A medium window speed control and uniform temperature device of a plasma etching machine and a method thereof

Abstract

This invention belongs to the field of semiconductor chip manufacturing technology, specifically relating to a dielectric window speed control and temperature uniformity device and method for a plasma etching machine. The device includes a vertically mounted cooling fan, an angled cooling fan, and a shield for the angled cooling fans. The vertically mounted and angled cooling fans are evenly spaced and intersectingly arranged on the inner top wall of the shield around the perpendicular bisector of the dielectric window. The air outlet surfaces of the vertically mounted cooling fans all point vertically downwards towards the heater. The plane containing the air outlet surfaces of the vertically mounted cooling fans is always parallel to the plane containing the dielectric window. The air outlet surfaces of each angled cooling fan point towards the center area of ​​the heater. The plane containing the bottom surface of the angled cooling fan always intersects the plane containing the dielectric window. The angle between the bottom surface of the angled cooling fan shield and the perpendicular bisector of the dielectric window is less than 90°. The wind speeds of the vertically mounted and angled cooling fans are controlled independently. This method adjusts the speeds of the vertically mounted and angled cooling fans to achieve uniformity of the dielectric window temperature.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor chip manufacturing technology, specifically relating to a dielectric window speed control and temperature uniformization device and method for a plasma etching machine. Background Technology

[0002] With the continuous development and increasing integration of third-generation memory—magnetic RAM (MRAM)—in recent years, the demand for dry etching of novel non-volatile materials such as metal gate materials (e.g., Model, Ta) and high-k gate dielectric materials (e.g., Al2O3, HfO2, and ZrO2) is constantly increasing. It is essential to solve the sidewall deposition and particle contamination problems caused by non-volatile materials during dry etching, while improving the cleaning process efficiency of plasma processing chambers.

[0003] Typically, heating the ceramic dielectric window is an important means of reducing deposition. Kapton heaters are usually used for ceramic dielectric window heating. However, the resulting problem of temperature uniformity becomes a challenge that needs to be addressed, especially the control of the temperature at the center and the edge.

[0004] Currently, the top cover structure uses a Kapton heater to heat the ceramic dielectric window. The Kapton heater is attached to the upper surface of the ceramic dielectric window, and the excitation RF coil is located above the Kapton heater inside the shield. In order to achieve temperature control and uniformity during the heating process of the ceramic dielectric window by the Kapton heater, the commonly used structural design is to design a cooling fan directly above the Kapton heater and fixed on the shield. However, it seems that this kind of heat dissipation and temperature uniformity cannot control the temperature uniformity between the center and the edge of the ceramic dielectric window. Summary of the Invention

[0005] This invention provides a dielectric window speed control and temperature uniformization device and method for a plasma etching machine, which can achieve good temperature uniformity, has a simple structure, low adjustment cost, and realizes closed-loop control.

[0006] The technical solution adopted by this invention to solve its technical problem is: a dielectric window speed control and temperature uniformization device for a plasma etching machine, wherein a heater is provided above the dielectric window, and a shielding cover is provided on the top of the dielectric window; the temperature uniformization device includes at least two upright cooling fans, at least two upright cooling fan shielding covers, at least two angled cooling fans, and at least two angled cooling fan shielding covers, wherein:

[0007] The upright cooling fan and the angled cooling fan are evenly spaced and arranged crosswise around the vertical line of the medium window on the inner top wall of the shielding cover.

[0008] Each of the upright cooling fans is fixed to the top wall inside the shielding cover, and the air outlet of each of the upright cooling fans is vertically downward facing the heater;

[0009] The plane containing the air outlet surface of each of the aforementioned standard cooling fans is always parallel to the plane containing the medium window;

[0010] The shielding cover of the upright cooling fan is installed on the outside of the upright cooling fan, and the top surface of each shielding cover is connected to the inner top wall of the shielding cover;

[0011] Each of the inclined cooling fans is fixed to the top surface inside the inclined cooling fan shield, and the air outlet of each of the inclined cooling fans faces the central area of ​​the heater.

[0012] The plane containing the bottom surface of each of the angled cooling fans always intersects with the plane containing the medium window;

[0013] The inclined cooling fan shield is provided on the outside of the inclined cooling fan, and one end of each inclined cooling fan shield facing the center point of the inner top wall of the shield is hinged to the shield.

[0014] The angle between the bottom surface of each of the inclined cooling fan shields and the vertical line of the medium window is less than 90°;

[0015] The airflow speeds of the upright cooling fan and the angled cooling fan are controlled independently.

[0016] As a further preferred embodiment of the present invention, it also includes a connecting portion, one end of which is fixedly connected to the shielding cover, and the other end of which is connected to the other end of the inclined cooling fan shielding cover that is away from the center point of the inner top wall of the shielding cover.

[0017] As a further preferred embodiment of the present invention, the air outlet surface of the upright cooling fan is always parallel to the bottom surface of the upright cooling fan shield; the air outlet surface of the angled cooling fan is always parallel to the bottom surface of the angled cooling fan shield.

[0018] As a further preferred embodiment of the present invention, it further includes a first temperature sensor and a second temperature sensor, wherein the first temperature sensor is installed in the central region of the medium window; and the second temperature sensor is installed in the edge region of the medium window.

[0019] As a further preferred embodiment of the present invention, it further includes a first wind speed control system and a second wind speed control system, wherein:

[0020] Each of the above-mentioned standard cooling fans is connected to the first wind speed control system, and the first wind speed control system independently controls the wind speed of each of the above-mentioned standard cooling fans;

[0021] Each of the angled cooling fans is connected to the second wind speed control system, which independently controls the wind speed of each angled cooling fan.

[0022] A method for controlling and uniformizing the dielectric window temperature of a plasma etching machine is also provided. This method utilizes the dielectric window speed control and temperature uniformization device of the plasma etching machine according to any one of claims 1-5 to perform speed control and temperature uniformization operations. The method includes the following steps:

[0023] Step S1: Determine whether the temperature difference between the center and edge regions of the dielectric window meets the process standard. If the standard is met, the plasma etching system does not respond. If the standard is not met, proceed to step S2 below.

[0024] Step S2: The plasma etching system determines, based on the data read in step S1-1, whether the temperature of the central region of the dielectric window is greater than the temperature of the edge region of the dielectric window;

[0025] Step S3: Adjust the airflow speed of the upright cooling fan using the first airflow control system, and adjust the airflow speed of the angled cooling fan using the second airflow control system.

[0026] Step S4: Observe the temperature uniformity on the medium window;

[0027] Step S5: Determine whether the adjustment process is complete based on the observation results in Step 4 above.

[0028] As a further preferred embodiment of the present invention, step 1 specifically includes the following steps:

[0029] S1-1. Read the temperature of the central region of the medium window using the first temperature sensor, and read the temperature of the edge region of the medium window using the second temperature sensor;

[0030] S1-2, The plasma etching system calculates the temperature difference between the center and edge regions of the dielectric window based on the data read in step S1-1;

[0031] S1-3. The plasma etching system determines whether the temperature difference obtained in step S1-2 meets the process standards.

[0032] As a further preferred embodiment of the present invention, in step 3, the adjustment method for the upright cooling fan and the angled cooling fan is as follows:

[0033] When the plasma etching system in step S2 determines that the temperature in the center region of the dielectric window is greater than the temperature in the edge region, the second wind speed control system controls the wind speed of the angled cooling fan to increase, and the first wind speed control system controls the wind speed of the upright cooling fan to decrease.

[0034] When the plasma etching system in step S2 determines that the temperature in the center region of the dielectric window is lower than the temperature in the edge region, the second wind speed control system controls the wind speed of the angled cooling fan to decrease, and the first wind speed control system controls the wind speed of the upright cooling fan to increase.

[0035] As a further preferred embodiment of the present invention, step 5 specifically includes:

[0036] S5-1. When the temperature uniformity of the medium window is observed to meet the process standard in step S4, the adjustment work is completed and ends.

[0037] S5-2. When it is observed in step S4 that the temperature uniformity of the medium window does not meet the process standard, the adjustment work fails, the adjustment work continues, and steps S2 to S4 are repeated until it is observed that the temperature uniformity of the medium window meets the process standard, the adjustment work is completed and ends.

[0038] As a further preferred embodiment of the present invention, the first temperature sensor and the second temperature sensor perform real-time monitoring, while the plasma etching system determines in real time whether the temperature difference between the center and edge regions of the dielectric window meets the process standards.

[0039] By employing the above technical solutions, the present invention has the following beneficial effects compared to the prior art:

[0040] 1. The present invention uses an angled cooling fan with its air outlet facing the center of the heater to concentrate the air pressure of the angled cooling fan in the center of the heater, thereby cooling the center of the heater by adjusting the speed of the angled cooling fan.

[0041] 2. The first and second temperature sensors inside the dielectric window of this invention are for real-time monitoring. As long as the plasma etching system detects that the temperature difference between the center and the edge does not meet the process SPEC standard, it will use the speed control and temperature uniformity method to achieve closed-loop control and ensure that the temperature uniformity of the dielectric window always meets the process SPEC standard during the process. Attached Figure Description

[0042] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0043] Figure 1 This is a schematic diagram showing the distribution of upright and angled cooling fans in an embodiment of the present invention;

[0044] Figure 2 This is a schematic diagram of the overall structure of the speed control and temperature uniformization device in an embodiment of the present invention;

[0045] Figure 3 This is a schematic diagram of the temperature difference between the central and edge regions of the medium window when only a positively mounted cooling fan is used in the prior art of this invention;

[0046] Figure 4 This is a schematic diagram of the temperature difference between the central region and the edge region of the medium window of the present invention;

[0047] Figure 5 This is a flowchart illustrating the specific implementation of the present invention;

[0048] Figure 6 This is a table showing the speed adjustment range of the upright and angled cooling fans of this invention.

[0049] In the diagram: 001, excitation RF coil; 002, dielectric window; 003, upright cooling fan; 004, oblique cooling fan; 005, connection part; 006, oblique cooling fan shield; 008, shield; 009, heater. Detailed Implementation

[0050] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the invention, and therefore only show the components relevant to the invention.

[0051] In the description of this invention, it should be understood that the terms "left side," "right side," "upper part," "lower part," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. "First," "second," etc., do not indicate the importance of the components, and therefore should not be construed as a limitation of this invention. The specific dimensions used in this embodiment are only for illustrating the technical solution and do not limit the scope of protection of this invention.

[0052] This application relates to an etching machine, which includes a dielectric window 002, a shielding cover 008, a heater 009, and an excitation radio frequency coil 001, wherein:

[0053] A shielding cover 008 is installed above the dielectric window 002, with the dielectric window 002 located inside the shielding cover 008. A heater 009, which is a Kapton heater, is attached to the surface of the dielectric window 002. An excitation RF coil 001 is placed above the Kapton heater. To achieve temperature control and uniformity during the heating of the dielectric window 002 by the Kapton heater, a common structural design involves placing a cooling fan on the top surface of the shielding cover 008 directly above the Kapton heater, with the fan's exhaust surface parallel to the dielectric window 002. However, this method of heat dissipation and temperature uniformity currently suffers from the problem of not being able to control the temperature uniformity between the center and edge areas of the dielectric window 002.

[0054] This invention provides an embodiment of a dielectric window speed control and temperature uniformization device for a plasma etching machine, such as... Figures 1 to 6 As shown, the temperature equalization device includes at least two upright cooling fans 003, at least two upright cooling fan shields, at least two angled cooling fans 004, and at least two angled cooling fan shields 006, wherein:

[0055] The aforementioned upright cooling fan 003 and the aforementioned oblique cooling fan 004 are evenly spaced and arranged crosswise around the vertical line of the medium window 002 on the inner top wall of the shield 008.

[0056] It should be noted that, in this invention, at least two upright cooling fans 003 and at least two angled cooling fans 004 can be installed on the inner top wall of the medium window 002. For example, two upright cooling fans 003 and two angled cooling fans 004 can be selected, or three upright cooling fans 003 and three angled cooling fans 004 can be selected. This invention does not specifically limit the number of upright cooling fans 003 and angled cooling fans 004; the actual number selected shall prevail. In addition, generally, the number of upright cooling fans 003 and the number of angled cooling fans 004 are the same.

[0057] Preferably, two upright cooling fans 003 and two inclined cooling fans 004 are arranged. The two upright cooling fans 003 form an upright fan speed group, and the two inclined cooling fans 004 form an inclined fan speed group. The fan speed of both the upright fan speed group and the inclined fan speed group is infinitely adjustable and has an independent speed control system, thereby realizing infinitely adjustable cooling air pressure in the center and edge areas of the medium window 002.

[0058] Furthermore, each mounting cooling fan 003 is fixed to the inner top wall of the shielding cover 008, and the air outlet surface of each mounting cooling fan 003 faces vertically downwards towards the heater 009. The plane containing the air outlet surface of each mounting cooling fan 003 is always parallel to the plane containing the medium window 002. Furthermore, to avoid the mounting cooling fans 003 being affected by the radio frequency of the excitation RF coil 001, a mounting cooling fan shielding cover is installed on the outside of each mounting cooling fan 003. Preferably, the top surface of each mounting cooling fan shielding cover is fixedly connected to the inner top wall of the shielding cover 008. The air outlet surface of the mounting cooling fan 003 is always parallel to the bottom surface of the mounting cooling fan shielding cover.

[0059] Each of the aforementioned angled cooling fans 004 is fixed to the inner top surface of the angled cooling fan shield 006. The air outlet of each angled cooling fan 004 faces the central area of ​​the heater 009 to concentrate cooling on the central area of ​​the heater 009. The plane containing the bottom surface of the aforementioned angled cooling fan 004 always intersects with the plane containing the medium window 002.

[0060] Furthermore, to prevent the angled cooling fan 004 from being affected by the radio frequency of the excitation RF coil 001, an angled cooling fan shield 006 is installed on the outside of each angled cooling fan 004. Preferably, the angle between the bottom surface of the angled cooling fan shield 006 and the perpendicular bisector of the medium window 002 is less than 90°. Preferably, the end of each angled cooling fan shield 006 facing the center point of the inner top wall of the shield 008 is hinged to the shield 008. The air outlet surface of the angled cooling fan 004 is always parallel to the bottom surface of the angled cooling fan shield 006, that is, the angled cooling fan 004 and the angled cooling fan shield 006 are tilted at the same angle. This design adjusts the air pressure concentration area to be more biased towards the central area of ​​the medium window 002.

[0061] Furthermore, this embodiment also includes a connecting part 005, one end of which is fixedly connected to the shielding cover 008, and the other end is connected to the other end of the inclined cooling fan shielding cover 006 that is away from the center point of the inner top wall of the shielding cover 008, thereby limiting the position between the other end of the inclined cooling fan shielding cover 006 that is away from the center point of the inner top wall of the shielding cover 008 and the shielding cover 008; that is, the connecting part 005 limits the angle between the bottom surface of the inclined cooling fan shielding cover 006 and the vertical line of the medium window 002, so that the angle of the inclined cooling fan 004 blowing towards the heater 009 is constant, but the inclined cooling fan 004 is required to always blow towards the central area of ​​the heater 009.

[0062] Preferably, the installation direction of the connecting part 005 is consistent with the extension direction of the end face of the inclined cooling fan shield 006 that is away from the center point of the inner top wall of the shield 008. Preferably, the number of inclined cooling fans 004, inclined cooling fan shield 006, and connecting parts 005 are all the same.

[0063] like Figure 3 As shown, when each cooling fan and each cooling fan shield are arranged parallel to the medium window 002, the temperature difference between the central area and the edge area of ​​the medium window 002 is large, and the temperature of the central area of ​​the medium window 002 is higher than that of the edge area.

[0064] like Figure 4 As shown, when the inclined cooling fan 004 and the inclined cooling fan shield 006 are set, that is, when the inclined cooling fan 004 and the inclined cooling fan shield 006 are set in an inclined manner relative to the medium window 002, the air pressure of the inclined cooling fan 004 is concentrated towards the central area of ​​the heater 009, thereby providing targeted cooling to the central area of ​​the heater 009 and thus improving the temperature uniformity of the medium window 002.

[0065] Since the plane of the exhaust surface of each mounting cooling fan 003 is always parallel to the plane of the medium window 002, the air pressure of the mounting cooling fan 003 is concentrated in the edge area of ​​the medium window 002. Therefore, adjusting the speed of the mounting cooling fan 003 can adjust the temperature of the edge area of ​​the medium window 002.

[0066] Since the exhaust surface of each angled cooling fan 004 faces the central area of ​​the medium window 002, the air pressure of the angled cooling fan 004 is concentrated in the central area of ​​the medium window 002. Therefore, adjusting the angled cooling fan 004 can regulate the temperature of the central area of ​​the medium window 002.

[0067] Furthermore, this embodiment also includes a first temperature sensor and a second temperature sensor. The first temperature sensor is installed in the central area of ​​the medium window 002 to sense the temperature of the central area of ​​the medium window 002 in real time; the second temperature sensor is installed in the edge area of ​​the medium window 002 to sense the temperature of the edge area of ​​the medium window 002 in real time.

[0068] Furthermore, this embodiment also includes a first wind speed control system and a second wind speed control system. Each upright cooling fan 003 is connected to the first wind speed control system, and the first wind speed control system independently controls the wind speed of each upright cooling fan 003. Each angled cooling fan 004 is connected to the second wind speed control system, and the second wind speed control system independently controls the wind speed of each angled cooling fan 004.

[0069] Furthermore, this embodiment also provides a method for controlling the speed and temperature of the dielectric window in a plasma etching machine. In this embodiment, the method involves a plasma etching system, which is connected to a first temperature sensor, a second temperature sensor, a first wind speed control system, and a second wind speed control system. The above-mentioned method includes the following steps:

[0070] Step S1: Determine whether the temperature difference between the center and edge regions of the medium window 002 meets the process SPEC standard.

[0071] S1-1. The temperature of the central region of the dielectric window 002 is read by the first temperature sensor and transmitted to the plasma etching system; the temperature of the edge region of the dielectric window 002 is read by the second temperature sensor and transmitted to the plasma etching system.

[0072] S1-2. The plasma etching system calculates the temperature difference between the center and edge regions of the dielectric window 002 based on the data received in step S1-1.

[0073] S1-3. The plasma etching system determines whether the temperature difference obtained in step S1-2 meets the process SPEC standard. If the determination meets the standard, the plasma etching system does not respond. If the determination does not meet the standard, proceed to step S2.

[0074] The first and second temperature sensors perform real-time monitoring, while the plasma etching system determines in real-time whether the temperature difference between the center and edge regions of the dielectric window 002 meets the process SPEC standard.

[0075] Step S2: The plasma etching system determines whether the temperature of the central region is greater than the temperature of the edge region based on the data received in step S1-1.

[0076] Step S3: Adjust the airflow speed of the upright cooling fan 003 using the first airflow control system, and adjust the airflow speed of the angled cooling fan 004 using the second airflow control system. The specific adjustment method is as follows:

[0077] When the plasma etching system determines in step S2 that the temperature of the central region of the dielectric window 002 is greater than the temperature of the edge region, the second wind speed control system controls the wind speed of the inclined cooling fan 004 to increase, and the first wind speed control system controls the wind speed of the upright cooling fan 003 to decrease.

[0078] When the plasma etching system determines in step S2 that the temperature of the central region of the dielectric window 002 is lower than the temperature of the edge region, the second wind speed control system controls the wind speed of the inclined cooling fan 004 to decrease, and the first wind speed control system controls the wind speed of the upright cooling fan 003 to increase.

[0079] like Figure 6As shown, when the temperature in the central region of the medium window 002 is 20°C higher than the temperature in the edge region, preferably, the speed of the angled cooling fan 004 is 25,000-30,000 rpm, and the speed of the upright cooling fan 003 is 5,000-10,000 rpm; when the temperature in the central region of the medium window 002 is 10°C higher than the temperature in the edge region, preferably, the speed of the angled cooling fan 004 is 20,000-25,000 rpm, and the speed of the upright cooling fan 003 is 10,000-15,000 rpm; when the temperature in the central region of the medium window 002 is 5°C higher than the temperature in the edge region, preferably, the speed of the angled cooling fan 004 is 15,000-20,000 rpm, and the speed of the upright cooling fan 003 is 15,000-20,000 rpm. When the temperature in the central area of ​​the medium window 002 is 5°C lower than the temperature in the edge area, preferably, the speed of the angled cooling fan 004 is 10000-15000 rpm, and the speed of the upright cooling fan 003 is 20000-25000 rpm; when the temperature in the central area of ​​the medium window 002 is 10°C lower than the temperature in the edge area, preferably, the speed of the angled cooling fan 004 is 5000-10000 rpm, and the speed of the upright cooling fan 003 is 25000-30000 rpm.

[0080] Step S4: Observe the temperature uniformity of medium window 002.

[0081] The observation of temperature uniformity of dielectric window 002 is mainly based on the temperature of the central region of dielectric window 002 read by the first temperature sensor in step S1-1 and the temperature of the edge region of dielectric window 002 read by the second temperature sensor, generating a temperature distribution curve diagram in the plasma etching system. The degree of curvature of the curve in the temperature distribution curve diagram is observed to determine the uniformity. When the curve is almost a straight line, it indicates that the temperature difference between the central and edge regions of dielectric window 002 is small and nearly uniform; when the curve is significantly curved, it indicates a large temperature difference between the central and edge regions of dielectric window 002.

[0082] Step S5: Determine whether the adjustment is complete.

[0083] S5-1. When the temperature uniformity of medium window 002 is observed to meet the process SPEC standard in step S4, that is, when the curve in the temperature distribution curve diagram is infinitely close to a straight line, it indicates that the adjustment work is completed and ended.

[0084] S5-2. When it is observed in step S4 that the temperature uniformity of medium window 002 does not meet the process SPEC standard, that is, the curve in the temperature distribution curve diagram is significantly curved, it indicates that the adjustment work has failed. The adjustment work continues, and steps S2 to S4 are repeated until the temperature uniformity of medium window 002 meets the process SPEC. The adjustment work is then completed and ends.

[0085] This implementation scheme uses angled cooling fans 004 with their exhaust surfaces facing the center of the heater 009 to concentrate the air pressure of the angled cooling fans 004 in the center of the heater 009, thereby achieving concentrated cooling of the central area of ​​the medium window 002. At the same time, two angled cooling fans 004 are axially symmetrically distributed on the top wall inside the shield 008, and two upright cooling fans 003 are axially symmetrically distributed on the top wall inside the shield 008. The angled cooling fans 004 and the upright cooling fans 003 are arranged alternately around the vertical line of the medium window 002. Thus, by independently adjusting the speed of the upright cooling fans 003 and the angled cooling fans 004, uniform temperature treatment can be achieved in the central and edge areas of the medium window 002.

[0086] In this implementation scheme, the first and second temperature sensors within the dielectric window 002 are used for real-time monitoring. As long as the plasma etching system detects that the temperature difference between the center and the edge does not meet the process specifications, it will perform the above-mentioned speed control and temperature uniformity method. This achieves closed-loop control and ensures that the temperature uniformity of the dielectric window 002 always meets the process specifications during the process.

[0087] Those skilled in the art will understand that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless defined as herein.

[0088] In this application, "and / or" means either the individual existence of each element or the simultaneous existence of both elements.

[0089] In this application, "connection" can mean either a direct connection between components or an indirect connection between components through other components.

[0090] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A dielectric window speed control and temperature uniformization device for a plasma etching machine, comprising a dielectric window (002), a heater (009) disposed above the dielectric window (002), and a shielding cover (008) covering the top of the dielectric window (002), characterized in that: The temperature equalization device includes at least two upright cooling fans (003), at least two upright cooling fan shields, at least two angled cooling fans (004), and at least two angled cooling fan shields (006), wherein: The upright cooling fan (003) and the oblique cooling fan (004) are evenly spaced and cross each other on the inner top wall of the shielding cover (008) around the vertical line of the medium window (002); Each of the upright cooling fans (003) is fixed to the top wall inside the shield (008), and the air outlet of each of the upright cooling fans (003) is vertically downward facing the heater (009); The plane containing the exhaust surface of each of the aforementioned standard cooling fans (003) is always parallel to the plane containing the medium window (002); The mounting fan shield is provided on the outside of the mounting fan (003), and the top surface of each mounting fan shield is connected to the inner top wall of the shield (008); Each of the inclined cooling fans (004) is fixed to the top surface inside the inclined cooling fan shield (006), and the air outlet of each of the inclined cooling fans (004) faces the central area of ​​the heater (009); The plane containing the bottom surface of each of the angled cooling fans (004) always intersects with the plane containing the medium window (002); The inclined cooling fan shield (006) is installed outside the inclined cooling fan (004), and one end of each inclined cooling fan shield (006) facing the center point of the inner top wall of the shield (008) is hinged to the shield (008). The angle between the bottom surface of each of the angled cooling fan shields (006) and the vertical line of the medium window (002) is less than 90°; the wind speeds of the upright cooling fan (003) and the angled cooling fan (004) are controlled independently.

2. The dielectric window speed control and temperature uniformization device for a plasma etching machine according to claim 1, characterized in that: It also includes a connecting part (005), one end of which is fixedly connected to the shielding cover (008), and the other end is connected to the other end of the inclined cooling fan shielding cover (006) away from the center point of the inner top wall of the shielding cover (008).

3. The dielectric window speed control and temperature uniformization device and method for a plasma etching machine according to claim 1, characterized in that: The air outlet surface of the upright cooling fan (003) is always parallel to the bottom surface of the upright cooling fan shield; the air outlet surface of the inclined cooling fan (004) is always parallel to the bottom surface of the inclined cooling fan shield (006).

4. The dielectric window speed control and temperature uniformization device for a plasma etching machine according to claim 1, characterized in that: It also includes a first temperature sensor and a second temperature sensor, wherein the first temperature sensor is installed in the central area of ​​the medium window (002); and the second temperature sensor is installed in the edge area of ​​the medium window (002).

5. The dielectric window speed control and temperature uniformization device for a plasma etching machine according to claim 1, characterized in that: It also includes a first wind speed control system and a second wind speed control system, wherein: Each of the above-mentioned upright cooling fans (003) is connected to the first wind speed control system, and the first wind speed control system independently controls the wind speed of each of the above-mentioned upright cooling fans (003); Each of the angled cooling fans (004) is connected to the second wind speed control system, which independently controls the wind speed of each of the angled cooling fans (004).

6. A method for controlling the speed and temperature of a plasma etching machine via a dielectric window, characterized in that, The speed control and temperature uniformization method utilizes the dielectric window speed control and temperature uniformization device of the plasma etching machine according to any one of claims 1-5 to perform speed control and temperature uniformization operations, and the speed control and temperature uniformization method includes the following steps: Step S1: Determine whether the temperature difference between the center and edge regions of the dielectric window (002) meets the process standard. If the determination meets the standard, the plasma etching system does not respond. If the determination does not meet the standard, proceed to the following step S2. Step S2: The plasma etching system determines, based on the data read in step S1-1, whether the temperature of the central region of the dielectric window (002) is greater than the temperature of the edge region of the dielectric window (002); Step S3: The temperature equalization device includes a first wind speed control system and a second wind speed control system. The first wind speed control system is used to adjust the wind speed of the upright cooling fan (003), and the second wind speed control system is used to adjust the wind speed of the inclined cooling fan (004). Step S4: Observe the temperature uniformity on the medium window (002); Step S5: Determine whether the adjustment process is complete based on the observation results from step S4 above.

7. The method for controlling the speed and temperature of a plasma etching machine via a dielectric window according to claim 6, characterized in that: Step S1 specifically includes the following steps: S1-1. The temperature uniform device includes a first temperature sensor and a second temperature sensor. The temperature of the central region of the medium window (002) is read by the first temperature sensor, and the temperature of the edge region of the medium window (002) is read by the second temperature sensor. S1-2, The plasma etching system calculates the temperature difference between the center and edge regions of the dielectric window (002) based on the data received in step S1-1; S1-3. The plasma etching system determines whether the temperature difference obtained in step S1-2 meets the process standards.

8. The method for controlling the speed and temperature of a plasma etching machine via a dielectric window according to claim 6, characterized in that: In step S3, the adjustment methods for the upright cooling fan and the angled cooling fan are as follows: When the plasma etching system in step S2 determines that the temperature of the central region of the dielectric window (002) is greater than the temperature of the edge region, the second wind speed control system controls the wind speed of the inclined cooling fan (004) to increase, and the first wind speed control system controls the wind speed of the upright cooling fan (003) to decrease. When the plasma etching system in step S2 determines that the temperature of the central region of the dielectric window (002) is lower than the temperature of the edge region, the second wind speed control system controls the wind speed of the inclined cooling fan (004) to decrease, and the first wind speed control system controls the wind speed of the upright cooling fan (003) to increase.

9. The method for controlling the speed and temperature of a plasma etching machine via a dielectric window according to claim 6, characterized in that: Step S5 specifically includes: S5-1. When the temperature uniformity of the medium window (002) meets the process standard as observed in step S4, the adjustment work is completed and ends. S5-2. When it is observed in step S4 that the temperature uniformity of the medium window (002) does not meet the process standard, the adjustment work fails, the adjustment work continues, and steps S2 to S4 are repeated until it is observed that the temperature uniformity of the medium window (002) meets the process standard, the adjustment work is completed and ends.

10. A method for controlling the speed and temperature of a plasma etching machine via a dielectric window according to claim 7, characterized in that: The first temperature sensor and the second temperature sensor perform real-time monitoring, while the plasma etching system determines in real time whether the temperature difference between the center and edge regions of the dielectric window (002) meets the process standards.

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