A manual semiconductor wafer film laminating device

Abstract

The present invention discloses a manual film laminating device for semiconductor wafers, which includes a large back film rewinding drive pulley (1), a small back film rewinding drive pulley (2), a large material rotation damping pulley (4), a belt (5), a small material rotation damping pulley (6), a material clamping rotating shaft (7), at least two material rack side plates (8), a front film guiding roller (9), a rotation damper (10), a material rack side plate connecting rod (11), a front guiding rubber roller (12), a film separating drive rubber roller (13), a back film rubber roller (14), a rear guiding rubber roller (15), a wafer adsorption platform (16), a moving film pressing support frame (17), a rear film pressing rubber roller (18), a suction cup platform base (19), a vacuum control pipeline (20), a front film pressing rubber roller (23), a back film clamping rotating shaft (24); the present invention solves the problems that it is not easy for a single person to separate the adhesive film and the back film and perform film pressing and attaching during the manual film laminating process.

Description

Technical Field

[0001] The present invention relates to the process fields in semiconductor integrated circuit manufacturing and microelectromechanical system (MEMS) manufacturing that require film pasting protection, and specifically to a manual film pasting device for semiconductor wafers. Background Art

[0002] In the process of semiconductor integrated circuit and microelectromechanical system (MEMS) manufacturing, there is usually a process of pasting a film for protection on the device side of the wafer.

[0003] If an automatic film pasting machine is used, the equipment cost is high. For the film pasting process of individual special films with a small wafer lot size or for experimental purposes, a manual film pasting method with extremely low cost is required. In the manual film pasting process, for the double-layer film pasting process with a non-sticky back film, to separate the back film, unfold the adhesive film, and then paste it on the wafer surface to meet the requirement of bubble-free pasting between the film and the wafer surface, without a dedicated device, it cannot be achieved by one person's operation.

[0004] Therefore, a device that can paste the film smoothly and quickly with only one person is needed. Summary of the Invention

[0005] The purpose of the present invention is to provide a manual film pasting device for semiconductor wafers, including a large back film rewinding drive pulley, a small back film rewinding drive pulley, a large material rotation damping pulley, a belt, a small material rotation damping pulley, a material clamping rotating shaft, at least two material rack side plates, a front guiding film pressing shaft, a rotation damper, a material rack side plate connecting rod, a front guiding rubber roller, a film separating drive rubber roller, a back film rubber roller, a rear guiding rubber roller, a wafer adsorption platform, a moving film pressing support frame, a rear film pressing rubber roller, a suction cup platform base, a vacuum control pipeline, a front film pressing rubber roller, and a back film clamping rotating shaft;

[0006] The material rack side plates and the wafer adsorption platform are fixed on the suction cup platform base;

[0007] The wafer adsorption platform is used to place the wafer to be pasted with a film;

[0008] Both ends of the material rack side plate connecting rod are respectively connected to different material rack side plates, thus forming a material support frame;

[0009] Both ends of the front guiding film pressing shaft, the front guiding rubber roller, the film separating drive rubber roller, the back film rubber roller, and the rear guiding rubber roller are respectively connected to different material rack side plates;

[0010] The rear film pressing rubber roller and the front film pressing rubber roller are installed on the moving film pressing support frame;

[0011] The moving film pressing support frame is movably connected to the wafer adsorption platform and can move in the sliding grooves on both sides of the wafer adsorption platform;

[0012] The rotary damper is installed on the side plate of the material rack and is movably connected to the material clamping rotating shaft through a small material rotating damper pulley, a belt, and a large material rotating damper pulley;

[0013] The material clamping rotating shaft is used to place the adhesive film to be used;

[0014] The small back film rewinding drive pulley is installed at the end of the film separating drive rubber roller shaft and is movably connected to the large back film rewinding drive pulley through a belt;

[0015] The large back film rewinding drive pulley is installed on the back film clamping rotating shaft;

[0016] The vacuum control pipeline is connected to the adsorption interface at the bottom of the wafer adsorption platform and is connected to the vacuum interface at the bottom of the wafer adsorption platform at one end.

[0017] Furthermore, it also includes fixing screws;

[0018] The side plate of the material rack and the wafer adsorption platform are fixed on the suction cup platform base through fixing screws;

[0019] Both ends of the connecting rod of the side plate of the material rack are connected to the side plate of the material rack through fixing screws;

[0020] The rotary damper is installed on the side plate of the material rack by using fixing screws;

[0021] Furthermore, it also includes bearings;

[0022] Both ends of the front film guiding roller, the front rubber roller, the film separating drive rubber roller, the back film rubber roller, and the rear rubber roller are respectively connected to different side plates of the material rack through bearings;

[0023] The rear film pressing rubber roller and the front film pressing rubber roller are installed on the moving film pressing support frame through bearings;

[0024] The moving film pressing support frame is movably connected to the wafer adsorption platform through bearings stuck in the sliding grooves on both sides of the wafer adsorption platform;

[0025] Furthermore, several feet for support are also provided at the bottom of the suction cup platform base.

[0026] Furthermore, the front film guiding roller, the front rubber roller, the film separating drive rubber roller, the back film rubber roller, and the rear rubber roller form a film separating system;

[0027] The film separating system can rotate according to the direction of the pulled-out film, so as to pull out the adhesive film.

[0028] Furthermore, the rotary damper, the large material rotating damper pulley, the belt, the small material rotating damper pulley, and the material clamping rotating shaft form a rotary damping system, which provides a damping force for the rotation of the film separating system to prevent excessive film output.

[0029] Furthermore, the film separating driving rubber roller, the back film rubber roller, the small driving pulley for back film rewinding, the large driving pulley for back film rewinding, the belt, and the back film clamping rotating shaft form a back film rewinding system; the back film rewinding system is used for rewinding the back film with an adhesive film.

[0030] The technical effect of the present invention is beyond doubt. Through the structural design of its material rotation damping system, the separation of the adhesive film, and the back film rewinding system, the device realizes single - person operation in the semiconductor wafer device process. It can separate the back film and rewind the back film only by relying on the pulling force of the adhesive film, without the assistance of others or electricity. The manual film - sticking device for semiconductor wafers of the present invention can be applied to the manual film - sticking protection process for device protection before wafer thinning in semiconductor integrated circuit manufacturing and micro - electro - mechanical system (MEMS) manufacturing. Brief Description of the Drawings

[0031] Figure 1 is an axonometric schematic diagram of the overall structure of the device of the present invention;

[0032] Figure 2 is a cross - sectional schematic diagram of the overall structure of the device of the present invention;

[0033] Figure 3 is a schematic diagram of the material installation of the device of the present invention;

[0034] Figure 4 is a schematic diagram of film - sticking of the device of the present invention;

[0035] In the figure: large driving pulley for back film rewinding 1, small driving pulley for back film rewinding 2, bearing 3, large belt pulley for material rotation damping 4, belt 5, small belt pulley for material rotation damping 6, material clamping rotating shaft 7, at least two material rack side plates 8, front guiding film roller 9, rotating damper 10, material rack side plate connecting rod 11, front guiding rubber roller 12, film separating driving rubber roller 13, back film rubber roller 14, rear guiding rubber roller 15, wafer adsorption platform 16, moving film - pressing support frame 17, rear film - pressing rubber roller 18, suction cup platform base 19, vacuum control pipeline 20, floor feet 21, fixing screw 22, front film - pressing rubber roller 23, back film clamping rotating shaft 24, adhesive film to be used 25, wafer to be film - stuck 26. Detailed Embodiments

[0036] The present invention will be further described below in conjunction with embodiments, but it should not be understood that the above - mentioned subject scope of the present invention is limited to the following embodiments. Without departing from the above - mentioned technical idea of the present invention, various substitutions and modifications made according to ordinary technical knowledge and conventional means in the art should be included within the protection scope of the present invention.

[0037] Embodiment 1:

[0038] SeeFigures 1 to 4 , a manual semiconductor wafer film laminating device, comprising a large back film rewinding drive pulley 1, a small back film rewinding drive pulley 2, a bearing 3, a large material rotation damping pulley 4, a belt 5, a small material rotation damping pulley 6, a material clamping rotating shaft 7, at least two material rack side plates 8, a front guiding film pressing shaft 9, a rotary damper 10, a material rack side plate connecting rod 11, a front guiding rubber roller 12, a film separating drive rubber roller 13, a back film rubber roller 14, a rear guiding rubber roller 15, a wafer adsorption platform 16, a moving film pressing support frame 17, a rear film pressing rubber roller 18, a suction cup platform base 19, a vacuum control pipeline 20, a floor footing 21, a fixing screw 22, a front film pressing rubber roller 23, and a back film clamping rotating shaft 24;

[0039] The material rack side plates 8 and the wafer adsorption platform 16 are fixed on the suction cup platform base 19;

[0040] The wafer adsorption platform 16 is used for placing the wafer 26 to be film laminated;

[0041] Both ends of the material rack side plate connecting rod 11 are respectively connected to different material rack side plates 8, thus forming a material support frame;

[0042] Both ends of the front guiding film pressing shaft 9, the front guiding rubber roller 12, the film separating drive rubber roller 13, the back film rubber roller 14, and the rear guiding rubber roller 15 are respectively connected to different material rack side plates 8;

[0043] The rear film pressing rubber roller 18 and the front film pressing rubber roller 23 are installed on the moving film pressing support frame 17;

[0044] The moving film pressing support frame 17 is movably connected to the wafer adsorption platform 16 and can move in the sliding grooves on both sides of the wafer adsorption platform 16;

[0045] The rotary damper 10 is installed on the material rack side plate 8 and is movably connected to the material clamping rotating shaft 7 through the small material rotation damping pulley 6, the belt 5, and the large material rotation damping pulley 4;

[0046] The material clamping rotating shaft 7 is used for placing the adhesive film 25 to be used;

[0047] The small back film rewinding drive pulley 2 is installed at the shaft end of the film separating drive rubber roller 13 and is movably connected to the large back film rewinding drive pulley 1 through the belt 5;

[0048] The large back film rewinding drive pulley 1 is installed on the back film clamping rotating shaft 24;

[0049] The vacuum control pipeline 20 is connected to the adsorption interface at the bottom of the wafer adsorption platform 16 and one end is connected to the vacuum interface at the bottom of the wafer adsorption platform 16.

[0050] The side plate 8 of the material rack and the wafer adsorption platform 16 are fixed on the sucker platform base 19 by fixing screws 22;

[0051] Both ends of the connecting rod 11 of the side plate of the material rack are connected to the side plate 8 of the material rack by fixing screws 22;

[0052] The rotary damper 10 is installed on the side plate 8 of the material rack by a fixing screw 22;

[0053] Both ends of the front film pressing shaft 9, the front guide rubber roller 12, the film separating drive rubber roller 13, the back film rubber roller 14, and the rear guide rubber roller 15 are respectively connected to different side plates 8 of the material rack through bearings 3;

[0054] The rear film pressing rubber roller 18 and the front film pressing rubber roller 23 are installed on the moving film pressing support frame 17 through bearings 3;

[0055] The moving film pressing support frame 17 is movably connected to the wafer adsorption platform 16 through bearings 3 stuck in the sliding grooves on both sides of the wafer adsorption platform 16;

[0056] Several feet 21 for support are also provided at the bottom of the sucker platform base 19.

[0057] The front film pressing shaft 9, the front guide rubber roller 12, the film separating drive rubber roller 13, the back film rubber roller 14, and the rear guide rubber roller 15 form a film separating system;

[0058] The film separating system can rotate according to the direction of the pulled-out film, so as to pull out the adhesive film 25. The rotary damper 10, the large belt pulley 4 of the material rotary damper, the belt 5, the small belt pulley 6 of the material rotary damper, and the material clamping rotating shaft 7 form a rotary damping system, which provides a damping force for the rotation of the film separating system to prevent the film from coming out too fast.

[0059] The film separating drive rubber roller 13, the back film rubber roller 14, the small belt pulley 2 for back film rewinding drive, the large belt pulley 1 for back film rewinding drive, the belt 5, and the back film clamping rotating shaft 24 form a back film rewinding system; the back film rewinding system is used to rewind the back film of the adhesive film 25.

[0060] Example 2:

[0061] See Figures 1 to 4, A manual film - sticking device for semiconductor wafers, including a large back - film rewinding driving pulley 1, a small back - film rewinding driving pulley 2, a bearing 3, a large material - rotating damping pulley 4, a belt 5, a small material - rotating damping pulley 6, a material - clamping rotating shaft 7, a side plate of the material rack 8, a front film - guiding and pressing shaft 9, a rotating damper 10, a connecting rod of the side plate of the material rack 11, a front guiding rubber roller 12, a film - separating driving rubber roller 13, a back - film rubber roller 14, a rear guiding rubber roller 15, a wafer adsorption platform 16, a moving film - pressing support frame 17, a rear film - pressing rubber roller 18, a base of the suction cup platform 19, a vacuum control pipeline 20, a floor - foot 21, a fixing screw 22, a front film - pressing rubber roller 23, a back - film clamping rotating shaft 24;

[0062] See Figure 3 , For the original material of the film - sticking being a two - layer film, one layer is the required adhesive - coated film, and the other layer is the non - sticky back - film. During the process of film - sticking, the film is installed on the material - clamping rotating shaft 7, and the led adhesive film bypasses the front film - guiding and pressing shaft 9, the front guiding rubber roller 12, and the film - separating driving rubber roller 13, and then the adhesive - coated film and the back - film are separated. The back - film is fixed on the back - film clamping rotating shaft 24 after bypassing the back - film rubber roller 14, and the adhesive - coated film bypasses the rear guiding rubber roller 15. The wafer 26 to be film - stuck is placed on the wafer adsorption platform 16. The manual stop valve of the vacuum control pipeline 20 is opened, and the wafer 26 is firmly adsorbed on the wafer adsorption platform 16. Manually pull out and unfold the adhesive - coated film from the rear guiding rubber roller 15, cover it over the wafer 26, and attach the end of the film to the low - step surface of the wafer adsorption platform 16, forming a wedge - shaped angle between the adhesive film and the wafer 26. The force of manually pulling out the adhesive film drives the film - separating driving rubber roller 13 to rotate, drives the small back - film rewinding driving pulley 2 installed at the end of the film - separating driving rubber roller 13 to rotate, is movably connected with the large back - film rewinding driving pulley 1 through the belt 5, and drives the back - film clamping rotating shaft 24 to achieve the separation and recycling of the back - film and the adhesive - coated film without the intervention of other personnel, electricity, and air driving to complete.

[0063] See Figure 4 , Push the moving film - pressing support frame 17 towards the material support frame. The front film - pressing rubber roller 23 and the rear film - pressing rubber roller 18 installed on the moving film - pressing support frame 17 roll and attach the adhesive film to the surface of the wafer 26 to achieve the purpose of film - sticking.

[0064] Example 3:

[0065] See Figures 1 to 4 , A manual film - sticking device for semiconductor wafers, including a large back - film rewinding driving pulley, a small back - film rewinding driving pulley, a bearing, a large material - rotating damping pulley, a belt, a small material - rotating damping pulley, a material - clamping rotating shaft, a side plate of the material rack, a front film - guiding and pressing shaft, a rotating damper, a connecting rod of the side plate of the material rack, a front guiding rubber roller, a film - separating driving rubber roller, a back - film rubber roller, a rear guiding rubber roller, a wafer adsorption platform, a moving film - pressing support frame, a rear film - pressing rubber roller, a base of the suction cup platform, a vacuum control pipeline, a floor - foot, a fixing screw, a front film - pressing rubber roller, a back - film clamping rotating shaft.

[0066] The two material rack side plates form a material support frame through four material rack side plate connecting rods and fixing screws.

[0067] The front film pressing shaft, the front rubber roller, the film separation driving rubber roller, the back film rubber roller and the rear rubber roller are installed between the side plates of the material rack through ten bearings, and can rotate without large damping according to the direction of pulling out the film, so as to form a film separation system.

[0068] The rotary damper, the large material rotary damping pulley, the belt, the small material rotary damping pulley, and the material clamping shaft form a rotary damping system for preventing the material from sticking due to excessive film discharge.

[0069] The film separation driving rubber roller, the back film rubber roller, the back film rewinding transmission small belt pulley, the back film rewinding driving large belt pulley, the belt, and the back film clamping rotating shaft constitute a back film rewinding system.

[0070] The wafer adsorption platform is fixed on the suction cup platform base by fixing screws, the vacuum control pipeline is fixed on the suction cup platform base, and one end is connected to the vacuum interface at the bottom of the wafer adsorption platform, forming a stage system for wafer adsorption and fixation and introduction into the atmosphere for release.

[0071] The above-mentioned entire support frame and stage system are assembled into one by screws, and the rear film pressing rubber roller and the front film pressing rubber roller are installed on the mobile film pressing support frame through four bearings. The mobile film pressing support frame is movably connected through four bearings stuck in the slide grooves on both sides of the wafer adsorption platform, forming a device that can realize the positioning and film sticking of manually pulling out the adhesive film.

[0072] During the film laminating process, due to the function of the material's rotation damping system, the material will rotate in the direction of the pull-out to output the same length of film as the adhesive film is manually pulled out, and will not automatically rotate more. Due to the function of the back film rewinding system, the back film can be rewound to the same length as the adhesive film is manually pulled out.

[0073] Embodiment 4:

[0074] A semiconductor wafer manual film pasting device comprises a large pulley 1 for back film rewinding transmission, a small pulley 2 for back film rewinding driving, a large pulley 4 for material rotation damping, a belt 5, a small pulley 6 for material rotation damping, a material clamping shaft 7, at least two material rack side panels 8, a front guide film pressing shaft 9, a rotary damper 10, a material rack side panel connecting rod 11, a front guide rubber roller 12, a film separation driving rubber roller 13, a back film rubber roller 14, a rear guide rubber roller 15, a wafer adsorption platform 16, a movable film pressing support frame 17, a rear film pressing rubber roller 18, a suction cup platform base 19, a vacuum control pipeline 20, a front film pressing rubber roller 23, and a back film clamping shaft 24.

[0075] The side plate 8 of the material rack and the wafer adsorption platform 16 are fixed on the sucker platform base 19;

[0076] The wafer adsorption platform 16 is used for placing the wafer 26 to be pasted with film;

[0077] Both ends of the side plate connecting rod 11 of the material rack are respectively connected to different side plates 8 of the material rack, thus forming a material support frame;

[0078] Both ends of the leading film pressing shaft 9, the leading rubber roller 12, the film separating driving rubber roller 13, the back film rubber roller 14, and the trailing rubber roller 15 are respectively connected to different side plates 8 of the material rack;

[0079] The trailing film pressing rubber roller 18 and the leading film pressing rubber roller 23 are installed on the moving film pressing support frame 17;

[0080] The moving film pressing support frame 17 is movably connected to the wafer adsorption platform 16 and can move in the sliding grooves on both sides of the wafer adsorption platform 16;

[0081] The rotary damper 10 is installed on the side plate 8 of the material rack and is movably connected to the material clamping rotating shaft 7 through the material rotary damper small pulley 6, the belt 5, and the material rotary damper large pulley 4;

[0082] The material clamping rotating shaft 7 is used for placing the adhesive film 25 to be used;

[0083] The back film rewinding driving small pulley 2 is installed at the shaft end of the film separating driving rubber roller 13 and is connected to the back film rewinding driving large pulley 1 through the belt 5;

[0084] The back film rewinding driving large pulley 1 is installed on the back film clamping rotating shaft 24;

[0085] The vacuum control pipeline 20 is connected to the adsorption interface at the bottom of the wafer adsorption platform 16 and is connected to the vacuum interface at the bottom of the wafer adsorption platform 16 at one end.

[0086] Example 5:

[0087] A semiconductor wafer manual film pasting device, the main content is shown in Example 4, wherein, it further includes a fixing screw 22;

[0088] The side plate 8 of the material rack and the wafer adsorption platform 16 are fixed on the sucker platform base 19 through the fixing screw 22;

[0089] Both ends of the side plate connecting rod 11 of the material rack are connected to the side plate 8 of the material rack through the fixing screw 22;

[0090] The rotary damper 10 is installed on the side plate 8 of the material rack by using the fixing screw 22; Example 6:

[0091] A manual film pasting device for semiconductor wafers, the main content is shown in Embodiment 4, and further includes a bearing 3;

[0092] Both ends of the leading film pressing roller 9, the leading rubber roller 12, the film separating driving rubber roller 13, the back film rubber roller 14, and the trailing rubber roller 15 are respectively connected to different material rack side plates 8 through the bearing 3;

[0093] The trailing film pressing rubber roller 18 and the leading film pressing rubber roller 23 are installed on the moving film pressing support frame 17 through the bearing 3;

[0094] The moving film pressing support frame 17 is movably connected to the wafer adsorption platform 16 through the bearing 3 stuck in the sliding grooves on both sides of the wafer adsorption platform 16;

[0095] Embodiment 7:

[0096] A manual film pasting device for semiconductor wafers, the main content is shown in Embodiment 4, and a plurality of floor feet 21 for support are further provided at the bottom of the sucker platform base 19.

[0097] Embodiment 8:

[0098] A manual film pasting device for semiconductor wafers, the main content is shown in Embodiment 4, and the leading film pressing roller 9, the leading rubber roller 12, the film separating driving rubber roller 13, the back film rubber roller 14, and the trailing rubber roller 15 form a film separating system;

[0099] The film separating system can rotate according to the direction of the pulled-out film, so as to pull out the adhesive film 25.

[0100] Embodiment 9:

[0101] A manual film pasting device for semiconductor wafers, the main content is shown in Embodiment 4, and the rotary damper 10, the material rotary damping large pulley 4, the belt 5, the material rotary damping small pulley 6, and the material clamping rotating shaft 7 form a rotary damping system, which provides a damping force for the rotation of the film separating system to prevent the film from being pulled out too fast.

[0102] Embodiment 10:

[0103] A manual film pasting device for semiconductor wafers, the main content is shown in Embodiment 4, and the film separating driving rubber roller 13, the back film rubber roller 14, the back film rewinding driving small pulley 2, the back film rewinding transmission large pulley 1, the belt 5, and the back film clamping rotating shaft 24 form a back film rewinding system; the back film rewinding system is used to rewind the back film of the adhesive film 25.

Claims

1. A manual film pasting device for semiconductor wafers, characterized in that: It includes a large back film rewinding driving pulley (1), a small back film rewinding driving pulley (2), a large material rotation damping pulley (4), a belt (5), a small material rotation damping pulley (6), a material clamping rotating shaft (7), at least two material rack side plates (8), a front film guiding roller (9), a rotation damper (10), a material rack side plate connecting rod (11), a front guiding rubber roller (12), a film separating driving rubber roller (13), a back film rubber roller (14), a rear guiding rubber roller (15), a wafer adsorption platform (16), a moving film pressing support frame (17), a rear film pressing rubber roller (18), a suction cup platform base (19), a vacuum control pipeline (20), a front film pressing rubber roller (23), and a back film clamping rotating shaft (24); The material rack side plates (8) and the wafer adsorption platform (16) are fixed on the suction cup platform base (19); The wafer adsorption platform (16) is used for placing the wafer (26) to be film-coated; Both ends of the material rack side plate connecting rod (11) are respectively connected to different material rack side plates (8), thus forming a material support frame; Both ends of the front film guiding roller (9), the front guiding rubber roller (12), the film separating driving rubber roller (13), the back film rubber roller (14), and the rear guiding rubber roller (15) are respectively connected to different material rack side plates (8); The rear film pressing rubber roller (18) and the front film pressing rubber roller (23) are installed on the moving film pressing support frame (17); The moving film pressing support frame (17) is movably connected to the wafer adsorption platform (16) and can move in the sliding grooves on both sides of the wafer adsorption platform (16); The rotation damper (10) is installed on the material rack side plate (8) and is movably connected to the material clamping rotating shaft (7) through the small material rotation damping pulley (6), the belt (5), and the large material rotation damping pulley (4); The material clamping rotating shaft (7) is used for placing the adhesive film (25) to be used; The small back film rewinding driving pulley (2) is installed at the shaft end of the film separating driving rubber roller (13) and is movably connected to the large back film rewinding driving pulley (1) through the belt (5); The large back film rewinding driving pulley (1) is installed on the back film clamping rotating shaft (24); The vacuum control pipeline (20) is connected to the adsorption interface at the bottom of the wafer adsorption platform (16), and one end is connected to the vacuum interface at the bottom of the wafer adsorption platform (16).

2. The manual film pasting device for semiconductor wafers according to claim 1, characterized in that: It also includes fixing screws (22); The material rack side plates (8) and the wafer adsorption platform (16) are fixed on the suction cup platform base (19) through the fixing screws (22); Both ends of the material rack side plate connecting rod (11) are connected to the material rack side plates (8) through the fixing screws (22); The rotation damper (10) is installed on the material rack side plate (8) by using the fixing screws (22).

3. The manual film pasting device for semiconductor wafers according to claim 1, characterized in that: It also includes bearings (3); Both ends of the front film guiding roller (9), the front guiding rubber roller (12), the film separating driving rubber roller (13), the back film rubber roller (14), and the rear guiding rubber roller (15) are respectively connected to different material rack side plates (8) through the bearings (3); The rear film pressing rubber roller (18) and the front film pressing rubber roller (23) are installed on the moving film pressing support frame (17) through the bearings (3); The movable film pressing support frame (17) is movably connected to the wafer adsorption platform (16) through bearings (3) clamped in the chute on both sides of the wafer adsorption platform (16).

4. The manual film pasting device for semiconductor wafers according to claim 1, characterized in that: Several feet (21) for support are also provided at the bottom of the sucker platform base (19).

5. The manual film pasting device for semiconductor wafers according to claim 1, characterized in that: The front film pressing shaft (9), the front guide rubber roller (12), the film separating drive rubber roller (13), the back film rubber roller (14), and the rear guide rubber roller (15) form a film separating system; The film separating system can rotate according to the direction of the pulled film, so as to pull out the adhesive film (25).

6. The manual film pasting device for semiconductor wafers according to claim 5, characterized in that: The rotary damper (10), the material rotary damping large pulley (4), the belt (5), the material rotary damping small pulley (6), and the material clamping rotating shaft (7) form a rotary damping system, which provides a damping force for the rotation of the film separating system to prevent excessive film output.

7. The manual film pasting device for semiconductor wafers according to claim 1, characterized in that: The film separating drive rubber roller (13), the back film rubber roller (14), the back film rewinding drive small pulley (2), the back film rewinding drive large pulley (1), the belt (5), and the back film clamping rotating shaft (24) form a back film rewinding system; the back film rewinding system is used to rewind the back film of the adhesive film (25).

Images