Method and test support module for operating automatic test equipment

Abstract

A test support module and corresponding method for supporting testing of one or more devices under test in automatic test equipment. The test support module includes a plurality of pogo pins adapted to establish a connection with a load board, and one or more electrical or electronic support components configured to support testing of the one or more devices under test. The one or more support components are electrically coupled to the pogo pins, and the test support module is adapted to be inserted into one or more pogo block locations of a pogo block frame such that the pogo pins align to contact the load board.

Description

Technical Field

[0001] Embodiments according to the present application relate to testing one or more devices under test in automatic test equipment, and in particular, to support for such testing.

[0002] An embodiment according to the present invention relates to a test support module for supporting testing of one or more devices under test in automatic test equipment.

[0003] A further embodiment according to the invention relates to a test arrangement for testing one or more devices under test.

[0004] A further embodiment according to the invention relates to a method for operating automatic testing equipment.

[0005] According to one aspect, embodiments according to the present invention may be applied to provide a concept of highly customizable, flexible, and cost-effective device testing using pogo blocks. Background Art

[0006] Various test arrangements are currently known, in particular test arrangements using pogo blocks.

[0007] In known test systems and apparatus, the load board includes a number of supporting electronic components, including those often used to provide communication between the load board and the pin electronics card. For example, one known solution is shown in FIG1 . FIG1 illustrates a schematic diagram of conventional signal routing from the pin electronics card to the load board and back from the load board to the pin electronics card when using a pin electronics card. A conventional or ordinary pin electronics card 100 consists of a pin electronics board 101, a coaxial cable 102, and a pogo block 103. Signals are routed from the pin electronics board 101 to the pogo block 103 via the coaxial cable 102, and then from the pogo block 103 to the load board.

[0008] Customized or application-specific solutions need to be placed on a load board. Therefore, they are exposed to the environment (hot and cold testing) and, because they cannot be reused, they need to be replicated for each load board. Consequently, these customized solutions have the following disadvantages.

[0009] First, known solutions are highly dependent on a specific load board and cannot be easily used with any random load board (e.g., from another manufacturer). The high dependency on application and load board requires creating a new circuit for each application, which is not very cost-effective.

[0010] Since, in known solutions, the electronic components used to support device testing are mostly arranged on the load board of the test equipment, the space on the load board is limited. This also increases the risk of damage to the electronic components due to temperature effects, as the load board may heat up or cool down to temperatures between -50°C and 170°C, while the specified temperature of most load board components is 85°C.

[0011] Known concepts may also suffer from poor signal performance due to long signal paths and limited tester channel resources.

[0012] In view of the above, it is desirable to create a test support concept that can provide an improved trade-off between performance, flexibility, reliability and test cost. Therefore, it is desirable to provide a concept that is more efficient in improving the trade-off between performance, flexibility, reliability and test cost. Summary of the Invention

[0013] According to an embodiment of the present invention, a test support module is created for supporting testing of one or more devices under test in an automatic test equipment. The test support module includes: a plurality of pogo pins (e.g., spring loaded pins) adapted to establish a connection with a load board or probe card (the load board or probe card being adapted, for example, to contact the one or more devices under test); and one or more electrical or electronic support components (e.g., one or more switches such as RF mechanical relays, MEMS relays, amplifiers, multiplexers, signal converters, etc.) configured to support testing of the one or more devices under test. The one or more support components are electrically coupled to the pogo pins; and the test support module is adapted (e.g., mechanically) to be inserted into one or more pogo block positions or one or more pogo block orientations of a pogo block frame so that the pogo pins are aligned to contact the load board.

[0014] This embodiment is based on the discovery that electronic support components can be arranged on a separate printed circuit board that can be combined with a pogo block to create a universal test support module, and that the test support module can be mounted in a pogo block position or pogo block orientation of a pogo block frame and can be coupled to a load board or probe card via pogo pins. Thus, the available space in the otherwise unused pogo block positions of the interface between the test head of the automatic test equipment and the load board can be used for electrical or electronic support components that support the test. The test support module can be easily replaced and used with different load boards and / or probe cards, regardless of the manufacturer. This concept provides low cost, low complexity, high flexibility and customization in the field. Since the electronic components are placed in the test support module instead of in the load board, valuable load board component space is saved, and since the components are arranged outside the load board, they can be protected from high temperatures.

[0015] According to an embodiment, the test support module is electrically coupled to its environment via a plurality of pogo pins, and the test support module preferably does not include any cables for connecting to the channel modules of the automatic test equipment. Due to the removal (or omission) of cables, the electrical components are placed (or at least can be placed) very close to the pogo pins, which maintains high signal performance by avoiding the need for signals to be routed back and forth from the tester pogo pins to the application space in the center of the load board. In addition, by avoiding cable connections to the channel modules of the automatic test equipment, replacement of the test support module is greatly facilitated.

[0016] According to an embodiment, the test support module is configured to avoid direct coupling (eg, via direct cables) with a channel module of the automatic test equipment, but is configured to couple only to a load board. This improves signal quality.

[0017] According to an embodiment, the test support module includes electrical connections (e.g., electrical connections implemented using pogo pins) only on one side of the load board (e.g., only on a single side where pogo pins for contacting the load board are arranged) or only on one side of the probe card. Thus, a mechanically simple solution is provided, and the test support module can be easily replaced (e.g., without the need to laboriously loosen cable connections).

[0018] According to an embodiment, the test support module is configured to couple a single automatic test equipment channel (e.g., a pin electronics card) to multiple device under test pins (e.g., so that the number of ATE channels or the number of pin electronics cards can be reduced compared to a tester that does not include the test support module). This allows (effective) tester resources to be expanded. In other words, by using the test support module, the number of actual channel modules can be reduced, which helps reduce testing costs.

[0019] According to an embodiment, one or more electrical or electronic support components are adapted to be located in a signal path between an automatic test equipment channel and one or more devices under test. This significantly conserves tester channel resources, which also reduces costs. Signals in the signal path can be processed (e.g., distributed, switched, amplified, attenuated, etc.) as needed.

[0020] According to an embodiment, one or more signal path inputs and one or more corresponding signal path outputs of the test support module are coupled to pogo pins (e.g., coupled to pogo pins arranged to contact a load board), providing a direct and short signal path, thereby improving signal quality.

[0021] According to an embodiment, the test support module is configured to receive one or more control signals that control the functionality of one or more electrical or electronic support components via one or more of the pogo pins (e.g., via pogo pins arranged to contact a load board). The electronic support components can be controlled by a test arrangement that provides a support test module that can be used with any load board and any test arrangement. In other words, by using such a configuration, control signals can be efficiently routed to the test support module via the load board, thereby avoiding the need for any additional wiring.

[0022] According to an embodiment, the test support module includes a switch (e.g., an RF mechanical relay or a MEMS relay). The switch is located in the signal path between a signal path input of the test support module and a signal path output of the test support module. The signal path input and signal path output can, for example, be coupled to corresponding pogo pins. The switch can (e.g., selectively) connect (e.g., to perform a multiplexing function): a switch input (coupled to a pogo pin of the test support module) and one or more switch outputs (coupled to a pogo pin of the test support module); or the switch can (e.g., be configured to selectively) connect (e.g., to perform a multiplexing function): one of a plurality of switch inputs (coupled to a pogo pin of the test support module) and a switch output (coupled to a pogo pin of the test supply module). High temperature protection is provided for the switch. Additionally, due to the short signal paths within the test module, high bandwidth and signal integrity can be maintained, i.e., higher signal performance is provided. Simultaneously, space is provided on the load board for multi-site sockets (or sockets for a large number of devices under test), as providing switching functionality does not require load board space. Provides an easily customizable, upgradeable and scalable solution to provide switching functionality independent of load boards and applications.

[0023] According to an embodiment, the test support module includes a multiplexer (e.g., a multiplexer integrated circuit, or a DC multiplexer circuit). The multiplexer is in a signal path between a signal path input of the test support module and a signal path output of the test support module. The signal path input and the signal path output can, for example, be coupled to corresponding pogo pins. The multiplexer can (e.g., selectively) connect the following two (e.g., to perform a multiplexing function): a multiplexer input (coupled to a pogo pin of the test support module) and one or more multiplexer outputs (coupled to a pogo pin of the test support module); or the multiplexer can (e.g., be configured to selectively) connect the following two (e.g., to perform a multiplexing function): one of a plurality of multiplexer inputs (coupled to a pogo pin of the test support module) and a multiplexer output (coupled to a pogo pin of the test supply module). An easily customizable, upgradeable, and scalable solution is provided to provide a multiplexing function that is independent of the load board and application. This also saves load board space and ATE channel resources.

[0024] According to an embodiment, the test support module includes a signal distributor, for example, a (e.g., passive) power distributor or an active power distribution device. The signal distributor is in a signal path between a signal path input of the test support module and a plurality of signal path outputs of the test support module (the signal path input and the signal path output can, for example, be coupled to corresponding pogo pins), and is adapted to simultaneously distribute a signal received from the signal path input of the test support module to the plurality of signal path outputs of the test support module. An easily customizable, upgradeable, and scalable solution is provided to provide signal distribution that is independent of the load board and application. This also saves load board space and ATE channel resources.

[0025] According to an embodiment, the test support module includes a signal conditioner, such as an amplifier, and / or an attenuator, and / or a filter, and / or a level converter, and / or a nonlinear distorter, and / or an isolation device (such as a circulator or a transformer), and / or a limiter, and / or (for example) a power splitter, (for example) a voltage source, (for example) a current source, (for example) a DC-DC converter, (for example) an ACDC converter, (for example) a level converter (for example, 4→40V). The signal conditioner is located in the signal path between the signal path input of the test support module and the signal path output of the test support module (wherein the signal path input and the signal path output can, for example, be coupled to corresponding pogo pins) and is adapted to manipulate the signal received from the signal path input of the test support module. A solution that is easily customizable, upgradeable, and scalable is provided to provide a signal conditioner that is independent of the load board and the application. This also saves load board space and protects components (for example, amplifiers, attenuators, etc.) from high temperatures.

[0026] According to an embodiment, the test support module includes a protocol converter, for example, a USB to RGMII converter. The signal protocol converter is in the signal path between the first signal path port of the test support module and the second signal path port of the test support module (the first signal path port and the second signal path port can, for example, be coupled to corresponding pogo pins) and is adapted to perform protocol conversion. This provides an adapter to expand functionality and adapt to applications while reducing complex LBA wiring and maintaining high signal performance. An easily customizable, upgradeable, and scalable solution is provided to provide an adapter that is independent of the load board and application. This also saves load board space and protects components from high temperatures.

[0027] According to an embodiment, the test support module is adapted (e.g., mechanically) to be inserted into multiple pogo block positions or pogo block orientations of a pogo block frame such that the pogo pins align to contact the load board. This provides a simple, reusable solution. Furthermore, because a single test support module can occupy multiple adjacent pogo block positions, complex functions can be implemented on the test support module, and the test support module can be kept short (or deep), which helps avoid mechanical conflicts.

[0028] According to an embodiment, the test support module comprises one or more printed circuit boards which are parallel (or, for example, not parallel, or, for example, not tangential) to the axis of the pogo pins (wherein, for example, one or more of the pogo pins are attached tangentially to the one or more printed circuit boards), wherein one or more electrical or electronic support components are arranged on the one or more printed circuit boards. Thus, the number of support electrical components to be removed (or relocated) from the load board is increased, which further provides more free space on the load board for high multi-site sockets. In addition, it can be achieved that the printed circuit board of the test support module is essentially perpendicular to the load board, which can significantly increase the available area for support components. Moreover, using such a configuration, the pogo pins can be reliably attached to the printed circuit board. For example, in another embodiment, the one or more printed circuit boards can also be perpendicular to the axis of the pogo pins.

[0029] According to an embodiment, a test support module includes a housing (or, for example, a box). The housing includes a plurality of holes on a side adapted to face a load board or a probe card, through which pogo pins extend, and the housing includes a mounting structure (or, for example, an attachment structure) for mounting the test support module in a pogo block position, or a pogo block orientation (e.g., two or more holes or threaded holes) of a pogo block frame. One or more electrical or electronic test support components are arranged on a printed circuit board that is placed within the box. The pogo pins can, for example, be soldered or electrically connected to the printed circuit board. A simple, low-cost solution is provided for providing reusable, easily replaceable support components.

[0030] According to an embodiment of the present invention, a test arrangement is created for testing one or more devices under test. The test arrangement includes a pogo block frame, which includes a plurality of pogo block positions or pogo block orientations, wherein one or more pogo blocks of the test arrangement (e.g., a unit for connecting a pogo pin or pogo needle to a cable, such as using a printed circuit board including pogo pins and a cable (e.g., a coaxial cable) for establishing a connection with one or more channel modules (e.g., a pin electronic card)) are arranged in one or more pogo block positions. One or more test support modules according to any of the above embodiments are arranged in one or more of the pogo block positions. The pogo pins of the one or more pogo blocks and the pogo pins of the one or more test support modules are arranged to contact a load board (e.g., when the load board is attached to the test arrangement).

[0031] This embodiment is based on the discovery that electronic support components can be arranged on a separate printed circuit board that can be combined with a pogo block to create a universal test support module. This test support module can be easily replaced and used with different load boards, regardless of the manufacturer. This concept provides low cost, low complexity, high flexibility, and on-site customization. Because the electrical or electronic support components are placed in the test support module instead of in the load board, valuable load board component space is saved, and because the components are arranged outside the load board, they can be protected from high temperatures.

[0032] According to an embodiment, the test arrangement further includes a load board. The pogo pins of one or more pogo blocks contact the load board, and the pogo pins of one or more test support modules contact the load board. This provides a direct, short signal path that improves signal quality.

[0033] According to an embodiment, a test arrangement includes a signal path (e.g., a signal path between an automatic test equipment channel and one or more devices under test) extending from a load board to one of the test support modules and back to the load board. Since the signal path is short and direct, high signal performance is provided.

[0034] According to an embodiment, the test arrangement includes a signal path (e.g., a signal path from a channel module of the automatic test equipment to the device under test, and / or a signal path from the device under test to the channel module of the automatic test equipment) that extends through the test support module and thus connects the support module to the load board, for example, via pogo pins. Accordingly, for example, because the test support module is closely connected to the load board, high signal performance is provided.

[0035] According to an embodiment, a signal path of the test arrangement extends from a channel module (e.g., a channel module of an automatic test equipment) via a cable to a given one of the pogo blocks, extends from the given one of the pogo blocks via a pogo pin of the given one of the pogo blocks to a first pogo pad of a load board, extends from the first pogo pad of the load board (e.g., via a conductor path on the load board) to a second pogo pad of the load board, extends from the second pogo pad of the load board via a pogo pin of a test support module to an input of a given one of the test support modules, extends from an output of the given one of the test support modules via another pogo pin of the test support module to a third pogo pad of the load board, and extends from the third pogo pad of the load board (e.g., directly via a conductor path on the load board or via one or more other components) to a device under test; and / or wherein the signal path of the test arrangement (e.g., as previously mentioned) The device under test (DUT) extends from the fourth pogo pad of the load board (e.g., a different signal path) to a fourth pogo pad of the load board, extends from the fourth pogo pad of the load board (e.g., via a pogo pin of the support module) to an input of the test support module, extends from the output of the test support module (e.g., via another pogo pin of the test support module) to a fifth pogo pad of the load board, extends from the fifth pogo pad of the load board to a sixth pogo pad of the load board (e.g., via a conductor path on the load board), extends from the sixth pogo pad on the load board (via a pogo pin of a given pogo block (e.g., another pogo block)) to a given pogo block (e.g., another pogo block different from the aforementioned pogo block), and extends from the given pogo block (e.g., another pogo block) via a cable (e.g., another cable different from the aforementioned cable) to a channel module of the automatic test equipment. In an embodiment, the channel module can be a digital module or an analog module. Channel modules can be items such as power supplies, digital channels, analog channels, power supply channels, RF channels, local tester sources, tester measurement resources, ADV power supplies, and the like. Thus, high signal performance is provided. Furthermore, support modules provide additional functionality while avoiding lengthy additional signal routing.

[0036] According to an embodiment, the pogo block locations or pogo block orientations are arranged in a peripheral area of the pogo block frame (e.g., arranged in one or more rows along one or more edges of the pogo block frame). As a result, the temperature impact of the components on the load board on the test support module is reduced, further protecting the electronic components of the test support module from high temperatures.

[0037] According to an embodiment, the pogo block frame includes at least one row of exemptions (e.g., at least one row of exemptions of rectangular openings), wherein the exemptions are adapted to mount a plurality of pogo blocks and test support modules at pogo block locations or pogo block orientations of the pogo block frame. Thus, a test support module replacement function is provided that is easy and mechanically simple.

[0038] According to an embodiment, for example, the pogo block frame may be rectangular, circular, or ring-shaped.For example, the pogo block frame may be a wafer sorting pogo tower or a part of a wafer sorting pogo tower.

[0039] According to an embodiment, the pogo block frame, pogo block, and test support module are adapted to enable the pogo block and the test support module to be interchangeably mounted in the pogo block position or orientation. Thus, an easy and mechanically simple test support module replacement capability is provided. This provides a reusable plug-and-play solution that is independent of the application.

[0040] According to an embodiment, the load board includes one or more device under test sockets (e.g., test sockets such as zero insertion force test sockets, or probe cards or "pogo towers") in a central area of the load board (e.g., on a first side of the load board), for example, during wafer testing. The load board includes a plurality of pogo pads in a peripheral area of the load board (e.g., on a second side of the load board opposite the first side of the load board) (wherein, for example, the central area of the load board is free of pogo pads). As a result, the temperature impact of the device under test sockets of the load board on the test support module is reduced. The electronic components of the test support module are further protected from high temperatures. Since the impact of high temperatures or environmental conditions is reduced, the test quality is also improved.

[0041] According to an embodiment, one or more test support modules (or, for example, even all test support modules) and, for example, pogo blocks (or, for example, even all pogo blocks) are arranged to contact pogo pads of a load board (these pogo pads are located in the peripheral area of the load board), for example, using their pogo pins. Signal performance is improved due to short and direct signal paths. Furthermore, the connection between the test support module and the load board can be established in a tool-free manner.

[0042] According to an embodiment, one or more test support modules are arranged to contact a load board from a first side (e.g., contact a pogo pad of the load board), the first side being opposite a second side of the load board on which one or more device under test sockets are arranged. This improves signal performance due to short, direct signal paths. Furthermore, separate thermal domains can be established on different sides of the load board.

[0043] According to an embodiment, the test arrangement is mounted on a test head of an automatic test device. Thus, the support module can be, for example, inside the test head and can thus be well protected.

[0044] According to an embodiment, a test arrangement is configured to selectively (e.g., switchably) couple a given channel of an automated test device to multiple DUT pins (e.g., to multiple pins of a single DUT, or even to multiple pins of different DUTs, or, for example, to a support device such as a processor). A switch or multiplexer for selecting which DUT pin a given channel of the automated test device is coupled to is disposed on one of one or more test support modules (where, for example, a given channel is coupled to a load board via a cable and one of one or more pogo blocks; where, for example, a given channel is coupled to a test support module via a cable, a pogo pin of one of the one or more pogo blocks, a conductive trace on the load board, and a pogo pin of the test support module). The test arrangement is configured to process a signal provided by the DUT in the test support module to obtain a processed signal, and to forward the processed signal to a given channel of the automated test device or to a support device (e.g., a processor). In the amplifier example, the signal is sent from the device to the test support module and then to the handler device. The signal need not always be sent to the tester channel. High-temperature protection for the switch can be implemented. Furthermore, because signal paths within the test module are short, high bandwidth and signal integrity are maintained, resulting in higher signal performance. Furthermore, because load board space is not required to provide switching functionality, this space is freed up for high-multipoint sockets. This provides an easily customizable, upgradeable, and scalable solution for switching functionality independent of the load board and application.

[0045] According to an embodiment, a test arrangement is configured to distribute a signal provided by a given channel of an automatic test equipment to multiple device pins under test (e.g., to multiple pins of a single device under test, or even to multiple pins of different devices under test). Distribution circuitry for distributing the signal provided by a given channel of the automatic test equipment is disposed on one of the one or more test support modules. This provides an easily customizable, upgradeable, and scalable solution for signal distribution that is independent of the load board and application. This also saves load board space and ATE channel resources.

[0046] According to an embodiment of the present invention, a test arrangement is created for testing one or more devices under test. The test arrangement includes a pogo block frame (e.g., a pogo tower such as a wafer sorting pogo tower) for establishing a connection between a load board and a probe card, the pogo block frame including a plurality of pogo block positions (e.g., annular sectors). One or more through-connected pogo blocks for establishing a connection between opposite surfaces of the pogo block frame are arranged in one or more of the pogo block positions. One or more test support modules according to any of the above embodiments are arranged in one or more of the pogo block positions. The pogo pins at the first side of the one or more through-connected pogo blocks are arranged to contact the load board, while the pogo pins at the second side of the one or more through-connected pogo blocks are arranged to contact the probe card. The pogo pins of one or more test support modules are arranged to contact the load board or to contact the probe card. For example, the test support module can be configured to have pogo pins on the load board side or on the probe card side (but not on both sides).

[0047] This embodiment is based on the discovery that electronic support components can be arranged on a single printed circuit board that can be combined with a pogo block to create a universal test support module. This test support module can be easily replaced and used with different load boards and / or probe cards, regardless of the manufacturer. This concept provides low cost, low complexity, high flexibility, and on-site customization.

[0048] According to an embodiment, the test arrangement further comprises a load board, wherein the pogo pins at the first side of the one or more through-connected pogo blocks contact the load board, and wherein the pogo pins of the one or more test support modules contact the load board, providing a direct and short signal path, thereby improving signal quality.

[0049] According to an embodiment, the test arrangement further comprises a probe card, wherein the pogo pins at the second side of the one or more through-connection pogo blocks contact the probe card, and wherein the pogo pins of the one or more test support modules contact the probe card, providing a direct short signal path, thereby improving signal quality.

[0050] According to an embodiment, the test arrangement includes: a signal path extending from a load board to one of the test support modules and back to the load board, and / or a signal path extending from a probe card to one of the test support modules and back to the probe card, and / or a signal path extending from a load board to one of the test support modules and from one of the test support modules to the probe card, and / or a signal path extending from a probe card to one of the test support modules and from one of the test support modules to the load board. In theory, a signal can go from, for example, a load board to a pogo block and then to a test support module, and from there to the other side of the pogo block and then to a probe card. The signal does not necessarily need to come from the load board, nor does it necessarily need to return to the load board. The same applies to the probe card. Since the signal path is short and direct, high signal performance is provided. In addition, the following items can be provided on the test support module in a space-efficient manner: additional signal distribution functions, or signal conditioning functions, or power management functions.

[0051] According to an embodiment, the test arrangement comprises a signal path extending via the test support module. Thus, high signal performance is provided (eg because the test support module is tightly connected to the load board and / or probe card).

[0052] According to an embodiment, the pogo block locations are arranged in a peripheral area of the first side and / or a peripheral area of the second side of the pogo block frame.

[0053] According to an embodiment, the pogo block frame is cylindrical and / or includes (but not necessarily includes) a cylindrical through-cut portion, for example, in the center portion. In an embodiment, accordingly, the load plate and / or the probe has (but not necessarily has) a cylindrical through-cut portion, for example, in the center portion thereof to fit into the cut portion of the pogo block frame.

[0054] According to an embodiment of the present invention, a method for operating automatic test equipment is created. The method includes routing the following signals, via a test support module according to any of the above embodiments: signals to be provided as test stimulus signals to a device under test (e.g., signals generated by a channel module of the automatic test equipment), or signals provided by the device under test (e.g., signals to be evaluated by a channel module of the automatic test equipment).

[0055] These aspects and further advantageous aspects are subject matter of the dependent claims.

[0056] The above-described test support modules, test arrangements, and methods may optionally be supplemented by any of the features, functions, and details disclosed herein (throughout the document), which may be used alone or in any combination. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] The preferred embodiments of the present application will be described below with reference to the accompanying drawings, in which:

[0058] FIG1 shows a schematic diagram of signal routing between a pin electronic card and a load board as known in the prior art;

[0059] Figure 2 shows a schematic diagram of a test support module according to an embodiment;

[0060] Figure 3A shows a schematic top view of a test support module according to an embodiment;

[0061] Figure 3B shows a schematic front view of a test support module according to an embodiment;

[0062] Figure 3C shows a front view of a test support module according to an embodiment;

[0063] Figures 4A to 4C shows a test support module with a housing according to an embodiment in different assembled states;

[0064] Figure 4D shows a front view of a double housing according to an embodiment;

[0065] Figure 5A and Figure 5B shows a test support module according to an embodiment;

[0066] Figure 5C shows a front view of a test support module according to an embodiment;

[0067] Figure 5D shows a block schematic representation of the functionality of a test support module according to an embodiment;

[0068] Figure 5E shows a schematic representation of a test scenario using a support module according to an embodiment of the present invention;

[0069] Figure 6A shows a top view of a test support module according to an embodiment;

[0070] Figure 6B shows a front view of a test support module according to an embodiment;

[0071] Figure 6C shows a schematic diagram of circuitry that may be implemented on a test support module according to an embodiment;

[0072] Figure 6D shows a schematic representation of a test scenario using a test support module according to an embodiment of the present invention;

[0073] Figure 7A shows a top view of a test support module according to an embodiment;

[0074] Figure 7B shows a block schematic diagram of circuitry that may be implemented on a test support module according to an embodiment;

[0075] Figure 7C shows a block schematic diagram of circuitry that may be implemented on a test support module according to an embodiment;

[0076] Figure 8A shows a top view of a test support module according to an embodiment;

[0077] Figure 8B shows a block schematic diagram of circuitry that may be implemented on a test support module according to an embodiment;

[0078] Figure 9A shows a circuit diagram of a test support module according to an embodiment;

[0079] Figure 9B shows a table illustrating pinouts for a test support module according to an embodiment;

[0080] Figure 9C shows a schematic diagram of circuitry that may be implemented on a test support module according to an embodiment;

[0081] Figure 10 shows a test arrangement according to an embodiment;

[0082] Figure 11 shows a pogo block framework according to an embodiment;

[0083] Figure 12 shows a support structure for a load plate according to an embodiment;

[0084] Figure 13A shows a test arrangement according to an embodiment;

[0085] Figure 13B shows a test arrangement according to an embodiment;

[0086] Figure 14 shows a test arrangement according to an embodiment;

[0087] Figure 15 A top view of a load plate according to an embodiment is shown. Specific embodiments

[0088] Figure 2 A schematic diagram is shown of how signal routing is performed using the test support module 200 according to an embodiment.

[0089] The signal is routed from the load board to a pogo block 201 of the test support module. A support component (e.g., a standardized test support component or a customized, e.g., application-specific support component) 202 is placed in the pogo block 201. Thus, the signal is routed from the load board to the input of the support component via the pogo pin of the pogo block 201. From there (e.g., from the output of one support component or the output of the support component) the signal is routed back to the load board (e.g., via another pin of the pogo block 201).

[0090] For example, in this embodiment, there is no direct interaction, or direct connection, between the test support module and the test system electronics or any cables that are not routed through the load board.

[0091] However, it should be noted that the testing support module 200 may optionally be supplemented by any of the features, functions, and details disclosed herein, which may be used alone or in combination.

[0092] Figure 3A and Figure 3B A schematic diagram of a test support module 300 is shown according to an embodiment.

[0093] Figure 3A A top view of the test support module 300 is shown.

[0094] The test support module includes N pogo pins 301 1...N and M electronic support components 302 1...M , these electronic support components are configured to support testing of one or more devices under test in automatic test equipment.

[0095] For example, pogo pin 301 1...N Attached (eg, soldered) to a printed circuit board (PCB) 303 .

[0096] Electronic support components 302 1...M (i.e. one or more relays, or one or more multiplexers, or one or more amplifiers) are arranged on or in a PCB (e.g. soldered on a PCB, or embedded in a PCB) and connected to the pogo pin 301. 1...N One of the one or more electronic support components (eg, electronic support component 3021) may be electrically coupled (eg, via conductive traces of a PCB) to one or more pogo pins 301 of one or more pogo blocks. 1...N electrically coupled (e.g., in Figure 2 A pogo block is a simple unit (e.g., a block of pogo pins) that uses a PCB to connect pogo pins to cables.

[0097] Figure 3B A front view of the test support module 300 is shown (e.g., a view of the side of the support module intended to face the load board). Figure 3B The tips of the pogo pins (some or all of which are coupled to signal path inputs and / or signal path outputs and / or control connections and / or supply connections of one or more supporting components) can be seen in the front view of the . The pogo pins are arranged, for example, in a pattern that fits corresponding pads on a load board. As an example, in Figure 3A In a top view of the device, the pogo pins can be arranged on a regular grid (some grid positions may not have pogo pins). In other words, for example, there can be multiple rows of substantially parallel pogo pins. However, in some embodiments, there may be only one row of pogo pins.

[0098] Furthermore, it should be noted that the test support module is (mechanically) adapted to be inserted into one or more pogo block positions of a pogo block frame. For example, the outer shape of the support module may be selected to fit into one or more pogo block positions. Additionally, the support module may include appropriate fastening means to fasten the support module in one or more pogo block positions. As an example, the support module may include a plurality of fastening means on its front side (e.g., Figure 3A The support module may include holes or threaded holes (not shown) to secure the support module to one or more pogo block locations (e.g., using a plurality of screws). Alternatively or in addition, the support module may include one or more snap-in features to snap the support module into one or more pogo block locations.

[0099] The support module may be adapted to receive one or more input "test signals" (e.g., signals received from a signal generator of an automatic test equipment such as a pinned electronic module and to be forwarded to a device under test (DUT), and / or signals provided by the DUT and to be forwarded to a measurement unit such as a pinned electronic module or any other signal analyzer) from the load board via one or more pogo pins thereof, and may be adapted to output one or more output "test signals" (e.g., signals to be forwarded to the DUT, or signals to be forwarded to a measurement unit of the automatic test equipment) to the load board via one or more pogo pins thereof. Furthermore, the support module may be adapted to receive one or more of the following signals: control signals that determine the functionality (e.g., switching states) of one or more support components, and power supply signals (e.g., supply voltage and reference voltage).

[0100] Generally speaking, a test support module can affect the test signals passing through the support module, for example, by switching between different test signal paths or by providing amplification or attenuation. Thus, a test support module can support testing of a DUT, for example, by providing switching or multiplexing functions, or signal conditioning functions.

[0101] However, it should be noted that the testing support module 300 may optionally be supplemented by any of the features, functions, and details disclosed herein, which may be used alone or in combination.

[0102] Figure 3C Shown is a front view of a test support module according to an embodiment.

[0103] Figure 3C A front view of the test support module in the housing (e.g., a view of the side of the support module intended to face the load board) is shown. The tips of the pogo pins (some or all of which couple to signal path inputs and / or signal path outputs and / or control connections and / or supply connections of one or more support components) are visible in the front view of the test support module.

[0104] However, it should be noted that Figure 3C The housing shown in may optionally be supplemented by any of the features, functions, and details disclosed herein, either used alone or in any combination.

[0105] Figures 4A to 4D An implementation of a test support module 400 with a housing is shown according to an embodiment.

[0106] Figure 4A The top view of the components of the test support module 400 is shown in FIG. The test support module 400 includes: at least one PCB 401 carrying pogo pins 402, and a housing 403. The at least one PCB 401 is based on Figure 3A and Figure 3B The PCB shown is formed in the same manner and is suitable for being arranged in a housing 403 (such as a plastic housing, or such as a metal housing) that fits in one or more pogo block locations. Figure 4A As shown, the test support module 400 preferably includes two PCBs 401 carrying pogo pins 402. However, this example is not limiting, and in embodiments, the test support module 400 may include only one PCB, for example, arranged in one housing, or may include more than two PCBs.

[0107] One or more electronic support components (i.e., one or more relays, or one or more multiplexers, or one or more amplifiers) may be arranged on or in the PCB 401 (e.g., soldered on or embedded in the PCB) and electrically coupled to the pogo pins 402 (e.g., via conductive traces of the PCB). One of the one or more electronic support components may be electrically coupled to the one or more pogo pins 402 (e.g., as Figure 2 ).

[0108] At least one PCB 401 includes two protrusions (or extensions) 404 on both sides of the PCB 401 , the two protrusions 404 being in a plane parallel to the plane of the pogo pins 402 , the protrusions 404 including holes and being used to secure the PCB 401 .

[0109] from Figure 4A As can be seen in FIG, the housing 403 further includes a side portion 405 that protrudes (or widens) in the plane of the pogo pin 402, and the side portion 405 includes a hole 406, the axis of the hole 406 being parallel to the plane of the pogo pin 402. Figure 4B See hole 406, Figure 4B A rear view of the test support module 400 is shown. Aperture 406 is adapted to secure the housing 403 of the test support module 400 within a test device (eg, in one or more pogo block locations).

[0110] The pogo pins are arranged, for example, in a pattern that fits the corresponding pads on the load board. As an example, the pogo pins can be arranged on a regular grid, such as in Figure 4A (wherein some grid positions may not have pogo pins). In other words, for example, there may be multiple rows of substantially parallel pogo pins. However, in some embodiments, there may be only one row of pogo pins on a PCB.

[0111] Figure 4C Shown is a front view of a test support module according to an embodiment, which may include a single housing or multiple housings (eg, dual housings, or eg, triple housings).

[0112] In embodiments, housing 403 may include a different number of holes 406 (eg, four holes 406 , or, for example, less than four holes 406 , or, for example, more than four holes 406 ).

[0113] However, it should be noted that the test support module 400 may optionally be supplemented by any of the features, functions, and details disclosed herein, which may be used alone or in combination.

[0114] Figure 4D A dual housing of a test support module is shown according to an embodiment.

[0115] Figure 4D A front view of the dual housing (e.g., a view intended for the side of the support module facing the load board) is shown. The tips of the pogo pins (some or all of which couple to signal path inputs and / or signal path outputs and / or control connections and / or supply connections of one or more support components) can be seen in the front view of the dual housing.

[0116] However, it should be noted that Figure 4D The dual housing shown may optionally be supplemented by any of the features, functions, and details disclosed herein, which may be used alone or in combination.

[0117] 5 to 8 show different embodiments of a test support module, in which different electronic support components are arranged in the test support module (in particular on or in a printed circuit board of the test support module).

[0118] Figures 5A to 5E Test support modules 500A-500B are shown according to an embodiment.

[0119] Figure 5A FIG. 5 shows a top view of a test support module 500A including at least one PCB 501 carrying pogo pins 502. The structure of the at least one PCB 501 is similar to Figures 4A to 4D The structure of the PCB shown in is the same.

[0120] At least one high-speed instrument switch 508 is disposed in the printed circuit board 501 of the test support module 500A. The switch 508 is, for example, Figure 5A RF mechanical relay 508 is shown.

[0121] Figure 5B FIG. 5 shows a top view of a test support module 500B including at least one PCB 501 carrying pogo pins 502. The structure of the at least one PCB 500B is, for example, similar to that in FIG. Figures 4A to 4D The structure of the PCB shown in is the same.

[0122] At least one high-speed instrument switch 509 is arranged in the printed circuit board 501 of the test support module 500B. The switch 509 is, for example, Figure 5B Mechanical MEMs relay 509 is shown.

[0123] As an example, Figure 5A and Figure 5BThe illustrated embodiment has four switches 508, 509 disposed on (or in) the PCBs of the test support modules 500A and 500B.

[0124] Figure 5C is a front view of test support modules 500A and 500B showing the tips of pogo pins 502 and illustrating the connection of pogo pins 502 to signal paths.

[0125] Figure 5D A block schematic diagram illustrating the functionality of test support modules 500A and 500B, which may act as switches to selectively connect an input pogo pin to a different output pogo pin, or vice versa.

[0126] Figure 5E A schematic representation of a test scenario using support modules 500A or 500B is shown. Figure 5E As seen in FIG, two channel modules 570, 572 of an automated test equipment are coupled to a load board interface (comprising a pogo block frame having a plurality of pogo block positions) via cables. These cables (not shown) terminate at pogo blocks 574, 576, which include pogo pins for contacting the load board. Pogo blocks for establishing connections with the channel modules are inserted into the pogo block frame. In addition, a test support module 580 (corresponding to the test support module described herein) is also inserted into the pogo block positions of the pogo block frame. When the load board is attached, connections are established between the pogo pins of the pogo blocks 574, 576 and the pogo pins of the test support module via routing 578 on the load board. In addition, connections are also established between the pogo pins of the test support module 580 and the pins of the device under test 590 via routing 582 on the load board (and further via the test socket or pogo tower and probe card).

[0127] Figures 5A to 5E The illustrated embodiments protect the relay from high temperatures (e.g., 160°C) that may be present in a load board, save space in the load board (e.g., for high multi-site sockets), provide independence of the relay from the load board and application, and provide high bandwidth and signal integrity.

[0128] However, it should be noted that the test support modules 500A and 500B may optionally be supplemented by any of the features, functions, and details disclosed herein, which may be used alone or in combination.

[0129] 6A to 6D A testing support module 600 is shown according to an embodiment.

[0130] Figure 6A FIG. 6 shows a top view of a test support module 600 comprising at least one PCB 601 carrying pogo pins 602. The at least one PCB 601 is similar in structure to the Figures 4A to 4D The structure of the PCB shown in is the same.

[0131] The test support module 600 includes at least one amplifier 610 disposed on (or in) a printed circuit board 601 of the test support module 600 . Figure 6A A top view of test support module 600 is shown. Figure 6A The illustrated embodiment has seven amplifiers 610 arranged, for example, on or in (eg, soldered on or embedded in) a PCB of the test support module 600 . Figure 6B A front view of the test support module 600 is shown, showing the tips of the pogo pins 602 and illustrating the connections of the pogo pins to the signal paths.

[0132] Figure 6C A schematic diagram of circuitry that may be implemented on test support module 600 is shown.

[0133] Figure 6D A schematic representation of a test scenario using the test support module 600 is shown. Figure 6D As can be seen in FIG, the pins of the device under test 670 are coupled to the input pins of a test support module 680 (which may correspond to the test support module 600) via traces (or routes) 672 on the load board. In addition, the output pins of the test support module 680 are coupled to the pins of a pogo block 690 via traces (or routes) 682 on the load board. The pogo block is coupled to one or more external processing devices 692 of the automatic test equipment, for example, via cables 694. The pogo block 690 is connected to cables that lead to the external devices 692 (e.g., a processor). Both the test support module 680 and the pogo block 690 are inserted into the pogo block position of the pogo block frame.

[0134] 6A to 6D The illustrated embodiments protect the amplifier from high temperatures (e.g., 160°C) that may be present in the load board, save space in the load board (e.g., for high multi-site sockets), provide independence from the load board and application, and provide high bandwidth and signal integrity.

[0135] However, it should be noted that the test support module 600 may optionally be supplemented by any of the features, functions, and details disclosed herein, which may be used alone or in combination.

[0136] 7A to 7CA testing support module 700 is shown according to an embodiment.

[0137] Figure 7A FIG shows a top view of a test support module 700 comprising at least one PCB 701 carrying pogo pins 702. The structure of the at least one PCB 701 is similar to Figures 4A to 4D The structures of the PCBs shown are the same.

[0138] The test support module 700 includes at least one multiplexer 711 arranged in a printed circuit board 701 of the test support module 700 . Figure 7A 7 shows a top view of the test support module 700. Figure 7A As shown, for example, twelve multiplexers 711 are arranged in two rows of six multiplexers on or in PCB 701 of test support module 700. Multiplexers 711 may be DC (eg, channel multiplexers such as ADG858).

[0139] Figure 7B A block diagram of the circuitry that can be implemented on the test support module 700 is shown. The multiplexing function of a 4-to-1 multiplexer is presented. This function saves, for example, 3x ATE channels.

[0140] Figure 7C A block diagram of circuitry that can be implemented on the test support module 700 is shown. A 2-to-1 multiplexer multiplexing function is shown. This function saves, for example, 1x ATE channels.

[0141] 7A to 7C The illustrated embodiment saves the number of ATE channels to be used, saves space in the load board (eg, for high multi-site sockets), and provides independence with respect to the load board and application.

[0142] However, it should be noted that the testing support module 700 may optionally be supplemented by any of the features, functions, and details disclosed herein, which may be used alone or in combination.

[0143] Figure 8A and Figure 8B A testing support module 800 is shown according to an embodiment.

[0144] Figure 8A FIG. 8 shows a top view of a test support module 800 comprising at least one PCB 801 carrying pogo pins 802. The at least one PCB 801 is structured similar to Figures 4A to 4D The structures of the PCBs shown are the same.

[0145] The test support module 800 includes at least one protocol converter 812 arranged in a printed circuit board 801 of the test support module 800 . Figure 8A 8 shows a top view of the test support module 800. Figure 8A As shown in FIG, for example, seven protocol converters 812 are arranged in the PCB 801 of the test support module 800. The protocol converter 812 may be, for example, a USB to RGMII converter and may also be combined with a JTAG switch, for example.

[0146] Figure 8B A block schematic diagram of circuitry that may be implemented on test support module 800 is shown.

[0147] Figure 8A and Figure 8B The illustrated embodiment provides an adapter to expand functionality and adapt to applications, while reducing complex LBA wiring and maintaining high signal performance. It also provides the function of saving load board space and protecting components from high temperatures.

[0148] However, it should be noted that the test support module 800 may optionally be supplemented by any of the features, functions, and details disclosed herein, which may be used alone or in combination.

[0149] Figures 9A to 9C The arrangement and connection of pogo pins in the test support module 900 according to an embodiment are shown.

[0150] Figure 9A A front schematic diagram of a test support module 900 according to an embodiment is shown. The tips of the pogo pins are shown, which are arranged in a grid of, for example, 4 rows, with, for example, 17 pogo pins in each row.

[0151] Figure 9A Schematically shows a front view of a test support module according to an embodiment. The tips of the pogo pins are shown to illustrate the arrangement of the pogo pins. The pogo pins are arranged in four rows, with 17 pogo pins in each row.

[0152] Figure 9B A table is shown that shows the pin assignments for the test support module 900. Figure 9B As can be seen in the figure, the pogo pins are arranged on two PCBs or in two PCBs (e.g., PCB1 and PCB2).

[0153] Figure 9C A schematic diagram of circuitry that may be implemented on test support module 900 is shown. Figure 9CApproximately 25% of the entire test support module is shown, i.e., the circuitry connected to one row of pogo pins. For example, there are three multiplexers connected to pogo pins 1-17. These multiplexers are correspondingly arranged on or in the PCB of the test support module 900 and electrically coupled to the pogo pins (e.g., Figure 9C The multiplexer input signal, multiplexer control signal, and power supply voltage are all provided via the pogo pins. The output of the multiplexer is also coupled to the pogo pins.

[0154] Generally speaking, the test support module 900 supports testing of a DUT, for example, by providing multiplexing functionality.

[0155] However, it should be noted that the test support module 900 may optionally be supplemented by any of the features, functions, and details disclosed herein, which may be used alone or in combination.

[0156] Figure 10 A testing arrangement 1000 according to an embodiment is shown.

[0157] The test arrangement 1000 comprises a pogo block frame 1001 comprising a plurality of pogo block positions or pogo block orientations (e.g., cutouts or openings adapted to receive pogo blocks or test support modules). One or more pogo blocks 1003 (comprising pogo pins and cables for establishing connections with one or more channel modules, such as pin electronics cards, of the test arrangement 1000) are arranged in one or more of the pogo block positions. One or more test support modules 1002 (e.g., shown in Figures 3 to 9) according to any of the above-described embodiments are arranged in one or more of the pogo block positions. It should be noted that the test support module 1002 is (mechanically) adapted to be inserted into one or more pogo block positions of the pogo block frame 1001. For example, the outer shape of the test support module 1002 may be selected to fit the pogo block position. Additionally, the test support module 1002 may comprise suitable fastening means to fasten the support module in the pogo block position. As an example, the test support module 1002 may be provided at its front side (e.g., Figure 3A The side (shown) includes holes or threaded holes (not shown) to secure the test support module 1002 in a pogo block location (e.g., using a plurality of screws). Alternatively or in addition, the test support module can include one or more snap-in features to snap the support module into one or more pogo block locations.

[0158] The pogo pins of the one or more pogo blocks 1003 and the pogo pins of the one or more test support modules 1002 (when inserted into the pogo block frame) are arranged to contact the load board (e.g., when the load board is attached to the test arrangement). The pogo pins of the one or more pogo blocks 1003 and the pogo pins of the one or more test support modules 1002 are arranged, for example, in a pattern that fits corresponding pads on the load board.

[0159] However, it should be noted that the testing arrangement 1000 may optionally be supplemented by any of the features, functions and details disclosed herein, which may be used alone or in combination.

[0160] Figure 11 A pogo block framework 1100 is shown according to an embodiment. The pogo block framework 1100 may be used, for example, Figure 10 In the test arrangement 1000 shown.

[0161] The pogo block frame 1100 includes a plurality of pogo block locations 1110 or pogo block positions. One or more pogo blocks 1120 (including for use with a test arrangement (e.g., Figure 10 One or more channel modules (such as pin electronics cards and cables) of the illustrated test arrangement 1000 are arranged in one or more of the pogo block locations 1110 .

[0162] When the pogo block framework 1100 is used in a test arrangement, one or more test support modules (eg, shown in FIG. 3 to FIG. 9 ) of a corresponding test arrangement according to any of the above-described embodiments are arranged in one or more of the pogo block locations 1110 .

[0163] The pogo pins of the one or more pogo blocks 1120 and the pogo pins of the one or more test support modules are arranged to contact the load board (eg, when the load board is attached to a test arrangement).

[0164] The one or more pogo blocks 1120 are grouped into, for example, 8 pogo blocks.

[0165] One or more pogo blocks 1120 are arranged, for example, in the peripheral area of the pogo block frame 1100. One or more pogo blocks 1120 are arranged, for example, in several rows along the edge of the pogo block frame 1100. Figure 11 As shown, the pogo blocks 1120 are arranged in 8 rows, for example, along the long side of the pogo block frame 1100. The pogo blocks 1120 are arranged in 16 columns, for example, along the short side of the pogo block frame 1100, 8 columns in the first peripheral area of the short side, and 8 columns in the second peripheral area of the short side.

[0166] The pogo block frame has an application space 1130 in a central region thereof. The application space is not affected by one or more pogo blocks 1120. The application space is disposed opposite a corresponding central region of the load board (eg, when the load board is attached to a test arrangement).

[0167] However, it should be noted that the pogo block framework 1100 may optionally be supplemented by any of the features, functions, and details disclosed herein, which may be used alone or in combination.

[0168] Figure 12 A support structure 1200 , such as a stiffener, for a load plate is shown according to an embodiment.

[0169] The support structure 1200 is realized as a frame (eg as a metal frame, eg as a rectangle comprising longitudinal and transverse bars or ribs forming a closed outer contour of the support structure 1200). The outer contour of the support structure 1200 is rectangular.

[0170] The support structure 1200 is divided into a plurality of sections 1210 (e.g., 8 sections, or 4 sections, or 2 sections, or 1 section, or any other number of sections) to correspond to the structure of the pogo block frame so as to align the pogo pin blocks with corresponding sockets (or pads) on or in the load board. A large central section 1220 formed in the central portion of the support structure 1200 corresponds to the application space of the pogo block frame and / or the load board.

[0171] A load board to be mounted in the test arrangement is arranged on a support structure 1200. The support structure 1200 includes a handle 1260 (eg, a metal handle) for easily installing or removing a load board mounted on the support structure 1200 on the test arrangement.

[0172] The test support module (e.g., the test support module shown in Figures 3 to 9) fits into the portion 1210 of the support structure 1200. For example, when the support structure 1200 is close to the pogo block frame, the front portion (e.g., the portion equipped with pogo pins) of the test support module (and the pogo block) can extend into the portion 1210 to contact the load board. Figure 10 When placed on the test arrangement (e.g., test module) shown in FIG, the test support module is arranged to be movable up and down (e.g., together with a pogo block frame that carries the test support module and further carries a pogo block), for example, it can be moved upward to connect to a load plate fixed to the support structure 1200.

[0173] However, it should be noted that the support structure 1200 may optionally be supplemented by any of the features, functions, and details disclosed herein, which may be used alone or in combination.

[0174] Figure 13A and Figure 13B A testing arrangement 1300 according to an embodiment is shown.

[0175] The test arrangement 1300 includes a pogo block frame 1301 including a plurality of pogo block locations 1302 or pogo block orientations. The pogo block frame can be mounted, for example, on a test head of an automated test equipment (wherein the channel modules are disposed within the test head). One or more pogo blocks 1303 are disposed in one or more of the pogo block locations 1302. It should be noted that a test support module (e.g., a test support module according to any of the above-described embodiments, such as those shown in Figures 3 to 9) is mechanically adapted to be inserted into one or more of the pogo block locations 1302 of the pogo block frame 1301.

[0176] When the load board 1304 is attached to the test arrangement, the pogo pins of the test support module are arranged to contact the load board 1304. The pogo pins of the test support module are arranged in a pattern that fits corresponding pads on the load board 1304, for example.

[0177] The load plate 1304 includes a plurality of blocks 1305 of pogo pads in a peripheral region of the load plate 1304 (e.g., on a second side of the load plate 1304 opposite the first side of the load plate 1304) (where, for example, a central region of the load plate 1304 is free of pogo pads).

[0178] The load board can have different numbers of pogo pad blocks 1305 corresponding to the pogo pin blocks. For example, two groups (or four groups, or eight groups) of pogo pad blocks 1305 can be symmetrically arranged along at least one longitudinal peripheral area of the load board 1304.

[0179] Figure 13B Also shown is a support structure 1310 on which the load plate 1304 is mounted. The support structure 1310 may be, for example, Figure 12 The support structure shown in .

[0180] However, it should be noted that the testing arrangement 1300 may optionally be supplemented by any of the features, functions, and details disclosed herein, which may be used alone or in combination.

[0181] Figure 14 A testing arrangement 1400 according to an embodiment is shown.

[0182] Figure 14 A 3D view of the disassembled test arrangement 1400 is shown.

[0183] The test arrangement 1400 includes a pogo block frame 1410 (e.g., formed as a pogo tower) for establishing a connection between a load board 1420, such as a general DUT board (arranged to be, for example, fixed in a support structure 1430, such as a DUT board stiffener) and a probe card 1440. The probe card 1440 is arranged (e.g., fixed) in a probe card support structure 1450, such as a probe card stiffener (inserted into a probe head board 1470).

[0184] The pogo block frame 1410 includes a plurality of pogo block locations (e.g., formed as sectors of a circular ring or as segments of a pogo tower). A through-connection pogo block for establishing a connection between opposing surfaces of the pogo block frame 1410 is disposed in one or more of the pogo block locations. Furthermore, one or more test support modules are disposed in one or more of the pogo block locations.

[0185] The pogo block frame 1410 has a cylindrical shape and includes a cylindrical through-cut portion at a central portion. The pogo block positions are arranged in a peripheral area of the pogo block frame 1410.

[0186] The pogo block frame 1410 includes a plurality of pogo block locations 1480 (e.g., formed as sectors of a donut shape or as segments of a pogo tower). A through-connection pogo block for establishing a connection between opposing surfaces of the pogo block frame 1410 is disposed in one or more of the pogo block locations 1480. Furthermore, one or more test support modules are disposed in one or more of the pogo block locations 1480.

[0187] Segment 1480 may, for example, include the functionality of a test support module with pogo pins on only one side. However, in this case, the test support module may have the same shape as a through-connection pogo module.

[0188] The pogo pins at a first side of the one or more through-connected pogo blocks are arranged to contact the load board 1420 , while the pogo pins at a second side of the one or more through-connected pogo blocks are arranged to contact the probe card 1450 .

[0189] However, it should be noted that the testing arrangement 1400 may optionally be supplemented by any of the features, functions, and details disclosed herein, which may be used alone or in combination.

[0190] Figure 15A top view of a load plate 1500 is shown according to an embodiment.

[0191] The load plate 1500 is fixed in a support structure 1510. The support structure can be, for example, Figure 12 Same as shown in .

[0192] The load board 1500 includes a plurality of blocks 1505 of pogo pads in a peripheral region of the load board (where, for example, a central region of the load board is free of pogo pads).

[0193] The support structure 1510 is implemented as a frame, for example as a metal frame. Pogo pins of one or more test support modules (not shown) are arranged, for example, in a pattern that fits corresponding pads on the load board 1510.

[0194] The support structure 1510 includes fastening means 1540 (eg, screws, or alternative fastening means) for removably attaching the support structure 1510 with the load plate 1500 mounted thereon to a testing arrangement.

[0195] The load board 1500 may be mounted, for example, on a Figure 10 , Figure 13 and Figure 14 In the test arrangement shown.

[0196] However, it should be noted that the load plate 1500 may optionally be supplemented by any of the features, functions, and details disclosed herein, either used alone or in combination.

[0197] Embodiments of the present invention may achieve one or more of the following advantages. Embodiments of the present invention create a concept that allows application engineers to develop simple circuits in the field without relying on factory-generated products, and / or saves load board space, and / or protects electronic components from damage due to high temperatures, and / or improves tester channel resources and signal performance. Embodiments of the present invention create a concept that is more efficient from the perspectives of: customization, and / or component lifespan, and / or high signal performance and / or tester channel resources, and / or reusability and / or cost.

[0198] Further embodiments and aspects

[0199] In the following, further aspects and embodiments according to the present invention will be described, which may be used alone or in combination with any other embodiments disclosed herein.

[0200] Furthermore, the embodiments disclosed in this section may optionally be supplemented by any of the other features, functions, and details disclosed herein, which may be used alone or in any combination.

[0201] In the following, the Extending the application space of load boards concept.

[0202] Hereinafter, the basic idea of embodiments of the present invention will be described.

[0203] Embodiments according to the present invention are based on the discovery that a pogo block is a simple unit that connects pogo pins to cables using a PCB.

[0204] In the following, some goals and objectives of the present invention will be described, which goals and objectives may be achieved in some or all embodiments.

[0205] Embodiments according to the present invention allow achieving one or more of the following objectives:

[0206] Customize low-cost and highly flexible load boards driven by application requirements

[0207]

[0014] In the following, aspects, ideas, features, functions, and details are described, which may optionally be incorporated alone or in combination into any embodiment disclosed herein.

[0208] Embodiments according to the present invention are based on the discovery that removing the cable, retaining the plastic housing, and placing the components on a PCB (e.g., that of a conventional pogo block) allows for easy customization of applications, such as provided in the embodiments disclosed herein. In other words, embodiments according to the present invention may, for example, take the form of a conventional pogo block, wherein the cable is removed and replaced by one or more test support components (where the PCB is adapted to connect the pogo pins to the one or more test support components, rather than to the cable).

[0209] Advantages of an embodiment may be, for example, one or more of the following:

[0210] Achieve low cost, low complexity, high flexibility and on-site customization;

[0211] Embodiments enable new applications in the field, such as reducing ATE channels and lowering costs (e.g., because the test support module can, for example, connect a single ATE channel to multiple DUT pins);

[0212] • Embodiments do not take up valuable load board component space (e.g., because the test support module can contact the load board, for example, in the area reserved for the pogo block). This is important for multi-site:

[0213] Protecting components (e.g., protecting test support components) from high or low temperatures;

[0214] The embodiment maintains high signal quality;

[0215] • Leverage and reuse across many applications. In an embodiment, no dependency on a load board is provided (eg, in the sense that support components do not need to be soldered to the load board).

[0216] An example of an embodiment according to the present invention is Figures 4A to 4D Displayed in.

[0217] In the following, further aspects of the basic idea of embodiments of the present invention will be described.

[0218] · Ordinary or regular PE card consists of pin electronic board, coaxial cable and pogo block.

[0219] The signals are routed from the normal or regular PE card to the pogo block and then to the load board.

[0220] An example of a conventional PE card and connections known in the prior art is shown in Figure 1 (Prior Art).

[0221] According to aspects of the present invention, the novel idea is to route signals from the load board into a pogo block (e.g., into a pogo block of a test support module), where customized application-specific components are placed, wherein, for example, application-specific components (also designated as test support components) can be placed on or in a printed circuit board connected to the pogo block of the test support module. In an embodiment of the present invention, the signals are routed from there (e.g., from the test support module) back to the load board.

[0222] For example, in an embodiment, no interaction with the test system electronics (or any cables) is provided. For example, the test support module can have no (additional) (direct) cable connection to the test system electronics. Rather, for example, all signals can be routed via the pogo pins of the test support module (and thus via the load board).

[0223] • This makes the concept of aspects of the present invention highly customizable, flexible and very low cost.

[0224] Figure 2 Examples of new aspects, such as the test support module and its connection to the load board, are shown in .

[0225] In the following, motivations for extending the application space (eg, using embodiments according to the present invention) will be described.

[0226] Hereinafter, it will be described what problems or disadvantages can be solved according to embodiments of the present invention.

[0227] In other words, in the following, some objects of the present invention will be described, which objects can be achieved (at least partially) in some or all embodiments.

[0228] According to the embodiments of the present invention, a low-cost, application-customizable solution can be achieved:

[0229] For example, a solution that allows application engineers to develop simple circuits in the field rather than relying on factory-generated products.

[0230] • Utilizing empty pogo block locations or positions to expand load board component space in accordance with embodiments of the present invention (e.g., by placing test support modules in such empty pogo block locations or positions):

[0231] According to an embodiment, load board space in production is often occupied by sockets (e.g., device under test sockets) to drive multi-site testing. According to an embodiment of the present invention, load board space is saved for components (e.g., by placing test support components on a test support module and coupling the test support module to the load board via pogo pins in the pogo block contact area).

[0232] According to the embodiments of the present invention, protection for very high temperature tests can be achieved:

[0233] According to embodiments of the present invention, components (e.g., test support components on a test support module) are shielded from low test temperatures or high test temperatures (between -50°C and 170°C), such as those found in, for example, automotive final testing. The specified temperature for most load board components is 85°C.

[0234] Embodiments according to the present invention allow scaling of tester resources and saving on ATE capital costs:

[0235] According to an embodiment, one or more DC multiplexers with high fan-out are used to increase multi-site count in production (where, for example, the DC multiplexers are placed on a test support module).

[0236] Embodiments according to the present invention allow for significant savings in tester channel resources, for example, a factor of 4 for the DC channel. Thus, a MUX function can be provided (e.g., on a test support module) that is helpful to the customer. Using this concept according to embodiments, this can be achieved at low cost.

[0237] • Embodiments according to the present invention allow signal performance to be preserved:

[0238] Embodiments according to the present invention allow components (e.g., test support components) to be placed very close to the instrument's pogo pins, rather than routing signals back and forth from the tester's pogo to the application space in the center of the load board. For example, a test support module can be placed at a pogo block location (or pogo block orientation) that is close to (or adjacent to) another pogo block location that is used to establish a connection with a channel module of an automated test equipment (e.g., a connection to a signal path that extends through the test support module).

[0239] The embodiments according to the present invention allow a reusable plug-and-play scalable solution:

[0240] Embodiments according to the present invention allow for solution reuse, upgradeability, plug-and-play independent of applications and load boards.

[0241] Differences

[0242] In the following, some differences between the conventional solution and the embodiment according to the present invention will be described.

[0243] It has been found that conventional solutions have the following problems.

[0244] Test head “pocket” solutions (e.g. for RF or power multiplexers (PMUX)) are products that do not provide:

[0245] Flexibility to apply custom solutions on site

[0246] Possibility to create simple, low-cost solutions

[0247] Extend the application value and use cases of existing products

[0248] Save valuable component space

[0249] Current product solutions are in the center of the LBA and take up space in the application, which limits the placement of more sockets for higher multi-site testing and / or increases cabling complexity.

[0250] Reusable, plug-and-play solution, easy to expand and upgrade

[0251] Adjust component space

[0252] Using a double or triple shell, the solution can be adapted to the component size.

[0253] Embodiments of the present invention allow some or all of these problems to be addressed.

[0254] In contrast, embodiments according to the present invention may provide one or more of the following advantages:

[0255] Flexibility to apply custom solutions on site

[0256] Possibility to create simple, low-cost solutions

[0257] Extend the application value and use cases of existing products

[0258] Save valuable component space

[0259] The embodiment of the present invention is not located in the center of the LBA, but in the peripheral area of the load board, so it does not take up a lot of application space. This allows more sockets to be placed to obtain higher multi-site testing and / or increase the complexity of the wiring.

[0260] Reusable, plug-and-play solution, easy to expand and upgrade

[0261] Adjust component space

[0262] Using a double or triple (triple) housing, the solution can be adjusted to the component size. For example, the test support module can include the size of two or three (or even more) pogo block locations or positions and can be inserted into two or three (or even more) adjacent unused pogo block positions.

[0263] pogo shell space

[0264] Figures 4A to 4D A device (e.g., a test support module) according to an embodiment is shown wherein, for example, a cable is removed and wherein one or more test support components are placed in a “component space” area of the test support module, such as in an area on a printed circuit board opposite the tips of pogo pins secured to the printed circuit board.

[0265] According to an embodiment, the size of the component space (eg, "12 mm") of a device (eg, a test support module) may be expanded, for example, if space is available in the test head.

[0266] For example, one or more test support components may be one or more MEMs RF switches (e.g., Figure 5A and Figure 5B ) and / or one or more multiplexers (e.g., as Figure 7A shown).

[0267] Embedded High-Speed Instrument Switches

[0268] Use Case Example 1

[0269] Aspects and embodiments of the present invention are Figures 5A to 5E Displayed in.

[0270] • Embodiments according to the present invention allow protection of relays (eg RF mechanical relays and / or MEMs relays) from high temperatures (eg 160°C).

[0271] • No load board space is required in accordance with the embodiments of the present invention. In embodiments according to the present invention, space is freed up for high multi-site sockets.

[0272] • Embodiments according to the present invention allow for high leverage: independent of load plate and application.

[0273] • The embodiments according to the present invention allow for an easily customizable, upgradeable and extensible concept.

[0274] • Embodiments according to the present invention allow maintaining high bandwidth and signal integrity / performance.

[0275] Embedded amplifier

[0276] Use Case Example 2: Processor Interface

[0277] Aspects and embodiments of the present invention are 6A to 6D Displayed in.

[0278] • Embodiments according to the present invention allow protection of relays from high temperatures (eg 160°C).

[0279] • No load board space is required in accordance with the embodiments of the present invention. In embodiments according to the present invention, space is freed up for high multi-site sockets.

[0280] • The embodiments according to the invention allow for a reusable concept: independent of the load board and the application.

[0281] • The embodiments according to the present invention allow for an easily customizable, upgradeable and extensible concept.

[0282] Saving ATE costs - lost cost channels

[0283] Use Case Example 3: DC Multiplexer Fanout

[0284] Aspects of the present invention are 7A to 7C Displayed in.

[0285] • According to an embodiment of the present invention, muxing x4 saves ~4x ATE channels.

[0286] • No load board space is required in accordance with the embodiments of the present invention. In embodiments according to the present invention, space is freed up for high multi-site sockets.

[0287] • Embodiments according to the present invention allow for high leverage: independent of load plate and application.

[0288] • The embodiments according to the present invention allow for an easily customizable, upgradeable and extensible concept.

[0289] Interface converter

[0290] Use Case Example 4: USB / RGMII Converter + JTAG MUX

[0291] Aspects of the present invention are Figure 8A-8B Displayed in.

[0292] • Embodiments according to the present invention allow adapters to extend product functionality and adapt to applications.

[0293] • Embodiments according to the present invention allow protection of relays from high temperatures (eg 160°C).

[0294] • Embodiments according to the present invention allow for reduction of complex LBA routing while maintaining high signal performance.

[0295] • No load board space is required in accordance with the embodiments of the present invention. In embodiments according to the present invention, space is freed up for high multi-site sockets.

[0296] • Embodiments according to the present invention allow utilization independent of load board and application.

[0297] • The embodiments according to the present invention allow for an easily customizable, upgradeable and extensible concept.

[0298] Furthermore, it should be noted that the embodiments and procedures may be used as described in this section and may optionally be supplemented by any of the features, functions, and details disclosed herein (and throughout this document), either alone or in combination.

[0299] Alternative Implementation Methods

[0300] Although some aspects are described in the context of an apparatus, it is clear that these aspects also represent a description of a corresponding method, where a block or device corresponds to a method step or a feature of a method step. Similarly, aspects described in the context of a method step also represent a description of a corresponding block or item or feature of a corresponding apparatus. Some or all of the method steps can be performed by or using a hardware device (e.g., a microprocessor, a programmable computer, or an electronic circuit). In some embodiments, one or more of the most important method steps can be performed by such an apparatus.

[0301] The embodiments described herein are merely illustrative of the principles of the present invention. It should be understood that modifications and variations of the arrangements and details described herein will be readily apparent to those skilled in the art. Accordingly, the present invention is intended to be limited only by the scope of the following claims and not by the specific details presented by way of description and explanation of the embodiments herein.

Claims

1. A test support module (300) for supporting testing of one or more devices under test in an automatic test equipment, the test support module (300) comprising: A plurality of pogo pins (301) adapted to establish a connection with a load board or a probe card; One or more electrical or electronic support components (302) configured to support testing of the one or more devices under test, wherein the one or more support components (302) are electrically coupled to the pogo pins; wherein the test support module is adapted to be inserted into one or more pogo block locations of a pogo block frame such that the pogo pins are aligned to contact the load board or the probe card, The test support module includes electrical connections only on the load board side or only on the probe card side.

2. The test support module according to claim 1, in, The test support module is electrically coupled to its environment via the plurality of pogo pins.

3. The test support module according to claim 1 or claim 2, in, The test support module is configured to avoid direct coupling with a channel module of the automatic test equipment, but is configured to couple only to the load board.

4. The test support module according to claim 1 or claim 2, in, The test support module is configured to couple a single automatic test equipment channel to a plurality of device under test pins.

5. The test support module according to claim 1 or claim 2, in, The one or more electrical or electronic support components are adapted to be positioned in a signal path between an automatic test equipment channel and one or more devices under test.

6. The test support module according to claim 1 or claim 2, in, One or more signal path inputs and one or more corresponding signal path outputs of the test support module are coupled to the pogo pins.

7. The test support module according to claim 1 or claim 2, in, The test support module is configured to receive one or more control signals that control functionality of one or more of the electrical or electronic support components via one or more of the pogo pins.

8. The test support module according to claim 1 or claim 2, in, The test support module includes a switch, The switch is located in the signal path between a signal path input of the test support module and a signal path output of the test support module.

9. The test support module according to claim 1 or claim 2, in, The test support module includes a multiplexer, The multiplexer is located in the signal path between a signal path input of the test support module and a signal path output of the test support module.

10. The test support module according to claim 1 or claim 2, in, The test support module includes a signal distributor, The signal distributor is located in a signal path between a signal path input of the test support module and a plurality of signal path outputs of the test support module, and is adapted to simultaneously distribute a signal received from the signal path input of the test support module to the plurality of signal path outputs of the test support module.

11. The test support module according to claim 1 or claim 2, in, The test support module includes a signal conditioner, The signal conditioner is located in a signal path between a signal path input of the test support module and a signal path output of the test support module and is adapted to manipulate a signal received from the signal path input of the test support module.

12. The test support module according to claim 1 or claim 2, in, The test support module includes a protocol converter, The protocol converter is located in a signal path between a first signal path port of the test support module and a second signal path port of the test support module and is adapted to perform protocol conversion.

13. The test support module according to claim 1 or claim 2, in, The test support module is adapted to be inserted into a plurality of pogo block locations of a pogo block frame such that the pogo pins are aligned to contact the load board or the probe card.

14. The test support module according to claim 1 or claim 2, in, The test support module includes one or more printed circuit boards, the printed circuit boards being parallel to the axes of the pogo pins, Therein, the one or more electrical or electronic support components are arranged on the one or more printed circuit boards.

15. The test support module according to claim 1 or claim 2, in, The test support module includes a housing, wherein the housing includes a plurality of holes on a side adapted to face the load board or the probe card, the pogo pins extending through the holes, the housing further including a mounting structure for mounting the test support module at a pogo block position of a pogo block frame, and, Wherein, the one or more electrical or electronic test support components are arranged on a printed circuit board, and the printed circuit board is placed in the housing.

16. A test arrangement (1000) for testing one or more devices under test, in, The test arrangement (1000) comprises a pogo block framework (1001), the pogo block framework (1001) comprising a plurality of pogo block positions, wherein one or more pogo blocks (1003) include pogo pins and cables for establishing connections with one or more channel modules of the test arrangement, the pogo blocks being arranged in one or more of the pogo block locations; and, wherein one or more test support modules according to any one of claims 1 to 15 are arranged in one or more of said pogo block locations, wherein the pogo pins of the one or more pogo blocks (1003) and the pogo pins of the one or more test support modules are arranged to contact a load board.

17. The test arrangement according to claim 16, in, The test arrangement further comprises a load board, wherein the pogo pins of the one or more pogo blocks contact the load board, and Wherein, the pogo pins of the one or more test support modules contact the load board.

18. A test arrangement according to claim 16 or claim 17, in, The test arrangement includes a signal path extending from the load board to one of the test support modules and back to the load board.

19. A test arrangement according to claim 16 or claim 17, in, The test arrangement includes a signal path extending through the test support module.

20. A test arrangement according to claim 16 or claim 17, in, the signal path of the test arrangement extending from the channel module via a cable to a given one of the pogo blocks, from a given one of the pogo blocks via a pogo pin of a given one of the pogo blocks to a first pogo pad of the load board, from the first pogo pad of the load board to a second pogo pad of the load board, from the second pogo pad of the load board to an input of a given one of the test support modules via a pogo pin of the test support module, from an output of a given one of the test support modules via another pogo pin of the test support module to a third pogo pad of the load board, and from the third pogo pad of the load board to a device under test; and / or wherein the signal path of the test arrangement extends from the device under test to a fourth pogo pad of the load board, from the fourth pogo pad of the load board to the input end of the test support module, from the output end of the test support module to the fifth pogo pad of the load board, from the fifth pogo pad of the load board to the sixth pogo pad of the load board, from the sixth pogo pad on the load board via a pogo pin of a given one of the pogo blocks to a given one of the pogo blocks, and from a given one of the pogo blocks to a channel module of the automatic test equipment via a cable.

21. A test arrangement according to claim 16 or claim 17, in, The pogo block locations are arranged in a peripheral area of the pogo block frame.

22. A test arrangement according to claim 16 or claim 17, in, The pogo block frame includes at least one row of exemptions, wherein the exemptions are adapted to mount a plurality of pogo blocks and test support modules at pogo block locations of the pogo block frame.

23. A test arrangement according to claim 16 or claim 17, in, The pogo block frame, the pogo block, and the test support module are adapted to enable the pogo block and test support module to be interchangeably mounted in the pogo block location.

24. A test arrangement according to claim 16 or claim 17, in, The load board includes one or more device under test sockets in a central region of the load board, and, wherein the load plate includes a plurality of pogo pad blocks in a peripheral region of the load plate.

25. A test arrangement according to claim 16 or claim 17, in, The one or more test support modules are arranged to contact pogo pads of the load board in a peripheral region of the load board.

26. A test arrangement according to claim 16 or claim 17, in, The one or more test support modules are arranged to contact the load board from a first side, such as pogo pads of the load board, opposite a second side of the load board on which one or more device under test sockets are arranged.

27. A test arrangement according to claim 16 or claim 17, in, The test arrangement is mounted on a test head of an automatic test equipment.

28. A test arrangement according to claim 16 or claim 17, in, The test arrangement is configured to selectively couple a given channel of the automatic test equipment to a plurality of device under test pins or to a support device such as a processor, wherein a switch or multiplexer for selecting which pin of the device under test the given channel of the automatic test equipment is coupled to is arranged on one of the one or more test support modules; or The test arrangement is configured to process a signal provided by the device under test in the test support module to obtain a processed signal, and forward the processed signal to a given channel of the automatic test equipment or to a support device such as a handler.

29. A test arrangement according to claim 16 or claim 17, in, The test arrangement is configured to distribute a signal provided by a given channel of the automatic test equipment to a plurality of device under test pins, Wherein, distribution circuitry for distributing the signal provided by the given channel of the automatic test equipment is disposed on one of the one or more test support modules.

30. A test arrangement for testing one or more devices under test, in, The test arrangement includes a pogo block framework including a plurality of pogo block positions, wherein one or more through-connecting pogo blocks for establishing a connection between opposing surfaces of the pogo block frame are arranged in one or more of the pogo block locations, and, wherein one or more test support modules according to any one of claims 1 to 15 are arranged in one or more of said pogo block locations, wherein the pogo pins at the first side of the one or more through-connected pogo blocks are arranged to contact the load board, and wherein the pogo pins at the second side of the one or more through-connection pogo blocks are arranged to contact the probe card, and The pogo pins of the one or more test support modules are arranged to contact the load board or the probe card.

31. The test arrangement according to claim 30, in, The testing arrangement further comprises a load board, wherein the pogo pins at the first side of the one or more through-connected pogo blocks contact the load board, and, Wherein, the pogo pins of the one or more test support modules contact the load board.

32. A test arrangement according to claim 30 or claim 31 , in, The test arrangement further comprises a probe card, wherein the pogo pins at the second side of the one or more through-connected pogo blocks contact the probe card, and, Wherein, the pogo pins of the one or more test support modules contact the probe card.

33. A test arrangement according to claim 30 or claim 31 , in, The test arrangement includes: a signal path extending from the load board to one of the test support modules and back to the load board, and / or a signal path extending from the probe card to one of the test support modules and back to the probe card, and / or a signal path extending from the load board to one of the test support modules and from one of the test support modules to the probe card, and / or a signal path extending from the probe card to one of the test support modules and from one of the test support modules to the load board.

34. A test arrangement according to claim 30 or claim 31 , in, The test arrangement includes a signal path extending through the test support module.

35. A test arrangement according to claim 30 or claim 31 , in, The pogo block locations are arranged in a peripheral area of the first side and / or a peripheral area of the second side of the pogo block frame.

36. A test arrangement according to claim 30 or claim 31 , in, The pogo block frame is cylindrical in shape and / or includes a cylindrical cut-through portion in a central portion.

37. A method for operating automatic test equipment, in, The method comprises routing, via a test support module according to any one of claims 1 to 15, signals to be provided as test stimulus signals to, or provided by, a device under test.

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