Cutting method and optical element

Abstract

The present application provides a cutting method and an optical element, wherein the cutting method cools down the target structure by placing it within a preset temperature range, so that the target structure absorbs part of the heat of the laser when being cut by the laser; and by cutting the target structure on two sides, and cutting the target structure on two sides, it is possible to prevent the same side of the target structure from absorbing too much heat, and prevent the target structure from generating bubbles, black spots, deformation, and breakage due to local rapid heating when the laser is cutting the target structure, thereby improving the yield rate of the target structure.

Description

Technical Field

[0001] The present application belongs to the field of laser cutting technology, and more specifically, to a cutting method and an optical element. Background Art

[0002] With the development of science and technology, glass is increasingly used in optical components such as mobile phones, AR (Augmented Reality) and VR (Virtual Reality). As glass has high transparency and high flatness, it is irreplaceable by other PET (Polyethylene terephthalate) materials. Therefore, glass is generally used as the base material of optical components. At the same time, film materials are attached to the glass to improve the display effect of the optical components.

[0003] In the prior art, when processing optical AR and VR lenses, the following two methods are usually used to cut the lenses: one is mechanical cutting; the other is to use laser to cut the glass substrate and the film material separately. In this way, the above-mentioned cutting technical solutions have the following problems: when mechanical cutting of optical elements is used, burrs are easily generated on the edges of the cut optical elements, resulting in low yield of the optical elements; laser cutting of the glass substrate and the film material in the optical elements is used separately, which is easy to cause the glass substrate and the film material to deform and break, and in the process of bonding the film material to the glass substrate, bubbles are easily generated between the film material and the glass substrate, resulting in low yield of the optical elements. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a cutting method and an optical element to solve the technical problem of low yield rate of optical elements during processing in the prior art.

[0005] To achieve the above object, the first aspect of the present application is to provide a cutting method, which comprises the following steps:

[0006] maintaining the target structure within a preset temperature range;

[0007] Cutting inward from the first surface to a first preset depth along a first preset path by laser;

[0008] Cutting the intermediate element inward from the second surface to a second preset depth along the first preset path by laser;

[0009] The first surface and the second surface are arranged opposite to each other, and the sum of the first preset depth and the second preset depth is not less than the distance between the first surface and the second surface.

[0010] In one embodiment, the frequency of the laser is between 850KHZ and 900KHZ, and / or the cutting speed of the laser is between 380mm / s and 400mm / s.

[0011] In one embodiment, the intermediate element is used to form a target element, and an edge of the target element and an edge of the intermediate element form an intermediate area; the cutting method further includes:

[0012] separating the intermediate element from the target structure;

[0013] The intermediate region is separated from the intermediate element to obtain the target element.

[0014] In one embodiment, the step of cutting inwardly from the first surface to a first preset depth along a first preset path by laser comprises the following steps:

[0015] adjusting the target structure to a first preset position;

[0016] The laser cuts inwardly the intermediate component along a first predetermined path and to the first predetermined depth on the first surface.

[0017] In one embodiment, the step of adjusting the target structure to the first preset position includes the following steps:

[0018] irradiating the first surface with a preset light and causing the preset light to generate reflected light on the first surface;

[0019] The laser altimeter receives the reflected light and determines whether the target structure is at the first preset position according to the reflected light;

[0020] If yes, the laser cuts the intermediate element inwardly along the first preset path and the first preset depth on the first surface;

[0021] If not, the laser altimeter sends out an alarm message.

[0022] In one embodiment, the step of cutting inwardly from the first surface to a first preset depth along a first preset path by laser further includes the following steps:

[0023] The laser cuts and locates a target on the first surface along a second preset path.

[0024] In one embodiment, the step of cutting the intermediate element by laser along the first preset path from the second surface to a first preset depth inwardly comprises the following steps:

[0025] adjusting the target structure to a second preset position by using the positioning target;

[0026] The laser cuts the intermediate element inwardly along the first predetermined curve and the second predetermined depth on the second surface.

[0027] In one embodiment, the step of adjusting the target structure to the second preset position comprises the following steps:

[0028] Using an industrial camera to photograph the target structure in real time and obtain the position information of the positioning target;

[0029] Comparing the position information of the positioning target with the second preset position information, and determining whether the position information of the positioning target coincides with the second preset position information;

[0030] If yes, the laser cuts the intermediate element inwardly along the first preset path and the second preset depth on the second surface;

[0031] If not, the target structure is adjusted to move to the second preset position.

[0032] In one embodiment, the step of maintaining the target structure within a preset temperature range comprises:

[0033] pre-cooling the target structure within a preset temperature range;

[0034] Fixing the target structure within the preset temperature range; wherein,

[0035] The temperature within the preset temperature range is between 12°C and 14°C.

[0036] The cutting method provided by the present application has the following beneficial effects: compared with the prior art, the cutting method of the present application includes maintaining the target structure within a preset temperature range, cutting a first preset depth inward from the first surface along a first preset path by a laser, and cutting a second preset depth inward from the second surface along the first preset path by a laser to cut out an intermediate element; wherein the first surface and the second surface are arranged relative to each other, and the sum of the first preset depth and the second preset depth is not less than the distance between the first surface and the second surface; by adopting the above steps, the target structure is placed within a preset temperature range to cool down the target structure, so that the target structure absorbs part of the heat of the laser when being cut by the laser; by cutting the target structure in two side surfaces, compared with the technical solution of cutting one side of the target structure by a laser in the prior art, cutting the target structure in two side surfaces can prevent the same side of the target structure from absorbing too much heat, and prevent the target structure from generating bubbles, black spots, deformation and breakage due to local rapid heating when the laser is cutting the target structure, thereby improving the yield rate of the target structure.

[0037] In a second aspect, the present application provides an optical element, which is cut by any of the cutting methods described above.

[0038] The beneficial effect of the optical element provided by the present application is that: compared with the prior art, the optical element provided by the present application is cut by the cutting method provided by any one of the above-mentioned embodiments, and the optical element structure is placed in a preset temperature range for cooling, so that the optical element absorbs part of the heat of the laser when being laser cut; by cutting the optical element on two sides, compared with the technical solution of cutting one side of the optical element by laser in the prior art, cutting the optical element on two sides can prevent the same side of the optical element from absorbing too much heat, and prevent the optical element from generating bubbles, black spots, deformation and breakage due to local rapid heating of the laser when cutting the optical element, thereby improving the yield rate of the target structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0040] Figure 1 A schematic diagram of a process for a cutting method provided in an embodiment of the present application;

[0041] Figure 2 A schematic diagram of a specific process of the cutting method provided in an embodiment of the present application;

[0042] Figure 3 A schematic diagram of a specific process of step 1 provided in an embodiment of the present application;

[0043] Figure 4 A schematic diagram of a specific process of step 2 provided in an embodiment of the present application;

[0044] Figure 5 A schematic diagram of a specific process of step 3 provided in an embodiment of the present application;

[0045] Figure 6 A schematic diagram of a specific process of step 4 provided in an embodiment of the present application;

[0046] Figure 7 An exploded view of the target structure provided by an embodiment of the present application;

[0047] Figure 8 A front view of a target structure provided in an embodiment of the present application;

[0048] Fig. 9 A schematic diagram of the structure of the intermediate element 2 provided in an embodiment of the present application.

[0049] Among them, the reference numerals in the figure are:

[0050] 10. Glass substrate; 20. Film material; 21. Quarter glass; 22. Polarizer; 23. Reflective polarizer; 30. First curve; 40. Second curve; 50. Intermediate element; 51. Intermediate area; 60. Target element; 70. First positioning target; 80. Second positioning target. DETAILED DESCRIPTION

[0051] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0052] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0053] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0054] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0055] Please also read Figures 1 to 9 , the cutting method and optical element provided in the embodiments of the present application are now described.

[0056] The first aspect of the present application is to provide a cutting method, which comprises the following steps:

[0057] Step 1, maintaining the target structure within a preset temperature range;

[0058] Step 2, cutting inward from the first surface to a first preset depth along a first preset path by laser;

[0059] Step 3, cutting from the second surface to a second preset depth inward along a first preset path by laser to cut out the intermediate element 50;

[0060] The first surface and the second surface are arranged opposite to each other, and the sum of the first preset depth and the second preset depth is not less than the distance between the first surface and the second surface.

[0061] Specifically, in this application, please refer to 7 to Fig. 9 The target structure is a sheet structure with a length and width of 201*125mm and a thickness of 0.5mm. The target structure includes a glass substrate 10 and a film material 20 attached to the glass substrate 10, wherein the film material 20 is attached to one side of the glass substrate 10. Of course, the film material 20 can also be attached to two opposite sides of the glass substrate 10. For the sake of convenience, in this application, the film material 20 attached to one side of the glass substrate 10 is used as an example for description.

[0062] The film material 20 includes a quarter glass plate 21 , a polarizer 22 and a reflective polarizer 23 . The quarter glass plate 21 , the polarizer 22 and the reflective polarizer 23 are sequentially stacked on one side of the glass substrate 10 using colorless and transparent optical glue.

[0063] The first preset path can be designed as required, such as a straight line, an open curve or a closed curve, wherein when the first preset path is a straight line open curve, the straight line or the open curve extends from one circumferential side wall of the target structure to the other circumferential side wall of the target structure. For ease of description, in the embodiments of the present application, the first preset path is taken as a closed curve as an example for description.

[0064] When the first preset path is a closed curve, there are two closed curves, which are a first curve 30 and a second curve 40, respectively. The first curve 30 and the second curve 40 have the same shape, and a first area surrounded by the first curve 30 is smaller than a second area surrounded by the second curve 40. The first area corresponds to the target element 60, the second area corresponds to the intermediate element 50, and the center of the target element 60 coincides with the center of the intermediate element 50.

[0065] The shapes of the intermediate element 50 and the target element 60 are both elliptical. Of course, the shapes of the intermediate element 50 and the target element 60 can also be circular or polygonal such as a triangle, a quadrilateral, a pentagon, etc. For ease of description, in this application, the shapes of the intermediate element 50 and the target element 60 are both elliptical.

[0066] The first preset depth is equal to half of the distance between the first surface and the second surface, and the second preset depth is equal to half of the distance between the first surface and the second surface. Of course, the first preset depth may be greater than or less than half of the distance between the first surface and the second surface, and the second preset depth may be greater than or less than half of the distance between the first surface and the second surface. For ease of explanation, in this application, an example is taken in which a preset depth is equal to half of the distance between the first surface and the second surface, and a second preset depth is equal to half of the distance between the first surface and the second surface.

[0067] It should be noted that two rows of intermediate components 50 are arranged on each target structure, and there are three intermediate components 50 in each row of intermediate components 50 , that is, six intermediate components 50 can be processed from each target structure.

[0068] See also Figures 1 to 3 In an embodiment of the present application, in step 1, the step of maintaining the target structure within a preset temperature range includes the following steps:

[0069] Step 1.1, pre-cooling the target structure within a preset temperature range;

[0070] Step 1.2, fixing the target structure within the preset temperature range;

[0071] Wherein, the temperature within the preset temperature range is between 12°C and 14°C.

[0072] Specifically, in the embodiment of the application, in the step 1.1 of placing the target structure within the first preset temperature range for pre-cooling: a cooling box is used to pre-cool the target structure, a cooling space is formed inside the cooling box, and the cooling space is cooled by a cooling gun, and the cooling gun uses a vortex tube cooler to inject cooling gas into the cooling space. Among them, the vortex tube cooler compresses the air into cold vortex flow and hot vortex flow, the hot vortex flow is emitted through the suppressor and discharged from the hot gas outlet, and the cold vortex flow enters the cooling space through the cooling gun to cool the cooling space until the temperature in the cooling space is within the preset temperature range. The target structure is placed in the cooling space for pre-cooling until the temperature of the target structure is consistent with the temperature of the cooling space.

[0073] Four target structures can be placed in the cooling space at the same time, so that the cooling space can pre-cool multiple target structures at the same time.

[0074] Specifically, in an embodiment of the present application, in the step of fixing the target structure within the preset temperature range in step 1.2: a workbench is used to fix the target structure, the workbench is connected to a ball screw extending along the X-axis and Y-axis directions, and the ball screws extending along the X-axis and Y-axis directions are provided with drive motors, and the drive motors are controlled to rotate by a computer, so that the workbench can move along the X-axis direction and the Y-axis direction respectively.

[0075] The processing table fixes the target structure by vacuum adsorption. At the same time, a cooling gun is connected to the processing table to cool the target structure when the laser beam cuts the intermediate element 50, so that the temperature of the target structure is maintained within a preset temperature range during the process of being cut by the laser beam.

[0076] At the same time, when the worktable moves along the X-axis and Y-axis directions, a grating ruler is used to determine the displacement of the worktable, and the displacement of the worktable is fed back to the computer, so that the computer controls the drive motor and ball screw to drive the worktable to move precisely.

[0077] It should be noted that the X-axis direction and the Y-axis direction are located in the same plane, and the X-axis direction and the Y-axis direction are perpendicular to each other.

[0078] Preferably, in an embodiment of the present application, the cooling temperature of the cooling space and the cooling gun on the processing table is 13°C.

[0079] In another embodiment of the present application, the cooling temperature of the cooling space and the cooling gun on the processing table is 12°C.

[0080] In another embodiment of the present application, the cooling temperature of the cooling space and the cooling gun on the processing table is 14°C.

[0081] In another embodiment of the present application, the implementation method of step 1 is: the target structure can be placed in a constant temperature environment with an ambient temperature of 13°C for pre-cooling, and the working environment of the workbench is set to a constant temperature environment with a temperature of 13°C.

[0082] See also Figure 1 , Figure 2 and Figure 4 In an embodiment of the present application, step 2 includes the following steps:

[0083] Step 2.1, adjusting the target structure to a first preset position;

[0084] Step 2.2: Laser cuts the intermediate element 50 inwardly along a first preset path and a first preset depth on the first surface.

[0085] Specifically, in an embodiment of the present application, in the step of adjusting the target structure to the first preset position in step 2.1: the target structure is fixed on the processing table and is located at the first preset position, and at this time, the error value between the flatness of the target structure and the preset flatness is within the error range, and the first surface faces the laser beam.

[0086] The first surface is irradiated with a preset light so that the preset light generates a reflected light on the first surface. The reflected light is received by a laser altimeter to determine whether the error value between the flatness of the target structure and the preset flatness is within ±0.02 mm.

[0087] Of course, the laser altimeter can also be used to receive the light reflected by the center position of the six target elements 60, and generate six position data according to the center position of the six target elements 60. Six preset position data can be set inside the laser altimeter, and the six position data correspond to the six preset position data one by one, and each preset position data is used to determine whether the position data corresponding to it is within the error range, thereby determining whether the target structure is at the first preset position. At the same time, the laser altimeter also measures the thickness of the target structure according to the reflected light to prevent the target structure from being missed or over-placed.

[0088] When the flatness of the target structure is within the error range, the laser cuts the intermediate element 50 along the first preset depth on the first surface.

[0089] If the flatness of the first surface is not within the error range, the laser altimeter sends out an alarm message to facilitate the operator to adjust the target structure.

[0090] In step 2.2, the laser cuts the intermediate element 50 inwardly along the first pre-path and the first preset depth on the first surface: the laser is generated by a laser, and the laser outputs a laser beam with a wavelength of 532nm. After being expanded by a beam expander, the laser beam is emitted into the X-axis optical scanning head and the Y-axis optical scanning head in the laser scanner, and then passes through the electronic drive amplification unit in the laser scanner, and then enters the X-axis reflector and the Y-axis reflector of the laser scanner. Then, the laser scanner generates a rapid swing under computer control, so that the laser beam scans in two directions in the X-axis direction and the Y-axis direction of the plane.

[0091] It should be noted that the laser beam is focused to form a fine and high energy density cutting spot. After being reflected by the X-axis reflector and the Y-axis reflector, the laser beam cuts the intermediate component 50 along the first curve 30 and the second curve 40 and the first preset depth on the first surface.

[0092] The laser emission frequency is 1000KHZ, the power factor is 85%-90%, and the laser cutting speed is between 380mm / s-400mm / s.

[0093] Preferably, the power factor of the laser transmitter is 90%, and the cutting speed of the laser is 400 mm / s, that is, the frequency of the laser beam acting on the target structure is 900 KHZ.

[0094] In another embodiment of the present application, the power factor of the laser transmitter is 85%, and the cutting speed of the laser is 380 mm / s, that is, the frequency of the laser beam acting on the target structure is 850 KHZ.

[0095] After the laser beam cuts the first intermediate element 50 along the first preset depth on the first surface, the computer controls the movement of the fixed table to move the remaining five intermediate elements 50 in turn to the cut position of the first intermediate element 50, so that the laser beam cuts the remaining five intermediate elements 50 in turn along the first preset depth on the first surface.

[0096] In an embodiment of the present application, in step 2, the step of cutting inward from the first surface to a first preset depth along a first preset path by laser, further includes:

[0097] Step 2.3: The laser cuts the positioning target on the first surface along the second preset path, wherein the second surface is adjusted to face the laser according to the positioning target.

[0098] Specifically, in the embodiment of the present application, in the step 2.3 in which the laser cuts the positioning target on the first surface along the second preset path: in the step in which the second path includes a closed third curve and a fourth curve, the area surrounded by the third curve corresponds to the first positioning target 70, the area surrounded by the fourth curve corresponds to the second positioning target 80, the area of ​​the first positioning target 70 is larger than the area of ​​the second positioning target 80, and the shape of the first positioning target 70 is the same as or different from the shape of the second positioning target 80, and the first positioning target 70 and the second positioning target 80 are arranged at intervals. In the present application, for the sake of convenience, the shape of the first positioning target 70 and the shape of the second positioning target 80 are the same as an example for description.

[0099] The shapes of the first positioning target 70 and the second positioning target 80 are both rectangular. The length and width of the first positioning target 70 are 5*2 mm respectively, and the length and width of the second positioning target 80 are 3*2 mm respectively.

[0100] See also Figure 1 , Figure 2 and Figure 5In the embodiment of the present application, in step 3, the step of cutting the intermediate element 50 inward from the second surface along the first preset path by laser to a second preset depth includes the following steps:

[0101] Step 3.1, adjusting the target structure to a second preset position by positioning the target;

[0102] Step 3.2: laser cuts the intermediate element 50 inwardly along the first preset path and the second preset depth on the second surface.

[0103] Specifically, in the present application, in step 3.1 of adjusting the target structure to the second preset position by means of the positioning target, the operator preliminarily determines whether the second surface of the target structure faces the laser beam by determining whether the positions of the first positioning target 70 and the second positioning target 80 coincide with the target preset position. An industrial camera is used to determine whether the target structure is in the second preset position. When the target structure is in the second preset position, the second surface faces the laser beam, and the first positioning target 70 and the second positioning target 80 coincide with the target preset position information.

[0104] The position information of the intermediate component 50 and the first positioning target 70 and the second positioning target 80 is captured in real time by an industrial camera, and the position information of the first positioning target 70 and the second positioning target 80 is compared with the target preset position information, and it is determined whether the first positioning target 70 and the second positioning target 80 coincide with the target preset position; if the first positioning target 70 and the second positioning target 80 coincide with the target preset position, the laser cuts the intermediate component 50 inward on the second surface along the first preset path and the second preset depth.

[0105] If the first positioning target 70 and the second positioning target 80 do not coincide with the target preset position, the industrial camera moves in the X-axis and Y-axis directions through computer adjustment, and the first positioning target 70 and the second positioning target 80 coincide with the target preset position.

[0106] The laser beam is focused on the second surface to form fine and high energy density cutting spots. After being reflected by the X-axis reflector and the Y-axis reflector, the laser beam cuts the intermediate component 50 along the first curve 30 and the second curve 40 and the second preset depth on the second surface.

[0107] After the first intermediate element 50 on the second surface is cut along the second depth, the workbench moves in the X-axis and Y-axis directions driven by the computer so that the laser beam sequentially cuts the remaining five intermediate elements 50 on the second side along the second depth.

[0108] In this application, please see Figure 1 , Figure 2 and Figure 6 , the method further comprises:

[0109] Step 4: Separate the middle region 51 from the middle component 50 to obtain the target component 60 .

[0110] In the intermediate element 50, by setting the intermediate region 51 on the periphery of the target element 60, the formation of stress on the target element 60 is reduced when the laser beam cuts the target structure. At the same time, when the intermediate element 50 is separated from the target structure and the intermediate region 51 is separated from the target element 60, the yield rate of the target element 60 is improved.

[0111] In the embodiment of the present application, in step 4, the step of separating the intermediate region 51 from the intermediate element 50 to obtain the target element 60 includes the following steps:

[0112] Step 4.1, separating the intermediate element 50 from the target structure;

[0113] Step 4.2, separating the middle region 51 from the target element 60.

[0114] In the embodiment of the present application, in step 4.1 of separating the intermediate element 50 from the target structure: a first splitting jig is used to separate the intermediate element 50 from the target structure.

[0115] In step 4.2 of separating the middle region 51 from the target element 60 , a second splitting jig is used to separate the middle region 51 from the target element 60 .

[0116] Before using the first splitting jig to separate the intermediate component 50 from the target structure and using the second splitting jig to separate the target component 60 from the intermediate component 50 , it is necessary to use pressure-sensitive paper to confirm the flatness of the first splitting jig and the second splitting jig.

[0117] Specifically, in an embodiment of the present application, the first split jig includes a first fixed platform and a first upper pressing shaft that can be close to or away from the first fixed platform. Among them, a first fixed structure, such as a fixing groove, whose shape and size are the same as those of the target structure is provided on the first fixed platform, and six first accommodating cavities are formed on the first fixed structure, the shape of the first accommodating cavity is the same as that of the intermediate element 50, and the size of the first accommodating cavity is not less than the size of the intermediate element 50, and the six first accommodating cavities correspond to the positions of the six intermediate elements 50 on the target structure. A first profiling silicone head whose shape and size are the same as those of the intermediate element 50 is provided on the first pressing shaft. And the first pressing shaft is driven by a cylinder, so that the first pressing shaft drives the first profiling silicone head to move toward the first fixing mechanism.

[0118] It should be pointed out that the first fixed platform can move in the X-axis and Y-axis directions, such as by being driven by a ball screw extending along the X-axis and Y-axis directions, and the ball screw extending along the X-axis and Y-axis directions is driven by a drive motor, and the drive motor is controlled to rotate by a computer, thereby realizing that the first fixed platform can move in the X-axis and Y-axis directions.

[0119] The second split jig includes a second fixed platform and a second upper pressing shaft that can approach or move away from the second fixed platform. The second fixed platform is provided with a second fixed structure, such as a fixing groove, whose shape and size are the same as those of the intermediate element 50, and a second accommodating cavity is formed on the second fixed structure. The shape of the second accommodating cavity is the same as that of the target element 60, and the size of the second accommodating cavity is not less than the size of the target element 60. The second pressing shaft is provided with a second contoured silicone head whose shape and size are the same as those of the target element 60. The second pressing shaft is driven by a cylinder, so that the second pressing shaft drives the second contoured silicone head to move toward the second fixing mechanism.

[0120] Before performing step 4.1 to separate the intermediate element 50 from the target structure, place the pressure-sensitive paper on the first fixed structure, and the cylinder drives the first pressing shaft to drive the first contoured silicone head to press against the pressure-sensitive paper. Then, the cylinder drives the first pressing shaft to drive the first contoured silicone head to separate from the pressure-sensitive paper. By analyzing the color development on the pressure-sensitive paper, the pressure balance, pressure distribution, and pressure size of the first contoured silicone head acting on the intermediate element 50 when the intermediate element 50 is separated from the target structure are analyzed.

[0121] If the color distribution of the pressed part of the first profiling silicone head on the pressure-sensitive paper is uniform, it is considered that the first profiling silicone head has the best effect in separating the intermediate element 50 from the target structure. Otherwise, it is necessary to adjust the moving speed and hardness of the first profiling silicone head until the color distribution of the pressed part of the first profiling silicone head on the pressure-sensitive paper meets the requirements.

[0122] Preferably, in the present application, the moving speed of the first contoured silicone head is 1 mm / s and the hardness is 80 degrees.

[0123] In step 4.1 of separating the intermediate element 50 from the target structure, the cylinder drives the first pressing shaft to drive the first contoured silicone head to move toward the first fixed platform at 1 mm / s until it abuts against the intermediate element 50, thereby separating the intermediate element 50 from the target structure.

[0124] After the first profiling silicone head separates the first intermediate element 50 on the target structure from the target structure, the first fixed platform drives the remaining five intermediate elements 50 to abut against the first profiling silicone head in turn, thereby separating all six intermediate elements 50 on the target structure from the target structure.

[0125] In another embodiment of the present application, the number of the first contoured silicone heads is 6, the 6 first contoured silicone heads correspond one-to-one to the positions of the 6 intermediate elements 50 on the target structure, and the 6 first contoured silicone heads simultaneously separate the 6 intermediate elements 50 on the target structure from the target structure.

[0126] Before performing step 4.2 of separating the middle area 51 from the target element 60, the pressure-sensitive paper is placed on the second fixed structure, and the cylinder drives the second pressing shaft to drive the second profiling silicone head to press the pressure-sensitive paper, and then the cylinder drives the second pressing shaft to drive the second profiling silicone head to separate from the pressure-sensitive paper, and the pressure balance, pressure distribution, pressure size, etc. of the second profiling silicone head acting on the target element 60 when separating the target element 60 from the middle element 50 are analyzed by color development on the pressure-sensitive paper. If the color distribution of the pressing part of the second profiling silicone head on the pressure-sensitive paper is uniform, it is considered that the second profiling silicone head has the best effect of separating the target element 60 from the middle element 50, otherwise, it is necessary to adjust the moving speed and hardness of the second profiling silicone head until the color distribution of the pressing part of the second profiling silicone head on the pressure-sensitive paper meets the requirements.

[0127] Preferably, in the present application, the moving speed of the second contoured silicone head is 1 mm / s and the hardness is 80 degrees.

[0128] In step 4.2 of separating the middle area 51 from the target element 60 , the cylinder drives the second pressing shaft to drive the second contoured silicone head to move toward the second fixed platform at 1 mm / s until it abuts against the target element 60 , thereby separating the target element 60 from the middle element 50 .

[0129] Compared with the prior art, the cutting method of the present application includes maintaining the target structure within a preset temperature range, cutting a first preset depth inward from the first surface along a first preset path by a laser, and cutting a second preset depth inward from the second surface along the first preset path by a laser to cut out an intermediate element 50; wherein the first surface and the second surface are arranged relative to each other, and the sum of the first preset depth and the second preset depth is not less than the distance between the first surface and the second surface; by adopting the above steps, the target structure is placed within the preset temperature range to cool down the target structure, so that the target structure absorbs part of the heat of the laser when being cut by the laser; by cutting the target structure in two side surfaces, compared with the technical solution of cutting one side of the target structure by laser in the prior art, cutting the target structure in two side surfaces can prevent the same side of the target structure from absorbing too much heat, and prevent the target structure from generating bubbles, black spots, deformation and breakage due to local rapid heating when the laser is cutting the target structure, thereby improving the yield rate of the target structure.

[0130] In a second aspect, the present application provides an optical element, which is cut by any one of the above-mentioned cutting methods.

[0131] For details, please refer to Fig. 9 In the implementation of the present application, the optical element is an elliptical sheet structure. The optical element includes a glass substrate 10 and a film material 20 attached to the glass substrate 10, wherein the film material 20 is attached to one side of the glass substrate 10. Of course, the film material 20 can also be attached to two opposite sides of the glass substrate 10. For the sake of convenience, in the present application, the film material 20 is attached to one side of the glass substrate 10 as an example.

[0132] The film material 20 includes a quarter glass plate 21 , a polarizer 22 and a reflective polarizer 23 . The quarter glass plate 21 , the polarizer 22 and the reflective polarizer 23 are sequentially stacked on one side of the glass substrate 10 using colorless and transparent optical glue.

[0133] Compared with the prior art, the optical element provided in the present application is cut by the cutting method provided by any of the above-mentioned embodiments, and the optical element structure is placed in a preset temperature range for cooling, so that the optical element absorbs part of the heat of the laser when being laser cut; by cutting the optical element on two sides, compared with the technical solution of cutting one side of the optical element by laser in the prior art, cutting the optical element on two sides can prevent the same side of the optical element from absorbing too much heat, and prevent the optical element from generating bubbles, black spots, deformation and breakage due to local rapid heating of the laser when cutting the optical element, thereby improving the yield rate of the target structure.

[0134] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A cutting method for cutting a target structure, wherein the target structure is an optical element, wherein the optical element comprises a glass substrate and a film material attached to the glass substrate, wherein: The cutting method comprises the following steps: Maintaining the target structure within a preset temperature range includes: pre-cooling the target structure within the preset temperature range; fixing the target structure within the preset temperature range; wherein the temperature within the preset temperature range is between 12° C. and 14° C.; Cutting inwardly from the first surface to a first preset depth along a first preset path by laser; wherein the first preset path is a closed curve, the number of the closed curves is two, the two closed curves are respectively a first curve and a second curve, the first curve and the second curve have the same shape, and a first area surrounded by the first curve is smaller than a second area surrounded by the second curve, the first area corresponds to a target element, the second area corresponds to an intermediate element, and the center of the target element coincides with the center of the intermediate element; Cutting the intermediate element inward from the second surface to a second preset depth along the first preset path by laser; Wherein, the first surface and the second surface are arranged opposite to each other, and the sum of the first preset depth and the second preset depth is not less than the distance between the first surface and the second surface; The intermediate element is used to form a target element, and an edge of the target element and an edge of the intermediate element form an intermediate area; the cutting method further comprises: Separating the intermediate element from the target structure using a first splitting fixture; Using a second splitting jig to separate the middle region from the middle component to obtain the target component; Before using the first splitting jig to separate the intermediate element from the target structure and before using the second splitting jig to separate the intermediate region from the intermediate element, using pressure-sensitive paper to confirm the flatness of the first splitting jig and the second splitting jig; The step of cutting inwardly from the first surface to a first preset depth along a first preset path by laser comprises the following steps: adjusting the target structure to a first preset position; The laser cuts the intermediate element inwardly on the first surface along a first preset path and at the first preset depth; The step of adjusting the target structure to the first preset position comprises the following steps: irradiating the first surface with a preset light and causing the preset light to generate reflected light on the first surface; The reflected light is received by a laser altimeter to determine whether the error value between the flatness of the target structure and the preset flatness is within ±0.02 mm; If yes, the laser cuts the intermediate element inwardly along the first preset path and the first preset depth on the first surface; If not, the laser altimeter sends out an alarm message.

2. The cutting method according to claim 1, characterized in that: The frequency of the laser is between 850KHZ and 900KHZ, and / or the cutting speed of the laser is between 380mm / s and 400mm / s.

3. The cutting method according to claim 1, characterized in that: The step of cutting inwardly from the first surface to a first preset depth along a first preset path by laser also includes the following steps: The laser cuts and locates a target on the first surface along a second preset path.

4. The cutting method according to claim 3, characterized in that: The step of cutting the intermediate element by cutting from the second surface to a first preset depth inwardly along the first preset path by laser comprises the following steps: adjusting the target structure to a second preset position by using the positioning target; The laser cuts the intermediate component inwardly along the first predetermined path and the second predetermined depth on the second surface.

5. The cutting method according to claim 4, characterized in that: The step of adjusting the target structure to the second preset position comprises the following steps: Using an industrial camera to photograph the target structure in real time and obtain the position information of the positioning target; Comparing the position information of the positioning target with the second preset position information, and determining whether the position information of the positioning target coincides with the second preset position information; If yes, the laser cuts the intermediate element inwardly along the first preset path and the second preset depth on the second surface; If not, the target structure is adjusted to move to the second preset position.

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