An ultrahigh pressure multi-field coupled stress-strain material characterization apparatus and method

Abstract

The application provides a kind of superhigh pressure multi-field coupling stress-strain material characterization equipment and method, wherein the equipment comprises: a pressure testing machine, including a moving platen, an upper pressure plate, a base and a lower pressure plate, the upper pressure plate is provided with a probe accommodating cavity reaching the lower surface, and a first crystal cone is arranged at the opening, the lower pressure plate is provided with a probe accommodating cavity, and a second crystal cone is arranged at the opening;First probe unit and second probe unit respectively include at least one of ultrasonic probe, laser probe, visible light probe, infrared probe, ultraviolet probe, electromagnetic wave probe, radioactive ray probe, the probes of the two units are respectively arranged in the probe accommodating cavity of the upper pressure plate and the lower pressure plate, and are respectively installed opposite to the first crystal cone and the second crystal cone.This application can realize the combined test of one or more physical signals synchronously during the pressure test of the material, and can also realize the material test under superhigh pressure condition.

Description

Technical Field

[0001] This invention relates to the field of materials testing technology, specifically to an ultra-high pressure multi-field coupled stress-strain material characterization device and method. Background Technology

[0002] The testing of the mechanical and physical properties of materials is a fundamental part of materials science. Various physical detection methods have been developed, such as ultrasound, lasers, visible light, infrared, ultraviolet, electromagnetic waves, and radioactive rays. However, most of these tests are currently limited to static testing using a single method, and coupled testing schemes using multiple methods are relatively rare. In particular, there are no systematic reports or dedicated equipment for simultaneously conducting other physical methods under dynamic loads such as tensile and compressive loads on materials. However, dynamic loads often represent the actual operating conditions of materials and devices, highlighting the significant importance of performance testing under simulated conditions. Furthermore, conducting multiple tests under stress-strain loading conditions offers valuable research opportunities for the physical methods themselves, including ultrasound, lasers, visible light, infrared, ultraviolet, electromagnetic waves, and radioactive rays. Therefore, such equipment and testing methods are essential.

[0003] Currently, there are only a few simple reports on multi-field coupling detection schemes under dynamic conditions. For example, Chinese patent CN101915807A discloses an ultrasonic testing auxiliary device for the failure process of non-metallic materials. This device tests the failure process of non-metallic materials by measuring the change in ultrasonic wave velocity during the failure process. Since this device only targets the ultrasonic properties of unloaded materials during the failure process, it lacks the universality of general inspection and testing. Therefore, it cannot be extended to detection devices and methods employing other physical detection methods. Summary of the Invention

[0004] This invention is made to solve the above-mentioned problems, and its purpose is to provide an ultra-high pressure multi-field coupled stress-strain material characterization device.

[0005] This invention provides an ultra-high pressure multi-field coupled stress-strain material characterization device, characterized by comprising: a pressure testing machine including a liftable movable platform, an upper pressure plate mounted on the movable platform, a base, and a lower pressure plate mounted on the base; the upper pressure plate has a probe receiving cavity extending to its lower surface, and a first crystal cone is installed at the lower opening of the probe receiving cavity; the lower pressure plate has a probe receiving cavity extending to its upper surface, and a second crystal cone is installed at the upper opening of the probe receiving cavity; and a first probe unit and a second probe unit, each comprising at least one of an ultrasonic probe, a laser probe, a visible light probe, an infrared probe, an ultraviolet probe, an electromagnetic wave probe, and a radioactive ray probe; the probes of the first probe unit and the second probe unit are respectively disposed in the probe receiving cavities of the upper pressure plate and the lower pressure plate, and are respectively installed facing each other closely against the first and second crystal cones; wherein the probe of any probe unit is used to emit physical test signals, and the corresponding probe of the other probe unit is used to acquire corresponding physical test signals.

[0006] The ultra-high pressure multi-field coupled stress-strain material characterization device provided by the present invention may also have the following feature: a coupling agent is applied between the contact surface of the probe of the first probe unit and the first crystal cone, and between the contact surface of the probe of the second probe unit and the second crystal cone to reduce the interface effect.

[0007] The ultra-high pressure multi-field coupled stress-strain material characterization device provided by this invention may also have the following features: both the upper and lower pressure plates include connected sleeve portions and plate portions. The sleeve portion of the upper pressure plate is mounted on a movable platform via an upper pressure plate joint. The plate portion of the upper pressure plate is connected to the lower end of the sleeve portion, and a stepped hole corresponding to the inner cavity of the sleeve portion is opened at the center of the plate portion. The sleeve portion of the lower pressure plate is mounted on a base via a lower pressure plate joint. The upper end of the sleeve is connected to the plate part, and a stepped hole is opened in the center of the plate part, which is vertically connected and corresponds to the inner cavity of the sleeve part; the large diameter end of the first crystal cone is embedded in the lower end of the stepped hole of the upper pressure plate, and the small diameter end of the first crystal cone protrudes from the lower surface of the plate part of the upper pressure plate and is used to directly apply pressure to the material sample during the test; the large diameter end of the second crystal cone is embedded in the upper end of the stepped hole of the lower pressure plate, and the small diameter end of the second crystal cone protrudes from the upper surface of the plate part of the lower pressure plate and is used to support the material sample.

[0008] Furthermore, the ultra-high pressure multi-field coupled stress-strain material characterization device provided by the present invention may also have the following features: both the upper pressure plate joint and the lower pressure plate joint are T-shaped cylindrical, the large diameter end of the upper pressure plate joint is set on the upper surface of the moving platform, the small diameter end of the upper pressure plate joint passes downward through the moving platform and is connected to the sleeve part of the upper pressure plate, the large diameter end of the lower pressure plate joint is connected to the base, the small diameter end of the lower pressure plate joint faces upward and is connected to the sleeve part of the lower pressure plate.

[0009] Furthermore, the ultra-high pressure multi-field coupled stress-strain material characterization device provided by the present invention may also have the following features: the probes of the first probe unit are all set in the stepped holes of the upper pressure plate and are respectively connected to the small diameter end of the upper pressure plate joint by threaded connection; the probes of the second probe unit are all set in the stepped holes of the lower pressure plate and are respectively connected to the small diameter end of the lower pressure plate joint by threaded connection.

[0010] The ultra-high pressure multi-field coupled stress-strain material characterization device provided by the present invention may also have the following feature: the first crystal cone and the second crystal cone are made of high-hardness transparent crystal.

[0011] This invention also provides a method for characterizing ultra-high pressure multi-field coupled stress-strain materials, characterized by employing the aforementioned ultra-high pressure multi-field coupled stress-strain material characterization equipment, including: using a pressure testing machine to perform a pressure test on a material sample, wherein during the pressure destruction of the material sample by a first crystal cone in conjunction with a second crystal cone, the physical test signal is transmitted through the probes of the first probe unit and the second probe unit along the path of the first crystal cone, the material sample, and the second crystal cone, or the reverse path, and the change data of the physical test signal is recorded simultaneously; the dynamic structural information inside the material sample is obtained by analyzing the obtained physical test signal change data.

[0012] The role and effect of invention

[0013] The ultra-high pressure multi-field coupled stress-strain material characterization equipment and method according to the present invention includes a pressure testing machine and two probe units. The upper and lower pressure plates of the pressure testing machine each have probe receiving cavities, and crystal cones are installed at the cavity openings. These crystal cones not only serve as a transmission medium for physical test signals but also enable high-pressure or ultra-high-pressure testing. Each probe unit includes at least one of the following: ultrasonic probe, laser probe, visible light probe, infrared probe, ultraviolet probe, electromagnetic wave probe, and radioactive ray probe. The probes of the two probe units are respectively disposed within the probe receiving cavities of the upper and lower pressure plates and are respectively installed facing each other, closely attached to their corresponding crystal cones. Therefore, the present invention can simultaneously perform one or more combinations of ultrasonic, laser, visible light, infrared, ultraviolet, electromagnetic wave, and radioactive ray tests during classical pressure testing of materials, and can also perform material testing under ultra-high pressure conditions, demonstrating originality in the field of material testing. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of the ultra-high pressure multi-field coupled stress-strain material characterization device in an embodiment of the present invention;

[0015] Figure 2 This is a partial cross-sectional view of the ultra-high pressure multi-field coupled stress-strain material characterization device in an embodiment of the present invention;

[0016] Figure 3 This is an exploded schematic diagram of a portion of the structure of the ultra-high pressure multi-field coupled stress-strain material characterization device in an embodiment of the present invention.

[0017] Explanation of reference numerals in the attached figures:

[0018] 1 Material sample; 10 Pressure testing machine; 11 Moving platform; 12 Upper bearing plate; 121 Sleeve part; 122 Plate body part; 1221 Stepped hole; 13 Base; 14 Lower bearing plate; 141 Sleeve part; 142 Plate body part; 1421 Stepped hole; 15 Upper bearing plate joint; 16 Lower bearing plate joint; 17 First pin; 18 Second pin; 20 First probe unit; 30 Second probe unit; 40 First crystal cone; 50 Second crystal cone. Detailed Implementation

[0019] To make the technical means, creative features, objectives and effects of this invention easier to understand, the following embodiments are described in detail with reference to the accompanying drawings.

[0020] Example

[0021] Figure 1 This is a schematic diagram of the overall structure of an ultra-high pressure multi-field coupled stress-strain material characterization device. Figure 2This is a partial cross-sectional view of an ultra-high pressure multi-field coupled stress-strain material characterization device.

[0022] like Figure 1 and Figure 2 As shown, this embodiment provides an ultra-high pressure multi-field coupled stress-strain material characterization device, including a pressure testing machine 10, a first probe unit 20, and a second probe unit 30.

[0023] The pressure testing machine 10 adopts a classic material pressure testing machine, mainly including a movable platform 11 driven by a lifting mechanism for lifting, an upper pressure plate 12 installed on the movable platform 11, a base 13 set below the movable platform 11, and a lower pressure plate 14 installed on the base 13.

[0024] The upper pressure plate 12 and the lower pressure plate 14 are both provided with probe receiving cavities. The probe receiving cavity of the upper pressure plate 12 is connected to the lower surface of the upper pressure plate 12, and a first crystal cone 40 is installed at its lower opening. The probe receiving cavity of the lower pressure plate 14 is connected to the upper surface, and a second crystal cone 50 flush with the upper surface is installed at its upper opening. The materials of the first crystal cone 40 and the second crystal cone 50 can be diamond, zircon or other existing high-hardness transparent crystals.

[0025] The first probe unit 20 and the second probe unit 30 each include at least one of the following: an ultrasonic probe, a laser probe, a visible light probe, an infrared probe, an ultraviolet probe, an electromagnetic wave probe, a radioactive ray probe, or other existing physical test signal probes. The probes of the first probe unit 20 and the second probe unit 30 are respectively disposed within the probe receiving cavity of the upper pressure plate 12 and the probe receiving cavity of the lower pressure plate 14, and are respectively installed facing each other, closely attached to the first crystal cone 40 and the second crystal cone 50. The probe of any one probe unit is used to transmit physical test signals, and the corresponding probe of the other probe unit is used to acquire the corresponding physical test signals. Thus, during pressure testing, the physical test signals can be transmitted and received along the path of the crystal, the material sample 1, and the crystal.

[0026] The following is a detailed explanation of some of the installation structures.

[0027] Figure 3 This is an exploded schematic diagram of part of the structure of the ultra-high pressure multi-field coupled stress-strain material characterization device.

[0028] like Figure 2 and Figure 3As shown, the installation structure of the movable platform 11 and the upper pressure plate 12 is as follows: A T-shaped cylindrical upper pressure plate connector 15 is centrally mounted on the movable platform 11. The large-diameter end of the upper pressure plate connector 15 is located on the upper surface of the movable platform 11, and the small-diameter end of the upper pressure plate connector 15 passes downward through the movable platform 11. The upper pressure plate 12 includes a sleeve portion 121 and a plate body portion 122 connected together. The sleeve portion 121 of the upper pressure plate 12 is fitted onto the small-diameter end of the upper pressure plate connector 15 and is connected to the small-diameter end of the upper pressure plate connector 15 through a radially arranged first pin 17. The plate body portion 122 of the upper pressure plate 12 is connected to the lower end of the sleeve portion 121, and a stepped hole 1221 is opened in the center of the plate body portion 122, which is a vertically penetrating stepped hole corresponding to the inner cavity of the sleeve portion 121. This stepped hole 1221 is the probe receiving cavity of the upper pressure plate 12.

[0029] The large-diameter end of the first crystal cone 40 is embedded in the lower end of the stepped hole 1221, and the small-diameter end of the first crystal cone 40 faces downward and protrudes from the lower surface of the plate body 122 of the upper pressure plate 12. The small-diameter end of the first crystal cone 40 is used to directly apply pressure to the material sample 1 during the test. The first probe unit 20 shown in this embodiment includes three probes, all of which are set in the stepped hole 1221. The head of each probe is set downward and close to the end face of the large-diameter end of the first crystal cone 40, and a coupling agent is applied between the contact surfaces to reduce the interface effect. The tail of each probe has a stud portion, and the small-diameter end of the upper pressure plate connector 15 has three threaded holes. The three probes are connected to the small-diameter end of the upper pressure plate connector 15 through the stud portion and the threaded holes respectively.

[0030] The mounting structure of the base 13 and the lower pressure plate 14 is as follows: A T-shaped cylindrical lower pressure plate connector 16 is mounted on the base 13. The large-diameter end of the lower pressure plate connector 16 is connected to the base 13 by a plurality of screws evenly distributed along the circumference, and the small-diameter end of the lower pressure plate connector 16 is set upward. The lower pressure plate 14 includes a sleeve portion 141 and a plate portion 142 connected together. The sleeve portion 141 of the lower pressure plate 14 is fitted onto the small-diameter end of the lower pressure plate connector 16 and is connected to the small-diameter end of the lower pressure plate connector 16 by a radially arranged second pin 18. The plate portion 142 of the lower pressure plate 14 is connected to the upper end of the sleeve portion 141, and a stepped hole 1421 is opened in the center of the plate portion 142, which is a through hole corresponding to the inner cavity of the sleeve portion 141. This stepped hole 1421 is the probe receiving cavity of the lower pressure plate 14.

[0031] The large-diameter end of the second crystal cone 50 is embedded in the upper end of the stepped hole 1421, and the small-diameter end of the second crystal cone 50 faces upward and protrudes from the upper surface of the plate body 142 of the lower pressure plate 14. The small-diameter end of the second crystal cone 50 is used to support the material sample 1. The second probe unit 30 shown in this embodiment includes three probes, all of which are set in the stepped hole 1421. The head of each probe faces upward and is closely attached to the end face of the large-diameter end of the second crystal cone 50. Coupling agent is applied between the contact surfaces to reduce the interface effect. The tail of each probe has a stud. The small-diameter end of the lower pressure plate connector 16 has three threaded holes along the axis. The three probes are connected to the small-diameter end of the lower pressure plate connector 16 through the stud and the threaded holes respectively.

[0032] The method and process for characterizing materials using this equipment are as follows: During the test, the material sample 1 to be tested is placed on the small-diameter end of the second crystal cone 50. The pressure testing machine 10 is started, and the moving platform 11 drives the upper pressure plate 12 to move downwards until the small-diameter end of the first crystal cone 40 contacts the material sample 1, thus initiating pressure destruction of the material sample 1. During the pressure destruction of the material sample 1, the probes of the first probe unit 20 and the second probe unit 30 transmit and receive physical test signals along the path of the first crystal cone 40, the material sample 1, and the second crystal cone 50, or the reverse path. Simultaneously, the changes in the physical test signals are detected and recorded by a signal detector or other device connected to the probes. Furthermore, by analyzing the data of the changes in the physical test signals using a computer or other instruments, the dynamic structural information inside the material sample 1 can be obtained.

[0033] It should be noted that the area of ​​the small-diameter ends of the first crystal cone 40 and the second crystal cone 50 can be designed as needed to achieve high-pressure or ultra-high-pressure testing. This is because existing diamond and other crystal processing technologies can achieve 10... -6 m 2 The area processing is on the order of magnitude larger, while a typical pressure testing machine can only achieve 10... 6 Pressure on the order of N can be used to estimate that this device can achieve 10 12 A pressure on the order of Pa is sufficient for most material tests and is still within the tolerance range of high-hardness crystals such as diamond.

[0034] For the material being tested, certain tests require the material itself to have the property of transmitting a certain signal. For example, when conducting visible light or laser tests, the material being tested needs to have high transparency and light transmittance.

[0035] For the first crystal cone 40 and the second crystal cone 50, if the coupled physical testing method does not include optical signals, such as only ultrasonic signals or electromagnetic wave signals, then the materials of the first crystal cone 40 and the second crystal cone 50 do not necessarily have to be transparent, but they still need to have characteristics such as high voltage resistance and good transmission of physical signals. If the first crystal cone 40 and the second crystal cone 50 are made of insulating materials, an electric field can also be applied to the material under test during testing, which can realize the coupling and testing of stress-strain conditions, multiple physical testing signals, and conductivity properties.

[0036] For those skilled in the art, actual testing is not limited to pressure testing; the same principle, with simple modifications, can also be used for material testing such as tension, bending, and shearing.

[0037] The role and effect of the embodiments

[0038] The ultra-high pressure multi-field coupled stress-strain material characterization equipment and method described in this embodiment includes a pressure testing machine and two probe units. The upper and lower pressure plates of the pressure testing machine each have probe housing cavities, and crystal cones are installed at the cavity openings. These crystal cones not only serve as a medium for transmitting physical test signals but also enable high-pressure or ultra-high-pressure testing. Each probe unit includes at least one of the following: ultrasonic probe, laser probe, visible light probe, infrared probe, ultraviolet probe, electromagnetic wave probe, and radioactive ray probe. The probes of the two probe units are respectively installed in the probe housing cavities of the upper and lower pressure plates, and are respectively mounted facing each other against the corresponding crystal cones. Therefore, this invention can simultaneously perform one or more combinations of ultrasonic, laser, visible light, infrared, ultraviolet, electromagnetic wave, and radioactive ray tests during classical pressure testing of materials, and can also perform material testing under ultra-high pressure conditions, demonstrating originality in the field of material testing.

[0039] The above embodiments are preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention.

Claims

1. An ultra-high pressure multi-field coupled stress-strain material characterization apparatus, comprising: The pressure testing machine comprises a movable base plate, an upper pressure plate installed on the movable base plate, a base, and a lower pressure plate installed on the base, the upper pressure plate is internally provided with a probe accommodating cavity opening to the lower surface, and a first crystal cone is installed at the lower end opening of the probe accommodating cavity, the lower pressure plate is internally provided with a probe accommodating cavity opening to the upper surface, and a second crystal cone is installed at the upper end opening of the probe accommodating cavity; and the first probe unit and the second probe unit each comprise at least two of an ultrasonic probe, a laser probe, a visible light probe, an infrared probe, an ultraviolet probe, an electromagnetic wave probe, and a radioactive ray probe, the probes of the first probe unit and the second probe unit are respectively arranged in the probe accommodating cavities of the upper pressure plate and the lower pressure plate, and are respectively installed in close contact with the first crystal cone and the second crystal cone, wherein the probes of any one of the probe units are used for emitting physical test signals, and the corresponding probes of the other probe unit are used for collecting corresponding physical test signals.

2. The ultra-high pressure multi-field coupling stress-strain material characterization device according to claim 1, wherein: a coupling agent is coated between the contact surfaces of the probes of the first probe unit and the first crystal cone and between the contact surfaces of the probes of the second probe unit and the second crystal cone to reduce the interface effect. wherein 3. The ultra-high pressure multi-field coupling stress-strain material characterization device according to claim 1, wherein: the upper pressure plate and the lower pressure plate each comprise a sleeve part and a plate part connected to each other, wherein the sleeve part of the upper pressure plate is installed on the movable base plate through an upper pressure plate joint, the plate part of the upper pressure plate is connected to the lower end of the sleeve part, and the center of the plate part is provided with a stepped hole opening through the upper and lower surfaces and corresponding to the inner cavity of the sleeve part, the sleeve part of the lower pressure plate is installed on the base through a lower pressure plate joint, the plate part of the lower pressure plate is connected to the upper end of the sleeve part, and the center of the plate part is provided with a stepped hole opening through the upper and lower surfaces and corresponding to the inner cavity of the sleeve part; the large-diameter end of the first crystal cone is embedded in the lower end of the stepped hole of the upper pressure plate, and the small-diameter end of the first crystal cone protrudes from the lower surface of the plate part of the upper pressure plate and is used for directly pressing the material sample during testing, the large-diameter end of the second crystal cone is embedded in the upper end of the stepped hole of the lower pressure plate, and the small-diameter end of the second crystal cone protrudes from the upper surface of the plate part of the lower pressure plate and is used for carrying the material sample.

4. The ultra-high pressure multi-field coupling stress-strain material characterization device according to claim 3, wherein: the upper pressure plate joint and the lower pressure plate joint each have a T-shaped cylindrical shape, wherein the large-diameter end of the upper pressure plate joint is arranged on the upper surface of the movable base plate, the small-diameter end of the upper pressure plate joint penetrates downward through the movable base plate, and is connected to the sleeve part of the upper pressure plate, the large-diameter end of the lower pressure plate joint is connected to the base, and the small-diameter end of the lower pressure plate joint faces upward and is connected to the sleeve part of the lower pressure plate. ​ 5. The ultra-high pressure multi-field coupling stress-strain material characterization device according to claim 4, characterized in that: wherein the probes of the first probe unit are arranged in the stepped holes of the upper pressure plate and are connected to the small-diameter end of the upper pressure plate joint by screw connection, the probes of the second probe unit are arranged in the stepped holes of the lower pressure plate and are connected to the small-diameter end of the lower pressure plate joint by screw connection.

6. The ultra-high pressure multi-field coupling stress-strain material characterization device according to claim 1, characterized in that: wherein, the first crystal cone and the second crystal cone are made of high-hardness transparent crystal.

7. A method of ultra-high pressure multi-field coupled stress-strain material characterization, comprising: The ultra-high pressure multi-field coupling stress-strain material characterization device according to any one of claims 1-6, comprising: performing a pressure test on the material sample using a pressure testing machine, wherein in the process of pressure failure of the material sample by the first crystal cone cooperating with the second crystal cone, the physical test signal is conducted along the path of the first crystal cone, the material sample, the second crystal cone or the reverse path by the probes of the first probe unit and the second probe unit, and the physical test signal change data is recorded synchronously; analyzing the obtained physical test signal change data to obtain the dynamic structure information of the material sample.

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