A multi-angle PCD grinding tool and its preparation method

Abstract

The present invention belongs to the technical field of abrasive tool processing, and in particular relates to a multi-angle PCD abrasive tool and a preparation method thereof. The PCD sheet of the multi-angle PCD abrasive tool has a positive rake angle cutting edge and a negative rake angle cutting edge. The preparation method comprises the following steps: 1: mounting the PCD abrasive tool to be processed on an ultrashort pulse laser processing device; 2: processing the rake face of the negative rake angle cutting edge of the end face and the flank face of the positive rake angle cutting edge of the end face; 3: processing the rake face of the circumferential negative rake angle cutting edge and the flank face of the circumferential positive rake angle cutting edge; 4: processing the flank face of the negative rake angle cutting edge of the end face and the rake face of the positive rake angle cutting edge of the end face; 5: processing the flank face of the circumferential negative rake angle cutting edge and the rake face of the circumferential positive rake angle cutting edge; and 6: repeating steps 2 to 5 in sequence until all cutting edges are processed. The present invention realizes alternating processing of positive and negative rake angles during end face grinding and circumferential grinding, thereby improving the grinding force, grinding heat, and surface quality and integrity of the workpiece to be processed.

Description

Technical Field

[0001] The present invention belongs to the technical field of abrasive tool processing, and in particular relates to a multi-angle PCD abrasive tool and a preparation method thereof. Background Art

[0002] Abrasive tools are tools used for grinding, lapping and polishing. Most of them are artificial abrasive tools made of abrasives and binders. There are also natural abrasive tools directly processed from natural mineral rocks. In addition to being widely used in machinery manufacturing and other metal processing industries, abrasive tools are also used in food processing, papermaking industry and the processing of non-metallic materials such as ceramics, glass, stone, plastic, rubber, and wood.

[0003] Existing polycrystalline diamond (PCD) grinding tools have the problem of a single cutting edge, that is, a purely positive rake angle cutting edge or a purely negative rake angle cutting edge. When grinding with a negative rake angle, the workpiece material will be subjected to a large compressive stress, which in turn leads to a large normal force. The normal force plays a dominant role in the generation of cracks during processing, causing the generation and expansion of cracks, thereby affecting the surface and sub-surface quality of the ground workpiece. However, the phenomenon of chipping is not easy to occur when grinding with a negative rake angle; when cutting with a positive rake angle, it can effectively reduce the grinding force and specific grinding energy, and can effectively reduce the surface and sub-surface damage of the workpiece after processing, such as microcracks, residual stress, phase change, dislocation, ripples, etc., and greatly improve the surface integrity of the material. However, the strength of the cutting edge is reduced, and chipping is prone to occur. Summary of the Invention

[0004] In response to the shortcomings of the existing technology, the present invention proposes a multi-angle PCD grinding tool and a preparation method thereof. Ultrashort pulse laser is used to alternately process positive and negative rake angle cutting edges on PCD wafers, realizing alternating positive and negative rake angle processing during end face grinding and circumferential grinding, thereby improving the grinding force and grinding heat during processing, the quality and integrity of the surface to be processed, and the processing efficiency.

[0005] To achieve the above-mentioned object, the technical solution adopted by the present invention provides a multi-angle PCD grinding tool, which is installed on a PCD grinding tool ultrashort pulse laser processing device to process the blade;

[0006] The multi-angle PCD grinding tool comprises a PCD sheet; the PCD sheet is annular in structure, and the end face and the circumferential outer wall of the PCD sheet each have a plurality of positive rake angle cutting edges and negative rake angle cutting edges; the positive rake angle cutting edges and the negative rake angle cutting edges constitute a positive and negative rake angle alternating grinding surface of the multi-angle PCD grinding tool; the positive rake angle cutting edges and the negative rake angle cutting edges each include a rake face and a flank face;

[0007] The positive rake angle cutting edge includes a plurality of end face positive rake angle cutting edges and a plurality of circumferential positive rake angle cutting edges, and the negative rake angle cutting edge includes a plurality of end face negative rake angle cutting edges and a plurality of circumferential negative rake angle cutting edges; the plurality of end face negative rake angle cutting edges and the plurality of end face positive rake angle cutting edges are distributed on the end face of the PCD wafer, and the plurality of circumferential negative rake angle cutting edges and the plurality of circumferential positive rake angle cutting edges are distributed on the circumferential outer wall of the PCD wafer; the end face negative rake angle cutting edge and the end face positive rake angle cutting edge are adjacent cutting edges; the circumferential negative rake angle cutting edge and the circumferential positive rake angle cutting edge are adjacent cutting edges; each of the negative rake angle cutting edges is composed of the end face negative rake angle cutting edge extending to the circumferential negative rake angle cutting edge on the circumferential outer wall; each of the positive rake angle cutting edges is composed of the end face positive rake angle cutting edge extending to the circumferential positive rake angle cutting edge on the circumferential outer wall;

[0008] The end face negative rake angle edge includes the end face negative rake angle edge rake face and the end face negative rake angle edge flank face; the end face positive rake angle edge includes the end face positive rake angle edge rake face and the end face positive rake angle edge flank face; the circumferential negative rake angle edge includes the circumferential negative rake angle edge rake face and the circumferential negative rake angle edge flank face; the circumferential positive rake angle edge includes the circumferential positive rake angle edge rake face and the circumferential positive rake angle edge flank face; the end face negative rake angle edge rake face, the end face negative rake angle edge flank face, the end face positive rake angle edge flank face, the circumferential negative rake angle edge rake face, the circumferential negative rake angle edge flank face, the circumferential positive rake angle edge rake face and the circumferential positive rake angle edge flank face all have grinding surfaces;

[0009] The rake face of the end face negative rake angle cutting edge and the rake face of the end face positive rake angle cutting edge constitute the clockwise grinding face of the positive and negative rake angles of the end face of the multi-angle PCD grinding tool; the rake face of the circumferential negative rake angle cutting edge and the rake face of the circumferential positive rake angle cutting edge constitute the clockwise grinding face of the positive and negative rake angles of the circumferential surface of the multi-angle PCD grinding tool; the flank face of the end face negative rake angle cutting edge and the flank face of the end face positive rake angle cutting edge constitute the counterclockwise grinding face of the positive and negative rake angles of the end face of the multi-angle PCD grinding tool; the flank face of the circumferential negative rake angle cutting edge and the flank face of the circumferential positive rake angle cutting edge constitute the counterclockwise grinding face of the positive and negative rake angles of the circumferential surface of the multi-angle PCD grinding tool.

[0010] Furthermore, the multi-angle PCD grinding tool further comprises a clamping structure and a metal matrix;

[0011] The bottom of the metal substrate is fixed to the top of the clamping structure by brazing;

[0012] The top of the metal substrate is fixed to the bottom of the PCD sheet by brazing;

[0013] The clamping structure is fixedly connected to the PCD grinding tool ultrashort pulse laser processing device.

[0014] A method for preparing a multi-angle PCD grinding tool as described in any one of the above, the method for preparing the multi-angle PCD grinding tool comprising:

[0015] Step 1: Install the PCD abrasive tool to be processed on the PCD abrasive tool ultrashort pulse laser processing device;

[0016] Step 2: According to the cutting edge design spacing of the PCD wafer, the matching CNC interpolation path and laser parameters such as laser average power and repetition frequency are set to process the adjacent rake face of the end face negative rake angle cutting edge and the flank face of the end face positive rake angle cutting edge;

[0017] Step 3: Based on step 2, the rotatable worktable is rotated to 90 degrees around the X axis, and the circumferential negative rake angle cutting edge rake face and the circumferential positive rake angle cutting edge flank face are machined on the circumferential surface of the PCD wafer;

[0018] Step 4: According to the designed number of cutting edges n of the PCD wafer, the rotatable worktable is rotated 180° / n around the Z axis, and the laser beam is processed along the motion trajectory of the end face of the PCD wafer to respectively form the adjacent negative rake angle cutting edge flank face and the positive rake angle cutting edge rake face of the end face;

[0019] Step 5: Based on step 4, the rotatable worktable is rotated to 90° around the X-axis, and the precision slide returns to the coordinate origin set in step 3. The adjacent circumferential negative rake angle cutting edge flank face and the circumferential positive rake angle cutting edge rake face are continuously machined on the circumferential outer wall of the PCD wafer with the coordinate origin as the starting point;

[0020] Step 6: Rotate the rotatable worktable around the X-axis to 0°, and repeat steps 2 to 5 (n / 2-1) times in sequence until all the end face negative rake angle edges, the end face positive rake angle edges, the circumferential negative rake angle edges, and the circumferential positive rake angle edges on the PCD wafer are processed.

[0021] Furthermore, the processing of the adjacent rake face of the end face negative rake angle cutting edge and the flank face of the end face positive rake angle cutting edge in step 2 specifically includes:

[0022] Step 2.1: Processing the rake face of the negative rake angle cutting edge and the flank face of the positive rake angle cutting edge on the end face according to the laser beam emitted by the optical rotation module;

[0023] Step 2.2: After the negative rake angle cutting edge and the positive rake angle cutting edge flank adjacent to the end face of the PCD wafer in step 2.1 are processed, the precision slide returns to the coordinate origin set in step 1.

[0024] Furthermore, the processing of the adjacent circumferential negative rake angle cutting edge rake face and the circumferential positive rake angle cutting edge flank face in step 3 specifically includes:

[0025] Step 3.1: Rotate the rotatable table 90° around the X-axis so that the annular outer wall of the PCD wafer is located below the optical rotation module and the vertically emitted light beam of the focusing system is located at the coordinate origin. Set the matching CNC interpolation path and laser parameters such as average laser power and repetition rate. Select the matching optical rotation module parameters such as rotation speed, prism angle and translation mirror position to begin processing;

[0026] Step 3.2: After the adjacent circumferential negative rake angle cutting edge front cutting edge and the circumferential positive rake angle cutting edge back cutting edge on the circumferential outer wall of the PCD wafer in step 3.1 are processed, the rotatable worktable is rotated to 0° around the X-axis, and the precision slide returns to the coordinate origin set in step 1.

[0027] Furthermore, it is characterized in that the laser beam has three modes: negative taper laser beam, zero taper laser beam and positive taper laser beam.

[0028] Furthermore, when processing the adjacent rake face of the end face negative rake angle cutting edge and the flank face of the end face positive rake angle cutting edge in step 2, the initial laser beam adopts a negative taper laser beam. After the negative taper laser beam processes the flank face of the end face positive rake angle cutting edge from the coordinate origin, the negative taper laser beam is switched to a zero taper laser beam. The zero taper laser beam moves to a set position along the motion trajectory of the laser beam along the end face of the PCD wafer, and is switched to a positive taper laser beam to process the rake face of the end face negative rake angle cutting edge.

[0029] The laser beam processing method used in step 3 to process the adjacent circumferential negative rake angle cutting edge rake face and the circumferential positive rake angle cutting edge flank face is the same as that in step 2;

[0030] When processing the adjacent flank face of the end face negative rake angle cutting edge and the rake face of the end face positive rake angle cutting edge in step 4, the initial laser beam adopts a positive taper laser beam, and when the positive taper laser beam moves from the coordinate origin to the middle of the designed spacing between the two cutting edges, it is switched to a negative taper laser beam until the laser beam is processed in place along the motion trajectory of the end face of the PCD wafer, and the adjacent flank face of the end face negative rake angle cutting edge and the rake face of the end face positive rake angle cutting edge are respectively processed;

[0031] The laser beam processing method used in step 5 to process the adjacent flank face of the circumferential negative rake angle cutting edge and the rake face of the circumferential positive rake angle cutting edge is the same as that in step 4.

[0032] The beneficial effects of the present invention are:

[0033] First, the technical solution adopted by the present invention is to use a PCD grinding tool ultrashort pulse laser processing device to process multiple positive rake angle cutting edges and negative rake angle cutting edges on the end face and circumferential outer wall of the PCD sheet of the PCD grinding tool to be processed. The positive rake angle cutting edges and the negative rake angle cutting edges constitute the positive and negative rake angle alternating grinding surfaces of the multi-angle PCD grinding tool. When the multi-angle PCD grinding tool rotates, the positive and negative rake angle cutting edges on the end face of the PCD sheet and the positive and negative rake angle cutting edges on the circumferential outer wall of the PCD sheet can be alternately cut and ground, which can improve the grinding force and grinding heat during processing, and improve the surface quality, integrity and processing efficiency of the ground workpiece;

[0034] Second, the positive rake angle cutting edge of the present invention includes multiple end face positive rake angle cutting edges and multiple circumferential positive rake angle cutting edges, and the negative rake angle cutting edge includes multiple end face negative rake angle cutting edges and multiple circumferential negative rake angle cutting edges. The end face positive rake angle cutting edge, the circumferential positive rake angle cutting edge, the end face negative rake angle cutting edge and the circumferential negative rake angle cutting edge all have rake faces and flank faces. When the multi-angle PCD grinding tool rotates clockwise, the end face positive rake angle cutting edge, the circumferential positive rake angle cutting edge, the end face negative rake angle cutting edge and the rake faces on the circumferential negative rake angle cutting edge perform alternating cutting and grinding of positive and negative rake angles on the workpiece being ground. When the multi-angle PCD grinding tool rotates counterclockwise, the end face positive rake angle cutting edge, the circumferential positive rake angle cutting edge, the end face negative rake angle cutting edge and the flank faces on the circumferential negative rake angle cutting edge perform alternating cutting and grinding of positive and negative rake angles on the workpiece being ground. When the rake face is severely worn, the flank face can be switched for use. This structure improves the service life of the multi-angle PCD grinding tool. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 Schematic diagram of an ultrashort pulse laser processing apparatus for PCD abrasive tools according to an embodiment of the present invention;

[0036] Figure 2 yes Figure 1 Schematic diagram of the rotatable table of the PCD abrasive ultrashort pulse laser processing device rotating 90°;

[0037] Figure 3 2. It is a schematic diagram of the overall structure of a multi-angle PCD grinding tool according to an embodiment of the present invention;

[0038] Figure 4 Schematic diagram of three modes of laser beams according to an embodiment of the present invention;

[0039] Figure 5 Schematic diagram of the machining of the negative rake angle cutting edge and the positive rake angle cutting edge of the end face according to the embodiment of the present invention Figure 1 ;

[0040] Figure 6 Schematic diagram of the machining of the negative rake angle cutting edge and the positive rake angle cutting edge of the end face according to the embodiment of the present invention Figure 2 ;

[0041] Figure 7 Schematic diagram of a rake face of a negative rake angle cutting edge and a flank face of a positive rake angle cutting edge in an embodiment of the present invention;

[0042] Figure 8 Schematic diagram of a rake face of a circumferential negative rake angle cutting edge and a flank face of a circumferential positive rake angle cutting edge according to an embodiment of the present invention;

[0043] Figure 9 Schematic diagram of the machining of the negative rake angle cutting edge flank and the positive rake angle cutting edge rake face of the end face according to the embodiment of the present invention Figure 1 ;

[0044] Figure 10 Schematic diagram of the machining of the negative rake angle cutting edge flank and the positive rake angle cutting edge rake face of the end face according to the embodiment of the present invention Figure 2 ;

[0045] Figure 11 It is a schematic structural diagram of the PCD sheet after processing and forming according to an embodiment of the present invention.

[0046] Among them, A1-ultrashort pulse laser light source; A2-CCD module; A3-reflecting lens; A4-optical rotation module; A5-focusing system; A6-precision coaxial blowing device; A7-caliper; A8-rotatable worktable; A9-turntable body; A10-precision slide; B-PCD grinding tool to be processed; 1-multi-angle PCD grinding tool; 10-clamping structure; 11-metal substrate; 12-PCD sheet; 120-end face negative rake edge; 1200-end face Negative rake angle cutting edge rake face; 1201-end face negative rake angle cutting edge flank face; 121-end face positive rake angle cutting edge; 1210-end face positive rake angle cutting edge rake face; 1211-end face positive rake angle cutting edge flank face; 122-circumferential negative rake angle cutting edge; 1220-circumferential negative rake angle cutting edge rake face; 1221-circumferential negative rake angle cutting edge flank face; 123-circumferential positive rake angle cutting edge; 1230-circumferential positive rake angle cutting edge rake face; 1231-circumferential positive rake angle cutting edge flank face. DETAILED DESCRIPTION

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0048] It should be noted that the present invention provides a multi-angle PCD grinding tool and a preparation method thereof. The PCD grinding tool to be processed is installed on a PCD grinding tool ultra-short pulse laser processing device, and the PCD grinding tool ultra-short pulse laser processing device is used to perform cutting edge processing on the PCD grinding tool to be processed.

[0049] like Figure 1 、 Figure 2 As shown, the PCD abrasive tool ultrashort pulse laser processing apparatus includes an ultrashort pulse laser light source A1, a CCD module A2, a reflective lens A3, an optical rotation module A4, a focusing system A5, a precision coaxial air blowing device A6, a caliper A7, a rotatable worktable A8, a turntable body A9, and a precision slide A10. The PCD abrasive tool B to be processed is fixedly mounted on the PCD abrasive tool ultrashort pulse laser processing apparatus.

[0050] Figure 1 The coordinates in represent the current position coordinates of the PCD abrasive tool ultrashort pulse laser processing device.

[0051] The turntable body A9 has a rotation axis perpendicular to the XOY plane and the YOZ plane. The rotation axis perpendicular to the XOY plane rotates around the coordinate Z axis, and the rotation axis perpendicular to the YOZ plane rotates around the coordinate X axis.

[0052] The rotatable worktable A8 is set on the rotation axis of the turntable body A9 perpendicular to the XOY plane, and the PCD grinding tool B to be processed is fixed on the rotatable worktable A8 through the caliper A7; the rotation axis of the turntable body A9 perpendicular to the XOY plane and the YOZ plane rotates, driving the PCD grinding tool B to be processed on the rotatable worktable A8 to rotate around the Z axis and the X axis respectively.

[0053] The optical rotation module A4 and the focusing system A5 are fixed on the precision slide A10. The precision slide A10 can move up and down along the Z axis to ensure that the surface of the part to be processed is located at the laser focal plane. At the same time, the precision slide A10 moves along the X and Y axes through precision guide rails.

[0054] The movement of the precision slide A10 along the X, Y, and Z axes, as well as the rotation of the rotatable worktable A8 around the Z and X axes, are controlled by the CNC system and servo motors of the PCD mold ultrashort pulse laser processing device, enabling multi-axis linkage and ensuring a high degree of automation in the processing.

[0055] A horizontally mounted focusing system A5 is fixed to the bottom of the precision slide A10 via a bracket. A precision coaxial air blowing device A6 is located at the bottom of the focusing system A5. The processing area of the PCD abrasive tool B to be processed is located below the precision coaxial air blowing device A6. The precision coaxial air blowing device A6 is used to blow inert gas into the processing area of the PCD abrasive tool B to be processed, which can effectively isolate oxygen, prevent high-temperature deterioration of the material surface, and quickly remove gasified and fragmented materials to ensure material processing efficiency and quality.

[0056] A rotation module A4 is installed above the precision slide A10. The ultrashort pulse laser light source A1 emits pulsed laser, which is reflected by the reflective lens A3 and enters the rotation module A4. The CCD module A2 monitors the processing process in real time. The laser emitted from the rotation module A4 is focused by the focusing system A5. The focused laser spot moves in a high-speed circular motion on the processing surface of the PCD mold B to be processed, forming peeling. The high-speed rotating laser can ensure uniform energy distribution in the entire radiation area, reducing the impact of beam polarization and spot shape on the processing area.

[0057] like Figure 3 、 Figure 11 As shown, the present invention provides a multi-angle PCD grinding tool and its preparation method. The PCD grinding tool B to be processed is transformed into a multi-angle PCD grinding tool 1 through processing by a PCD grinding tool ultrashort pulse laser processing device. The multi-angle PCD grinding tool 1 includes a clamping structure 10, a metal substrate 11 and a PCD sheet 12.

[0058] The PCD grinding tool 1 is a cylindrical structure. The bottom of the metal base 11 is fixed to the top of the clamping structure 10 by brazing. The bottom of the PCD sheet 12 is fixed to the top of the metal base 11 by brazing.

[0059] The PCD sheet 12 has multiple machined multi-angle cutting edges, which are used for alternating cutting and grinding of positive and negative rake angles during end face grinding and circumferential grinding. When the PCD sheet 12 is machined with multi-angle cutting edges, it is fixed in the caliper A7 of the PCD grinding tool ultrashort pulse laser processing device through the clamping part 10.

[0060] The PCD wafer 12 is an annular structure, and includes a plurality of end face negative rake angle cutting edges 120, a plurality of end face positive rake angle cutting edges 121, a plurality of circumferential negative rake angle cutting edges 122, and a plurality of circumferential positive rake angle cutting edges 123; wherein, the end face negative rake angle cutting edges 120 and the end face positive rake angle cutting edges 121 are adjacent cutting edges, and the circumferential negative rake angle cutting edges 122 and the circumferential positive rake angle cutting edges 123 are adjacent cutting edges.

[0061] The distribution pattern between each cutting edge on the PCD wafer 12 is set according to demand, multiple end face negative rake angle cutting edges 120 and multiple end face positive rake angle cutting edges 121 are distributed on the end face of the PCD wafer 12, and multiple circumferential negative rake angle cutting edges 122 and multiple circumferential positive rake angle cutting edges 123 are distributed on the circumferential outer wall of the annular structure.

[0062] Each negative rake angle cutting edge on the PCD wafer 12 is composed of an end face negative rake angle edge 120 extending to a circumferential negative rake angle edge 122 of the outer wall of the annular structure, and each positive rake angle cutting edge on the PCD wafer 12 is composed of an end face positive rake angle edge 121 extending to a circumferential positive rake angle edge 123 of the outer wall of the annular structure.

[0063] The end face negative rake angle edge 120 includes an end face negative rake angle edge rake face 1200 and an end face negative rake angle edge flank face 1201, the end face positive rake angle edge 121 includes an end face positive rake angle edge rake face 1210 and an end face positive rake angle edge flank face 1211, the circumferential negative rake angle edge 122 includes a circumferential negative rake angle edge rake face 1220 and a circumferential negative rake angle edge flank face 1221, and the circumferential positive rake angle edge 123 includes a circumferential positive rake angle edge rake face 1230 and a circumferential positive rake angle edge flank face 1231.

[0064] The end face negative rake angle cutting edge rake face 1200, the end face negative rake angle cutting edge flank face 1201, the end face positive rake angle cutting edge rake face 1210, the end face positive rake angle cutting edge flank face 1211, the circumferential negative rake angle cutting edge rake face 1220, the circumferential negative rake angle cutting edge flank face 1221, the circumferential positive rake angle cutting edge rake face 1230 and the circumferential positive rake angle cutting edge flank face 1231 all have grinding surfaces.

[0065] When the multi-angle PCD grinding tool 1 rotates clockwise using the end face, the end face negative rake angle cutting edge rake face 1200 and the end face positive rake angle cutting edge rake face 1210 realize the alternating grinding of the positive rake angle cutting edge and the negative rake angle cutting edge of the multi-angle PCD grinding tool 1; when the multi-angle PCD grinding tool 1 rotates clockwise using the annular outer wall, the circumferential negative rake angle cutting edge rake face 1220 and the circumferential positive rake angle cutting edge rake face 1230 realize the alternating grinding of the positive rake angle cutting edge and the negative rake angle cutting edge of the multi-angle PCD grinding tool 1.

[0066] When the multi-angle PCD grinding tool 1 rotates counterclockwise using the end face, the end face negative rake angle cutting edge flank 1201 and the end face positive rake angle cutting edge flank 1211 realize the alternating grinding of the positive rake angle cutting edge and the negative rake angle cutting edge of the multi-angle PCD grinding tool 1; when the multi-angle PCD grinding tool 1 rotates counterclockwise using the annular outer wall, the circumferential negative rake angle cutting edge flank 1221 and the circumferential positive rake angle cutting edge flank 1231 realize the alternating grinding of the positive rake angle cutting edge and the negative rake angle cutting edge of the multi-angle PCD grinding tool 1.

[0067] Alternating positive and negative rake angle grinding can improve the grinding force and grinding heat during processing, the quality and integrity of the machined surface, and processing efficiency.

[0068] The end face and the cutting edge on the annular outer wall of the multi-angle PCD grinding tool 1 can participate in grinding at the same time.

[0069] The present invention provides a multi-angle PCD grinding tool and a preparation method thereof, the preparation method comprising the following steps:

[0070] Step 1: Install the PCD abrasive tool B to be processed on the PCD abrasive tool ultrashort pulse laser processing device.

[0071] Fix the clamping part 10 on the rotatable workbench A8 through the caliper A7, adjust the position of the precision slide A10, so that the vertical light beam emitted by the focusing system A5 is tangent to the annular outer wall of the PCD wafer 12, and record the tangent point as the coordinate origin.

[0072] Step 2: According to the designed cutting edge spacing of the PCD wafer 12, set the matching CNC interpolation path and laser parameters such as laser average power and repetition frequency to process the adjacent end face negative rake angle cutting edge rake face 1200 and end face positive rake angle cutting edge flank face 1211.

[0073] Step 2.1: Process the negative rake angle cutting edge rake face 1200 and the positive rake angle cutting edge flank face 1211 of the end face according to the laser beam emitted by the optical rotation module A4.

[0074] like Figure 4 As shown, the laser beam emitted by the optical rotation module A4 has three modes. By selecting matching optical rotation module parameters such as rotation speed, prism angle and translation mirror position, a cutting edge with a set angle is machined on the end face of the PCD wafer 12.

[0075] like Figure 5 As shown, in this embodiment, the laser beam emitted by the optical rotation module A4 adopts two modes. The initial laser beam adopts a negative taper laser beam. When the negative taper laser beam moves from the coordinate origin to the middle of the designed distance between the two cutting edges, it switches to a positive taper laser beam until the laser beam is processed in place along the movement trajectory of the end face of the PCD wafer 12, and the adjacent end face negative rake angle cutting edge rake face 1200 and the end face positive rake angle cutting edge flank face 1211 are respectively processed.

[0076] like Figure 6 As shown, in another implementation, the laser beam emitted by the optical rotation module A4 adopts three modes. The initial laser beam adopts a negative taper laser beam. After the negative taper laser beam processes the end face positive rake angle cutting edge back face 1211 from the coordinate origin, the negative taper laser beam is switched to a zero taper laser beam. The zero taper laser beam moves to a set position along the motion trajectory of the laser beam along the end face of the PCD wafer 12, and is switched to a positive taper laser beam to process the end face negative rake angle cutting edge front face 1200.

[0077] Step 2.2: After the negative rake angle cutting edge face 1200 and the positive rake angle cutting edge flank face 1211 adjacent to the end face of the PCD wafer 12 in step 2.1 are processed, the precision slide A10 returns to the coordinate origin set in step 1.

[0078] Step 3: Based on step 2, the rotatable worktable A8 is rotated to 90° around the X-axis, and adjacent circumferential negative rake angle cutting edge rake face 1220 and circumferential positive rake angle cutting edge flank face 1231 are machined on the circumferential surface of the PCD wafer 12 .

[0079] Step 3.1: Rotate rotatable table A8 90° around the X-axis so that the annular outer wall of PCD wafer 12 is located below optical rotation module A4 and the vertically emitted light beam of focusing system A5 is located at the coordinate origin. Set the matching CNC interpolation path and laser parameters such as average laser power and repetition frequency. Select matching optical rotation module parameters such as rotation speed, prism angle, and translation mirror position.

[0080] like Figure 7 As shown, starting from the coordinate origin, the laser beam emitted by optical rotation module A4 continues to machine a circumferential negative rake edge rake face 1220 and a circumferential positive rake edge flank face 1231 on the annular outer wall of the PCD wafer 12. The circumferential negative rake edge rake face 1220 extends from the edge of the end face negative rake edge rake face 1200 to the outer wall of the annular structure, while the circumferential positive rake edge flank face 1231 extends from the edge of the end face positive rake edge flank face 1211 to the outer wall of the annular structure.

[0081] In step 3, the laser beam processing method used to process the adjacent circumferential negative rake angle cutting edge rake face 1220 and the circumferential positive rake angle cutting edge flank face 1231 is the same as that in step 2.

[0082] Step 3.2: After the adjacent circumferential negative rake angle cutting edge rake face 1220 and circumferential positive rake angle cutting edge flank face 1231 on the annular outer wall of the PCD wafer 12 in step 3.1 are processed, the rotatable worktable A8 is rotated to 0° around the X-axis, and the precision slide A10 returns to the coordinate origin set in step 1.

[0083] Step 4: According to the designed number of cutting edges n of the PCD wafer 12, the rotatable worktable A8 is rotated 180° / n around the Z axis, and processing is performed according to the motion trajectory of the laser beam along the end face of the PCD wafer 12 to respectively produce adjacent end face negative rake angle cutting edge flank face 1201 and end face positive rake angle cutting edge rake face 1210.

[0084] After the end face negative rake angle cutting edge flank surface 1201 and the end face positive rake angle cutting edge rake surface 1210 adjacent to the end face of the PCD wafer 12 are processed, the precision slide A10 returns to the coordinate origin set in step 1.

[0085] It should be noted that the operation method of step 4 is the same as that of step 2, and the difference from step 2 is that the mode of the initial laser beam and the mode of the laser beam at the end are different.

[0086] like Figure 7As shown, in this embodiment, the laser beam emitted by the optical rotation module A4 adopts two modes. The initial laser beam adopts a positive taper laser beam. When the positive taper laser beam moves from the coordinate origin to the middle of the designed distance between the two cutting edges, it switches to a negative taper laser beam until the laser beam is processed in place along the movement trajectory of the end face of the PCD wafer 12, and the adjacent end face negative rake angle cutting edge flank surface 1201 and the end face positive rake angle cutting edge front cutting edge 1210 are respectively processed.

[0087] like Figure 8 As shown, in another implementation, the laser beam emitted by the optical rotation module A4 adopts three modes. The initial laser beam adopts a positive taper laser beam. After the positive taper laser beam processes the negative rake angle cutting edge flank 1201 of the end face from the coordinate origin, the positive taper laser beam is switched to a zero taper laser beam. The zero taper laser beam moves to a set position along the motion trajectory of the laser beam along the end face of the PCD wafer 12, and is switched to a negative taper laser beam to process the positive rake angle cutting edge flank 1210 of the end face.

[0088] Step 5: Based on step 4, the rotatable table A8 is rotated 90° about the X-axis, and the precision slide A10 returns to the coordinate origin set in step 3. The adjacent circumferential negative rake angle cutting edge flank 1221 and circumferential positive rake angle cutting edge rake face 1230 are continuously machined on the annular outer wall of the PCD wafer 12 with the coordinate origin as the starting point.

[0089] After the circumferential negative rake angle cutting edge flank 1221 and the circumferential positive rake angle cutting edge rake edge 1230 of the annular outer wall of the PCD wafer 12 are processed, the precision slide A10 returns to the coordinate origin set in step 1.

[0090] Step 6: Rotate the rotatable worktable A8 around the X-axis to 0°, and repeat steps 2 to 5 (n / 2-1) times in sequence until all the end face negative rake angle edges 120, end face positive rake angle edges 121, circumferential negative rake angle edges 122 and circumferential positive rake angle edges 123 on the PCD wafer 12 are processed.

[0091] like Figure 9 As shown, the machined positive rake angle cutting edges and negative rake angle cutting edges are distributed on the end surface and the annular outer wall of the PCD wafer 12 .

[0092] In the present invention, terms such as "installed," "connected," "connected," and "fixed" should be understood broadly. For example, "connected" may refer to a fixed connection, a detachable connection, or an integral connection; and "connected" may refer to a direct connection or an indirect connection via an intermediary. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0093] The shapes of the various components in the drawings are schematic, and certain differences from their actual shapes are not excluded. The drawings are only used to illustrate the principles of the present invention and are not intended to limit the present invention.

[0094] Although the present invention has been disclosed in detail with reference to the accompanying drawings, it should be understood that these descriptions are merely illustrative and are not intended to limit the application of the present invention. The scope of the present invention is defined by the appended claims and includes various modifications, variations, and equivalents made to the invention without departing from the scope and spirit of the present invention.

Claims

1. A multi-angle PCD grinding tool, characterized in that: The multi-angle PCD grinding tool (1) is installed on a PCD grinding tool ultrashort pulse laser processing device to process the blade; The multi-angle PCD grinding tool (1) comprises a PCD sheet (12); the PCD sheet (12) is an annular structure, and the end face and the circumferential outer wall of the PCD sheet (12) both have a plurality of positive rake angle cutting edges and negative rake angle cutting edges; the positive rake angle cutting edges and the negative rake angle cutting edges constitute the positive and negative rake angle alternating grinding surfaces of the multi-angle PCD grinding tool (1); the positive rake angle cutting edges and the negative rake angle cutting edges both comprise a rake face and a flank face; The positive rake angle cutting edge comprises a plurality of end face positive rake angle cutting edges (121) and a plurality of circumferential positive rake angle cutting edges (123), and the negative rake angle cutting edge comprises a plurality of end face negative rake angle cutting edges (120) and a plurality of circumferential negative rake angle cutting edges (122); the plurality of end face negative rake angle cutting edges (120) and the plurality of end face positive rake angle cutting edges (121) are distributed on the end face of the PCD wafer (12), and the plurality of circumferential negative rake angle cutting edges (122) and the plurality of circumferential positive rake angle cutting edges (123) are distributed on the PCD wafer (12). the circumferential outer wall; the end face negative rake angle edge (120) and the end face positive rake angle edge (121) are adjacent edges; the circumferential negative rake angle edge (122) and the circumferential positive rake angle edge (123) are adjacent edges; each of the negative rake angle edges is composed of the end face negative rake angle edge (120) extending to the circumferential negative rake angle edge (122) of the circumferential outer wall; each of the positive rake angle edges is composed of the end face positive rake angle edge (121) extending to the circumferential positive rake angle edge (123) of the circumferential outer wall; The end face negative rake angle edge (120) comprises an end face negative rake angle edge rake face (1200) and an end face negative rake angle edge flank face (1201); the end face positive rake angle edge (121) comprises an end face positive rake angle edge rake face (1210) and an end face positive rake angle edge flank face (1211); the circumferential negative rake angle edge (122) comprises a circumferential negative rake angle edge rake face (1220) and a circumferential negative rake angle edge flank face (1221); the circumferential positive rake angle edge (123) comprises a circumferential positive rake angle edge rake face (12 30) and a circumferential positive rake angle cutting edge flank (1231); the end face negative rake angle cutting edge rake face (1200), the end face negative rake angle cutting edge flank (1201), the end face positive rake angle cutting edge rake face (1210), the end face positive rake angle cutting edge flank (1211), the circumferential negative rake angle cutting edge rake face (1220), the circumferential negative rake angle cutting edge flank (1221), the circumferential positive rake angle cutting edge rake face (1230) and the circumferential positive rake angle cutting edge flank (1231) all have grinding surfaces; The end face negative rake angle cutting edge rake face (1200) and the end face positive rake angle cutting edge rake face (1210) constitute the positive and negative rake angle clockwise grinding face of the end face of the multi-angle PCD grinding tool (1); the circumferential negative rake angle cutting edge rake face (1220) and the circumferential positive rake angle cutting edge rake face (1230) constitute the positive and negative rake angle clockwise grinding face of the circumferential surface of the multi-angle PCD grinding tool (1); The end face negative rake angle cutting edge flank (1201) and the end face positive rake angle cutting edge flank (1211) constitute the positive and negative rake angle counterclockwise grinding blade surface of the end face of the multi-angle PCD grinding tool (1); the circumferential negative rake angle cutting edge flank (1221) and the circumferential positive rake angle cutting edge flank (1231) constitute the positive and negative rake angle counterclockwise grinding blade surface of the circumferential surface of the multi-angle PCD grinding tool (1).

2. The multi-angle PCD grinding tool according to claim 1, characterized in that: The multi-angle PCD grinding tool (1) further comprises a clamping structure (10) and a metal matrix (11); The bottom of the metal substrate (11) is fixed to the top of the clamping structure (10) by brazing; The top of the metal substrate (11) is fixed to the bottom of the PCD sheet (12) by brazing; The clamping structure is fixedly connected to the PCD grinding tool ultrashort pulse laser processing device.

3. A method for preparing a multi-angle PCD grinding tool according to any one of claims 1 to 2, characterized in that: The preparation method of the multi-angle PCD grinding tool (1) comprises: Step 1: Install the PCD abrasive tool to be processed on the PCD abrasive tool ultrashort pulse laser processing device; Step 2: according to the cutting edge design spacing of the PCD wafer (12), a matching numerical control interpolation path and laser parameters such as laser average power and repetition frequency are set to process the adjacent end face negative rake angle cutting edge rake face (1200) and the end face positive rake angle cutting edge flank face (1211); Step 3: Based on step 2, the rotatable workbench is rotated to 90° around the X-axis, and the circumferential negative rake angle cutting edge rake face (1220) and the circumferential positive rake angle cutting edge flank face (1231) are machined on the circumferential surface of the PCD wafer (12); Step 4: Based on step 3, the rotatable worktable is rotated around the X axis to 0°, and according to the designed number of blades n of the PCD wafer (12), the rotatable worktable is rotated around the Z axis by 180° / n, and the end face of the PCD wafer (12) is processed according to the motion trajectory of the laser beam along the end face, and adjacent end face negative rake angle cutting edge flank faces (1201) and end face positive rake angle cutting edge rake faces (1210) are respectively processed; Step 5: Based on step 4, the rotatable worktable is rotated to 90° around the X-axis, the precision slide returns to the coordinate origin set in step 3, and the adjacent circumferential negative rake angle cutting edge flank surface (1221) and the circumferential positive rake angle cutting edge rake surface (1230) are continuously processed on the circumferential outer wall of the PCD wafer (12) with the coordinate origin as the starting point; Step 6: Rotate the rotatable worktable around the X-axis to 0°, and repeat steps 2 to 5 (n / 2-1) times in sequence until all the end face negative rake angle edges (120), the end face positive rake angle edges (121), the circumferential negative rake angle edges (122) and the circumferential positive rake angle edges (123) on the PCD wafer (12) are processed.

4. The method for preparing a multi-angle PCD grinding tool according to claim 3, wherein: The processing of the adjacent end face negative rake angle cutting edge rake face (1200) and the end face positive rake angle cutting edge flank face (1211) in step 2 specifically includes: Step 2.1: Processing the negative rake angle cutting edge rake face (1200) and the positive rake angle cutting edge flank face (1211) of the end face according to the laser beam emitted by the optical rotation module; Step 2.2: After the negative rake angle cutting edge front face (1200) and the positive rake angle cutting edge back face (1211) adjacent to the end face of the PCD piece (12) in step 2.1 are processed, the precision slide returns to the coordinate origin set in step 1.

5. The method for preparing a multi-angle PCD grinding tool according to claim 3, wherein: The processing of the adjacent circumferential negative rake angle cutting edge rake face (1220) and the circumferential positive rake angle cutting edge flank face (1231) in step 3 specifically includes: Step 3.1: Rotate the rotatable workbench to 90° around the X-axis so that the annular outer wall of the PCD wafer (12) is located below the optical rotation module, and the vertically emitted light beam of the focusing system is located at the coordinate origin. Set the matching numerical control interpolation path and laser parameters such as laser average power and repetition frequency, and select matching optical rotation module parameters such as rotation speed, prism angle and translation mirror position to start processing; Step 3.2: After the adjacent circumferential negative rake angle cutting edge front cutting edge surface (1220) and the circumferential positive rake angle cutting edge back cutting edge surface (1231) on the circumferential outer wall of the PCD wafer (12) described in step 3.1 are processed, the rotatable worktable is rotated to 0° around the X-axis, and the precision slide returns to the coordinate origin set in step 1.

6. The method for preparing a multi-angle PCD grinding tool according to any one of claims 3 to 5, characterized in that: The laser beam has three modes: a negative taper laser beam, a zero taper laser beam and a positive taper laser beam.

7. The method for preparing a multi-angle PCD grinding tool according to claim 6, wherein: When processing the adjacent front cutting edge (1200) of the end face with a negative rake angle and the back cutting edge (1211) of the end face with a positive rake angle in step 2, the initial laser beam adopts a negative taper laser beam, and after the negative taper laser beam processes the back cutting edge (1211) of the end face with a positive rake angle from the coordinate origin, the negative taper laser beam is switched to a zero taper laser beam, and the zero taper laser beam moves to a set position along the motion trajectory of the laser beam along the end face of the PCD wafer (12), and is switched to a positive taper laser beam to process the front cutting edge (1200) of the end face with a negative rake angle; The laser beam processing method used in step 3 to process the adjacent circumferential negative rake angle cutting edge rake face (1220) and the circumferential positive rake angle cutting edge flank face (1231) is the same as that in step 2; When processing the adjacent end face negative rake angle cutting edge flank (1201) and the end face positive rake angle cutting edge rake edge (1210) in step 4, the initial laser beam adopts a positive taper laser beam, and when the positive taper laser beam moves from the coordinate origin to the middle of the designed spacing between the two cutting edges, it is switched to a negative taper laser beam until the laser beam is processed in place along the motion trajectory of the end face of the PCD wafer (12), and the adjacent end face negative rake angle cutting edge flank (1201) and the end face positive rake angle cutting edge rake edge (1210) are processed respectively; The laser beam processing method used in step 5 to process the adjacent circumferential negative rake angle cutting edge flank surface (1221) and the circumferential positive rake angle cutting edge rake surface (1230) is the same as that in step 4.

Images