Carrier for through-hole reflow soldering equipment and through-hole reflow soldering equipment having the same.

Abstract

This invention provides a carrier for a through-hole reflow soldering machine and a through-hole reflow soldering machine having the same. The carrier includes: a carrier base, comprising a carrier substrate and a support frame, the support frame surrounding the edge of the carrier substrate and connected to the carrier substrate, the upper end of the support frame protruding upward from the upper surface of the carrier substrate, the carrier substrate having a through-hole ventilation hole, and a fixture mounting position provided at the upper end of the support frame; a sliding plate assembly, slidably covering the top of the carrier substrate, the support frame having a sliding plate passage through which the sliding plate assembly passes, the sliding plate assembly having a closed position that blocks the ventilation hole and an open position that avoids the ventilation hole. The technical solution provided by this application can solve the problem in related technologies where severe heat transfer between the upper and lower temperature zones of through-hole reflow soldering equipment damages components on non-soldering surfaces.

Description

Technical Field

[0001] This invention relates to the field of reflow soldering technology, and more specifically, to a carrier for a through-hole reflow soldering apparatus and a through-hole reflow soldering apparatus having the same. Background Technology

[0002] As electronic products continue to evolve towards miniaturization, lightweighting, and high density, PCB assembly structures have emerged that utilize both surface-mount components (SMCs) and surface-mount devices (SMDs) in a double-sided or mixed manner. Double-sided or mixed-assembly PCB assemblies typically involve reflow soldering the top (component side) and then wave soldering the bottom (lead side). With the rise of through-hole reflow soldering, it has replaced the previous reflow-then-wave soldering process and become an important technology in PCB mixed-assembly.

[0003] In related technologies, through-hole reflow soldering equipment uses a hot air pressure balance process to solder PCBs. The constituent materials of PCB components are different, and their thermal performance parameters, such as the coefficient of thermal expansion, vary greatly.

[0004] Therefore, in the related technology, when the through-hole reflow soldering equipment is used for PCB reflow soldering, the lack of physical insulation between the upper and lower temperature zones leads to severe heat transfer between the upper and lower temperature zones, resulting in poor temperature control. This results in poor heat insulation between the upper and lower layers of the PCB, causing thermal shock to the non-soldering components, leading to failure of electrical and physical connections between the components and the PCB, and ultimately causing the entire PCB assembly to fail. Summary of the Invention

[0005] This invention provides a carrier for a through-hole reflow soldering machine and a through-hole reflow soldering machine having the same, in order to solve the problem in related technologies where severe heat transfer between the upper and lower temperature zones of the through-hole reflow soldering machine causes damage to components on non-soldering surfaces.

[0006] According to one aspect of the present invention, a carrier for a through-hole reflow soldering equipment is provided. The carrier for the through-hole reflow soldering equipment includes: a carrier base, including a carrier substrate and a support frame, the support frame surrounding the edge of the carrier substrate and connected to the carrier substrate, the upper end of the support frame protruding upward from the upper surface of the carrier substrate, the carrier substrate having a through-hole ventilation hole, and the upper end of the support frame having a fixture mounting position; a sliding plate assembly slidably covering the top of the carrier substrate, the support frame having a sliding plate passage through which the sliding plate assembly passes, the sliding plate assembly having a closed position that blocks the ventilation hole and an open position that avoids the ventilation hole.

[0007] Furthermore, the carrier frame includes two guide mechanisms and two connecting mechanisms that are spliced ​​together. The two guide mechanisms are respectively located on the left and right sides of the carrier base plate, and the two connecting mechanisms are respectively located on the front and rear sides of the carrier base plate. A sliding guide structure is provided between the guide mechanisms and the sliding plate assembly.

[0008] Furthermore, the guiding mechanism includes a guide support plate and a guide rod disposed on the guide support plate. Both the guide support plate and the guide rod extend along the front-rear direction of the carrier base plate. The sliding plate assembly is provided with a guide rod sliding hole, and the guide rod passes through the guide rod sliding hole to form a sliding guiding structure.

[0009] Furthermore, the sliding plate assembly includes a sliding base plate and two sliding lugs respectively disposed on the left and right sides of the sliding base plate. The sliding base plate is slidably covered above the carrier base plate. Guide rod sliding holes are disposed on the sliding lugs. The sliding base plate is made of heat-insulating material.

[0010] Furthermore, the sliding plate assembly also includes a sliding pull plate, which is disposed on the side of the sliding base plate away from the carrier base plate, and the sliding pull plate and the sliding base plate are connected by a pull plate pin; and / or, the sliding lug is provided with a base plate clamping groove, the end of the sliding base plate is inserted into the base plate clamping groove, and the sliding lug and the sliding base plate are connected by a sliding lug pin.

[0011] Furthermore, the carrier for the through-hole reflow soldering equipment also includes a self-locking structure that limits the sliding plate assembly to the closed position, the self-locking structure being disposed between the guide mechanism and the sliding plate assembly.

[0012] Furthermore, the self-locking structure includes a lock head, a return spring, and a spring clamping sheet metal. A countersunk hole for the self-locking head is provided on the guide support plate. Both the lock head and the return spring are located inside the countersunk hole for the self-locking head. The spring clamping sheet metal covers the countersunk hole for the self-locking head and is connected to the guide support plate by a sheet metal pin. The lower end of the return spring abuts against the lock head, and the upper end of the return spring abuts against the lower surface of the spring clamping sheet metal. The lower end of the lock head protrudes downward from the countersunk hole for the self-locking head and engages with the sliding lug for limiting.

[0013] Furthermore, the connecting mechanism includes a connecting plate extending in the left-right direction along the carrier substrate, and a sliding plate passage is disposed at the lower end of the connecting plate.

[0014] Furthermore, the carrier base plate has a first pin hole, the guide support plate has a second pin hole, and the connecting plate has a third pin hole. The first pin hole, the second pin hole, and the third pin hole are coaxially arranged. The carrier assembly pin passes through the first pin hole, the second pin hole, and the third pin hole to connect the carrier base plate, the guide mechanism, and the connecting mechanism; and / or, the connecting plate is provided with a guide rod mounting hole, and the end of the guide rod is inserted into the guide rod mounting hole.

[0015] Furthermore, the fixture mounting position includes a first fixture assembly step and a second fixture assembly step. The first fixture assembly step is disposed on the upper end face of the guide support plate and includes a first fixture bearing surface and a first fixture limiting surface that are at an angle to each other. The second fixture assembly step is disposed on the upper end face of the connecting plate and includes a second fixture bearing surface and a second fixture limiting surface that are at an angle to each other. The lower surface of the product fixture rests on the first fixture bearing surface and the second fixture bearing surface, and the sidewalls of the product fixture abut against the first fixture limiting surface and the second fixture limiting surface, respectively.

[0016] Furthermore, the carrier substrate also includes a connection and fixing mechanism for connecting to a through-hole reflow soldering device. The connection and fixing mechanism is located below the carrier substrate and connected to the carrier substrate.

[0017] Furthermore, the connecting and fixing mechanism includes a connecting and fixing seat, the lower surface of which is provided with a conveying mechanism engagement step, and the upper surface of which is provided with a carrier substrate limiting groove; the connecting and fixing seat is connected to the carrier substrate through a fixing mechanism mounting pin, and the connecting and fixing seat is connected to the transmission mechanism of the reflow soldering equipment through a carrier mounting pin.

[0018] Furthermore, the carrier for the through-hole reflow soldering equipment includes two sliding plate assemblies, one of which is slidably mounted on the front side of the carrier base plate, and the other sliding plate assembly is slidably mounted on the rear side of the carrier base plate; the guide support plate is provided with a guide rod limiting hole for mounting a guide rod, and the guide support plate is also provided with a groove, the guide rod is located in the groove and passes through the guide rod limiting hole; the upper surface of the carrier base plate is provided with a connecting mechanism step, and the connecting mechanism is provided on the connecting mechanism step; the guide support plate has oil holes corresponding to the guide rods.

[0019] According to another aspect of the present invention, a through-hole reflow soldering apparatus is provided, including a carrier for the through-hole reflow soldering apparatus, wherein the carrier for the through-hole reflow soldering apparatus is the through-hole reflow soldering apparatus carrier provided above.

[0020] Applying the technical solution of this invention, the carrier for through-hole reflow soldering equipment includes a carrier base and a sliding plate assembly. When welding products using a hot air pressure balancing process, after placing the product in the fixture mounting position of the carrier base, the sliding plate assembly is pulled. Since the sliding plate assembly passes through the sliding plate passage, it slides horizontally away from the carrier base relative to the support frame, positioning the sliding plate assembly in an open position that avoids the ventilation holes. Hot air contacts the lower surface of the product through the ventilation holes on the carrier base, achieving product welding. When not welding the product, the sliding plate assembly is pushed. The sliding plate assembly slides horizontally towards the carrier substrate relative to the support frame, so that it covers the carrier substrate and blocks the ventilation holes. In other words, the sliding plate assembly is in the closed position, blocking the ventilation holes of the carrier substrate and thus isolating hot air. The sliding plate assembly provides physical heat insulation for the upper and lower temperature zones. The temperature control of the upper and lower temperature zones is easier and the furnace temperature is more stable when using the through-hole reflow soldering equipment of this invention. This allows components that are not resistant to high temperatures to be soldered on the through-hole reflow soldering equipment, solving the problem of severe heat transfer between the upper and lower temperature zones, which damages components on the non-soldering surface of the product. Attached Figure Description

[0021] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0022] Figure 1 A schematic diagram of the structure of a carrier for a through-hole reflow soldering equipment provided according to an embodiment of the present invention is shown;

[0023] Figure 2 An exploded view of a carrier for a through-hole reflow soldering apparatus provided according to an embodiment of the present invention is shown;

[0024] Figure 3 A schematic diagram of the carrier substrate of a through-hole reflow soldering equipment according to an embodiment of the present invention is shown;

[0025] Figure 4 A schematic diagram of the guiding mechanism of a carrier for a through-hole reflow soldering equipment provided according to an embodiment of the present invention is shown;

[0026] Figure 5 A schematic diagram of the connection mechanism of the carrier for a through-hole reflow soldering equipment provided according to an embodiment of the present invention is shown;

[0027] Figure 6 A schematic diagram of the structure of a sliding plate assembly of a carrier for a through-hole reflow soldering equipment provided according to an embodiment of the present invention is shown;

[0028] Figure 7A schematic diagram of the connection and fixing mechanism of the carrier for a through-hole reflow soldering equipment provided according to an embodiment of the present invention is shown;

[0029] Figure 8 A schematic diagram of the guide support plate structure of the guide mechanism of the carrier for through-hole reflow soldering equipment provided according to an embodiment of the present invention is shown;

[0030] Figure 9 A schematic diagram of the connecting plate of the connecting mechanism of the carrier for through-hole reflow soldering equipment provided according to an embodiment of the present invention is shown;

[0031] Figure 10 A schematic diagram of the sliding lug of a sliding plate assembly for a through-hole reflow soldering equipment according to an embodiment of the present invention is shown;

[0032] Figure 11 A schematic diagram of the connection fixing base of the connection fixing mechanism for the through-hole reflow soldering equipment provided in an embodiment of the present invention is shown;

[0033] Figure 12 A schematic diagram of the structure of a carrier, product fixture, and product for a through-hole reflow soldering equipment provided according to an embodiment of the present invention is shown.

[0034] Figure 13 A schematic diagram showing test data for the lower (welded surface) and upper (non-welded surface) layers of a conventional through-hole reflow soldering apparatus that does not employ this invention is presented.

[0035] Figure 14 A schematic diagram of test data for the lower (welding surface) and upper (non-welding surface) layers of the through-hole reflow soldering equipment using the present invention is shown.

[0036] The above figures include the following reference numerals:

[0037] 10. Carrier base; 11. Carrier base plate; 111. Ventilation hole; 112. Connecting mechanism step; 12. Bearing frame; 121. Fixture mounting position; 1211. First fixture assembly step; 1212. First fixture bearing surface; 1213. First fixture limiting surface; 1214. Second fixture assembly step; 1215. Second fixture bearing surface; 1216. Second fixture limiting surface; 122. Sliding plate passageway; 123. Guide 1231. Guide support plate; 1232. Guide rod limiting hole; 1233. Slide groove; 1234. Oil hole; 1235. Guide rod; 1236. Self-locking head countersunk hole; 1237. Sheet metal groove; 124. Connecting mechanism; 1241. Connecting plate; 1242. Guide rod mounting hole; 13. Connecting and fixing mechanism; 131. Connecting and fixing seat; 1311. Engaging step of conveying mechanism; 1312. Carrier base plate limiting groove;

[0038] 20. Sliding plate assembly; 21. Guide rod sliding hole; 22. Sliding base plate; 23. Sliding lug; 231. Base plate clamping groove; 24. Sliding pull plate;

[0039] 30. Sliding guide structure;

[0040] 41. Pull plate pin; 42. Sliding lug pin; 43. Sheet metal pin; 44. Fixing mechanism mounting pin; 45. Vehicle mounting pin; 46. Vehicle assembly pin;

[0041] 50. Self-locking structure; 51. Lock head; 53. Spring-loaded sheet metal;

[0042] 61. First pin hole; 62. Second pin hole; 63. Third pin hole; 64. Fourth pin hole; 65. Fifth pin hole; 66. Sixth pin hole; 67. Seventh pin hole; 68. Eighth pin hole;

[0043] 71. Product fixture; 72. Product; 73. Cotter pin;

[0044] S1, Temperature-time curve of the welding surface;

[0045] S2, Temperature-Time Curve of Non-Welded Surface. Detailed Implementation

[0046] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0047] like Figures 1 to 12 As shown, this embodiment of the invention provides a carrier for a through-hole reflow soldering equipment. The carrier includes a carrier base 10 and a sliding plate assembly 20. The carrier base 10 includes a carrier substrate 11 and a support frame 12. The support frame 12 surrounds the edge of the carrier substrate 11 and is connected to the carrier substrate 11. The upper end of the support frame 12 protrudes upward from the upper surface of the carrier substrate 11. The carrier substrate 11 has a through-hole ventilation hole 111. The upper end of the support frame 12 is provided with a fixture mounting position 121. The sliding plate assembly 20 is slidably covered above the carrier substrate 11. The support frame 12 is provided with a sliding plate passage 122 through which the sliding plate assembly 20 passes. The sliding plate assembly 20 has a closed position that blocks the ventilation hole 111 and an open position that avoids the ventilation hole 111.

[0048] Applying the technical solution of this invention, the carrier for the through-hole reflow soldering equipment includes a carrier base 10 and a sliding plate assembly 20. When welding the product 72 using a hot air pressure balancing process, after placing the product 72 in the fixture mounting position 121 of the carrier base 10, the sliding plate assembly 20 is pulled. Since the sliding plate assembly 20 passes through the sliding plate passage 122, the sliding plate assembly 20 slides horizontally away from the carrier base 11 relative to the support frame 12, so that the sliding plate assembly 20 is in an open position avoiding the ventilation hole 111. Hot air contacts the lower surface of the product 72 through the ventilation hole 111 on the carrier base 11, thereby achieving the welding of the product 72. When not welding the product 72, the sliding plate assembly is pushed. 20. The sliding plate assembly 20 slides horizontally relative to the support frame 12 towards the carrier substrate 11, so that the sliding plate assembly 20 covers the carrier substrate 11, thereby blocking the ventilation hole 111. That is, the sliding plate assembly 20 is in the closed position, blocking the ventilation hole 111 of the carrier substrate 11, thus isolating hot air. The sliding plate assembly 20 provides physical heat insulation for the upper and lower temperature zones. The temperature control of the upper and lower temperature zones using the through-hole reflow soldering equipment of the present invention is easier, and the furnace temperature is more stable. This allows components that are not resistant to high temperatures to be soldered on the through-hole reflow soldering equipment, solving the problem of severe heat transfer between the upper and lower temperature zones causing damage to components on the non-soldering surface of the product 72.

[0049] like Figure 1 , Figure 2 , Figure 4 as well as Figure 12 As shown, the support frame 12 includes two guide mechanisms 123 and two connecting mechanisms 124 spliced ​​together. The two guide mechanisms 123 are respectively disposed on the left and right sides of the carrier base plate 11, and the two connecting mechanisms 124 are respectively disposed on the front and rear sides of the carrier base plate 11. A sliding guide structure 30 is provided between the guide mechanisms 123 and the sliding plate assembly 20. With the above structure, when the sliding plate assembly 20 slides horizontally relative to the support frame 12, the sliding guide structure 30 between the guide mechanisms 123 and the sliding plate assembly 20 can guide the horizontal sliding of the sliding plate assembly 20. Furthermore, since the two guide mechanisms 123 are respectively disposed on the left and right sides of the carrier base plate 11, the sliding plate assembly 20 can smoothly slide back and forth in the horizontal direction relative to the support frame 12.

[0050] like Figure 1 and Figure 4As shown, the guiding mechanism 123 includes a guide support plate 1231 and a guide rod 1235 disposed on the guide support plate 1231. Both the guide support plate 1231 and the guide rod 1235 extend along the front-rear direction of the carrier base plate 11. The sliding plate assembly 20 is provided with a guide rod sliding hole 21, and the guide rod 1235 passes through the guide rod sliding hole 21 to form a sliding guide structure 30. With the above structure, when the sliding plate assembly 20 slides back and forth in the horizontal direction relative to the bearing frame 12, since the guide rod 1235 extends along the front-rear direction of the carrier base plate 11 and passes through the guide rod sliding hole 21, the sliding plate assembly 20 moves relative to the bearing frame 12 along the axial direction of the guide rod 1235, thereby ensuring the stability of the relative sliding of the sliding plate assembly 20.

[0051] like Figure 6 and Figure 12 As shown, the sliding plate assembly 20 includes a sliding base plate 22 and two sliding lugs 23 respectively disposed on the left and right sides of the sliding base plate 22. The sliding base plate 22 is slidably disposed on the top of the carrier base plate 11. Guide rod sliding holes 21 are disposed on the sliding lugs 23. The sliding base plate 22 is made of heat-insulating material. With the above structure, when the sliding plate assembly 20 is in the closed position, since the sliding base plate 22 is made of heat-insulating material, it can block the ventilation holes 111 of the carrier base plate 11, thus isolating hot air. Furthermore, by sliding the sliding lugs 23 on the guide rod 1235, the sliding plate assembly 20 can complete the transition between the open and closed positions.

[0052] like Figure 6 As shown, the sliding plate assembly 20 also includes a sliding pull plate 24, which is disposed on the side of the sliding base plate 22 away from the carrier base plate 11. The sliding pull plate 24 and the sliding base plate 22 are connected by a pull plate pin 41. With this structure, the sliding plate assembly 20 can slide relative to the carrier frame by pushing and pulling the sliding pull plate 24, allowing the sliding plate assembly 20 to switch between an open and closed position. Furthermore, when the sliding plate assembly 20 is in the closed position, because the sliding pull plate 24 is disposed on the side of the sliding base plate 22 away from the carrier base plate 11, hot air from the lower temperature zone can be prevented from contacting the product 72 through the gap between the sliding base plate 22 and the sliding plate passage 122, ensuring the effective isolation of hot air by the sliding plate assembly 20 when it is in the closed position. Moreover, the sliding pull plate 24 and the sliding base plate 22 are connected by a pull plate pin 41. In high-temperature operating environments, the pin connection has the advantage of higher connection reliability compared to a threaded connection, which can improve the reliability of the connection between the sliding pull plate 24 and the sliding base plate 22.

[0053] like Figure 10As shown, the sliding lug 23 is provided with a base plate clamping groove 231, and the end of the sliding base plate 22 is inserted into the base plate clamping groove 231. The sliding lug 23 and the sliding base plate 22 are connected by a sliding lug pin 42. With the above structure, in high-temperature working environments, the pin connection has the advantage of higher connection reliability compared to the threaded connection, which can improve the reliability of the connection between the sliding lug 23 and the sliding base plate 22.

[0054] like Figure 10 As shown, the sliding lug 23 is provided with a fifth pin hole 65, and the sliding lug pin 42 passes through the fifth pin hole 65 to connect the sliding lug 23 and the sliding base plate 22.

[0055] like Figure 1 and Figure 4 As shown, the carrier for the through-hole reflow soldering equipment also includes a self-locking structure 50 that limits the sliding plate assembly 20 to the closed position. The self-locking structure 50 is disposed between the guide mechanism 123 and the sliding plate assembly 20. With the aforementioned self-locking structure 50, when the sliding plate assembly 20 is in the closed position, the self-locking structure 50 limits the sliding plate assembly 20, preventing it from moving relative to the guide mechanism 123. This prevents the carrier for the through-hole reflow soldering equipment from automatically opening the sliding plate assembly 20 during the cyclic operation of the equipment conveying mechanism, ensuring the physical heat insulation effect of the sliding plate assembly 20 on the upper and lower temperature zones.

[0056] like Figure 1 and Figure 4 As shown, the self-locking structure 50 includes a lock head 51, a return spring, and a spring clamping sheet metal 53. A self-locking head countersunk hole 1236 is provided on the guide support plate 1231. The lock head 51 and the return spring are both located in the self-locking head countersunk hole 1236. The spring clamping sheet metal 53 covers the self-locking head countersunk hole 1236 and is connected to the guide support plate 1231 through sheet metal pins 43. The lower end of the return spring abuts against the lock head 51, and the upper end of the return spring abuts against the lower surface of the spring clamping sheet metal 53. The lower end of the lock head 51 protrudes downward from the self-locking head countersunk hole 1236 and is limited and matched with the sliding lug 23. The self-locking structure 50 with the above structure, since the spring-pressed sheet metal 53 covers all the self-locking head countersunk holes 1236, compresses the return spring in the self-locking head countersunk holes 1236. The lock head 51 can elastically extend and retract through the elastic force of the return spring to lock the sliding lug 23 on the sliding plate assembly, preventing the carrier of the through-hole reflow soldering equipment from automatically opening the sliding plate assembly 20 during the operation cycle of the equipment transmission mechanism.

[0057] Specifically, when the sliding plate assembly 20 is pushed, the sliding lug 23 contacts one side of the lock head 51, and the sliding lug 23 lifts the lock head 51. Since the self-locking head countersunk hole 1236 has a guiding effect on the lock head 51, the lock head 51 moves upward along the self-locking head countersunk hole 1236. The sliding lug 23 is located on the lower side of the lock head 51, and the return spring is compressed and deformed. When the sliding plate assembly 20 slides to the closed position, the sliding lug 23 slides to the other side of the lock head 51. The compression deformation force of the return spring drives the lock head 51 to move downward, and the lock head 51 completes the reset, so that the lock head 51 and the sliding lug 23 are again in a limited engagement.

[0058] like Figure 8 As shown, the guide support plate 1231 is provided with a sheet metal groove 1237 and a fourth pin hole 64. The spring clamping sheet metal 53 is covered above the self-locking head countersunk hole 1236. The spring clamping sheet metal 53 is set in the sheet metal groove 1237. The sheet metal pin 43 passes through the fourth pin hole 64 to connect the spring clamping sheet metal 53 with the guide support plate 1231.

[0059] like Figure 1 and Figure 5 As shown, the connecting mechanism 124 includes a connecting plate 1241 extending in the left-right direction along the carrier substrate 11, and a sliding plate passage 122 is disposed at the lower end of the connecting plate 1241. With the connecting mechanism 124 employing the above structure, since the sliding plate passage 122 is disposed at the lower end of the connecting plate 1241, a heat insulation cavity is formed above the sliding base plate 22 when the sliding plate assembly 20 is in the closed position. While the sliding base plate 22 isolates hot air, the heat insulation cavity enhances the physical heat insulation effect of the sliding plate assembly 20 on the upper and lower temperature zones.

[0060] like Figure 3 , Figure 8 as well as Figure 9 As shown, the carrier base plate 11 has a first pin hole 61, the guide support plate 1231 has a second pin hole 62, and the connecting plate 1241 has a third pin hole 63. The first pin hole 61, the second pin hole 62, and the third pin hole 63 are coaxially arranged. The carrier assembly pin 46 passes through the first pin hole 61, the second pin hole 62, and the third pin hole 63 to connect the carrier base plate 11, the guide mechanism 123, and the connecting mechanism 124. Using the above-mentioned pin connection, in high-temperature working environments, the pin connection has the advantage of higher connection reliability compared to threaded connections, which can improve the connection reliability of the carrier base plate 11, the guide mechanism 123, and the connecting mechanism 124, and also has the advantage of simple assembly.

[0061] like Figure 1 , Figure 4 as well as Figure 9As shown, the connecting plate 1241 is provided with a guide rod mounting hole 1242, and the end of the guide rod 1235 is inserted into the guide rod mounting hole 1242. By inserting the end of the guide rod 1235 into the guide rod mounting hole 1242, the guide rod 1235 is ensured to extend along the front-back direction of the carrier base plate 11, thereby allowing the sliding plate assembly 20 to slide relative to the bearing frame 12 in the front-back direction.

[0062] like Figure 1 , Figure 8 , Figure 9 as well as Figure 12 As shown, the fixture mounting position 121 includes a first fixture assembly step 1211 and a second fixture assembly step 1214. The first fixture assembly step 1211 is disposed on the upper end face of the guide support plate 1231 and includes a first fixture bearing surface 1212 and a first fixture limiting surface 1213 that are at an angle to each other. The second fixture assembly step 1214 is disposed on the upper end face of the connecting plate 1241 and includes a second fixture bearing surface 1215 and a second fixture limiting surface 1216 that are at an angle to each other. The lower surface of the product fixture 71 rests on the first fixture bearing surface 1212 and the second fixture bearing surface 1215. The sidewalls of the product fixture 71 abut against the first fixture limiting surface 1213 and the second fixture limiting surface 1216, respectively. The fixture mounting position 121 with the above structure is used to mount the product fixture 71. The first fixture bearing surface 1212 and the second fixture bearing surface 1215 support the product fixture 71, and the first fixture limiting surface 1213 and the second fixture limiting surface 1216 limit the product fixture 71, thereby ensuring that the product fixture 71 has a relatively fixed position on the carrier base 10. The product 72 is placed on the product fixture 71 to complete the welding. The carrier for the through hole reflow soldering equipment can be adapted to products 72 of different specifications through the product fixture 71.

[0063] like Figure 1 and Figure 2 As shown, the carrier base 10 also includes a connection and fixing mechanism 13 for connecting to a through-hole reflow soldering equipment. The connection and fixing mechanism 13 is disposed below the carrier base plate 11 and connected to the carrier base plate 11. The connection and fixing mechanism 13 described above can realize the connection between the carrier base 10 and the reflow soldering equipment.

[0064] like Figure 7As shown, the connecting and fixing mechanism 13 includes a connecting and fixing seat 131. The lower surface of the connecting and fixing seat 131 is provided with a conveying mechanism engagement step 1311, and the upper surface of the connecting and fixing seat 131 is provided with a carrier substrate limiting groove 1312. With the above-described structure, the connecting and fixing seat is connected to the conveying mechanism of the reflow soldering equipment via the conveying mechanism engagement step 1311, and the connecting and fixing seat is connected to the carrier base 10 via the carrier substrate limiting groove 1312, thereby realizing the connection between the carrier base 10 and the conveying mechanism of the reflow soldering equipment.

[0065] In this embodiment, two connecting and fixing mechanisms 13 are used, which are located directly below the two connecting mechanisms 124, thereby ensuring the reliability of the connection between the carrier base 10 and the conveying mechanism of the reflow soldering equipment.

[0066] like Figure 7 As shown, the connecting base 131 is connected to the carrier base plate 11 via a fixing mechanism mounting pin 44, and the connecting base 131 is connected to the transmission mechanism of the reflow soldering equipment via a carrier mounting pin 45. Using this pin connection, in high-temperature operating environments, the pin connection has the advantage of higher connection reliability compared to threaded connections, which can improve the connection reliability of the connecting base 131, the carrier mounting pin 45, and the transmission mechanism of the reflow soldering equipment, and also has the advantage of simple assembly.

[0067] like Figure 11 As shown, the connecting base 131 is provided with a sixth pin hole 66 and a seventh pin hole 67. The fixing mechanism mounting pin 44 passes through the sixth pin hole 66 to connect the connecting base 131 and the carrier base plate 11. The carrier mounting pin 45 passes through the seventh pin hole 67 to connect the connecting base 131 and the transmission mechanism of the reflow soldering equipment.

[0068] like Figure 3 As shown, the carrier base plate 11 is provided with an eighth pin hole 68. The carrier mounting pin 45 passes through the sixth pin hole 66 and the eighth pin hole 68 to connect the fixing seat 131 and the carrier base plate 11.

[0069] like Figure 2 and Figure 12 As shown, the carrier for the through-hole reflow soldering equipment includes two sliding plate assemblies 20. One sliding plate assembly 20 is slidably disposed on the front side of the carrier base plate 11, and the other sliding plate assembly 20 is slidably disposed on the rear side of the carrier base plate 11. Using two sliding plate assemblies 20, compared to using a single sliding plate assembly 20, shortens the stroke of the sliding plate assembly 20, reducing the time required for switching between the closed and open positions, thereby improving the physical heat insulation effect of the sliding plate assembly 20 on the upper and lower temperature zones.

[0070] In this embodiment, the lock head 51 and the reset spring are set as two corresponding to the two sliding plate assemblies 20, which lock the two sliding plate assemblies 20 in the closed position to prevent the carrier of the through hole reflow soldering equipment from automatically opening the sliding plate assemblies 20 during the operation cycle of the equipment transmission mechanism.

[0071] like Figure 4 and Figure 8 As shown, the guide support plate 1231 is provided with a guide rod limiting hole 1232 for mounting the guide rod 1235. The guide support plate 1231 is also provided with a sliding groove 1233. The guide rod 1235 is located in the sliding groove 1233 and passes through the guide rod limiting hole 1232. Since the guide rod 1235 is located in the sliding groove 1233 and passes through the guide rod limiting hole 1232, the guide rod 1235 is ensured to extend along the front-back direction of the carrier base plate 11, thereby allowing the sliding plate assembly 20 to slide relative to the bearing frame 12 in the front-back direction.

[0072] like Figure 1 and Figure 3 As shown, a connecting mechanism step 112 is provided on the upper surface of the carrier base plate 11, and a connecting mechanism 124 is disposed on the connecting mechanism step 112. Since the connecting mechanism 124 is disposed on the connecting mechanism step 112, and the connecting mechanism step 112 is disposed on the upper surface of the carrier base plate 11, the connecting mechanism 124 is disposed on the upper surface of the carrier base plate 11. The sliding plate assembly 20 passes through the sliding plate passage 122, and the sliding plate assembly 20 slides relative to the carrier base plate 11 in the front-back direction above the carrier base plate 11.

[0073] like Figure 4 and Figure 8 As shown, the guide support plate 1231 has oil holes 1234 corresponding to the guide rod 1235. By using the oil holes 1234, oil can be injected into the oil holes 1234 to achieve the effect of lubricating the guide rod 1235, preventing the sliding lug 23 from getting stuck when sliding relative to the guide rod 1235, thereby ensuring the effect of physical heat insulation of the upper and lower temperature zones by the sliding plate assembly 20.

[0074] In this embodiment, the pull plate pin 41, sliding lug pin 42, sheet metal pin 43, fixing mechanism mounting pin 44, carrier mounting pin 45, and carrier assembly pin 46 are fixed with cotter pins 73 or snap rings to prevent loosening and falling off, thereby improving the reliability of the pin connection.

[0075] Another embodiment of the present invention provides a through-hole reflow soldering apparatus, which includes a carrier for the through-hole reflow soldering apparatus, wherein the carrier for the through-hole reflow soldering apparatus is the through-hole reflow soldering apparatus carrier provided above.

[0076] The through-hole reflow soldering equipment provided by this invention offers advantages such as easy temperature control between the upper and lower temperature zones, the ability to freely switch between different furnace temperature profiles for different welding processes, and strong welding compatibility. Furthermore, the through-hole reflow soldering equipment of this invention is environmentally friendly, requires no cleaning, meets the requirements for high-density component welding, provides excellent welding results, and boasts high welding efficiency.

[0077] In this embodiment, before the through-hole reflow soldering equipment is started, the upper and lower furnace chambers are closed, and the carrier for the circulating through-hole reflow soldering equipment is in a closed state. The through-hole reflow soldering equipment starts operation, with heating or cooling in each furnace chamber and the conveyor belt starting its cyclical operation. The carrier for the circulating through-hole reflow soldering equipment, which is in a closed state, circulates with the conveyor belt. When the temperature of each furnace chamber reaches the set temperature required for through-hole reflow soldering and the temperature stabilizes, product 72, along with product fixture 71, is placed into the circulating carrier for the through-hole reflow soldering equipment. A product reflow detection switch detects that a product has passed through the furnace and sends a carrier opening signal. When a carrier position detection switch detects that the carrier for the through-hole reflow soldering equipment is in the open position, it sends a carrier opening signal. When two carrier opening signals are simultaneously received in the control system, the carrier opening mechanism immediately opens the carrier for the through-hole reflow soldering equipment by pulling the sliding plate 24. Product 72, along with product fixture 71, is reflow welded through the reflow oven using a carrier with an open through-hole. When product 72 is not placed inside, the carrier only sends a signal, and the carrier remains closed, ensuring thermal isolation between the upper and lower oven chambers. When product 72, along with product fixture 71, has completed its reflow welding and reached the carrier's closed position, the detection switch indicating the carrier's position sends a closing signal, and the carrier closing mechanism immediately closes the carrier. The closed carrier, carrying product 72 and product fixture 71, is then transported to the unloading position, completing one reflow welding cycle.

[0078] It should be noted that after the product 72, which has undergone reflow soldering, along with the product fixture 71, is removed from the carrier of the through-hole reflow soldering equipment, the carrier continues to move forward. Neither the fault-prevention switch indicating the carrier is not closed nor the fault-prevention switch indicating the product has not been removed sends a signal. The carrier circulates until it reaches the rearward transfer layer, and then circulates again until it reaches the starting position where product 72 is placed in the forward transport layer, completing one cycle of the through-hole reflow soldering equipment carrier. If either the fault-prevention switch indicating the carrier is not closed or the fault-prevention switch indicating the product has not been removed sends a signal, or if the transmission mechanism of the through-hole reflow soldering equipment stops abnormally, the equipment will alarm and immediately and automatically open the upper furnace chamber, shut off the heating source, and stop the air supply. After the abnormality is resolved, the upper furnace chamber can be closed and the equipment can be restarted.

[0079] like Figure 14As shown, in conventional hot air through-hole reflow soldering equipment without the present invention, the peak furnace temperature of the lower layer (welding surface) is 250°C, while the peak furnace temperature of the upper layer (non-welding surface) is only 190°C, resulting in poor heat insulation. It is unsuitable for reflow soldering of components that are not resistant to high temperatures through through-holes, and the temperature fluctuation of the upper layer (non-welding surface) is large, causing significant thermal shock to the components and making them prone to damage. S1 represents the temperature-time curve of the welding surface, and S2 represents the temperature-time curve of the non-welding surface.

[0080] like Figure 13 As shown, the carrier of the through-hole reflow soldering equipment of the present invention has a lower layer (welding surface) furnace temperature peak of 250°C and an upper layer (non-welding surface) furnace temperature peak of 120°C, exhibiting good heat insulation effect. It is suitable for through-hole reflow soldering of components that are not resistant to high temperatures, and the temperature fluctuation of the upper layer (non-welding surface) is small, resulting in less thermal shock to the components and reducing the risk of damage. Wherein, S1 is the temperature-time curve of the welding surface, and S2 is the temperature-time curve of the non-welding surface.

[0081] The application of the technical solution of the present invention has the following beneficial effects:

[0082] (1) The through-hole reflow soldering equipment of the present invention has good heat insulation effect, makes it easier to control the temperature of the upper and lower temperature zones, and makes the furnace temperature more stable, so that components that are not resistant to high temperature can be soldered on the through-hole reflow soldering equipment.

[0083] (2) The through-hole reflow soldering equipment of the present invention has good heat insulation effect, easy temperature control of the upper and lower temperature zones, and can freely switch between different furnace temperature curves, and has strong welding compatibility.

[0084] (3) All carriers used in through-hole reflow soldering equipment adopt pin connection. In high temperature environment, pin connection has the advantage of high connection reliability compared with threaded connection. It effectively solves the problem of screw loosening, falling off or even equipment jamming caused by large temperature difference and high temperature operating environment, and improves the reliability of carrier connection in through-hole reflow soldering equipment.

[0085] (4) The through-hole reflow soldering equipment of the present invention has the advantages of being environmentally friendly, requiring no cleaning, meeting the requirements of high-density component welding, having good welding effect, and high welding efficiency.

[0086] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0087] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0088] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0089] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0090] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0091] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A carrier for a through-hole reflow soldering machine, characterized in that, The carrier for the through-hole reflow soldering equipment includes: The carrier base (10) includes a carrier base plate (11) and a support frame (12). The support frame (12) surrounds the edge of the carrier base plate (11) and is connected to the carrier base plate (11). The upper end of the support frame (12) protrudes upward from the upper surface of the carrier base plate (11). The carrier base plate (11) has a through-hole ventilation hole (111). Hot air contacts the lower surface of the product through the ventilation hole (111). The upper end of the support frame (12) is provided with a fixture mounting position (121). The product is placed on the product fixture of the fixture mounting position (121). The sliding plate assembly (20) is slidably disposed above the carrier base plate (11). The carrier frame (12) is provided with a sliding plate passage (122) through which the sliding plate assembly (20) passes. The sliding plate assembly (20) has a closed position that blocks the hot air from the ventilation hole (111) and an open position that avoids the ventilation hole (111).

2. The carrier for through-hole reflow soldering equipment according to claim 1, characterized in that, The carrier frame (12) includes two guide mechanisms (123) and two connecting mechanisms (124) that are spliced ​​together. The two guide mechanisms (123) are respectively disposed on the left and right sides of the carrier base plate (11), and the two connecting mechanisms (124) are respectively disposed on the front and rear sides of the carrier base plate (11). A sliding guide structure (30) is provided between the guide mechanism (123) and the sliding plate assembly (20).

3. The carrier for through-hole reflow soldering equipment according to claim 2, characterized in that, The guiding mechanism (123) includes a guide support plate (1231) and a guide rod (1235) disposed on the guide support plate (1231). The guide support plate (1231) and the guide rod (1235) both extend along the front-rear direction of the carrier base plate (11). The sliding plate assembly (20) is provided with a guide rod sliding hole (21). The guide rod (1235) passes through the guide rod sliding hole (21) to form the sliding guide structure (30).

4. The carrier for through-hole reflow soldering equipment according to claim 3, characterized in that, The sliding plate assembly (20) includes a sliding base plate (22) and two sliding lugs (23) respectively disposed on the left and right sides of the sliding base plate (22). The sliding base plate (22) is slidably covered above the carrier base plate (11). The guide rod sliding hole (21) is disposed on the sliding lug (23). The sliding base plate (22) is made of heat insulation material.

5. The carrier for through-hole reflow soldering equipment according to claim 4, characterized in that, The sliding plate assembly (20) further includes a sliding pull plate (24), which is disposed on the side of the sliding base plate (22) away from the carrier base plate (11), and the sliding pull plate (24) and the sliding base plate (22) are connected by a pull plate pin (41); and / or, The sliding lug (23) is provided with a base plate clamping groove (231), and the end of the sliding base plate (22) is inserted into the base plate clamping groove (231). The sliding lug (23) and the sliding base plate (22) are connected by a sliding lug pin (41).

6. The carrier for through-hole reflow soldering equipment according to claim 4, characterized in that, The carrier for the through-hole reflow soldering equipment also includes a self-locking structure (50) that limits the sliding plate assembly (20) to the closed position, the self-locking structure (50) being disposed between the guide mechanism (123) and the sliding plate assembly (20).

7. The carrier for through-hole reflow soldering equipment according to claim 6, characterized in that, The self-locking structure (50) includes a lock head (51), a return spring, and a spring clamping sheet metal (53). The guide support plate (1231) is provided with a self-locking head countersunk hole (1236). The lock head (51) and the return spring are both located in the self-locking head countersunk hole (1236). The spring clamping sheet metal (53) covers the self-locking head countersunk hole (1236). The spring clamping sheet metal (53) is connected to the guide support plate (1231) through a sheet metal pin (43). The lower end of the return spring abuts against the lock head (51), and the upper end of the return spring abuts against the lower surface of the spring clamping sheet metal (53). The lower end of the lock head (51) protrudes downward from the self-locking head countersunk hole (1236) and is limited and engaged with the sliding lug (23).

8. The carrier for a through-hole reflow soldering equipment according to any one of claims 3 to 7, characterized in that, The connecting mechanism (124) includes a connecting plate (1241) extending in the left-right direction along the carrier base plate (11), and the sliding plate passage (122) is disposed at the lower end of the connecting plate (1241).

9. The carrier for through-hole reflow soldering equipment according to claim 8, characterized in that, The carrier base plate (11) has a first pin hole (61), the guide support plate (1231) has a second pin hole (62), and the connecting plate (1241) has a third pin hole (63). The first pin hole (61), the second pin hole (62), and the third pin hole (63) are coaxially arranged. A carrier assembly pin (46) passes through the first pin hole (61), the second pin hole (62), and the third pin hole (63) to connect the carrier base plate (11), the guide mechanism (123), and the connecting mechanism (124); and / or, The connecting plate (1241) is provided with a guide rod mounting hole (1242), and the end of the guide rod (1235) is inserted into the guide rod mounting hole (1242).

10. The carrier for a through-hole reflow soldering equipment according to claim 8, characterized in that, The fixture mounting position (121) includes a first fixture assembly step (1211) and a second fixture assembly step (1214). The first fixture assembly step (1211) is disposed on the upper end face of the guide support plate (1231). The first fixture assembly step (1211) includes a first fixture bearing surface (1212) and a first fixture limiting surface (1213) that are at an angle to each other. The second fixture assembly step (1214) is disposed on the upper end face of the connecting plate (1241). The second fixture assembly step (1214) includes a second fixture bearing surface (1215) and a second fixture limiting surface (1216) that are at an angle to each other. The lower surface of the product fixture (71) rests on the first fixture bearing surface (1212) and the second fixture bearing surface (1215). The sidewalls of the product fixture (71) abut against the first fixture limiting surface (1213) and the second fixture limiting surface (1216) respectively.

11. The carrier for a through-hole reflow soldering apparatus according to any one of claims 1 to 7, characterized in that, The carrier base (10) also includes a connection and fixing mechanism (13) for connecting to a through-hole reflow soldering device. The connection and fixing mechanism (13) is disposed below the carrier base plate (11) and connected to the carrier base plate (11).

12. The carrier for through-hole reflow soldering equipment according to claim 11, characterized in that, The connecting and fixing mechanism (13) includes a connecting and fixing seat (131), the lower surface of which is provided with a conveying mechanism engagement step (1311), and the upper surface of which is provided with a carrier base plate limiting groove (1312). The connecting fixing seat (131) is connected to the carrier base plate (11) through the fixing mechanism mounting pin (44), and the connecting fixing seat (131) is connected to the transmission mechanism of the reflow soldering equipment through the carrier mounting pin (45).

13. The carrier for a through-hole reflow soldering equipment according to any one of claims 3 to 7, characterized in that, The carrier for the through-hole reflow soldering equipment includes two sliding plate assemblies (20), one of which is slidably disposed on the front side of the carrier base plate (11), and the other is slidably disposed on the rear side of the carrier base plate (11). The guide support plate (1231) is provided with a guide rod limiting hole (1232) for installing the guide rod (1235), and the guide support plate (1231) is also provided with a sliding groove (1233). The guide rod (1235) is located in the sliding groove (1233) and passes through the guide rod limiting hole (1232). The upper surface of the carrier base plate (11) is provided with a connecting mechanism step (112), and the connecting mechanism (124) is disposed on the connecting mechanism step (112). The guide support plate (1231) has an oil hole (1234) corresponding to the guide rod (1235).

14. A through-hole reflow soldering apparatus, comprising a carrier for the through-hole reflow soldering apparatus, characterized in that, The carrier for the through-hole reflow soldering equipment is the carrier for the through-hole reflow soldering equipment as described in any one of claims 1 to 13.

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