TP sensor structure, manufacturing method thereof and display module

By adjusting the top MO film material in the TP sensor structure to MoO3 and optimizing the sputtering process, the problem of obvious bridge points was solved, and the visual experience of the touch screen was improved.

CN115756197BActive Publication Date: 2025-10-14WUHU TOKEN SCI
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Patent Information

Application Number
CN202211447699.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-11-18
Publication Date
2025-10-14
Estimated Expiration
2042-11-18

AI Technical Summary

Technical Problem

Existing TP sensor products have obvious bridge points after being bonded to LCM screens, which cannot meet consumers' high requirements for visual experience.

Method used

By adjusting the top MO film material in the TP sensor structure to MoO3 and controlling the oxygen flow rate ratio during the sputtering process, the thickness and optical reflectivity of the metal layer are optimized, and the color difference between the local OC and the metal layer is reduced.

Benefits of technology

The bridge point is almost invisible after being bonded to the back-end display module LCM or OLED, which improves the visual experience of the touch screen.

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Abstract

The application discloses a TP sensor structure, glass is sequentially provided with an ITO layer, an OC1 layer, a metal layer and a local OC layer, the metal layer comprises a top MO film, an intermediate Al film and a bottom MO film, the thickness of the top MO film is 350A+ / -100A, the thickness of the intermediate Al film is 1800+ / -300A, the thickness of the bottom MO film is 350+ / -100A, and the material of the top MO film is MoO3. The rear-end display module LCM or OLED of the application is invisible after being attached to the rear bridge point, and the visual experience of customers on the touch screen is improved.
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Description

TECHNICAL FIELD

[0001] The present application relates to the field of touch screens, in particular to TP sensor technology. BACKGROUND

[0002] With the development of the touch screen industry, consumers have increasingly high requirements for the visual experience of touch screens. The micron-level bridge points become very obvious after the back-end display module LCM or OLED is attached, which is visible to the naked eye and cannot meet the needs of consumers, and improvement is urgently needed.

[0003] At present, the common TP sensor product structure is as shown in Figure 1 The module structure composed of the TP sensor product structure is as shown in Figure 2 For example, the disclosure number CN 106201151B and the patent name “Display panel and electronic equipment” disclose a display panel and electronic equipment. In the present application, the display panel comprises: a TP In-Cell liquid crystal display module, a resonance layer and a shielding layer; the resonance layer is located between the TP In-Cell liquid crystal display module and the shielding layer; and the resonance layer is located on the backlight side of the TP In-Cell liquid crystal display module; during the display period, the resonance layer maintains a first constant voltage; during the touch scanning period, the touch sensor and the common electrode both receive a scanning signal, charge and discharge the touch sensor, and the resonance layer receives a preset voltage signal; the phase and amplitude of the preset voltage signal are the same as those of the scanning signal.

[0004] The metal bridge product of the similar structure display device all has the problem that the bridge point is obvious after the LCM screen is attached. SUMMARY

[0005] The technical problem to be solved by the present application is to make the bridge point less obvious without changing the product layer structure.

[0006] In order to achieve the above purpose, the technical scheme adopted by the present application is: a TP sensor structure, glass is sequentially provided with an ITO layer, an OC1 layer, a metal layer and a local OC layer, the metal layer comprises a top MO film, an intermediate Al film and a bottom MO film, the thickness of the top MO film is 350A±100A, the thickness of the intermediate Al film is 1800±300A, the thickness of the bottom MO film is 350±100A, and the material of the top MO film is MoO3.

[0007] The material of the bottom MO film is elemental Mo.

[0008] The material of the intermediate Al film is elemental Al.

[0009] A method for manufacturing a TP sensor structure includes: forming a top MO film on a prepared intermediate Al film by target sputtering; the target sputtering equipment has a gas pipeline; oxygen is introduced into the gas pipeline when manufacturing the top MO film.

[0010] During the sputtering of the target material, the thickness of the top MO film is controlled at 300±100A by adjusting the input power.

[0011] There are 3-5 gas pipelines, and the gas outlet of each gas pipeline is aligned with the vertically arranged target material, and the gas outlets are arranged from top to bottom.

[0012] The oxygen flow rate of each gas pipeline is different. The gas pipeline with the outlet located in the center has a large flow rate, while the gas pipeline with the outlet located at the top and bottom has a small flow rate.

[0013] There are three gas outlets and gas pipelines, and the ratio of oxygen output from top to bottom is 1:8:1.5.

[0014] A display module comprises a cover plate, an OCR / OCA layer, a TP sensor layer, an OCR layer, and a light-emitting layer. The structure of the TP sensor layer is similar to the TP sensor structure.

[0015] The light-emitting layer is LCM or OLED.

[0016] After the rear display module LCM or OLED of the present invention is bonded, the bridge point is invisible, thereby improving the visual experience of the customer on the touch screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The following is a brief description of the contents of each figure in the specification of the present invention:

[0018] Figure 1 This is a schematic diagram of the TP sensor product layer structure;

[0019] Figure 2 It is a schematic diagram of the module structure layer structure;

[0020] Figure 3 This is a schematic diagram of the bridge point structure;

[0021] Figure 4 This is the top-level MO transformation diagram. DETAILED DESCRIPTION

[0022] Below, with reference to the accompanying drawings, through the description of the embodiments, the specific implementation methods of the present invention, such as the shape, structure, relative positions and connection relationships of the various components involved, the functions and working principles of the various components, the manufacturing process and operating methods, etc., are further explained in detail to help those skilled in the art to have a more complete, accurate and in-depth understanding of the inventive concept and technical solution of the present invention.

[0023] The technical solution of the present invention is to change the top MO film thickness and the top MO to MoO3 design without changing the product design, thereby reducing the chromaticity difference between the local OC (region 1) and the metal layer (region 2) and making the bridge point invisible. Here, the chromaticity difference between region 1 and region 2 is evaluated by ΔE, ΔE = SQRT((L1-L2) 2 +(a1-a2) 2 +(b1-b2) 2 ), L1, a1, b1 are the chromaticities at region 1, L2, a2, b2 are the chromaticities at region 2. In principle, the smaller △E is, the less obvious the bridge point is.

[0024] The conventional structure of the metal layer is MOALMO. The conventional metal layer film thickness range is that the bottom MO film thickness is 300±100A, the middle Al layer thickness is 1800±300A, and the top MO layer thickness is 500±100A. The conventional metal top MO is an oxygen-proof MO. After the film layers are stacked, the optical reflectivity of the film surface is about 50%, the standard range is 45-60%, and the L* is 77. After the final product is bonded with the LCM screen, the bridge points are clearly visible visually. In order to improve the obviousness of the bridge points, the present invention introduces O2 into the top MO, changing it from simple MO to MoO3, and the top MO film thickness is thinned from 500A to 350A, that is, the top MO film thickness is 350A±100A, and the preferred film thickness is 350A.

[0025] When manufacturing TP sensor products, other production processes remain unchanged. When manufacturing the top MO film thickness, compared with the original design, the top MO film thickness is adjusted from the original 500A to 350A. The initial adjustment requires evaluating the actual film thickness, the corresponding power, and calculating the sputtering rate of the target material to facilitate film thickness adjustment. Changes to the single-layer film thickness require evaluating the adhesion of the superimposed film layers.

[0026] The top-layer MO target requires equipment modification. Compared with the original design, the normal metal process top-layer MO does not require oxygen. Normal equipment installation may only retain the Ar pipeline. In order to meet the test requirements, the top-layer MO target needs to be modified to add an oxygen pipeline. The pipeline is divided into 3 or 5 sections for control (i.e., upper, middle, and lower). The target length of 1428mm is divided into 3 sections for control, and the target length of 2240mm is divided into 5 sections for control. In addition, a 100sccm or 200sccm flowmeter is added to each section so that the oxygen flow in each section can be independently controlled. In addition, a needle valve needs to be added to the pipeline, which is equivalent to adding a switch to the pipeline to facilitate switching between conventional products and top-layer blackened products.

[0027] Adjust the oxygen ratio of the top MO. Compared with conventional metal processes, the top MO requires a certain amount of oxygen to be introduced, which can be controlled overall. However, the resulting products may have different film colors, such as golden or brownish red. The normal film color is dark blue. In this case, it is necessary to adjust a certain section according to the optical and film color requirements so that a certain section is not fully oxidized, resulting in a large difference in film color. If the film color of a certain area of ​​the product is golden yellow, it is judged that the O2 is too low and O2 needs to be increased appropriately. If the film color is brown-red, the O2 is too high and O2 needs to be reduced appropriately. To ensure the consistency of the film color, the current optimal MoO3 oxygen injection ratio for the upper, middle and lower parts is 1:8:1.5 (for example, if the total O2 injection amount is 84sccm, then the actual injection amount calculated according to the ratio is 8sccm, 64sccm and 12sccm); after the superposition of each film layer, the optical reflectivity of the film surface is 11.06%, and the L* is 40.14. After the sample is bonded, the bridge point is almost invisible visually, and the △E is significantly reduced after bonding, from 41.40 to 5.07, meeting customer requirements.

[0028] The optical properties of the metal film surface of the TP sensor product produced using this method are compared in the following table:

[0029]

[0030] The △E value test comparison of display components made with TP sensor products is shown in the following table:

[0031]

[0032] It can be seen that the bridge point of the TP sensor product of the present invention and the display assembly made of the TP sensor product is almost invisible after bonding, which can effectively improve the customer's visual experience of the touch screen.

[0033] The present invention is described above by way of example in conjunction with the accompanying drawings. It is obvious that the specific implementation of the present invention is not limited to the above-mentioned method. As long as various non-substantial improvements are made using the method concept and technical solution of the present invention, or the concept and technical solution of the present invention are directly applied to other occasions without improvement, they are all within the scope of protection of the present invention.

Claims

1. A method for manufacturing a TP sensor structure, characterized by: When forming the top MO film on the prepared middle Al film, a target sputtering method is adopted. The target sputtering equipment has a gas pipeline. Oxygen is introduced into the gas pipeline when forming the top MO film. The gas outlet of each gas pipeline is aligned with the vertically arranged target, and the gas outlets are arranged from top to bottom; The oxygen flow rate of each gas pipeline is different. The gas pipeline with the outlet in the center has a large flow rate, while the gas pipeline with the outlet at the top and bottom has a small flow rate. There are three gas outlets and gas pipelines, and the ratio of oxygen output from top to bottom is 1:8:1.

5.

2. The production method according to claim 1, characterized in that: During the sputtering of the target material, the thickness of the top MO film is controlled at 300±100A by adjusting the input power.

3. A TP sensor structure comprising an ITO layer, an OC1 layer, a metal layer, and a partial OC layer sequentially disposed on glass, wherein the metal layer comprises a top MO film, a middle Al film, and a bottom MO film, characterized in that: The thickness of the top MO film is 350A±100A, the thickness of the middle Al film is 1800±300A, the thickness of the bottom MO film is 350±100A, the material of the top MO film is MoO3, and the TP sensor structure is manufactured using the manufacturing method described in claim 1 or 2.

4. The TP sensor structure according to claim 3, wherein: The bottom MO film is made of elemental Mo.

5. The TP sensor structure according to claim 4, characterized in that: The material of the intermediate Al film is single substance Al.

6. A display module having a layer structure comprising, in order, a cover plate, an OCR / OCA layer, a TP sensor layer, an OCR layer, and a light-emitting layer, characterized in that: The structure of the TP sensor layer is the TP sensor structure as claimed in claim 3, 4 or 5.

7. The display module according to claim 6, wherein: The light-emitting layer is LCM or OLED.

Citation Information

Patent Citations

  • Display panels and electronic devices

    CN106201151B

  • Capacitive touch screen and manufacturing method thereof

    CN103853397A