Pattern transfer system, sheet, method, and computer program product

Abstract

The present invention provides a pattern transfer system, sheet, method, and computer program product. The pattern transfer system includes a laser scanning device, a movable stage, and a controller. The laser scanning device includes a laser scanning head configured to irradiate a source substrate with a laser beam, the source substrate including a plurality of grooves arranged in a first pattern and holding a printing paste, and the source substrate is configured to release the printing paste from the grooves onto a receiving substrate when irradiated by the laser beam. The receiving substrate can be fixedly attached to the movable stage. The controller is configured to control the movement of the laser scanning head along the grooves and along a scanning direction across the grooves, and the controller is further configured to move the movable stage to produce a second pattern of deposited paste on the receiving substrate. Dynamic pattern transfer can be used to accommodate receiving substrates of different widths for achieving more efficient pattern transfer and / or achieving a one-to-many pattern transfer technology with high wafer throughput.

Description

Technical Field

[0001] The present invention relates to the field of pattern transfer printing (PTP), and more particularly to non-contact pattern transfer of high viscosity slurry. Background Art

[0002] The most common method for printing high-viscosity pastes in the solar photovoltaic (PV) and electronics industries is screen printing. In this method, a screen is brought into contact with a receiving substrate, the paste is pushed through openings in the screen, and the printed pattern replicates the pattern of the screen. The receiving substrate and screen are stationary during printing, so the deposited paste pattern cannot be changed during printing (e.g., see Luque and Hegedus (eds.) 2011, Handbook of PV Science and Engineering, pp. 276-277).

[0003] U.S. Patent No. 9,616,524, the entire contents of which are incorporated herein by reference, teaches a method for depositing a material on a receiving substrate, the method comprising: providing a source substrate having a rear surface and a front surface, the rear surface carrying at least one coating material; providing a receiving substrate positioned adjacent to the source substrate and facing the coating material; and radiating light toward the front surface of the source substrate to remove at least one coating material from the source substrate and deposit the removed at least one coating material as a whole onto the receiving substrate. In this method, the source substrate, which defines the pattern to be deposited, does not contact the receiving substrate. The source and receiving substrates are stationary during printing, so that the deposited slurry pattern replicates the pattern of the source substrate, and the deposited slurry pattern cannot change during printing.

[0004] In some industrial applications, there is a need to adjust an existing pattern of a source substrate according to changes in the target positions of printed lines on a receiving substrate, and to increase the throughput of the pattern transfer system. Summary of the Invention

[0005] The following is a brief summary to provide an initial understanding of the present invention. The summary does not necessarily identify key elements nor limit the scope of the present invention, but merely serves as an introduction to the following description.

[0006] One aspect of the present invention provides a pattern transfer system, which includes: a laser scanning device, the laser scanning device including a laser scanning head, the laser scanning head configured to irradiate a source substrate with a laser beam, the source substrate including a plurality of grooves arranged in a first pattern and holding a printing paste, wherein the source substrate is configured to release the printing paste from the grooves onto a receiving substrate when irradiated by the laser beam; a movable stage to which the receiving substrate can be fixedly attached; and a controller, the controller configured to control the laser scanning head to move along the grooves and along a scanning direction across the grooves, and the controller is also configured to move the movable stage to produce a second pattern of deposited paste on the receiving substrate.

[0007] In some examples, the controller is configured to move the movable stage at least along the scanning direction and / or in a direction opposite to the scanning direction.

[0008] In some examples, adjacent grooves in the first pattern have a first gap p1 between them, and the second pattern includes a plurality of deposited paste lines deposited by the printing paste of the grooves, and adjacent deposited paste lines of the plurality of deposited paste lines have a second gap p2 between them. Assuming that the interval between the deposition of adjacent deposited paste lines is t, and the scanning speed of the laser scanning head along the scanning direction is v S The movable stage is configured to move along the scanning direction at a speed v F During exercise, p2=p1·(v S -v F ) / v S , making the first gap larger than the second gap; and / or, the movable stage is configured to be able to move in a direction opposite to the scanning direction at a speed v B During exercise, p2=p1·(v S +v B ) / v S , so that the first gap is smaller than the second gap.

[0009] In some examples, the source substrate includes at least one groove group, and the controller is further configured to calculate the second gap relative to the first gap based on a relationship between a width of one groove group in the at least one groove group and a width of the receiving substrate.

[0010] In some examples, the source substrate includes a plurality of groove groups for depositing slurry on a plurality of receiving substrates, and the controller is further configured to deposit the slurry in each groove group onto one of the plurality of receiving substrates, and to switch the plurality of receiving substrates on the movable stage to continuously deposit the slurry on the plurality of receiving substrates.

[0011] In some examples, the controller is configured to cause the laser scanning head to print sequentially from the first groove to the last groove of each groove group, and is configured to position and set the first predefined deposited slurry line on the next receiving substrate to be opposite to the first groove of the next groove group on the source substrate when switching to the next receiving substrate.

[0012] In some examples, the controller is further configured to control, when switching the next receiving substrate, the scanning speed of the laser scanning head in the scanning direction, the interval of the corresponding groove groups, and the duration required to switch and position the next receiving substrate in a relationship such that the interval corresponds to the product of the scanning speed of the laser scanning head in the scanning direction and the duration required to switch and position the next receiving substrate.

[0013] In some examples, the controller is further configured to switch to another source substrate after the printing paste retained in the grooves of all groove groups of the source substrate is transferred, and the laser scanning head returns to its initial position.

[0014] Another aspect of the present invention provides a pattern transfer sheet for use with the above-mentioned pattern transfer system, wherein the pattern transfer sheet includes a plurality of groups of grooves configured to receive printing paste and release the printing paste onto a receiving substrate when irradiated by a laser beam, and the plurality of groups are spaced apart at regular intervals.

[0015] In some examples, the gaps between adjacent grooves in each group are equal.

[0016] In some examples, the gaps between adjacent grooves in all groups are equal.

[0017] In some examples, the gap is between 0.1 mm and 0.3 mm.

[0018] In some examples, the intervals between adjacent groups in the plurality of groups are equal.

[0019] In some examples, the interval corresponds to a product of a scanning speed of the laser scanning head along the scanning direction multiplied by a duration required to switch and position an adjacent receiving substrate.

[0020] In some examples, the spacing is between 1 mm and 10 mm.

[0021] In some examples, the pattern transfer sheet is transparent to laser radiation, comprises a polymer layer, and the grooves are formed in the pattern transfer sheet by embossing, pneumatic forming, or laser forming.

[0022] In some examples, the polymer layer includes a top polymer layer and a bottom polymer layer, the groove is disposed on the top polymer layer, and the bottom polymer layer has a melting temperature higher than an imprinting temperature of the top polymer layer.

[0023] In some examples, the top polymer layer and the bottom polymer layer are each between 10 μm and 100 μm thick and are attached by an adhesive layer thinner than 10 μm, and wherein the bottom polymer layer is at least as thick as the top polymer layer.

[0024] In some examples, the top polymer layer and the bottom polymer layer are each between 25 μm and 40 μm thick and are attached by an adhesive layer thinner than 2 μm, and wherein the bottom polymer layer is at least as thick as the top polymer layer.

[0025] In some examples, the top polymer layer has a melting temperature below 170° C. if the top polymer layer is made of a semi-crystalline polymer, or a glass transition temperature below 160° C. if the top polymer layer is made of an amorphous polymer.

[0026] In some examples, the top polymer layer has a melting temperature below 110° C. if the top polymer layer is made of a semi-crystalline polymer, or a glass transition temperature below 100° C. if the top polymer layer is made of an amorphous polymer.

[0027] Yet another aspect of the present invention provides a pattern transfer method comprising irradiating a source substrate with a laser beam and controllably moving the receiving substrate to produce a second pattern of deposited slurry on the receiving substrate.

[0028] In some examples, a first gap p1 is formed between adjacent grooves of the plurality of grooves on the source substrate, and a second gap p2 is formed between adjacent deposited slurry lines on the receiving substrate. The pattern transfer method includes: moving the receiving substrate along the scanning direction to obtain a second pattern on the receiving substrate in which the second gap is smaller than the first gap, or moving the receiving substrate in a direction opposite to the scanning direction to obtain a second pattern on the receiving substrate in which the second gap is larger than the first gap.

[0029] In some examples, assuming that the interval between the deposition of adjacent deposition slurry lines is t, the scanning speed of the laser scanning head along the scanning direction is v S , when the movable stage moves along the scanning direction at a speed v F During exercise, p2=p1·(v S- v F ) / v S , so that the first gap is larger than the second gap; or when the movable stage moves in a direction opposite to the scanning direction at a speed v B During exercise, p2=p1·(v S +v B ) / v S , so that the first gap is smaller than the second gap.

[0030] In some examples, the source substrate has at least one groove group, and the pattern transfer method further includes calculating the second gap relative to the first gap based on a relationship between a width of one groove group of the at least one groove group and a width of the receiving substrate.

[0031] In some examples, the source substrate includes a plurality of groove groups for depositing slurry on a plurality of receiving substrates. The pattern transfer method further includes depositing the slurry in each groove group onto one of the plurality of receiving substrates; and switching the receiving substrates when the laser scanning head moves between adjacent groove groups, thereby depositing the slurry from the source substrate onto the plurality of receiving substrates.

[0032] In some examples, the laser scanning head prints sequentially from the first groove to the last groove of each groove group, and when switching to the next receiving substrate, the first pre-defined deposited slurry line on the next receiving substrate is positioned and set to be opposite to the first groove of the next groove group on the source substrate.

[0033] In some examples, when switching the next receiving substrate, the relationship between the scanning speed of the laser scanning head in the scanning direction, the interval of the corresponding groove groups, and the duration required to switch and position the next receiving substrate is: the interval corresponds to the product of the scanning speed of the laser scanning head in the scanning direction and the duration required to switch and position the next receiving substrate.

[0034] When the printing paste held in the grooves of all groove groups of the source substrate is transferred completely, another source substrate is switched, and the laser scanning head returns to its initial position.

[0035] Another aspect of the present invention provides a computer program product, comprising a computer-readable medium storing a program, wherein the program implements the above-mentioned pattern transfer method when executed by a processor.

[0036] The relative motion of the receiving substrate relative to the stationary source substrate during printing provides flexibility in pattern transfer, enabling adjustments to the existing pattern of the source substrate based on changes in the target position of the printed line on the receiving substrate. This relative motion is only possible using non-contact printing methods such as PTP. Furthermore, the disclosed pattern transfer sheet enables pattern transfer printing in a one-to-many mode, transferring from one source substrate to multiple wafers—increasing the throughput of the pattern transfer system.

[0037] These, additional and / or other aspects and / or advantages of the invention are set forth in the detailed description which follows; may be inferred from the detailed description; and / or may be learned by practice of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] For a better understanding of embodiments of the invention and to show how they may be practiced, reference will now be made, by way of example only, to the accompanying drawings in which like references indicate corresponding elements or parts throughout.

[0039] In the attached figure:

[0040] Figure 1A and Figure 1B is a high-level schematic diagram of a dynamic pattern transfer system according to some embodiments of the present invention.

[0041] Figure 2 is a high-level schematic diagram of modification of a transferred pattern by a dynamic pattern transfer system according to some embodiments of the present invention.

[0042] Figure 3 is a high-level schematic diagram of modifying a transferred pattern based on wafer width by a dynamic pattern transfer system according to some embodiments of the present invention.

[0043] Figure 4 is a high-level schematic diagram of the motion of a source substrate and a movable stage for one-to-many slurry deposition according to some embodiments of the present invention.

[0044] Figure 5A is a high-level block diagram of an exemplary controller that may be used with embodiments of the present invention.

[0045] Figure 5B is a high-level schematic cross-sectional view of a pattern transfer sheet according to some embodiments of the present invention.

[0046] Figure 6is a high-level flow chart illustrating a dynamic pattern transfer method according to some embodiments of the present invention.

[0047] It will be understood that, for simplicity and clarity of illustration, the elements shown in the drawings are not necessarily drawn to scale. For example, for clarity, the dimensions of some elements may be exaggerated relative to other elements. In addition, where deemed appropriate, reference numerals may be repeated in the drawings to indicate corresponding or similar elements. DETAILED DESCRIPTION

[0048] In the following description, various aspects of the present invention are described. For illustrative purposes, specific configurations and details are set forth to provide a thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without the specific details presented herein. In addition, well-known features may have been omitted or simplified so as not to be confused with the present invention. With specific reference to the accompanying drawings, it is emphasized that the details shown are by way of example and are only used for the purpose of illustrative discussion of the present invention and are presented in order to provide the most useful and most easily understood description of the principles and concepts of the present invention. In this regard, no attempt is made to illustrate the structural details of the present invention in more detail than is necessary for a basic understanding of the present invention, and the description in conjunction with the accompanying drawings makes it apparent to those skilled in the art how several forms of the present invention can be implemented in practice.

[0049] Before describing in detail at least one embodiment of the present invention, it should be understood that the invention is not necessarily limited in its application to the details of the construction and the arrangement of components set forth in the following description or illustrated in the accompanying drawings. The present invention is applicable to other embodiments and combinations of the disclosed embodiments that can be practiced or executed in various ways. In addition, it should be understood that the phraseology and terminology employed herein are for descriptive purposes only and should not be considered as limiting.

[0050] Unless otherwise clearly indicated from the following discussion, it should be understood that throughout this specification, discussions utilizing terms such as "control," "process," "compute," "calculate," "determine," "enhance," and "obtain" refer to the actions and / or processes of a computer or computing system or similar electronic computing device that manipulate and transform data represented as physical, such as electronic, quantities within the computing system's registers or memories into other data similarly represented as physical quantities within the computing system's memories, registers, or other such information storage, transmission, or display devices.

[0051] Embodiments of the present invention provide efficient and economical methods and mechanisms for improving pattern transfer printing (PTP), thereby providing improvements in the art of wafer production. A dynamic pattern transfer system and method is provided that separates the design of a groove pattern on a source substrate for pattern transfer from the resulting metal paste line pattern transferred to a receiving substrate, such as a photovoltaic cell, or an electrode paste pattern for a display device, or other semiconductor power devices, detection devices, and the like. The system and method can also be used in the manufacture of mobile phone antennas, decorative and functional automotive glass, semiconductor integrated circuit semiconductor IC packaging connections, printed circuit boards (PCBs), PCB component assembly, optical biological, chemical, and environmental sensors and detectors, radio frequency identification (RFID) antennas, organic light emitting diode (OLED) displays (passive or active matrix), OLED illumination sheets, printed batteries, and other applications. The receiving substrate can be moved forward (along the scan direction of the laser radiation used to transfer the paste from the grooves to the receiving substrate) to reduce the pattern gap relative to the source substrate, and / or the receiving substrate can be moved backward (opposite the scan direction) to increase the pattern gap relative to the source substrate. For example, dynamic pattern transfer can adapt a source substrate of the same width to substrates of different widths, and / or enable a one-to-many pattern transfer technique with high wafer printing throughput.

[0052] Figure 1A and Figure 1B is a high-level schematic diagram of a dynamic pattern transfer system 100 according to some embodiments of the present invention.

[0053] The dynamic pattern transfer system 100 includes a laser scanning device having a laser scanning head 92 configured to irradiate a source substrate 80 with a laser beam 90. The source substrate 80 includes a plurality of grooves 85 arranged in a first pattern 86 and holding a printing paste 82. The source substrate 80 is configured to release the printing paste 82 from the grooves 85 onto a receiving substrate 70 when irradiated by the laser beam 90 (the source substrate has one side of the grooves holding the printing paste facing the receiving substrate and the other side facing the laser scanning device) (schematically represented as pattern transfer 93) (see, for example, Figure 1B ). The laser scanning head 92 can be configured to have a fast scanning axis along the machine direction 97 (MD) and can move along the scanning direction 95 (cross-machine direction - CMD). As needed, there can be one or more laser scanning heads 92.

[0054] For example, Figure 5BAs schematically illustrated in FIG, the source substrate 80 may include a pattern transfer sheet, for example, made of a transparent polymer material, having grooves 85 with any of a variety of profiles (cross-sectional shapes), such as trapezoidal, circular, square, rectangular, and / or triangular profiles. The polymer material and the groove profile may be configured to release slurry 82 filled into the grooves upon irradiation by a laser beam 90. In certain embodiments, the grooves 85 may be embossed, pneumatically formed, or laser-formed onto the source substrate 80 during the production process, and the grooves 85 may be filled with slurry 82 within the dynamic pattern transfer system 100 prior to irradiation. The source substrate 80 may be made of a single layer, or may be made of two or more layers attached to each other, for example, one layer having a pattern embossed, pneumatically formed, or laser-formed therein and another layer providing mechanical strength to the source substrate 80. For example, the source substrate 80 may include a top polymer layer 114 and a bottom polymer layer 112. In some embodiments, the top polymer layer 114 has a melting temperature of less than 170° C., more preferably less than 150° C., 130° C., or 110° C., or other intermediate values, when made of a semi-crystalline polymer, or has a glass transition temperature of less than 160° C., more preferably less than 140° C., 120° C., or 100° C., or other intermediate values, when made of an amorphous polymer. The bottom polymer layer 112 may have a melting temperature or glass transition temperature higher than that of the top polymer layer 114, for example, the bottom polymer layer 112 may have a melting temperature higher than 150° C., higher than 160° C. (e.g., biaxially oriented polypropylene), higher than 170° C., and up to 400° C. (e.g., certain polyimides), or intermediate values.

[0055] In certain embodiments, the top polymer layer 114 and the bottom polymer layer 112 may comprise one or more of polyethylene, polypropylene, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, wholly aromatic polyesters, other copolyesters, polymethyl methacrylate, other copolyacrylates, polycarbonate, polyamide, polysulfone, polyethersulfone, polyetherketone, polyamideimide, polyetherimide, aromatic polyimide, alicyclic polyimide, fluorinated polyimide, cellulose acetate, cellulose nitrate, aromatic polyamide, polyvinyl chloride, polyphenol, polyarylate, polyphenylene sulfide, polyphenylene oxide, and polystyrene, as long as the melting temperature or glass transition temperature (Tm / Tg) of the top polymer layer 114 is lower than the melting temperature or glass transition temperature (Tm / Tg) of the bottom polymer layer 112 and / or as long as the bottom polymer layer 112 is not affected by the processing conditions of the top polymer layer 114.

[0056] In some embodiments, the top polymer layer 114 and the bottom polymer layer 112 (respectively) can be between 10 μm and 100 μm thick, preferably between 15 μm and 80 μm thick, 20 μm and 60 μm thick, 25 μm and 45 μm thick, 20 μm and 45 μm thick, or other intermediate ranges of thickness, with the bottom polymer layer 112 being at least as thick as the top polymer layer 114. The polymer layers can be attached by an adhesive layer 113 that is thinner than 10 μm and also transparent to laser radiation, more preferably thinner than 8 μm, 6 μm, 4 μm, 2 μm, or other intermediate ranges of thickness. For example, in some embodiments, the top polymer layer 114 can be several μm thicker than the depth of the trench 85, such as 5 μm, 3 μm to 7 μm, 1 to 9 μm, or up to 10 μm thicker than the depth of the trench 85. For example, the groove 85 can be 20 μm deep and the top polymer layer 114 can be 20-30 μm thick. The thickness of the bottom polymer layer 112 can be in the range of between 25 μm and 45 μm (e.g., 30 μm and 40 μm) (note that a thicker bottom polymer layer provides better mechanical properties). Note that the term "groove" should not be interpreted as limiting the shape of the groove 85 to a linear element, but is to be understood in a broad sense to include grooves 85 of any shape. In order to achieve the positioning of the groove, further marks can be provided (e.g., embossed) on the top polymer layer 114.

[0057] The temperature and thickness of the top polymer layer and the bottom polymer layer are designed so that the top polymer layer has good formability, ductility and a certain mechanical strength, the bottom polymer layer has good mechanical strength, and the two layers have good adhesion properties.

[0058] The receiving substrate 70 may comprise a silicon wafer, such as, for example, silicon wafers used to make different types of PV cells, such as, for example, the PV cells described in detail in Luque and Hegedus (eds.) 2011, Handbook of PV Science and Engineering, pages 276-277, the entire contents of which are incorporated herein by reference.

[0059] The dynamic pattern transfer system 100 further includes a movable stage 60 supporting a receiving substrate 70, to which the receiving substrate 70 is fixed (e.g., clamped by vacuum suction) during the release of the printing paste 82 from the source substrate 80 (e.g., see Figure 1A ). The movable stage 60 may include any type of stage or wafer holder that can fix and move the receiving substrate 70. The movable stage 60 may be moved by any type of actuator, such as a linear or stepper motor.

[0060] The dynamic pattern transfer system 100 also includes a controller 120 configured to control the laser scanning head 92 to direct the laser beam 90 along the grooves 85 (along the machine direction 97 - MD) and across the grooves 85 in a scanning direction 95 (CMD - cross-machine direction). The controller 120 is also configured to move the movable stage 60 (these movements are schematically represented by reference numeral 110) to produce a second pattern 76 of deposited slurry on the receiving substrate 70, which can be different from the first pattern 86 of grooves 85 on the source substrate 80. Advantageously, in contrast to current practice that is limited to transferring the same pattern (e.g., a pattern of lines) from the source substrate 80 to the receiving substrate 70, various embodiments of the dynamic pattern transfer system 100 enable the transferred metal paste to be deposited on the receiving substrate 70 in a pattern (the second pattern 76) that is different from the first pattern 86 of grooves 85 on the source substrate 80, as described in further detail below.

[0061] Note that scanning can be done in one or two directions, and the corresponding movement 110 of the receiving substrate 70 can be adjusted accordingly. In this disclosure, the scanning direction 95 is illustrated in one direction as a non-limiting example.

[0062] For example, a first pattern 86 of grooves 85 on a source substrate 80 can have a first gap ("p1") and a second pattern 76 of deposited slurry on a receiving substrate 70 can have a second gap ("p2") that can be smaller or larger than the first gap ("p1"), e.g., p1>p2 or p1<p2. Note that the second pattern 76 can differ from the first pattern 86 over the entire extent of the receiving substrate 70 or over a portion of the receiving substrate 70, or possibly, the manner in which the second pattern 76 differs from the first pattern 86 can vary over the extent of the receiving substrate 70, e.g., in some areas of the receiving substrate 70, the difference can include p1>p2, while in other areas of the receiving substrate 70, the difference can include p1<p2.

[0063] In some embodiments, in order to make the first gap p1 larger than the second gap p2 (p1>p2), the controller 120 can be configured to move the movable stage 60 along the scanning direction 95 (CMD) (indicated by 110A) at a forward speed set to convert the first gap p1 into the second gap p2. For example, the forward speed is represented by v F , and the time between successive line depositions is denoted as t, p2 = p1 - v F Alternatively or additionally, the scanner velocity across the groove 85 is expressed as v S =p1 / t, the approximate relationship between the gaps is p2=p1·(v S -v F ) / vS Generally speaking, v S Should be greater than v F .

[0064] In some embodiments, in order to make the first gap p1 smaller than the second gap p2 (p1 < p2), the controller 120 may be configured to move the movable stage 60 (indicated by 110B) in the opposite direction to the scanning direction 95 (CMD) at a backward speed set to convert the first gap p1 into the second gap p2. For example, the backward speed is represented by v B , and the time between successive line depositions is denoted as t, p2 = p1 + v B Alternatively or additionally, the scanner velocity across the groove 85 is expressed as v S =p1 / t, the approximate relationship between the gaps is p2=p1·(v S +v B ) / v S .

[0065] Figure 2 is a high-level schematic diagram of modification of a transferred pattern by the dynamic pattern transfer system 100 according to some embodiments of the present invention. Figure 2 Schematically illustrates the modification of the gap of the fixed groove pattern during printing. The source substrate 80 may include a plurality of substantially parallel grooves 85 arranged with a specific source gap (first gap) p1. The source substrate 80 may be configured to receive the printing paste 82 and release the printing paste from the grooves 85 onto the receiving substrate 70 when irradiated by the laser beam 90 (see also FIG. Figure 1A and Figure 1B ). The receiving substrate 70 (e.g., a wafer) may include a pattern of substantially parallel linear positions arranged with a specific receiving gap (second gap) p2 for receiving the slurry released from the groove 85 of the source substrate 80, and the receiving substrate 70 is close to the source substrate 80 so that the first groove on the source substrate 80 is positioned directly opposite the first linear position on the receiving substrate 70. The slurry is deposited on the designated position on the receiving substrate 70 in a designated pattern (second pattern) (76) by scanning the slurry filling groove pattern (86) on the source substrate 80 sequentially from the first groove to the last groove by the laser beam 90. When the controller 120 moves the receiving substrate 70 during the scanning, the slurry is deposited with different gaps (p2≠p1) depending on the direction and speed of the movement.

[0066] For example, depositing a slurry on a receiving substrate 70 in a pattern 76 that is different from the pattern 86 on the source substrate 80 may be particularly useful for printing conductive lines (fine grids) on crystalline silicon PV cells (wafers) (crystalline silicon solar cells), including narrow selective emitter (SE) lines (e.g., see Luque and Hegedus (eds.) 2011, Handbook of PV Science and Engineering, pp. 282-283, the entire contents of which are incorporated herein by reference). In a non-limiting example, the fine grid width on the receiving substrate 70 may be 30 μm, and the desired SE line width may be 80 μm—positioning the fine grid within the SE line leaves a tolerance of only about ±25 μm (assuming the SE line gap is uniform across the wafer).

[0067] In current practice, the gap between the SE lines can be slightly different from the gap between the trenches, or the gap between the SE lines is not uniform across the silicon wafer, so fine gates printed from a fixed source substrate with a constant source gap will not fall precisely into the pre-defined SE lines. This requires increasing the SE line width, which will lead to reduced photovoltaic cell efficiency.

[0068] In contrast, in various embodiments, the dynamic pattern transfer system 100 can be configured to produce wafers 70A, 70B having lines 75A, 75B that are spaced narrower or wider from one another (respectively), depending on specified requirements. For example, the lines 75A can be spaced narrower than the grooves 85 (p2 < p1) by applying a forward motion 110A, while the lines 75B can be spaced wider than the grooves 85 (p2 > p1) by applying a backward motion 110B. Obviously, the line spacing on the receiving substrate 70 can be modified to a lesser extent by modifying the speed of the forward motion 110A or the backward motion 110B, respectively, while maintaining the direction of motion. Different line spacings can be applied in different areas of the wafer 70 if desired, for example by modifying the speed of motion and / or by reversing the direction of motion.

[0069] Advantageously, as disclosed herein, the dynamic pattern transfer system 100 is capable of precisely matching the position of the printed fine grid to the pattern of SE lines on the silicon wafer during printing. For example, by moving the receiving substrate 70 and / or by modifying the speed at which the controller 120 moves the receiving substrate 70, the slurry 82 can be more accurately deposited from the groove 85 to a predefined position on the receiving substrate 70.

[0070] In some embodiments, different line spacings can be applied to different areas of the wafer 70 if desired, for example, by modifying the motion speed and / or by reversing the motion direction. For example, the first pattern 86 of grooves 85 on the source substrate 80 can have a first non-uniform spacing p1, and the second pattern 76 of deposited slurry on the receiving substrate 70 can include a plurality of linear positions (such as SE lines) distributed with variable spacing on the CMD. The controller 120 can be configured to move the movable stage 60 in a forward direction or a backward direction at a predefined variable speed (forward motion 110A or backward motion 110B), thereby ensuring that all lines printed from the source substrate 80 are accurately deposited at the designated linear positions on the receiving substrate 70.

[0071] Figure 3 FIG. 1 is a high-level schematic diagram of modifying the transferred pattern according to the wafer width by the dynamic pattern transfer system 100 according to some embodiments of the present invention. In some embodiments, the controller 120 can also be configured to modify the transferred pattern according to the width w of the source substrate 80. S (See Figure 3 , which may be a width of a set of groove patterns) and a corresponding width w of the receiving substrate 70 R The second gap p2 is calculated from the first gap p1 by the relationship between . The dynamic pattern transfer system 100 can be configured to start deposition by aligning the source substrate 80 so that the first groove is positioned exactly opposite a predefined first fine grid position on the receiving substrate 70, and sequentially scan the groove pattern 86 from the first groove to the last groove of the pattern 86 by the laser beam 90, while moving the receiving substrate 70 during printing in a direction and speed required to deposit the slurry from the groove 85 onto the receiving substrate 70 so that the last printed line is located at a predefined distance from the first printed line (the distance is different from the distance between the first groove and the last groove on the source substrate 80).

[0072] For example, assuming that the number of grooves 85 is equal to the number of printed lines 75, the speed of the movable stage is represented by v (e.g., v F or v B ) (positive in the scanning direction and negative in the direction opposite to the scanning direction), the scanner speed across the groove 85 (CMD) is denoted as v S The width of the source substrate 80 is represented by w S , and the width of the receiving substrate 70 is represented as w R , can be approximately estimated as w S / w R =v S / (v S -v), or v=v S ·(1-w R / w S), that is, v is positive (when the receiving substrate 70 is narrower than the source substrate 80, it is equivalent to the above v F ) and v is negative (when the receiving substrate 70 is wider than the source substrate 80, it is equivalent to the above v B ).

[0073] Advantageously, this mode of operation is particularly useful for printing conductive lines (fine grids) on crystalline silicon PV cells (wafers) when the dimensions of the silicon wafer are different from the width of the polymer tape roll used as the source substrate 80 and the dimensions of the silicon wafer are limited by the tape manufacturing equipment. Thus, the dynamic pattern transfer system 100 is capable of printing fine grids from a tape having a specific width onto silicon wafers of different sizes. For example, a typical tape width is defined and manufactured for use in a w S =156mm size stationary wafer. The same tape width can be used for w R =PTP on a wafer of 166 mm size. In this case, only the length of the groove is increased, which does not require any changes to the equipment used to manufacture the pattern tape. In order to lay out the printing lines on wafers of greater width, dynamic printing can be applied, in which the wafer is moved by 10 mm during printing, with a corresponding backward movement 110B of the receiving substrate 70 during the slurry transfer (in this non-limiting example, v B It can be estimated as approximately v S 10 / 156 of the original value, the exact value depends on the process details).

[0074] Figure 4 1 is a high-level schematic diagram of a source substrate 80 and a movable stage for one-to-many slurry deposition according to some embodiments of the present invention. The dynamic pattern transfer system 100 can be configured to deposit slurry 82 from one source substrate 80 onto a plurality of receiving substrates 70, wherein the grooves 85 of the first pattern 86 on the source substrate 80 include a plurality of groups 87 of grooves 85, and the controller 120 is further configured to deposit the slurry 82 from each group 87 of grooves 85 onto one of the receiving substrates 70, and the controller 120 is configured to switch the receiving substrate 70 between successive groups 87 of grooves 85.

[0075] The groups 87 can be separated by a specified distance d (equal or variable, schematically illustrated as spacing 88), for example, each group has grooves 85 arranged at one or more gaps p1 (illustrated in a non-limiting manner as being equal across the groups 87, but also potentially variable). The dynamic pattern transfer system 100 and / or the controller 120 can be configured to position each successive receiving substrate 70 for receiving slurry 82 from the grooves 85 of a corresponding successive group 87 on the source substrate 80 at a specified receiving gap p2 (not shown) adjacent to the source substrate 80 such that the first groove of each successive group 87 is positioned directly opposite a first predefined print line location on the corresponding successive receiving substrate 70. When the laser scanning head 92 of the dynamic pattern transfer system 100 is used to scan the groove pattern 86 sequentially from the first groove to the last groove of each group 87 (along the grooves 85 along the machine direction 97 and then along the scanning direction 95 perpendicular to the grooves 85), the controller 120 is configured to: (i) scan the groove pattern 86 in a direction opposite to the scanning direction 95 of the laser scanning head 92 and at a speed v F (backward movement 110B) successively moving the respective receiving wafers 70, as disclosed above, which movement converts the source gap p1 into the receiving gap p2; and (ii) switching the receiving substrates 70 (e.g., by removing the previous wafer and providing a successive wafer), positioning and setting the first predefined print line position on the receiving substrate 70 opposite the first groove of the next group 87 of grooves 85 on the source substrate 80, and commencing scanning and transferring the slurry 82 from the successive group 87 to the successive receiving substrate 70. The switching of the receiving substrates 70 can be performed, for example, during the movement of the laser scanning head 92 over the gap 88 so as to keep the scanner head speed substantially constant.

[0076] In certain embodiments, the dynamic pattern transfer system 100 can thus be configured to print conductive lines (fine grids) on crystalline silicon PV cells (wafers) in high-volume manufacturing, achieving high throughput that may be limited only by the printing equipment itself. The source substrate 80 (polymer tape segment) can include many more grooves 85 (more densely arranged) than the number of lines required to be printed on the wafer serving as the receiving substrate 70, and be used to print multiple wafers. For example, if the number of fine grids per wafer is 100, the number of grooves 85 on the tape segment can be 1000, where the receiving gap p2 is ten times larger than the source gap p1 - the source substrate can print ten wafers (serving as the receiving substrate 70) continuously from one tape segment (serving as the source substrate 80) in one movement of the laser scanning head 92 along the scanning direction 95. When operating dynamic printing, the next wafer can be accurately positioned at the desired location at the beginning of the next fill group 87 of grooves 85 on the source substrate 80 to ensure continuous movement of the wafers 70 through the printing system 100. High throughput printing is achieved by arranging the grooves 85 on the tape segment 80 at a spacing p1 that is much smaller than the desired spacing p2 of the fine grids printed on the wafers 70. For example, a typical spacing p2 of the fine grids on the receiving substrate 70 (e.g., a PV wafer) can be in the range of 1-3 mm, such as 1.2 mm to 1.5 mm, 1.5-2.5 mm, or any other intermediate range, while a typical spacing p1 of the grooves 85 on the source substrate 80 (e.g., a polymer tape) can be approximately 0.1-0.3 mm, such as 0.12 mm to 0.15 mm, 0.15-0.2 mm, 0.15-0.25 mm, or any other intermediate range. Thus, in one continuous movement of the laser scanning head 92, up to ten wafers 70 can be printed, or possibly up to five wafers 70, up to fifteen wafers 70, or up to twenty or thirty wafers 70, or any other intermediate range of wafers. After all grooves 85 of the tape segment 80 have been printed, the printing system 100 can move another tape segment 80 with grooves 85 filled with slurry 82 to the printing station while the laser scan head 92 returns to its initial position. During this time of segment replacement and scan head return to the scan head's initial position (the first groove 85 of the first group 87 of grooves on the source substrate 80), the next wafer 70 can be moved to the initial position at a lower speed, and upon reaching the initial position, the continuous printing process can continue at a high wafer speed and high wafer throughput. Because each wafer 70 is printed from a group 87 of grooves 85 separated by a small gap p1 on the tape segment 80, the speed of the laser scan head 92 along the scan direction 95 (CMD) is relatively low. For example, if 100 fine grids are printed per wafer 70 in approximately 0.5 seconds (sec) from a tape 80 having a gap p1 of 0.15 mm, the scan head 92 speed is 30 mm / sec.This relatively slow speed enables very precise control of the positioning of the laser beam 90 relative to the groove 85 .

[0077] Certain embodiments include a pattern transfer sheet 80 used as a source substrate 80 that includes a plurality of groups 87 of grooves configured to receive a printing paste 82 and release the printing paste 82 from the grooves 85 onto a receiving substrate 70 when irradiated by a laser beam 90, wherein the gap p1 of the grooves 85 in each group 87 can be constant and the groups 87 can be separated by gaps 88, e.g., as Figure 4 As shown in the figure and in Figure 5B Schematic cross section of the pattern transfer sheet 80 shown in FIG.

[0078] In various embodiments, the gaps p1 can be equal in all groups 87. In various embodiments, the gaps p1 can be between 0.1 mm and 0.3 mm.

[0079] In various embodiments, the spacing 88 between all consecutive groups 87 can be equal. The pattern transfer sheet 80 can be configured with spacing 88 corresponding to the scanning speed v of the laser scanning head 92 (e.g., in the printing system 100) on the pattern transfer sheet 80. S The product of the duration required to switch between successive pattern transfers and to position the receiving substrate 70, as explained herein, can be, for example, between 1 mm and 10 mm. For example, up to 2 mm, up to 3 mm, up to 5 mm, or up to 10 mm.

[0080] In various embodiments, the dynamic pattern transfer system 100 can be configured to increase the accuracy of slurry deposition from the trench 85, e.g., to increase the accuracy of produced PV cells, e.g., by controlling the motion 110. For example, the dynamic pattern transfer system 100 can be configured to increase the accuracy of selective emitter pre-alignment, e.g., by increasing the accuracy of slurry deposition on PV selective emitter lines, e.g., by controlling the motion 110.

[0081] Figure 5A 1 is a high-level block diagram of an exemplary controller 120 that may be used with embodiments of the present invention. The controller 120 may include: one or more controllers or processors 123, which may be or may include, for example, one or more central processing unit processors (CPUs), one or more graphics processing units (GPUs or general-purpose GPUs - GPGPUs), chips, or any suitable computing device or computing-related device; an operating system 121, memory 122, a storage system 125, input devices 126, and output devices 127.

[0082] The operating system 121 may be or may include any code segment designed and / or configured to perform tasks related to coordinating, scheduling, arbitrating, supervising, controlling, or otherwise managing the operation of the controller 120, such as scheduling the execution of programs. The memory 122 may be or may include, for example, random access memory (RAM), read-only memory (ROM), dynamic RAM (DRAM), synchronous DRAM (SD-RAM), double data rate (DDR) memory chips, flash memory, volatile memory, non-volatile memory, cache memory, buffer, short-term memory unit, long-term memory unit, or other suitable memory unit or storage unit. The memory 122 may be or may include a plurality of possibly different memory units. The memory 122 may store, for example, instructions for executing a method (e.g., code 124) and / or store data such as user responses, interrupts, etc.

[0083] Executable code 124 can be any executable code, such as an application, program, process, task, or script. Executable code 124 may be executed by controller 123 under the control of operating system 121. For example, according to an embodiment of the present invention, executable code 124, when executed, may cause computer code to be generated or compiled, or an application program such as VR execution or reasoning to be executed. Executable code 124 may be code generated by the methods described herein. For the various modules and functions described herein, one or more computing devices and / or components of controller 120 may be used. A device including components similar to or different from those included in controller 120 may be used, and the device may be connected to a network and used as a system. One or more processors 123 may be configured to execute embodiments of the present invention by, for example, executing software or code.

[0084] The storage system 125 may be or include, for example, a hard disk drive, a floppy disk drive, a compact disk (CD) drive, a CD-Recordable (CD-R) drive, a universal serial bus (USB) device, or other suitable removable and / or fixed storage unit. Data such as instructions, code, VR model data, parameters, etc. may be stored in the storage system 125 and loaded from the storage system 125 into the memory 122, where the data may be processed by the controller 123. In some embodiments, the memory 122 may be omitted. Figure 5A Some of the components shown in .

[0085] The input device 126 can be or include, for example, a mouse, a keyboard, a touch screen or touchpad, or any suitable input device. It will be appreciated that, as shown by the box of the input device 126, any suitable number of input devices can be operatively connected to the controller 120. The output device 127 can include one or more displays, speakers, and / or any other suitable output device. It will be appreciated that, as shown by the box of the output device 127, any suitable number of output devices can be operatively connected to the controller 120. Any applicable input / output (I / O) device can be connected to the controller 120, for example, a wired or wireless network interface card (NIC), a modem, a printer or fax machine, a universal serial bus (USB) device, or an external hard disk can be included in the input device 126 and / or the output device 127.

[0086] Embodiments of the invention may include: one or more articles of manufacture (e.g., memory 122 or storage system 125), such as a computer or processor non-transitory readable medium or a computer or processor non-transitory storage medium, such as a memory, a disk drive, or a USB flash drive; encoding, including or storing instructions, such as computer executable instructions, which, when executed by a processor or controller, perform the methods disclosed herein.

[0087] Figure 6 is a high-level flow chart illustrating a dynamic pattern transfer method 200 according to some embodiments of the present invention. The method stages can be performed with respect to the system 100 described above, which can optionally be configured to implement the method 200. The method 200 can be implemented at least in part by at least one computer processor, such as in the controller 120. Certain embodiments include a computer program product comprising a computer-readable storage medium having a computer-readable program implemented thereon, and the computer-readable program is configured to perform the relevant stages of the method 200. The method 200 can include the following stages, regardless of their order.

[0088] The dynamic pattern transfer method 200 may include transferring a slurry pattern from a source substrate to a receiving substrate by irradiating the slurry pattern in a scanning direction across the slurry pattern (stage 210). The irradiated source substrate includes a plurality of grooves arranged in a first pattern and holding the printing slurry, and the source substrate is configured to release the printing slurry from the grooves and onto the receiving substrate when irradiated by the laser beam, which is performed along the grooves and across the grooves in a scanning direction. The method 200 may also include moving the receiving substrate in a controllable manner to produce a second pattern of deposited slurry on the receiving substrate, the second pattern being different from the first pattern of grooves on the source substrate (stage 220).

[0089] In some embodiments, the first pattern of grooves on the source substrate can have a first gap, and the second pattern of deposited slurry on the receiving substrate can have a second gap. When the first gap is greater than the second gap, a controlled motion can be performed along the scanning direction at a forward speed set to reduce the pattern gap (stage 230), and when the first gap is less than the second gap, a controlled motion can be performed in the opposite direction (opposite direction) of the scanning direction at a backward speed set to increase the pattern gap (stage 240). The method 200 can also include calculating the pattern gap on the receiving substrate relative to the slurry pattern gap based on the relationship between the widths of the source substrate and the receiving substrate (stage 250) and controlling the pattern transfer process accordingly.

[0090] In some embodiments, the first pattern of grooves on the source substrate may include multiple groups of grooves, and method 200 may further include depositing the slurry from one source substrate onto multiple receiving substrates by depositing the slurry from each group of grooves onto one of the receiving substrates and switching the receiving substrate between successive groups of grooves (stage 260). The receiving substrates (e.g., wafers) may be continuously switched to enable continued transfer of the pattern from a single source substrate (each group of wafers) to the receiving substrates.

[0091] Figures 1A to 6 The elements may be combined in any operable combination, and the depiction of certain elements in some figures and not in others is for illustrative purposes only and is non-limiting.

[0092] Various aspects of the present invention are described above with reference to the flowcharts and / or partial schematic diagrams of the methods, devices (systems) and computer program products according to embodiments of the present invention. It will be understood that each portion in the flowcharts and / or partial schematic diagrams and the combination of portions in the flowcharts and / or partial schematic diagrams can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer or other programmable data processing device to produce a machine, so that instructions executed by the processor of the computer or other programmable data processing device create a device for implementing the functions / actions specified in the flowcharts and / or partial schematic diagrams or a portion of the flowcharts and partial schematic diagrams.

[0093] These computer program instructions may also be stored in a computer-readable medium, which may direct a computer, other programmable data processing device, or other apparatus to operate in a specific manner so that the instructions stored in the computer-readable medium produce a manufactured article, including instructions for implementing the functions / actions specified in the flowchart and / or partial schematic diagram or a portion of the flowchart and partial schematic diagram.

[0094] The computer program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device to perform a series of operational steps on the computer, other programmable apparatus, or other device to produce a computer-implemented process, such that the instructions executed on the computer or other programmable device provide a process for implementing the functions / actions specified in the flowchart and / or partial schematic diagrams or a portion of the flowchart and partial schematic diagrams.

[0095] Foregoing flow chart and schematic diagram illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present invention.In this respect, each part in the flow chart or partial schematic diagram can represent a module, section or part of a code, and the module, section or part of the code include one or more executable instructions for realizing the specified logical function.It should also be noted that, in some alternative implementations, the function pointed out in the part may not occur in the order pointed out in the figure.For example, depending on the function involved, the two parts shown in succession can actually be performed substantially simultaneously, or the part can sometimes be performed in the opposite order.It will also be noted that the combination of each part in the partial schematic diagram and / or flow chart description and the part in the partial schematic diagram and / or flow chart description can be realized by a combination of a hardware-based system or special-purpose hardware and computer instructions for performing a special-purpose specified function or action.

[0096] In the above description, an embodiment is an example or implementation of the present invention. The various appearances of "one embodiment," "an embodiment," "certain embodiments," or "some embodiments" do not necessarily all refer to the same embodiment. Although various features of the present invention may be described in the context of a single embodiment, various features of the present invention may also be provided individually or in any suitable combination. Conversely, for clarity, although the present invention may be described in the context of a single embodiment, the present invention may also be implemented in a single embodiment. Certain embodiments of the present invention may include features from different embodiments disclosed above, and certain embodiments may include elements from other embodiments disclosed above. Disclosure of an element of the present invention in the context of a particular embodiment should not be construed as limiting the use of the element only in that particular embodiment. Furthermore, it should be understood that the present invention may be implemented or practiced in various ways, and that the present invention may be implemented in certain embodiments other than the embodiments outlined in the above description.

[0097] The present invention is not limited to those schematic diagrams or corresponding descriptions. For example, the process does not need to move through each illustrated box or state, or move in exactly the same order as illustrated and described. Unless otherwise defined, the meaning of the technical terms and scientific terms used herein should be generally understood by those of ordinary skill in the art to which the present invention belongs. Although the present invention has been described with respect to a limited number of embodiments, these should not be interpreted as limitations on the scope of the invention, but rather as examples of some preferred embodiments. Other possible variations, modifications and applications are also within the scope of the present invention. Therefore, the scope of the present invention should not be limited by what has been described so far, but should be limited by the appended claims and their legal equivalents.

Claims

1. A pattern transfer system comprising: a laser scanning device comprising a laser scanning head configured to irradiate a source substrate with a laser beam, the source substrate comprising a plurality of grooves arranged in a first pattern and holding a printing paste, wherein the source substrate is configured to release the printing paste from the grooves onto a receiving substrate when irradiated by the laser beam; a movable stage to which the receiving substrate is fixedly attachable; and A controller is configured to control the laser scanning head to move along the groove and along a scanning direction across the groove, and the controller is further configured to move the movable stage to produce a second pattern of deposited slurry on the receiving substrate.

2. The pattern transfer system according to claim 1, wherein: The controller is configured to move the movable stage at least along the scanning direction and / or in a direction opposite to the scanning direction.

3. The pattern transfer system according to claim 2, wherein: There is a first gap p1 between adjacent grooves in the first pattern, and the second pattern includes a plurality of deposited paste lines deposited by the printing paste of the plurality of grooves, and there is a second gap p2 between adjacent deposited paste lines of the plurality of deposited paste lines. Assume that the interval between the deposition of adjacent slurry lines is t, and the scanning speed of the laser scanning head along the scanning direction is v S , The movable stage is configured to be able to move along the scanning direction at a speed v F During exercise, p2=p1·(v S -v F ) / v S , making the first gap larger than the second gap; and / or The movable stage is configured to be able to move in a direction opposite to the scanning direction at a speed v B During exercise, p2=p1·(v S +v B ) / v S , so that the first gap is smaller than the second gap.

4. The pattern transfer system according to claim 3, wherein: The source substrate includes at least one groove group, and the controller is further configured to calculate the second gap relative to the first gap based on a relationship between a width of one groove group in the at least one groove group and a width of the receiving substrate.

5. The pattern transfer system according to any one of claims 1 to 4, wherein: The source substrate includes a plurality of groove groups for depositing slurry on a plurality of receiving substrates, and The controller is further configured to deposit the slurry in each groove group onto one of the plurality of receiving substrates, and to switch the plurality of receiving substrates on the movable stage to continuously deposit the slurry on the plurality of receiving substrates.

6. The pattern transfer system according to claim 5, wherein: The second pattern includes a plurality of deposited paste lines deposited by the printing paste of the plurality of grooves, and the controller is configured to cause the laser scanning head to print sequentially from the first groove to the last groove of each groove group, and is configured to position and set the first pre-defined deposited paste line on the next receiving substrate to be opposite to the first groove of the next groove group on the source substrate when switching the next receiving substrate.

7. The pattern transfer system according to claim 6, wherein: The controller is also configured to control the relationship between the scanning speed of the scanning direction of the laser scanning head, the interval of the corresponding groove groups, and the duration required to switch and position the next receiving substrate when switching the next receiving substrate: the interval corresponds to the product of the scanning speed of the scanning direction of the laser scanning head and the duration required to switch and position the next receiving substrate.

8. The pattern transfer system according to claim 6, wherein: The controller is further configured to switch to another source substrate after the printing paste retained in the grooves of all groove groups of the source substrate is transferred, and the laser scanning head returns to its initial position.

9. A pattern transfer sheet for use with the pattern transfer system according to any one of claims 1 to 8, comprising: A plurality of groups of grooves are configured to receive printing paste and release the printing paste on a receiving substrate when irradiated by a laser beam, and the plurality of groups are spaced apart at intervals.

10. The pattern transfer sheet according to claim 9, wherein The gaps between adjacent grooves in each group are equal.

11. The pattern transfer sheet according to claim 10, wherein The gaps between adjacent grooves in all groups are equal.

12. The pattern transfer sheet according to claim 9, wherein The gap between adjacent grooves in each group is between 0.1 mm and 0.3 mm.

13. The pattern transfer sheet according to claim 9, wherein Intervals between adjacent groups in the plurality of groups are equal.

14. The pattern transfer sheet according to claim 9, wherein The interval corresponds to the product of the scanning speed of the laser scanning head along the scanning direction multiplied by the duration required to switch and position adjacent receiving substrates.

15. The pattern transfer sheet according to claim 9, wherein The interval is between 1 mm and 10 mm.

16. The pattern transfer sheet according to any one of claims 10 to 15, wherein The pattern transfer sheet is transparent to laser irradiation and includes a polymer layer. The grooves are formed in the pattern transfer sheet by embossing, pneumatic forming or laser forming.

17. The pattern transfer sheet according to claim 16, wherein The polymer layer includes a top polymer layer and a bottom polymer layer, the groove is disposed on the top polymer layer, and the bottom polymer layer has a melting temperature higher than an imprinting temperature of the top polymer layer.

18. The pattern transfer sheet according to claim 17, wherein The top polymer layer and the bottom polymer layer are each between 10 μm and 100 μm thick and are attached by an adhesive layer thinner than 10 μm, and wherein the bottom polymer layer is at least as thick as the top polymer layer.

19. The pattern transfer sheet according to claim 17, wherein The top polymer layer and the bottom polymer layer are each between 25 μm and 40 μm thick and are attached by an adhesive layer thinner than 2 μm, and wherein the bottom polymer layer is at least as thick as the top polymer layer.

20. The pattern transfer sheet according to claim 17, wherein The top polymer layer has a melting temperature below 170° C. if the top polymer layer is made of a semi-crystalline polymer, or a glass transition temperature below 160° C. if the top polymer layer is made of an amorphous polymer.

21. The pattern transfer sheet according to claim 17, wherein The top polymer layer has a melting temperature below 110°C if the top polymer layer is made of a semi-crystalline polymer, or a glass transition temperature below 100°C if the top polymer layer is made of an amorphous polymer.

22. A pattern transfer method performed by the pattern transfer system according to any one of claims 1 to 8, the pattern transfer method comprising: irradiating the source substrate with a laser beam, and The receiving substrate is moved in a controllable manner to produce a second pattern of deposited slurry on the receiving substrate.

23. The pattern transfer method according to claim 22, wherein: There is a first gap p1 between adjacent grooves of the plurality of grooves on the source substrate and a second gap p2 between adjacent deposited slurry lines of the plurality of deposited slurry lines on the receiving substrate, The pattern transfer method comprises: moving the receiving substrate along the scanning direction, thereby obtaining a second pattern on the receiving substrate in which the second gap is smaller than the first gap, or The receiving substrate is moved in a direction opposite to the scanning direction, thereby obtaining a second pattern on the receiving substrate in which the second gap is larger than the first gap.

24. The pattern transfer method according to claim 23, wherein: Assume that the interval between the deposition of adjacent slurry lines is t, and the scanning speed of the laser scanning head along the scanning direction is v S , When the movable stage moves along the scanning direction at a speed v F During exercise, p2=p1·(v S -v F ) / v S , making the first gap larger than the second gap; or When the movable stage moves in a direction opposite to the scanning direction at a speed v B During exercise, p2=p1·(v S +v B ) / v S , so that the first gap is smaller than the second gap.

25. The pattern transfer method according to claim 23, wherein: The source substrate has at least one groove group thereon, and the pattern transfer method further includes calculating the second gap relative to the first gap based on a relationship between a width of one groove group of the at least one groove group and a width of the receiving substrate.

26. The pattern transfer method according to any one of claims 22 to 25, wherein: The source substrate includes a plurality of groove sets for depositing slurry on a plurality of receiving substrates, and the pattern transfer method further includes: depositing the slurry in each set of trenches onto one of the plurality of receiving substrates; and The receiving substrates are switched as the laser scanning head moves between adjacent trench groups, thereby depositing slurry from the source substrate onto the plurality of receiving substrates.

27. The pattern transfer method according to claim 26, wherein: The second pattern includes a plurality of deposited paste lines deposited by the printing paste of the plurality of grooves, the laser scanning head prints sequentially from the first groove to the last groove of each groove group, and when switching to the next receiving substrate, the first pre-defined deposited paste line on the next receiving substrate is positioned and set to be opposite to the first groove of the next groove group on the source substrate.

28. The pattern transfer method according to claim 27, wherein: When switching the next receiving substrate, the relationship between the scanning speed of the laser scanning head in the scanning direction, the interval of the corresponding groove group, and the duration required to switch and position the next receiving substrate is: the interval corresponds to the product of the scanning speed in the scanning direction of the laser scanning head and the duration required to switch and position the next receiving substrate.

29. The pattern transfer method according to claim 26, wherein: When the printing paste held in the grooves of all groove groups of the source substrate is transferred completely, another source substrate is switched, and the laser scanning head returns to its initial position. 30 . A computer program product, comprising a computer-readable medium storing a program, wherein when the program is executed by a processor, the program implements the pattern transfer method according to claim 22 .

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