Sensing component comprising a coupling element

Abstract

Disclosed herein are methods, devices, and systems for providing a sensing component for a device. An example sensing component includes a substrate, a sensing element attached to a surface of the substrate and in electronic communication therewith, a lower coupling element in contact with the sensing element, the lower coupling element defining a bottom layer of the sensing component, and an upper coupling element disposed adjacent to a top surface of the lower coupling element and defining a top layer of the sensing component, wherein the lower coupling element exhibits a lower internal stress relative to the upper coupling element.

Description

BACKGROUND

[0001] Devices including sensing components (e.g., pressure sensing components) can detect and / or measure a variety of parameters (e.g., pressure) in a wide variety of applications, including, for example, commercial applications, automotive applications, aerospace applications, industrial applications, and medical applications. Many sensing components suffer from technical challenges and limitations. Through the efforts, wisdom, and innovation, including the development solutions in embodiments of the present disclosure, many of these identified problems have been solved, many examples of which are described in detail herein. SUMMARY

[0002] Various embodiments described herein relate to sensing components in a variety of methods, devices, and systems.

[0003] According to various examples of the present disclosure, a sensing component is provided. In some examples, the sensing component includes a substrate, a sensing element attached to a surface of the substrate and in electronic communication therewith, a lower coupling element in contact with the sensing element, the lower coupling element defining a bottom layer of the sensing component, and an upper coupling element disposed adjacent to a top surface of the lower coupling element and defining a top layer of the sensing component, wherein the lower coupling element exhibits a lower internal stress relative to the upper coupling element.

[0004] According to various examples of the present disclosure, a method for manufacturing a sensing component is provided. In some examples, the method includes preparing a substrate, attaching a sensing element to a surface of the substrate, attaching a columnar structure to the substrate so as to surround the sensing element and define a cavity, disposing a lower coupling element within the columnar structure, and disposing an upper coupling element within the structure, wherein the lower coupling element exhibits a lower internal stress relative to the upper coupling element.

[0005] The foregoing exemplary summary, as well as other exemplary objectives and / or advantages, of the present disclosure and manner in which the same can be attained are further described in the following detailed description and its accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0006] The description of the exemplary embodiments can be read in conjunction with the accompanying drawings. It will be appreciated that the elements shown in the figures are not necessarily to scale, unless otherwise noted, for purposes of illustration and clarity. For example, the dimensions of some of the elements can be exaggerated relative to other elements. Embodiments incorporating teachings of the present disclosure are shown and described with respect to the figures presented herein, in which:

[0007] Figure 1 A cross-sectional view of an example sensing component according to various embodiments of the present disclosure is shown;

[0008] Figure 2An example method according to various embodiments of the disclosure is shown;

[0009] Figure 3 An example controller component according to various embodiments of the disclosure is shown;

[0010] Figure 4 A graph depicting example measurement results is shown; and

[0011] Figure 5 A graph depicting example measurement results associated with an example sensing component according to various embodiments of the disclosure is shown. DETAILED DESCRIPTION

[0012] Some embodiments of the disclosure will be described below with reference to the accompanying drawings, in which some embodiments of the disclosure are shown. These embodiments are not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Rather, the embodiments serve to enable others skilled in the art to make and use the disclosure, and to best practice the disclosure in substantial compliance with the required legal standards. Throughout this document, like reference numerals are used to refer to like elements.

[0013] The components shown in the figures represent components that can or can not be present in various embodiments of the disclosure described herein, such that embodiments can include fewer or more components than shown in the figures, without departing from the scope of the disclosure. Some components can be omitted from one or more of the figures, or shown in dashed lines to illustrate that they can be present or absent, in order to make the components shown in the figures more visible.

[0014] The phrases “in some embodiments,” “in various embodiments,” “in other embodiments,” etc. do not necessarily refer to the same embodiments, although they can. The above specific embodiments are examples of embodiments of the present disclosure, and are not intended to limit the present disclosure, but to provide examples of the disclosure only. Other specific embodiments of the present disclosure can include modifications to, or differences from, the described specific embodiments.

[0015] The words “example” or “exemplary” are used herein to mean “serving as an example, instance, or illustration.” Any implementation described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other implementations.

[0016] If the specification states a component, feature, structure, or characteristic “may,” “might,” “can,” “would,” “should,” “could,” “typically,” “often,” “usually,” “typically,” “optionally,” “for example,” “exemplary,” “for instance,” or “possibly,” with respect to or in one of the described embodiments, it is not necessarily implying that the component, feature, structure, or characteristic is mandatory, essential, or critical to every embodiment or that the component, feature, structure, or characteristic is useful, alone or in combination with other components, features, structures, or characteristics, in any embodiment. Such components, features, structures, or characteristics might or might not be present in some embodiments.

[0017] The term“electrically coupled” or“electronically communicate” in this disclosure can refer to two or more electronic elements and / or circuits connected by wired means (such as, but not limited to, electrically conductive wires or traces) and / or wireless means (such as, but not limited to, wireless networks, electromagnetic fields) such that data and / or information (e.g., electronic indications, signals) can be transmitted to and / or received from the electrically coupled electrical elements and / or circuits.

[0018] The term“gel” or“gel material” can refer to a non-fluid colloidal network or polymer or a soft semi-solid material that exhibits no flow when in a steady state. In some embodiments, example gels can include a portion of liquid material. Additionally, gels can exhibit adhesive and / or viscous properties. The term gelation can refer to an example process for forming and / or coagulating a gel. In some embodiments, a gel can be processed or cured in order to obtain target properties.

[0019] Sensing components (e.g., pressure / micro-pressure sensing components and / or force sensing components) are integral to a wide range of existing and emerging applications, such as smart medical devices and real-time healthcare monitoring. Devices and systems incorporating such sensing components include, for example and without limitation, motor control devices, HVAC systems, hydraulic control systems, blood dispersion devices, compressors, robots, automotive systems, control systems, and the like. In some examples, such devices can be configured to detect pressure associated with a medium (e.g., a substance, a wet medium, a fluid, and the like). For example, an example pressure sensing component can include a pressure sensing element (e.g., a sensing die) and a pressure measurement element. The pressure sensing element can be configured to absorb pressure of a medium, which is in turn detected and / or sensed by the pressure measurement element. The pressure measurement element can be configured to convert the incoming pressure of the medium (e.g., mechanical stress caused by the incoming pressure of the medium) into a measurable electrical signal. In some applications, the pressure sensing element (e.g., a sensing die) can be coupled to a coupling element (e.g., a gel), which absorbs and safely transmits force to the pressure sensing element, thereby providing a protective layer.

[0020] While coupling gels for pressure sensing elements can help isolate and protect the pressure sensing elements, they suffer from challenges in measurement performance and reliability due to a variety of different factors. For example, internal stresses of the gel material can cause a misalignment offset during the curing phase of manufacturing, which can result in inaccurate readings generated by devices incorporating such sensing components. In some examples, the misalignment offset caused by the coupling element (e.g., a gel material) can require trimming of the output of the sensing component associated therewith, adding unnecessary complexity and cost. Additionally, the properties (e.g., hardness or viscosity) of the coupling element can adversely affect the performance and sensitivity of the sensing element. For example, a lack of uniformity of the coupling element (e.g., a gel material) can generate measurement errors.

[0021] According to various embodiments of the present disclosure, example methods, components, devices, and systems are provided.

[0022] In various embodiments, the present disclosure can provide a sensing component including a substrate, a sensing element attached to and in electronic communication with a surface of the substrate, a lower coupling element in contact with the sensing element, the lower coupling element defining a bottom layer of the sensing component, and an upper coupling element disposed adjacent to a top surface of the lower coupling element and defining a top layer of the sensing component, wherein the lower coupling element exhibits lower internal stress relative to the upper coupling element. In some examples, each of the lower coupling element and the upper coupling element includes a gel material. In some examples, the lower coupling element includes a liquid or oil. In some examples, the sensing component includes a pressure sensing component, the sensing element includes a sensing die, and the substrate includes a PCBA or a ceramic board. In some examples, a ratio of a volume of the lower coupling element to a volume of the upper coupling element is 1:3. In some examples, at least one of the lower coupling element and the upper coupling element includes a silicone gel or a silicone oil. In some examples, the lower coupling element includes an inhibitor substance. In some examples, the upper coupling element includes a catalyst substance. In some examples, the lower coupling element and the upper coupling element are disposed within a columnar structure. In some examples, a height of the lower coupling element within the columnar structure is approximately 0.6 microns, and a height of the upper coupling element within the columnar structure is approximately 1 mm.

[0023] In various embodiments, this disclosure may provide a method for manufacturing a sensing element. In some examples, the method includes preparing a substrate; attaching a sensing element to a surface of the substrate; attaching a columnar structure to the substrate to surround the sensing element and define a cavity; disposing a lower coupling element within the columnar structure; and disposing an upper coupling element within the structure, wherein the lower coupling element exhibits lower internal stress relative to the upper coupling element. In some examples, the method further includes allowing the sensing element to solidify or cure for a first time period after disposing the lower coupling element within the columnar structure. In some examples, the method further includes allowing the sensing element to cure for a second time period after disposing the lower coupling element within the columnar structure. In some examples, each of the lower and upper coupling elements comprises a gel material. In some examples, the lower coupling element comprises a liquid or oil. In some examples, the sensing element comprises a pressure sensing element, the sensing element comprises a sensing die, and the substrate comprises a PCBA or a ceramic plate. In some examples, the volume ratio of the lower coupling element to the upper coupling element is 1:3. In some examples, the lower coupling element comprises an inhibitory substance. In some examples, the upper coupling element comprises a catalyst material. In some examples, the height of the lower coupling element within the columnar structure is approximately 0.6 micrometers, and the height of the upper coupling element within the columnar structure is approximately 1 mm.

[0024] Now for reference Figure 1 This image depicts a cross-sectional view of at least a portion of an example pressure sensing component 100 according to various embodiments of the present disclosure. The example pressure sensing component 100 may be a component of a device or apparatus. Figure 1 As depicted, the example pressure sensing component 100 includes a substrate 102 (e.g., a pressure measuring element), a pressure sensing element 104, columnar structures 110A and 110B, a lower coupling element 101, and an upper coupling element 103. As depicted, the example pressure sensing component 100 may be at least partially disposed within a housing, which may include metal, plastic, combinations thereof, etc.

[0025] The example pressure sensing element 100 can be configured to detect pressures between 0 and 150,000 psi. As depicted, the example pressure sensing element 100 defines a circular body / structure. However, the pressure sensing element 100 can have any other shape and can be embodied in a variety of forms. In various embodiments, at least one surface can be fixedly attached to or coupled to one or more other elements of the pressure sensing element 100. In some examples, as shown, the pressure sensing element 104 is at least partially disposed on a substrate 102 that defines the bottom surface of the pressure sensing element 100.

[0026] In some embodiments, as depicted, pressure sensing component 100 includes a pressure sensing element 104 and a substrate 102 (e.g., a pressure measuring element), the pressure sensing element being configured to detect the pressure of a medium, and the substrate being configured to provide a measurable electrical signal in response to the medium pressure absorbed by the pressure sensing element 104. In some embodiments, pressure sensing element 104 may be or include a sensing die, a silicon die, a piezoelectric chip, etc. As depicted, pressure sensing element 102 includes a sensing die. Example pressure sensing element 104 (e.g., a sensing die) may have a thickness between about 300 micrometers and about 800 micrometers and between about 10,000 micrometers. 2 With approximately 4,000,000 micrometers 2 The surface area between [specific dimensions]. In some examples, the pressure sensing element 104 (e.g., a sensing die) may have a thickness between about 380 micrometers and about 410 micrometers and a thickness between about 300,000 micrometers. 2 With approximately 500,000 micrometers 2 The surface area between. In one example, the sensing die can have a thickness of approximately 390 micrometers and a surface area of ​​approximately 390,625 micrometers. 2 The surface area (e.g., when the pressure sensing die is rectangular or square, the sensing die may have a side length of about 625 micrometers).

[0027] As described above, the example pressure sensing component 100 includes a substrate 102. In various embodiments, the substrate 102 may be or include a pressure measuring element configured to provide a measurable electrical signal in response to the pressure sensing element 104 detecting and / or absorbing the pressure of a medium. As depicted, the substrate 102 includes a printed circuit board assembly (PCBA). In various embodiments, the PCBA may be in electronic communication with the pressure sensing element 104, allowing them to exchange data / information with each other. Figure 1 As depicted, the bottom surface of the pressure sensing element 104 is fixedly attached to or mounted on the surface of the substrate 102. Various techniques can be used to electrically connect the pressure sensing element 104 to the substrate 102 (e.g., a PCBA). In some examples, as depicted, the pressure sensing element 104 can be electrically connected to the substrate 102 (e.g., a PCBA) using wire bonds 106A and 106B. Additionally or alternatively, the pressure sensing element 104 can be electrically connected to the substrate 102 (e.g., a PCBA) via bump bonding and / or any other suitable method.

[0028] As described above, in some implementations, such as Figure 1As depicted, substrate 102 includes a PCBA defining the lower surface of pressure sensing component 100. Example PCBAs may include thick-film printed ceramic substrates, FR 4 laminates, and / or other materials. Example PCBAs may include one or more electronic components thereon and / or pads for connecting to other electronic components in a device that may house pressure sensing component 100 or be used with pressure sensing component 100. In some examples, the PCBA may include application-specific integrated circuits (ASICs) that can be attached to the surface of the PCBA, such as ASICs electrically coupled to the PCBA via wire bonding, bump bonding, electrical terminals, and / or any other suitable electrical connections. Additionally or alternatively, example PCBAs may include one or more conductive pads for bonding circuitry and / or electronic components communicating with a processor, remote processor, etc.

[0029] Additionally and / or alternatively, the PCBA may include one or more processing electronics and / or compensation circuitry (e.g., it may or may not include an ASIC). Such processing electronics may be electrically connected to terminals of the pressure sensing element 104, the ASIC (if present), and / or electrical terminals to process electrical signals from the pressure sensing element 104 and / or to transmit the output from the pressure sensing element 104 to one or more devices used in conjunction with the pressure sensing component 100. In some cases, the PCBA may include circuitry that can be configured to format one or more output signals provided by the pressure sensing element 104 into a specific output format. For example, the PCBA circuitry may be configured to format the output signals provided by the pressure sensing element 104 into a ratio measurement output format, a current format, a digital output format, and / or any other suitable format. In some cases, the PCBA circuitry may be configured to regulate the output voltage. The circuitry on the PCBA for providing ratio measurement (or other) outputs may include traces and / or other circuitry that may act as conduits to a test pad and / or provide ratio measurement (or other) outputs to one or more electrical terminals, thereby facilitating electrical connection to electronic components of one or more devices used in conjunction with the pressure sensing component 100.

[0030] In some examples, the PCBA may include a Wheatstone bridge circuit. For example, the Wheatstone bridge circuit may supply a small amount of current to the pressure sensing element 104. In response to the amount of applied medium pressure, the resistivity of a plurality of strain gauges of the example pressure sensing element 104 may vary proportionally to the applied pressure, such that less current flows through the pressure sensing element 104. Thus, a measurable output or pressure signal can be generated using a measurable detection current. In various examples, the medium may be in contact with the outer surface (e.g., the top surface) of the pressure sensing component 100. The pressure sensing component 100 may absorb the pressure of the medium and transmit the incoming pressure to the upper coupling element 103 and the lower coupling element 101, where this pressure may be detected and / or sensed by the pressure sensing element 104 (e.g., a sensing die). Subsequently, the substrate 102 / pressure measuring element may convert the detected and / or sensed pressure into a measurable electrical signal.

[0031] As stated above, and as Figure 1 As depicted, the pressure sensing element 100 includes a lower coupling element 101 and an upper coupling element 103. In some embodiments, as shown, the lower coupling element 101 is disposed on the pressure sensing element 104 (e.g., surrounding, enclosing, etc.). As further depicted, the upper coupling element 103 is disposed on the top surface of the lower coupling element 101. In some examples, as shown, the lower coupling element 101 defines a different and / or separate layer from the upper coupling element 103. In some embodiments, the lower coupling element 101 and the upper coupling element 103 may each comprise a gel material. In some examples, the lower coupling element 101 and the upper coupling element 103 may comprise similar materials or gels of the same type (e.g., a first gel having a first consistency and a second gel having a second consistency).

[0032] like Figure 1As depicted, the pressure sensing element 100 includes a lower coupling element 101. In some embodiments, as shown, the lower coupling element 101 surrounds the pressure sensing element 104, thus providing a protective layer. As further depicted, the lower coupling element 101 is disposed within columnar structures 110A and 110B of the example pressure sensing element 100 and defines an intermediate layer between the substrate 102 and the upper coupling element 103. It should be understood that columnar structures 110A and 110B may define an integral body. In various examples, columnar structures 110A and 110B include plastics, metals, glass, etc. In some embodiments, the lower coupling element 101 may include a gel material characterized by minimal or no internal stress. In some examples, the lower coupling element 101 may exhibit less internal stress compared to the upper coupling element 103. In some examples, the lower coupling element 101 may be or include a viscous and / or incompressible material. In some embodiments, the lower coupling element 101 may be or include oil or liquid. In some embodiments, the lower coupling element 101 may include a medical-grade gel or material (e.g., liquid silicone, silicone oil, medical-grade silicone oil, etc.) or an adhesive material. In some embodiments, the lower coupling element 101 may include an inhibitory substance or colorant to slow down the gelation process in order to provide a softer material relative to the upper coupling element 103.

[0033] As described above, the pressure sensing component 100 includes an upper coupling element 103. In some embodiments, such as Figure 1 As depicted, the upper coupling element 103 is disposed adjacent to / on the top surface of the lower coupling element 101 and defines different / separating layers. In some embodiments, the top surface of the upper coupling element 103 may be disposed adjacent to a sealing member to contain the upper coupling element 103 (and the lower coupling element 101) within columnar structures 110A and 110B. In some examples, as depicted, the pressure sensing component 100 also includes one or more sealing members 108A and 108B that operate to further isolate the columnar structures 110A and 110B from media exposure.

[0034] like Figure 1Further depicted, the upper coupling element 103 is disposed within the columnar structures 110A and 110B of the example pressure sensing component 100 and defines the top layer of the pressure sensing component. In some embodiments, the upper coupling element 103 may comprise a gel material characterized by minimal or no internal stress. In some examples, the upper coupling element 103 may exhibit more internal stress compared to the lower coupling element 101. Therefore, in some examples, the upper coupling element 103 may comprise a hard gel material, and the lower coupling element 101 may comprise a soft gel material. In some embodiments, the upper coupling element 103 may be or comprise a viscous and / or incompressible material. In some embodiments, the upper coupling element 103 may be or comprise an oil or liquid. In some embodiments, the upper coupling element 103 may comprise a medical-grade gel or material (e.g., liquid silicone, silicone oil, medical-grade silicone oil, etc.) or an adhesive material. In some embodiments, the upper coupling element 103 may comprise a catalytic substance to accelerate the gelation process in order to provide a material that is rigid relative to the lower coupling element 101. In some embodiments, the volume of the upper coupling element 103 can be three times the volume of the lower coupling element 101. In other words, the volume ratio of the upper coupling element 103 to the lower coupling element 101 can be 3:1. In some examples, the height of the lower coupling element 101 (e.g., along the y-direction) can be approximately 600 micrometers. In some examples, the height of the upper coupling element 103 can be approximately 1 millimeter (mm). In some examples, the combined height of the lower coupling element 101 and the upper coupling element 103 can be 2 mm.

[0035] Although Figure 1 An example pressure sensing component 100 is provided, but it should be noted that the scope of this disclosure is not limited to such embodiments. In various embodiments, the example pressure sensing component according to this disclosure may take other forms. Additionally and / or alternatively, other types of sensing elements and / or components may be provided according to this disclosure. In some embodiments, the example pressure sensing component 100 may include more than two coupling elements (e.g., three or four coupling elements).

[0036] Now for reference Figure 2 A flowchart is provided depicting an example method 200 for generating at least an example portion of a sensing component according to various embodiments of the present disclosure. This sensing component can be related to the above-described... Figure 1 The pressure sensing component 100 described is similar to or the same as that described above.

[0037] Beginning at step / operation 201, the method may commence with the fabrication of a substrate. In various embodiments, this substrate may be or include a PCBA, a ceramic material (including a printed film), etc. This substrate may be related to the above-mentioned... Figure 1The substrate 102 discussed is similar or identical. Preparing the substrate may include cleaning and drying at least a portion of the substrate, and preparing and / or forming electrical connections thereon.

[0038] Following step / operation 201, method 200 proceeds to step / operation 203. In step / operation 203, after substrate fabrication, a sensing element (e.g., a pressure sensing element, a sensing die, etc.) is attached to at least a portion or surface of the substrate (e.g., the bottom surface of the sensing element may be attached to the top surface of the substrate). This sensing element can be combined with the above description. Figure 1 The pressure sensing element 104 described herein is similar or identical. In some examples, attaching the sensing element to the substrate may include, for example, electrically connecting the sensing element and the substrate using wire bonding, bump bonding, etc.

[0039] Following the attachment of the sensing element to at least a portion or surface of the substrate at step / operation 203, method 200 proceeds to step / operation 205. At step / operation 205, a lower coupling element is disposed on at least a portion of the sensing element (e.g., by application, dispensing, injection, etc.). The lower coupling element may be related to the above-mentioned... Figure 1 The lower coupling element 101 discussed is similar or identical. In some examples, the lower coupling element completely covers the sensing element. In some embodiments, step / operation 203 further includes attaching or securing a structural / receiving member to a substrate (e.g., a ring, member, pillar, columnar structure, etc.) such that the structure surrounds the sensing element and provides a cavity for receiving the lower coupling element. In some embodiments, the lower coupling element may be at least partially solidified or cured before further steps / operations. In some examples, the lower coupling element may be solidified or cured for a time between 0 hours and 10 hours. In some embodiments, as described elsewhere herein, the lower coupling element may include an inhibitory substance that slows down the gelation and / or curing process.

[0040] Following step / operation 205, method 200 proceeds to step / operation 207. At step / operation 207, after setting the lower coupling element, an upper coupling element is disposed thereon. In some examples, a seal and / or sealing member may be disposed on the top surface of the upper coupling element. As described above, the upper coupling element may include a catalyst material to accelerate the gelation and / or curing process.

[0041] Following step / operation 207, method 200 proceeds to step / operation 209. At step / operation 209, after setting the coupling element, at least a portion of the component / sensing part is cured. In some examples, curing the component includes implementing a thermosetting technique. In some examples, the component may be cured for a time between 2 hours and 24 hours.

[0042] although Figure 2 An example of a method 200 for generating a sensing component is shown, but other methods can be used. For example, although shown as a series of operations / steps, Figure 3 The various operations / steps in the process can overlap, occur in parallel, occur in different orders, or occur multiple times.

[0043] Now for reference Figure 3 A schematic diagram of an example controller component 300 is provided, depicting an example device electronically communicating with a pressure sensing component 302 according to various embodiments of the present disclosure. The example device may be, or includes, for example, but not limited to, a motor control device, a hydraulic control device, a blood dispersing device, a control system device, etc. As shown, the controller component 300 includes a processing circuit 301, a communication module 303, an input / output module 305, a memory 307, and / or other components configured to perform the various operations, programs, functions, etc., described herein.

[0044] As shown in the figure, the controller component 300 (such as processing circuitry 301, communication module 303, input / output module 305, and memory 307) is electrically coupled and / or electronically communicates with the pressure sensing component 302, enabling it to exchange (e.g., transmit and receive) data with the processing circuitry 301 of the controller component 300. In some embodiments, the pressure sensing component 302 may be coupled to the controller component 300. In other embodiments, the pressure sensing component 302 may be located remotely from the controller component 300.

[0045] Processing circuitry 301 can be implemented as, for example, various devices including one or more microprocessors with an accompanying digital signal processor; one or more processors without an accompanying digital signal processor; one or more coprocessors; one or more multi-core processors; one or more controllers; processing circuitry; one or more computers; and various other processing elements (including integrated circuits, such as ASICs or FPGAs, or some combination thereof). In some embodiments, processing circuitry 301 may include one or more processors. In one exemplary embodiment, processing circuitry 301 may be configured to execute instructions stored in memory 307 or otherwise accessible to processing circuitry 301. When executed by processing circuitry 301, these instructions can enable controller component 300 to perform one or more functions as described herein. Whether processing circuitry 301 is configured by a hardware approach, a firmware / software approach, or a combination thereof, the processing circuitry may include an entity capable of operating according to embodiments of the invention when correspondingly configured. Thus, for example, when processing circuitry 301 is implemented as an ASIC, FPGA, etc., processing circuitry 301 may include hardware specifically configured to perform one or more operations as described herein. Alternatively, as another example, when the processing circuitry 301 is implemented as an actuator of instructions (such as those that can be stored in memory 307), the instructions can be specifically configured to perform one or more algorithms and operations described herein.

[0046] Memory 307 may include, for example, volatile memory, non-volatile memory, or some combination thereof. Although in Figure 3 While shown as a single memory, memory 307 may include multiple memory components. In various embodiments, memory 307 may include, for example, a hard disk, random access memory, cache memory, flash memory, compressed optical disc read-only memory (CD-ROM), digital versatile optical disc read-only memory (DVD-ROM), optical disc, circuitry configured to store information, or some combination thereof. Memory 307 may be configured to store information, data, application programs, instructions, etc., enabling controller component 300 to perform various functions according to embodiments of this disclosure. For example, in at least some embodiments, memory 307 is configured to buffer input data for processing circuitry 301. Additionally or alternatively, in at least some embodiments, memory 307 is configured to store program instructions for execution by processing circuitry 301. Memory 307 may store information in static and / or dynamic information forms. When performing functions, the stored information may be stored and / or used by controller component 300.

[0047] The communication module 303 can be implemented as any means, including circuitry, hardware, computer program products, or combinations thereof, configured to receive and / or transmit data to or from another component or device. The computer program product includes computer-readable program instructions stored on a computer-readable medium (e.g., memory 307) and executed by a controller component 300 (e.g., processing circuitry 301). In some embodiments, the communication module 303 (like the other components discussed herein) can be at least partially implemented as or otherwise controlled by the processing circuitry 301. In this regard, the communication module 303 can communicate with the processing circuitry 301, for example, via a bus. The communication module 303 can include, for example, an antenna, transmitter, receiver, transceiver, network interface card, and / or supporting hardware and / or firmware / software, and is used to establish communication with another device. The communication module 303 can be configured to receive and / or transmit any data that can be stored in memory 307 using any protocol that can be used for communication between devices. The communication module 303 may additionally or alternatively communicate with the memory 307, the input / output module 305 and / or any other component of the controller component 300, for example via a bus.

[0048] In some embodiments, controller component 300 may include input / output module 305. Input / output module 305 may communicate with processing circuitry 301 to receive instructions input by a user and / or provide auditory, visual, mechanical, or other outputs to the user. Therefore, input / output module 305 may include supporting devices such as a keyboard, mouse, display, touchscreen display, and / or other input / output mechanisms. Alternatively, at least some aspects of input / output module 305 may be implemented on a user-used device to communicate with controller component 300. Input / output module 305 may communicate, for example, via a bus with memory 307, communication module 303, and / or any other components. Controller component 300 may include one or more input / output modules and / or other components.

[0049] For example, the pressure sensing component 302 can be related to the above-mentioned Figure 1 The pressure sensing element 100 described is similar. For example, the pressure sensing element 302 can convert the medium pressure absorbed by the pressure sensing element 302 into a measurable electrical signal.

[0050] Now for reference Figure 4 Example Figure 400 is provided, depicting example measurement results obtained from conventional sensing electrodes.

[0051] like Figure 4The diagram depicts multiple time instances on the x-axis. As depicted, the y-axis represents the detected voltage signal measured in volts (V), which corresponds to the normalized pressure output obtained from conventional sensing components. Figure 4 As shown, the deviation values ​​generated by conventional sensing components are relatively high (up to 0.0003V along the y-axis, as depicted). Therefore, it should be understood that conventional sensing components can generate inaccurate measurement results due to the high deviation values ​​and / or offsets.

[0052] Now for reference Figure 5 Example Figure 500 is provided, depicting example measurement results obtained by a sensing component according to certain embodiments of the present disclosure.

[0053] like Figure 5 The diagram depicts multiple time instances on the x-axis. As depicted, the y-axis represents the detected voltage signal measured in volts (V), which corresponds to the normalized pressure output obtained from the sensing element. Figure 5 As shown, relative to Figure 4 The deviation values ​​depicted, generated by conventional sensing components, are significantly lower than those generated by sensing components (as depicted, they are typically close to 0V along the y-axis in several examples). Therefore, Figure 5 This demonstrates that incorporating multiple coupling elements in a sensing component reduces deviation stress and provides a more robust component with improved performance. Additionally, reduced deviation associated with the sensing component provides a more sensitive force range. Furthermore, in some examples, coupling elements in viscous environments (e.g., liquids, oils, etc.) can provide a uniform layer adjacent to the sensing element and improve performance and stability.

[0054] Those skilled in the art to which these embodiments pertain will, having benefited from the teachings presented in the foregoing description and related drawings, conceive of numerous modifications and other embodiments of the present disclosure set forth herein. Therefore, it should be understood that the present disclosure is not limited to the specific embodiments disclosed, and that modifications and other embodiments are intended to be included within the scope of the appended claims. Furthermore, although the foregoing description and related drawings describe exemplary embodiments in the context of certain example combinations of elements and / or functions, it should be understood that different combinations of elements and / or functions may be provided by alternative embodiments without departing from the scope of the appended claims. In this regard, for example, combinations of elements and / or functions different from those explicitly described above, as shown in some of the appended claims, may also be contemplated. Although specific terminology is used herein, it is used only in a general and descriptive sense and not for limiting purposes.

Claims

1. A sensing component, comprising: Substrate; A sensing element, the sensing element being attached to and in electronic communication with the surface of the substrate; A lower coupling element in contact with the sensing element, the lower coupling element defining the bottom layer of the sensing component, wherein the lower coupling element completely covers the sensing element; as well as An upper coupling element is disposed adjacent to the top surface of the lower coupling element and defines the top layer of the sensing element, wherein the lower coupling element includes an inhibitory substance to slow down the gelation process in order to provide a softer material relative to the upper coupling element. Each of the lower coupling element and the upper coupling element comprises a gel material, and The upper coupling element includes a catalyst to accelerate the gelation process.

2. The sensing component of claim 1, wherein the lower coupling element comprises liquid or oil.

3. The sensing component according to claim 1, wherein: The sensing component includes a pressure sensing component, the sensing element includes a sensing die, and the substrate includes a PCBA or a ceramic plate.

4. The sensing component according to claim 1, wherein the volume ratio of the lower coupling element to the upper coupling element is 1:

3.

5. The sensing component according to claim 1, wherein the lower coupling element and the upper coupling element are disposed within the columnar structure.

6. The sensing component of claim 5, wherein the height of the lower coupling element within the columnar structure is approximately 0.6 micrometers, and the height of the upper coupling element within the columnar structure is approximately 1 millimeter.

7. A method for manufacturing a sensing component, the method comprising: Substrate preparation; The sensing element is attached to the surface of the substrate; The columnar structure is attached to the substrate to surround the sensing element and define a cavity; A lower coupling element is disposed on the sensing element within the columnar structure, wherein the lower coupling element completely covers the sensing element; as well as An upper coupling element is disposed within the columnar structure, wherein the upper coupling element is disposed adjacent to the top surface of the lower coupling element and defines the top layer of the sensing component, wherein the lower coupling element includes an inhibitory substance to slow down the gelation process in order to provide a soft material relative to the upper coupling element, wherein each of the lower coupling element and the upper coupling element includes a gel material, and wherein the upper coupling element includes a catalytic substance to accelerate the gelation process.

8. The method according to claim 7, further comprising: After the lower coupling element is placed within the columnar structure, the sensing component is allowed to condense or solidify for a first time period.

9. The method according to claim 7, further comprising: After the lower coupling element is disposed within the columnar structure, the sensing component is cured for a second time period.

10. The method of claim 7, wherein the lower coupling element comprises a liquid or oil.

11. The method according to claim 7, wherein: The sensing component includes a pressure sensing component, the sensing element includes a sensing die, and the substrate includes a PCBA or a ceramic plate.

12. The method of claim 7, wherein the volume ratio of the lower coupling element to the upper coupling element is 1:

3.

13. The method of claim 7, wherein the height of the lower coupling element within the columnar structure is approximately 0.6 micrometers, and the height of the upper coupling element within the columnar structure is approximately 1 millimeter.

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