Circuit board and copper activation treatment method thereof

Abstract

This application provides a circuit board and a method for activating copper plating therein. The method includes pre-immersing a micro-etched water-washed substrate to obtain a board to be activated; activating the board to be activated to obtain a board to be re-immersed; re-immersing the board to be re-immersed to obtain a board to be copper plating; and performing copper plating on the board to be copper plating to obtain the circuit board. After activation, the surface of the board to be activated has an activating agent for copper foil adhesion. Before copper plating, the activated board to be re-immersed is re-immersed, i.e., pre-immersed again, so that the excess activating agent on the board to be re-immersed does not enter subsequent processes. This allows the excess activating agent on the board to be re-immersed to be collected and recovered, reducing waste of activating agent and effectively reducing the production cost of the circuit board.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and in particular to a circuit board and a method for copper plating activation treatment thereof. Background Technology

[0002] Chemical plating through holes (COP) aims to plate a copper layer onto the walls and surfaces of holes made of insulating substrates (including resin and fiberglass) to achieve conductivity between layers in double-sided and multilayer boards and to enable the soldering of components. The traditional COP process steps are as follows: loading - fluffing - water washing - adhesive removal - water washing - pre-neutralization - neutralization - water washing - cleaning / hole finishing - micro-etching - water washing - pre-immersion - activation - water washing - acceleration / reduction - water washing - copper plating - water washing - unloading.

[0003] However, in the traditional chemical plating process for metallizing through-holes, after surface treatment and charge adjustment, the product enters the pre-dip and activation treatment, and then enters the water washing tank, as well as the subsequent accelerated reduction and plating treatment. During the operation, a large amount of activator in the activation tank is carried out to the subsequent water washing tank, causing excess activator on the board surface to be adsorbed in other tanks, which easily leads to waste of raw materials and thus increases production costs. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a circuit board and its copper plating activation treatment method that effectively reduces production costs.

[0005] The objective of this invention is achieved through the following technical solution:

[0006] A method for activating copper plating on a circuit board, the method comprising:

[0007] The micro-etched water-washed substrate is pre-immersed to obtain the board to be activated;

[0008] The plate to be activated is subjected to an activation treatment to obtain a plate to be re-impregnated;

[0009] The plate to be re-immersed is subjected to a re-immersion process to obtain a copper plate to be deposited;

[0010] The copper plating board to be plated is subjected to copper plating treatment to obtain a circuit board.

[0011] In one embodiment, the pre-immersion treatment of the micro-etched water-washed substrate includes: placing the micro-etched water-washed substrate in a pre-immersion cleaning tank for a pre-immersion.

[0012] In one embodiment, the re-immersion process of the plate to be re-immersed includes: returning the plate to be re-immersed to the pre-immersion cleaning tank for a second pre-immersion.

[0013] In one embodiment, the pre-immersion treatment of the micro-etched water-washed substrate is further included before surface treatment of the micro-etched water-washed substrate.

[0014] In one embodiment, the surface treatment of the micro-etched water-washed substrate includes: performing a surface resin polishing treatment on the micro-etched water-washed substrate to remove surface residues; and performing a surface charge adjustment treatment on the micro-etched water-washed substrate to attach agglomerated charges to the surface and hole walls of the micro-etched water-washed substrate.

[0015] In one embodiment, the surface charge adjustment treatment of the micro-etched water-washed substrate to make the surface and hole walls of the micro-etched water-washed substrate have agglomerated charges includes: performing a negative surface treatment on the micro-etched water-washed substrate to make the surface and hole walls of the micro-etched water-washed substrate have negative agglomerated charges.

[0016] In one embodiment, the activation process of the plate to be activated includes: placing the plate to be activated in an activation tank to perform an activation nucleation reaction.

[0017] In one embodiment, placing the plate to be activated in an activation tank for activation nucleation reaction includes: performing a hydrolysis reaction on the plate to be activated to obtain a plate to be re-immersed with activated nuclei, wherein the activated nuclei are attached to the surface of the plate to be re-immersed and the walls of the holes.

[0018] In one embodiment, the copper plating process for the copper plate to be plating includes: placing the copper plate to be plating in a copper plating tank to carry out a catalytic copper plating reaction, so that copper foil is attached to the region corresponding to the activation core.

[0019] A circuit board is prepared using the circuit board copper plating activation treatment method described in any of the above embodiments.

[0020] Compared with the prior art, the present invention has at least the following advantages:

[0021] After the activation process, the surface of the board to be activated is covered with an activator for attaching copper foil. Before copper plating, the activated board to be re-immersed is re-immersed, which means that the board to be re-immersed is pre-immersed again. This prevents the excess activator on the board to be re-immersed from entering subsequent processes, thus allowing the excess activator on the board to be re-immersed to be collected and recycled, reducing the waste of activator and effectively reducing the production cost of the circuit board. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a flowchart of a circuit board copper plating activation treatment method in one embodiment. Detailed Implementation

[0024] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0027] This invention relates to a method for activating copper plating on circuit boards. In one embodiment, the method includes pre-immersing a micro-etched, water-washed substrate to obtain a board to be activated; activating the board to obtain a board to be re-immersed; re-immersing the board to obtain a board to be copper-plated; and performing copper plating on the board to obtain the circuit board. After activation, the surface of the board to be activated has an activating agent for copper foil adhesion. Before copper plating, the activated board to be re-immersed is re-immersed, i.e., pre-immersed again, so that excess activating agent on the board to be re-immersed does not enter subsequent processes. This allows excess activating agent on the board to be re-immersed to be collected and recovered, reducing waste and effectively lowering the production cost of the circuit board.

[0028] Please see Figure 1 This is a flowchart of a circuit board copper plating activation treatment method according to an embodiment of the present invention. The circuit board copper plating activation treatment method includes some or all of the following steps.

[0029] S100: The micro-etched water-washed substrate is pre-immersed to obtain the board to be activated.

[0030] In this embodiment, the micro-etched and water-washed substrate is a substrate that has undergone micro-etching and water washing. Specifically, after surface micro-etching, the substrate undergoes a surface water washing operation to form the desired copper plating pattern on the surface of the micro-etched and water-washed substrate, and to remove impurities remaining on the surface during the micro-etching process. This results in a clean surface for subsequent copper plating. The pre-immersion treatment is a pre-dip treatment of the micro-etched and water-washed substrate to clean and recover surface impurities, making the surface of the micro-etched and water-washed substrate even cleaner and facilitating the subsequent generation and adhesion of the activator.

[0031] S200: The plate to be activated is activated to obtain the plate to be re-immersed.

[0032] In this embodiment, the board to be activated is obtained after the micro-etched and washed substrate undergoes the pre-dip treatment. Specifically, the micro-etched and washed substrate is a substrate that has undergone micro-etching and washing treatments. After surface micro-etching, the substrate undergoes a surface washing operation to form the required copper plating pattern on the surface of the micro-etched and washed substrate, and to remove impurities remaining on the surface during the micro-etching process, thereby making the surface of the micro-etched and washed substrate clean and facilitating subsequent copper plating. The pre-dip treatment is a pre-dip treatment of the micro-etched and washed substrate to clean and recover surface impurities, making the surface of the micro-etched and washed substrate cleaner. After obtaining the board to be activated, the board is activated by forming the required activating agent on the board to facilitate the formation of the activating agent in the corresponding area. The activating agent is used for subsequent copper plating, that is, copper foil is formed in the area corresponding to the activating agent.

[0033] S300: Perform a re-immersion treatment on the plate to be re-immersed to obtain a copper plate to be immersed.

[0034] In this embodiment, the plate to be re-immersed is obtained by activating the plate to be activated, and the plate to be activated is obtained by pre-immersing the micro-etched and washed substrate. The micro-etched and washed substrate is a substrate that has undergone micro-etching and washing treatments. Specifically, after surface micro-etching, the substrate undergoes surface washing to form the desired copper plating pattern on its surface and remove impurities remaining on the surface during the micro-etching process, thus making the surface of the micro-etched and washed substrate clean and facilitating subsequent copper plating. The pre-immersion treatment is a pre-dip treatment of the micro-etched and washed substrate to clean and recover surface impurities, making the surface of the micro-etched and washed substrate cleaner. After obtaining the plate to be activated, the plate to be activated is activated to form the required activator on the plate to facilitate the formation of the activator in the corresponding areas. Thus, after obtaining the plate to be re-immersed, the plate to be re-immersed has the activator attached, that is, the activator is attached in the designated areas. At this point, there is a significant amount of activator on the board to be re-immersed. The board is then pre-immersed again, meaning it is placed back into the pre-immersion cleaning tank. This facilitates the recovery of excess activator into the pre-immersion cleaning tank, preventing it from entering the subsequent water washing tank and thus avoiding waste. Furthermore, the activator collected in the pre-immersion cleaning tank can be used to replenish the activator for the next circuit board. That is, after the pre-immersion treatment, the next board to be activated is pre-adhered with activator, improving the adsorption density of the activator on the board to be re-immersed and effectively enhancing the activator adhesion effect.

[0035] S400: Perform copper plating on the copper plate to be plating to obtain a circuit board.

[0036] In this embodiment, the copper plating board to be deposited is obtained after a re-immersion treatment. The re-immersion board is obtained after the activation treatment of the activation board. The activation board is obtained after the micro-etched and water-washed substrate undergoes a pre-immersion treatment. The micro-etched and water-washed substrate is a substrate that has undergone micro-etching and water washing treatments. Specifically, after surface micro-etching, the substrate undergoes a surface water washing operation to form the copper plating pattern required for subsequent deposits on the surface of the micro-etched and water-washed substrate, and to remove impurities remaining on the surface during the micro-etching process, thereby making the surface of the micro-etched and water-washed substrate clean and facilitating subsequent copper plating. The pre-immersion treatment is a pre-dip treatment of the micro-etched and water-washed substrate to clean and recover surface impurities, making the surface of the micro-etched and water-washed substrate cleaner. After obtaining the activation board, the activation treatment is performed on the activation board to form the required activator, so that the activator can be formed in the corresponding area. After obtaining the re-immersion board, the activator is attached to the re-immersion board, that is, the activator is attached to the designated area. At this point, there is a significant amount of activator on the plate to be re-immersed. The plate is then re-pre-immersed, meaning it is placed back into the pre-immersion cleaning tank. This facilitates the recovery of excess activator into the pre-immersion cleaning tank, preventing it from entering the subsequent water washing tank and thus avoiding waste. In this way, after obtaining the copper foil plate with the activator attached, the activator acts as an adhesion point for copper ions, facilitating the formation of the required copper layer in the activator area. This not only avoids activator waste but also effectively improves the accuracy of copper foil adhesion.

[0037] In the above embodiments, after the board to be activated is activated, an activator for attaching copper foil is formed on its surface. Before copper plating, the activated board to be re-immersed is re-immersed, that is, the board to be re-immersed is pre-immersed again, so that the excess activator on the board to be re-immersed will not enter the subsequent process. This allows the excess activator on the board to be re-immersed to be collected and recycled, reducing the waste of activator and effectively reducing the production cost of the circuit board.

[0038] In one embodiment, the pre-immersion treatment of the micro-etched and water-washed substrate includes: placing the micro-etched and water-washed substrate in a pre-immersion cleaning tank for a preliminary immersion. In this embodiment, the micro-etched and water-washed substrate is a substrate that has undergone micro-etching and water washing treatments. Specifically, after the substrate undergoes surface micro-etching, a surface water washing operation is performed to form the copper plating pattern required for subsequent plating on the surface of the micro-etched and water-washed substrate, and to remove impurities remaining on the surface during the micro-etching process, thereby making the surface of the micro-etched and water-washed substrate clean and facilitating subsequent copper plating. The pre-immersion treatment is a preliminary immersion of the micro-etched and water-washed substrate to clean and recover surface impurities, making the surface of the micro-etched and water-washed substrate cleaner and facilitating the subsequent generation and adhesion of activators. The pre-immersion treatment of the micro-etched water-washed substrate is the initial pre-immersion of the micro-etched water-washed substrate. Before this, other circuit boards have also undergone re-immersion, so that the pre-immersion cleaning tank is rich in activator, which facilitates the pre-attachment of activator to the current micro-etched water-washed substrate, thereby improving the adsorption density of the final activator.

[0039] Further, the re-immersion treatment of the plate to be re-immersed includes: returning the plate to be re-immersed to the pre-immersion cleaning tank for a second pre-immersion. In this embodiment, the plate to be re-immersed is obtained after the activation treatment of the plate to be activated, and the plate to be activated is obtained after the pre-immersion treatment of the micro-etched and water-washed substrate. The micro-etched and water-washed substrate is a substrate after micro-etching and water washing. Specifically, after the substrate undergoes surface micro-etching, it is then surface-washed to form the copper plating pattern required for subsequent plating on the surface of the micro-etched and water-washed substrate, and to remove impurities remaining on the surface during the micro-etching process, thereby making the surface of the micro-etched and water-washed substrate clean and facilitating subsequent copper plating. The pre-immersion treatment is a pre-immersion of the micro-etched and water-washed substrate to clean and recover surface impurities, making the surface of the micro-etched and water-washed substrate cleaner. After obtaining the plate to be activated, the plate to be activated is activated to form the required activator on the plate to be activated, so as to facilitate the formation of the activator in the corresponding areas. Thus, after obtaining the board to be re-immersed, it is coated with activator, specifically in a designated area. At this point, there is a significant amount of activator on the board. The board is then re-pre-immersed, meaning it is placed back into the pre-immersion cleaning tank. This facilitates the recovery of excess activator into the pre-immersion cleaning tank, preventing it from entering the subsequent water washing tank and thus avoiding waste. Furthermore, the activator collected in the pre-immersion cleaning tank can be used to replenish the activator for the next circuit board. After the pre-immersion treatment, the next board to be activated is pre-coated with activator to improve the adsorption density of the activator on the board to be re-immersed, effectively enhancing the activator adhesion. Specifically, the board to be re-immersed is returned to the pre-immersion cleaning tank for a second pre-immersion operation, allowing excess activator to be recovered into the pre-immersion cleaning tank. This not only recovers excess activator but also provides activator for the subsequent fabrication of other circuit boards.

[0040] In one embodiment, the pre-immersion treatment of the micro-etched and water-washed substrate further includes a surface treatment of the micro-etched and water-washed substrate. In this embodiment, the micro-etched and water-washed substrate is a substrate that has undergone micro-etching and water washing. Specifically, after surface micro-etching, the substrate undergoes a surface water washing operation to form the desired copper plating pattern on the surface of the micro-etched and water-washed substrate and remove impurities remaining on the surface during the micro-etching process, thereby making the surface of the micro-etched and water-washed substrate clean and facilitating subsequent copper plating. The pre-immersion treatment is a pre-dip treatment of the micro-etched and water-washed substrate to clean and recover surface impurities, making the surface of the micro-etched and water-washed substrate cleaner and facilitating the subsequent generation and adhesion of the activator. Before the pre-immersion treatment of the micro-etched and water-washed substrate, a corresponding surface treatment is required to facilitate the stable adsorption of the activator onto the board.

[0041] Specifically, the surface treatment of the micro-etched and water-washed substrate includes: performing surface resin polishing on the micro-etched and water-washed substrate to remove surface residues; and performing surface charge adjustment on the micro-etched and water-washed substrate to attach aggregated charges to the substrate surface and hole walls. First, surface resin polishing of the micro-etched and water-washed substrate facilitates the removal of residual impurities, such as residual etching inhibitors or dry film molecules generated during the micro-etching process, and excess chemicals from the water-washing process, thereby reducing surface foreign matter on the substrate. Then, charge adjustment is performed on the micro-etched and water-washed substrate so that a specific charge is attached to designated areas, for example, aggregated charges for adsorbing activators are attached to the hole walls of the substrate. In another embodiment, the activator is activated palladium, and the aggregated charges are used to adsorb palladium micelles, for example, the palladium micelles are Sn5PdCl. 10 .

[0042] Furthermore, the surface charge adjustment treatment of the micro-etched and washed substrate to imbue the surface and hole walls with clustered charges includes: applying a negative charge to the surface of the micro-etched and washed substrate to imbue the surface and hole walls with negative clustered charges. In this embodiment, the clustered charges are used to adsorb palladium micelles. After the negative charge application treatment, the surface and hole walls of the micro-etched and washed substrate are imbued with negative charges, facilitating the adsorption of palladium micelles.

[0043] In one embodiment, the activation treatment of the board to be activated includes: placing the board to be activated in an activation tank to perform an activation nucleation reaction. In this embodiment, the board to be activated is obtained after the pre-immersion treatment of the micro-etched and washed substrate. The micro-etched and washed substrate is a substrate that has undergone micro-etching and washing treatments. For example, after the substrate undergoes surface micro-etching, it is then washed to form the copper plating pattern required for subsequent plating on the surface of the micro-etched and washed substrate, and to remove impurities remaining on the surface during the micro-etching process, thereby making the surface of the micro-etched and washed substrate clean and facilitating subsequent copper plating. The pre-immersion treatment is a pre-dip treatment of the micro-etched and washed substrate to clean and recover surface impurities, making the surface of the micro-etched and washed substrate cleaner. The board to be activated is placed in the activation tank for activation treatment, so that the surface and hole walls of the board to be activated are coated with an activating agent. Specifically, placing the plate to be activated in an activation tank for activation nucleation reaction includes: hydrolyzing the plate to be activated to obtain a plate to be re-immersed with activated nuclei, wherein the activated nuclei are attached to the surface and hole walls of the plate to be re-immersed. The hydrolysis reaction involves hydrolyzing palladium micelles on the plate to be activated, causing the palladium nuclei formed after the reaction to deposit on the surface and hole walls of the plate to be re-immersed, forming the activated palladium required for the subsequent copper plating process. This facilitates the formation of a copper layer by copper ions under the catalytic action of the activated palladium, thereby facilitating the subsequent copper plating operation.

[0044] Furthermore, the copper plating process for the copper plating board includes: placing the copper plating board in a copper plating tank to perform a catalytic copper plating reaction, so that copper foil is attached to the region corresponding to the activation core. In this embodiment, the copper plating board is obtained after a re-immersion process, the re-immersion board is obtained after the activation process of the activation board, and the activation board is obtained after the pre-immersion process of the micro-etched and water-washed substrate. The micro-etched and water-washed substrate is a substrate after micro-etching and water washing. Specifically, after surface micro-etching, the substrate undergoes surface water washing to form the desired copper plating pattern on the surface of the micro-etched and water-washed substrate, and to remove impurities remaining on the surface during the micro-etching process, thereby making the surface of the micro-etched and water-washed substrate clean and facilitating subsequent copper plating. The pre-immersion process is a pre-immersion of the micro-etched and water-washed substrate to clean and recover surface impurities, making the surface of the micro-etched and water-washed substrate cleaner. After obtaining the plate to be activated, it undergoes an activation treatment to form the required activated palladium in the corresponding areas. After obtaining the plate to be re-immersed, activated palladium is attached to it, i.e., it is attached to designated areas. Since there is a significant amount of activated palladium on the plate, it is re-pre-immersed by placing it back into the pre-immersion cleaning tank. This facilitates the recovery of excess activated palladium into the pre-immersion cleaning tank, preventing it from entering the subsequent water washing tank and thus avoiding waste. In this way, after obtaining the copper plating plate with activated palladium attached, copper ions produce a copper layer under the catalysis of the activated palladium. This copper layer is easily attached to the designated surfaces and hole walls of the copper plating plate. For example, if the copper plating tank contains HCHO and NaOH, copper ions will rapidly deposit at the location of the activated palladium under its catalysis.

[0045] Understandably, both pre-immersion and back-immersion treatments are performed in the pre-immersion cleaning tank, which is reused for the fabrication of multiple circuit boards. This means that after one circuit board is fabricated, activated palladium is recovered from the pre-immersion cleaning tank, which can be used for the attachment of activated palladium to the next circuit board, facilitating the pre-attachment of some activated palladium to designated surfaces and hole walls. However, as the number of circuit boards fabricated increases, the concentration of activated palladium in the pre-immersion cleaning tank rises, meaning the solubility of activated palladium in the liquid within the pre-immersion cleaning tank approaches saturation. This leads to a decrease in the dissolution efficiency of activated palladium in the pre-immersion cleaning tank. Furthermore, the pre-immersion and back-immersion times are already short, resulting in a significant amount of activated palladium remaining on the board, making effective recovery impossible.

[0046] To improve the recovery efficiency of the activator, i.e. the recovery rate of activated palladium, the process of re-leaching the plate to be re-leached to obtain the copper plate to be deposited includes the following steps:

[0047] Obtain the activation concentration in the pre-prep cleaning tank;

[0048] The activation concentration is mixed with a preset concentration to obtain the activation-dissolution difference component.

[0049] The vibration start / stop signal is sent to the circuit board monitoring device according to the activation and immersion differential component to adjust the ultrasonic vibration state of the ultrasonic vibrator.

[0050] In this embodiment, the activation concentration is the concentration of the activator in the pre-immersion cleaning tank, that is, the percentage of the activator recovered in the pre-immersion cleaning tank. The activation concentration is used to reflect the current content of the recovered activator. The preset concentration is the standard activator concentration, that is, the critical concentration at which the activator in the pre-immersion cleaning tank can continue to dissolve, or the reference dissolution concentration of the activator in the pre-immersion cleaning tank. For example, the preset concentration is 3 / 5 to 5 / 6 of the maximum dissolution concentration of the activator in the pre-immersion cleaning tank. The immersion concentration and preset concentration are used for concentration treatment to determine the difference between the current concentration of the activator in the pre-immersion cleaning tank and the standard activator concentration, thereby determining whether the concentration of the activator in the pre-immersion cleaning tank has reached the reference dissolution concentration. The activation-dissolution difference is used as the difference between the current concentration of the activator in the pre-immersion cleaning tank and the standard activator concentration to determine whether the activator in the pre-immersion cleaning tank is about to be saturated. This facilitates the vibration control of the ultrasonic vibrator by the circuit board monitoring device, thereby facilitating the recovery of the activator through the ultrasonic vibration of the ultrasonic vibrator.

[0051] Furthermore, a vibration start / stop signal is sent to the circuit board monitoring device based on the activation and immersion differential component to adjust the ultrasonic vibration state of the ultrasonic vibrator, specifically including the following steps:

[0052] Detect whether the activation-dissolution difference is greater than 0;

[0053] When the activation impregnation difference is greater than 0, an ultrasonic vibration start signal is sent to the circuit board monitoring device to start the ultrasonic vibrator and perform ultrasonic vibration on the plate to be re-impregnated.

[0054] In this embodiment, the activation-dissolution difference is greater than 0, indicating that the current concentration of the activator in the pre-immersion cleaning tank is greater than the standard activator concentration, which means that the current concentration of the activator in the pre-immersion cleaning tank exceeds the standard and is about to reach saturation. At this time, the dissolution rate of the activator in the pre-immersion cleaning tank will decrease significantly. By sending an ultrasonic vibration start signal to the circuit board monitoring device, the ultrasonic vibrator in the circuit board monitoring device is started, so that the ultrasonic vibrator can perform ultrasonic vibration on the plate to be re-immersed, dispersing the activator with weak adhesion on the plate to be re-immersed, thereby facilitating the recovery of more excess activator.

[0055] In another embodiment, when the activation impregnation difference is less than 0, an ultrasonic shutdown signal is sent to the circuit board monitoring device to shut down the ultrasonic vibrator.

[0056] Furthermore, when the activation impregnation difference component is greater than 0, an ultrasonic vibration start signal is sent to the circuit board monitoring device to start the ultrasonic vibrator and perform ultrasonic vibration on the plate to be re-impregnated. This specifically includes the following steps:

[0057] When the activation immersion-dissolution difference is greater than 0, the temperature of the bath solution in the pre-immersion cleaning tank is obtained;

[0058] Detect whether the temperature of the bath solution is lower than the preset temperature;

[0059] When the temperature of the bath solution is lower than the preset temperature, a heating signal is sent to the circuit board monitoring device to activate the heater in the circuit board monitoring device and heat the pre-soak cleaning tank.

[0060] In this embodiment, a difference in activation and dissolution factors greater than 0 indicates that the current concentration of the activator in the pre-impregnation cleaning tank is greater than the standard activator concentration, meaning the current concentration of the activator in the pre-impregnation cleaning tank exceeds the standard, and the concentration of the activator in the pre-impregnation cleaning tank is approaching saturation. At this point, the dissolution rate of the activator in the pre-impregnation cleaning tank will decrease significantly. Before ultrasonically vibrating the plate to be re-impregnated, the liquid temperature in the pre-impregnation cleaning tank is detected to ensure that the liquid temperature in the pre-impregnation cleaning tank reaches a temperature that accelerates the dissolution of the activator. A tank liquid temperature lower than the preset liquid temperature indicates that the liquid temperature in the pre-impregnation cleaning tank is lower than the standard tank liquid temperature, meaning the liquid temperature in the pre-impregnation cleaning tank is too low, and therefore unfavorable for the dissolution and recovery of the activator. In this way, a heating signal is sent to the circuit board monitoring device so that the circuit board monitoring device controls the heater to start, thereby turning on the heater to heat up, which in turn raises the temperature of the liquid in the pre-soak cleaning tank, which facilitates the dissolution rate of the activator in the solution in the pre-soak cleaning tank and further improves the recovery efficiency of the activator.

[0061] In each of the above embodiments, there is a corresponding circuit board manufacturing module, such as a tank for processing each board, a pre-immersion cleaning tank for pre-immersion treatment of micro-etched water-washed substrate, an activation tank for activation treatment of the board to be activated, and a copper plating tank for copper plating treatment of the board to be copper plating.

[0062] In one embodiment, this application also provides a circuit board prepared using the circuit board copper plating activation treatment method described in any of the above embodiments. In this embodiment, the circuit board copper plating activation treatment method includes pre-immersion treatment of a micro-etched water-washed substrate to obtain a board to be activated; activation treatment of the board to be activated to obtain a board to be re-immersed; re-immersion treatment of the board to be re-immersed to obtain a board to be copper-plated; and copper plating treatment of the board to be copper-plated to obtain the circuit board. After activation treatment, the surface of the board to be activated has an activating agent for copper foil adhesion. Before copper plating, the activated board to be re-immersed is re-immersed, i.e., pre-immersed again, so that excess activating agent on the board to be re-immersed does not enter subsequent processes. This allows excess activating agent on the board to be re-immersed to be collected and recovered, reducing waste of activating agent and effectively lowering the production cost of the circuit board.

[0063] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for activating copper plating on circuit boards, characterized in that, include: The micro-etched water-washed substrate is pre-immersed to obtain the board to be activated; The plate to be activated is subjected to an activation treatment to obtain a plate to be re-impregnated; The plate to be re-immersed is subjected to a re-immersion process to obtain a copper plate to be deposited; The copper plating board to be plated is subjected to copper plating treatment to obtain a circuit board; The process of performing a re-immersion treatment on the plate to be re-immersed to obtain a copper plate to be immersed includes the following steps beforehand: The activation concentration in the pre-impregnation cleaning tank is obtained. The activation concentration is the concentration of the activator in the pre-impregnation cleaning tank. Both the pre-impregnation treatment and the re-impregnation treatment are carried out in the pre-impregnation cleaning tank. The activation concentration is mixed with the preset concentration to obtain the activation-dissolution difference, which is the difference between the activation concentration of the activator in the pre-immersion cleaning tank and the standard preset concentration. According to the activation and immersion differential component, a vibration start / stop signal is sent to the circuit board monitoring device to adjust the ultrasonic vibration state of the ultrasonic vibrator. The process involves sending a vibration start / stop signal to the circuit board monitoring device based on the activated impregnation differential component to adjust the ultrasonic vibration state of the ultrasonic vibrator, including the following steps: Detect whether the activation-dissolution difference is greater than 0; When the activation impregnation difference is greater than 0, an ultrasonic vibration start signal is sent to the circuit board monitoring device to start the ultrasonic vibrator and perform ultrasonic vibration on the plate to be re-impregnated. When the activation impregnation difference is less than 0, an ultrasonic shutdown signal is sent to the circuit board monitoring device to shut down the ultrasonic vibrator. When the activation impregnation difference component is greater than 0, an ultrasonic vibration start signal is sent to the circuit board monitoring device to start the ultrasonic vibrator and perform ultrasonic vibration on the plate to be re-impregnated, which further includes the following steps: When the activation immersion-dissolution difference is greater than 0, the temperature of the bath solution in the pre-immersion cleaning tank is obtained; Detect whether the temperature of the bath solution is lower than the preset temperature; When the temperature of the bath solution is lower than the preset temperature, a heating signal is sent to the circuit board monitoring device to activate the heater in the circuit board monitoring device and heat the pre-soak cleaning tank.

2. The method for activating copper plating on circuit boards according to claim 1, characterized in that, The pre-immersion treatment of the micro-etched water-washed substrate includes: The micro-etched water-washed substrate is placed in a pre-immersion cleaning tank for a pre-immersion.

3. The method for activating copper plating on circuit boards according to claim 2, characterized in that, The re-immersion treatment of the plate to be re-immersed includes: The plates to be re-immersed are returned to the pre-immersion cleaning tank for a second pre-immersion.

4. The method for activating copper plating on circuit boards according to claim 1, characterized in that, The pre-immersion treatment of the micro-etched water-washed substrate also includes, prior to: The micro-etched water-washed substrate is then subjected to surface treatment.

5. The method for activating copper plating on circuit boards according to claim 4, characterized in that, The surface treatment of the micro-etched water-washed substrate includes: The micro-etched water-washed substrate is subjected to surface resin polishing treatment to remove surface residues from the micro-etched water-washed substrate. The micro-etched water-washed substrate is subjected to surface charge adjustment treatment so that the surface and hole walls of the micro-etched water-washed substrate are covered with agglomerated charges.

6. The method for activating copper plating on circuit boards according to claim 5, characterized in that, The surface charge adjustment treatment of the micro-etched water-washed substrate, to imbue the substrate surface and hole walls with aggregated charges, includes: The micro-etched water-washed substrate is subjected to a negative surface treatment so that the surface of the substrate and the hole walls are covered with negative agglomerated charges.

7. The method for activating copper plating on circuit boards according to claim 1, characterized in that, The activation process for the plate to be activated includes: The plate to be activated is placed in the activation tank to carry out the activation nucleation reaction.

8. The method for activating copper plating on circuit boards according to claim 7, characterized in that, The step of placing the plate to be activated in the activation tank for activation nucleation reaction includes: The plate to be activated is subjected to a hydrolysis reaction to obtain a plate to be re-immersed with an activated core, wherein the activated core is attached to the plate surface and the hole wall of the plate to be re-immersed.

9. The method for activating copper plating on circuit boards according to claim 8, characterized in that, The copper plating process for the plate to be plated includes: The copper plate to be deposited is placed in a copper plating tank to carry out a catalytic copper plating reaction, so that copper foil is attached to the region corresponding to the activation core.

10. A circuit board, characterized in that, It is prepared by the copper plating activation treatment method for circuit boards as described in any one of claims 1 to 9 above.

Images