A scanning actuator and a fiber optic scanner

Abstract

This invention discloses a scanning actuator, comprising a piezoelectric bicrystalline wafer and an adhesive component. Taking the plane containing the piezoelectric bicrystalline wafer as the horizontal plane and the fixed end of the wafer as the rear end, the front end of the wafer is the free end. The adhesive component is disposed on the left or right side of the wafer, fixing one side of the two piezoelectric ceramic sheets of the wafer into a single unit. A fiber optic scanner employing this scanning actuator is also disclosed. Both piezoelectric ceramic sheets of the bicrystalline wafer simultaneously possess synchronous equal-length extension and retraction motion components and synchronous opposite-length extension and retraction motion components, driving the free end of the wafer to vibrate simultaneously in the horizontal and vertical directions. Two-dimensional scanning is achieved through the two piezoelectric wafers. The scanning actuator, composed of a piezoelectric bicrystalline wafer and an adhesive component, eliminates the need for additional correction structures, making the components easy to manufacture and ensuring consistency in product specifications, performance, and parameters during mass production.

Description

Technical Field

[0001] This invention relates to the field of fiber optic scanning display device technology, and more particularly to a scanning actuator and a fiber optic scanner. Background Technology

[0002] A fiber optic scanner is a display technology that uses a scanning actuator to control the oscillation of an optical fiber to project a pattern. The pattern projected by this technology has sharp and saturated colors, high contrast, high brightness, and a very small structural size. It is mainly used in fiber optic scanning display (FSD) technology and fiber optic scanning endoscopy (FSE) technology.

[0003] The actuator of a grid-type fiber optic scanner mainly consists of a second actuator (fast axis) and a first actuator (slow axis). Both the second and first actuators have a fixed end and a free end, respectively, with the fixed end of the second actuator fixedly connected to the free end of the first actuator. To obtain a stable scanning range and precisely control the scanning trajectory, the scanning trajectory at the actuator's end must be precisely consistent with the scanning trajectories of both the first and second actuators. Any machining error in the actuator will make the actuator's vibration difficult to control or generate random vibration components. Avoiding uncontrolled or random vibration components is one of the important factors in improving scanning quality.

[0004] Traditional scanner actuators are generally tubular or plate-shaped. In order to ensure that the actuator in the slow axis direction meets the slow axis scanning frequency and the actuator in the fast axis direction meets the fast axis scanning frequency, the shape and size of the actuator must be designed accordingly, which results in the actuator being an irregular shape.

[0005] For example, Chinese patent CN111830702A discloses a scanning actuator that generally uses a tubular piezoelectric actuator. However, due to the aforementioned constraints, its design results in an irregular shape, which is quite disadvantageous for mass production of the actuator, making it difficult to manufacture and compromising manufacturing consistency. Similarly, Chinese patent CN209784655U discloses a scanning actuator that generally uses a sheet-like piezoelectric actuator. Again, for performance reasons, the actuator is also designed as an irregular shape, similarly suffering from the aforementioned technical problems of difficult precision manufacturing and poor manufacturing consistency.

[0006] Meanwhile, how to avoid vibration coupling between the slow-axis actuator and the fast-axis actuator is also a technical problem that needs to be considered. The two existing technologies mentioned above do not offer any corresponding design for reducing vibration coupling between the slow-axis actuator and the fast-axis actuator.

[0007] Therefore, the technical problem that needs to be solved is how to make the actuator easy to manufacture, easy to mass-produce, and have good consistency in mass production, while ensuring that each actuating part meets the performance parameters and does not generate vibration coupling. Summary of the Invention

[0008] This invention provides a scanning actuator and a fiber optic scanner using the scanning actuator, to at least solve the technical problems of the actuator being difficult to mass-produce and having poor consistency in mass production.

[0009] To achieve the above-mentioned objective, the first aspect of the present invention provides a scanning actuator, including a piezoelectric bicrystalline wafer and an adhesive component. Taking the plane where the piezoelectric bicrystalline wafer is located as the horizontal plane and the fixed end of the piezoelectric bicrystalline wafer as the rear end, the front end of the piezoelectric bicrystalline wafer is the free end. The adhesive component is disposed on the left or right side of the piezoelectric bicrystalline wafer, and the adhesive component fixes one side of the two piezoelectric ceramic sheets of the piezoelectric bicrystalline wafer into a whole.

[0010] Therefore, when the two piezoelectric ceramic sheets of the piezoelectric bicrystalline wafer extend and retract synchronously and at the same length, the bonding component fixes one side of the two piezoelectric ceramic sheets of the piezoelectric bicrystalline wafer into one piece, and the synchronous extension and retraction of the two piezoelectric ceramic sheets will drive the free end of the piezoelectric bicrystalline wafer to vibrate in the horizontal direction; while when the two piezoelectric ceramic sheets of the piezoelectric bicrystalline wafer extend and retract synchronously in opposite directions, the free end of the piezoelectric bicrystalline wafer will be driven to vibrate in the vertical direction.

[0011] Therefore, when both piezoelectric ceramic plates of a piezoelectric bicrystalline wafer simultaneously have synchronous equal-length extension and retraction motion components and synchronous opposite-length extension and retraction motion components, the free end of the piezoelectric bicrystalline wafer will be driven to vibrate simultaneously in the horizontal and vertical directions.

[0012] Generally, the piezoelectric bicrystalline wafer comprises two overlapping and bonded piezoelectric ceramic sheets. Each piezoelectric ceramic sheet has a conductive thin film deposited on its upper and lower surfaces, forming two surface electrodes. The two piezoelectric ceramic sheets are fixedly bonded together, and the left or right sides of both sheets are simultaneously fixedly connected to an adhesive component. Both piezoelectric ceramic sheets are polarized along their thickness direction (i.e., the vertical direction).

[0013] Optionally, the connection method of the piezoelectric bicrystalline wafer access circuit is as follows: the electrodes on the upper surface and the lower surface of the first piezoelectric ceramic wafer located in the upper layer of the piezoelectric bicrystalline wafer are respectively connected to a first driving circuit for generating a first control signal through electrode leads; the electrodes on the upper surface and the lower surface of the second piezoelectric ceramic wafer located in the lower layer of the piezoelectric bicrystalline wafer are respectively connected to a second driving circuit for generating a second control signal through electrode leads.

[0014] Alternatively, the polarization directions of the two piezoelectric ceramic sheets are opposite, and the piezoelectric bicrystalline wafer is connected to the circuit as follows: the electrode on the upper surface of the first piezoelectric ceramic sheet in the upper layer of the piezoelectric bicrystalline wafer is connected to the positive terminal of the first control signal through an electrode lead; the electrode on the lower surface of the second piezoelectric ceramic sheet in the lower layer of the piezoelectric bicrystalline wafer is connected to the positive terminal of the second control signal through an electrode lead; and the electrodes on the lower surface of the first piezoelectric ceramic sheet and the upper surface of the second piezoelectric ceramic sheet are directly connected and grounded.

[0015] The first piezoelectric ceramic sheet, driven by the first driving signal, simultaneously performs a synchronous, equal-length extension and retraction motion with the second piezoelectric ceramic sheet and a synchronous, opposite-length extension and retraction motion; the second piezoelectric ceramic sheet, driven by the second driving signal, simultaneously performs a synchronous, equal-length extension and retraction motion with the first piezoelectric ceramic sheet and a synchronous, opposite-length extension and retraction motion.

[0016] Specifically, the first control signal comprises a first set of control signals that drive the first piezoelectric ceramic sheet to perform synchronous, equal-length, telescopic movements with the second piezoelectric ceramic sheet, and a second set of control signals that drive the first piezoelectric ceramic sheet to perform synchronous, opposite-length, telescopic movements with the second piezoelectric ceramic sheet. The first control signal is a signal formed by superimposing the first and second sets of control signals. The second control signal comprises a third set of control signals that drive the second piezoelectric ceramic sheet to perform synchronous, equal-length, telescopic movements with the first piezoelectric ceramic sheet, and a fourth set of control signals that drive the second piezoelectric ceramic sheet to perform synchronous, opposite-length, telescopic movements with the first piezoelectric ceramic sheet. The second control signal is a signal formed by superimposing the third and fourth sets of control signals.

[0017] Preferably, the first control signal consists of two sets of sinusoidal voltage signals. Specifically, the first set of control signals S AX =VA1*sin(ω x *t+φ a1 Correspondingly, the third set of control signals is S. BX =VB1*sin(ω x* t+φ b1 The second set of control signals S AY =VA2*sin(ω) y* t+φ a2 Correspondingly, the fourth set of control signals is S. BY =VB2*sin(ω y* t+φ b2 ).

[0018] Therefore, the first control signal is: S A =S AX +S AY =VA1*sin(ω x* t+φ a1 )+VA2*sin(ω y* t+φa2 The second control signal is: S B =S BX +S BY =VB1*sin(ω x* t+φ b1 )+VB2*sin(ω y* t+φ b2 ).

[0019] In the formula: VA1 is the control signal S AX The voltage amplitude, VA2 is the control signal S Ay voltage amplitude, φ a1 For control signal S AX The initial phase, φ a2 For control signal S Ay The initial phase, VB1 is the control signal S BX The voltage amplitude, VB2 is the control signal S By voltage amplitude, φ b1 For control signal S BX The initial phase, φ b2 For control signal S By The initial phase. Theoretically, φ a1 and φ b1 The difference is 0° or 180°, φ a1 and φ b1 The difference is 0° or 180°; φ is adjusted accordingly based on the polarization direction of the first piezoelectric ceramic sheet and its connection to the circuit. a1 and φ b1 The difference, and φ a2 and φ b2 The difference between φ and φ can be used to achieve simultaneous synchronous equal-length extension and contraction, as well as synchronous reverse extension and contraction. Clearly, based on the above requirements and operating conditions, φ is selected... a1 and φ b1 The difference, and φ a2 and φ b2 The difference is conventional prior art to those skilled in the art. However, due to the processing precision deviation of the piezoelectric bicrystalline wafer and the bonding of the adhesive components, the scanning trajectory is prone to distortion. That is, when only the first set of control signals is applied to the first piezoelectric ceramic wafer and only the third set of control signals is applied to the second piezoelectric ceramic wafer, the scanning trajectory of the free end of the piezoelectric bicrystalline wafer is not a straight line along the X direction but an ellipse with its major axis along the X direction. The inventors discovered through actual operation that, in this case, by increasing or decreasing φ a1 and φ bThe difference can correct the scanning trajectory of the free end of the piezoelectric bicrystalline wafer to a straight line along the X direction; or, when only the second set of control signals is applied to the first piezoelectric ceramic wafer and only the fourth set of control signals is applied to the second piezoelectric ceramic wafer, the scanning trajectory of the free end of the piezoelectric bicrystalline wafer is not a straight line along the Y direction but an ellipse with its major axis along the Y direction. The inventors discovered through practical operation that, in this case, by increasing or decreasing φ... a2 and φ b2 The difference can be used to correct the scanning trajectory of the free end of the piezoelectric bicrystalline wafer into a straight line along the Y direction.

[0020] When the scanner is used in grid scanning mode, the second and fourth control signals do not have to be sinusoidal signals, as long as the waveforms of the second and fourth control signals are the same.

[0021] A second aspect of the present invention provides an optical fiber scanning actuator, including a scanning actuator and an optical fiber as described above, wherein the light-emitting end of the optical fiber is fixed to the free end of the scanning actuator in a cantilevered manner.

[0022] Specifically, the portion of the optical fiber that extends beyond the free end of the scanning actuator forms an optical fiber cantilever, and the portion of the optical fiber located behind the optical fiber cantilever is fixedly connected to the scanning actuator.

[0023] Optionally, the optical fiber is fixed to the piezoelectric bicrystalline wafer in a cantilevered manner; alternatively, the optical fiber is fixed to the adhesive component in a cantilevered manner.

[0024] In a preferred embodiment, the bonding component is a curing adhesive, meaning that the left or right sides of the two piezoelectric ceramic wafers of the piezoelectric bicrystalline wafer are fixedly connected as a single unit using curing adhesive, and the optical fiber is also fixed and bonded using curing adhesive. Specifically, the portion of the optical fiber located on the rear side of the optical fiber cantilever is bonded using curing adhesive.

[0025] One or more technical solutions in the embodiments of the present invention have at least the following technical effects or advantages:

[0026] In this invention, the synchronous equal-length extension and retraction of two piezoelectric ceramic sheets drives the free end of the piezoelectric bicrystalline wafer to vibrate in the horizontal direction; while when the two piezoelectric ceramic sheets of the piezoelectric bicrystalline wafer synchronously extend and retract in opposite directions, the free end of the piezoelectric bicrystalline wafer vibrates in the vertical direction. This invention utilizes the simultaneous synchronous equal-length extension and retraction motion components and synchronous opposite-length extension and retraction motion components of the two piezoelectric ceramic sheets of the piezoelectric bicrystalline wafer to drive the free end of the piezoelectric bicrystalline wafer to vibrate in both the horizontal and vertical directions, thus realizing two-dimensional scanning through the two piezoelectric wafers.

[0027] This invention comprises a piezoelectric bicrystalline wafer and bonding components. The components are easy to manufacture and process, and in mass production, it is easy to ensure consistency in product specifications, performance, and parameters. For fiber optic scanning imaging technology, good actuator consistency is one of the key factors enabling the mass production of fiber optic scanners. Simultaneously, the sheet-like structure results in a large difference in the characteristic frequency values ​​of the actuator in the horizontal and vertical directions, which can greatly reduce vibration coupling between the two vibration directions.

[0028] This invention increases or decreases φ a1 and φ b The difference can correct the scanning trajectory of the free end of the piezoelectric bicrystalline wafer to a straight line along the X direction by increasing or decreasing φ. a2 and φ b2 The difference can correct the scanning trajectory of the free end of the piezoelectric bicrystalline wafer to a straight line along the Y direction. No additional correction structure is needed, which also helps reduce processing difficulty and is suitable for mass production. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the scanning actuator of the present invention;

[0030] Figure 2 This is a top view of the first piezoelectric ceramic sheet of the scanning actuator of the present invention;

[0031] Figure 3 This is a schematic diagram of the electrode arrangement structure of the scanning actuator of the present invention;

[0032] Figure 4 This is a schematic diagram of the drive wiring of the scanning actuator of the present invention;

[0033] Figure 5 This is a schematic diagram of another embodiment of the scanning actuator of the present invention;

[0034] Figure 6 This is a schematic diagram of the fiber optic scanner of the present invention. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] like Figure 1 , Figure 2As shown, a first aspect of the present invention provides a scanning actuator, including a piezoelectric bicrystalline wafer 100 and an adhesive component 200. Taking the plane where the piezoelectric bicrystalline wafer 100 is located as the horizontal plane and the fixed end of the piezoelectric bicrystalline wafer 100 as the rear end, the front end of the piezoelectric bicrystalline wafer 100 is the free end. The adhesive component 200 is disposed on the left or right side of the piezoelectric bicrystalline wafer 100, and the adhesive component 200 fixes one side of the two piezoelectric ceramic sheets of the piezoelectric bicrystalline wafer 100 into a whole.

[0037] Therefore, when the two piezoelectric ceramic sheets of the piezoelectric bicrystalline wafer 100 extend and retract synchronously at the same length, the adhesive component 200 fixes one side of the two piezoelectric ceramic sheets 101 and 102 of the piezoelectric bicrystalline wafer 100 into a single unit, and the synchronous extension and retraction of the two piezoelectric ceramic sheets will drive the free end of the piezoelectric bicrystalline wafer 100 to vibrate in the horizontal direction; while when the two piezoelectric ceramic sheets of the piezoelectric bicrystalline wafer 100 extend and retract synchronously in opposite directions, the free end of the piezoelectric bicrystalline wafer 100 will be driven to vibrate in the vertical direction.

[0038] Therefore, when both piezoelectric ceramic sheets of the piezoelectric bicrystalline wafer 100 simultaneously have synchronous equal-length extension and retraction motion components and synchronous opposite-length extension and retraction motion components, the free end of the piezoelectric bicrystalline wafer 100 will be driven to vibrate simultaneously in the horizontal direction and the vertical direction.

[0039] Generally, the piezoelectric bicrystalline wafer 100 includes two overlapping piezoelectric ceramic sheets 101 and 102. Each piezoelectric ceramic sheet has a conductive thin film deposited on its upper and lower surfaces, forming upper and lower surface electrodes 103, 104, 105, and 106, respectively. The two piezoelectric ceramic sheets are fixedly bonded together, and the left or right sides of both sheets are simultaneously fixedly connected to the bonding component 200. Both piezoelectric ceramic sheets are polarized along their thickness direction (i.e., the vertical direction).

[0040] Optional, such as Figure 3 As shown, the piezoelectric bicrystalline wafer 100 is connected to the circuit as follows: the electrode 103 on the upper surface and the electrode 104 on the lower surface of the first piezoelectric ceramic wafer 101 located in the upper layer of the piezoelectric bicrystalline wafer 100 are respectively connected to a first driving circuit for generating a first control signal through electrode leads; the electrode 105 on the upper surface and the electrode 105 on the lower surface of the second piezoelectric ceramic wafer 102 located in the lower layer of the piezoelectric bicrystalline wafer 100 are respectively connected to a second driving circuit for generating a second control signal through electrode leads.

[0041] Alternatively, such as Figure 4As shown, the polarization directions of the two piezoelectric ceramic sheets are opposite. The piezoelectric bicrystalline wafer 100 is connected to the circuit as follows: the electrode 103 on the upper surface of the first piezoelectric ceramic sheet 101 in the upper layer of the piezoelectric bicrystalline wafer 100 is connected to the positive terminal of the first control signal through an electrode lead; the electrode 106 on the lower surface of the second piezoelectric ceramic sheet 102 in the lower layer of the piezoelectric bicrystalline wafer 100 is connected to the positive terminal of the second control signal through an electrode lead; and the electrode 103 on the lower surface of the first piezoelectric ceramic sheet 101 and the electrode 105 on the upper surface of the second piezoelectric ceramic sheet 102 are directly connected and grounded.

[0042] The first piezoelectric ceramic sheet 101, driven by the first driving signal, simultaneously performs a synchronous equal-length extension and retraction motion with the second piezoelectric ceramic sheet 102 and a synchronous reverse extension and retraction motion; the second piezoelectric ceramic sheet 102, driven by the second driving signal, simultaneously performs a synchronous equal-length extension and retraction motion with the first piezoelectric ceramic sheet 101 and a synchronous reverse extension and retraction motion.

[0043] Specifically, the first control signal comprises a first set of control signals that drive the first piezoelectric ceramic sheet 101 to perform synchronous and equal-length telescopic movement with the second piezoelectric ceramic sheet 102, and a second set of control signals that drive the first piezoelectric ceramic sheet 101 to perform synchronous and opposite telescopic movement with the second piezoelectric ceramic sheet 102. The first control signal is a signal formed by superimposing the first and second sets of control signals. The second control signal comprises a third set of control signals that drive the second piezoelectric ceramic sheet 102 to perform synchronous and equal-length telescopic movement with the first piezoelectric ceramic sheet 101, and a fourth set of control signals that drive the second piezoelectric ceramic sheet 102 to perform synchronous and opposite telescopic movement with the first piezoelectric ceramic sheet 101. The second control signal is a signal formed by superimposing the third and fourth sets of control signals.

[0044] In a preferred embodiment, the first control signal consists of two sets of sinusoidal voltage signals. Specifically, the first set of control signals S... AX =VA1*sin(ω x *t+φ a1 Correspondingly, the third set of control signals is S. BX =VB1*sin(ω x* t+φ b1 The second set of control signals S AY =VA2*sin(ω) y* t+φ a2 Correspondingly, the fourth set of control signals is S. BY =VB2*sin(ω y* t+φ b2 ).

[0045] Therefore, the first control signal is: S A =S AX +SAY =VA1*sin(ω x* t+φ a1 )+VA2*sin(ω y* t+φ a2 The second control signal is: S B =S BX +S BY =VB1*sin(ω x* t+φ b1 )+VB2*sin(ω y* t+φ b2 ).

[0046] In the formula: VA1 is the control signal S AX The voltage amplitude, VA2 is the control signal S Ay voltage amplitude, φ a1 For control signal S AX The initial phase, φ a2 For control signal S Ay The initial phase, VB1 is the control signal S BX The voltage amplitude, VB2 is the control signal S By voltage amplitude, φ b1 For control signal S BX The initial phase, φ b2 For control signal S By The initial phase. Theoretically, φ a1 and φ b1 The difference is 0° or 180°, φ a1 and φ b1 The difference is 0° or 180°; φ is adjusted accordingly based on the polarization direction of the first piezoelectric ceramic sheet 101 and its connection to the circuit. a1 and φ b1 The difference, and φ a2 and φ b2 The difference between φ and φ can be used to achieve simultaneous synchronous equal-length extension and contraction, as well as synchronous reverse extension and contraction. Clearly, based on the above requirements and operating conditions, φ is selected... a1 and φ b1 The difference, and φ a2 and φ b2The difference is conventional prior art to those skilled in the art. However, due to the processing precision deviation of the piezoelectric bicrystalline wafer 100 and the bonding of the adhesive component 200, the scanning trajectory is prone to distortion. That is, when only the first set of control signals is applied to the first piezoelectric ceramic wafer 101 and only the third set of control signals is applied to the second piezoelectric ceramic wafer, the scanning trajectory of the free end of the piezoelectric bicrystalline wafer 100 is not a straight line along the X direction but an ellipse with its major axis along the X direction. The inventors discovered through actual operation that, in this case, by increasing or decreasing φ a1 and φ b The difference can correct the scanning trajectory of the free end of the piezoelectric bicrystalline wafer 100 to a straight line along the X direction; or, when only the second set of control signals is applied to the first piezoelectric ceramic wafer 101 and only the fourth set of control signals is applied to the second piezoelectric ceramic wafer, the scanning trajectory of the free end of the piezoelectric bicrystalline wafer 100 is not a straight line along the Y direction but an ellipse with its major axis along the Y direction. The inventors discovered through actual operation that, in this case, by increasing or decreasing φ a2 and φ b2 The difference can be used to correct the scanning trajectory of the free end of the piezoelectric bicrystalline wafer 100 into a straight line along the Y direction.

[0047] When the scanner is used in grid scanning mode, the second and fourth control signals do not have to be sinusoidal signals, as long as the waveforms of the second and fourth control signals are the same.

[0048] A second aspect of the present invention provides an optical fiber scanning actuator, including the scanning actuator and optical fiber 300 as described above, wherein the light-emitting end of the optical fiber 300 is fixed to the free end of the scanning actuator in a cantilevered manner.

[0049] Specifically, the portion of the optical fiber 300 extending beyond the free end of the scanning actuator constitutes the optical fiber cantilever 301. The portion of the optical fiber 300 located behind the optical fiber cantilever 301 is fixedly connected to the scanning actuator. The free end of the scanning actuator is its front end. The other end of the optical fiber 300 is connected to a light source. Driven by the scanning actuator, the optical fiber cantilever performs a two-dimensional scan. The light source emits light corresponding to the pixel point according to the scanning position of the optical fiber cantilever, thereby realizing optical fiber two-dimensional scanning imaging.

[0050] Optionally, the optical fiber 300 is fixed to the piezoelectric bicrystalline wafer 100 in a cantilevered manner; alternatively, the optical fiber 300 is fixed to the adhesive component 200 in a cantilevered manner.

[0051] In a preferred embodiment, the bonding component 200 is a curing adhesive 201, meaning that the left or right sides of the two piezoelectric ceramic sheets of the piezoelectric bicrystalline wafer 100 are fixedly connected as a single unit by the curing adhesive 201, and the optical fiber 300 is also fixedly bonded by the curing adhesive 201. That is, the portion of the optical fiber 300 located on the rear side of the optical fiber cantilever 301 is bonded by the curing adhesive 201.

[0052] It should be noted that the above embodiments are illustrative of the invention and not restrictive, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The words “comprising” or “including” do not exclude the presence of elements or steps not listed in the claims. The words “a” or “an” preceding an element do not exclude the presence of a plurality of such elements. The use of the words first, second, and third, etc., does not indicate any order and these words can be interpreted as names.

[0053] All features disclosed in this specification, except for mutually exclusive features, can be combined in any way.

[0054] Any feature disclosed in this specification (including any appended claims, abstract, and drawings) may be replaced by other equivalent or similar features, unless specifically stated otherwise. That is, unless specifically stated otherwise, each feature is merely one example of a series of equivalent or similar features.

[0055] This invention is not limited to the specific embodiments described above. The invention extends to any new feature or combination disclosed in this specification, as well as any new method or process step or combination disclosed herein.

Claims

1. A scanning actuator, characterized in that, It includes a piezoelectric bicrystalline wafer and an adhesive component. Taking the plane where the piezoelectric bicrystalline wafer is located as the horizontal plane and the fixed end of the piezoelectric bicrystalline wafer as the rear end, the front end of the piezoelectric bicrystalline wafer is the free end. The adhesive component is set on the left or right side of the piezoelectric bicrystalline wafer and fixes one side of the two piezoelectric ceramic sheets of the piezoelectric bicrystalline wafer into one piece. The two piezoelectric ceramic plates of the piezoelectric bicrystalline wafer simultaneously have synchronous equal-length extension and retraction motion components and synchronous opposite-length extension and retraction motion components, driving the free end of the piezoelectric bicrystalline wafer to vibrate simultaneously in the horizontal and vertical directions.

2. A scanning actuator as described in claim 1, characterized in that, In a piezoelectric bicrystalline wafer, the electrodes on the upper and lower surfaces of the first piezoelectric ceramic wafer in the upper layer are respectively connected to a first driving circuit for generating a first control signal via electrode leads. Similarly, the electrodes on the upper and lower surfaces of the second piezoelectric ceramic wafer in the lower layer are respectively connected to a second driving circuit for generating a second control signal via electrode leads.

3. A scanning actuator as described in claim 1, characterized in that, The two piezoelectric ceramic sheets in the piezoelectric bicrystalline wafer have opposite polarization directions. The electrode on the upper surface of the first piezoelectric ceramic sheet in the upper layer of the piezoelectric bicrystalline wafer is connected to the positive terminal of the first control signal through an electrode lead. The electrode on the lower surface of the second piezoelectric ceramic sheet in the lower layer of the piezoelectric bicrystalline wafer is connected to the positive terminal of the second control signal through an electrode lead. The electrodes on the lower surface of the first piezoelectric ceramic sheet and the electrodes on the upper surface of the second piezoelectric ceramic sheet are directly connected and grounded.

4. A scanning actuator as described in claim 2 or 3, characterized in that, The first piezoelectric ceramic sheet, driven by the first driving signal, simultaneously performs a synchronous, equal-length extension and retraction motion with the second piezoelectric ceramic sheet and a synchronous, opposite-length extension and retraction motion; the second piezoelectric ceramic sheet, driven by the second driving signal, simultaneously performs a synchronous, equal-length extension and retraction motion with the first piezoelectric ceramic sheet and a synchronous, opposite-length extension and retraction motion.

5. A scanning actuator as described in claim 4, characterized in that, The first control signal has a first set of control signals that drive the first piezoelectric ceramic sheet to perform synchronous and equal-length telescopic movement with the second piezoelectric ceramic sheet, and a second set of control signals that drive the first piezoelectric ceramic sheet to perform synchronous and opposite telescopic movement with the second piezoelectric ceramic sheet. The first control signal is a signal formed by superimposing the first set of control signals and the second set of control signals. The second control signal has a third set of control signals that drive the second piezoelectric ceramic sheet to perform synchronous and equal-length telescopic movement with the first piezoelectric ceramic sheet, and a fourth set of control signals that drive the second piezoelectric ceramic sheet to perform synchronous and opposite telescopic movement with the first piezoelectric ceramic sheet. The second control signal is a signal formed by superimposing the third set of control signals and the fourth set of control signals.

6. A scanning actuator as described in claim 5, characterized in that, First set of control signals S AX =VA1*sin(ω x *t+φ a1 The third set of control signals is S. BX =VB1*sin(ω x* t+φ b1 The second set of control signals S AY =VA2*sin(ω) y* t+φ a2 The fourth group of control signals is S. BY =VB2*sin(ω y* t+φ b2 ); The first control signal is: S A =S AX +S AY =VA1*sin(ω x* t+φ a1 )+VA2*sin(ω y* t+φ a2 The second control signal is: S B =S BX +S BY =VB1*sin(ω x* t+φ b1 )+VB2*sin(ω y* t+φ b2 ); In the formula: VA1 is the control signal S AX The voltage amplitude, VA2 is the control signal S Ay voltage amplitude, φ a1 For control signal S AX The initial phase, φ a2 For control signal S Ay The initial phase, VB1 is the control signal S BX The voltage amplitude, VB2 is the control signal S By voltage amplitude, φ b1 For control signal S BX The initial phase, φ b2 For control signal S By The initial phase.

7. A scanning actuator as described in claim 6, characterized in that, By increasing or decreasing φ a1 and φ b1 The difference corrects the scan trajectory of the free end of the piezoelectric bicrystalline wafer to a straight line along the X direction; By increasing or decreasing φ a2 and φ b2 The difference corrects the scan trajectory of the free end of the piezoelectric bicrystalline wafer to a straight line along the Y direction.

8. A fiber optic scanning actuator, characterized in that, Includes a scanning actuator and an optical fiber as described in any one of claims 1-7, wherein the light-emitting end of the optical fiber is fixed to the free end of the scanning actuator in a cantilevered manner.

9. The fiber optic scanning actuator as described in claim 8, characterized in that, The bonding component is a curing adhesive, that is, the left or right sides of the two piezoelectric ceramic sheets of the piezoelectric bicrystalline wafer are fixedly connected as one piece by the curing adhesive. The optical fiber is also fixed and bonded by the curing adhesive, that is, the part of the optical fiber located on the back side of the optical fiber cantilever is bonded by the curing adhesive.

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