Storage drive with capacitor module

Abstract

A storage drive comprises: a main module, comprising: a main printed circuit board (PCB) having a first side positioned opposite to a second side; a flash memory component positioned on the main PCB and at a first end of the storage drive; a controller module positioned on the main PCB and at a second end of the storage drive opposite to the first end; and a capacitor module, comprising: a module printed circuit board (PCB) having a first side positioned opposite to the second side; a plurality of capacitors positioned on the module PCB and on the first side of the module PCB, wherein the capacitor module is coupled to the main module so that the capacitor module is positioned at the first end of the storage drive and the first side of the capacitor module faces the first side of the main module.

Description

Background Art Technical Field

[0001] The present disclosure relates generally to an information handling system and, in particular, to a storage drive having a capacitor module.

[0002] Description of Related Technology

[0003] As the value and use of information continue to increase, individuals and businesses are looking for alternative ways to process and store information. One option available to users is an information handling system. An information handling system typically processes, compiles, stores, and / or communicates information or data for business, personal, or other purposes, thereby allowing users to exploit the value of this information. Because technology and information handling needs and requirements may vary between different users or applications, information handling systems may also differ in terms of what information is handled, how it is handled, how much information is processed, stored, or communicated, and how quickly and efficiently it can be processed, stored, or communicated. Variations in information handling systems allow information handling systems to be general-purpose or configured for specific users or specific applications, such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, an information handling system may include various hardware and software components that can be configured to process, store, and communicate information, and may include one or more computer systems, data storage systems, and networking systems.

[0004] Storage drives of information handling systems may include capacitors. However, capacitors can be large and therefore occupy a large amount of space on a storage drive, such as a solid-state drive (SSD) on a printed circuit board (PCB). Including such large capacitors can prevent the inclusion of additional flash memory components on the SSD PCB. Summary of the Invention

[0005] The innovative aspects of the subject matter described in this specification can be embodied in a storage drive comprising: a main module comprising: a main printed circuit board PCB having a first side positioned relative to a second side; a flash memory component positioned on the main PCB and at a first end of the storage drive; a controller module positioned on the main PCB and at a second end of the storage drive opposite to the first end; and a capacitor module comprising: a module printed circuit board PCB having a first side positioned relative to the second side; a plurality of capacitors positioned on the module PCB and on the first side of the module PCB, wherein the capacitor module is coupled to the main module such that the capacitor module is positioned at the first end of the storage drive and the first side of the capacitor module faces the first side of the main module.

[0006] Other embodiments of these aspects include corresponding systems and devices.

[0007] These and other embodiments may each optionally include one or more of the following features. For example, the storage drive is a solid-state drive (SSD) storage drive. The capacitor module also includes a signal connector positioned on a first side of the capacitor module, the signal connector connecting the capacitor module to the main module to transmit signals between the capacitor module and the main module. The signal connector includes a plurality of pins that directly contact pads of the main module. The signal connector includes a wire having a connector. The flash memory component is positioned on a first side and a second side of the main PCB. A plurality of capacitors face the flash memory element positioned on the first side of the main PCB. The controller module is positioned on the first side of the main PCB.

[0008] Certain implementations of the subject matter described in this specification can be implemented to achieve one or more of the following advantages: For example, space on an SSD PCB can be increased, resulting in a higher capacity and more compact SSD.

[0009] The details of one or more embodiments of the subject matter described in this specification are set forth in the accompanying drawings and the description below. Other potential features, aspects, and advantages of the subject matter will become apparent from the description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a block diagram of selected elements of an embodiment of an information handling system.

[0011] Figure 2 A block diagram of an information handling system including a storage drive is shown.

[0012] Figure 3 A side view of a storage drive is shown.

[0013] Figure 4 A perspective view of a capacitor module of a storage drive is shown. DETAILED DESCRIPTION

[0014] This disclosure discusses a storage drive for an information handling system, including a capacitor module. Briefly, the storage drive may include a capacitor module mounted on a housing of the storage drive. The capacitor module can provide power to the storage drive during a power outage. The capacitor module is coupled to the storage drive as a low-profile capacitor module, which can increase available board space in the storage drive by minimizing or eliminating fasteners used for coupling.

[0015] Specifically, the present disclosure discusses a storage drive, which includes: a main module, the main module including: a main printed circuit board PCB, which has a first side positioned relative to the second side; a flash memory component, which is positioned on the main PCB and at a first end of the storage drive; a controller module, which is positioned on the main PCB and at a second end of the storage drive opposite to the first end; and a capacitor module, the capacitor module including: a module printed circuit board PCB, which has a first side positioned relative to the second side; a plurality of capacitors positioned on the module PCB and on the first side of the module PCB, wherein the capacitor module is coupled to the main module so that the capacitor module is positioned at the first end of the storage drive and the first side of the capacitor module faces the first side of the main module.

[0016] In the following description, details are set forth by way of examples to facilitate discussion of the disclosed subject matter. However, it should be apparent to those skilled in the art that the disclosed embodiments are exemplary rather than exhaustive of all possible embodiments.

[0017] For the purposes of this disclosure, an information handling system may include a tool or tool set that is operable to calculate, classify, process, transmit, receive, retrieve, generate, switch, store, display, indicate, detect, record, reproduce, dispose of, or utilize any form of information, intelligence, or data for commercial, scientific, control, entertainment, or other purposes. For example, an information handling system may be a personal computer, a PDA, a consumer electronic device, a network storage device, or another suitable device, and may vary in size, shape, performance, functionality, and price. An information handling system may include a memory, one or more processing resources (such as a central processing unit (CPU), or hardware or software control logic. Additional components of an information handling system may include one or more storage devices, one or more communication ports for communicating with external devices, and various input / output (I / O) devices (such as a keyboard, mouse, and video display). An information handling system may also include one or more buses that are operable to transmit communications between various hardware components.

[0018] For the purposes of this disclosure, a computer-readable medium may include a tool or collection of tools that can retain data and / or instructions for a period of time. Computer-readable media may include, but are not limited to: storage media such as direct access storage devices (e.g., hard drives or floppy disks), sequential access storage devices (e.g., magnetic tape disk drives), compact discs, CD-ROMs, DVDs, random access memories (RAM), read-only memories (ROMs), electrically erasable programmable read-only memories (EEPROMs), and / or flash memories (SSDs); and communication media such as wires, optical fibers, microwaves, radio waves, and other electromagnetic and / or optical carrier waves; and / or any combination of the foregoing.

[0019] By reference Figures 1 to 4 To best understand the particular embodiments, like reference numerals are used throughout to designate like and corresponding parts.

[0020] Referring now to the accompanying drawings, Figure 1 A block diagram depicting selected elements of an information handling system 100 according to some embodiments of the present disclosure is shown. In various embodiments, the information handling system 100 can represent different types of portable information handling systems, such as a display device, a head-mounted display, a head-mounted display system, a smartphone, a tablet computer, a notebook computer, a media player, a digital camera, a two-in-one tablet-laptop combination computer, a wireless organizer, or other types of portable information handling systems. In one or more embodiments, the information handling system 100 can also represent other types of information handling systems, including desktop computers, server systems, controllers and microcontroller units, and other types of information handling systems. Components of the information handling system 100 can include, but are not limited to, a processor subsystem 120, which can include one or more processors; and a system bus 121 that communicatively couples various system components to the processor subsystem 120, including, for example, a memory subsystem 130, an I / O subsystem 140, local storage resources 150, and a network interface 160. The system bus 121 can represent various suitable types of bus structures, such as a memory bus, a peripheral bus, or a local bus using various bus architectures in selected embodiments. For example, such architectures may include, but are not limited to, Micro Channel Architecture (MCA) bus, Industry Standard Architecture (ISA) bus, Enhanced ISA (EISA) bus, Peripheral Component Interconnect (PCI) bus, PCI Express bus, HyperTransport (HT) bus, and Video Electronics Standards Association (VESA) local bus.

[0021] like Figure 1As depicted, processor subsystem 120 may include a system, device, or apparatus operable to interpret and / or execute program instructions and / or process data, and may include a microprocessor, a microcontroller, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), or another digital or analog circuit configured to interpret and / or execute program instructions and / or process data. In some embodiments, processor subsystem 120 may interpret and / or execute program instructions and / or process locally stored data (e.g., stored in memory subsystem 130 and / or another component of the information handling system). In the same or alternative embodiments, processor subsystem 120 may interpret and / or execute program instructions and / or process remotely stored data (e.g., stored in network storage resource 170).

[0022] Also in Figure 1 1. Memory subsystem 130 may include a system, device, or apparatus (e.g., a computer-readable medium) that can retain and / or retrieve program instructions and / or data over a period of time. Memory subsystem 130 may include random access memory (RAM), electrically erasable programmable read-only memory (EEPROM), a PCMCIA card, flash memory, magnetic storage devices, optical-magnetic storage devices, and / or a series and / or array of suitable volatile or nonvolatile memories that retain data after power is removed from their associated information handling system (such as system 100).

[0023] In information handling system 100, I / O subsystem 140 may include systems, devices, or apparatuses generally operable to receive data from and / or transmit data to / within information handling system 100. I / O subsystem 140 may represent, for example, various communication interfaces, graphics interfaces, video interfaces, user input interfaces, and / or peripheral interfaces. In various embodiments, I / O subsystem 140 may be used to support various peripheral devices, such as a touch panel, a display adapter, a keyboard, an accelerometer, a touch pad, a gyroscope, an IR sensor, a microphone, a sensor, or a camera or another type of peripheral device.

[0024] The information handling system 100 may also include a storage drive 190, such as a hard disk drive (HDD) or a solid state drive (SSD) card. The storage drive may have a form factor such as U.2 or E3.

[0025] The local storage resources 150 may include computer-readable media (e.g., a hard drive, a floppy disk drive, a CD-ROM, and / or other types of rotating storage media, flash memory, EEPROM, and / or another type of solid-state storage media) and are generally operable to store instructions and / or data. Similarly, the network storage resources may include computer-readable media (e.g., a hard drive, a floppy disk drive, a CD-ROM, and / or other types of rotating storage media, flash memory, EEPROM, and / or another type of solid-state storage media) and are generally operable to store instructions and / or data.

[0026] exist Figure 1 10. In some embodiments, the network interface 160 may be a suitable system, device, or apparatus operable to serve as an interface between the information handling system 100 and the network 110. The network interface 160 may enable the information handling system 100 to communicate over the network 110 using suitable transmission protocols and / or standards, including but not limited to those listed below in connection with the discussion of the network 110. In some embodiments, the network interface 160 may be communicatively coupled to the network storage resources 170 via the network 110. The network 110 may be a public network or a private (e.g., corporate) network. The network may be implemented as, or may be a portion of, a storage area network (SAN), a personal area network (PAN), a local area network (LAN), a metropolitan area network (MAN), a wide area network (WAN), a wireless local area network (WLAN), a virtual private network (VPN), an intranet, the Internet, or another suitable architecture or system that facilitates the transmission of signals, data, and / or messages (generally referred to as data). Network interface 160 may enable wired and / or wireless communication (eg, NFC or Bluetooth) to and / or from information handling system 100 .

[0027] In certain embodiments, network 110 may include one or more routers for routing data between client information handling systems 100 and server information handling systems 100. Devices on network 110 (e.g., client information handling systems 100 or server information handling systems 100) may be addressed by corresponding network addresses, including, for example, Internet Protocol (IP) addresses, Internet names, Windows Internet Name Service (WINS) names, domain names, or other system names. In certain embodiments, network 110 may include one or more logical groupings of network devices, such as, for example, one or more sites (e.g., customer sites) or subnets. As an example, a corporate network may include potentially thousands of offices or branches, each with its own subnet (or multiple subnets) containing many devices. One or more client information handling systems 100 may communicate with one or more server information handling systems 100 via any suitable connection, including, for example, a modem connection, a LAN connection including Ethernet, a broadband WAN connection including DSL, cable, Ti, T3, fiber optic, Wi-Fi, or a mobile network connection including GSM, GPRS, 3G, or WiMax.

[0028] The network 110 may transmit data using a desired storage and / or communication protocol, including, but not limited to, Fibre Channel, Frame Relay, Asynchronous Transfer Mode (ATM), Internet Protocol (IP), other packet-based protocols, Small Computer System Interface (SCSI), Internet SCSI (iSCSI), Serial Attached SCSI (SAS), or another transport operating with the SCSI protocol, Advanced Technology Attachment (ATA), Serial ATA (SATA), Advanced Technology Attachment Packet Interface (ATAPI), Serial Storage Architecture (SSA), Integrated Drive Electronics (IDE), and / or any combination thereof. The network 110 and its various components may be implemented using hardware, software, or any combination thereof.

[0029] In short, the storage drive 190 may include a capacitor module mounted on a housing of the storage drive 190. The capacitor module may provide power to the storage drive 190 during a power outage. The capacitor module is coupled to the storage drive 190 as a low-profile capacitor module, which can increase the available board space of the storage drive by minimizing or eliminating fasteners used for coupling.

[0030] Steering Figure 2 , Figure 2An environment 200 is shown that includes an information handling system 202. The information handling system 202 may include a storage drive 204 and a power supply 206. In some examples, the information handling system 202 is similar to Figure 1 In some examples, the storage drive 204 and the information handling system 100 may be connected to the storage drive 204. Figure 1 The storage drive 190 is the same or substantially the same as the storage drive 190.

[0031] The storage drive 204 may include a controller module 210, a power management module (PMIC) 212, a capacitor 214, a RAM (DRAM) component 216, and a flash (NAND) memory component 218. The controller module 210 may communicate with the power management module 212, the RAM component 216, and the flash memory component 218. The power management module 212 may communicate with the power supply 206, the controller module 210, and the capacitor 214.

[0032] The power source 206 may include batteries, an AC adapter, or both.

[0033] In short, the power supply 206 can provide power (energy) to the power management module 212 (or PMIC 212). During normal operation, the power management module 212 can manage the power provided by the power supply 206 to charge the capacitor 214. In addition, the controller module 210 can manage data storage between the RAM component 216 and the flash memory component 218. To this end, if the power from the power supply 206 is interrupted (e.g., an unexpected power outage), the power management module 212 can direct the power (energy) stored by the capacitor 214 to the controller module 210 (e.g., tens of milliseconds of power). The controller module 210 can then perform a data backup (partial or full) of the data stored in the RAM component to be stored in the flash memory component 218. The capacitor 214 also provides power to the flash memory component 218.

[0034] Figure 3 A side view of the storage drive 204 is shown. The storage drive 204 may include a master module 302 and a capacitor module 304. The storage drive 204 may be any type of storage drive, including a solid-state drive (SSD) or hard disk drive (HDD) storage drive in a form factor such as U.2 and E3. The storage drive 204, and in particular the master module 302, may be coupled to a host backplane 306 (a server backplane or a storage backplane).

[0035] The storage drive 204 may further include a housing 350. The housing 350 may substantially surround the storage drive 204, and in particular the main module 302 and the capacitor module 304.

[0036] The main module 302 may include a main printed circuit board PCB 310. The main PCB 310 may include a first side 312 positioned opposite a second side 314. The main module 302 may also include a flash memory component 218. The flash memory component 218 may be positioned on the main PCB 310 at a first end 320 of the storage drive 204. The flash memory component 218 may be positioned on the first side 312 and / or the second side 314 of the main PCB 310.

[0037] The main module 302 may further include a controller module 210. The controller module 210 may be positioned on the main PCB 310 at a second end 322 of the storage drive 204. The second end 322 of the storage drive 204 is opposite the first end 320 of the storage drive 204. Furthermore, the controller module 210 is positioned on a first side 312 of the main PCB 310. Furthermore, the controller module 210 may contact a housing contact 326 to thermally control the controller module 210.

[0038] The main module 302 may also include a RAM component 216. The RAM component 216 may be positioned on the main PCB 310 at the second end 322 of the storage drive 204. The RAM component 316 may be positioned on the first side 312 and / or the second side 314 of the main PCB 310.

[0039] The main module 302 may also include a power management module 212. The power management module 212 may be positioned on the main PCB 310 and on a second side 314 of the main PCB 310.

[0040] The capacitor module 304 can include a module printed circuit board PCB 360. The module PCB 360 can include a first side 362 positioned opposite a second side 364. The module PCB 360 can be positioned at the first end 320 of the storage drive 204. Figure 4 A portion of housing 350 including capacitor module 304 is shown.

[0041] The capacitor module 304 may also include capacitors 214. The capacitors 214 may be positioned on the module PCB 360 and on the first side 362 of the module PCB 360. In some examples, the capacitors 214 may face the flash memory element 218 positioned on the first side 312 of the main PCB 310. For example, the capacitors 214 may include 20 to 30 capacitors (e.g., 7.3 mm x 6.1 mm) with a total capacitance of up to 3000 microfarads (uF).

[0042] The capacitor module 304 may also include a signal connector 380. The signal connector 380 may be positioned on the first side 362 of the capacitor module 304. The signal connector 380 may connect the capacitor module 304 to the main module 302 to transmit signals between the capacitor module 304 and the main module 302. Specifically, the main module 302 may also include a complementary signal connector 382 positioned on the first side 312 of the main PCB 310. The signal connector 380 may be coupled to the complementary signal connector 382 to transmit signals between the capacitor module 304 and the main module 302. In some examples, the signal connector 380 includes a plurality of pins that directly contact pads of the complementary signal connector 382 on the main PCB 310. In some examples, the signal connector 380 includes a wire having a connector that contacts the complementary signal connector 382 on the main PCB 310. In some examples, the signals transmitted between the capacitor module 304 and the main module 302 include a ground signal and a storage signal.

[0043] To this end, the capacitor module 304 is coupled to the main module 302 within the housing 350. In other words, the housing 350 includes both the main module 302 and the capacitor module 304, such that the capacitor module 304 is coupled to the main module 302. Furthermore, within the housing 350, the first side 362 of the capacitor module 304 can face the first side 312 of the main module 302. That is, when the capacitor module 304 is coupled to the main module 302, the capacitor module 304 is positioned at the first end 320 of the storage drive 204, and further, the first side 362 of the capacitor module 304 faces the first side 312 of the main module 302. Additionally, the capacitor 214 can be positioned proximate to the main module 302, proximate to the first side 312 of the main PCB 310, and proximate to the flash memory component 218. Furthermore, the capacitor module 304 can be mounted on (and coupled to) the housing 350 independently of the fasteners / coupling to the main PCB 310. That is, capacitor module 304 does not take up space on main PCB 310, or fasteners take up space on main PCB 310 coupling capacitor module 304 to main module 302 and / or housing 350. In other words, the coupling between capacitor module 304 and main module 302 is offloaded to housing 350.

[0044] The subject matter disclosed above is to be considered illustrative and not restrictive, and the appended claims are intended to cover all such modifications, enhancements, and other embodiments that fall within the true spirit and scope of the disclosure. Thus, to the maximum extent allowed by law, the scope of the present disclosure is to be determined by the broadest permissible interpretation of the appended claims and their equivalents, and shall not be restricted or limited by the foregoing detailed description.

[0045] As used herein, "or" is inclusive, not exclusive, unless expressly indicated otherwise or the context indicates otherwise. Thus, herein, "A or B" means "A, B, or both," unless expressly indicated otherwise or the context indicates otherwise. Furthermore, "and" is both conjunctive and several, unless expressly indicated otherwise or the context indicates otherwise. Thus, herein, "A and B" means "A and B jointly or severally," unless expressly indicated otherwise or the context indicates otherwise.

[0046] The scope of the present disclosure encompasses all changes, substitutions, variations, alterations and modifications to the exemplary embodiments described or illustrated herein that would be conceived by a person of ordinary skill in the art. The scope of the present disclosure is not limited to the exemplary embodiments described or illustrated herein. In addition, although the present disclosure describes and illustrates various embodiments herein as including specific parts, elements, features, functions, operations or steps, any of these embodiments may include any combination or arrangement of parts, elements, features, functions, operations or steps described or illustrated anywhere herein that would be conceived by a person of ordinary skill in the art. References in the appended claims to a device or system or a component of a device or system that is adapted to, arranged to, capable of, configured to, enabled to, operable to or operated to perform a specific function encompass the device, system, component, whether or not the device, system, component or the specific function is activated, turned on or unlocked, as long as the device, system or component is adapted to, arranged to, capable of, configured to, enabled to, operable to or operated to perform a specific function.

Claims

1. A storage drive comprising: The main module includes: a main printed circuit board PCB having a first side positioned opposite to a second side; a flash memory component positioned on the main PCB at a first end of the storage drive; a controller module positioned on the main PCB at a second end of the storage drive opposite the first end; and A capacitor module comprising: a module printed circuit board PCB having a first side positioned opposite a second side; a plurality of capacitors positioned on the module PCB and on the first side of the module PCB, The capacitor module is coupled to the main module such that the capacitor module is positioned at the first end of the storage drive and a first side of the capacitor module faces a first side of the main module.

2. The storage drive of claim 1, wherein the storage drive is a solid state drive (SSD) storage drive.

3. The storage drive of claim 1, wherein the capacitor module further comprises a signal connector positioned on the first side of the capacitor module, the signal connector connecting the capacitor module to the main module to transmit signals between the capacitor module and the main module. 4 . The storage drive of claim 3 , wherein the signal connector comprises a plurality of pins that directly contact pads of the main module.

5. The storage drive of claim 3, wherein the signal connector comprises a wire having a connector. 6 . The storage drive of claim 1 , wherein the flash memory component is positioned on the first side and the second side of the main PCB. 7 . The storage drive of claim 6 , wherein the plurality of capacitors face the flash memory element positioned on the first side of the main PCB. 8 . The storage drive of claim 1 , wherein the controller module is positioned on the first side of the main PCB.

9. An information processing system comprising: processor; a memory medium storing instructions executable by the processor to perform operations; A storage drive comprising: The main module includes: a main printed circuit board PCB having a first side positioned opposite to a second side; a flash memory component positioned on the main PCB at a first end of the storage drive; a controller module positioned on the main PCB at a second end of the storage drive opposite the first end; and A capacitor module comprising: a module printed circuit board PCB having a first side positioned opposite a second side; a plurality of capacitors positioned on the module PCB and on the first side of the module PCB, The capacitor module is coupled to the main module such that the capacitor module is positioned at the first end of the storage drive and a first side of the capacitor module faces a first side of the main module.

10. The information handling system of claim 9, wherein the storage drive is a solid state drive (SSD) storage drive.

11. The information handling system of claim 9, wherein the capacitor module further comprises a signal connector positioned on the first side of the capacitor module, the signal connector connecting the capacitor module to the main module to transmit signals between the capacitor module and the main module. 12 . The information handling system of claim 11 , wherein the signal connector comprises a plurality of pins that directly contact pads of the main module.

13. The information handling system of claim 11, wherein the signal connector comprises an electrical wire having a connector.

14. The information handling system of claim 9, wherein the flash memory component is positioned on the first side and the second side of the main PCB.

15. The information handling system of claim 14, wherein the plurality of capacitors face the flash memory element positioned on the first side of the main PCB.

16. The information handling system of claim 9, wherein the controller module is positioned on the first side of the main PCB.

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