Electrode feeding device and chemical deposition equipment

Abstract

The present application discloses an electrode feeding device and a chemical deposition device, wherein the electrode feeding device comprises an electrode guide rod, an electrode block and a wafer boat. The electrode block is arranged on the electrode guide rod. The wafer boat has a boat foot, and the boat foot abuts against the electrode block to electrically connect the two. Among them, at least one of the electrode block and the boat foot is provided with a blocking portion for blocking process gas from entering the gap between the boat foot and the electrode block. In the above manner, the present application can enhance the stability of the electric field.

Description

Technical Field

[0001] The present application relates to the technical field of chemical deposition equipment, and in particular to an electrode feeding device and a chemical deposition equipment. Background Art

[0002] Chemical deposition equipment can deposit thin films on the surface of products, thereby modifying the products and optimizing product performance. Chemical deposition equipment can use, for example, plasma enhanced chemical vapor deposition for chemical deposition. Plasma enhanced chemical vapor deposition is a process that ionizes and decomposes process gases in a vacuum chamber through an electric field, and then deposits a thin film on the surface of the product. In related technologies, the conductivity of the electrode feed device in the chemical deposition equipment is unstable, which can easily lead to abnormal electric fields. Summary of the invention

[0003] The embodiments of the present application provide an electrode feeding device and a chemical deposition apparatus, which can enhance the stability of the electric field.

[0004] In a first aspect, an embodiment of the present application provides an electrode feeding device. The electrode feeding device includes an electrode guide rod, an electrode block and a wafer boat. The electrode block is disposed on the electrode guide rod. The wafer boat has a boat foot, and the boat foot abuts against the electrode block to electrically connect the two. Among them, at least one of the electrode block and the boat foot is provided with a blocking portion for blocking process gas from entering the gap between the boat foot and the electrode block.

[0005] In a second aspect, an embodiment of the present application provides a chemical deposition device. The chemical deposition device includes a reaction chamber and the above-mentioned electrode feeding device. A process gas is introduced into the reaction chamber. The electrode feeding device is arranged in the reaction chamber.

[0006] The beneficial effects of the present application are as follows: Different from the prior art, the blocking of the process gas by the blocking part can reduce the gap between the electrode block and the boat foot, thereby reducing the phenomenon of ionizing the gas by the ignition discharge between the electrode block and the boat foot, and further reducing and inhibiting the growth of the insulating film between the electrode block and the boat foot. After the growth of the insulating film is inhibited, the decrease in conductivity between the electrode block and the boat foot can be reduced, thereby reducing the abnormal electric field in the wafer carrier boat and increasing the stability of the electric field therein. By setting the blocking part, it can also play a positioning or guiding role in the placement of the wafer carrier boat, thereby reducing the deviation of the placement position of the wafer carrier boat in each process, reducing the impact on the repeatability of the electric field, and helping to improve the uniformity between batch processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a structural schematic diagram of an embodiment of the chemical deposition device of the present application;

[0008] Figure 2 yes Figure 1A schematic diagram of the top view of the chemical deposition equipment shown;

[0009] Figure 3 It is a structural schematic diagram of an electrode block and a boat foot in an embodiment of an electrode feed-in device;

[0010] Figure 4 yes Figure 3 A schematic diagram of another embodiment of the electrode block and the boat foot is shown;

[0011] Figure 5 It is a structural schematic diagram of an electrode block and a boat foot in another embodiment of an electrode feed-in device;

[0012] Figure 6 yes Figure 5 A schematic diagram of another embodiment of the electrode block and the boat foot is shown;

[0013] Figure 7 It is a structural schematic diagram of an electrode block and a boat foot of another embodiment of an electrode feeding device;

[0014] Figure 8 yes Figure 7 A schematic diagram of another embodiment of the electrode block and the boat leg is shown. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0016] In the related art, chemical deposition equipment can coat products through plasma enhanced chemical vapor deposition to achieve the purpose of modification and performance improvement. Plasma enhanced chemical vapor deposition is a process that ionizes and decomposes process gas through an electric field in a vacuum chamber, and then deposits a thin film on the surface of the product. Chemical deposition equipment coats products by setting an electrode feeding device in the reaction chamber. In the existing electrode feeding device, the contact between the electrode block and the boat foot of the wafer carrier boat is two planes abutting contact, so that the electrode block and the boat foot are electrically conductive. Among them, due to production precision and other reasons, there will be a gap between the electrode block and the boat foot, and the gap will cause the electrode block and the boat foot to form a capacitor. Process gas is introduced into the reaction chamber, and the gap is exposed to the flow direction of the process gas, and the process gas will enter the gap between the electrode block and the boat foot. In this way, a parasitic electric field will be generated between the electrode block and the boat foot. In the process of ignition discharge, an insulating film will gradually grow in the gap. After the insulating film grows to a certain extent, the conductivity between the electrode block and the boat foot will decrease, resulting in abnormal electric field. In order to improve the above technical problems, the present application may provide the following embodiments.

[0017] The embodiment of the chemical deposition device 1 of the present application describes an exemplary structure of the chemical deposition device 1 .

[0018] The chemical deposition device 1 has a reaction chamber 20. A process gas is introduced into the reaction chamber 20. The process gas may be, for example, SiH4 or NH3, etc., which may be selected according to the type of film to be deposited, and is not specifically limited here. Optionally, the process gas is introduced into one end of the reaction chamber 20 and the other end is evacuated, so that the process gas in the reaction chamber 20 can flow evenly and the interference of air on the deposition process can be reduced. The chemical deposition device 1 also includes an electrode feeding device 10, which is arranged in the reaction chamber 20.

[0019] The specific structure of the electrode feeding device 10 is exemplarily introduced below.

[0020] See also Figure 1The electrode feeding device 10 includes an electrode guide rod 110, an electrode block 111 and a wafer boat 120. The electrode block 111 is arranged on the electrode guide rod 110. The electrode guide rod 110 can be electrically connected to a power source, a relay or an electric control circuit, so as to introduce current to the electrode block 111. At the same time, the electrode guide rod 110 can also play a supporting role for the electrode block 111 and the wafer boat 120 placed on the electrode block 111. The wafer boat 120 can specifically be a graphite boat made of graphite or a metal boat made of metal. The wafer boat 120 can also be made of other conductive materials, and the material specifically includes graphite or metal. In terms of the setting form, a composite method can also be adopted. For example, the central material of the conductive sheet is metal, and a graphite layer is arranged on the outer layer of the metal material. The use of a graphite boat in the center can reduce losses, and the use of a graphite material on the outer layer can better utilize the advantages of graphite, such as acid and alkali resistance, high thermal conductivity aluminum and other properties. The wafer boat 120 is used to carry products that need to be coated, and the wafer boat 120 can generate an electric field when powered on to ionize the process gas to coat the products in the wafer boat 120. In one embodiment, the wafer boat 120 can be composed of a plurality of conductive sheets (not shown) arranged side by side, and the adjacent conductive sheets are used to place products such as silicon wafers. Among them, the conductive sheets adjacent to each other are positive and negative electrodes and are not conductive to each other. The conductive sheets adjacent to the same conductive sheet and spaced apart from each other have the same electrode polarity and are conductive to each other. Process gas flows between two adjacent conductive sheets, and the process gas is ionized into plasma under the action of the electric field. The plasma is deposited on the surface of the product to form a thin film. Further, the wafer boat 120 has a boat foot 121, and the boat foot 121 abuts against the electrode block 111 to electrically connect the two. The boat foot 121 of the wafer boat 120 is electrically conductive with different conductive sheets to supply power to the conductive sheets.

[0021] Specifically, see Figure 2 In one embodiment, the electrode feed device 10 includes at least two electrode guide rods 110, wherein the two electrode guide rods 110 can be connected to the positive and negative electrodes of the power supply, respectively, to provide different electrode polarities for the conductive sheets in the wafer boat 120. Each electrode guide rod 110 is provided with at least two electrode blocks 111 along its length direction, and the wafer boat 120 is provided with at least two electrode blocks 111 along the length direction of the electrode guide rod 110, so that multiple electrode blocks 111 can supply power to the same wafer boat 120 to increase the power supply stability. And / or, multiple electrode blocks 111 can supply power to different wafer boats 120, thereby placing multiple wafer boats 120 in one process to increase production efficiency. The wafer boat 120 has at least two boat feet 121, and the boat feet 121 correspond to the electrode blocks 111 one by one, respectively, so as to electrically connect the boat feet 121 to the electrode blocks 111.

[0022] See also Figure 3, at least one of the electrode block 111 and the boat foot 121 is provided with a blocking portion 130. Specifically, the blocking portion 130 can be provided on the electrode block 111, or on the boat foot 121, or both the electrode block 111 and the boat foot 121 are provided with the blocking portion 130, which is not specifically limited here. The blocking portion 130 can be detachably installed on the electrode block 111 or the boat foot 121, can be integrally provided with the electrode block 111 and the boat foot 121, or can be fixedly installed on the electrode block 111 and the boat foot 121 by bonding or the like, which is not specifically limited here. The blocking portion 130 is used to block the process gas from entering the gap between the boat foot 121 and the electrode block 111. For example, the process gas can flow from left to right to form a flow field (the flow direction of the process gas in this application is introduced as an example of flow from left to right). By providing the blocking portion 130, the gap between the electrode block 111 and the boat foot 121 can be shielded. Due to the characteristics of the flow field, the process gas cannot easily enter the gap after being blocked by the blocking portion 130. This can reduce the generation of parasitic electric fields in the gap and reduce the growth of derivative thin films caused by ignition discharge, thereby ensuring good conductivity between the electrode block 111 and the boat foot 121 and improving the stability of the electric field.

[0023] Further, see Figure 3 and Figure 4 , at least one of the electrode block 111 and the boat foot 121 is provided with a blocking portion 130, and the other of the electrode block 111 and the boat foot 121 is provided with a receiving space 122 for receiving the blocking portion 130. The surface of the electrode block 111 close to the boat foot 121 is provided with a blocking portion 130, and the boat foot 121 is provided with a receiving space 122, or the surface of the boat foot 121 close to the electrode block 111 is provided with a blocking portion 130, and the electrode block 111 is provided with a receiving space 122. When the boat foot 121 is electrically connected to the electrode block 111, the blocking portion 130 is received in the receiving space 122. The electrical connection between the electrode block 111 and the boat foot 121 can be achieved by the blocking portion 130 abutting against the side wall of the receiving space 122. With such a configuration, the placement position of the wafer boat 120 on the electrode block 111 can be positioned. In different batches of processes, different wafer boats 120 will be replaced on the electrode block 111. Positioning the relative positions of the wafer boat 120 and the electrode block 111 can reduce the deviation of the placement position of the wafer boat 120 in each process, reduce the impact on the repeatability of the electric field, and help improve the uniformity between batch processes. Optionally, the blocking portion 130 is convexly arranged in the middle of at least one of the electrode block 111 and the boat foot 121. Such a setting can enable the gap between the electrode block 111 and the boat foot 121 to be bent multiple times (for example, Figure 3The gap in the substrate has four bends), further reducing the possibility of process gas entering the gap. Optionally, the blocking portion 130 is disposed at the edge of at least one of the electrode block 111 and the boat foot 121, so that the limiting effect of the blocking portion 130 on the boat foot 121 can be reduced, which can facilitate the placement of the wafer boat 120 and reduce the difficulty of aligning the two.

[0024] Optionally, the projection of the blocking portion 130 on the surface of the electrode block 111 or the boat foot 121 having the blocking portion 130 accounts for 20%-75% of the surface. Specifically, if the projection of the blocking portion 130 accounts for too large an area of ​​the surface, the accommodating space 122 will need to be larger, and the side wall of the accommodating space 122 will be thinner, which will cause the assembly stability of the electrode block 111 and the boat foot 121 to decrease. In addition, if the blocking portion 130 is too large, it will also hinder the installation of the wafer boat 120 and reduce production efficiency. If the projection of the blocking portion 130 accounts for too small an area of ​​the surface, the role of the blocking portion 130 in blocking the entry of process gases will become smaller. A large amount of process gas will still enter the gap between the electrode block 111 and the boat foot 121, producing an insulating film.

[0025] Optionally, the ratio of the height of the blocking portion 130 protruding from the electrode block 111 or the boat foot 121 to the thickness of the electrode block 111 or the boat foot 121 is 20%-65%. Specifically, if the height of the blocking portion 130 is too high, it will increase the difficulty of matching the boat foot 121 and the electrode block 111, and will cause the blocking portion 130 to be subjected to excessive bending moment, which will reduce the strength of the blocking portion 130. If the height of the blocking portion 130 is too low, it will cause the blocking portion 130 to be unable to block the process gas from flowing into the gap between the electrode block 111 and the boat foot 121.

[0026] The following is a further description by taking the example that the surface of the electrode block 111 close to the boat foot 121 is provided with a blocking portion 130 and the boat foot 121 is provided with a receiving space 122 .

[0027] The blocking portion 130 is extended from the electrode block 111 in the direction of the boat foot 121, and the electrode block 111 and the boat foot 121 are integrally formed. In one embodiment, the blocking portion 130 is in the shape of a rectangular parallelepiped, and the shape of the accommodating space 122 is adapted to the blocking portion 130. A rectangular insertion port (shown in the figure, but not marked) is provided on one side of the accommodating space 122, and the blocking portion 130 extends into the accommodating space 122 from the insertion port. Among them, the side surface of the rectangular blocking portion 130 is a plane, which can better block the process gas, thereby further reducing the process gas from entering the gap between the electrode block 111 and the boat foot 121. In other embodiments, the blocking portion 130 may also be in the shape of a cylinder, a cone or a trapezoid, without specific limitation.

[0028] See also Figure 4In one embodiment, the cross section of the blocking portion 130 is gradually reduced from the surface of the electrode block 111 toward the boat foot 121, and the accommodating space 122 is gradually reduced from the surface of the boat foot 121 toward the direction away from the electrode block 111. Such a configuration enables the accommodating space 122 with a gradually reduced cross section and the blocking portion 130 with a gradually reduced cross section to guide the placement process when the wafer boat 120 is placed on the electrode block 111, so that the wafer boat 120 can be conveniently placed on the electrode block 111, which is conducive to improving production efficiency.

[0029] Among them, optionally, the angle between the side of the cross section of the blocking portion 130 and the surface of the electrode block 111 close to the boat foot 121 is 20°-80°. The blocking portion 130 set in this way can play a good guiding role, and can facilitate the assembly of the boat foot 121 and the electrode block 111. Optionally, the ratio of the area of ​​the surface of the blocking portion 130 close to the boat foot 121 to the projected area of ​​the blocking portion 130 on the surface of the electrode block 130 is 30%-90%. If it exceeds 90%, it will increase the difficulty of aligning the accommodating space 122 with the blocking portion 130. If it is less than 30%, the stability of the electrical connection between the electrode block 111 and the boat foot 121, as well as the structural strength of the blocking portion 130 will be reduced.

[0030] For example, if the blocking portion 130 is a truncated cone, the angle between the generatrix of the truncated cone and the surface of the electrode block 111 close to the boat foot 121 is 20°-80°. Alternatively, the proportion of the upper surface of the truncated cone to the projection of the truncated cone on the electrode block 111 is 30%-90%. The blocking portion 130 may also be a regular prism, etc., which will not be described in detail.

[0031] A blocking portion 130 is protruding from the surface of the boat foot 121 close to the electrode block 111, and the electrode block 111 is provided with a accommodating space 122 in the same manner as the above-mentioned embodiment, and the specific implementation details can be adaptively changed, which can at least produce the same technical effect as the above-mentioned embodiment, and will not be repeated here.

[0032] In one embodiment, see Figure 5 and Figure 6 At least two blocking parts 130 are provided, at least two blocking parts 130 are provided on the electrode block 111 or the boat foot 121 , or at least one of the at least two blocking parts 130 is provided on the electrode block 111 , and the remaining blocking parts 130 are provided on the boat foot 121 .

[0033] The number of the blocking parts 130 can be multiple, for example, the number of the blocking parts 130 is two. Figure 5, when the number of the blocking parts 130 is two, the two blocking parts 130 can be both arranged on the electrode block 111. Further, the boat foot 121 can be provided with two accommodating spaces 122 corresponding to the number of the blocking parts 130, and the two accommodating spaces 122 correspond one to one to the two blocking parts 130. Optionally, the blocking parts 130 can also be both arranged on the boat foot 121, and the accommodating spaces 122 are arranged on the electrode block 111. Such an arrangement can make the gap between the electrode block 111 and the boat foot 121 have more bends, which can further reduce the possibility of process gas entering the gap.

[0034] See also Figure 6 , the two blocking parts 130 may also adopt a scheme in which one of them is arranged on the electrode block 111 and the other is arranged on the boat foot 121. Furthermore, the electrode block 111 and the boat foot 121 are provided with accommodation spaces 122 corresponding to the electrode block 111 respectively. Such an arrangement can also make the gap between the electrode block 111 and the boat foot 121 have more bends, which can further reduce the possibility of process gas entering the gap. On the other hand, the blocking part 130 and the accommodation space 122 arranged in this way can not only position the placement of the wafer boat 120, but also orient the wafer boat 120 so that the placement direction of the wafer boat 120 is consistent for each process.

[0035] The number of the blocking parts 130 may also be three, and the three blocking parts 130 may all be arranged on the electrode block 111, or may all be arranged on the boat foot 121. The three blocking parts 130 may also be one or two of the three provided on the electrode block 111, and two or one of the three provided on the boat foot 121. Providing three blocking parts 130 at least has the technical effect of the above-mentioned embodiment, which will not be described in detail. The same is true for the case where there are more blocking parts 130, which will not be described in detail.

[0036] In yet another embodiment, see Figure 7 , the blocking part 130 is arranged on one side of the electrode block 111 or the boat foot 121. Specifically, the blocking part 130 is arranged on the electrode block 111 as an example for introduction. The blocking part 130 is arranged on one side of the electrode block 111, specifically, the side of the electrode block 111 close to the source direction of the process gas. In this way, the blocking part 130 is located at one end of the gap to block at least one direction of the gap and prevent the process gas from entering. Optionally, the gap between the electrode block 111 and the boat foot 121 is parallel to the flow direction of the process gas, and the gap between the blocking part 130 and the boat foot 121 is perpendicular to the flow direction of the process gas. In this way, the process gas can be reduced from entering the gap, and such an electrode block 111 is easy to manufacture. For further information, refer to Figure 8The blocking part 130 may include two blocking parts 130, which are arranged on both sides of the electrode block 111, so as to block the gap from two directions, thereby further reducing the process gas from entering the gap. Optionally, the number of blocking parts 130 can also be more, which are arranged around the electrode block 111. In other embodiments, the blocking part 130 can also be arranged on one side or both sides of the boat foot 121, and the technical effects produced include at least the technical effects in the above-mentioned embodiments, which will not be repeated.

[0037] In summary, the electrode feeding device 10 can reduce the process gas blowing into the gap between the electrode block 111 and the boat foot 121 by blocking the process gas through the blocking part 130, thereby reducing the phenomenon of ionizing the gas by the ignition discharge between the electrode block 111 and the boat foot 121, and further reducing and inhibiting the growth of the insulating film between the electrode block 111 and the boat foot 121. After the growth of the insulating film is inhibited, the decrease in conductivity between the electrode block 111 and the boat foot 121 can be reduced, thereby reducing the abnormal electric field in the wafer boat 120 and increasing the stability of the electric field therein. By setting the blocking part 130, it can also play a positioning or guiding role in the placement of the wafer boat 120, thereby reducing the deviation of the placement position of the wafer boat 120 in each process, reducing the impact on the repeatability of the electric field, and helping to improve the uniformity between batch processes.

[0038] The above are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An electrode feed device, characterized in that: include: Electrode guide rod; An electrode block is arranged on the electrode guide rod; A wafer boat, wherein the wafer boat has a boat foot, and the boat foot abuts against the electrode block to electrically connect the two; Wherein, at least one of the electrode block and the boat foot is provided with a blocking portion for blocking process gas from entering the gap between the boat foot and the electrode block, and the process gas is introduced along the length direction of the wafer carrier boat; The projection of the blocking portion on the surface of the electrode block or the boat foot having the blocking portion accounts for 20%-75% of the surface; The ratio of the height of the blocking portion protruding from the electrode block or the boat foot to the thickness of the electrode block or the boat foot is 20%-65%.

2. The electrode feedthrough device according to claim 1, characterized in that: At least one of the electrode block and the boat foot is provided with the blocking portion protrudingly, and the other of the electrode block and the boat foot is provided with a receiving space for receiving the blocking portion concavely, and when the boat foot is electrically connected to the electrode block, the blocking portion is received in the receiving space.

3. The electrode feed-in device according to claim 2, characterized in that: The blocking portion is protruding from the middle of at least one of the electrode block and the boat foot, and is in a rectangular parallelepiped shape. The shape of the accommodating space is adapted to the blocking portion. A rectangular insertion port is provided on one side of the accommodating space, and the blocking portion extends into the accommodating space from the insertion port.

4. The electrode feed-in device according to claim 2, characterized in that: The blocking portion is protrudingly provided on the surface of the electrode block close to the boat foot, and the boat foot is provided with the accommodating space.

5. The electrode feed-in device according to claim 4, characterized in that: The cross section of the blocking portion is gradually reduced from the surface of the electrode block toward the boat foot, and the cross section of the accommodating space is gradually reduced from the surface of the boat foot toward a direction away from the electrode block.

6. The electrode feedthrough device according to claim 5, characterized in that: The angle between the side of the cross section of the blocking portion and the surface of the electrode block close to the boat foot is 20°-80°, or the ratio of the area of ​​the surface of the blocking portion close to the boat foot to the projected area of ​​the blocking portion on the surface of the electrode block is 30%-90%.

7. The electrode feedthrough device according to claim 2, characterized in that: The blocking portion is protrudingly provided on the surface of the boat foot close to the electrode block, and the electrode block is provided with the accommodating space.

8. The electrode feedthrough device according to claim 1, characterized in that: At least two blocking parts are provided, and at least two blocking parts are provided on the electrode block or the boat foot, or at least one of the at least two blocking parts is provided on the electrode block, and the remaining blocking parts are provided on the boat foot.

9. The electrode feedthrough device according to claim 1, characterized in that: The blocking portion is disposed on one side of the electrode block or the boat foot, and the blocking portion is located at one end of the gap to block at least one direction of the gap to prevent process gas from entering.

10. The electrode feedthrough device according to claim 1, characterized in that: The electrode feeding device includes at least two electrode guide rods, each of which is provided with at least two electrode blocks along its length direction, and the wafer boat is provided with at least two electrode blocks along the length direction of the electrode guide rods. The wafer boat has at least two boat feet, and the boat feet correspond to the electrode blocks one by one.

11. The electrode feedthrough device according to claim 1, characterized in that: The wafer boat includes a plurality of conductive sheets arranged side by side.

12. The electrode feedthrough device according to claim 11, characterized in that: The conductive sheet is made of graphite or metal.

13. The electrode feedthrough device according to claim 12, characterized in that: The central material of the conductive sheet is metal, and a graphite layer is arranged on the outer layer of the metal material.

14. A chemical deposition device, characterized in that: include: The reaction chamber is supplied with process gas; The electrode feeding device according to any one of claims 1 to 13, wherein the electrode feeding device is arranged in the reaction chamber.

Images