Printed circuit board

Abstract

Disclosed is a printed circuit board divided into a printed circuit board region and a peripheral region surrounding the printed circuit board region, the printed circuit board including: a plurality of unit printed circuit boards provided in the printed circuit board region; a base portion provided in the peripheral region and the printed circuit board region, and including a circuit pattern portion and an insulating material portion; a first solder resist portion provided on a first surface and a second surface of the base portion in the peripheral region, the first surface being opposite to the second surface; and a second solder resist portion provided on the first surface and the second surface of the base portion in the printed circuit board region. The first solder resist portion surrounds the second solder resist portion in the printed circuit board region. The first solder resist portion includes a first filler, and the second solder resist portion includes a second filler different from the first filler.

Description

TECHNICAL FIELD

[0001] The present invention relates to a printed circuit board, and more particularly, to a printed circuit board preventing moisture penetration and warpage. BACKGROUND

[0002] Printed circuit boards applied to various electronic products have been continuously developed to cope with the increasing need for higher functionality of smaller and faster electronic devices.

[0003] In particular, as the size of various electronic products including printed circuit boards becomes smaller and smaller, making the printed circuit boards smaller and thinner has become an important task, and a great deal of research is being conducted at the present stage. However, the thinner the thickness of the printed circuit board, the less rigid it becomes, and the more likely it is to cause warpage. In addition, in the process of manufacturing the printed circuit board, when the printed circuit board is separated from the press mold, the outer periphery of the printed circuit board is easily pulled by the separation film due to the large adhesion force at the time of demolding, thereby causing warpage and seriously affecting the workability of the plastic encapsulation process.

[0004] In addition, as integrated circuit (IC) products are widely used, higher requirements are placed on the life and reliability of the IC products. However, the life of the IC product is greatly affected by moisture. In particular, moisture penetration easily occurs at the interface where the substrate of the printed circuit board is combined with the epoxy resin molding compound (EMC), which causes degradation of the electrical properties of the IC product, thereby degrading the reliability of the IC product and shortening the service life. The printed circuit board is easily warped due to its thinness, which also increases the possibility of moisture intrusion. SUMMARY

[0005] A printed circuit board that can improve warpage and prevent moisture penetration is provided.

[0006] Additional aspects will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following and the attendant drawings. Embodiments of the invention will be described with reference to the following drawings.

[0007] According to an example embodiment, a printed circuit board is provided, wherein the printed circuit board is divided into a printed circuit board region and a peripheral region surrounding the printed circuit board region. The printed circuit board includes: a plurality of unit printed circuit boards disposed in the printed circuit board region; a substrate portion disposed in the peripheral region and the printed circuit board region, and including a circuit pattern portion and an insulating material portion; a first solder resist portion disposed in the peripheral region on a first surface and a second surface of the substrate portion, the first surface being opposite to the second surface; and a second solder resist portion disposed in the printed circuit board region on the first surface and the second surface of the substrate portion; wherein the first solder resist portion surrounds the second solder resist portion in the printed circuit board region, and wherein the first solder resist portion includes a first filler, and the second solder resist portion includes a second filler different from the first filler.

[0008] According to an example embodiment, a printed circuit board is provided, the printed circuit board including: a printed circuit board region; a peripheral region surrounding the printed circuit board region; a substrate portion disposed in the peripheral region and the printed circuit board region; a first solder resist portion disposed in the peripheral region on a first surface and a second surface of the substrate portion, the second surface being opposite to the first surface; and a second solder resist portion disposed in the printed circuit board region on the first surface and the second surface of the substrate portion, wherein the first solder resist portion surrounds the second solder resist portion in the printed circuit board region.

[0009] According to an example embodiment, a printed circuit board is provided, the printed circuit board including: a printed circuit board region; a peripheral region surrounding the printed circuit board region; a substrate portion disposed in the peripheral region and the printed circuit board region; a first solder resist portion including a first portion disposed in the peripheral region on a first surface of the substrate portion and a second portion disposed in the peripheral region on a second surface of the substrate portion opposite to the first surface; and a second solder resist portion including a first portion disposed in the printed circuit board region on the first surface of the substrate portion and a second portion disposed in the printed circuit board region on the second surface of the substrate portion, wherein the first solder resist portion surrounds the second solder resist portion in the printed circuit board region. Attached Figure Description

[0010] The above and other objects and features of the invention will become clearer from the following description taken in conjunction with the exemplary drawings, in which:

[0011] Figure 1A This is a top view showing a printed circuit board according to an example embodiment;

[0012] Figure 1B This is a bottom view of a printed circuit board according to an example embodiment;

[0013] Figure 2This is a cross-sectional view of a printed circuit board according to an example embodiment;

[0014] Figure 3 This is a diagram illustrating the structure according to an example embodiment;

[0015] Figure 4 This shows a top view of a printed circuit board according to an example embodiment; and

[0016] Figure 5 This is a cross-sectional view of a printed circuit board according to an example embodiment. Detailed Implementation

[0017] Embodiments of the invention will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are illustrated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey to those skilled in the art the concept of embodiments of the invention. In the following detailed description, numerous specific details are set forth by way of example to provide a full understanding of the teachings relating to it. However, it will be apparent to those skilled in the art that the teachings can be practiced without such detail. In other instances, well-known methods, steps, and components are described at a relatively high level without detail to avoid unnecessarily obscuring various aspects of the teachings. The same reference numerals in the drawings denote the same elements, and therefore their description will not be repeated. In the drawings, the dimensions and relative dimensions of layers and regions may be exaggerated for clarity.

[0018] Furthermore, in this specification, the phrase "in a plane" or "plan view" means viewing the target portion from above, and the phrase "in a section" means viewing a section formed by vertically cutting the target portion from the side. Additionally, "vertical direction" indicates the up-down direction in a sectional view.

[0019] The invention will now be described more fully below with reference to the accompanying drawings.

[0020] Figure 1A This is a top view showing a printed circuit board according to an example embodiment. Figure 1B This is a bottom view of a printed circuit board according to an example embodiment. Figure 2 This is a cross-sectional view of a printed circuit board according to an example embodiment. Figure 2 It shows along Figure 1A The sectional view is taken by line I-I' in the middle, and for convenience, in Figure 2 The unit printed circuit board 10 is marked with a dashed frame.

[0021] Reference Figures 1A-2According to an exemplary embodiment of the present invention, a printed circuit board 1000 may include a plurality of unit printed circuit boards 10, and the printed circuit board 1000 may be divided into a printed circuit board area PCBA and a peripheral area PA surrounding the printed circuit board area PCBA, wherein the plurality of unit printed circuit boards 10 may be located in the printed circuit board area PCBA. Chips or chip packages to be electrically connected to the printed circuit board 1000 may be disposed in the printed circuit board area PCBA, and the peripheral area PA may be removed in a subsequent dicing process of the printed circuit board 1000.

[0022] like Figure 2 As shown, the printed circuit board 1000 may include a substrate portion 110, which may include a circuit pattern portion 101 and an insulating material portion 103 that partially exposes the circuit pattern portion 101. The substrate portion 110 may be disposed in the peripheral region PA and the printed circuit board region PCBA.

[0023] Each of the plurality of unit printed circuit boards 10 may have a circuit pattern portion 101 formed therein and an insulating material portion 103. In other words, each unit printed circuit board 10 may have electronic circuitry formed therein and an insulating layer structure for the electronic circuitry, enabling the performance of a predetermined function. The circuit pattern portion 101 may be formed by photolithographic etching or by processes such as plating, and may be connected to another circuit pattern portion 101 via, for example, through a via passing through the insulating material portion 103. However, the circuit pattern portion 101 is not limited to... Figure 2 The situation shown in the figure can be modified in various ways as needed.

[0024] Chips or chip packages that are to be electrically connected to printed circuit boards 1000 can be disposed on each unit printed circuit board 10 to realize the predetermined function of the chip.

[0025] Solder resist portions that at least partially expose the circuit pattern portion 101 may be provided on the first surface 102 and the second surface 104 of the substrate portion 110, and the first surface 102 of the substrate portion 110 may be opposite to the second surface 104 of the substrate portion 110. The solder resist portions may include a first solder resist portion 200 and a second solder resist portion 300. In the example embodiment, for the sake of simplifying the pattern structure and for convenience, [the following is omitted]. Figure 1A and Figure 1B The plan view shows the circuit pattern portion 101 exposed by the first solder mask portion 200 and the second solder mask portion 300.

[0026] In example embodiments, such as Figure 1A and Figure 1BAs shown, the second solder resist portion 300 may include a solder resist portion 300a disposed on a first surface 102 of the substrate portion 110 in the printed circuit board area PCBA and a solder resist portion 300b disposed on a second surface 104 of the substrate portion 110 in the printed circuit board area PCBA. The first solder resist portion 200 may include a solder resist portion 200a disposed on the first surface 102 of the substrate portion 110 in the peripheral area PA. Figure 1A As shown, the solder resist portion 200a of the first solder resist portion 200 disposed in the peripheral region PA can be disposed on the first surface 102 of the base portion 110 in a manner surrounding the printed circuit board region PCBA. That is, the solder resist portion 200a of the first solder resist portion 200 disposed in the peripheral region PA can have a frame shape surrounding the printed circuit board region PCBA in a top view. In addition, the first solder resist portion 200 may also include a solder resist portion 200b disposed in the peripheral region PA on the second surface 104 of the base portion 110 in a manner surrounding the printed circuit board region PCBA, but in the peripheral region PA, the size of the solder resist portion 200b of the first solder resist portion 200 disposed on the second surface 104 of the base portion 110 can be smaller than the size of the solder resist portion 200a of the first solder resist portion 200 disposed on the first surface 102 of the base portion 110, and the solder resist portion 300b of the second solder resist portion 300 can be disposed on the second surface 104 of the base portion 110 in the peripheral region PA. For example, as Figure 2 As shown, the solder resist portion 200b of the first solder resist portion 200 disposed on the second surface 104 of the substrate portion 110 in the peripheral region PA can be disposed side by side with the solder resist portion 300b of the second solder resist portion 300 disposed on the second surface 104 of the peripheral region PA, and the solder resist portion 300b of the second solder resist portion 300 disposed on the second surface 104 of the substrate portion 110 in the peripheral region PA can be located between the printed circuit board region PCBA and the solder resist portion 200b of the first solder resist portion 200 disposed on the second surface 104.

[0027] The solder resist portion 300b of the second solder resist portion 300, which is disposed on the second surface 104 of the substrate portion 110 in the peripheral region PA, can surround the printed circuit board region PCBA on the second surface 104. In the peripheral region PA, the solder resist portion 200b of the first solder resist portion 200 formed on the second surface 104 can be combined with the solder resist portion 300b of the second solder resist portion 300 formed on the second surface 104 in various shapes, such as straight lines, serrated edges, wavy shapes, or pulse shapes.

[0028] The thickness of the solder resist portion 200a disposed on the first surface 102 can be the same as the thickness of the solder resist portion 200b disposed on the second surface 104; however, the disclosed example embodiments are not limited thereto. Furthermore, refer to... Figure 1A and Figure 2 The printed circuit board area (PCBA) can be divided into multiple unit printed circuit board areas (UPCBA) based on the unit printed circuit board 10. Each unit printed circuit board 10 can be disposed in the unit printed circuit board area (UPCBA). During the manufacturing process, after the printed circuit board 1000 is manufactured, it can be cut according to the unit printed circuit board area (UPCBA) to obtain each unit printed circuit board 10.

[0029] A second solder resist portion 300 (e.g., solder resist portion 300a) may be provided in each unit printed circuit board area (UPCBA). In each UPCBA, the second solder resist portion 300 may be provided on the first surface 102 and the second surface 104 of the substrate portion 110. For example, in each UPCBA, solder resist portion 300a is provided on the first surface 102 of the substrate portion 110, and solder resist portion 300b is provided on the second surface 104 of the substrate portion 110. Furthermore, in each UPCBA, a solder resist portion 200c of the first solder resist portion 200 may also be formed on the first surface 102 of the substrate portion 110. The solder resist portion 200a of the first solder resist portion 200 provided on the first surface 102 in the peripheral region PA may be integrally provided with the solder resist portion 200c of the first solder resist portion 200 provided on the first surface 102 in the corresponding UPCBA of the same peripheral region PA. On the first surface 102 of each unit printed circuit board area (UPCBA), the solder resist portion 200a of the first solder resist portion 200 may surround the solder resist portion 300a of the second solder resist portion 300. That is, in the example embodiment, the first solder resist portion 200 may be formed in a portion of each unit printed circuit board area (UPCBA) and in the peripheral area PA. For example, the solder resist portions 200a and 200b of the first solder resist portion 200 may be respectively disposed on the first surface 102 and the second surface 104 of the substrate portion 110 in the peripheral area PA, and the solder resist portion 200c of the first solder resist portion 200 may be disposed on the first surface 102 of the substrate portion 110 in a portion of each unit printed circuit board area (UPCBA). Furthermore, the solder resist portion 200c of the first solder resist portion 200 formed in the unit printed circuit board area UPCBA can be combined with the solder resist portion 300a of the second solder resist portion 300 on the first surface 102 of the substrate portion 110 in various shapes, such as straight lines, sawtooth shapes, wavy shapes, or pulse shapes. Additionally, in the unit printed circuit board area UPCBA, the solder resist portion 200c of the first solder resist portion 200 is not formed on the second surface 104 of the substrate portion 110. Therefore, in a cross-sectional view (e.g., ...), Figure 2 As shown in the diagram, in each unit printed circuit board area UPCBA, the solder resist portion 200c of the first solder resist portion 200 formed on the first surface 102 of the substrate portion 110 can be stacked in the vertical direction with the solder resist portion 300b of the second solder resist portion 300 formed on the second surface 104 of the substrate portion 110.

[0030] The solder resist portion 200c of the first solder resist portion 200 may be formed in the unit printed circuit board area UPCBA, but this disclosure is not limited thereto. That is, the first solder resist portion 200 may be formed only in the peripheral area PA of the printed circuit board 1000, and not in the unit printed circuit board area UPCBA. For example, the solder resist portion 200c of the first solder resist portion 200 may not be formed in the unit printed circuit board area UPCBA. In this example, the first solder resist portion 200 may be formed only on the first surface 102 and the second surface 104 of the substrate portion 110 in the peripheral area PA. In this case, the first solder resist portion 200 (e.g., solder resist portion 200a) formed in the peripheral area PA may be in direct contact with the second solder resist portion 300 (e.g., solder resist portion 300a) and bonded to each other in a shape such as a straight line, a sawtooth shape, a wave shape, or a pulse shape.

[0031] In the disclosed example embodiments, the forming material of the first solder resist portion 200 can be the same as the forming material of the second solder resist portion 300. However, the filler of the first solder resist portion 200, including solder resist portions 200a to 200c, can be different from the filler of the second solder resist portion 300, including solder resist portions 300a and 300b. The difference between the filler of the first solder resist portion 200 and the filler of the second solder resist portion 300 may be that the filler of the first solder resist portion 200 can be modified to have hydrophobic groups, for example, the surface of the filler is coated with hydrophobic groups. When the filler includes materials such as silica, the filler of the first solder resist portion 200 may include silica or the like with hydrophobic groups coated on its surface.

[0032] Figure 3 This is a diagram illustrating the structure according to an example embodiment. Figure 3 In the example structural formula of silicon dioxide encapsulated with hydrophobic groups shown in the figure, R is a hydrophobic group.

[0033] In the prior art, the filler for the solder resist portions formed on the upper and lower surfaces of the substrate is the same. In this case, due to the material properties of the solder resist portions, moisture in the environment can easily penetrate into the peripheral area of ​​the printed circuit board, thereby degrading the reliability of the printed circuit board and shortening its service life. However, according to embodiments of this disclosure, the filler for the solder resist portions 200a and / or 200b formed in the peripheral area PA of the printed circuit board 1000 can be coated with hydrophobic groups on their surfaces. Therefore, the printed circuit board 1000 according to the exemplary embodiment can prevent moisture penetration, thereby preventing the problem of delamination of the package structure due to moisture. In addition, according to the disclosed embodiments, the hydrophobic groups are not particularly limited, as long as they can improve moisture penetration.

[0034] Furthermore, in the disclosed example embodiments, the solder resist portion 200c of the first solder resist portion 200 may be further formed on the first surface 102 of the substrate portion 110 in each unit printed circuit board area UPCBA, and may surround the solder resist portion 300a of the second solder resist portion 300 in the unit printed circuit board area UPCBA. Therefore, the first solder resist portion 200 may also protect each unit printed circuit board 10 from moisture penetration into the unit printed circuit board 10 after the unit printed circuit board 10 is formed by cutting.

[0035] On the other hand, in order to make the rigidity of the first solder resist portion 200 greater than the rigidity of the second solder resist portion 300, the thickness of the first solder resist portion 200 formed on the substrate portion 110 can be greater than the thickness of the second solder resist portion 300 formed on the substrate portion 110. For example, the thickness of the first solder resist portion 200 can be about 35 μm, and the thickness of the second solder resist portion 300 can be about 15 μm. Therefore, the rigidity of the first solder resist portion 200 can be 1.3 times the rigidity of the second solder resist portion 300.

[0036] However, the embodiments according to this disclosure are not limited thereto. When the ratio (e.g., weight ratio) of the filler in the first solder resist 200 to the first solder resist 200 increases, the rigidity of the first solder resist 200 is enhanced. Therefore, in order to improve the rigidity of the printed circuit board 1000, the weight ratio of the filler in the first solder resist 200 to the first solder resist 200 can be higher than the weight ratio of the filler in the second solder resist 300 to the second solder resist 300, thereby making the rigidity of the first solder resist 200 greater than that of the second solder resist 300.

[0037] In the exemplary embodiments of this disclosure, the thickness of the solder resist portion 300a disposed on the first surface 102 of the second solder resist portion 300 may be the same as the thickness of the solder resist portion 300b disposed on the second surface 104 of the second solder resist portion 300. Furthermore, although the thickness of the first solder resist portion 200 is shown to be greater than the thickness of the second solder resist portion 300 in the cross-sectional view, this is not a limitation. For example, the thickness of the first solder resist portion 200 may be the same as the thickness of the second solder resist portion 300.

[0038] As a result, the printed circuit board 1000 according to the embodiment can enhance overall rigidity, thereby reducing overall warpage of the substrate and a series of problems caused by warpage. In addition, the first solder resist portion 200 (e.g., solder resist portion 200a and / or 200b) formed in the peripheral region PA is hydrophobic, thus preventing problems such as interface delamination caused by moisture.

[0039] In the foregoing embodiments, warping of the printed circuit board 1000 is prevented by increasing its rigidity, but the disclosed embodiments are not limited thereto. As in the embodiments described below, warping due to strong adhesion to the separation film is avoided by making the first solder resist portion 200 easily separable from the mold's separation film during the molding process.

[0040] Figure 4 This is a top view showing a printed circuit board according to an example embodiment. Figure 5 This is a cross-sectional view of a printed circuit board according to an exemplary embodiment. Figure 5 It shows along Figure 4 The sectional view taken from line II-II' in the middle.

[0041] To avoid unnecessary explanation, Figure 4 and Figure 5 The description of the printed circuit board in this embodiment will focus on the differences from the printed circuit board in the foregoing embodiments. Components not separately explained in the following description of this embodiment are the same as those in the foregoing embodiments. The same reference numerals will be used to denote the same components, and similar reference numerals will be used to denote similar components.

[0042] Reference Figure 4 and Figure 5 The first solder resist portion 2000 may be formed only in the peripheral region PA of the printed circuit board. That is, in this embodiment, the first solder resist portion 2000 may be formed in the peripheral region PA on the first surface 1020 and the second surface 1040 of the substrate portion 1100, and not in the printed circuit board area PCBA surrounded by the peripheral region PA. Additionally, the second solder resist portion 3000 may be formed in the peripheral region PA on the first surface 1020 of the substrate portion 1100. On each of the first surface 1020 and the second surface 1040 in the peripheral region PA, the first solder resist portion 200 may surround the second solder resist portion 3000. Furthermore, the first solder resist portion 2000 formed in the peripheral region PA may be in direct contact with the second solder resist portion 3000 in the peripheral region PA and may be coupled to each other in shapes such as straight lines, serrated edges, wavy lines, or pulsed shapes. On each of the first surface 1020 and the second surface 1040, the second solder resist portion 3000 formed in the peripheral region PA can be integrally formed with the second solder resist portion 3000 formed in the unit printed circuit board region UPCBA adjacent to the peripheral region PA.

[0043] During the encapsulation molding process of a printed circuit board, the first solder resist portion 2000 comes into direct contact with the release liner on the mold. To facilitate separation from the mold, the filler of the first solder resist portion 2000 can be coated with a wax-like material to reduce the adhesion between the first solder resist portion 2000 and the release liner. In an example embodiment, the surface of the filler of the first solder resist portion 2000 can be coated with a wax-like material. This allows the first solder resist portion 2000 to easily detach from the release liner on the mold, achieving the purpose of separation from the mold. Therefore, according to the example embodiment, the tensile force on the printed circuit board during separation from the mold is reduced, thereby reducing the possibility of warping.

[0044] Furthermore, in the example embodiment, the thickness of the first solder resist portion 2000 may be the same as the thickness of the second solder resist portion 3000, but this disclosure is not limited thereto. To further improve the rigidity of the printed circuit board, the thickness of the first solder resist portion 2000 may be greater than the thickness of the second solder resist portion 3000. That is, the thickness of the first solder resist portion 2000 may be greater than or equal to the thickness of the second solder resist portion 3000.

[0045] In addition, since the filler of the first weld resist portion 2000 can be coated with a waxy material on its surface, the first weld resist portion 2000 can also be used to prevent moisture penetration.

[0046] Although described separately Figures 1A-3 The embodiments described herein and Figure 4 and Figure 5 The embodiments described herein are as follows, but aspects of each embodiment may be combined without departing from the scope of the disclosure.

[0047] The printed circuit board according to the disclosed example embodiments can improve packaging process blockage and poor soldering caused by large warpage during the packaging process, and can simultaneously improve interface delamination problems caused by moisture absorption. Furthermore, during the packaging molding process, the adhesion force between the printed circuit board and the release film can be reduced when separating the printed circuit board from the mold.

[0048] In summary, the printed circuit board according to the exemplary embodiment of the present invention can achieve the purpose of preventing moisture penetration and / or facilitating demolding by changing the solder resist material formed on the surface of the substrate portion to a solder resist material comprising two different fillers, and by changing the arrangement of the solder resist material.

[0049] Furthermore, in the printed circuit board according to an exemplary embodiment of the present invention, the thickness of the first solder resist material formed in the peripheral region can be greater than the thickness of the second solder resist material formed in the printed circuit board region surrounded by the peripheral region, thereby improving the rigidity of the printed circuit board.

[0050] Furthermore, according to an exemplary embodiment of the present invention, the rigidity of the printed circuit board can be improved by increasing the content of filler in the first solder resist material compared to the second solder resist material.

[0051] Although various embodiments have been shown and described above, those skilled in the art will understand that various modifications, additions, substitutions, and combinations are possible without departing from the scope of this disclosure. Therefore, the embodiments disclosed in this specification are for illustrative purposes only and are not intended to limit the technical scope of this disclosure. The scope of this disclosure must be defined by the appended claims.

Claims

1. A printed circuit board, wherein, The printed circuit board is divided into a printed circuit board area and a peripheral area surrounding the printed circuit board area. Printed circuit boards include: Multiple unit printed circuit boards are arranged in the printed circuit board area; The substrate portion is disposed in the peripheral area and the printed circuit board area, and includes a circuit pattern portion and an insulating material portion. The first anti-weld portion is disposed on the first and second surfaces of the base portion in the peripheral region, with the first surface and the second surface facing each other. The second solder resist portion is disposed on the first and second surfaces of the substrate portion in the printed circuit board area; The first solder mask portion surrounds the second solder mask portion in the printed circuit board area. The first weld-resistant portion includes a first filler, and the second weld-resistant portion includes a second filler that is different from the first filler. The weight ratio of the first filler in the first weld resist portion to the first weld resist portion is greater than the weight ratio of the second filler in the second weld resist portion to the second weld resist portion.

2. The printed circuit board according to claim 1, wherein, The printed circuit board area includes multiple unit printed circuit board areas. Each of the plurality of unit printed circuit boards is located in at least one unit printed circuit board region among the plurality of unit printed circuit board regions, and The second solder resist portion is disposed on the first and second surfaces of the substrate portion in each of the plurality of unit printed circuit board regions.

3. The printed circuit board according to claim 2, wherein, The first filler in the first weld shield is coated with hydrophobic groups.

4. The printed circuit board according to claim 3, wherein, In each of the plurality of unit printed circuit board regions, a first solder resist portion is disposed on a first surface of the substrate portion around the second solder resist portion and contacts the second solder resist portion.

5. The printed circuit board according to claim 4, wherein, The second weld-resistant portion is further disposed in the peripheral region and on the second surface of the base portion, and The second solder resist portion on the second surface in the peripheral region is located between the printed circuit board region and the first solder resist portion on the second surface in the peripheral region.

6. The printed circuit board according to claim 3, in, The thickness of the first weld-proof part is greater than or equal to the thickness of the second weld-proof part.

7. The printed circuit board according to claim 2, wherein, The first filler of the first anti-weld section is coated with a wax-like material.

8. The printed circuit board according to claim 7, wherein, The second weld-resistant portion is further disposed in the peripheral region and on the first and second surfaces of the base portion, and Wherein, on each of the first and second surfaces of the substrate portion, the second solder resist portion in the peripheral region is located between the first solder resist portion in the peripheral region and the printed circuit board region.

9. The printed circuit board according to claim 7, wherein, The thickness of the first weld-proof part is greater than or equal to the thickness of the second weld-proof part.

10. The printed circuit board according to claim 8, wherein, The first and second anti-weld portions are combined with each other in the outer region in a straight line, serrated, wavy, or pulsed shape.

11. A printed circuit board, the printed circuit board comprising: Printed circuit board area; The outer area, surrounding the printed circuit board area; The substrate portion is located in the peripheral area and the printed circuit board area; The first anti-weld portion is disposed on the first and second surfaces of the base portion in the peripheral region, with the second surface opposite to the first surface; as well as The second solder mask portion is disposed on the first and second surfaces of the substrate portion in the printed circuit board area. The first solder mask portion surrounds the second solder mask portion in the printed circuit board area. The first solder resist portion is disposed on the first surface of the base portion around the second solder resist portion and contacts the second solder resist portion. The weight ratio of the first filler in the first weld resist portion to the first weld resist portion is greater than the weight ratio of the second filler in the second weld resist portion to the second weld resist portion.

12. The printed circuit board according to claim 11, wherein, The first weld-proof portion includes a first filler, and the second weld-proof portion includes a second filler that is different from the first filler.

13. The printed circuit board according to claim 11, wherein, The thickness of the first weld-proof part is greater than or equal to the thickness of the second weld-proof part.

14. The printed circuit board according to claim 12, wherein, The first filler in the first weld shield is coated with hydrophobic groups.

15. The printed circuit board according to claim 12, wherein, The first filler of the first anti-weld section is coated with a wax-like material.

16. The printed circuit board according to claim 11, wherein, The second weld-resistant portion is further disposed in the peripheral region and on the second surface of the base portion, and The second solder resist portion on the second surface in the peripheral region is located between the printed circuit board region and the first solder resist portion on the second surface in the peripheral region.

17. The printed circuit board according to claim 11, wherein, The second weld-resistant portion is further disposed in the peripheral region and on the first and second surfaces of the base portion, and The second solder resist portion in the peripheral region is located on each of the first and second surfaces of the substrate portion between the printed circuit board region and the first solder resist portion in the peripheral region.

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