a first surface 111 and a second surface 112 opposite to each other. The metal layer 12 is disposed on the first surface 111, the first copper layer 13 is disposed on the surface of the metal layer 12, and the second copper layer 14 is disposed on the second surface 112. The base layer 11 includes a hollow area A and a non-hollow area B connecting the hollow area A.

[0067] In this embodiment, the copper clad laminate 1 is a double-sided copper clad laminate. It can be understood that the copper clad laminate 1 can also be a single-sided copper clad laminate, that is, it only includes the base layer 11, the metal layer 12 and the first copper layer 13.

[0068] In this embodiment, the base layer 11 can be made of one of the following resins: epoxy resin, prepreg (PP), BT resin, polyphenylene ether (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). Specifically, the base layer 11 is made of PI.

[0069] In this embodiment, the material of the metal layer 12 includes, but is not limited to, at least one of nickel, silver, titanium, and nickel-chromium alloy.

[0070] In this embodiment, the thickness of the metal layer 12 is 1-50 μm.

[0071] For step S2, please refer to [link / reference]. Figure 2 A through hole 15 is formed in the copper-clad laminate 1 at the location corresponding to the non-cutout area B, and a plating layer 16 is formed in the through hole 15 so that the first copper layer 13 and the second copper layer 14 are electrically connected.

[0072] In this embodiment, the through hole 15 is formed by laser drilling. It is understood that the through hole 15 can also be formed by mechanical drilling.

[0073] In this embodiment, the plating layer 16 is a copper layer.

[0074] Step S3, please refer to Figure 3 The first copper layer 13 and the second copper layer 14 are patterned to form a first circuit layer 17 and a third circuit layer 18. The first circuit layer 17 includes a first circuit 171 and a first circuit opening 172. The metal layer 12 is exposed through the first circuit opening 172 to obtain a circuit substrate 10.

[0075] In this embodiment, the first copper layer 13 and the second copper layer 14 are formed by lamination, exposure, development and etching. When etching the first copper layer 13, a copper etching solution is used. The composition of the copper etching solution is specific to metallic copper. By controlling the composition of the copper etching solution and the etching time, the etching depth is controlled so that only the first copper layer 13 is etched without etching away the metal layer 12.

[0076] In this embodiment, the third circuit layer 18 includes a third circuit opening 181 corresponding to the hollow area A, and the second surface 112 of the base layer 11 is exposed through the third circuit opening 181.

[0077] For step S4, please refer to [link / reference]. Figure 4 Remove the metal layer 12 exposed by the first line opening 172 to form a second line layer 20, the second line layer 20 including a second line opening 21 and a second line 22 communicating with the first line opening 172.

[0078] In this embodiment, the metal layer 12 is formed into the second circuit layer 20 by lamination, exposure, development, and etching. The sidewalls of the formed second circuit 22 are exposed at the second circuit opening 21, facilitating the subsequent formation of a hollow cavity 23 for the second circuit 22 in the hollow area A. (See reference...) Figure 6 .

[0079] Step S5, please refer to Figure 5 and Figure 6 Remove the second line 22 corresponding to the hollow area A to form a hollow cavity 23, which is connected to the second line opening 21 and the first line opening 172.

[0080] The formation of the hollow cavity 23 allows the first circuit layer 17 to separate from the base layer 11, facilitating the subsequent removal of the portion of the base layer 11 corresponding to the hollow area A, thus creating a hollow structure in the first circuit layer 17. Therefore, the thickness of the second circuit layer 20 does not need to be too thick; it only needs to be sufficient to separate the first circuit layer 17 from the base layer 11. The thickness of the second circuit layer 20 is 1-50 μm.

[0081] The method for manufacturing the hollow cavity 23 specifically includes the following steps:

[0082] For step S51, please refer to... Figure 5 A first insulating layer 30 is formed on the surface of the first circuit layer 17 and the second surface 112 corresponding to the non-cutout area B. The first insulating layer 30 covers the first circuit layer 17, the base layer 11, the second circuit layer 20 and the third circuit layer 18 corresponding to the non-cutout area B, to obtain an intermediate circuit board 40.

[0083] In this embodiment, the material of the first insulating layer 30 can be a thermosetting or photocurable material with filling and protective functions, such as a cover film (CVL), ink, pure adhesive, ABF resin, and prepreg (PP). Specifically, the material of the first insulating layer 30 is a cover film. The first insulating layer 30 is mainly used to protect the circuit and substrate corresponding to the non-cutout area B from the influence of the subsequent metal layer etching solution.

[0084] For step S52, please refer to... Figure 6The intermediate circuit board 40 is immersed in a metal layer etching solution. This solution is used to etch away the second line 22 corresponding to the cutout area A to form the cutout cavity 23. The cutout cavity 23 communicates with the opening 172 of the first line. The metal layer etching solution is specifically designed for etching the metal layer 12 and has a slower etching rate for copper. Therefore, after immersing the intermediate circuit board 40 in the metal layer etching solution, the solution only etches away the exposed second line 22 and does not affect the first line 171.

[0085] In this embodiment, the etching rate ratio of the first line 171 and the second line 22 in the metal layer etching solution is 1:1 to 1:10, that is, the etching rate ratio of copper to metals such as nickel, silver, titanium, and nickel-chromium alloys in the metal layer etching solution is 1:1 to 1:10. To reduce the corrosion of the first line layer 17 in the metal layer etching solution, the greater the difference in etching rates between the first line 171 and the second line 22 in the metal layer etching solution, the better. Preferably, the etching rate ratio is 1:5 to 1:10, more preferably 1:7 to 1:10, and even more preferably 1:8 to 1:10.

[0086] Step S6, please refer to Figure 7 The base layer 11 corresponding to the hollow area A is removed to form a base layer opening 113. The hollow cavity 23 is connected to the base layer opening 113, and the surface of the first circuit layer 17 near the base layer 11 is exposed through the base layer opening 113. The base layer opening 113 is also connected to the third circuit opening 181.

[0087] In this embodiment, the base layer opening 113 is formed by laser drilling or mechanical drilling. The hollow cavity 23 separates the first circuit layer 17 and the base layer 11, making it easier to remove the portion of the base layer 11 corresponding to the hollow area A by laser drilling or mechanical drilling.

[0088] In this embodiment, the size of the base layer opening 113 is smaller than the size of the hollow cavity 23 along the direction extending from the circuit board 10. This prevents damage to the second circuit layer 20 when laser drilling or mechanical drilling is performed on the base layer 11, and also facilitates the cutting away of the portion of the base layer 11 corresponding to the hollow area A. Furthermore, at the edge of the hollow area A, there is a certain hollow space between the base layer 11 and the first circuit layer 17. During deformation, the first circuit 171 at the edge of the hollow area A is affected by the hard edge of the base layer 11 and breaks, thereby improving the flexibility of the first circuit 171 corresponding to the hollow area A.

[0089] For step S7, please refer to [link / reference]. Figure 8A second insulating layer 50 is formed on the surface of the first line 171 corresponding to the cutout area A, thereby obtaining the circuit board 100.

[0090] In this embodiment, the material of the second insulating layer 50 can be selected from thermosetting or photocurable materials with filling and protective functions, such as cover film (CVL), ink, pure adhesive, ABF resin, and prepreg (PP). Specifically, the material of the second insulating layer 50 is a cover film. The second insulating layer 50 can also be a surface treatment layer such as organic solderability preservatives (OSP) or electroless nickel-gold layer.

[0091] The method for manufacturing the circuit board 100 of this application is used to manufacture a circuit board for a lens module. The chip of the lens module is placed on the first line 171 corresponding to the cutout area of ​​the circuit board 100. By deforming the first line 171 corresponding to the cutout area A of the circuit board 100, dynamic traction is achieved on the chip placed on the first line 171 in the cutout area A, thereby enabling fine-tuning of the chip's translation and rotation, thus achieving optical image stabilization. The thickness and size of the circuit board 100 can be arbitrarily set according to actual needs, and the cutout area A only needs to accommodate the chip 203, without precise size limitations; the matching degree between the cutout area A and the chip 203 is high. Furthermore, the material of the first line 171 can be selected according to the adjustment range of the chip 203 in the plane perpendicular to the optical axis a, and the line width and spacing of the first line 171 can be controlled by the aforementioned method for manufacturing the circuit board 100. The circuit fabrication of the circuit board 100 is compatible with high-density wiring in small spaces and is compatible with both subtractive and additive processes.

[0092] Please see Figure 9 In this embodiment, the cutout area A is located between the two non-cutout areas B, and the cutout area A mainly serves to connect the two non-cutout areas B and facilitate signal transmission. During the fabrication of the first circuit layer 17, multiple first circuits 171 can be formed, wherein the multiple first circuits 171 corresponding to the cutout area A are not connected to each other. The multiple first circuits 171 can deform, and through their own deformation, they control the movement of the chip placed in the cutout area A in different directions within the plane.

[0093] Please see Figure 8The present invention also provides a circuit board 100, which is applied in a lens module for fine-tuning the position of a chip placed thereon. The circuit board 100 includes a base layer 11, a first circuit layer 17 disposed on one side of the base layer 11, and a second circuit layer 20 disposed between the first circuit layer 17 and the base layer 11. The first circuit layer 17 includes a first circuit opening 172 and a first circuit 171. The second circuit layer 20 includes a second circuit opening 21 and a second circuit 22. The first circuit opening 172 and the second circuit opening 21 are connected. The base layer 11 includes a cutout area A and a non-cutout area B connected to the cutout area A. A cutout cavity 23 is provided through the second circuit layer 20 corresponding to the cutout area A, and the cutout cavity 23 is connected to the first circuit opening 172. A base layer opening 113 is provided through the base layer 11 corresponding to the cutout area A, and the base layer opening 113 is connected to the cutout cavity 23. The surface of the first circuit layer 17 near the base layer 11 is exposed through the base layer opening 113. The first line 171 corresponding to the hollow area A can be deformed.

[0094] In this embodiment, the material of the second circuit layer 20 includes at least one of nickel, silver, titanium and nickel-chromium alloy, and the thickness of the second circuit layer 20 is 1-50 μm.

[0095] In this embodiment, the surface of the first circuit layer 17 corresponding to the non-cutout area B is provided with a first insulating layer 30, and the surface of the first circuit 171 corresponding to the cutout area A is provided with a second insulating layer 50.

[0096] In this embodiment, the material of the first insulating layer 30 can be a thermosetting or photocurable material with filling and protective functions, such as cover film (CVL), ink, pure adhesive, ABF resin, and prepreg (PP). Specifically, the material of the first insulating layer 30 is a cover film.

[0097] In this embodiment, the material of the second insulating layer 50 can be selected from thermosetting or photocurable materials with filling and protective functions, such as cover film (CVL), ink, pure adhesive, ABF resin, and prepreg (PP). Specifically, the material of the second insulating layer 50 is a cover film. The second insulating layer 50 can also be a surface treatment layer formed by organic solderability preservatives (OSP) or electroless nickel-gold layer.

[0098] In this embodiment, the size of the base layer opening 113 is smaller than the size of the hollow cavity 23 along the direction extending from the circuit board 10.

[0099] In this embodiment, the first circuit layer 17 includes multiple first circuits 171, and the multiple first circuits 171 corresponding to the hollow area A are not connected to each other.

[0100] In this embodiment, the surface of the base layer 11 facing away from the first circuit layer 17 is provided with at least one third circuit layer 18. The third circuit layer 18 achieves electrical connection by forming a plating layer 16 within the through-hole 15. The third circuit layer 18 includes a third circuit opening 181 corresponding to the cutout area A, and the cutout cavity 23 communicates with the third circuit opening 181. That is, the circuit board 10 can be a single-sided board or a double-sided board.

[0101] Understandably, the non-cutout area B corresponds to the setting of multiple circuit layers to form a multi-layer board, while the cutout area A is a single-layer board. The cutout area A is designed as a single-layer structure to facilitate the precise transfer of the deformation generated by the first circuit layer 17 to the chip, so as to drive the chip to move and thus accurately control the displacement of the chip.

[0102] In this embodiment, the base layer 11 can be made of one of the following resins: epoxy resin, prepreg (PP), BT resin, polyphenylene ether (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). Specifically, the base layer 11 is made of PI.

[0103] In this embodiment, the cutout area A is approximately located in the middle of the circuit board 100.

[0104] Please see Figure 10This application also provides a lens module 200, which includes a circuit board 100, a bracket 201, a lens 202, and a chip 203 as described above. The bracket 201 is disposed on the circuit board 100; the lens 202 is disposed on the bracket 201; the chip 203 is disposed on the first line 171 of the circuit board 100 corresponding to the cutout area A and housed within the bracket 201. The plane of the chip 203 is perpendicular to the optical axis a of the lens 202. The first line 171 deforms to move the chip 203 in multiple directions perpendicular to the optical axis a. The first line 171 is electrically connected to the chip 203, enabling signal transmission from the chip 203. Simultaneously, through the deformation of the first line 171 corresponding to the cutout area A of the circuit board 100, dynamic traction of the chip 203 is achieved, thereby enabling fine-tuning of the translation and rotation of the chip 203, thus achieving optical image stabilization. The thickness and size of the circuit board 100 can be arbitrarily set according to actual needs, and the cutout area A only needs to be large enough to accommodate the chip 203, without precise size restrictions, resulting in a high degree of matching between the cutout area A and the chip 203. Furthermore, the material of the first line 171 can be selected based on the adjustment range of the chip 203 within the plane perpendicular to the optical axis a, and the line width and spacing of the first line 171 can be controlled through the aforementioned circuit board 100 manufacturing method. The circuit board 100's wiring fabrication is compatible with high-density wiring in small spaces, and is also compatible with both subtractive and additive processes.

[0105] Compared to existing technologies, the circuit board 100 manufacturing method provided in this application sets a hollow area A and non-hollow areas B on the circuit board 100. The hollow area A allows for connection and signal transmission between the chip 203 placed thereon and different non-hollow areas B. Furthermore, the deformation of the first line 171 corresponding to the hollow area A enables dynamic pulling of the chip 203, thereby allowing for translational and rotational fine-tuning of the chip 203, achieving optical image stabilization. The circuit board 100 manufacturing method is simple, compatible with high-density wiring in small spaces, and compatible with both subtractive and additive processes, making it easy to mass-produce and cost-effective. Moreover, the low matching degree between the hollow area A and the chip 203 facilitates the assembly of the lens module 200. Additionally, the material of the first line 171 can be selected based on the adjustment range of the chip 203 in the plane perpendicular to the optical axis a, and the line width and spacing of the first line 171 can be controlled through the aforementioned circuit board 100 manufacturing method.

Claims

1. A method for manufacturing a circuit board, characterized in that, Including the following steps: A circuit board is provided, the circuit board including a base layer, a metal layer disposed on a surface of the base layer, and a first circuit layer disposed on the surface of the metal layer. The first circuit layer includes a first circuit opening and a first circuit. The metal layer is exposed through the first circuit opening. The base layer includes a hollow area and a non-hollow area connected to the hollow area. Remove the metal layer exposed by the first line opening to form a second line layer, the second line layer including a second line opening and a second line communicating with the first line opening; Remove the second line corresponding to the hollow area to form a hollow cavity, the hollow cavity being connected to the opening of the first line; as well as The base layer corresponding to the cutout area is removed to form a base layer opening. The cutout cavity is connected to the base layer opening. The surface of the first circuit layer near the base layer is exposed through the base layer opening, thereby obtaining the circuit board. The first circuit corresponding to the cutout area can be deformed.

2. The method for manufacturing a circuit board as described in claim 1, characterized in that, The method for manufacturing the hollow cavity includes: A first insulating layer is formed on the surfaces of the first circuit layer and the base layer corresponding to the non-cutout area, away from the first circuit layer. The first insulating layer covers the first circuit layer, the base layer, and the second circuit layer corresponding to the non-cutout area, resulting in an intermediate circuit board; and The intermediate circuit board is immersed in an etching solution, which is used to etch away the second line corresponding to the hollow area to form the hollow cavity. The etching rate ratio of the first line and the second line in the etching solution is 1:1 to 1:

10.

3. The method for manufacturing a circuit board as described in claim 2, characterized in that, The metal layer is made of at least one of nickel, silver, titanium, and nickel-chromium alloys.

4. The method for manufacturing a circuit board as described in claim 1, characterized in that, The thickness of the metal layer is 1-50 μm.

5. The method for manufacturing a circuit board as described in claim 1, characterized in that, After removing the base layer corresponding to the hollowed-out area, the manufacturing method further includes: A second insulating layer is formed on the surface of the first line corresponding to the hollowed-out area.

6. The method for manufacturing a circuit board as described in claim 1, characterized in that, Along the direction extending from the circuit board, the size of the opening in the base layer is smaller than the size of the hollow cavity.

7. The method for manufacturing a circuit board as described in claim 1, characterized in that, The first circuit layer includes multiple first circuits, and the multiple first circuits corresponding to the hollow area are not connected to each other.

8. A circuit board, characterized in that, The system includes a base layer, a first circuit layer disposed on one side of the base layer, and a second circuit layer disposed between the first circuit layer and the base layer. The first circuit layer includes a first circuit opening and a first circuit. The second circuit layer includes a second circuit opening and a second circuit. The first circuit opening and the second circuit opening are connected. The base layer includes a hollow area and a non-hollow area connected to the hollow area. A hollow cavity is formed by penetrating the second circuit layer corresponding to the hollow area, and the hollow cavity is connected to the first circuit opening. A base layer opening is formed by penetrating the base layer corresponding to the hollow area, and the base layer opening is connected to the hollow cavity. The surface of the first circuit layer near the base layer is exposed through the base layer opening. The first circuit corresponding to the hollow area can be deformed. A second insulating layer is provided on the surface of the first circuit corresponding to the hollow area.

9. The circuit board as described in claim 8, characterized in that, The material of the second circuit layer includes at least one of nickel, silver, titanium and nickel-chromium alloy, and the thickness of the second circuit layer is 1-50 μm.

10. The circuit board as described in claim 8, characterized in that, The first circuit layer corresponding to the non-perforated area and the surface of the base layer opposite to the first circuit layer are provided with a first insulating layer.

11. The circuit board as described in claim 8, characterized in that, Along the direction extending from the base layer, the size of the opening in the base layer is smaller than the size of the hollow cavity.

12. The circuit board as described in claim 8, characterized in that, The first circuit layer includes multiple first circuits, and the multiple first circuits corresponding to the hollow area are not connected to each other.

13. A lens module, characterized in that, include: A circuit board, wherein the circuit board is the circuit board as described in any one of claims 8-12; A bracket is mounted on the circuit board; The lens is mounted on the bracket; as well as A chip is disposed on the first line of the circuit board corresponding to the cutout area and housed in the bracket. The plane of the chip is perpendicular to the optical axis of the lens. The first line is deformed to generate movement of the chip in multiple directions perpendicular to the optical axis.

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