Automatic assembly process for thin film capacitors

Abstract

The application discloses a kind of automatic assembly processes of thin film capacitor, it belongs to the technical field of thin film capacitor assembly process, it discloses a kind of new technology of thin film capacitor assembly of carrier tape, compared with traditional paper tape type thin film capacitor assembly process, the technical scheme has the advantages such as carrier tape reusable, wire positioning precision is high, processing equipment structure is simple;Can effectively reduce production equipment cost and processing cost.Further, the application also discloses the key technology of wire automatic braiding in the automatic assembly process of thin film capacitor carrier tape;And discloses a kind of wire braiding mechanism combined with machine-electricity-gas;Solve the technical scheme of realizing carrier tape punching, wire punching braiding under the same station;Effectively avoid the high-precision positioning requirement of carrier tape fast movement under different station assembly working condition.So, the application solves the technical problem of how to improve the automatic assembly efficiency of thin film capacitor.

Description

Technical Field

[0001] This invention relates to the technical field of thin-film capacitor assembly processes, and in particular to an automated thin-film capacitor assembly process. Background Technology

[0002] Film capacitors, as a type of high-performance capacitor, possess key characteristics such as non-polarity, high insulation resistance, wide frequency response, and low dielectric loss. With the rapid development of the IT industry in recent years, the market demand for film capacitors has been increasing. Furthermore, their size is trending towards miniaturization; and due to competition in the capacitor market, their selling price is continuously decreasing, thus putting pressure on reducing processing costs.

[0003] Despite my country's large-scale capacitor production, high-performance capacitors, especially those resistant to high temperatures, medium and high voltage, and large capacitance, still need to be imported. In safety-sensitive applications, such as frequency converters, OEMs still rely on imported capacitors. In fact, according to my country's electronics trade statistics, capacitors are the third largest category of electronic products with the largest trade deficit.

[0004] Traditional film capacitor manufacturing has a low level of automation, with many processes relying on manual labor, resulting in low production efficiency and inconsistent capacitor quality. In recent years, with intensified competition in the capacitor market, rising raw material and labor costs, and declining selling prices, the profit margin of the capacitor industry has plummeted. This forces companies to continuously improve production equipment to increase efficiency, product quality, and reduce costs. However, due to China's lagging equipment manufacturing capabilities compared to European countries, a large number of capacitors and their assembly equipment are imported. Currently, major film capacitor manufacturers include Siemens (Germany) and Panasonic (Japan). These companies primarily develop their own film capacitor production equipment, selling specialized devices with closed structures, highly confidential technology, and high prices. Most current film capacitor production equipment uses rotary indexing and positioning technology, with a typical processing speed of 60 capacitors per minute, although some large international R&D companies can achieve speeds of 100 capacitors per minute.

[0005] For example, Chinese patent CN102290236B discloses a method for gold spraying on a thin-film capacitor, which includes the following steps: (1) clamping the capacitor core package with a fixture; (2) moving the capacitor core package under the spray gun and adjusting the distance between the end face of the capacitor core package and the spray gun; (3) spraying gold on one end face of the capacitor core package; (4) repeating the above steps to spray gold on the other end face of the capacitor core package. The patent also discloses a device for gold spraying on a thin-film capacitor, which includes a fixture and a spray gun. The fixture is mainly composed of two arc-shaped blocks; the fixture is connected to a horizontal moving device; and the spray gun is connected to a vertical moving device. Using the above process, it is only necessary to clamp the capacitor core package with a fixture and adjust the distance between the spray gun and the capacitor core package to perform gold spraying. The process is very simple; and the distance between the spray gun and the capacitor core package is fixed throughout the gold spraying process, so the gold spraying is uniform.

[0006] Furthermore, Chinese patent CN105590751B also discloses a manufacturing process for a shielded organic thin-film capacitor. This process includes: winding a capacitor element using a capacitor winding machine; after forming the capacitor body, winding 1-2 layers of metal foil around the outer ring of the capacitor body and sealing the opening to form the capacitor element; spraying metal onto the left and right ends of the formed capacitor element using a gold spraying machine to form a gold spray layer of a certain thickness at both ends of the capacitor element; welding the gold spray layer to lead out inner and outer electrodes from the capacitor element; inserting it into a plastic shell or wrapping it with insulating tape; and encapsulating the plastic shell or the outer layer of insulating tape with epoxy resin to obtain the organic thin-film capacitor. The shielded organic thin-film capacitor manufactured using the above process has the function of effectively shielding circuit radiation interference. In circuits with high-frequency interference signals, it can bypass high-frequency interference signals. Furthermore, its compact structure and small size make it suitable as a high-frequency bypass capacitor, meeting the high reliability requirements of overall miniaturized equipment.

[0007] Based on current market demands and technological advancements, research on film capacitor assembly equipment primarily focuses on specialized devices or individual process steps, with little development of equipment or processes specifically designed for the entire film capacitor assembly process. This results in excessively large and cumbersome film capacitor assembly production lines. Therefore, improving traditional film capacitor assembly processes to create more compact assembly lines is a primary and pressing research issue. Secondly, current equipment for the lead-core welding process in film capacitors mostly employs a rotary indexing multi-station positioning method. This method has low efficiency in lead-core welding, averaging only about 60 capacitors per minute, and the welding quality is inconsistent. Therefore, changing the traditional lead-core welding method to increase the output of film capacitors per unit time while ensuring capacitor quality becomes a crucial problem that must be solved. Furthermore, most film capacitor manufacturing equipment currently uses manual methods to braid the welded film capacitors with paper tape to complete the next process. The manual involvement and the one-time use of a large amount of paper tape have inadvertently increased the production cost of the product. How to reduce the cost of film capacitor products as much as possible is an urgent issue to be considered.

[0008] For details, please refer to Figure 1 , Figure 1 The process flow diagram shown is a summary of the existing film capacitor manufacturing processes. Figure 1 It is known that existing film capacitor manufacturing processes generally include: winding, hot pressing, heating and shrinking, protective packaging, metallization, welding, assembly, impregnation, testing and marking, and tape packaging. Traditional film capacitor processing often involves manually packaging the welded film capacitors with paper tape after the wire-core welding process, allowing them to continue with subsequent processes. However, the large-scale single-use of paper tape increases the product's material costs. Summary of the Invention

[0009] Therefore, it is necessary to provide an automated assembly process for thin-film capacitors to address the technical issue of how to improve the efficiency of automated assembly.

[0010] An automated assembly process for thin-film capacitors includes the following steps:

[0011] S1: Core winding and metallization: The metallization film is rolled into a capacitor core according to the preset specifications; then, after the hot pressing process, heating and shrinking process, and protective packaging process, a layer of zinc metal is sprayed onto both ends of the capacitor core through the metallization process to serve as lead electrodes.

[0012] S2: Carrier tape punching: The carrier tape punching unit completes the punching of the conductor holes on the carrier tape, preparing for the next process of conductor perforation and tape taping.

[0013] S3: Wire threading: The wire threading unit completes the process of threading and braiding wires onto a carrier tape with punched wire holes.

[0014] S4: Wire-Core Welding: The wire-core welding unit welds the wires to the capacitor core on the carrier tape with the wires braided.

[0015] S5: Shell-Core Assembly: The shell-core assembly unit assembles and connects the welded capacitor core to the shell;

[0016] S6: Epoxy Resin Injection and Curing: The epoxy resin injection and curing unit injects epoxy resin into the assembled capacitor housing; and the carrier belt introduces it into the tunnel oven for heating to accelerate the curing of the epoxy resin.

[0017] S7: Testing and Marking: The testing and marking unit uses measuring instruments to test the electrical performance of the cured capacitors and marks the capacitors after testing;

[0018] S8: Visual Inspection: The visual inspection unit uses a vision device to inspect the appearance of the capacitor;

[0019] S9: Counting, Packaging and Warehousing: The counting, packaging and warehousing unit counts, packages and warehousing finished capacitors that have completed testing and appearance inspection.

[0020] Specifically, the carrier tape has insulating properties and its operating temperature is not lower than 380°C.

[0021] Specifically, the carrier tape punching, wire threading, and wire-core welding are continuous processes; the carrier tape punching process is completed at station I, the wire threading process is completed at station II, and the wire-core welding process is completed at station III. The carrier tape is driven by a drive element through the carrier tape drive positioning hole to achieve feeding and positioning at different stations.

[0022] Specifically, after the conductor hole punching is completed, the carrier tape is fed to the next station to complete the conductor perforation and tape braiding.

[0023] Specifically, after the punching of the conductor holes is completed, the conductor is perforated and taped at the same workstation.

[0024] Specifically, the carrier tape deformation mechanism is used to arch and deform the carrier tape, so that the two wire holes on the same straight line on the carrier tape are symmetrical in space to achieve wire perforation.

[0025] Specifically, the template is designed with guide holes for wire perforation under the deformation of the carrier tape; so that after the carrier tape is deformed, the wire carrier hole and the guide hole for wire perforation coincide, thereby ensuring that the wire passes smoothly through the wire carrier hole along the guide hole to achieve tape taping.

[0026] Specifically, the template under the deformation of the carrier belt consists of two completely symmetrical templates that can be separated and joined. The separation and joining of the templates is achieved by pneumatic fingers.

[0027] Specifically, in the punching lower die mechanism, the die is fixed to the die fixing seat by screws for easy disassembly; the die is a straight-edged die.

[0028] Specifically, in the punching die mounting structure, a wide-type air gripper is used to realize the opening and closing movement of the punching die; during punching, the wide-type air gripper drives the punching die to close, and the punching punch moves relative to each other to realize the punching of the wire carrier hole; after punching is completed, the wide-type air gripper drives the punching die to separate, and the upper and lower templates move relative to each other to realize the deformation of the carrier strip.

[0029] In summary, this invention discloses a novel carrier tape-based automatic assembly process for film capacitors. Compared with the traditional paper tape-based film capacitor assembly process, this technology offers advantages such as reusable carrier tape, high wire positioning accuracy, and simple processing equipment structure, effectively reducing production equipment and processing costs. Furthermore, this invention also reveals key technologies for automatic wire taping in the carrier tape-based automatic assembly process for film capacitors. To achieve rapid and accurate wire taping and perforation, it proposes implementation schemes for wire hole punching, carrier tape arching deformation, and wire taping and perforation. It also discloses a mechatronics-electrical-pneumatic wire taping mechanism, solving the technical problem of achieving carrier tape punching and wire taping and perforation at the same workstation. It effectively avoids the high-precision positioning requirements for rapid carrier tape movement under different workstation assembly conditions. It achieves accurate wire hole punching, carrier tape arching deformation, and wire taping and perforation in an economical and simple structure, and can control the speed matching between each action to ensure coordinated completion. Therefore, this invention's automatic assembly process for film capacitors solves the technical problem of how to improve the efficiency of automatic assembly of film capacitors. Attached Figure Description

[0030] Figure 1 This is a flowchart of the existing thin-film capacitor manufacturing process;

[0031] Figure 2 This is a process flow diagram of the automatic assembly process for thin-film capacitors according to the present invention;

[0032] Figure 3 This is a structural block diagram of the film capacitor assembly equipment used in the automatic film capacitor assembly process of the present invention.

[0033] Figure 4This is a flowchart illustrating the automated assembly process of the thin-film capacitor of the present invention.

[0034] Figure 5 This is a schematic diagram of the carrier tape punching process in the automatic assembly process of the thin film capacitor of the present invention;

[0035] Figure 6 This is a schematic diagram of a scheme for the rapid perforation and taping of wires in the automatic assembly process of thin-film capacitors according to the present invention.

[0036] Figure 7 This is a schematic diagram of Scheme 2 for the automatic assembly process of thin-film capacitors of the present invention, which involves rapid perforation and tape taping of wires.

[0037] Figure 8 This invention provides a carrier tape deformation scheme for the rapid perforation and taping of wires in the automatic assembly process of thin-film capacitors.

[0038] Figure 9 This is a schematic diagram of the punching die mounting structure used in the automatic assembly process of thin-film capacitors for rapid wire perforation and tape taping of the present invention.

[0039] Figure 10 This is a schematic diagram of the carrier tape punching and deformation composite mechanism used in the automatic assembly process of thin film capacitors of the present invention for rapid perforation and braiding of wires;

[0040] Figure 11 This is a schematic diagram of the wire perforation and tape-tapping mechanism used in the automatic assembly process of thin-film capacitors of the present invention.

[0041] Figure 12 This is a schematic diagram of the wire rapid perforation and taping mechanism used in the automatic assembly process of thin-film capacitors of the present invention;

[0042] Figure 13 This is a schematic diagram of the core-wire automatic assembly system of the thin-film capacitor automatic assembly process of the present invention. Detailed Implementation

[0043] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0044] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0045] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0046] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0047] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0048] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0049] Please see Figure 2 The automatic assembly process for thin-film capacitors of the present invention includes the following steps:

[0050] S1: Core winding and metallization: The metallization film is wound into a capacitor core according to the preset size and other specifications; then, after the hot pressing process, heating and shrinking process, and protective packaging process, a layer of zinc metal is sprayed onto both ends of the capacitor core through the metallization process to serve as lead electrodes.

[0051] S2: Carrier tape punching: The carrier tape punching unit completes the punching of the conductor holes on the carrier tape, preparing for the next process of conductor perforation and tape taping.

[0052] S3: Wire threading: The wire threading unit completes the process of threading and braiding wires onto a carrier tape with punched wire holes.

[0053] S4: Wire-Core Welding: The wire-core welding unit welds the wires to the capacitor core on the carrier tape with the wires braided.

[0054] S5: Shell-Core Assembly: The shell-core assembly unit assembles and connects the welded capacitor core to the shell;

[0055] S6: Epoxy Resin Injection and Curing: The epoxy resin injection and curing unit injects epoxy resin into the assembled capacitor housing; and the carrier belt introduces it into the tunnel oven for heating to accelerate the curing of the epoxy resin.

[0056] S7: Testing and Marking: The testing and marking unit uses measuring instruments to test the electrical performance of the cured capacitors and marks the capacitors after testing;

[0057] S8: Visual Inspection: The visual inspection unit uses a vision device to inspect the appearance of the capacitor;

[0058] S9: Counting, Packaging and Warehousing: The counting, packaging and warehousing unit counts, packages and warehousing finished capacitors that have completed testing and appearance inspection.

[0059] Specifically, the carrier tape used above should have good insulation properties, an operating temperature of up to 380℃, and be reusable. (Comparison) Figure 1 As can be seen, the automatic assembly process for thin-film capacitors of this invention is a carrier tape-based assembly process. Its biggest difference from traditional thin-film capacitor assembly processes lies in the introduction of a carrier tape, serving as the carrier for the entire assembly system, before the wire-core soldering process. The introduction of this carrier tape completely changes the traditional thin-film capacitor assembly method. Furthermore, the carrier tape-based assembly technology for thin-film capacitors has the following advantages:

[0060] 1. The introduction of carrier tape makes the entire thin-film capacitor assembly line an organic whole, making the various parts of the assembly equipment more compact;

[0061] 2. The wire mounting holes punched on the carrier tape ensure the spacing accuracy of the thin film capacitor conductors from the beginning of processing and improve the welding quality of the wires and cores.

[0062] 3. The introduction of carrier tape transforms the traditional method of multi-station film capacitor assembly using rotary indexing positioning into a linear feed positioning method, thereby increasing the output of film capacitors per unit time.

[0063] 4. From a cost perspective, in the traditional method of braiding film capacitors using paper tape, the paper tape is a disposable material; while the carrier tape used in the automatic assembly process of film capacitors in this invention can be reused, thereby saving the cost of production materials.

[0064] For further details, please refer to Figure 3 An assembly device capable of implementing the automated assembly process for thin-film capacitors according to the present invention has the following overall structural block diagram: Figure 3 As shown. By Figure 3It is understood that, to achieve the aforementioned process steps, this type of equipment should structurally include four main parts: a drive element, a working mechanism, a transmission mechanism, and an automatic control device system. Based on the characteristics of the automatic assembly process for thin-film capacitors according to this invention, the structure of the thin-film capacitor assembly equipment can be divided into the following ten parts: a carrier tape feeding device, a carrier tape punching mechanism, a wire threading mechanism, a wire-core welding mechanism, a shell-core assembly mechanism, an epoxy resin injection mechanism, a performance testing and marking mechanism, a counting and packaging mechanism, a control device, and a core conveying device. Among these, the carrier tape feeding device, carrier tape punching mechanism, wire threading mechanism, core conveying device, wire-core welding mechanism, shell-core assembly mechanism, epoxy resin injection mechanism, performance testing and marking mechanism, and counting and packaging mechanism are all working mechanisms. A working mechanism is a specialized mechanism that directly or with the aid of tools acts on the workpiece to change its position, state, properties, size, and shape. According to the nature of the work function performed by the working mechanism in the automatic machine, the working mechanism can be further divided into process operation mechanisms and auxiliary operation mechanisms.

[0065] Specifically, such as Figure 3 The nine working mechanisms shown are specialized mechanisms used to complete the assembly of thin-film capacitors. Auxiliary operating mechanisms include: a carrier tape feeding device and a core conveying device; process operating mechanisms include a carrier tape punching mechanism, a wire threading mechanism, a wire-core welding mechanism, a shell-core assembly mechanism, an epoxy resin injection mechanism, a performance testing and marking mechanism, and a counting and packaging mechanism. The driving elements selected in the automatic assembly process of thin-film capacitors in this invention are pneumatic components; these include linear cylinders and pneumatic grippers. Driving elements provide power for the working machines to perform processing and various movements. Commonly used driving elements in electronic product assembly equipment include electric motors, hydraulic components, and pneumatic components. The transmission mechanism is used to transmit power and motion from the driving elements to the working mechanisms. The function of the transmission mechanism is to adjust the speed of motion or change the form of motion, such as from rotational motion to oscillation or movement; that is, to convert continuous motion into periodic pulsation, etc. Since the automatic assembly process of thin-film capacitors in this invention uses pneumatic components; the linear motion characteristics of the cylinders eliminate the need for many transmission mechanisms in the mechanical structure of the equipment; therefore, the transmission devices can be incorporated into each working mechanism.

[0066] The special equipment disclosed in this invention's thin-film capacitor assembly process employs a pneumatic-electric control system. The automatic control device of the automatic working machine can be mechanical, hydraulic, pneumatic, electrical, or a combination thereof. Mechanical automatic working machines were the earliest type used, offering advantages such as reliable operation and ease of implementation; however, they also suffer from relatively complex structures. The latter types of automatic working machines are easier to automate than mechanical ones; therefore, their application in thin-film capacitor production processes with a high degree of automation is recommended. The process operations and auxiliary operations within the working mechanism can be completed automatically by the machine or with operator intervention. In existing thin-film capacitor assembly processes, some steps require operator intervention, resulting in low efficiency; however, the thin-film capacitor assembly equipment used in this invention's automatic assembly process is a fully automated working machine. Therefore, this equipment has the following characteristics: all process operations and auxiliary operations are automatically completed by the various components of the thin-film capacitor assembly equipment; the assembly equipment operates automatically according to a set process sequence, and its control device can perform cyclical control of the equipment's automatic operation.

[0067] Furthermore, in the automated assembly process of the thin-film capacitor of this invention, the core-wire automated assembly step is a key technical step. Please continue reading. Figure 4 , Figure 4 This is a flowchart illustrating the automated assembly process of the thin-film capacitors according to the present invention—specifically, the automated assembly process of the core. (Combined with...) Figure 4 and Figure 2 As can be seen, carrier tape punching, wire threading, and wire-core welding are continuous processes. The carrier tape punching process is completed at station I, the wire threading process at station II, and the wire-core welding process at station III. A drive element moves the carrier tape through the carrier tape drive positioning holes to achieve feed positioning at different stations. Punching the wire holes on the carrier tape is a technological challenge. A schematic diagram of carrier tape punching is shown below. Figure 5 As shown, in a specific embodiment, the carrier tape punching requires punching wire holes of 0.5 ± 0.02 mm on the carrier tape; and the lateral spacing of the wire holes and the spacing of the film capacitor wires are 4.98 to 5.68 mm. This places high demands on the mechanical performance of the punching device and the accurate positioning precision of the carrier tape under high-speed movement.

[0068] Specifically, wire braiding is a crucial step in the automated assembly process of the thin-film capacitors of this invention. It includes punching the wire carrier holes on the carrier tape and braiding the wires through the holes. The punching accuracy of the wire carrier holes themselves and the lateral spacing accuracy between two wire carrier holes are the main factors affecting the wire spacing accuracy of the thin-film capacitor. Whether the wires can pass through the wire carrier holes quickly and accurately determines the braiding process time and affects the overall efficiency of the thin-film capacitor assembly system. In traditional thin-film capacitor assembly systems, wire braiding is performed after the wire-core welding is completed; it is mostly done manually by pasting the thin-film capacitor onto paper tape using adhesive tape, and the disposable use of large amounts of adhesive and paper tape increases product costs. In this invention, wire braiding is performed before the wire-core welding, ensuring the welding quality of the thin-film capacitor; moreover, the wire braiding is fully automated, without manual intervention, thus improving production efficiency.

[0069] After the conductor holes on the carrier tape are punched, the conductors need to be threaded and braided. Efficient conductor threading requires two things: speed and accuracy. To achieve fast conductor threading and braiding, the actions of punching the conductor holes on the carrier tape and the conductor threading and braiding processes need to be optimally arranged. Two solutions are presented below: Solution 1: After the conductor holes are punched, the carrier tape is fed to the next station before the conductor threading and braiding are completed; for example... Figure 6 As shown. That is, the wire carrier hole punching is completed at station I. After punching, the carrier tape is fed to station II to complete the wire threading and tape bonding. Since there is a certain positioning error in each feed and positioning of the carrier tape, this increases the difficulty of accurately threading the wire; moreover, performing wire threading after the carrier tape has been fed and positioned increases unnecessary waste of movement and makes the system structure appear fragmented. Therefore, we will continue to reveal scheme two: after the wire carrier hole punching is completed, the wire threading and tape bonding are performed at the same station; such as Figure 7 As shown, in this scheme, the wire carrier hole punching and wire piercing and tape braiding are completed in the same station, which avoids the difficulties caused by the carrier tape feeding positioning error to the accurate piercing of the wire.

[0070] In efficient wire perforation technology, achieving accurate wire perforation requires designing a suitable mechanism that allows the wire to pass through a pair of wire holes on the same horizontal plane on a carrier tape. This is impossible in plane geometry. Therefore, we can consider how to achieve this technical requirement in three-dimensional space. When manually passing a wire through two wire holes on the same horizontal plane on a carrier tape, the usual practice is to use the thumb and forefinger of one hand to arch and deform the carrier tape, making the two wire holes symmetrical in space, while the other hand passes the wire through these two holes. This inspires automated wire perforation, which utilizes a carrier tape deformation mechanism to arch and deform the carrier tape, making the two wire holes on the same straight line symmetrical in space, thus achieving wire perforation. Therefore, after the wire hole punching mechanism completes the punching, a carrier tape deformation mechanism is needed to deform the carrier tape to facilitate the wire perforation and braiding mechanism. The wire hole punching mechanism, carrier tape deformation mechanism, and wire perforation and braiding mechanism are collectively referred to as the wire braiding mechanism. Thus, in... Figure 8 This paper discloses a carrier tape deformation mechanism, which includes: a carrier tape deformation upper template connector 11, a carrier tape deformation upper template 12, a carrier tape 13, a wire perforation guide hole 14, a carrier tape deformation lower template 15, and a pneumatic finger 16. In this mechanism, the relative movement of the upper and lower templates causes the carrier tape to deform. To ensure that the wire perforations are completely symmetrical in space after deformation, the design places the wire perforations on the deformed carrier tape against the lower template on a vertical plane, thus preventing deformation of the wire perforations. The purpose of carrier tape deformation is to ensure accurate wire perforation; therefore, a wire perforation guide hole is designed on the lower template. After deformation, the wire perforations coincide with the wire perforation guide hole, ensuring that the wire smoothly passes through the wire perforation guide hole to achieve tape weaving. Furthermore, to ensure the carrier tape deformation mechanism can smoothly reposition itself after successful tape winding for the start of the next punching cycle, the carrier tape deformation lower template is designed as two completely symmetrical templates that can be separated and joined. The separation and joining of the templates is driven by pneumatic fingers. Figure 8 In the carrier tape deformation scheme shown, two pairs of pneumatic fingers are used to realize the closing motion of the template under carrier tape deformation, which can increase the number of wires braided per unit time.

[0071] Furthermore, to ensure accurate and rapid tape bonding of the conductors, the conductor punching and perforation on the carrier tape are completed in a single station. That is, conductor perforation and tape bonding occur immediately after punching. This places demands on the functionality of the carrier tape punching and deformation composite mechanism: how to achieve the conversion between carrier tape punching and deformation functions. To enable carrier tape deformation in the same station after punching, the carrier tape punching die mounting structure is designed as a detachable motion mechanism, such as... Figure 9 As shown. Figure 9The punching die mounting structure shown includes a punching die 21, a die fixing seat 22, and a wide pneumatic gripper 23. Considering the tendency of the die to wear and fail, the die is designed as a replaceable die plate. The lower die plate mechanism uses a common die fixing method, fixing the die to the die fixing seat with screws for easy disassembly. The die is designed as a straight-edged die with high cutting edge strength; the working part dimensions remain unchanged after grinding. A wide pneumatic gripper is introduced into the punching die mounting structure to realize the opening and closing motion of the punching die. During punching, the wide pneumatic gripper drives the punching die to close, and the punching punch moves relative to it to achieve punching of the wire carrier hole. After punching, the wide pneumatic gripper drives the punching die to open, and the upper and lower die plates move relative to it to achieve deformation of the carrier strip.

[0072] Furthermore, both the carrier tape punching and deformation processes are achieved through the relative movement of the upper and lower punching and deformation templates, respectively. For a compact system structure, the upper punching and deformation templates can share a single power element. A modular design approach can be used for the design of the composite upper template for carrier tape punching and deformation. Two cylinders, a rodless cylinder and a thin cylinder, can be used as motion modules to achieve the X and Y degrees of freedom, respectively. The rodless cylinder's X-axis movement enables the functional switching between the upper template for carrier tape punching and deformation, while the thin cylinder's Y-axis movement enables the vertical downward movement and reset of the upper template. These two cylinders can be assembled like building blocks using simple mechanical connectors to complete the required actions. The revealed composite upper template for carrier tape punching and deformation features high integration, convenient assembly, compact structure, and simple control. Therefore, please continue reading... Figure 10 ,like Figure 10 As shown, from top to bottom, the structure consists of a carrier strip punching and deformation composite upper template mechanism 31, a carrier strip punching lower template mechanism 32, and a carrier strip deformation lower template mechanism 33. In the design of the carrier strip deformation lower template mechanism, for structural simplicity and to ensure accurate movement of the lower template, it is recommended to use a series of thin-type cylinders with guide rods that do not rotate on the piston rod.

[0073] Furthermore, after completing the punching of the conductor mounting holes and the deformation of the carrier tape, the perforation and braiding of the conductors needs to be completed. This invention uses two conductors fed at a time for braiding to increase the amount of conductors braided per unit time, thereby increasing the overall number of thin-film capacitors processed in the system; specifically as follows... Figure 11 As shown. Figure 11The wire piercing and taping mechanism shown includes: a support 41, a wire clamping cylinder 42, a wire clamping block 43, a wire 44, a wire cutting upper die 45, a wire cutting lower die 46, a wire cutting cylinder 47, and a wire conveying cylinder 48. The mechanism operates as follows: after receiving a valid deformation signal from the carrier tape, the wire conveying cylinder drives the wire clamping mechanism to move along the axial direction to feed the wire. The wire clamping mechanism consists of a wire clamping cylinder, a wire clamping block, and a wire clamping support. When the wire conveying cylinder is in its reset state, the wire clamping cylinder clamps the wire. After the wire conveying cylinder delivers the wire to its position, the wire cutting cylinder drives the wire cutting upper die to move along the Z-axis to cut the wire. After the wire is cut, the wire cutting cylinder resets, the wire clamping cylinder drives the wire clamping block to move upwards along the Z-axis to release the wire, and the wire conveying cylinder then resets the mechanism to prepare for the next wire feed.

[0074] For further information, please refer to [link / reference]. Figure 12 Based on the foregoing, the overall scheme of the wire feeding and taping mechanism is as follows: Figure 12 As shown; part A is the wire perforation and tape-tapping mechanism; part B is the carrier tape punching and deformation composite mechanism. Combined with... Figure 13 In the automatic assembly process of the thin-film capacitor of this invention, the overall process of lead welding of the wire taping machine is as follows: Before the system starts working, each cylinder is in the reset state. After the carrier tape is conveyed to the position and accurately positioned, the carrier tape punching lower template opening and closing cylinder drives the punching die to close; the carrier tape punching deformation function composite cylinder drives the punching punch to achieve punching positioning; after the punching punch is positioned horizontally, it is driven vertically downward by the carrier tape punching upper template cylinder to achieve wire carrier hole punching; after the wire carrier hole punching is completed, the punching punch is reset in the vertical and horizontal directions respectively. At the same time as the punching punch is reset, the carrier tape punching lower template opening and closing cylinder drives the punching die to separate and reset; after each cylinder of the carrier tape punching mechanism is reset, the carrier tape deformation upper template moves downward to the position; at the same time, the carrier tape deformation lower template is driven by the carrier tape deformation lower template cylinder to achieve vertical upward movement; the carrier tape deformation lower template moves upward. After the carrier tape is successfully arched in place, the conductor clamping cylinder clamps the conductor and the conductor feeding cylinder feeds the conductor. When the conductor feeding cylinder reaches its horizontal position, the conductor cutting upper die moves vertically to cut the conductor. Simultaneously, the conductor clamping block moves vertically upward and is driven by the conductor feeding cylinder to reset horizontally, thus successfully completing the conductor braiding. After the conductor is cut, the conductor cutting upper die resets, and the carrier tape deformation lower die is driven by the carrier tape deformation lower die opening and closing cylinder to separate horizontally and reset vertically. Simultaneously, the carrier tape deformation upper die resets, and after the vertical reset is complete, the pneumatic gripper drives the carrier tape deformation lower die to close and reset. Thus, one cycle of conductor braiding is completed.

[0075] In summary, this invention discloses a novel carrier tape-based automatic assembly process for film capacitors. Compared with the traditional paper tape-based film capacitor assembly process, this technology offers advantages such as reusable carrier tape, high wire positioning accuracy, and simple processing equipment structure, effectively reducing production equipment and processing costs. Furthermore, this invention also reveals key technologies for automatic wire taping in the carrier tape-based automatic assembly process for film capacitors. To achieve rapid and accurate wire taping and perforation, it proposes implementation schemes for wire hole punching, carrier tape arching deformation, and wire taping and perforation. It also discloses a mechatronics-electrical-pneumatic wire taping mechanism, solving the technical problem of achieving carrier tape punching and wire taping and perforation at the same workstation. It effectively avoids the high-precision positioning requirements for rapid carrier tape movement under different workstation assembly conditions. It achieves accurate wire hole punching, carrier tape arching deformation, and wire taping and perforation in an economical and simple structure, and can control the speed matching between each action to ensure coordinated completion. Therefore, this invention's automatic assembly process for film capacitors solves the technical problem of how to improve the efficiency of automatic assembly of film capacitors.

[0076] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. An automated assembly process for thin-film capacitors, characterized in that, Includes the following steps: S1: Core winding and metallization: The metallization film is rolled into a capacitor core according to the preset specifications; then, after the hot pressing process, heating and shrinking process, and protective packaging process, a layer of zinc metal is sprayed onto both ends of the capacitor core during the metallization process to serve as lead electrodes. S2: Carrier tape punching: The carrier tape punching unit completes the punching of the conductor holes on the carrier tape, preparing for the next process of conductor perforation and tape taping. S3: Wire threading: The wire threading unit enables the wire to complete the perforation and braiding process on the carrier tape with punched wire holes; wherein, the punching of the wire holes and the wire perforation and braiding are completed in the same station; the carrier tape is arched and deformed by the carrier tape deformation mechanism so that the two wire holes on the same straight line on the carrier tape are symmetrical in space; the wire passes through the two spatially symmetrical wire holes in sequence from one side of the deformed carrier tape to realize the perforation and braiding; the carrier tape deformation mechanism includes a carrier tape deformation upper template (12), a detachable carrier tape deformation lower template (15), and a pneumatic finger (16) for driving the detachment and detachment of the carrier tape deformation lower template; a wire perforation guide hole (14) is provided on the carrier tape deformation lower template (15); after the carrier tape is deformed, the wire holes and the wire perforation guide hole coincide; S4: Wire-Core Welding: The wire-core welding unit welds the wires to the capacitor core on the carrier tape with the wires braided. S5: Shell-Core Assembly: The shell-core assembly unit assembles and connects the welded capacitor core to the shell; S6: Epoxy Resin Injection and Curing: The epoxy resin injection and curing unit injects epoxy resin into the assembled capacitor housing; and the carrier belt introduces it into the tunnel oven for heating to accelerate the curing of the epoxy resin. S7: Testing and Marking: The testing and marking unit uses measuring instruments to test the electrical performance of the cured capacitors and marks the capacitors after testing; S8: Visual Inspection: The visual inspection unit uses a vision device to inspect the appearance of the capacitor; S9: Counting, Packaging and Warehousing: The counting, packaging and warehousing unit counts, packages and warehousing finished capacitors that have completed testing and appearance inspection.

2. The automatic assembly process for a thin-film capacitor according to claim 1, characterized in that: Carrier tape punching, wire threading, and wire-core welding are continuous processes. The carrier tape punching process is completed at station I, the wire threading process is completed at station II, and the wire-core welding process is completed at station III. The carrier tape is driven by a drive element through the carrier tape drive positioning hole to achieve feeding and positioning at different stations.

3. The automatic assembly process for a thin-film capacitor according to claim 1, characterized in that: After the conductor is punched, the carrier tape is fed to the next station to complete the perforation and tape bonding of the conductor.

4. The automatic assembly process for a thin-film capacitor according to claim 1, characterized in that: After the punching of the conductor holes is completed, the conductor is pierced and taped at the same station.

5. The automatic assembly process for a thin-film capacitor according to claim 1, characterized in that: In the punching die mechanism, the die is fixed to the die holder by screws for easy disassembly; the die is a straight-edged die.

6. The automatic assembly process for a thin-film capacitor according to claim 5, characterized in that: In the punching die mounting structure, a wide-type air gripper is used to realize the opening and closing movement of the punching die; during punching, the wide-type air gripper drives the punching die to close, and the punching punch moves relative to each other to realize the punching of the wire carrier hole; after punching is completed, the wide-type air gripper drives the punching die to open, and the upper and lower templates move relative to each other to realize the deformation of the carrier strip.

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